KR20180075549A - 급속 경화형이고 요변성이 높은 에폭시 접착제 조성물 - Google Patents
급속 경화형이고 요변성이 높은 에폭시 접착제 조성물 Download PDFInfo
- Publication number
- KR20180075549A KR20180075549A KR1020187013556A KR20187013556A KR20180075549A KR 20180075549 A KR20180075549 A KR 20180075549A KR 1020187013556 A KR1020187013556 A KR 1020187013556A KR 20187013556 A KR20187013556 A KR 20187013556A KR 20180075549 A KR20180075549 A KR 20180075549A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy
- curing agent
- precursor composition
- mol
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15192110.3A EP3162829B1 (en) | 2015-10-29 | 2015-10-29 | Rapid curing and high thixotropy epoxy adhesive compositions |
| EP15192110.3 | 2015-10-29 | ||
| PCT/US2016/058107 WO2017074810A1 (en) | 2015-10-29 | 2016-10-21 | Rapid curing and high thixotropy epoxy adhesive compostions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20180075549A true KR20180075549A (ko) | 2018-07-04 |
Family
ID=54478566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187013556A Withdrawn KR20180075549A (ko) | 2015-10-29 | 2016-10-21 | 급속 경화형이고 요변성이 높은 에폭시 접착제 조성물 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10647897B2 (https=) |
| EP (1) | EP3162829B1 (https=) |
| JP (1) | JP7076708B2 (https=) |
| KR (1) | KR20180075549A (https=) |
| CN (1) | CN108350149B (https=) |
| BR (1) | BR112018008793A2 (https=) |
| CA (1) | CA3003640A1 (https=) |
| WO (1) | WO2017074810A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3275915B1 (en) * | 2016-07-29 | 2022-11-30 | 3M Innovative Properties Company | Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties |
| EP3569630B1 (de) * | 2018-05-17 | 2022-08-03 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| EP3569629B1 (de) | 2018-05-17 | 2022-07-06 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| US11359048B2 (en) | 2018-05-17 | 2022-06-14 | Evonik Operations Gmbh | Fast-curing epoxy systems |
| US11286335B2 (en) | 2018-05-17 | 2022-03-29 | Evonik Operations Gmbh | Fast-curing epoxy systems |
| JP7142771B2 (ja) * | 2018-09-19 | 2022-09-27 | ヒルティ アクチエンゲゼルシャフト | エポキシ樹脂化合物用の硬化剤組成物、エポキシ樹脂化合物、および多成分エポキシ樹脂系 |
| EP3861046B1 (de) * | 2018-10-01 | 2022-06-29 | Sika Technology AG | Beschleuniger für die aushärtung von epoxidharzen mit alkylierten aminen |
| EP3660069B1 (de) | 2018-11-29 | 2024-01-03 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| FR3095449B1 (fr) * | 2019-04-26 | 2021-11-26 | Safran | Procede de collage de pieces aeronautiques |
| US11453744B2 (en) | 2019-10-15 | 2022-09-27 | Evonik Operations Gmbh | Compositions consisting of BrØnsted acids and monoamines |
| EP3981817B1 (de) | 2020-10-12 | 2025-09-10 | Evonik Operations GmbH | Zusammensetzungen umfassend brönstedtsäuren und monoamine |
| EP4493612B1 (en) | 2022-06-16 | 2025-07-30 | 3M Innovative Properties Company | Two-part epoxy adhesive with working life color change indicator |
| EP4332070A1 (en) * | 2022-08-31 | 2024-03-06 | 3M Innovative Properties Company | Curable precursor of an adhesive composition comprising calcium hydroxide nitrate particles |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2194058T3 (es) * | 1994-09-19 | 2003-11-16 | Minnesota Mining & Mfg | Composicion epoxidica adhesiva. |
| US20080029214A1 (en) | 2006-08-04 | 2008-02-07 | Zephyros, Inc. | Multiple or single stage cure adhesive material and method of use |
| GB0700960D0 (en) * | 2007-01-18 | 2007-02-28 | 3M Innovative Properties Co | High strength epoxy adhesive and uses thereof |
| EP2310436B1 (en) | 2008-07-23 | 2012-12-26 | 3M Innovative Properties Company | Two-part epoxy-based structural adhesives |
| US20120024477A1 (en) | 2009-02-06 | 2012-02-02 | Kropp Michael A | Room temperature curing epoxy adhesive |
| EP2223966B1 (en) | 2009-02-25 | 2017-08-16 | 3M Innovative Properties Company | Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
| CN101818037B (zh) | 2009-02-27 | 2014-12-31 | 汉高(中国)投资有限公司 | 一种室温固化环氧结构胶粘剂组合物及其制备方法 |
| GB0905362D0 (en) * | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
| GB201005444D0 (en) * | 2010-03-31 | 2010-05-19 | 3M Innovative Properties Co | Epoxy adhesive compositions comprising an adhesion promoter |
| WO2012021258A1 (en) | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
| CN102911631A (zh) * | 2011-08-05 | 2013-02-06 | 汉高股份有限公司 | 单组分环氧结构粘合剂组合物 |
| EP3275915B1 (en) * | 2016-07-29 | 2022-11-30 | 3M Innovative Properties Company | Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties |
| EP3275914B1 (en) * | 2016-07-29 | 2022-05-11 | 3M Innovative Properties Company | Flame retardant adhesive composition |
-
2015
- 2015-10-29 EP EP15192110.3A patent/EP3162829B1/en active Active
-
2016
- 2016-10-21 CN CN201680063292.0A patent/CN108350149B/zh active Active
- 2016-10-21 US US15/770,876 patent/US10647897B2/en active Active
- 2016-10-21 JP JP2018522117A patent/JP7076708B2/ja active Active
- 2016-10-21 CA CA3003640A patent/CA3003640A1/en not_active Abandoned
- 2016-10-21 WO PCT/US2016/058107 patent/WO2017074810A1/en not_active Ceased
- 2016-10-21 BR BR112018008793A patent/BR112018008793A2/pt not_active Application Discontinuation
- 2016-10-21 KR KR1020187013556A patent/KR20180075549A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20180305595A1 (en) | 2018-10-25 |
| EP3162829A1 (en) | 2017-05-03 |
| CA3003640A1 (en) | 2017-05-04 |
| CN108350149B (zh) | 2020-06-23 |
| JP7076708B2 (ja) | 2022-05-30 |
| EP3162829B1 (en) | 2018-08-15 |
| JP2018536052A (ja) | 2018-12-06 |
| US10647897B2 (en) | 2020-05-12 |
| BR112018008793A2 (pt) | 2018-10-30 |
| CN108350149A (zh) | 2018-07-31 |
| WO2017074810A1 (en) | 2017-05-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20180514 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |