KR20180067053A - Method of forming patterns using mold - Google Patents

Abstract

The present invention relates to a method for forming patterns using a release mold, and more specifically, to a method for forming patterns, which comprises the following steps: manufacturing a release mold (S1); cutting a part of the release mold in accordance with the patterns (S2); removing a protective film and attaching a release paper or a release film (S3); removing a part of the cut release mold in accordance with the patterns (S4); applying a resin (S5); curing the resin (S6); applying an adhesive (S7); and adhering a material (S8) to a patterned material using the method for forming the patterns, and to the release mold which can be used for the formation of the patterns. It is an object of the present invention to provide the patterned material having excellent aesthetics manufactured through the pattern forming method.

Description

METHOD OF FORMING PATTERNS USING MOLD BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern forming method for forming a pattern on a surface of a work, more particularly, to a pattern forming method for forming a pattern of resin on a work surface by using a mold releasing mold, To molds that can be used.

In the case of producing synthetic leather in general, a wet or dry type organic solvent-based polyurethane or water-dispersible urethane is applied to release paper (hereinafter referred to as RP) by a knife or a coma, After the application, it is passed through a high-temperature chamber to evaporate the organic solvent or the like to cure the polyurethane. The adhesive is applied on the cured polyurethane, and then the fabric, the knitted fabric or the nonwoven fabric is adhered, To produce a synthetic leather comprising a fabric and a polyurethane layer. The temperature of the chamber used depends on the type of the resin used. When the polyurethane is organic solvent type, the temperature is about 150 캜, and in case of water dispersion type, it is 100 캜. In this general manufacturing method, only the synthetic leather is produced in a form in which the polyurethane is applied to the entire surface of the fabric in accordance with the coating width.

As an example of a method for three-dimensionally expressing various design patterns on a fabric surface, there is a method using a foamed resin. This is a method in which the foamed resin is attached to the fabric, and then the foamed resin to which the foamed resin is attached is heated and foamed to make the design pattern appear three-dimensionally. However, this method is a method in which a single-phase foamed resin is overlaid manually, and there is a problem that a shape difference is generated in the quality of the finished fabric due to the external shape difference caused by the operation. In addition, there is a problem that it is difficult to apply the resin in the liquid state to the fabric tissues after the resin layer is formed on the fabric of the low-density structure such as fabric.

KR 1019940002424 A KR 101526842 B1

The present invention relates to a method of manufacturing a composite structure in which a resinous surface capable of giving a feeling of synthetic leather with a desired design pattern is formed on a part of a surface of a material and a material surface And to provide a pattern forming method capable of forming a pattern.

It is another object of the present invention to provide a patterned material having excellent aesthetics, which is produced through the pattern forming method.

Another object of the present invention is to provide a mold releasing mold which can be used for a pattern forming method capable of producing a composite structure material.

According to one aspect of the present invention, there is provided a coating material comprising a substrate portion having a thickness of 38 to 250 mu m, a coating layer having an initial releasing force of 5 to 50 gf / inch formed on the upper surface of the substrate portion, a thickness of 1 to 50 mu m, / inch < / RTI > and a protective film; A second step of cutting a part of the mold releasing mold according to a pattern to be formed; A third step of removing the protective film from the mold and attaching a release paper or release film to a position where the protective film is removed; A fourth step of removing a part of the cut mold that is cut according to the pattern; A fifth step of removing the resin on the upper surface of the coating layer after coating the mold with the coating layer as the uppermost surface; A sixth step of curing the resin; A seventh step of removing the adhesive on the upper surface of the coating layer after applying the adhesive on the coating layer of the mold releasing mold as the uppermost surface; And an eighth step of adhering the material to be patterned and then curing the adhesive.

The coating layer may be formed by coating one side of the substrate with a resin containing at least one selected from the group consisting of silicon, fluorine and polyolefin.

The adhesive layer may be formed by applying and curing a silicone-based, rubber-based, polyamide-based, acrylic-based, modified acrylic-based or hot-melt-based pressure sensitive adhesive on one side of the substrate portion.

According to another aspect of the present invention, there is provided a material in which a pattern is formed on a surface by the pattern forming method.

According to still another aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising: a base material portion having a thickness of 38 to 250 占 퐉; a coating layer having a coating surface having an initial releasing force of 5 to 50 gf / inch formed on the base material portion; And an adhesive layer having an adhesion of 450 to 2000 gf / inch and a protective film.

A method of forming a pattern according to an aspect of the present invention is a method of forming a pattern by applying a resin to a polyurethane or silicone by adhering the polyurethane or silicone according to a design to be expressed, The knitted fabric, the nonwoven fabric or the film itself can be expressed in appearance, color and surface state, and at the same time, a part of the knitted fabric, the nonwoven fabric or the film can be expressed as a synthetic leather feeling depending on the design, and the added value of the material can be enhanced with a unique appearance.

In addition, it is possible to freely design patterns to be applied to the upper part of the material, and when applied to a fabric, it is possible to give a feeling of being cut by cutting only a thin synthetic leather surface on a circular phase using a release paper pattern used in synthetic leather .

In addition, a variety of design patterns can be expressed stereoscopically freely using a resin for a fabric of a low-density structure.

In addition, it is suitable to reduce material loss due to thermal deformation, etc., and to reduce the difference in the design shape of each manufactured product, thereby manufacturing a large amount of materials capable of expressing design with excellent quality.

Further, it is suitable to be applied to a material surface requiring flexibility by keeping the rigidity and flexibility of the material on which the pattern is formed close to the original.

In addition, when a fabric is used as the material, the resin may be further attached to the fabric to improve the wear resistance of the fabric.

In addition, it is possible to prevent brand infringement by engraving a brand or logo on a product in a unique way that is not existing.

1 is a flowchart showing a pattern forming method according to an embodiment of the present invention,
2 is a schematic diagram of a mold release mold manufactured in an embodiment of the present invention,
FIG. 3 is a schematic view of a release mold or a release film having a pattern design to be formed on a release mold according to an embodiment of the present invention by using an adhesive layer,
4 is a view showing a state where a protective film is peeled off from a mold of an embodiment of the present invention and a part cut according to the pattern is removed after attaching the release or release film,
5 shows a state in which a mold is filled with a resin and cured,
6 is a patterned material formed by the pattern forming method according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is an exemplary embodiment only and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for efficiently describing the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

The accompanying drawings are merely exemplary and are not to be construed as limiting the scope of the present invention.

1 is a flowchart illustrating a pattern forming method according to an embodiment of the present invention.

Referring to FIG. 1, a method of forming a pattern according to an embodiment of the present invention includes the steps of: (S1) forming a mold releasing mold; Cutting a portion of the mold to match the pattern (S2); Removing the protective film from the mold and attaching the release paper or release film (S3); Removing (S4) the part of the mold that has been cut to fit the pattern; Applying the resin (S5); Curing the resin (S6); Applying an adhesive (S7); And a step (S8) of adhering the material.

First, a pattern forming method according to an embodiment of the present invention includes manufacturing a mold releasing mold (S1). The mold releasing mold comprises a substrate portion, a coating layer formed on the upper surface of the substrate portion, an adhesive layer formed on the lower surface of the substrate portion, and a protective film attached to the substrate portion through the adhesive layer. A mold release mold according to a preferred embodiment of the present invention is shown in Fig.

The substrate portion 1 may be manufactured using at least one material selected from the group consisting of paper, polyethylene terephthalate, polypropylene, polyvinyl chloride, and polyethylene films as a base material of a mold to be produced. The thickness of the substrate portion 1 is preferably 38 to 250 mu m. If the thickness of the substrate part 1 is less than 38 mu m, it is difficult to peel off the releasing paper or release film to be attached to the mold thereafter, and the resin filled in the mold for pattern formation becomes too thin to easily form a high quality pattern If the thickness is more than 250 탆, the resin to be filled in the mold may not be uniformly distributed to the lowermost end or bubbles may be generated, and the filling resin surface may become uneven due to a long time for curing, so that the material such as backing cloth may be adhered There is a problem that the probability of occurrence of adhesion failure increases.

The coating layer 2 is formed by coating one surface of the substrate part 1 with a resin containing at least one selected from the group consisting of silicon, fluorine and polyolefin. The coating layer 2 may be formed by a method known in the art. For example, a liquid resin can be directly applied and cured, or a resin tape can be adhered to form a coating layer 2. The coating layer 2 preferably has an initial releasing force of 5 to 50 gf / inch. If the initial releasing force of the coating layer 2 is less than 5 gf / inch, there is a problem that the manufacturing cost is increased and the economical efficiency is lowered. If it exceeds 50 gf / inch, the resin and the adhesive applied on the surface of the coating layer become difficult to be removed, And it is difficult to reuse the mold due to damage to the substrate due to the physical problem. The initial releasing force was measured by ASTM D3330 method.

The adhesive layer 3 is formed by applying a silicone, rubber, polyamide, acrylic, modified acrylic or hot melt adhesive onto one surface of the substrate 1 where the coating layer 2 is not formed and curing it. The adhesive layer 3 preferably has an adhesive strength of 450 to 2000 gf / inch. If the adhesive strength of the adhesive layer 3 is less than 450 gf / inch, the release paper or release film to be adhered thereafter may not be adhered properly, so that the releasing paper or release film may be liberated during the process, If it is more than 2000 gf / inch, it is difficult to remove the releasing paper or the releasing film, and excessive force is applied to the releasing paper or releasing film, thereby causing damage to the releasing mold, releasing paper or release film. The adhesion was measured by the KS T 1028 method. The thickness of the adhesive layer 3 is preferably 1 to 50 mu m. If the thickness of the pressure-sensitive adhesive layer 3 is less than 1 占 퐉, there is a problem that it is difficult to exhibit a stable adhesion effect. If the thickness exceeds 50 占 퐉, the curing time becomes excessively long at the step of forming the pressure- It is difficult to exhibit a stable adhesive effect and a problem that a pressure-sensitive adhesive remains on a mechanical contact portion such as a release paper or a release film and a roll or a blade during a pattern formation process may occur. The adhesive layer is preferably selected to have chemical resistance to a resin solvent.

The protective film (4) is attached to the substrate portion through the adhesive layer. As the protective film 4, a material having a releasing force is selected as the pressure-sensitive adhesive. For example, a plastic film material containing at least one selected from the group consisting of polyethylene terephthalate, polyethylene and polyvinyl chloride can be selected. The thickness of the protective film 4 is preferably 5 to 50 mu m. If the thickness of the protective film 4 is less than 5 탆, there is a problem that it tends to be torn when peeled off from the mold, and it is difficult to perform the half-cut operation at the time of cutting. When the thickness exceeds 50 탆, .

According to the above-described method, a mold releasing mold having a coating layer formed on its upper surface and a base material and a protective film on which an adhesive layer is formed is manufactured. The pattern forming method according to an embodiment of the present invention is characterized in that the mold releasing mold is prepared and cut and used.

Next, a part of the formed mold is cut according to the pattern to be formed (S2). The cutting may be a full cut cutting an entire layer of the mold release mold or a half-cut operation to cut only some of the layers except for the protective film in the mold release mold. The whole layer of the mold releasing mold means a substrate portion, a coating layer, an adhesive layer and a protective film. Some layers of the mold releasing mold mean a substrate portion, a coating layer and an adhesive layer. The cut mold is used to cut the produced mold according to the design, and the cutting can be performed using a cutting machine known in the art. For example, a laser cutting machine, a CNC cutting machine, a printing cutting machine, an offset machine, or a Thompson cutting machine can be used, but is not limited thereto. The cutting may be performed in a roll-to-roll state.

Next, the protective film is removed from the mold release mold and the release paper or release film is attached (S3). The release paper or release film is selected so as to have a pattern matching with the design in the attachment surface to be adhered to the substrate portion. Specifically, the mold is cut in a range larger than the overall size of the pattern design so that it can be fitted to the edge of the pattern design to be formed on the workpiece in the previous step, or both the pattern design can be included, and the pattern of the release or release film is cut And is attached to the mold releasing mold so as to be included in the molded portion. The releasing paper or release film used in the process of manufacturing a synthetic leather, a membrane or a wallpaper is adhered to the base portion of the mold releasing mold by using the tackiness of the pressure-sensitive adhesive layer 3 while removing the protective film 4 on the lower surface of the mold- And if necessary, a step of making a close contact with a roller or the like is further performed. An example of a mold releasing mold to which a release paper or release film is attached according to an embodiment of the present invention is shown in Fig.

Then, a part of the mold is removed in accordance with the design which is completely cut or half-cut in the previous stage, so that the space 6 is formed in the mold according to the pattern of the desired design (S4). At this time, the space 6 formed in the mold release mold is filled with resin, and a pattern can be formed of a resin material on the circular phase. FIG. 4 shows the state of this step in which the cut portion is removed according to the pattern after attaching the release paper or the release film in the release mold.

Next, the resin is applied to the mold releasing mold (S5). The release mold has a coating layer as the uppermost surface and a releasing paper or release film as a lowermost surface, and after the resin is applied on the upper surface, the resin on the upper surface of the coating layer is removed. In this way, the resin is filled only in the space 6 formed by removing a part of the mold releasing mold according to a desired design, and at the same time, the pattern of the releasing paper or the releasing film is transferred to the resin contacting therewith. The resin may be at least one selected from the group consisting of a wet polyurethane, a dry polyurethane and a silicone resin. The removal of the resin on the upper surface of the coating layer may be performed using a knife, a coma, a doctor blade or the like used in coating.

Next, the resin is cured (S6). According to the function and appearance of the final product, it is possible to perform full curing which completely cures the resin or semi-curing which hardens only a part of the resin. As the resin filled in the mold cavity 6 is cured, the volume of the resin is reduced due to the evaporation of volatile components such as a solvent. Through this, a void space in which the resin is not filled is formed in the upper portion of the cavity 6 . This state is shown in Fig.

Next, an adhesive is applied to the mold releasing mold (S7). Except that an adhesive is used in place of the resin, the same method (S5) as that in which the resin is applied is carried out. The volume of the cured resin is reduced in the space 6 in the mold releasing mold to fill the empty space and the adhesive on the upper surface of the coating layer is removed. For adhesion to a more stable material, an adhesive is applied so that the surface of the applied layer is flat.

Next, the material is adhered and adhered through the adhesive applied to the mold releasing mold (S8). The mold releasing mold is peeled off before or after the resin and the material are bonded. More specifically, the mold and the mold can be removed after first adhering the resin and the material without adhering the remaining resin and the material after removing the mold, or without removing the mold. In the case of reusing the mold release mold in a state of being adhered to the release paper or release film, it is preferable to adhere the mold without removing the mold releasing mold from the viewpoint of cost reduction through simplification of the process and reuse of the material. The material is a material for forming a pattern, and may be a cloth or a fabric such as a fabric, a knitted fabric, or a nonwoven fabric, but is not limited thereto. Before the adhesive applied in the previous stage is fully cured, the material is adhered to and adhered to the surface to which the adhesive of the resin is applied, and then the adhesive is cured and adhered. After the adhesive is fully cured, the release mold, release paper or release film is peeled off to complete the final product. Specifically, in the case where the mold releasing mold is removed and the resin and the material are adhered to each other, the releasing paper or the releasing film remaining after peeling off the releasing mold is peeled from the material. When the material is adhered without removing the releasing mold, So that the releasing mold in the attached state is peeled from the work at once. Another example of a mold releasing mold to which a releasing paper or release film is attached according to an embodiment of the present invention is shown in Fig. Fig. 6 is a view in which a positive pattern is formed on the surface of a nonwoven fabric with urethane resin.

According to the method of forming a pattern according to an embodiment of the present invention, it is possible to form a pattern designed on a part thereof without greatly reducing the characteristics such as texture, flexibility and surface feeling of the material itself. In addition, by embossing a pattern designed on a part of the upper surface of the material, it is possible to improve the added value of the material by realizing the characteristics of the material itself and also by adhering a thin synthetic leather surface to cut and adhere. For example, it is possible to realize the desired design of the synthetic resin leather surface on the surface of the pitch skin made of microfiber suede or seesum and the general brushed type fabric. Through this, it is possible to provide the brushed feeling and the silvered feeling on the same fabric, It is possible to exhibit tactile sensation. Further, the abrasion resistance of the material can be improved.

1:
2: Coating layer
3: Adhesive layer
4: Protective film
5: release paper or release film
6: space in mold release mold
7: Cured resin

Claims (5)

A coating layer having an initial releasing force of 5 to 50 gf / inch formed on the upper surface of the substrate portion, a pressure-sensitive adhesive layer having a thickness of 1 to 50 占 퐉 and an adhesive force of 450 to 2000 gf / inch formed on the lower surface of the substrate portion, A first step of producing a mold releasing mold comprising:
A second step of cutting a part of the mold releasing mold according to a pattern to be formed;
A third step of removing the protective film from the mold and attaching a release paper or release film to a position where the protective film is removed;
A fourth step of removing a part of the mold releasing mold cut in accordance with the pattern;
A fifth step of removing the resin on the upper surface of the coating layer after coating the mold with the coating layer as the uppermost surface;
A sixth step of curing the resin;
A seventh step of removing the adhesive on the upper surface of the coating layer after applying the adhesive on the coating layer of the mold releasing mold as the uppermost surface; And
And an eighth step of adhering the material to be patterned and then curing the adhesive.
The pattern forming method according to claim 1, wherein the coating layer is formed by coating one side of the substrate with a resin containing at least one selected from the group consisting of silicon, fluorine and polyolefin.
The pattern forming method according to claim 1, wherein the pressure-sensitive adhesive layer is formed by applying and curing a silicone-based, rubber-based, polyamide-based, acrylic-based, modified acrylic-based or hot-
A pattern forming method according to any one of claims 1 to 3, wherein a pattern is formed on the surface.
A coating layer having an initial releasing force of 5 to 50 gf / inch formed on the upper surface of the substrate portion, a pressure-sensitive adhesive layer having a thickness of 1 to 50 占 퐉 and an adhesive force of 450 to 2000 gf / inch formed on the lower surface of the substrate portion, And a mold for forming a pattern.

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