KR20180064054A - Wideband and combiner to improve pimd performace - Google Patents

Abstract

Disclosed is a wideband coupler for increasing PIMD performance. According to an embodiment of the present invention, the wideband coupler implements a wideband diplexer using a low pass filter and a high pass filter and proposes a suspended structure to lift a PCB substrate in the air, capable of minimizing a tunneling effect which is a main cause of contact nonlinear PIMD for increasing the PIMD performance.

Description

[0001] WIDEBAND AND COMBINER TO IMPROVE PIMD PERFORMACE FOR PIMD PERFORMANCE [

The following description relates to a broadband band combiner for improving PIMD performance.

PIMD (Passive Inter-Modulation Distortion) is a phenomenon considered in satellite communication or high-power communication systems and has been almost ignored in commercial mobile communication systems. However, as the demand for mobile communication continues to increase, it is required to improve the quality of mobile communication. In addition, interference phenomenon of adjacent base stations due to problems such as multichannelization, high power consumption, and high frequency for solving mobile communication quality improvement demands is increasing, and the PIMD problem is also increasing accordingly. Accordingly, minimization of interference between commercial mobile communication systems is becoming increasingly important.

The causes of PIMD occurrence in RF parts are classified into contact nonlinearity and material nonlinearity. The cause of contact nonlinearity is the tunneling effect due to the metal connection between the conductors, microcracks, and the junction capacitance due to the thin oxide layer between the conductors. The causes of PIMD in the filter are Connector, Fractures, Riveted Joint, Thermal Variation, Stress Relaxation, Contamination, Tuning Screw, Waveguide Glange and EMI Capacitor. Tunneling effect caused by contact nonlinearity is the main cause of PIMD.

The present invention proposes a structure for improving a PIMD performance of a broadband diplexer by designing a filter using a PCB pattern and reducing the contact nonlinearity by floating the PCB substrate on the bottom surface of the apparatus.

The wide band combiner includes a low pass filter composed of an inductor and having at least one notch added thereto; And a high pass filter composed of an inductor and a capacitor and having at least one notch added thereto, and the low pass filter and the high pass filter are combined to form a broadband diplexer And a PCB substrate made of a dielectric material including the low-pass filter and the high-pass filter can be separated from the bottom surface of the device by a predetermined distance.

The wide band combiner can adjust the distance between the bottom surface of the mechanism and the bottom surface of the PCB, the length of the L-Pad, the width of the L-Pad, and the area of the C-Pad.

The wide band combiner may insert a bolt to remove cavity resonance of the PCB substrate.

The wide band combiner may provide a predetermined housing step for reducing the C-pad on the PCB substrate.

The wide band combiner may be designed such that the input terminal of the low pass filter passing through the first frequency band and the input terminal of the high pass filter passing through the second frequency band different from the first frequency band are matched.

Wherein the at least one inductor is formed as a transmission line on the PCB substrate and the transmission line is connected between an input terminal and an output terminal on the PCB substrate to pass an input signal through 380 MHz to 960 MHz to output an output signal .

Wherein the at least one inductor is configured as a transmission line on the PCB substrate and at least one capacitor is formed at an interval between the transmission lines and the transmission line and the capacitor are connected to an input terminal on the PCB substrate and an output terminal So that the output signal can be outputted by passing 1710 to 2700 MHz with respect to the input signal.

The present invention relates to a broadband diplexer design using a low pass filter with a notch and a high pass filter with a notch and a suspended Tunneling effect can be minimized by improving the PIMD performance.

1 is a circuit diagram illustrating a configuration of a wideband combiner according to an exemplary embodiment of the present invention.
2 is a view illustrating conversion of a wideband band combiner according to an embodiment into a PCB pattern.
3 is a view for explaining a suspended structure of a wideband band combiner according to an embodiment.
4 is a graph illustrating a simulation result of a wideband band combiner according to an embodiment.
FIG. 5 is a diagram illustrating tuning points of a wideband band combiner according to an exemplary embodiment of the present invention. Referring to FIG.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings.

In the following embodiments, a filter is designed using a PCB pattern to improve the IMD characteristics of a broadband diplexer, and a wide band that improves the IMD characteristic by using a suspended structure that separates the PCB substrate from the bottom surface of the device Band combiner will be described.

1 is a circuit diagram illustrating a configuration of a wideband combiner according to an exemplary embodiment of the present invention.

A wideband diplexer can be designed by combining a low pass filter and a high pass filter. Generally, a diplexer is a device that transmits signals separately from two circuits to one circuit without affecting each other. The diplexer is a device for branching filter elements used for transmitting and receiving two signals having different frequencies, . ≪ / RTI > The diplexer is formed in a structure that combines a low-pass filter through which a signal in a low-frequency band passes and a high-pass filter through which a signal in a high-frequency band passes.

The wide band combiner may be designed such that the input terminal of the low pass filter passing through the first frequency band and the input terminal of the high pass filter passing through the second frequency band different from the first frequency band are matched.

1B is a circuit diagram of a broadband diplexer designed as an inductor and a capacitor element. FIG. 1B is a circuit diagram of a broadband diplexer in which a broadband diplexer designed with an inductor and a capacitor element is implemented as a transmission line. The equivalent circuit of the flexor is shown.

The low-pass filter 110 may include an inductor and may include at least one notch 130. For example, as shown in FIG. 1, the low-pass filter 110 may be formed by replacing the inductor with a transmission line to add a notch of a three-stage structure. Here, the notch may mean a filter for rapidly reducing or eliminating only a component of a very narrow frequency band around a specific frequency.

The low-pass filter 110 can have an insertion loss (IL) of 0.6 dB in the low band (80 MHz to 960 MHz) and an attenuation characteristic of 60 dB in the high band (1710 MHz to 2700 MHz).

The low pass filter 110 may pass a first frequency band, for example, 380 MHz to 960 MHz.

The high-pass filter 120 may include an inductor and a capacitor, and may include at least one or more notches. For example, as shown in FIG. 1, the high-pass filter 120 may be formed by adding a notch of a three-stage structure by replacing only an element constituted by an inductor with a transmission line.

The high pass filter 120 can satisfy the insertion loss (IL) of 0.6 dB in the high band (1710 MHz to 2700 MHz) and the attenuation characteristic 60 dB in the low band (80 MHz to 960 MHz).

The high pass filter 120 may pass a second frequency band, for example, 1710 to 2700 MHz.

It can be converted into the PCB pattern shown in FIG. 2 by using the element value of the circuit designed from FIG. 1 (a).

The PCB substrate used for the PCB pattern can use Neltec NY 9250 having a dielectric constant of 2.5 and 20 mil, and the PCB substrate can be made of a dielectric material. In addition, the substrate to be applied can be determined considering the insertion loss and the frequency, and the PCB substrate may have a size of 90 mm * 90 mm and a thickness of 0.508 mm (20 mil). In addition, the PCB substrate can be infused with an air layer of 2 mm each on the top and bottom.

For example, a circuit of a PCB-type wideband combiner can be constructed through EM simulation. In this case, the inductor may be replaced with a transmission line, and the capacitor elements that are not replaced by the transmission line may be spaced apart from each other.

The PCB pattern can provide a housing 240 step of a predetermined size (e.g., 0.5 mm) for shrinking the C-pad. Capacitor-pad can be reduced by giving 0.5mm step to the housing.

In addition, a bolt 250 may be inserted to remove cavity resonance.

Referring to FIG. 3, there is shown a suspended structure of a wideband combiner. The broadband band combiner combines a low pass filter and a high pass filter to form a broadband diplexer and converts the low pass and high pass filters to a PCB pattern, (310) may be spaced a predetermined distance from the bottom surface of the implement (330). At this time, an empty space 320 may occur by a predetermined distance. It is possible to improve the PIMD characteristic compared to the existing products by reducing the tunneling effect caused by the contact nonlinearity by generating a void space between the bottom surface of the PCB substrate 310 and the mechanism 330.

The wideband band combiner thus configured may include an input 210 to which different frequency signals are input from any antenna. The input terminal 210 may receive a signal transmitted from the antenna.

The low pass filter can be provided to output an output signal by passing 380 MHz to 960 MHz to the input signal by connecting at least one inductor to the PCB substrate and a transmission line between the input and output terminals between the PCB substrates have. At this time, the low-pass filter can output only the frequencies in the range of 380 MHz to 960 MHz to the output stage 230. Referring to FIG. 2, the lower region of the PCB substrate may denote a high-pass filter in an upper region of the low-pass filter region PCB substrate.

The high-pass filter comprises at least one inductor on the PCB substrate as a transmission line, at least one capacitor being formed at an interval between the transmission lines, and a transmission line and a capacitor being connected between the input terminal and the output terminal on the PCB substrate, The output signal can be outputted by passing through 1710 MHz to 2700 MHz. At this time, the high-pass filter can output only frequencies in the range of 1710 MHz to 2700 MHz to the output stage 220.

Furthermore, to obtain data related to insertion loss and attenuation characteristics in the low and high bands, the broadband combiner uses the length of the L-pad, the width of the L-pad, the area of the C-pad, Can be tuned by adjusting the interval between the bottom surfaces of the two plates. Through this, it is possible to adjust the distance between the bottom surface of the apparatus and the bottom surface of the PCB, the length of the L-Pad, the width of the L-Pad, and the area of the C-Pad.

A wideband band combiner according to an exemplary embodiment may pass a desired band by combining a low pass filter and a high pass filter. In addition, the wideband combiner can obtain more accurate data by removing unwanted noise through a filter that adds a notch.

In addition, the broadband combiner can reduce the tunneling effect caused by the contact nonlinearity by creating a void space between the PCB substrate and the mechanism through the suspended structure.

Referring to FIG. 5, there is shown a tuning point of a wide band combiner according to an embodiment.

The tuning point can be checked through the simulator for the designed wideband combiner and retuned to obtain the improved data.

The PCB-type filter fabricated on the PCB board can be debugged using a tuning screw. As a result of the impedance tuning using the tuning bolt, it is possible to confirm some main tuning points as shown in FIG.

4 is a graph illustrating a simulation result of a wideband band combiner according to an embodiment.

For example, a circuit of a PCB-type wideband combiner can be constructed through EM simulation. In this case, the inductor may be replaced with a transmission line, and the capacitor elements that are not replaced by the transmission line may be spaced apart from each other.

The wideband combiner can design a low pass filter and a high pass filter with a notch filter. At this time, the designed filter can be converted into a PCB pattern on a PCB substrate and actually implemented. Pass filter and a high-pass filter in which notches equal to or greater than the single-stage structure are added, respectively.

The wideband combiner can improve the problem of contact by forming space by injecting air between the device and the PCB substrate.

Also, the wide band combiner can improve the characteristics of the diplexer manufactured by impedance tuning using the ground bolt.

For example, the return loss of the low-pass filter can be optimized through the impedance tuning to the input terminal (antenna section) and the junction-pad and the impedance tuning to the output section of the high-pass filter.

It can be confirmed that the wide band combiner operates in the first frequency band (380 MHz to 960 MHz) and the second frequency band (1710 MHz to 2700 MHz).

First, in the first frequency band, the wide band combiner can detect a Low Return Loss of 19 dB, a Marker (m2) of IL <0.6 dB, and Low to High Isolation of Atten> 50 dB in the first frequency band.

Also, in the second frequency band, the wide band combiner can detect High to Low isolation of 16dB, Marker3 (m3) with IL < 0.6dB and Atten> 50dB.

By verifying the low pass filter and the high pass filter on the implemented PCB pattern through EM simulation, it is possible to derive the data and operation performance to be obtained by performing various debugging.

The wideband band combiner according to one embodiment can effectively reduce the mass production cost.

The apparatus described above may be implemented as a hardware component, a software component, and / or a combination of hardware components and software components. For example, the apparatus and components described in the embodiments may be implemented within a computer system, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA) , A programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. For ease of understanding, the processing apparatus may be described as being used singly, but those skilled in the art will recognize that the processing apparatus may have a plurality of processing elements and / As shown in FIG. For example, the processing unit may comprise a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as a parallel processor.

The software may include a computer program, code, instructions, or a combination of one or more of the foregoing, and may be configured to configure the processing device to operate as desired or to process it collectively or collectively Device can be commanded. The software and / or data may be in the form of any type of machine, component, physical device, virtual equipment, computer storage media, or device As shown in FIG. The software may be distributed over a networked computer system and stored or executed in a distributed manner. The software and data may be stored on one or more computer readable recording media.

The method according to an embodiment may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer-readable medium. The computer-readable medium may include program instructions, data files, data structures, and the like, alone or in combination. The program instructions to be recorded on the medium may be those specially designed and configured for the embodiments or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI &gt; or equivalents, even if it is replaced or replaced.

Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.

Claims (7)

In a broadband band combiner,
A low pass filter composed of an inductor and having at least one notch added thereto; And
A high pass filter composed of an inductor and a capacitor and having at least one notch added thereto,
Lt; / RTI &gt;
Wherein a low pass filter and a high pass filter are combined to form a broadband diplexer and a PCB substrate made of a dielectric material including the low pass filter and the high pass filter is connected to a predetermined distance Spacing
Wherein the wideband combiner comprises: The method according to claim 1,
The wideband combiner comprises:
Wherein the distance between the bottom surface of the mechanism and the bottom surface of the PCB, the length of the L-pad, the width of the L-Pad, and the area of the C-Pad are adjustable. The method according to claim 1,
The wideband combiner comprises:
And a bolt is inserted to remove cavity resonance of the PCB substrate. The method according to claim 1,
The wideband combiner comprises:
And a housing step is provided on the PCB substrate to reduce a C-pad. The method according to claim 1,
The wideband combiner comprises:
Wherein an input terminal of a low-pass filter passing through a first frequency band and an input terminal of a high-pass filter passing through a second frequency band different from the first frequency band are designed to be matched. 6. The method of claim 5,
The low-
Wherein at least one inductor is configured as a transmission line on the PCB substrate and the transmission line is connected between an input terminal and an output terminal on the PCB substrate to provide an output signal by passing 380 MHz to 960 MHz with respect to the input signal, Coupler. 6. The method of claim 5,
Wherein the high-
Wherein at least one inductor is configured as a transmission line, at least one capacitor is formed at an interval between the transmission lines, and the transmission line and the capacitor are connected between an input terminal and an output terminal on the PCB substrate, To output an output signal by passing 1710 to 2700 MHz.

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