KR20180049746A - Solution management system - Google Patents

Abstract

The present invention relates to a solution management system, comprising: an analysis solution storage portion; a specimen storage portion; a specimen supply portion; an absorption sensor; an analysis solution circulation pump; and a wet type analysis control portion. According to the present invention, a concentration of a plating solution is measured in real-time while being inputted with an additive through a real-time analysis management portion. According to a measurement result of the wet type analysis portion having higher analysis precision, a sensor error of the real-time analysis management portion can be promptly corrected.

Description

Solution management system

The present invention relates to a solution management system, and more particularly, to an apparatus and a method for measuring a concentration of a specific component contained in a plating solution or the like, So that it can be corrected immediately.

Copper solution is used for plating PCB. However, if the plating process is continued, the copper concentration of the plating solution may be lowered, thereby lowering the plating efficiency and causing product failure. For this purpose, a technique has been developed which can grasp the state of the plating liquid and fill it when the concentration is lowered.

Methods for analyzing the plating solution include various methods such as using a measured impedance value by applying a potential to the plating solution or using light. However, the measured values at the time of analyzing the plating solution may vary depending on the surrounding environment, and if errors occur in the measurement during the normal measurement process, there is a possibility that the additives are misapplied due to the error of the measured values.

Meanwhile, Korean Patent Laid-Open No. 10-2011-0110462 (October 10, 2011 'Apparatus and Method for Measuring the Activity of Plating Solution') related to the analysis of the plating solution is known as a conventional technique.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide an apparatus and a method for analyzing the concentration of a plating solution, Accordingly, it is an object of the present invention to provide a technique for immediately correcting a sensor error of an analysis management unit.

According to an aspect of the present invention, there is provided a solution management system comprising: an analysis solution storage unit for storing an analysis solution; A sample storage part for storing the plating solution to be supplied to the analysis solution storage part and the samples; A sample supply unit for supplying a predetermined amount of the sample stored in the sample storage unit to the analysis solution storage unit side; An absorption sensor for sensing a change in color of the analysis solution passing through the transmittance of light; An analytical solution circulating pump for supplying the analytical solution to the absorptive sensor side when the plating solution and the samples are mixed in the analytical solution storage part, and then returning the analytical solution to the analytical solution storage part; And a wet analysis control unit for calculating the concentration of the plating solution based on a sample supply amount at a point of time when the color change is detected by the light absorption sensor.

The apparatus further includes a routine analysis management unit that circulates the plating solution in the plating solution storage tank to constantly analyze the concentration of the plating solution in the plating solution storage tank and inputs additives into the plating solution storage tank according to the analyzed result, And the concentration of the plating solution calculated through the constant analysis management unit may be provided to the constant analysis management unit to correct the measurement error in the constant analysis management unit.

The normal analysis management unit may further include: a sampling pump for circulating the plating liquid in the plating liquid storage tank; A normal analysis sensor which transmits light to the plating liquid circulated in accordance with the operation of the sampling pump and outputs a value corresponding to the concentration of the plating liquid; And a normal analysis control unit for deriving a specific component concentration of the plating solution according to an output value of the normal analysis sensor, wherein the normal analysis control unit controls the concentration of the plating solution according to the output value of the normal analysis sensor, When there is a difference in the concentration of one plating solution, the output value of the normal analysis sensor can be corrected so as to correspond to the concentration of the plating solution received from the wet analysis control unit.

The present invention has the following effects.

First, the plating solution is circulated through the routine analysis management unit to measure the concentration in real time. When the concentration falls below a certain level, the additive is injected so that the state of the plating solution can be maintained at a constant level.

At this time, since the constant analysis management unit measures the concentration of the plating solution using light, if there is an error in the analysis sensor at all times according to use for a long time, there is a possibility that an error occurs in the measured value. However, the wet analysis unit periodically measures the concentration of the plating solution through a wet analysis method having a very high measurement accuracy, and transmits the resultant value to the always-on analysis management unit so that the error of the always-on analysis sensor can be corrected immediately.

That is, in the present invention, the additive can be injected while analyzing the concentration of the plating liquid in real time through the routine analysis management unit, and the measurement value of the normal analysis sensor can be corrected using the accurate concentration value measured through the wet analysis, It is possible to manage the plating solution without stopping the analysis at all times.

1 is a view for explaining a solution management system according to an embodiment of the present invention;
2 is a perspective view for explaining a wet analysis unit in the solution management system shown in FIG. 1;
FIG. 3 is a front view of the wet analysis unit shown in FIG. 2. FIG.
Fig. 4 is a side view of the wet analysis unit shown in Fig. 2; Fig.
Fig. 5 is a block diagram for explaining the wet analysis unit shown in Fig. 2; Fig.
FIG. 6 is a perspective view for explaining the routine analysis management unit in the solution management system shown in FIG. 1; FIG.
FIG. 7 is a block diagram for explaining the routine analysis management unit shown in FIG. 6; FIG.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, some configurations which are not related to the gist of the present invention may be omitted or compressed, but the configurations omitted are not necessarily those not necessary in the present invention, and they may be combined by a person having ordinary skill in the art to which the present invention belongs. .

1 is a view for explaining a solution management system according to an embodiment of the present invention. 1, the solution management system according to an embodiment of the present invention includes a normal analysis management unit 100 and a wet analysis unit 200.

The routine analysis management unit 100 always analyzes the concentration of the plating solution stored in the plating solution storage tank 106 and allows the addition of additives when the concentration of the plating solution falls below a reference level so that the state of the plating solution is always maintained at a constant level. Here, the normal analysis sensor 120 of the normal analysis management unit 100 measures the concentration of the plating solution using light. If the long time analysis work is continued, the measurement value of the normal analysis sensor 120 may be erroneous. Of course, the measurement error of the always-on analysis sensor 120 can be corrected using the reference solution, but the analysis operation should be stopped for the correction using the reference solution.

To this end, in the present invention, the wet analysis unit 200 periodically measures the concentration of the plating solution with high accuracy using the sample, and the measured accurate value is transmitted to the normal analysis management unit 100, The measurement error in the normal analysis sensor 120 can be corrected immediately. Hereinafter, the wet analysis unit 200 will be described first with reference to FIG. 2 through FIG.

FIG. 2 is a perspective view for explaining a wet analysis unit in the solution management system shown in FIG. 1, FIG. 3 is a front view of the wet analysis unit shown in FIG. 2, FIG. 5 is a block diagram for explaining the wet analysis unit shown in FIG. 2; FIG.

2 to 5, the wet analysis unit 200 includes a wet analysis main body 210, a sample storage unit 220, a sample metering unit 230, a sample supply unit 240, a sample supply valve 250, An analytical solution circulating pump 264, a circulating pipe 265, a light absorbing sensor 266 and a wet analytical control unit 267. The analytical solution storing unit 262, the analytical solution storing unit 262, the stirring member 263, the analytical solution circulating pump 264, .

The wet analysis body 210 is provided for mounting various configurations for solution analysis.

The sample storage unit 220 is a storage unit for storing samples necessary for analysis. The type and number of samples including the sampled plating solution (working solution) may vary, and it is assumed that six samples are used in this embodiment. Accordingly, the sample storage unit 220 includes a first sample storage unit 221, a second sample storage unit 222, a third sample storage unit 223, a fourth sample storage unit 224, A second sample storage section 225, and a sixth sample storage section 226.

The first sample storage section 221 stores the first sample, for example, the reagent A. The second sample storage section 222 stores the second sample, for example, reagent B, and the third sample storage section 223 stores the reagent The fourth sample storage part 224 stores a fourth sample, for example, a C starch reagent, and the fifth sample storage part 225 stores a fifth sample storage part 225. The fourth sample storage part 224 stores deionized water, For example, reagent D, and a sixth sample storage section 226 is provided for storing the sampled plating liquid. The plating solution stored in the sixth sample storage part 226 is sampled in the plating solution storage tank 106 in units of a predetermined time.

The sample metering section 230 is provided for metering the sample stored in the sample storage section 220 in a predetermined amount before supplying the sample to the analysis solution storage section 262. In this analysis, the C-starch reagent, which is the fourth sample, is not added after a small amount of the reagent is added. Therefore, the fifth reagent D reagent does not need metering since the reagent should be injected periodically during the analysis. Therefore, the sample metering section 230 includes a first sample metering section 231 for metering the first reagent A, a second sample metering section 232 for metering the second reagent B reagent, A third sample metering section 233 for metering the DI reagent, and a sixth sample metering section 236 for metering the sampled plating liquid.

The sample supply unit 240 may be, for example, a metering pump and is provided to supply each sample stored in the sample storage unit 220 to the sample metering unit 230 or the analysis solution storage unit 262. That is, the sample supply unit 240 includes the first sample supply unit to the sixth sample supply units 241, 242, 243, 244, 245 and 246, and the first sample supply unit 241, the second sample supply unit 242, the third sample supply unit 243, The supplying section 246 supplies the first sample (reagent A), the second sample (reagent B), the third sample (the DI reagent) and the sixth sample (sampled plating liquid) to the first sample metering section 231, To the sample metering section 232, the third sample metering section 233, and the sixth sample metering section 236, respectively. At this time, a water level sensor is provided in the first sample metering section 231, the second sample metering section 232, the third sample metering section 233 and the sixth sample metering section 236 to measure the supplied amount of each sample can do.

Meanwhile, the fourth sample supply unit 244 and the fifth sample supply unit 245 directly supply the fourth sample (C starch reagent) and the fifth sample (D reagent) directly to the analysis solution storage unit 262 ).

The sample supply valve 250 is a means for opening and closing a pipe connecting the sample metering section 230 and the mixed supply section 261. This sample supply valve includes a first sample supply valve 251, a second sample supply valve 252, a third sample supply valve 253 and a sixth sample supply valve 256 corresponding to the sample metering section. That is, when a predetermined amount of sample is filled in the sample metering section 230, the sample filled in each sample metering section 230 is supplied to the mixing and supplying section 261.

The mixing supply part 261 has four inlets at the top and one outlet at the bottom. Therefore, when the sample supply valve 250 is opened and samples filled in the sample metering section 230 are mixed in the mixing supply section 261, the sample is supplied to the analysis solution storage section 262 through the lower outlet.

The analysis solution storage part 262 is a container containing the sampled plating solution and storing the respective samples mixed. The analytical solution (the sampled plating solution, the A reagent, the B reagent, the DI reagent, the C starch reagent, and the D reagent mixed solution) stored in the analysis solution storage part 262 flows into the absorption sensor 266 side and is analyzed .

The agitation means 263 allows the plating solution supplied to the analysis solution storage portion 262 to be mixed with various reagents evenly. As the stirring means 263, a magnet stirring method may be applied to smoothly mix with vibration.

The analytical solution storing section 262 is connected to the absorbance sensor 266 through the circulation pipe 265 and the analysis solution is circulated along the circulation pipe 265 by the operation of the analysis solution circulation pump 264 to the absorption sensor 266 And then return to the analytical solution storage part 262 again.

The wet analysis control unit 267 controls the operation of the entire solution analysis and wet analysis unit 200 and provides the results of the measurement at the light absorption sensor 266 to the normal analysis management unit 100, Thereby enabling the analysis sensor 120 error to be corrected.

The wet analysis unit 200 described above will be further described through a description of the wet analysis process, which will be described later.

FIG. 6 is a perspective view for explaining the routine analysis management unit in the solution management system shown in FIG. 1, and FIG. 7 is a block diagram for explaining the routine analysis management unit shown in FIG.

6, the normal analysis management unit 100 according to an embodiment of the present invention includes a normal analysis main body 101, a beacon light 103, a display 104, and an operation unit 105. [

Various components for plating solution analysis are mounted on the main body 101. The components are always protected through the cover 102 on the front surface of the analyzing main body 101. At the back surface of the analyzing main body 101, 106 and the additive storage tank 107 are connected to the flow path.

The beacon light 103 is provided to notify the manager promptly of an error or an urgent situation according to the analysis result.

The display 104 outputs an analysis result of the plating liquid, or outputs a user interface for system setting. The operation unit 105 is provided for receiving a user command.

Referring to FIG. 7, the components for plating solution analysis, that is, the cooling unit 107, the filter 108, the branch valve 1 109, the pH measuring container 113, the pH measuring unit 117, the temperature measuring means 118, the normal analysis control unit 119, the normal analysis sensor 120, the auxiliary valve 141, the merging unit 142, the sampling pump 143, the branch valve 2 144, A driver 148 and piping 150 for connecting the respective components are installed.

The cooling means 107 is provided to lower the temperature of the plating liquid introduced from the plating liquid reservoir 106 provided outside the analysis main body 101 through the piping 150 to a certain level or less. The cooling means 107 may be cooled by air or water, and the cooling means 107 may be omitted.

The filter 108 is provided to filter the foreign substances and bubbles in the plating liquid whose temperature has been lowered through the cooling means 107. [

The branch valve 1 (109) allows the plating solution to flow into the pH measuring container 113 at the downstream or to introduce the reference solution. That is, the branch valve 1 (109) may be a solenoid valve that operates by receiving a signal from the analysis control unit 119. The connection unit 110 connected to the filter 108 side, the inlet of the pH measurement vessel 113 A connecting portion b 111 connected to the reference solution 114, and a connecting portion c 112 connected to the reference solution. Therefore, the connection part a 110 and the connection part b 111 are communicated with each other according to the valve setting, so that the plating solution passing through the filter 108 flows into the pH measurement container 113, or the connection part c 112 and the connection part b 111, Thereby allowing the reference solution to flow into the pH measurement vessel 113. [

An inlet port 114 and an outlet port 115 are formed on the side surface of the pH measuring container 113 and an outlet port 116 is provided on the bottom. When the plating liquid flows into the pH measuring container 113 through the inlet 114, the plating liquid is temporarily stored at a predetermined height.

The pH measuring means 117 and the temperature measuring means 118 are provided for measuring the pH level and the temperature of the plating liquid temporarily stored in the pH measuring vessel 113. The results measured by the pH measuring means 117 and the temperature measuring means 118 are transmitted to the normal analysis control unit 119.

the outlet 1 115 of the pH measuring vessel 113 is connected to the inlet 2 142b of the merging portion 142 through the auxiliary valve 141 and the outlet 2 116 is connected to the lower portion of the analytical sensor 120 . The auxiliary valve 141 may be omitted according to the embodiment.

In addition, the upper portion of the normal analysis sensor 120 is connected to the inlet portion 142a of the merging portion 142. In addition, the discharge portion 142c of the merging portion 142 is connected to the sampling pump 143. When the sampling pump 143 is operated, the inlet portion 142a and the inlet portion 142b of the merging portion 142, So that the plating liquid is simultaneously discharged through the discharge port 1 (115) and the discharge port (116) of the pH measurement container 113. Of course, the plating liquid simultaneously discharged from the two outlets 115 and 116 of the pH measuring vessel 113 is then merged at the merging portion 142.

The reason why the plating solution is discharged through the two paths when discharging the plating solution in the pH measurement container 113 is that the phenomenon of bubbles being generated during the discharge of the plating solution is suppressed, .

The always-on analysis sensor 120 is for monitoring the concentration of the introduced plating solution, and provides the analysis signal obtained by using the light to the always-on analysis control unit 119 side. The normal analysis sensor 120 measures the concentration of the plating liquid using light. That is, when the light of a specific wavelength is emitted from one side of the passing plating liquid, the light is received from the opposite side, and the concentration value is calculated according to the amount of light received by using the point that the transmittance of light of a specific wavelength varies depending on the concentration of the substance contained in the plating liquid I will.

In this case, the amount of light received may vary depending on the change in the surrounding environment such as the temperature, and thus the always-on analysis control unit 119 may misdetect the concentration value. To this end, the always-on analysis sensor 120 is provided with a temperature measurement unit, and when the light reception signal is transmitted to the analysis control unit 119, the temperature analysis unit 119 also transmits the temperature signal measured by the temperature measurement unit. Therefore, the normal analysis control unit 119 can derive the concentration value of a specific component through an analysis signal including a temperature signal and a light reception signal.

The plating liquid that has passed through the normal analysis sensor 120 flows into the sampling pump 143 through the merging portion 142. The plating solution passing through the normal analysis sensor 120 flows into the sampling pump 143. In practice, however, the plating pump 143 is driven by the power generated by the sampling pump 143, The plating solution is pulled up from the plating solution storage tank 106. [

The plating liquid that has passed through the sampling pump 143 flows into the connecting portion a 145 of the branch valve 2 144. The branch valve 2 144 may be a solenoid valve that operates by receiving a signal from the analysis control unit 119 in the same manner as the branch valve 1 109. The branch valve 2 144 includes a connection part 145 connected to the sampling pump 143, A connecting portion b 146 connected to the tank 106, and a connecting portion c 147 connected to the reference solution or drain pipe. Therefore, when the connection portion a 145 and the connection portion b 146 are communicated with each other according to the valve setting, the plating liquid that has passed through the sampling pump 143 is discharged again to the plating liquid reservoir 106 and the connection portion a 145 and the connection portion c 147 ) Is communicated, the reference solution is again discharged to the reference solution storage tank or discarded.

The driving driver 148 drives the supply pump 149 so that the additive stored in the additive storage tank 107 is supplied to the plating solution storage tank 106 in accordance with the drive signal outputted from the normal analysis control unit 119. Here, the additive storage tank 107 provided outside the routine analysis body 101 of the routine analysis management unit 100 may be provided with a plurality of different additives so that each additive is supplied. A driver 149 and a driver 148 may be prepared.

The normal analysis control unit 119 derives the concentration value of a specific component included in the plating solution according to the analysis signal (light receiving signal, temperature signal) output from the normal analysis sensor 120 and outputs the corresponding driving signal to the driving driver 148 . That is, when the specific component measured by the normal analysis sensor 120 is analyzed, when the material falls below a certain level, the driving signal is outputted to the driving driver 148 to operate the supply pump 149, Is supplied to the plating liquid. Further, the normal analysis control unit 119 derives the pH level of the plating solution according to the measurement result by the pH measuring unit 117. When the pH level falls below a certain level, the driving analysis unit 119 outputs a driving signal, 149) so that additives such as a pH adjusting agent are supplied to the plating liquid.

Here, when the concentration value of a specific component is derived according to the light reception signal of the normal analysis sensor 120, the normal analysis control unit 119 derives the concentration value based on the temperature signal transmitted from the temperature measurement unit. Further, when the pH level is derived, the normal analysis control unit 119 corrects the pH level of the plating liquid according to the measurement result of the temperature measuring unit 118 and derives the result. That is, even if the same concentration and the same pH level, the measured value may be changed if the ambient environment such as temperature changes. To this end, the normal analysis control unit 119 corrects measured values (light receiving signal, pH level) by utilizing the data that is constructed through the reference solution.

Since the constant analysis management unit described above corrects the concentration value according to changes in the surrounding environment, it is necessary to accumulate data through the reference solution in advance.

That is, when the user activates the calibration mode through the operation unit 105, the normal analysis control unit 119 changes the valve connection state of the branch valve 1 109 and the branch valve 2 144. That is, the connection portion b 111 of the branch valve 1 109 is connected to the connection portion c 112, and the connection portion a 145 of the branch valve 2 144 is connected to the connection portion c 147. When the sampling pump 143 is operated in this state, the reference solution is discharged to the connection portion b 111 through the connection portion c 112 of the branch valve 1 109, and the pH measurement container 113, 120, the merging portion 142, the sampling pump 143, and the branching valve 2 144, and then returned to the container in which the reference solution is stored or discarded. Therefore, the pH measuring means 117 and the constant analysis sensor 120 can perform the measurement on the reference solution, and the result is transmitted to the analysis control unit 119 at all times.

For example, it is possible to measure the pH level and the copper concentration while circulating a reference solution having a pH level of 7 and a copper concentration of 5 g / L. At this time, the measurement is performed while changing the temperature of the reference solution. In this case, the pH measurement unit 117 and the always-on analysis sensor 120 may measure the pH level or the copper concentration differently. The normal analysis control unit 119 measures the measured value, the corresponding temperature, and the actual value (pH level 7, Copper concentration of 5 g / L), it can be used as data for calibration of the measurement value at the time of sampling for later analysis.

On the other hand, the normal analysis sensor 120 measures the concentration of a specific component using light. Depending on the installation state, the light may be refracted or distorted, resulting in different measured values. However, if the data is accumulated through the calibration process using the reference solution, it is possible to calibrate the measured value even in actual analysis in the future, so that accurate concentration measurement is possible.

In the above description, the calibration process using the reference solution is possible. In this case, even if the measurement error of the normal analysis sensor 120 occurs due to use for a long time, it can be corrected using the reference solution. However, calibration using the reference solution should be done while the analysis is stopped. For this, in the present invention, it is possible to rectify the error of the normal analysis sensor 120 through the wet analysis unit 200. This is discussed below.

A process of sampling and analyzing the plating solution in real time in the normal analysis management unit 100 will be described below.

When the user sets the analysis mode through sampling via the operation unit 105, the always-on analysis control unit 119 changes the valve connection state of the branch valve 1 (109) and the branch valve 2 (144). The connection portion a 110 of the branch valve 1 109 and the connection portion b 111 communicate with each other and the connection portion a 145 of the branch valve 2 144 and the connection portion b 146 communicate with each other. When the sampling pump 143 is operated in this state, the plating solution stored in the plating solution storage tank 106 is drawn up through the pipe 150.

The plating solution is cooled to a predetermined temperature or lower while passing through the cooling means 107, and the foreign substance and air are filtered by passing through the filter 108. The plating liquid flowing into the pH measurement vessel 113 through the branch valve 1 (109) is temporarily stored in the pH measurement vessel (113).

The pH measurement unit 117 and the temperature measurement unit 118 measure the pH level and temperature of the plating solution stored in the pH measurement vessel 113 in real time (or at predetermined time intervals) .

The routine analysis control unit 119 derives the pH level of the plating solution according to the measurement result of the pH measuring unit 117 and derives the corrected pH level according to the measurement result of the temperature measuring unit 118 at this time. When the pH level is corrected, the data accumulated through the reference solution is utilized. The constant analysis control unit 119 outputs a driving signal corresponding to the corrected pH level to the drive driver 148 so that the additive stored in the additive storage tank 107 is driven by the feed pump 149 And is supplied to the plating solution storage tank 106. For example, when the adjusted pH level drops to 6 or less, a certain amount of the pH adjuster is supplied to the plating solution storage tank 106.

The plating solution stored in the pH measurement container 113 is discharged to the always-on analysis sensor 120 side along the pipe 150. Here, the always-on analysis sensor 120 uses an optical analysis method. If the plating liquid contains bubbles, light scattering or distortion may occur, resulting in an error in an accurate measurement value. To this end, in the present invention, the plating solution is simultaneously discharged at two points of the pH measurement vessel 113, thereby minimizing the occurrence of bubbles.

That is, when negative pressure is generated in the discharge portion 142c of the merging portion 142 according to the operation of the sampling pump 143, the outlet 1 of the pH measuring container 113 connected to the inlet portion 142a and the inlet portion 142b The plating liquid is simultaneously sucked from the discharge port 115 and the discharge port 116. Accordingly, the pressure and the flow rate of the plating liquid flowing into the normal analysis sensor 120 are lowered, and the probability of occurrence of bubbles becomes extremely low.

Generally, when the pressure of the moving fluid is high and the flow velocity is high, the reactivity increases together, thereby increasing the bubble generation rate. For example, when the carbonated beverage is sucked by using a straw, if the sucking force is increased and the sucked sucked quickly, the reactivity of the carbonic acid dissolved in the beverage is increased and the bubbles are rapidly generated. When the sucking is slow, relatively little air bubbles are generated, I feel less.

That is, if the pressure generated by the operation of the sampling pump 143 is applied to both the front and rear ends of the analytical sensor 120, and the plating liquid is discharged only through the outlet 2 116 of the pH measuring container 113, In this embodiment, the pressure generated by the sampling pump 143 is dispersed so that the outlet 1 (115) of the pH measuring vessel (113) and the outlet (2) of the pH measuring vessel (113) The plating liquid is dispersed and discharged through the through-hole 116 and the pressure and the flow rate of the plating liquid flowing into the analysis sensor 120 are low. Therefore, the concentration analysis using light in the normal analysis sensor 120 can be performed smoothly.

When the light receiving unit 128 or 129 of the normal analysis sensor 120 outputs a light receiving signal to the normal analysis control unit 119, the normal analysis control unit 119 derives the concentration value of the specific component included in the plating liquid based on the light receiving signal And the drive signal corresponding thereto is transmitted to the drive driver 148 to operate the supply pump 149 so that necessary additives are supplied to the plating liquid. For example, if the copper concentration falls below the reference value, an additive such as a copper stock solution is supplied to the plating solution.

In addition, the normal analysis control unit 119 corrects the concentration value based on the temperature signal output from the temperature measurement unit of the normal analysis sensor 120 and derives the corrected concentration value. When the concentration value is corrected, the data accumulated through the reference solution is utilized.

The plating liquid introduced into the inlet portion 142a of the merging portion 142 via the constant analysis sensor 120 is discharged to the outside through the auxiliary valve 141 and the plating liquid mixed with the plating liquid introduced into the inlet portion 142b of the merging portion 142 And then returns to the plating solution storage tank 106 via the branch valve 2 144. The plating solution 142 is supplied to the sampling pump 143 through the back discharge unit 142c.

The routine analysis management unit 100 samples the plating solution, derives a pH level and a concentration value of a specific component contained in the plating solution, and supplies the plating solution with the additive according to the analyzed result, thereby maintaining the plating solution always in a constant state There is a number. For example, in the case of a plating solution used in a plating process using a copper plating solution, if the plating process is performed for a long time, the copper concentration may be lowered or impurities may accumulate. After monitoring the plating solution in real time through the analysis management unit 100, So that the plating process can be continuously performed without deteriorating the quality.

However, if the long-term analysis is performed through the normal analysis management unit 100, the performance of the normal analysis sensor 120 may be degraded and a measurement error may occur. For example, it is normal that the copper concentration is 5 g / L when the output value of the normal analysis sensor 120 is 5 (unit may be volts). However, the actual copper concentration is 5 g / The output value of the copper concentration becomes 4.9 and the copper concentration can be erroneously determined to be 4.9 g / L.

Of course, it is possible to calibrate the measurement value of the normal analysis sensor 120 using the reference solution. For example, since the reference solution is guaranteed to be 5 g / L even when the output value of the normal analysis sensor 120 becomes 4.9, the database is updated so as to determine the output value 4.9 as the concentration of 5 g / L. However, it is necessary to stop the analysis at all times.

 Accordingly, in the present invention, the accurate concentration of the plating solution is calculated through the wet analysis unit 200, and the calculated concentration of the plating solution is provided to the normal analysis management unit 100 so that the measurement value correction of the degraded normal analysis sensor 120 .

A process of accurately measuring the solution (plating solution) concentration through the wet analysis unit 200 will be described below.

The plating solution is stored in the plating solution storage tank 106 and the plating solution is stored in the plating solution storage tank 106. When the real time plating solution analysis is performed through the normal analysis management unit 100, The plating liquid in the plating liquid reservoir 106 is sampled and supplied to the plating liquid reservoir 226 at predetermined time intervals. The plating solution reservoir 106 and the sixth sample reservoir 226 are connected to each other by a separate pipe, a pump and a valve, and the plating solution in the plating solution reservoir 106 is supplied at predetermined time intervals under the control of the wet analysis control unit 267 And may be supplied to the sixth sample storage unit 226.

The wet analysis control unit 267 operates the sample supply unit 240 to supply each of the samples stored in the sample storage unit 220 to the sample metering unit 230. For example, 25 ml of the sampled plating liquid is supplied to the sixth sample metering section 236, 20 ml of the reagent A is supplied to the first sample metering section 231, 20 ml of the B reagent is supplied to the second sample metering section 232 , And 25 ml of the DI reagent may be supplied to the third sample metering section 233. At this time, the sample supply valve 250 is in a closed state.

When the predetermined amount of the sample is filled in the sample metering part 230, the operation of the sample supplying part 240 is stopped, and the sample supply valve 250 is opened so that the respective samples filled in the sample metering part 230 are mixed 261 and then supplied to the analytical solution storage unit 262.

The fourth sample supply unit 244 supplies the C starch reagent stored in the fourth sample storage unit 224 to the analytical solution storage unit 262 in a predetermined amount. For example, 1 ml to 2 ml of C starch reagent can be supplied. The fifth sample supply unit 245 supplies the D reagent stored in the fifth sample storage unit 225 to the analysis solution storage unit 262 at predetermined intervals.

On the other hand, the analytical solution storing portion 262 generates vibration by the stirring means 263, so that the analytical solution, that is, various samples including the sampled plating solution, are uniformly mixed.

Thereafter, the wet analysis control unit 267 operates the analysis solution circulation pump 264 so that the analysis solution mixed in the analysis solution storage unit 262 passes through the circulation pipe 265, passes through the absorption sensor 266, 262).

The light absorbing sensor 266 is provided for detecting changes in the analysis solution using the transmittance of light. In other words, a colorless solution transmits most of the light, but when the chemical reagent is continuously mixed with the D reagent, the color suddenly changes at a certain moment and the light is absorbed in a considerable amount in the solution. Therefore, the light absorbing sensor 266 is configured to detect when the light transmittance sharply drops. Of course, the base solution (analytical solution) has a dark brown color, and if the D reagent is continuously mixed, the color may disappear rapidly. Therefore, the light absorbing sensor 266 only needs to find a point of time when the color suddenly changes.

When the analysis solution stored in the analysis solution storage section 262 is circulated by the analysis solution circulation pump 264, the wet analysis control section 267 controls the fifth sample storage section 225 ) Is continuously supplied in a predetermined amount. Since the chemical reaction by the D reagent is abruptly performed, the fifth sample supply unit 245 supplies the D reagent by one drop at predetermined time intervals.

If it is confirmed that the color change sharply changes when the 5 ml of the D reagent is mixed and the light transmittance of the light absorbing sensor 266 is abruptly changed, the wet analysis control unit 267 controls 5 ml of the D reagent, The concentration of the plating solution can be calculated by multiplying the determined constant by the amount of the other reagent and the sampled plating solution.

Here, D reagent is said to be injected one drop, but 5 ml can be about 100 drops. However, the volume per drop may be different depending on the viscosity of D reagent, which can be used as a calculation index by building a database in advance.

In addition, the analytical solution can be circulated to the analyzing solution by the absorbance sensor 266 immediately after the reagent A, B reagent, DI reagent, C starch reagent, and sampled plating solution are added. However, after a considerable amount of D reagent is added, The wet analysis control unit 267 may operate the analysis solution circulation pump 264 after the D reagent is put in a certain amount (for example, 20 drops).

On the other hand, since the light absorption sensor 266 of the wet analysis unit 200 also uses light to determine the concentration, there is a possibility that it may be similar to the normal analysis sensor 120, but the principle of concentration determination is totally different, .

That is, the normal analysis sensor 120 reads the subtle changes in the plating liquid concentration to determine the concentration. For example, when the output value of the normal analysis sensor 120 is 4.9, the concentration is determined to be 4.9 g / L, and in the case of 5.0, the concentration is determined to be 5 g / L. Therefore, if an error occurs in the normal analysis sensor 120 and an output value of 4.9 is obtained even though the actual concentration is 5 g / L, the concentration determination is wrong.

On the other hand, the light absorbing sensor 266 in the wet analysis unit 200 does not read subtle changes in the plating liquid, but rather finds out the point in time when the color suddenly changes. For example, when there is no color change in the steady state, the output value of the light absorbing sensor 266 is 10, and when the color change is abrupt, the output value may be 5. Therefore, the wet analysis control unit 267 determines the reference that the color change is absent when the output value of the light absorbing sensor 266 is 7.5 or more, and determines the color change when the output value is less than 7.5. Therefore, the absorber sensor 266 should output the normal output value 10 when there is no color change. However, even if 9.5 is outputted due to an error, the wet analysis control unit 267 can recognize 'no color change' In case of a change, the normal output value of the light absorbing sensor 266 should be 5. However, even if 5.5 is output due to an error, the wet analysis control unit 267 can know the 'color change is present' because it is less than the standard 7.5. In other words, since only a few droplets of D reagent are changed, the wet analysis method is very accurate because it is calculated by the applied algorithm.

 However, since the reagent must be used, it is not always possible to analyze it through the wet analysis unit 200, and once the analysis is completed, the analysis solution should be emptied and cleaned. Therefore, the value measured by the wet analysis unit 200 is preferably used for the correction of the measurement value of the normal analysis management unit 100, rather than being used as a reference signal for adding the additive.

That is, if the continuous analysis is performed by the normal analysis management unit 100 for a long time, a measurement value error may occur due to the degradation of the normal analysis sensor 120, while the measurement value of the wet analysis unit 200, The wet analysis control unit 267 delivers the accurate measurement value from the wet analysis unit 200 to the always-on analysis control unit 119 of the normal analysis management unit 100 since the accuracy is always high.

Then, the normal analysis control unit 119 compares the measured value of the normal analysis sensor 120 with the measured value of the wet analysis unit 200. If it is confirmed that an error occurs in the two measured values, the wet analysis unit 200 and the measured value of the normal analysis sensor 120 is corrected based on the measured value.

For example, since the copper concentration in the actual plating solution is 5 g / L, the output value of the normal analysis sensor 120 should be 5.0, but 4.9 is outputted due to the error, so that the copper concentration can be determined to be 4.9 g / L. The analytical control unit 119 always transmits an output value 4.9 of the analytical sensor 120 to the copper analyzing unit 119, (Calibrate) the existing entire database to correspond to 5 g / L.

Of course, the routine analysis management unit 100 continuously measures the concentration by continuously circulating the plating solution storage tank 106. In the wet analysis unit 200, the reagent is dropped into the sampled plating solution one by one, It is possible to cause a parallax in which the concentration result is produced by the time that occurs in the concentration calculation process of the wet analysis unit 200. [

However, since the plating solution concentration does not change abruptly for a short period of time, a large problem does not occur even if a time difference occurs. Of course, it is also possible to design the normal analysis control unit 119 so as to compensate the past analysis data in consideration of the time of the concentration calculation process of the wet analysis unit 200.

As described in detail above, according to the present invention, the plating solution is circulated through the normal analysis management unit 100 to measure the concentration in real time, and when the concentration falls below a certain level, the additive is supplied so that the state of the plating solution is maintained at a constant level You can.

At this time, since the constant analysis management unit 100 measures the concentration of the plating solution using light, if an error occurs in the normal analysis sensor 120 according to long-time use, there is a possibility that an error occurs in the measured value. However, the wet analysis unit 200 periodically measures the concentration of the plating solution through the wet analysis method having a very high measurement accuracy and transmits the resultant value to the normal analysis management unit 100 so that the error of the normal analysis sensor 120 So that it can be corrected immediately.

That is, in the present invention, the additive can be introduced while analyzing the concentration of the plating solution in real time through the normal analysis management unit 100, and the measured value of the normal analysis sensor 120 Since calibration is possible, accurate plating solution management is possible without stopping the analysis at all times.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And additions should be considered as falling within the scope of the claims of the present invention.

100:
101: Continuous analysis body
102: Cover
103: warning light
104: Display
105:
107: cooling means
108: Filter
109: Branch valve 1
110: connection a
111: connection b
112: connection c
113: pH measuring container
114: inlet
115: Outlet 1
116: Outlet 2
117: pH measuring means
118: Temperature measuring means
119:
120: Always-on analysis sensor
141: Auxiliary valve
142:
142a: inlet 1
142b: inlet 2
142c:
143: Sampling pump
144: Branch valve 2
145: connection a
146: connection b
147: connection c
148: Driving driver
149: Feed pump
150: Piping
106: plating solution storage tank
107: Additive storage tank
200: wet analysis section
210: wet analysis body
220: Sample storage part
221: First sample storage part
222: second sample storage section
223: Third sample storage section
224: Fourth sample storage part
225: fifth sample storage section
226: Sixth sample storage part
230: sample metering section
231: First sample metering section
232: Second sample metering section
233: Third sample metering section
236: Sixth sample metering section
240:
241: First sample supply part
242: second sample supply section
243: Third sample supply section
244: Fourth sample supply part
245: fifth sample supply part
246: Sixth sample supply part
250: Sample supply valve
251: first sample supply valve
252: second sample supply valve
253: Third sample supply valve
256: Sixth sample supply valve
261:
262: Analytical solution storage section
263: stirring means
264: Analytical solution circulation pump
265: Circulating piping
266: Absorption sensor
267: Wet analysis control unit

Claims (3)

An analytical solution storage section for storing the analytical solution;
A sample storage part for storing the plating solution to be supplied to the analysis solution storage part and the samples;
A sample supply unit for supplying a predetermined amount of the sample stored in the sample storage unit to the analysis solution storage unit side;
An absorption sensor for sensing a change in color of the analysis solution passing through the transmittance of light;
An analytical solution circulating pump for supplying the analytical solution to the absorptive sensor side when the plating solution and the samples are mixed in the analytical solution storage part, and then returning the analytical solution to the analytical solution storage part; And
And a wet analysis control unit for calculating a concentration of the plating solution based on a sample supply amount at a point of time when the color change is detected by the light absorption sensor.
The method according to claim 1,
And a constant analysis management unit for continuously analyzing the concentration of the plating solution in the plating solution storage tank by circulating the plating solution in the plating solution storage tank and injecting the additives into the plating solution storage tank according to the analyzed result,
Wherein the wet analysis control unit provides the concentration of the plating solution calculated through the supply of the sample to the normal analysis management unit to correct the measurement error in the normal analysis management unit.
3. The method of claim 2,
Wherein the normal analysis management unit comprises:
A sampling pump for circulating the plating liquid in the plating liquid storage tank;
A normal analysis sensor which transmits light to the plating liquid circulated in accordance with the operation of the sampling pump and outputs a value corresponding to the concentration of the plating liquid; And
And a normal analysis controller for deriving a specific component concentration of the plating solution according to an output value of the normal analysis sensor,
Wherein the normal analysis control unit determines that the output value of the constant analysis sensor is greater than the concentration of the plating liquid received from the wet analysis control unit when there is a difference between the concentration of the plating liquid depending on the output value of the normal analysis sensor and the concentration of the plating liquid received from the wet analysis control unit And the concentration of the solution is adjusted to correspond to the concentration of the solution.

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