KR20180036344A - Display device having an upper substrate boding to a lower substrate by an adhesive layer - Google Patents

Abstract

The present invention provides a display device capable of preventing a panel from being damaged by foreign substances in a process of bonding an upper substrate to a lower substrate. The display device comprises the upper substrate bonded to the lower substrate by an adhesive layer. Grooves for receiving the foreign substances are located on an outer side surface of the upper substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a display device having an upper substrate for bonding an upper substrate to an upper substrate by an adhesive layer,

The present invention relates to a display device in which an upper substrate is bonded to a lower substrate through an adhesive layer.

2. Description of the Related Art Generally, electronic devices such as a monitor, a TV, a notebook, a digital camera, and the like include a display device for implementing an image. For example, the display device may include a liquid crystal display device and an organic light emitting display device.

A manufacturing method of a display device including a light emitting layer such as the organic light emitting display device may include a sealing process to prevent deterioration of the light emitting layer due to external moisture and / or oxygen. For example, the manufacturing method of the display device includes a step of forming a light emitting structure including a light emitting layer on a lower substrate, a step of disposing an upper substrate having an adhesive layer formed on the lower substrate on which the light emitting structure is formed, And applying a pressure to an outer surface of the upper substrate to bond the upper substrate to the lower substrate such that the adhesive layer covers the light emitting structure.

However, in the process of attaching the upper substrate to the lower substrate, when the foreign substance generated in the process penetrates onto the outer surface of the upper substrate, the upper substrate is partially subjected to a relatively strong pressure by the foreign object , The upper substrate and / or the light emitting structure may be damaged.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display device capable of remarkably reducing damage to an upper substrate and a light emitting structure due to foreign matter when an upper substrate is attached to a lower substrate using an adhesive layer.

Another object of the present invention is to provide a display device capable of minimizing the pressing of the upper substrate and / or the light emitting structure of the foreign object by the pressure applied to the upper substrate in the laminating process.

The problems to be solved by the present invention are not limited to the above-mentioned problems. Tasks not mentioned here will be apparent to the ordinarily skilled artisan from the description below.

According to an aspect of the present invention, there is provided a display device including: a light emitting structure disposed on a lower substrate and including a light emitting layer; An adhesive layer disposed on the lower substrate and covering the light emitting structure; And an upper substrate positioned on the adhesive layer. The upper substrate is located on the outer surface and includes grooves having a depth of 20 [mu] m to 40 [mu] m.

The vertical depth of the grooves may be between 36 μm and 40 μm.

The horizontal width of each of the grooves may be 600 탆 to 2000 탆.

The horizontal width of each of the grooves may be 1200 탆 to 2000 탆.

The distance between adjacent grooves in the first direction may be constant.

The distance between the adjacent grooves in the second direction perpendicular to the first direction may be constant.

The distance between adjacent grooves in the first direction may be different from the distance between adjacent grooves in the second direction.

The upper substrate may comprise a metal.

According to another aspect of the present invention, there is provided a display device including: a light emitting structure including a light emitting layer; An upper substrate disposed on the light emitting structure and including protruding patterns located on an outer surface; And an adhesive layer disposed between the lower substrate and the upper substrate and covering the light emitting structure. The distance between adjacent protruding patterns is 600 占 퐉 to 2000 占 퐉.

The distance between the adjacent protruding patterns may be 1200 mu m to 1400 mu m.

The horizontal width of each of the protruding patterns may be smaller than the distance between the adjacent protruding patterns.

The horizontal width of each of the protruding patterns may be 200 탆 to 600 탆.

The protruding patterns may extend parallel to each other.

The display device according to the technical idea of the present invention can minimize the damage of the upper substrate and / or the light emitting structure due to the foreign matter penetrating onto the outer surface of the upper substrate during the adhesion process. Accordingly, in the display device according to the technical idea of the present invention, the defect rate due to the adhesion process can be significantly reduced. Therefore, in the display device according to the technical idea of the present invention, the production yield and reliability can be improved.

1 is a schematic cross-sectional view of a display device according to an embodiment of the present invention.
2 is a schematic top view of a display device according to an embodiment of the present invention.
3 is an enlarged view of the P region in Fig.
4 to 9 are views showing a display device according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

In the drawings, the same reference numerals denote the same components throughout the specification. In the drawings, the lengths and the thicknesses of layers or regions may be exaggerated for convenience. In addition, when the first component is described as being on the second component, it is preferable that the first component is located on the upper side in direct contact with the second component, And the third component is located between the second components.

Here, the terms first, second, etc. are used for describing various components and are used for the purpose of distinguishing one component from another component. However, the first component and the second component may be arbitrarily named according to the convenience of the person skilled in the art without departing from the technical idea of the present invention.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. For example, an element represented in singular form includes a plurality of elements unless the context clearly dictates a singular number. Also, in the specification of the present invention, the terms such as " comprises "or" having ", and the like, designate the presence of stated features, integers, steps, operations, elements, But do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the related art and, unless expressly defined in the specification of the present invention, are intended to mean either an ideal or an overly formal meaning It is not interpreted.

(Example)

1 is a schematic cross-sectional view of a display device according to an embodiment of the present invention. 2 is a schematic top view of a display device according to an embodiment of the present invention. 3 is an enlarged view of the P region in Fig.

1 to 3, a display device according to an exemplary embodiment of the present invention may include a lower substrate 100, a thin film transistor 110, a light emitting structure 130, an adhesive layer 200, and an upper substrate 300 have.

The lower substrate 100 may support the thin film transistor 110 and the light emitting structure 130. The lower substrate 100 may include an insulating material. The lower substrate 100 may include a transparent material. For example, the lower substrate 100 may comprise glass or plastic.

The thin film transistor 110 may be positioned on the lower substrate 100. For example, the thin film transistor 110 may include a semiconductor pattern 111 located close to the lower substrate 100, a gate insulating film 112 located on the semiconductor pattern 111, An interlayer insulating film 114 covering the semiconductor pattern 111 and the gate electrode 113, a source electrode 115 located on the interlayer insulating film 114, and an interlayer insulating film And a drain electrode 116 that is spaced apart from the source electrode 115 on the substrate 114.

The semiconductor pattern 111 may include a semiconductor material. For example, the semiconductor pattern 111 may include amorphous silicon or polycrystalline silicon. For example, the semiconductor pattern 111 may include an oxide semiconductor material such as IGZO. The semiconductor pattern 111 may include a source region, a drain region, and a channel region located between the source region and the drain region.

The gate electrode 113 may be located on the channel region of the semiconductor pattern 111. The source electrode 115 may be electrically connected to the source region of the semiconductor pattern 111. The drain electrode 116 may be electrically connected to the drain region of the semiconductor pattern 111. For example, the interlayer insulating layer 114 may include a contact hole exposing the source region of the semiconductor pattern 111 and a contact hole exposing the drain region.

The gate electrode 113, the source electrode 115, and the drain electrode 116 may include a conductive material. For example, the gate electrode 113, the source electrode 115, and the drain electrode 116 may include a metal. The drain electrode 116 may include the same material as the source electrode 115. The gate electrode 113 may include a material different from the source electrode 115 and the drain electrode 116.

The gate insulating layer 112 and the interlayer insulating layer 114 may include an insulating material. The gate insulating layer 112 may include a side surface perpendicular to the side surface of the gate electrode 113. For example, the side surface of the gate insulating layer 112 may be continuous with the side surface of the gate electrode 113. The interlayer insulating layer 114 may extend outwardly of the semiconductor pattern 111. For example, the side surface of the semiconductor pattern 111 may be covered with the interlayer insulating layer 114.

A display device according to an embodiment of the present invention is described as a thin film transistor 110 positioned on a surface of a lower substrate 100. However, the display device according to another embodiment of the present invention may further include a buffer layer positioned between the lower substrate 100 and the thin film transistor 110. The buffer layer may include an insulating material. For example, the buffer layer may comprise silicon oxide and / or silicon nitride. The buffer layer may have a multi-layer structure.

A display device according to an embodiment of the present invention is described as including a thin film transistor 110 in which a gate electrode 113 is positioned on a top surface of a semiconductor pattern 111. [ However, the display device according to another embodiment of the present invention may include the thin film transistor 110 in which the gate electrode 113 is positioned between the lower substrate 100 and the semiconductor pattern 111.

The display device according to an embodiment of the present invention may further include a planarization layer 120 for removing a stepped portion by the thin film transistor 110. The thin film transistor 120 may be completely covered with the planarization layer 120. For example, the upper surface of the planarization layer 120 may be parallel to the upper surface of the lower substrate 100. The planarization layer 120 may include an insulating material. For example, the planarization layer 120 may include silicon oxide.

The display device according to the embodiment of the present invention is described as having the planarization layer 120 on the thin film transistor 110. However, the display device according to another embodiment of the present invention may further include a protective film disposed between the thin film transistor 110 and the planarization film 120. The protective film may include an insulating material. The protective layer may include a material different from the planarizing layer. For example, the protective film may comprise silicon nitride.

The light emitting structure 130 may generate light that emits a specific color. For example, the light emitting structure 130 may include a lower electrode 131, a light emitting layer 1320, and an upper electrode 133 stacked in order.

The light emitting structure 130 may be selectively operated by the thin film transistor 110. For example, the lower electrode 131 of the light emitting structure 130 may be electrically connected to the drain electrode 116 of the thin film transistor 110. The thin film transistor 9110 may be a driving transistor for applying a driving current to the light emitting structure 130. The light emitting structure 130 may be positioned on the planarization layer 120. The planarization layer 120 may include a contact hole exposing the drain electrode 116.

The lower electrode 131 and the upper electrode 133 may include a conductive material. The upper electrode 133 may include a material different from the lower electrode 131. For example, the lower electrode 131 may include a transparent material, and the upper electrode 133 may include a material having a relatively high reflectance. For example, the lower electrode 131 may include ITO or IZO, and the upper electrode 133 may include a metal.

The light emitting layer 132 may generate light having a luminance corresponding to a voltage difference between the lower electrode 131 and the upper electrode 133. The light generated by the light emitting layer 132 may realize a specific color. For example, the light emitting layer 132 may be blue, red, green, or white.

The light emitting layer 132 may include a light emitting material layer (EML) including a light emitting material. The light emitting material may include an organic material, an inorganic material, or a hybrid material. For example, the display device according to an embodiment of the present invention may be an organic light emitting display device including the organic light emitting layer 132.

The light emitting layer 132 may have a multi-layer structure for enhancing the light emitting efficiency. For example, the light emitting layer 132 may include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer ). ≪ / RTI >

A display device according to an embodiment of the present invention may include a plurality of pixel regions. Adjacent pixel regions may implement different colors. For example, the display device according to an exemplary embodiment of the present invention may include pixel regions for realizing blue, pixel regions for realizing red, pixel regions for realizing green, and pixel regions for realizing white. The light emitting structures 130 located on adjacent pixel regions can be independently controlled. For example, the lower electrodes 131 of the light emitting structures 130 located on adjacent pixel regions may be separated from each other. The lower electrode 131 of the light emitting structure 130 may be spaced apart from the lower electrode 131 of the adjacent light emitting structure 130.

The display device according to the embodiment of the present invention may further include a bank insulating film 140. [ The bank insulating layer 140 may cover the edge of the lower electrode 131 of the light emitting structure 130. The light emitting layer 132 and the upper electrode 133 of the light emitting structure 130 may be stacked on the surface of the lower electrode 131 exposed by the bank insulating layer 140. The bank insulating layer 140 may include an insulating material. For example, the bank insulating layer 140 may include an organic insulating material such as benzocyclobutene (BCB), polyimide, and photo acryl.

The pixel defining layer 150 may be disposed on the upper electrode 133 of the light emitting structure 130. The pixel protecting layer 150 may prevent external moisture or oxygen from penetrating into the light emitting layer 130. The pixel protecting layer 150 may extend over the bank insulating layer 140. For example, in the display device according to the embodiment of the present invention, the upper electrode 133 and the pixel protective layer 150 may extend on the bank insulating layer 140. The pixel protection layer 150 may include an insulating material. The pixel protecting layer 150 may include a material different from the bank insulating layer 140. For example, the pixel protection layer 150 may include silicon oxide and / or silicon nitride. The pixel protection layer 150 may have a multi-layer structure.

The adhesive layer 200 may protect the light emitting structure 130 from external impacts or penetration of foreign matter, moisture, and oxygen. The adhesive layer 200 may be positioned on the light emitting structure 130. For example, the protective layer 150 may be in direct contact with the adhesive layer 200. The adhesive layer 200 may extend outwardly of the pixel regions. The thin film transistor 110 and the light emitting structure 130 may be completely covered with the adhesive layer 200. For example, in the edge region of the lower substrate 100, the adhesive layer 200 may directly contact the lower substrate 100.

The adhesive layer 200 may have a multi-layer structure. For example, the adhesive layer 200 may include a lower adhesive layer 210 and an upper adhesive layer 220.

The lower adhesive layer 210 may be located close to the lower substrate 100. The lower substrate 100 and the pixel protective film 9150 may be in contact with the lower adhesive layer 210. The lower adhesive layer 210 may include a curable material. For example, the lower adhesive layer 210 may include a resin such as an epoxy, a penol, an amino, an unsaturated polyester, an olefin, or the like. The lower adhesive layer 210 may include a thermosetting resin.

The upper adhesive layer 220 may be positioned on the lower adhesive layer 210. The side surfaces of the lower adhesive layer 210 may be vertically aligned with the side surfaces of the upper adhesive layer 220. For example, the side surface of the lower adhesive layer 210 may be continuous with the side surface of the upper adhesive layer 220. The upper adhesive layer 220 may include a curable material. For example, the upper adhesive layer 220 may include a thermosetting resin. The upper adhesive layer 220 may include a material different from the lower adhesive layer 210.

The upper adhesive layer 220 may further include a moisture absorbing material 225. The hygroscopic material 225 can collect moisture permeating from the outside. The lower adhesive layer 210 can relieve stress due to the expansion of the hygroscopic material 225 located in the upper adhesive layer 220. Accordingly, the display device according to the embodiment of the present invention can effectively prevent the infiltration of moisture from the outside.

The upper substrate 300 may be positioned on the adhesive layer 200. The side surface of the upper substrate 300 may be located outside the adhesive layer 200. For example, the adhesive layer 200 may expose the outermost regions of the lower substrate 100 and the upper substrate 300. Accordingly, in the display device according to the embodiment of the present invention, the adhesive layer 200 can be prevented from flowing down to the side surfaces of the lower substrate 100 and / or the upper substrate 300 by the process margin.

The upper substrate 300 may be bonded to the lower substrate 100 by the adhesive layer 200. The thin film transistor 110 and the light emitting structure 130 located on the lower substrate 100 may be sealed by the lower substrate 100, the adhesive layer 200, and the upper substrate 300.

The upper substrate 300 may include a material having a hardness equal to or greater than a certain level. The upper substrate 300 may include a material capable of effectively transmitting heat generated by the thin film transistor 110 and the light emitting structure 130. For example, the upper substrate 300 may include a metal such as aluminum and copper.

The protruding patterns 301 may be located on the outer surface of the upper substrate 300. The upper substrate 300 may include grooves SA positioned between adjacent protruding patterns 301. The depth T of the grooves SA may be equal to the thickness T of the protruding patterns 301. The distance W between the adjacent protruding patterns 301 may be equal to the horizontal width W of each of the grooves SA. The protruding patterns 301 may extend in one direction. The grooves SA may be in the shape of a trench extending in one direction.

The foreign substances may be positioned between the protruding patterns 301 during the process of attaching the upper substrate 300. For example, the grooves SA located on the outer surface of the upper substrate 300 can accommodate foreign substances that have penetrated during the laminating process.

FIG. 4 is a graph showing the occurrence frequency according to the thickness of a foreign object generated in a manufacturing process of a general display device.

Referring to FIG. 4, it can be seen that foreign matter having a thickness of 0 μm to 20 μm is generated much more than foreign matter having a thickness of 20 μm or more in a general display device manufacturing process. In addition, it can be seen that almost no foreign matter having a thickness of 36 mu m or more is produced in a manufacturing process of a general display device. That is, in the display device according to the embodiment of the present invention, when the protruding patterns 301 have a thickness T of less than 20 占 퐉, The probability of occurrence of defects can be remarkably increased by pressing the light emitting structure 300 and / or the light emitting structure 130. The thickness T of the protruding patterns 301 located on the outer surface of the upper substrate 300, that is, the depth T of the grooves SA is 20 μm or more, The damage to the upper substrate 300 and / or the light emitting structure 130 due to foreign matter can be remarkably reduced.

In addition, if the thickness T of the protruding patterns 301 located on the outer surface of the upper substrate 300 increases, the overall size and weight of the display device may increase. Accordingly, in the display device according to the embodiment of the present invention, the thickness T of the protruding pattern 301 located on the outer surface of the upper substrate 300 is 40 μm or less considering the process margin, can do.

Therefore, in the display device according to the embodiment of the present invention, the upper substrate 300, which is adhered to the lower substrate 100 by the adhesive layer 200, has a depth T of 20 to 40 μm, (SA) having a depth (T) of 36 占 퐉 to 40 占 퐉, it is possible to minimize the damage of the upper substrate 300 and / or the light emitting structure 130 due to foreign substances during the adhesion process.

FIG. 5 is a graph illustrating the frequency of occurrence of foreign objects in a manufacturing process of a general display device according to a horizontal width.

Referring to FIG. 5, it can be seen that, in a general display device manufacturing process, foreign matter having a horizontal width of 0 μm to 600 μm occurs significantly more than foreign matter having a horizontal width of 600 μm or more. In addition, it can be seen that almost no foreign matter having a horizontal width of 1800 mu m or more is produced in a general display device manufacturing process. That is, when the distance W between the adjacent protruding patterns 301 in the display device according to the embodiment of the present invention is less than 600 mu m, grooves located on the outer surface of the upper substrate 300, (SA) can not be accommodated. Accordingly, if the horizontal width W of the grooves SA is less than 600 mu m in the display device according to the embodiment of the present invention, the probability of damage to the upper substrate 300 and / or the light emitting structure 130 due to foreign matter Can be significantly increased. Therefore, in the display device according to the embodiment of the present invention, the horizontal width W of the grooves SA located on the outer surface of the upper substrate 300 is 600 μm or more, preferably 1200 μm or more, The damage of the upper substrate 300 and / or the light emitting structure 130 can be remarkably reduced.

In addition, when the horizontal width W of the grooves SA located on the outer surface of the upper substrate 300 is increased, the pressure of the upper substrate 300 is increased, So that the upper substrate 300 can be damaged. Accordingly, in consideration of the process margin, the display device according to the embodiment of the present invention allows the distance W between the adjacent protruding patterns 301 located on the outer surface of the upper substrate 300 to be 2000 탆 or less, It is possible to prevent the size of the display device from unnecessarily increasing. In the display device according to the embodiment of the present invention, in consideration of the fact that the frequency of occurrence of foreign matter having a horizontal width of 1200 mu m to 1600 mu m is remarkably low in a general manufacturing process of a display device, The distance W between the adjacent protruding patterns 301 located on the surface can be 1400 占 퐉 or less in consideration of the process margin.

Therefore, in the display device according to the embodiment of the present invention, the depth T of the grooves SA on the outer surface of the upper substrate 300, which is adhered to the lower substrate 100 by the adhesive layer 200, The damage of the upper substrate 300 and / or the light emitting structure 130 due to foreign substances during the laminating process can be remarkably reduced by making the thickness of the upper substrate 300 and / or the light emitting structure 130 to be in the range of 1 μm to 2 μm, preferably 1200 μm to 2000 μm, and more preferably 1200 μm to 1400 μm have.

The display device according to the embodiment of the present invention can reduce the horizontal width of each of the protruding patterns 301 between the adjacent protruding patterns 301 so that infiltrated foreign matter does not stay on the outer surface of the protruding patterns 301. [ Can be made smaller than the distance. For example, the horizontal width of each of the protruding patterns 301 may be smaller than the horizontal width of each of the grooves SA. Referring to FIG. 5, since the occurrence frequency of foreign matter having a width of 200 to 400 mu m is the highest in a general display device, the horizontal width of each of the protruding patterns 301 is preferably 200 to 400 mu m have.

As a result, the display device according to the exemplary embodiment of the present invention may have a structure in which the thickness and the horizontal width of the protruding patterns 301 located on the outer surface of the upper substrate 300 and the widths of the grooves SA formed by the protruding patterns 301 It is possible to prevent damage to the upper substrate 300 and the light emitting structure 130 due to foreign matter and to optimize the production efficiency.

The display device according to the embodiment of the present invention is described as having grooves SA located on the outer surface of the upper substrate 300 extending parallel to each other in one direction. However, the display device according to another embodiment of the present invention may be positioned such that the grooves SA are spaced apart from each other in the first direction and the second direction perpendicular to the first direction, as shown in FIG. The distance between adjacent grooves SA in the first direction in the display device according to another embodiment of the present invention may be constant. In the display device according to another embodiment of the present invention, distances between adjacent grooves SA in the second direction may be constant. In the display device according to another embodiment of the present invention, the distance between adjacent grooves SA in the first direction may be equal to the distance between adjacent grooves SA in the second direction. For example, the display device according to another embodiment of the present invention may have a shape in which the grooves SA are regularly arranged in the first direction and the second direction, as shown in FIG. Alternatively, the display device according to another embodiment of the present invention may be arranged such that the grooves SA are spaced apart from each other in the first direction and the second direction, as shown in Fig. 7, The rows and / or columns adjacent to each other in two directions may be arranged to be staggered with respect to each other. For example, in a display device according to another embodiment of the present invention, the distance between adjacent grooves SA in the first direction may be different from the distance between adjacent grooves SA in the second direction.

The display device according to the embodiment of the present invention is described as having the shape in which the protruding patterns 301 located on the outer surface of the upper substrate 300 extend parallel to each other in one direction. However, the display device according to another embodiment of the present invention may be positioned such that the protruding patterns 301 are spaced apart from each other in the first direction and the second direction perpendicular to the first direction, as shown in FIG. 8 . In the display device according to another embodiment of the present invention, the grooves SA may have a mesh shape. In the display device according to another embodiment of the present invention, the protruding patterns 301 may be regularly arranged in the first direction and the second direction.

The display device according to another embodiment of the present invention with reference to FIG. 8 is described in which the protruding patterns 301 are rectangular in shape. However, the display device according to another embodiment of the present invention may include rhombic protruding patterns 301 as shown in FIG. In the display device according to another embodiment of the present invention, the protruding patterns 301 may be regularly arranged. For example, in the display device according to another embodiment of the present invention, the horizontal widths of the grooves SA located on the respective sides of the protruding patterns 301 may be the same.

100: lower substrate 110: thin film transistor
130: light emitting structure 200: adhesive layer
300: upper substrate 301: protruding pattern
SA: Home

Claims (13)

A light emitting structure located on the lower substrate, the light emitting structure including a light emitting layer;
An adhesive layer disposed on the lower substrate and covering the light emitting structure; And
And an upper substrate positioned on the adhesive layer,
Wherein the upper substrate is located on an outer surface and includes grooves having a depth of 20 占 퐉 to 40 占 퐉. The method according to claim 1,
And the vertical depth of the grooves is 36 to 40 占 퐉. The method according to claim 1,
And each of the grooves has a horizontal width of 600 mu m to 2000 mu m. The method of claim 3,
And each of the grooves has a horizontal width of 1200 mu m to 2000 mu m. The method according to claim 1,
Wherein a distance between adjacent grooves in the first direction is constant. 6. The method of claim 5,
And a distance between adjacent grooves in a second direction perpendicular to the first direction is constant. The method according to claim 6,
Wherein a distance between adjacent grooves in the first direction is different from a distance between adjacent grooves in the second direction. The method according to claim 1,
Wherein the upper substrate comprises a metal. A light emitting structure located on the lower substrate, the light emitting structure including a light emitting layer;
An upper substrate disposed on the light emitting structure and including protruding patterns located on an outer surface; And
And an adhesive layer disposed between the lower substrate and the upper substrate and covering the light emitting structure,
And the distance between adjacent protruding patterns is 600 mu m to 2000 mu m. 10. The method of claim 9,
And a distance between the adjacent protruding patterns is 1200 mu m to 1400 mu m. 10. The method of claim 9,
Wherein a horizontal width of each of the protruding patterns is smaller than a distance between the adjacent protruding patterns. 12. The method of claim 11,
And each of the protruding patterns has a horizontal width of 200 mu m to 600 mu m. 10. The method of claim 9,
Wherein the protruding patterns extend parallel to each other.

Images