KR20180010472A - A lens moving unit, and camera module and optical instrument including the same - Google Patents

Abstract

The present invention provides a lens driving apparatus which can prevent damage to bonding units of a coil substrate. According to an embodiment of the present invention, the lens driving apparatus comprises: a housing; a bobbin accommodated in the housing to mount a lens; a first coil arranged on an outer circumferential surface of the bobbin; magnets arranged on the housing; a coil substrate which is arranged below the housing, and includes second coils separated from each other and connection units connected to the second coils; a circuit board which is arranged below he coil substrate, and includes first pad units arranged on positions corresponding to the connection units; and a conductive adhesion member to bond a connection unit and a first pad unit corresponding to each other. The connection units each includes: a groove unit which is dented from an outer surface of the coil substrate, and exposes an upper surface of one corresponding first pad unit among the first pad units; and a bonding unit arranged around the groove unit. The conductive adhesion member is arranged on an upper surface of the bonding unit and the upper surface of the first pad unit exposed by the groove unit, and electrically connects the bonding unit and the first pad unit.

Description

Technical Field [0001] The present invention relates to a lens driving device, a camera module including the lens driving device,

Embodiments relate to a lens driving apparatus, a camera module including the lens driving apparatus, and an optical apparatus.

It is difficult to apply the technology of a voice coil motor (VCM) used in a conventional camera module to a camera module for ultra small size and low power consumption, and related research has been actively conducted.

Demand and production of electronic products such as smart phones and mobile phones equipped with cameras are increasing. The camera for mobile phones is becoming more compact and smaller, and accordingly, the actuator is also becoming smaller, larger diameter, and multi-functional. In order to realize a high-resolution cellular phone camera, additional functions such as performance improvement of the cellular phone camera, autofocusing, shutter shake improvement, and zoom function are required.

Embodiments provide a lens driving apparatus, a camera module including the lens driving apparatus, and an optical apparatus that can prevent an electrical short between the solders and the supporting members, damage to the bonding portions of the coil substrate, and cracks of the solder.

A lens driving apparatus according to an embodiment of the present invention includes a housing; A bobbin accommodated inside the housing and for mounting the lens; A first coil disposed on an outer circumferential surface of the bobbin; Magnets disposed in the housing; A coil substrate disposed below the housing and including second coils spaced apart from each other and connecting portions connected to the second coils; A circuit board disposed below the coil substrate and including first pad portions disposed at positions corresponding to the connecting portions; And a conductive bonding member for bonding the first pad portion and the connecting portion corresponding to each other, wherein each of the connection portions is recessed from the outer side surface of the coil substrate and is provided with a groove portion for exposing a corresponding one of the first pad portions, And a bonding portion provided around the groove portion, wherein the conductive bonding member is disposed on an upper surface of the first pad portion exposed by the upper surface of the bonding portion and the groove portion, and the bonding portion and the first pad portion Connect electrically.

The conductive adhesive member may be spaced apart from the outer surface of the circuit board and may be located inside the outer surface of the circuit board with respect to the outer surface of the circuit board.

The bonding portion of the coil substrate may be arranged to align with a corresponding one of the first pad portions in a direction parallel to the optical axis.

The conductive adhesive member may protrude from the upper surface of the coil substrate in the direction of the coil substrate from the circuit board.

The lower surface of the conductive adhesive member may cover the upper surface of the first pad portion of the circuit board and the upper surface of the bonding portion of the coil substrate.

The upper surface of the conductive adhesive member may be positioned higher than the upper surface of the coil substrate.

The lens driving device includes upper elastic members coupled to an upper portion of the bobbin and an upper portion of the housing; A lower elastic member coupled to a lower portion of the bobbin and a lower portion of the housing; And the support members may include an upper terminal portion, a lower terminal portion, and an elastic deformation portion connecting the upper terminal portion and the lower terminal portion, Each of the upper terminal portions of the support members may be connected to a corresponding one of the upper elastic members.

The circuit board may further include at least one second pad portion spaced apart from the first pad portions and connected to at least one of the lower terminal portions of the support members.

Two first pad portions spaced apart from each other and two second pad portions spaced apart from each other may be disposed on at least one side of the upper surface of the circuit board, Can be located between the parts.

The coil substrate may further include wires or patterns connecting the second coils and the bonding portions of the connection portions.

The groove portion may be formed in a first region of at least one side of the upper surface of the coil substrate, and a second region, which is a region other than the first region, is formed on the upper surface of the coil substrate And the first region may have a recessed structure with respect to the second region.

The conductive adhesive member may be a solder or a conductive paste.

The coil substrate may include a conductive layer and an insulating layer disposed on the conductive layer, and the bonding portion may be a part of the conductive layer exposed from the insulating layer.

The first surface of the conductive adhesive member facing the outer surface of the circuit board may be planar.

The second surface of the conductive adhesive member may be curved, and the second surface may be a surface facing the first surface.

The circuit board may include a terminal surface that is bent from at least one side of the upper surface on which the first and second pad portions are disposed and on which a plurality of terminals are formed, And the second pad portions.

A camera module according to an embodiment includes a lens barrel; The above-described lens driving device for moving the lens barrel; And an image sensor for converting the image inputted through the lens driving device into an electrical signal.

An optical apparatus according to an embodiment includes a display module including a plurality of pixels whose colors change according to an electrical signal; A camera module that converts an image incident through a lens into an electrical signal; And a controller controlling the operation of the display module and the camera module.

Embodiments can prevent an electrical short between the solders and the support members, damage to the bonding portions of the coil substrate, and cracks of the solder.

1 is a schematic perspective view of a lens driving apparatus according to an embodiment.
2 is an exploded perspective view of the lens driving apparatus illustrated in Fig.
3 is a perspective view of the lens driving apparatus except for the cover member.
4 is a first perspective view of the bobbin, the first coil, the first position sensor, the first magnet, and the second magnet of Fig. 1;
Fig. 5 shows a top plan view of Fig. 4. Fig.
Figure 6 is a first perspective view of the housing of Figure 1;
Figure 7 is a second perspective view of the housing of Figure 1;
8 is an assembled perspective view of the bobbin, the first magnet, the housing, the lower elastic member, and the support member shown in Fig.
9 is a perspective view of the upper elastic member shown in Fig.
10 is a perspective view of the lower elastic member of Fig.
11 is a cross-sectional view taken along the line II 'shown in FIG.
12 shows an exploded perspective view of the second coil, the circuit board and the base.
13 shows an assembled perspective view of the second coil, circuit board and base of Fig.
14 shows an enlarged view of a rectangular dotted line portion shown in Fig.
15 shows a conductive adhesive member for bonding the first pad portions and the bonding portions shown in Fig.
16A shows bonding of a general circuit board and a coil substrate.
Fig. 16B is an enlarged view of the first bonding portion of Fig. 16A. Fig.
16C is an enlarged view of the second bonding portion of Fig. 16A. Fig.
17A shows bonding of a circuit board and a coil substrate according to an embodiment.
FIG. 17B is an enlarged view of the first bonding portion of FIG. 17A. FIG.
Fig. 17C is an enlarged view of the second bonding portion of Fig. 17A. Fig.
18 is an exploded perspective view of the camera module according to the embodiment.
19 is a perspective view of a portable terminal according to an embodiment.
Fig. 20 shows a configuration diagram of the portable terminal shown in Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on" or "under" a substrate, each layer It is to be understood that the terms " on "and " under" include both " directly "or" indirectly " do. In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings. The same reference numerals denote the same elements throughout the description of the drawings.

Hereinafter, a lens driving apparatus according to an embodiment will be described with reference to the accompanying drawings. For convenience of explanation, the lens driving apparatus according to the embodiment is described using the Cartesian coordinate system (x, y, z), but may be described using another coordinate system, and the embodiment is not limited to this. In the drawings, the x-axis and the y-axis indicate directions perpendicular to the z-axis, which is the optical axis direction, the z-axis direction as the optical axis direction is referred to as a first direction, the x-axis direction is referred to as a second direction, The axial direction can be referred to as a 'third direction'.

The "camera-shake correction device" applied to a small-sized camera module of a mobile device such as a smart phone or a tablet PC is to prevent the outline of the captured image from being formed due to the vibration caused by the hand- ≪ / RTI >

The "auto focusing device" is a device that automatically focuses an image of a subject on an image sensor surface. The camera shake correcting device and the auto focusing device may be configured in various manners. In the lens driving device according to the embodiment, the optical module composed of at least one lens is moved in a first direction parallel to the optical axis, It is possible to perform the camera shake correcting operation and / or the auto focusing operation by moving with respect to the surface formed by the second and third directions perpendicular to the optical axis.

Fig. 1 shows a schematic perspective view of the lens driving apparatus 100 according to the embodiment. Fig. 2 shows an exploded perspective view of the lens driving apparatus 100 shown in Fig. 1, 11 is a cross-sectional view taken along the line II 'shown in FIG. 3. FIG.

1 to 3 and 11, the lens driving apparatus 100 includes a bobbin 110, a first coil 120, a first magnet 130, a housing 140, an upper elastic member 150, a lower elastic member 160, a second coil 230, a circuit board 250, and conductive adhesive members 239a, 239b.

The lens driving apparatus 100 further includes a cover member 300, a first position sensor 170, a second magnet 180, a magnetic field compensating metal 182, a base 210, and a support member 220, And may further include a second position sensor 240.

First, the cover member 300 will be described.

The cover member 300 includes an upper elastic member 150, a bobbin 110, a first coil 120, a housing 140, a first magnet 130, The position sensor 170, the second magnet 180, the lower elastic member 160, the plurality of support members 220, the second coil 230, the second position sensor 240, and the circuit board 250 Accept.

The cover member 300 may be in the form of a box that is open at the bottom and includes an upper end and side walls and the lower portion of the cover member 300 may be engaged with the upper portion of the base 210. The shape of the upper end portion of the cover member 300 may be polygonal, for example, rectangular, octagonal, or the like.

The cover member 300 may have a hollow at its upper end to expose a lens (not shown) coupled to the bobbin 110 to external light. In addition, a window made of a light-transmitting material may be additionally provided in the hollow of the cover member 300 to prevent foreign substances such as dust and moisture from penetrating into the camera module.

The cover member 300 may be made of a nonmagnetic material such as SUS to prevent the first magnet 130 from adhering to the first magnet 130, but may be formed of a magnetic material to serve as a yoke.

Next, the bobbin 110 will be described.

The bobbin 110 is disposed inside the housing 140 and is movable in a first direction, e.g., a Z-axis direction, by electromagnetic interaction between the first coil 120 and the first magnet 130. [

The bobbin 110 may include a lens barrel (not shown) in which at least one lens is installed on the inner side of the bobbin 110, The lens barrel may be coupled to the inside of the bobbin 110 in various manners.

The bobbin 110 may have a hollow structure for mounting a lens or lens barrel. The hollow shape may be circular, elliptical, or polygonal, but is not limited thereto.

4 is a first perspective view of the bobbin 110, the first coil 120, the first position sensor 170, the first magnet 130, and the second magnet 180 of FIG. 1, 4 shows a top plan view of Fig.

4 and 5, the bobbin 110 may include a first stopper 111, and a winding protrusion 112. The first stopper 110 may protrude from the upper surface of the bobbin 110 in a first direction. For example, the first stopper 111 may protrude upward from the upper surface of the bobbin 110 by a first height h1. When the bobbin 110 moves in the first direction for the auto-focusing function, the first stopper 111 moves the upper surface of the bobbin 110 to the cover It is possible to prevent direct collision with the inner surface of the member 300.

The first stopper 111 protrudes upward with respect to the upper surface of the bobbin 110 and protrudes from the side surface of the bobbin 110 in a direction perpendicular to the optical axis OA. For example, the first stopper 111 may be disposed so as to be in contact with an edge where the upper surface and the side of the bobbin 110 are in contact with each other.

The first stopper 111 may be inserted into the first seating groove 146-1 provided in the housing 140. [ The first stopper 111 inserted into the first seating groove 146-1 of the housing 140 can move the bobbin 110 in the direction in which the bobbin 110 rotates about the optical axis OA It is possible to prevent rotation.

The winding projections 112 protrude from the upper outer peripheral surface of the bobbin 110, and the first coil 120 is wound. Although two winding projections 112a and 112b are shown in FIG. 4, the present invention is not limited thereto. Any one of the two lines of sight line and vertical line corresponding to both ends of the first coil 120 may be wound on each of the two winding projections.

For example, the winding protrusion 112 may protrude from the side surface of the bobbin 110 in a direction perpendicular to the optical axis OA, may be seated in the second seating groove 146-2 provided in the housing 140, 2 seating groove 146-2.

The upper surface of the bobbin 110 may be provided with an upper support protrusion 113 which is engaged with the through hole 151a of the upper elastic member 150. The lower surface of the bobbin 110 may be provided with a through hole (Not shown) to be coupled with the lower protrusion 161a.

A first coil receiving groove on which the first coil 120 is disposed or seated may be provided on an outer circumferential surface of the bobbin 110. [ For example, the first coil receiving groove of the bobbin 110 may be provided at the lower end of the outer peripheral surface of the bobbin 110.

In addition, a second magnet seating groove on which the second magnet 180 is disposed or seated may be provided at the upper end of the outer circumferential surface of the bobbin 110. Further, a compensation metal receiving groove may be provided at an upper end of the outer circumferential surface of the bobbin 110 to arrange or place a metal for magnetic field compensation.

Next, the first coil 120 will be described.

The first coil 120 is disposed on the outer peripheral surface of the bobbin 110.

For example, the first coil 120 may be wound on the outer peripheral surface of the bobbin 110 so as to rotate clockwise or counterclockwise with respect to the optical axis OA.

For example, the first coil 120 may be directly wound on the outer peripheral surface of the bobbin 110, and may be ring-shaped, but is not limited thereto. In another embodiment, the first coil wound on the outer circumferential surface of the bobbin may be a ring-shaped or angular-shaped coil block rotating in a direction perpendicular to the optical axis. The line of sight and the vertical line of the first coil 120 can be wound around the winding protrusion 112 and fixed.

For example, the first coil 120 may be disposed below the outer circumferential surface of the bobbin 110.

The bobbin 110 can be moved by the electromagnetic force generated by the interaction between the first magnet 130 and the first coil 120 when the first coil 120 is supplied with a driving signal, The movement of the bobbin 110 in the optical axis direction can be controlled so that the lens mounted on the bobbin 110 is in focus.

The first coil 120 may be arranged to be opposed to or opposed to the first magnet 130 in a direction perpendicular to the optical axis.

Next, the housing 140 will be described.

The housing 140 houses the bobbin 110 inside and supports the first magnet 130.

FIG. 6 is a first perspective view of the housing 140 of FIG. 1, and FIG. 7 is a second perspective view of the housing 140 of FIG.

6 and 7, the housing 140 may be in the form of a hollow column as a whole. For example, the housing 140 may have a polygonal (e.g., rectangular or octagonal) or circular hollow.

The housing 140 may have a polygonal planar shape, for example, an octagonal planar shape, but is not limited thereto.

The housing 140 may include a plurality of sides.

For example, the housing 140 may include first side portions 141 and second side portions 142. A first magnet 130 may be disposed or installed on the first side portions 141 and an elastic supporting member 220 may be disposed on the second side portions 142. [ Each of the second side portions 142 can interconnect the two adjacent first side portions 141.

The housing 140 may include a first seating portion 141a on which the first magnet 130 is disposed and a second seating portion 172 on which the first position sensor 170 is disposed.

The first seating portion 141a may be formed on the inner side of the second side portions 142 and may be formed as a groove or a mounting hole corresponding to the size of the first magnet 130. [ For example, in order to facilitate insertion of the first magnet 130, an opening may be formed in the bottom surface of the first seating portion 141a facing the second coil 230.

An escape groove 142a in which an elastic supporting member 220 having a predetermined depth is disposed may be provided on an outer side surface of the first side portion 142 of the housing 140. [

In addition, the housing 140 may have a second stopper 143 protruding from the upper surface to prevent collision with the cover member 300.

For example, the housing 140 may include four second stoppers 143 that are spaced apart from each other, and the second stoppers 143 may correspond to or align with the first stoppers 111 of the bobbin 110 .

The first stopper 143 of the housing 140 may be provided with a first groove 146-1 through which the first stopper 111 can be inserted or seated. The second stopper 143 of the housing 140 may serve to guide the installation position of the upper elastic member 150.

The housing 140 may have guide grooves 149a and 149b and 149c and 149d formed on both upper surfaces of the guide protrusions 148a and 148b and the guide protrusions 148a and 148b protruding from the upper surface. have.

The guide protrusions 148a and 148b may be disposed between one ends or between the other ends of the upper elastic members 150a and 150b and may separate the upper elastic members 150a and 150b from each other, for example.

The lens driving apparatus 100 is disposed between each of the upper elastic members 150a and 150b and the first and second guide projections 148 of the housing 140 in order to absorb and cushion the vibration of the bobbin 110 Damping members DA1 to DA4 may be further provided.

Each of the guide grooves 149a to 149d may be structured to be depressed from the upper surface of the housing 140 and open to the inside and outside of the housing 140. [

One ends and the other ends of the upper elastic members (e.g., 150a and 150b) may be disposed in corresponding ones of the guide grooves 149a to 149d. One ends and the other ends of the upper elastic members (e.g., 150a and 150b) may be spaced apart from the guide grooves 149a to 149d of the housing 140, but the present invention is not limited thereto.

The damping members DA1 to DA4 may be disposed between the side surfaces of the guide protrusion 148 and the damping contacts 151-1 to 151-4 of the upper elastic members 150a and 150b.

Since the damping members DA1 to DA4 are disposed between the side surface of the guide projection 148 and the damping contact portions 150-1 to 150-4 parallel to the moving direction of the bobbin 110, Absorption of vibrations to the vibrating body, and buffering action.

The housing 140 may have a second seating portion 172 provided on an outer surface of one of the first side portions 141 and the second seating portion 172 may have a groove shape.

The second seating portion 172 of the housing 140 at the initial position of the bobbin 110 may be aligned or overlapped with the second magnet seating groove of the bobbin 110 in a direction perpendicular to the optical axis. The initial position is the initial position of the AF moving part in the state where no power is applied to the first coil 120 or the position where the AF moving part is placed as the upper and lower elastic members 150 and 160 are elastically deformed only by the weight of the AF moving part Lt; / RTI > The AF moving part may include configurations mounted on the bobbin 110 and the bobbin 110.

An upper frame supporting protrusion 144 coupled to the through hole 152a of the upper elastic member 150 may be provided on the upper surface of the housing 140. A lower frame supporting protrusion 144 may be formed on the lower surface of the housing 140, And a lower frame support protrusion 145 coupled to the through hole 162a may be provided.

Next, the first position sensor 170 will be described.

The first position sensor 170 is disposed at any one of the first sides 141 of the housing 140. For example, the first position sensor 170 may be disposed within the second seating portion 172 of the housing 140.

The first position sensor 170 can sense the displacement of the bobbin 110 according to the result of sensing the intensity of the magnetic field of the second magnet 180 mounted on the bobbin 110. An AF (Auto Focus) feedback control for the lens driving device can be performed by a control part included in the camera module using the displacement of the bobbin 110 sensed by the first position sensor 170. [

The first position sensor 170 may be a hall sensor, but not limited thereto, and any sensor capable of detecting a magnetic force change can be used.

Next, the first magnet 130 will be described.

The first magnet 130 is disposed in the housing 140. For example, the first magnet 130 may be disposed on the second sides 142 of the housing 140.

For example, the first magnets 130-1 to 130-4 may be disposed or installed in the first seating portion 141a of the housing 140. [ The shape of the first magnet 130 may correspond to the corner portion, and may be substantially trapezoidal, but is not limited thereto.

In other embodiments, the first magnets 130-1 through 130-4 may be disposed on the first sides of the housing 140, and the shape of each of the first magnets 130-1 through 130-4 For example, a rectangular parallelepiped.

Each of the first magnets 130-1 to 130-4 may be formed as one body, and the first magnet 120-1 and the first magnet 120-2 may be arranged such that the N-pole faces the first coil 120 and the S-pole is the outer face. However, the present invention is not limited to this, and it is also possible to configure the other way around.

At least two first magnets 130 may be provided, and four magnets 130 may be provided according to the embodiment.

Next, the second magnet 180 will be described.

The second magnet 180 is disposed on the outer peripheral surface of the bobbin 110.

The second magnet 180 is disposed between adjacent two first magnets 130-1 and 130-4 of the plurality of first magnets 130-1 to 130-4 in a direction perpendicular to the optical axis Aligned. This is to minimize the interference of the magnetic field between the first magnets 130-1 to 130-4 and the second magnet 180. [

The second magnet 180 may be disposed above the first coil 120 so as to be spaced apart from the first coil 120, but the embodiment is not limited thereto.

The magnetic field compensating metal 182 is disposed on the outer circumferential surface of the bobbin 110. For example, the magnetic field compensating metal 182 may be disposed to face the second magnet 180 in a direction perpendicular to the optical axis.

For example, the magnetic field compensating metal 182 and the second magnet 180 may be disposed on the outer circumferential surface of the bobbin 110 so as to pass through the center of the bobbin 110 and align with an imaginary straight line HL perpendicular to the optical axis.

The interaction between the first magnet 130 and the first coil 120 may be interfered or interrupted by the magnetic field of the second magnet 180. The magnetic field compensating metal 182 may serve to reduce the interference of the interaction between the first magnet 130 and the first coil 120 due to the magnetic field of the second magnet 180.

For example, the material of the magnetic field compensating metal 182 may be a metal, but is not limited thereto, and may be made of a magnetic material, for example, a magnetic material or a magnet.

The lens driving apparatus 100 may not include the first position sensor 170, the second magnet 180, and the magnetic field compensating metal 182 in another embodiment.

Each of the first magnets 130-1 to 130-4 in the initial position of the bobbin 110 may be aligned with the first coil 120 in the direction perpendicular to the optical axis or may overlap with the first coil 120 .

In the initial position of the bobbin 110, the first position sensor 170 and the second magnet 180 may overlap each other in a direction perpendicular to the optical axis.

Next, the upper elastic member 150 and the lower elastic member 160 will be described.

The upper elastic member 150 is engaged with the upper (or upper surface or upper) of the bobbin 110 and the upper (or upper surface, or upper) of the housing 140. The lower elastic member 160 is engaged with the lower (or lower or lower) end of the bobbin 110 and the lower (or lower surface, or lower end) of the housing 140.

Fig. 9 shows a perspective view of the upper elastic member 150 shown in Fig.

9, the upper elastic members 150 may include a plurality of upper elastic members 150a and 150b (e.g., 150a and 150b) that are separated from each other and electrically separated from each other.

Each of the plurality of upper elastic members 150a and 150b includes a first inner frame 151 coupled with a top portion of the bobbin 110 (e.g., the upper support protrusion 113), a top portion of the housing 140 A first outer frame 152 coupled to the first outer frame 152 and the first outer frame 152, and a first connection 153 connecting the first inner frame and the first outer frame 152.

At least one of the plurality of upper elastic members 150a and 150b may further include damping contacts 150-1 to 150-4 provided at one end of the first inner frame 151. [ The damping contact portions 150-1 to 150-4 may protrude upward from the upper surface of the first inner frame 151, for example, in the direction from the lower elastic member 160 to the upper elastic member 150.

For example, the damping contact portions 150-1 to 150-4 may be a portion where one end of the first inner frame 151 is bent upward.

At least one of the plurality of upper elastic members 150a and 150b may further include support member contacts 150a-1 and 150b-1 projecting from the first outer frame.

For example, the support member contacting portions 150a-1 and 150b-1 may protrude upwardly, for example, from the lower elastic member 160 toward the upper elastic member 150.

Fig. 10 shows a perspective view of the lower elastic member 160 of Fig.

10, the lower elastic members 160 may include a plurality of lower elastic members (e.g., 160a and 160b) that are spaced apart from each other and are electrically separated from each other.

Each of the plurality of lower elastic members 160a and 160b includes a second inner frame 161 coupled to a lower portion of the bobbin 110 (e.g., a lower support projection), a lower portion of the housing 140 And a second connection portion 163 connecting the second inner frame 161 and the second outer frame 162. The second connection portion 163 is connected to the second outer frame 162. The second connection portion 163 connects the second inner frame 161 and the second outer frame 162. [

Each of the first and second connection portions 153 and 163 may be bent at least once to form a pattern having a predetermined shape. The bobbin 110 can be elastically supported in the first direction and / or in the first direction parallel to the optical axis by the positional change and the fine deformation of the first and second connection portions 153 and 163.

At least one of the plurality of lower elastic members 160a and 160b may include sensor contact portions 160a-1, 160a-2, 160b-1, and 160b-2 provided in the second outer frame 162. Each of the sensor contact portions 160a-1, 160a-2, 160b-1, and 160b-2 may have a structure protruding upward from the second outer frame 162.

For example, a damper may be disposed between the first connection part 153 of the upper elastic members 150a and 150b and the upper surface of the bobbin 110 to prevent oscillation during movement of the bobbin 110. [ A damper (not shown) may be disposed between the second connection portion 163 of the lower elastic members 160a and 160b and the lower surface of the bobbin 110. [

Or the coupling portion of the bobbin 110 and the housing 140 with the upper elastic member 150 or the coupling portion of each of the bobbin 110 and the housing 140 with the lower elastic member 160 may be applied . For example, the damper may be gel-like silicon.

Next, the support member 220 will be described.

8 is an assembled perspective view of the bobbin 110, the first magnet 130, the housing 140, the lower elastic member 160, and the support member 220 shown in FIG.

Referring to FIG. 8, a support member 220 is disposed on the first side portions 141 of the housing 140. The number of the support members 220 may be plural.

At least one support member may be disposed on each of the first sides 141 of the housing 140. For example, two support members that are electrically separated from each other may be disposed on each of the first sides 141 of the housing 140, but are not limited thereto.

For example, the first to fourth support members 220-1 to 220-4 may be disposed on a corresponding one of the first side portions 141 of the housing 140, and the housing 140 and the bobbin 110 may be spaced apart from the base 210.

Each of the first to fourth support members 220-1 to 220-4 includes two elastic support members 220a-1 and 220b-1, 220a-2 and 220b-2, 220a-3 and 220b -3, 220a-4 and 220b-4).

For example, the two elastic support members disposed on either side of the housing 140 illustrated in Fig. 8 may have a shape symmetrical to each other in a direction perpendicular to the optical axis (e.g., in the x- or y-axis direction).

Each of the elastic supporters 220a-1 to 220a-4 and 220b-1 to 220b-4 may include an upper terminal portion 221, an elastic deformable portion 223 and a lower terminal portion 224. [

The upper terminal portion 221 may be engaged with an upper end portion of the first side portions 141 of the housing 140, for example, an engaging projection 147. For example, the upper terminal portion 221 may have a groove portion that engages with the engaging projection 147 of the housing 140.

The upper terminal portions 221 of the two elastic support members 220a-1 and 220b-1 selected from the elastic support members 220a-1 to 220a-4, 220b-1 to 220b- May be electrically connected to the support member contacts 150a-1 and 150b-1 of the upper elastic members 150a and 150b (CP1 and CP2, see FIG. 3).

For example, both ends of the first coil 120 may be electrically connected to the upper elastic members 150a and 150b, and elastically supporting members (not shown) that are in electrical contact with the support member contacts 150a-1 and 150b- 220a-1, and 220b-1 may serve to provide a driving signal to the first coil 120.

The elastic deforming portion 223 may extend from the upper terminal portion 221 in a direction parallel to the optical axis and may be bent at least once, and may have a certain pattern.

The lower terminal portion 224 may extend from the elastically deformable portion 223 and may be engaged with the base 210. One end of the lower terminal portion 224 may be inserted into or inserted into a support member seating groove 214 provided in the base 210 and fixedly coupled by an adhesive such as epoxy.

A damper may be disposed between each of the elastic supporting members 220a-1 to 220a-4, 220b-1 to 220b-4 and the housing 141. For example, a damper may be disposed between the elastic deforming portion 223 and the first side portions 141 of the housing 140.

Also, one end 224b of each of the lower terminal portions 224 of at least one of the support members 220a-1 to 220a-4, 220b-1 to 220b-4 is electrically connected to the circuit board 250 may be bonded to any one of the first and second pad portions 15-1 to 15-8, 252-1 to 252-8 of the first and second pad portions 250a, 250b.

The upper end portions of the two elastic support members 220a-2 and 220b-2 selected from the elastic support members 220a-1 to 220a-4 and 220b-1 to 220b- 221 may be electrically connected to the first and second pins of the first position sensor 170 (CP3, CP4, see FIG. 3). The lower terminal portions 221 of the two selected elastic supporting members 220a-2 and 220b-2 are electrically connected to any one of the second pad portions 15-1 to 15-8 of the circuit board 250 (CP7, CP8, see Fig. 3).

The sensor contacts 160a-1 and 160b-1 provided at one end of the second outer frame 162 of each of the lower elastic members 160a and 160b are connected to the third and fourth pins 170a and 170b of the first position sensor 170, (CP5, CP6).

The sensor contact portions 160a-2 and 160b-2 provided at the other ends of the second outer frame 162 of the lower elastic members 160a and 160b are connected to the elastic supporting members 220a-1 to 220a-4 and 220b (CP9, CP10, see FIG. 8) of the two elastic supporting members 220a-3 and 220b-3 selected from among the elastic supporting members 220a-1 to 220b-4.

As described above, for example, the first coil 120 can be electrically connected to any one of the second pad portions 15-1 to 15-8 of the circuit board 250 by the elastic supporting members 220-1a and 220-1b, And can be electrically connected to two of them. The first position sensor 170 is connected to the second pad 170 of the circuit board 250 by the elastic supporting members 220a-2, 220b-2, 220a-3 and 220b-3 and the lower elastic members 160a and 160b. And may be electrically connected to any four of the units 15-1 to 15-8. However, the present invention is not limited thereto. In another embodiment, the first coil (150a, 150b), the lower elastic members (160a, 160b), and the support members 120 and the first position sensor 170 and the circuit board 250 may be implemented in various forms.

8, the support members 220a-1 to 220a-4, 220b-1 to 220b-4 are in the form of leaf springs disposed on the first side 141 of the housing 140, It is not. In other embodiments, the support members may be disposed on the second sides 142 of the housing 140 and may be implemented as coil springs, suspension wires, and the like. Further, in another embodiment, the support member 220 may be formed integrally with the upper elastic member 150.

Next, the second coil 230, the circuit board 250, the base 210, and the second position sensor 240 will be described.

12 shows an exploded perspective view of the second coil 230, the circuit board 250 and the base 210, and Fig. 13 shows the second coil 230, the circuit board 250, and the base 210 of Fig. FIG.

12 and 13, the base 210 may have a hollow corresponding to the hollow of the bobbin 110 and / or the hollow of the housing 140, and may correspond to or correspond to the cover member 300 For example, a rectangular shape.

The base 210 may have a step 211 on which the adhesive can be applied when the cover member 300 is adhered and fixed. At this time, the step 211 can guide the cover member 300 when the cover member 300 is engaged with the cover member 300, and the lower end of the cover member 300 can be in surface contact with the step 211 of the base 210.

A support member receiving groove 214 may be formed at an edge of the upper surface of the base 210 to receive the support member 220 therein.

The end of the support member 220 may be inserted or placed in the support member seat groove 214 in the support member seat groove 214 and the support member 220 may be fixed to the support member seat groove 214 through an adhesive or the like .

The support member seating groove 214 may be provided on each of the sides of the upper surface of the base 210 corresponding or aligned with the first side 141 of the housing 140 on which the support member 220 is installed have.

In addition, a seating groove 215 in which the second position sensor 240 is disposed may be provided on the upper surface of the base 210.

For example, two seating recesses 215-1 and 215-2 may be provided on the upper surface of the base 210, and each of the second position sensors 240a and 240b may be provided on the seating recesses 215-1 and 215-2 of the base 210. [ May be disposed in any one of corresponding ones of the first and second memory units 215-1 and 215-2. For example, imaginary lines connecting the centers of the seating recesses 215-1, 215-2 of the base 210 and the center of the base 210 may intersect each other. For example, the angle formed by the imaginary lines may be 90 degrees, but the present invention is not limited thereto.

For example, each of the seating grooves 215-1 and 215-2 of the base 210 may be formed to correspond to one of the corresponding one of the second coils 230-1 to 230-4 (230-3 or 230-2) And may be arranged so as to be aligned in a direction parallel to the optical axis in the vicinity of the center or the center. For example, the center of each of the second position sensors 240a and 240b disposed in the seating recesses 215-1 and 215-2 is centered on the corresponding second coils 230-3 and 230-2, They can be aligned or overlapped in a vertical direction.

The second position sensor 240 may be disposed in the seating recesses 215-1, 215-2 of the base 210. [ The second position sensor 240 can sense the intensity of the magnetic field of the first magnet 130 disposed in the housing 140.

The second position sensor 240 may be implemented as a driver including a Hall sensor or may be implemented as a position detection sensor alone such as a hall sensor or the like.

The second position sensor 240 can sense the displacement of the housing 140 relative to the base 210 in the X-axis direction and / or the Y-axis direction perpendicular to the optical axis OA.

The second position sensor 240 includes an OIS position sensor 240a for sensing the displacement of the housing 140 in the X axis direction and an OIS position sensor 240 for sensing the displacement of the housing 140 in the X axis direction 240b.

The circuit board 250 is disposed on the upper surface of the base 210 and may have a hollow corresponding to the hollow of the bobbin 110, the hollow of the housing 140, and / or the hollow of the base 210 .

The shape of the outer circumferential surface of the circuit board 250 may be a shape that matches or corresponds to the upper surface of the base 210, for example, a rectangular shape.

The second coil 230 may be disposed on the upper side of the circuit board 250 and the second position sensor 240 may be disposed on the lower side.

The circuit board 250 may be electrically connected to the second position sensors 240a and 240b located below and the circuit board 250 may provide a driving signal to each of the second position sensors 240a and 240b And the outputs of each of the second position sensors 240a and 240b may be output to the circuit board 250. [

The circuit board 250 may have at least one terminal surface 253 bent from the top surface and formed with a plurality of terminals 251 to receive electrical signals from the outside.

The first and second coils 120 and 230, the first and second position sensors 170 and 170, and the first and second position sensors 170 and 170 are electrically connected to each other by receiving external power through a plurality of terminals 251 provided on the terminal surface 253 of the circuit board 250, And 240 and may output the output signals output from the first and second position sensors 170 and 240 to the outside.

According to the embodiment, the circuit board 250 may be formed of FPCB, but it is not limited thereto. The terminals 251 of the circuit board 250 may be directly connected to the surface of the base 210, .

The circuit board 250 includes first pad portions 251-1 to 251-8 and support members 220-1 to 220-4 electrically connected to the second coils 230-1 to 230-4, And second pad portions 15-1 to 15-8 that are electrically connected to the second pad portions 15-1 to 15-8.

For example, at least one side of the upper surface of the circuit board 250 may have two first pad portions (e.g., 252-1 and 252-2) spaced from each other, and two second pad portions (e.g., 15 -1 and 15-2 may be disposed and two second pad portions (e.g., 15-1 and 15-2) may be disposed between two first pad portions (e.g., 252-1 and 252-2) Can be located.

The terminals 251 of the circuit board 250 may be electrically connected to the first pad portions 251-1 through 251-8 and the second pad portions 15-1 through 15-8.

The second coil 230 may be disposed on the circuit board 250.

The second coil 230 may be formed on the coil substrate 231 provided separately from the circuit board 250. For example, the second coil 230 may be in the form of a fine pattern (FP) coil.

An adhesive member may be disposed between the coil substrate 231 and the circuit board 250. The coil substrate 231 is fixed to the circuit board 250 by an adhesive member and conductive adhesive members 239a and 239b to be described later .

The coil substrate 231 includes a plurality of second coils 230-1 to 230-4 corresponding to the first magnets 130-1 to 130-4 and a plurality of second coils 230-1 to 230-4, 4 and the connection portions 236-1 to 236-8 connected to the other end.

For example, the second coils 230-1 to 230-4 are arranged on the upper side of the coil substrate 231 so as to be aligned or aligned with the first magnets 130-1 to 130-4 in a direction parallel to the optical axis OA. But it is not limited thereto. In other embodiments, the second coils may be disposed on the sides of the upper surface of the coil substrate 231.

Each of the second coils 230-1 to 230-4 may be in the form of a ring-shaped coil block.

According to the embodiment, as illustrated in FIGS. 12 and 13, the four second coils 230-1 to 1230-4 may be disposed at the corners of the circuit board 250, but are not limited thereto .

In another embodiment, the coil substrate 231 may be provided with one second coil for the second direction (e.g., the X axis direction) and one coil for the third direction (e.g., the Y axis direction) have. In another embodiment, more than four second coils may be provided on the coil substrate 231. [

Electromagnetic force can be generated by the interaction between the first magnets 130-1 to 130-4 arranged to face each other and the second coils 230-1 to 230-4 provided with driving signals, The camera shake correction can be performed by moving the housing 140 in the second and / or third directions.

One end of each of the second coils 230-1 to 230-4 is bonded to a corresponding one of the first pad portions 252-1 to 252-8 of the circuit board 250 and the second coils 230-1 to 230-4 are respectively bonded to corresponding ones of the first pad portions 252-1 to 252-8 of the circuit board 250. [

At least one connection portion 236-1 to 236-8 may be located between two adjacent second coils provided on the coil substrate 231. [

For example, as shown in Fig. 12, the second coils 230-1 to 230-4 may be arranged at the corners of the upper surface of the coil substrate 231, and the sides of the upper surface of the coil substrate 231 And two connection portions 236-1 to 236-8 may be disposed at a distance from each other.

In order to bond the connection portions 236-1 to 236-8 of the coil substrate 131 and the first pad portions 252-1 to 252-8 to each other, the connection portions 236-1 to 236-8 of the coil substrate 131, 236-8 may be aligned with the first pad portions 252-1 through 252-8 of the circuit board 250 in a direction parallel to the optical axis.

The connection portions 236-1 to 236-8 of the coil substrate 131 each have groove portions 235-1 to 235-8 that are recessed from the outer surface of the coil substrate 231 and groove portions 235-1 to 235- 8, and bonding portions 236-1 to 236-8 provided around the bonding portions 236-1 to 236-8.

For example, the bonding portions 236-1 to 236-8 may be provided on the upper surface of the coil substrate 231 adjacent to the groove portions 235-1 to 235-8.

The groove portions 235-1 to 235-8 may be provided on at least one side of the upper surface of the coil substrate 231. [ For example, at least one groove may be formed on each side of the upper surface of the coil substrate 231. For example, two grooves may be provided on the respective sides of the upper surface of the coil substrate 231.

For example, the groove portions 235-1 to 235-8 may be provided in the first region S1 (see Fig. 12) of at least one side of the coil substrate 231. [ The first region S1 may be a recessed structure with respect to the second region S2. The second area S2 may be the remaining area of at least one side of the upper surface of the coil substrate 231 except for the first area S1.

In other embodiments, the first region may not be recessed, and the first region and the second region of the coil substrate 231 may be located on the same plane.

Each of the bonding portions 236-1 through 236-8 of the coil substrate 131 is electrically connected to the second coils 230-i through the wirings or patterns (indicated by dotted lines in Figs. 12 and 13) 1 to 230-8. However, the present invention is not limited thereto. 12, connections between one ends and the other ends of the second coils 230-1 to 230-8 and the bonding portions 236-1 to 236-8 of the coil substrate 131 can be variously implemented .

The coil substrate 131 may include a conductive layer (e.g., a copper foil) and an insulating layer disposed on the conductive layer. By patterning the conductive layer, the second coils 230-1 to 230-4 And the bonding portions 236-1 to 236-8 are formed by removing portions of the insulating layer around the groove portions 235-1 to 235-8 of the coil substrate 131 to expose one region of the conductive layer .

For example, two bonding portions may be spaced apart from each other on each side of the upper surface of the coil substrate 231.

14 shows an enlarged view of a rectangular dotted line portion shown in Fig.

14, the bonding portions 236-1 to 236-8 of the coil substrate 231 are connected to the first pad portions 252-1 to 252-2 of the circuit board 250 in a direction parallel to the optical axis OA, -8. ≪ / RTI >

Each of the groove portions 235-1 to 235-8 of the coil substrate 213 may expose any one of the first pad portions 252-1 to 252-8 of the circuit board 250. For example, the grooves 235-1 through 235-8 may expose the upper surfaces of the corresponding first pad portions 252-1 through 252-8.

The shape of each of the groove portions 235-1 to 235-8 of the coil substrate 231 may be semicircular, semi-elliptical, or polygonal, but is not limited thereto. The first pad portions 252-1 to 252- 8 may be exposed.

Each of the bonding portions 236-1 to 236-8 may be provided in one region of the upper surface of the coil substrate 231 within a certain distance from the groove portions 235-1 to 235-8. For example, each of the bonding portions 236-1 to 236-8 may be in the shape of a band of semicircular, semi-elliptic, or polygonal shape.

The circuit patterns and the wiring patterns formed on the coil substrate 231 are simple as compared with the circuit patterns and wiring patterns formed on the circuit substrate 250. [

That is, in the region of the coil substrate 231 located between the regions where the second coils 230-1 to 230-4 are formed, there is no circuit pattern or wiring pattern or is simple. This can alleviate the spatial constraint for forming the groove portions 235-1 to 235-8 from the outer side surface 12b of the coil substrate 231 to the inner side surfaces 12a. The design of the distance L1 between the central portion of the groove portions 235-1 to 235-8 and the inner surface 12a of the coil substrate 231 can be freely designed.

Since the first pad portions 252-1 to 252-8 are free from the design of the distance L1 between the central portion of the groove portions 235-1 to 235-8 and the inner side face 12a of the coil substrate 231, The groove portions 235-1 to 235-8 can be disposed close to the inner side surface 12a of the coil substrate 231 in consideration of the forming range of the bonding portion necessary for electrical contact and bonding.

Since the groove portions 235-1 to 235-8 can be disposed close to the inner side face 12a of the coil substrate 231, the bonding portions 252-1 to 252-8 Can be increased.

The conductive adhesive members 239a and 239b bond the first pad portions 252-1 to 252-8 of the circuit board 250 and the bonding portions 252-1 to 252-8 of the coil substrate 231 to each other .

Fig. 15 shows conductive adhesive members 239a and 239b bonding the first pad portions 252-1 to 252-8 and the bonding portions 252-1 to 252-8 shown in Fig.

15, the conductive adhesive members 239a and 239b are electrically connected to the upper surfaces of the first pad portions (e.g., 252-1 and 252-2) of the circuit board 250 and the bonding surfaces of the bonding portions of the coil substrate 231 252-1 to 252-8 and may be disposed on the upper surface of the first pad portion (e.g., 252-1, 252-2) and the upper surface of the bonding portion 252-1 to 252-8 And they can be electrically connected to each other.

The conductive bonding members 239a and 239b bonded to the bonding portions 252-1 to 252-8 of the coil substrate 231 may have a structure protruding from the upper surface of the coil substrate 231. [

The lower surfaces of the conductive adhesive members 239a and 239b are connected to the upper surfaces of the first pad portions 252-1 and 252-2 of the circuit board 250 and the bonding portions 252-1 and 252-2 of the coil substrate 231, 1 to 252-8).

The upper surfaces of the conductive adhesive members 239a and 239b may protrude upward from the upper surface of the coil substrate 231 so as to be positioned higher than the upper surface of the coil substrate 231. [

For example, each of the conductive adhesive members 239a and 239b may be electrically connected to one of the first pad portions (e.g., 252-1 and 252-2) of the circuit board 250 exposed by the groove portions 235-1 to 235-8 (E.g., 252-1, 252-2) and a corresponding one of the corresponding one of the coil substrate 231 and the bonding portions 252-1 to 252-8 of the coil substrate 231, And can be in contact with the bonding portions 252-1 to 252-8.

The conductive adhesive members 239a and 239b may be, but are not limited to, a conductive adhesive material, for example, a solder or a conductive paste.

Conductive adhesive members 239a and 239b may be spaced apart from the outer sides or edges p1 and p2 of the circuit board 250 adjacent to the first pad portions 252-1 to 252-8.

For example, the conductive adhesive members 239a and 239b are electrically connected to the circuit board 250 (refer to FIG. 2), with reference to the outer sides or edges p1 and p2 of the circuit board 250 adjacent to the first pad portions 252-1 to 252-8, , Or inside the edges p1 and p2.

Also, for example, the first one side of the conductive adhesive members 239a, 239b facing the outer side or edges p1, p2 of the circuit board 250 may be linear or planar, and the second side of the conductive adhesive member The surface may be curved or curved. Here, the second surface of the conductive adhesive members 239a and 239b may be a surface facing the first surface.

The conductive adhesive members 239a and 239b do not protrude beyond the edges p1 and p2 of the circuit board 250 adjacent to the first pad portions 252-1 to 252-8. As a result, electrical contact between the conductive adhesive members 239a and 239b and the support members 220-1 to 220-4 can be prevented.

Fig. 16A shows bonding of a general circuit board 18-1 and the coil substrate 18-2, Fig. 16B is an enlarged view of the first bonding portion 19-1 of Fig. 16A, Fig. 16C is a cross- And an enlarged view of the second bonding portion 19-2.

Referring to FIG. 16A, a pad is provided on the lower surface of the coil substrate 18-2, and a bonding portion for bonding to the pad of the coil substrate 18-2 is provided on the upper surface of the circuit substrate 18-1.

The coil substrate 18-2 is disposed so that the lower surface of the coil substrate 18-2 faces upward and the bonding portion provided on the upper surface of the circuit substrate 18-1 is bonded to the pad provided on the lower surface of the coil substrate 18-2 The circuit board 18-1 is arranged on the coil substrate 18-2 so as to be aligned.

The bonding portions of the circuit board 18-1 and the pads of the coil substrate 18-2 are fixed by the solders 21a and 21b while the circuit board 18-1 is disposed on the coil substrate 18-2. Respectively.

The bonding structure of the circuit board 18-1 and the pad of the coil substrate 18-2 are bonded to the base so that the lower surface of the circuit board 18-1 faces the upper surface of the base.

16B, the first solder 21a located on one side of the upper surface of the circuit board 18-1 parallel to the X axis is positioned on the optical axis X1 from the edge X1 of the circuit board 18-1, (E.g., the Y-axis direction).

16C, the second solder 21b located on one side of the upper surface of the circuit board 18-1 parallel to the Y-axis extends from the edge Y1 of the circuit board 18-1 (For example, the X-axis direction) perpendicular to the optical axis.

Since the first and second solders 21a and 21b protrude from the lower surface of the circuit board 18-1 toward the base, in order to stably mount the circuit board 18-1 on the base, A groove corresponding to the first and second solders 21a and 21b must be provided separately.

In addition, since the circuit board 18-1 is provided with additional circuit patterns, the bonding portion of the circuit board 18-1 is not freely designed and the size of the bonding portion is restricted. 2 bonding force between the solders 21a and 21b and the bonding portion is weak so that the bonding portion may be damaged by the impact and cracks may be generated in the first and second solders 21a and 21b, have.

17A shows the bonding of the circuit board 250 and the coil substrate 231 according to the embodiment, Fig. 17B is an enlarged view of the first bonding portion 19-3 of Fig. 17A, Fig. 2 bonding section 19-4.

17A, bonding portions (not shown) are provided on the upper surface of the coil substrate 231 and first pad portions 252 for bonding the bonding portions of the coil substrate 231 to the upper surface of the circuit substrate 250 -1 to 252-8).

The circuit board 250 is coupled to the upper surface of the base 210. Then, the coil substrate 231 is disposed on the circuit board 250 such that the bonding portions are aligned with the first pad portions 252-1 to 252-8 of the circuit board 250.

The first pad portions 252-1 to 252-8 of the circuit board 250 are bonded to the bonding portions of the coil substrate 231 by solders 239a to 239c. Since the coil substrate 231 is bonded to the circuit board after the circuit board 250 is coupled to the base 210, the circuit substrate 250 and the coil substrate 231 may not be deformed.

The solders 239a to 239c may have a structure protruding upward from the upper surface of the circuit board 250 and the upper surface of the coil substrate 231. [ Thus, the embodiment does not require separate grooves corresponding to the solders 239a through 239c in the base 210 to seat the circuit board 250 on the base 210. [

17B, the solder 239a located on one side of the upper surface of the circuit board 250 parallel to the X axis is positioned in a direction perpendicular to the optical axis from the edge X2 of the circuit board 250 , Y-axis direction).

17C, the solder 239c located on one side of the upper surface of the circuit board 250 parallel to the Y axis is positioned in a direction (Y2) perpendicular to the optical axis from the edge Y2 of the circuit board 250 For example, the X-axis direction). Thus, the embodiment can prevent an electrical short between the solders 239a and 239b and the support members 220-1 to 220-4.

Since the bonding portions 236-1 to 236-8 are provided on the coil substrate 231 having a simple circuit pattern or wiring pattern as compared with the circuit board 250, the size of the bonding portions 236-1 to 236-8 The design of the bonding parts 236-1 to 236-8 is free. Therefore, the embodiment can prevent damage to the bonding portions and cracks of the solder due to the impact due to weakening of the bonding force between the bonding portions of the coil substrate and the solder.

18 is an exploded perspective view of the camera module 200 according to the embodiment.

18, the camera module includes a lens barrel 400, a lens driving device 100, an adhesive member 710, a filter 610, a first holder 600, a second holder 800, an image sensor 810, a motion sensor 820, a controller 830, and a connector 840.

A lens barrel 400 may be mounted on the bobbin 110 of the lens driving apparatus 100. [

The first holder 600 may be disposed below the base 210 of the lens driving apparatus 100. The filter 610 may be mounted to the first holder 600 and the first holder 600 may have a protrusion 500 on which the filter 610 is seated.

The adhesive member 710 can couple or attach the base 210 of the lens driving apparatus 100 to the first holder 600. [ The adhesive member 710 may serve to prevent foreign substances from flowing into the lens driving apparatus 100 in addition to the above-described adhesive role.

For example, the adhesive member 710 may be an epoxy, a thermosetting adhesive, an ultraviolet ray-curable adhesive, or the like.

The filter 610 may block the light of a specific frequency band in the light passing through the lens barrel 400 from being incident on the image sensor 810. The filter 610 may be an infrared cut filter, but is not limited thereto. At this time, the filter 610 may be arranged to be parallel to the x-y plane.

A hollow may be formed in a portion of the first holder 600 where the filter 610 is mounted so that light passing through the filter 610 can be incident on the image sensor 810. [

The second holder 800 may be disposed below the first holder 600 and the image sensor 810 may be mounted on the second holder 600. The image sensor 810 is a portion where an image included in the light is formed by light incident through the filter 610.

The second holder 800 may be provided with various circuits, elements, and a controller for converting an image formed on the image sensor 810 into an electrical signal and transmitting the electrical signal to an external device.

The second holder 800 can be implemented as a circuit board on which an image sensor can be mounted, a circuit pattern can be formed, and various devices can be coupled.

The image sensor 810 receives the image included in the light incident through the lens driving apparatus 100 and converts the received image into an electrical signal.

The filter 610 and the image sensor 810 may be spaced apart from each other in the first direction.

The motion sensor 820 is mounted on the second holder 800 and may be electrically connected to the controller 830 through a circuit pattern provided on the second holder 800. [

The motion sensor 820 outputs rotational angular velocity information based on the motion of the camera module 200. The motion sensor 820 may be implemented as a two-axis or three-axis gyro sensor, or an angular velocity sensor.

The controller 820 is mounted on the second holder 800 and may be electrically connected to the second position sensor 240 and the second coil 230 of the lens driving apparatus 100. For example, the second holder 800 may be electrically connected to the circuit board 250 of the lens driving apparatus 100, and the control unit 820 mounted on the second holder 800 may be electrically connected to the circuit board 250 2 position sensor 240, and the second coil 230, as shown in FIG.

The control unit 830 outputs a drive signal capable of performing camera-shake correction for the OIS moving part of the lens driving device 100, based on the output signals provided from the second position sensor 240 of the lens driving device 100 Can be output.

The connector 840 is electrically connected to the second holder 800 and may include a port for electrically connecting to the external device.

Further, the lens driving apparatus 100 according to the embodiment may form an image of an object in a space by using reflection, refraction, absorption, interference, or diffraction, which are characteristics of light, For the purpose of recording and reproduction of an image by an optical device, or for optic measurement for the purpose of propagation or transmission of an image. For example, the optical device according to the embodiment may include a smart phone and a portable terminal equipped with a camera.

FIG. 19 shows a perspective view of the portable terminal 200A according to the embodiment, and FIG. 20 shows a configuration diagram of the portable terminal shown in FIG.

19 and 20, the portable terminal 200A includes a body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / An output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 shown in FIG. 19 is in the form of a bar but is not limited thereto. The body 850 may be a slide type, a folder type, a swing type , A swirl type, and the like.

The body 850 may include a case (casing, housing, cover, etc.) which forms an appearance. For example, the body 850 can be divided into a front case 851 and a rear case 852. Various electronic components of the terminal may be installed in the space formed between the front case 851 and the rear case 852. [

The wireless communication unit 710 may include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system or between the terminal 200A and the network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless Internet module 713, a short distance communication module 714, and a location information module 715 have.

The A / V (Audio / Video) input unit 720 is for inputting an audio signal or a video signal and may include a camera 721 and a microphone 722.

The camera 721 may be the camera module 200 shown in Fig.

The sensing unit 740 senses the current state of the terminal 200A such as the open / close state of the terminal 200A, the position of the terminal 200A, the presence of the user, the orientation of the terminal 200A, And generate a sensing signal for controlling the operation of the terminal 200A. For example, when the terminal 200A is in the form of a slide phone, it is possible to sense whether the slide phone is opened or closed. In addition, it is responsible for a sensing function related to the power supply of the power supply unit 790, whether the interface unit 770 is connected to an external device, and the like.

The input / output unit 750 is for generating an input or an output related to a visual, auditory or tactile sense. The input / output unit 750 can generate input data for controlling the operation of the terminal 200A and display information processed by the terminal 200A.

The input / output unit 750 may include a keypad unit 730, a display module 751, an audio output module 752, and a touch screen panel 753. [ The keypad unit 730 may generate input data by inputting a keypad.

The display module 751 may include a plurality of pixels whose color changes according to an electrical signal. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, And a display (3D display).

The audio output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, Audio data can be output.

The touch screen panel 753 may convert a change in capacitance caused by a user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and controlling the control unit 780 and may store input / output data (e.g., telephone directory, message, audio, still image, You can save it temporarily. For example, the memory unit 760 may store an image, e.g., a photograph or a moving image, photographed by the camera 721. [

The interface unit 770 serves as a path for connection to an external device connected to the terminal 200A. The interface unit 770 receives data from an external device or supplies power to each component in the terminal 200A or allows data in the terminal 200A to be transmitted to an external device. For example, the interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with the identification module, Output port, a video input / output (I / O) port, and an earphone port.

The controller 780 can control the overall operation of the terminal 200A. For example, the control unit 780 may perform related control and processing for voice call, data communication, video call, and the like. The control unit 780 may include the panel control unit 144 of the touch screen panel driving unit shown in FIG. 1 or may perform the function of the panel control unit 144.

The control unit 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented in the control unit 780 or may be implemented separately from the control unit 780.

The control unit 780 can perform a pattern recognition process for recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 can supply external power or internal power under the control of the controller 780 and supply power required for operation of each component.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

110: bobbin 120: first coil
130: first magnet 140: housing
150: upper elastic member 160: lower elastic member
170: first position sensor 180: second magnet
182: metal for magnetic field compensation 210: base
220: support member 230: second coil
239: conductive adhesive member 240: second position sensor
250: circuit board.

Claims (18)

A housing;
A bobbin accommodated inside the housing, for mounting the lens;
A first coil disposed on an outer circumferential surface of the bobbin;
Magnets disposed in the housing;
A coil substrate disposed below the housing and including second coils spaced apart from each other and connecting portions connected to the second coils;
A circuit board disposed below the coil substrate and including first pad portions disposed at positions corresponding to the connecting portions; And
And a conductive bonding member for bonding the first pad portion and the connection portion corresponding to each other,
Each of the connection portions includes:
A groove portion which is recessed from an outer surface of the coil substrate and exposes a corresponding one of the first pad portions, and a bonding portion provided around the groove portion,
Wherein the conductive adhesive member is disposed on an upper surface of the first pad portion exposed by the upper surface of the bonding portion and the groove portion, and electrically connects the bonding portion and the first pad portion. The method according to claim 1,
Wherein the conductive adhesive member is spaced apart from the outer surface of the circuit board and located inside the outer surface of the circuit board with respect to the outer surface of the circuit board. 3. The method of claim 2,
Wherein the bonding portion of the coil substrate is arranged to be aligned with a corresponding one of the first pad portions in a direction parallel to the optical axis. The method according to claim 1,
Wherein the conductive adhesive member protrudes from the upper surface of the coil substrate in the direction from the circuit board toward the coil substrate. 5. The method of claim 4,
Wherein the lower surface of the conductive adhesive member covers the upper surface of the first pad portion of the circuit board and the upper surface of the bonding portion of the coil substrate. 6. The method of claim 5,
Wherein an upper surface of the conductive adhesive member is positioned higher than an upper surface of the coil substrate. The method of claim 3,
Upper elastic members engaging with an upper portion of the bobbin and an upper portion of the housing;
A lower elastic member coupled to a lower portion of the bobbin and a lower portion of the housing; And
Further comprising support members disposed on the sides of the housing,
Each of the support members includes an upper terminal portion, a lower terminal portion, and an elastic deformation portion connecting the upper terminal portion and the lower terminal portion,
Wherein each of the upper terminal portions of the support members is connected to a corresponding one of the upper elastic members. 8. The method of claim 7,
Wherein the circuit board further includes at least one second pad portion spaced apart from the first pad portions and connected to at least one of the lower terminal portions of the support members. 9. The method of claim 8,
Two first pad portions spaced apart from each other and two second pad portions spaced from each other are disposed on at least one side of an upper surface of the circuit board,
Wherein the two second pad portions are positioned between the two first pad portions. The method according to claim 1,
Wherein the coil substrate comprises:
And wiring or patterns connecting the second coils and the bonding portions of the connection portions. The method according to claim 1,
Wherein the groove portion is provided in a first region of at least one side of the upper surface of the coil substrate,
A second region, which is a region other than the first region, is provided on the at least one side of the upper surface of the coil substrate,
Wherein the first region has a recessed structure with respect to the second region. 3. The method of claim 2,
Wherein the conductive adhesive member is a solder or a conductive paste. The method according to claim 1,
Wherein the coil substrate includes a conductive layer and an insulating layer disposed on the conductive layer,
Wherein the bonding portion is a portion of the conductive layer exposed from the insulating layer. 13. The method of claim 12,
Wherein the first surface of the conductive adhesive member facing the outer surface of the circuit board is planar. 15. The method of claim 14,
Wherein the second surface of the conductive adhesive member is curved and the second surface is a surface facing the first surface. 10. The method of claim 9,
Wherein the circuit board is bent from at least one side of the upper surface on which the first and second pad portions are disposed and has a terminal surface on which a plurality of terminals are formed,
Wherein the plurality of terminals are electrically connected to the first pad portions and the second pad portions. Lens barrel;
The lens driving apparatus according to any one of claims 1 to 16, wherein the lens barrel is moved. And
And an image sensor that converts an image incident through the lens driving device into an electrical signal. A display module including a plurality of pixels whose color changes by an electrical signal;
The camera module according to claim 17, wherein the camera module converts the image input through the lens into an electrical signal. And
The display module, and a controller for controlling operations of the camera module.

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