KR20180010192A - Dielectric waveguide filter with direct coupling and alternating cross coupling - Google Patents

Abstract

The RF signal transmission waveguide filter includes a plurality of dielectric material blocks connected together in a stacked relationship in a combined parallel. Each block includes an outer surface that forms a resonator and is covered with a layer of conductive material and forms a layer of inner conductive material with the blocks connected together. The layer of inner conductive material comprises a region free of conductive material forming an inner window for transmitting RF signals between the resonators in the stacked blocks of the parallel. The layer of inner conductive material also includes a region free of conductive material forming a pad of isolated conductive material for indirect transmission of RF signals between the resonators in the laminate block.

Description

Dielectric waveguide filter with direct coupling and alternating cross coupling

Cross-references to Related Applications and Concurrent Applications

This application claims the benefit of U.S. Patent Application No. 13 / 373,862, filed December 3, 2011, U.S. Patent No. 9,030,279, issued May 12, 2015, filed on May 11, 2015, Filed on even date herewith, the disclosure of which is incorporated herein by reference as if all the cited documents are incorporated herein by reference.

This application is also related to U.S. Patent Application No. 14 / 088,471, filed November 25, 2013, filed September 8, 2015, and U.S. Patent No. 9,130,255, filed September 8, 2015, This application is a continuation-in-part of U.S. Patent Application No. 14 / 842,920, filed on even date herewith, which is incorporated herein by reference as if all cited documents are incorporated herein by reference.

This application also claims the benefit of U.S. Provisional Application No. 62 / 165,657, filed May 22, 2015, the disclosure of which is incorporated herein by reference as if all citations are cited therein .

Technical field

The present invention relates generally to dielectric waveguide filters, and more particularly to dielectric ceramic waveguide filters having direct coupling and alternating cross coupling.

The present invention is directed to a dielectric waveguide filter of the kind disclosed in U.S. Patent No. 5,926,079 issued to Heine et al., Wherein the plurality of resonators in the patent are oriented longitudinally along the length of the dielectric / ceramic material block And a plurality of slots / notches are longitudinally spaced along the length of the blocks and provide a plurality of RF signals that provide direct inductive / capacitive coupling between the plurality of resonators. Thereby forming a dielectric material bridge.

The attenuation characteristic of a waveguide filter of the kind disclosed in U.S. Patent No. 5,926,079 issued to Heine et al. Can be accommodated by accommodating zero in the form of placing an additional resonator at one or both ends of the waveguide filter. However, the installation of additional resonators has the disadvantage of increasing the length of the filter, which may be undesirable in some cases or may not be possible due to space constraints on the customer's device body.

The attenuation characteristics of the filter may also be enhanced by both direct and cross coupling of the resonator, as disclosed, for example, in U.S. Patent No. 7,714,680 issued to Vangala et al. Discloses a block filter having both inductive direct coupling and quadruplet cross coupling partially created by respective metallization patterns formed on the upper surface and extending between selected through holes in the resonator through holes , Thereby providing direct and cross-coupling of the resonator.

Direct and cross-couplings of the type disclosed in U.S. Patent No. 7,714,680 issued to Vangala et al., Including top metallization patterns, include only slots and include any top metallization pattern It is not applicable to U.S. Patent No. 5,926,079 issued to Heine et al.

The present invention therefore relates to a dielectric waveguide filter having both direct and optional or alternative crossed-coupled resonators which avoids increasing the length of the waveguide filter while reducing the attenuation characteristics of the waveguide filter Can be improved.

The present invention relates to a dielectric material block comprising a plurality of dielectric material blocks connected together in a substantially parallel, stacked relationship, each of the blocks comprising an outer surface forming a resonator and covered by a layer of conductive material, And forming a first inner window for direct transmission of the RF signal between the resonators in the plurality of parallel stacked dielectric material blocks in the layer of inner conductive material And a second region in the layer of inner conductive material forming a second inner means for indirect transmission of the RF signal between the resonator in the plurality of laminated dielectric material blocks, To a waveguide filter for transmitting an RF signal.

In one embodiment, the second inner means for indirect transmission of the RF signal comprises a pad of isolated conductive material in a layer of inner conductive material.

The present invention also relates to a plurality of dielectric material blocks connected together in a combined, parallel, stacked relationship, comprising: a plurality of dielectric material blocks comprising an outer surface covered by a layer of conductive material and forming a plurality of resonators, A layer of a first inner conductive material formed between each of the plurality of dielectric material blocks in parallel by a layer of conductive material covering each outer surface of the dielectric material block, a layer of conductive material covering each outer surface of the plurality of dielectric material blocks A second inner conductive material layer formed between each of the plurality of dielectric material blocks stacked by the plurality of dielectric material blocks, an RF signal input section formed in a first block of the plurality of dielectric material blocks, an RF signal input section formed in the second block of the plurality of dielectric material blocks, As an output, an RF signal passes through a plurality of resonators in a dielectric material block between an RF signal input and an RF signal output A plurality of dielectric material blocks, a plurality of dielectric material blocks, a plurality of dielectric material blocks, a plurality of dielectric material blocks, a plurality of dielectric material blocks, a plurality of dielectric material blocks, An inner direct RF signal transmission means formed in a selected region of the dielectric material block and a second inner conductive channel for indirect transmission of the RF signal between the resonator and the resonator in one block of the plurality of dielectric material blocks, And an inner indirect RF signal transmission means formed in a selected region of the layer of material.

In one embodiment, the inner direct RF signal transmission means is formed by a window in a layer of first and second inner conductive material free of conductive material, and an inner indirect RF signal transmission means is formed by a layer of first inner conductive material Is formed by a pad of isolated conductive material formed in the substrate.

In one embodiment, the plurality of dielectric material blocks comprises first and second dielectric material blocks coupled together in a parallel relationship and third and fourth dielectric material blocks coupled together in a parallel relationship, wherein the first and second dielectric material blocks, The dielectric material block is connected to the third and fourth blocks in a stacked relationship and the RF signal input portion and the RF signal output portion are respectively formed in the first and second dielectric material blocks, 3 dielectric material block, and a third inner window formed between the fourth and second dielectric material blocks, the inner window formed between the inner and outer dielectric RF blocks, The signal transmission means is connected to the pad of the first inner isolated conductive material between the first and third dielectric material blocks and to the pad of the second inner isolated conductive material between the second and fourth dielectric material blocks .

In one embodiment, each of the RF signal input and output portions is formed by RF signal transmission through holes extending through the first and second blocks of the plurality of dielectric material blocks, respectively, A pad of isolated conductive material in a layer of conductive material.

The present invention further relates to first and second dielectric material blocks that are connected together in a parallel relationship as first and second dielectric material blocks and each comprise an outer surface that forms a plurality of resonators and is covered with a layer of conductive material, 3 and a fourth dielectric material block that are connected together in a parallel relationship and each comprise an outer surface that forms a plurality of resonators and is covered by a layer of conductive material and that are connected in a stacked relationship to each other with the first and second dielectric material blocks Third and fourth dielectric material blocks, and between the first and second dielectric material blocks and between the third and fourth dielectric material blocks by a layer of conductive material covering the first, second, third, and fourth dielectric material blocks. The first and third dielectric material blocks and the second and fourth dielectric material blocks by a layer of conductive material covering the first, second, third, and fourth dielectric material blocks,An RF signal input transmission through hole formed in the first dielectric material block, and an RF signal output transmission through hole formed in the second dielectric material block, the RF signal is transmitted through the RF signal input transmission An RF signal output transmission through hole that is transmitted through a plurality of resonators in the first, second, third, and fourth dielectric material blocks between the through holes and the RF signal output transmission through holes, the first and third dielectric material blocks For direct transmission of RF signals between one of the plurality of resonators in the first dielectric material block and one of the plurality of resonators in the third dielectric material block, A first inner direct RF signal transmission window formed by the first and second dielectric material blocks, a first inner direct RF signal transmission window formed by the first and second dielectric material blocks, A second inner direct RF signal transmission window formed by a second region in the layer of the first inner conductive material free of conductive material for direct transmission of RF signals between one of the plurality of resonators in the second dielectric material block, For direct transmission of RF signals between the third and fourth dielectric material blocks and between one of the plurality of resonators in the third dielectric material block and one of the plurality of resonators in the fourth dielectric material block, A third inner direct RF signal transmission window formed by a first region within the first dielectric material block and a second inner dielectric layer between the first and third dielectric material blocks and between the other resonator of the plurality of resonators in the first dielectric material block and a plurality For the indirect transmission of the RF signal between the other resonators in the resonator, the third zero in the layer of the first inner conductive material free of conductive material And a second inner indirect RF signal transmitting means formed between the second and fourth dielectric material blocks and between the other resonator in the plurality of resonators in the fourth dielectric material block and the other resonator in the plurality of resonators in the second dielectric material block. And a second inner indirect RF signal transmission means formed by a fourth region in the layer of the first inner conductive material free of conductive material for indirect transmission of the RF signal between the first inner conductive material layer and the second inner conductive RF material transmission portion.

In one embodiment, the first and second inner indirect RF signal transmission means comprise pads of first and second isolated conductive material formed by third and fourth regions in a layer of a first inner conductive material.

In one embodiment, the plurality of resonators in each of the first, second, third, and fourth dielectric material blocks are separated by a slit and an RF signal transmission bridge.

In one embodiment, the slits formed in the third dielectric material block face the slits formed in the fourth dielectric material block, the slits formed in the first dielectric material block face the slits formed in the second dielectric material block (Face away).

Other advantages and features of the present invention will become more apparent from the following detailed description of the preferred embodiments of the invention, the accompanying drawings, and the appended claims.

These and other features of the invention are best understood from the following description of the drawings,
1 is an enlarged perspective view of a dielectric waveguide filter according to the present invention;
Figure 2 is an enlarged, partially exploded, perspective view of the dielectric waveguide filter shown in Figure 1;
3 is an enlarged, partially exploded, perspective view of each of the separate solid dielectric blocks of the dielectric waveguide filter shown in FIG.

Figures 1, 2, and 3 illustrate a ceramic dielectric waveguide filter 100 in accordance with the present invention that accommodates both direct coupling and alternating cross-coupling configurations.

In the illustrated embodiment, the waveguide filter 100 is formed of four separate, substantially parallel, pipeline-shaped solid dielectric material blocks or blocks 101, 103, 201, and 203, And are connected and secured together to form a waveguide filter 100 as will be described in more detail below. Specifically, the lower blocks 101 and 103 are connected together in a parallel relationship, and the upper blocks 201 and 203 are connected together in parallel relationship with the upper blocks 201 and 203 stacked on the lower blocks 101 and 103 Wherein the upper block 201 is stacked on and on the lower block 101 and the upper block 203 is stacked on and on the lower block 103.

Each of the sub-blocks 101 and 103 are, for example, includes a suitable solid dielectric material block such as a ceramic, a block in the same longitudinal direction and forming a longitudinal axis (L ₁₎ and the longitudinal axis (L ₁₎ direction Longitudinally opposite lateral vertical outer surfaces 106 and 108 that extend in the longitudinal direction and extend in the same longitudinal direction as the longitudinal axis L ₁ , And opposite opposing lateral side vertical outer end faces 110 and 112 extending in a direction substantially perpendicular to the longitudinal axis L _{1 of the first} and second end portions 101 and 103.

Each block 101 and 103 includes a plurality of resonator sections (also collectively referred to as cavities or cells or resonators) 114,116, and 118,201, which, as will be described in greater detail below, , Longitudinally spaced and extended along the length and longitudinal axis L ₁ of each block 101 and 103 and separated from one another by respective vertical slits or slots 124 and 126, 104, 106, and 108 of blocks 101 and 103 and their respective dielectric material RF signal bridges 128 and 130. [

The slots 124 and 126 extend along the length of each side 106 and 108 of each block 101 and 103 in a generally perpendicular relationship to the longitudinal axis L ₁ . Each slot 124 and 126 cuts through each side 106 and 108 and opposite horizontal surfaces 102 and 104 and partially cuts through the body and each dielectric material block 101 and 103. Slots 124 and 126 are located approximately in the center of each block 101 and 103 between and parallel to each other between opposite transverse outer end faces 110 and 112. [

Slots 124 and 126 do not extend to the full width of each block 101 and 103 so that blocks 101 and 103 are located approximately at the center of each of blocks 101 and 103 Which form respective RF signal bridges 128 and 130 which extend in a substantially vertical relationship and direction with respect to each longitudinal axis L _{1 of} each of the blocks 101 and 103, And a dielectric material bridge or island in each block 101 and 103 that electrically interconnects each resonator 114,116 and resonators 118,120 within the respective resonator.

The dielectric material bridge 128 on the block 101 bridges and interconnects the dielectric material of the resonator 114 to the dielectric material of the resonator 116 while the dielectric material bridge 128 on the block < RTI ID = 0.0 & (130) connects and interconnects the dielectric material of the resonator (118) to the dielectric material of the resonator (120).

In the illustrated embodiment, the width of each RF signal bridge or island 128 and 130 formed of a dielectric material is determined by the distance that each slot 124 and 126 extends into each block 101 and 103 . Each of the slots 124 and 126 has a length that is greater than half the width of each of the blocks 101 and 103 so that each of the RF signal transmission bridges 128 and & 101 and 103, respectively.

Although not shown in any of the figures, the width or length of the RF signal bridges 128 and 130 may be varied accordingly by varying the thickness or width or length of the slots 124 and 126 depending on the particular application, ) Of the waveguide filter 100 can be controlled by controlling the electrical connection and the bandwidth of the waveguide filter 100.

Blocks 101 and 103 additionally have electrical RF signal input / output in the form of respective through holes 146 extending through the body of each block 101 and 103 in a direction perpendicular to its longitudinal axis L ₁ , Output electrodes and, more specifically, through the end resonators 114 and 118 of the respective resonators 114 and 118 formed in each of the blocks 101 and 103 and each of the opposing horizontal upper and lower external sides of each block 101 and 103 And terminates within each opening or hole 147 in surfaces 102 and 104. [ In the illustrated embodiment, the through-holes 146 are spaced from the respective transverse end outer surfaces 110 of each of the blocks 101 and 103 and are positioned substantially centrally therealong, As shown in FIG.

The inner surfaces of the outer surfaces 102, 104, 106, 108, 110 and 112 of the blocks 101 and 103 and the inner surfaces of the slots 124 and 126 and the inner surfaces of the input / output through holes 146, Such as silver, except for some areas of the outer surface, as will be described in more detail in FIG.

Specifically, in the illustrated embodiment, the outer upper horizontal surface 104 of each block 101 and 103 includes respective regions 400a and 402a without conductive material, and thus each block 101 and 103, The dielectric material regions 400a and 402a are formed on the outer upper horizontal surface 104 of the substrate 100. [

As described in more detail below, region 400a includes direct coupling of the RF signal from block 101 to block 201 when block 201 is stacked and connected to block 101, and Thereby forming a means or window for transmission. In the illustrated embodiment, the substantially rectangular region 400a is adjacent to, spaced from, and parallel to the transverse end outer surface 112 of each block 101 and 103, 120 and more particularly between and between each transverse end outer surface 112 and each slot 124 and 126 in each block 101 and 103, It is located in a parallel relationship. In the illustrated embodiment, the region or window 400a is disposed approximately at the center of each block 101 and 103 in a relationship that intersects the vertical axis L ₁ and is approximately perpendicular thereto.

The region 402a is substantially annular and has a substantially annular shape and includes an RF signal from the block 101 to the block 201 when the block 201 is stacked on and connected to the block 101, To form a pad 403a of circularly isolated conductive material that forms a means for cross or indirect coupling and transmission of the conductive material. Region 402a and pad 403a are connected to respective resonators 114 and 118 in a spaced relationship between and spaced from respective through holes 146 and respective slots 124 and 126 in each block 101 and 103. [ ) Region. In the illustrated embodiment, the regions or pads 402a are disposed approximately at the center of each of the blocks 101 and 103 in relation to the longitudinal axis L ₁ .

Further, in one illustrated embodiment, each of the regions 400a and 402a are co-linearly arranged with respect to each other and are arranged in the respective slots 124 and 126 on each block 101 and 103 On opposite sides and spaced apart therefrom.

1 and 2, the blocks 101 and 103 are connected and fixed together in the following relationship: the vertical longitudinal outer side 108 of the block 101 is connected to the vertical longitudinal direction of the block 103 by being butted against each other are fixed to the outer side (106), connected to the block (101 and 103), the longitudinal axis (L ₂₎ and the ball linear relationship to each of the blocks 101 and 103 layer or the conductive material of the internal conductive material extending between the strip of (500a); The horizontal outer surfaces 102 and 104 of each block 101 and 103 are aligned in a common straight line with each other; The respective vertical outer end faces 106 and 108 of each block 101 and 103 are aligned in a common straight line with each other; Each slot 124 and 126 are mutually aligned in a common straight line, and at each other and opening in a direction opposite faces, spaced from and on opposite sides of the inner conductive strips of material (500a) and a longitudinal axis (L _2), and these are with respect to these Approximately vertically positioned; Each zone (400a) it is mutually aligned in a common straight line and also separated from their substantially vertical position with respect to those on the opposite side of the inner conductive material strip 500 and the longitudinal axis (L _2), and; In addition, each of the regions (402a) and a pad (403a) is located at each other and aligned in a common straight line is located on the opposite side of the inner conductive material strip 500 and the longitudinal axis (L ₂₎ spaced from these.

In the same manner, each top block 201 and 203 comprises a suitable solid dielectric material block, such as, for example, a ceramic; This block forms a longitudinal axis L ₁ ; Includes opposing longitudinal outer horizontal lower and upper surfaces (202 and 204) extending in the same longitudinal direction as the longitudinal axis (L ₁ ) direction; Facing longitudinal vertical outer surfaces 206 and 208 extending in the same longitudinal direction as the longitudinal axis L ₁ direction; And opposing lateral side vertical outer end faces 210 and 212 extending in a direction substantially perpendicular to the longitudinal axis L ₁ of each block 201 and 203.

Each block 201 and 203 includes a plurality of resonator sections (also collectively referred to as cavities or cells or resonators) 214, 216 and 218 and 220, respectively, which, as will be described in greater detail below, , Longitudinally spaced and extended along the length and longitudinal axis L ₁ of each block 201 and 203 and separated from each other by respective vertical slits or slots 224 and 226, The surfaces 102, 104, 106, and 108 of blocks 201 and 203 and respective dielectric material RF signal bridges 128 and 132 are cut.

Slots 224 and 226 extend along the length of each side 106 and 108 of each block 201 and 203 in a relationship that is approximately perpendicular to the longitudinal axis L ₁ . Each slot 224 and 226 cuts through the respective side surfaces 106 and 108 and the opposing horizontal surfaces 102 and 104 and partially cuts through the body and the respective dielectric material blocks 201 and 203. The slots 224 and 226 are located approximately centrally between each of the blocks 201 and 203 in a parallel relationship between and opposite opposite lateral end faces 110 and 112.

Slots 224 and 226 do not extend to the full width of each block 201 and 203 so that blocks 201 and 203 are positioned approximately at the center of each of blocks 201 and 203 Which form respective RF signal bridges 228 and 230 which extend in a substantially vertical relationship and direction with respect to each longitudinal axis L _{1 of} each of the blocks 201 and 203, And dielectric material bridges or islands in each of the blocks 201 and 203 that electrically interconnect the respective resonators 214 and 216 and the resonators 218 and 220 therein.

Specifically, dielectric material bridge 228 on block 201 bridges and interconnects the dielectric material of resonator 214 to the dielectric material of resonator 216, while dielectric material bridge 228 on block < RTI ID = 0.0 > (230) connects and interconnects the dielectric material of the resonator (218) to the dielectric material of the resonator (220).

In the illustrated embodiment, the width of each RF signal bridge or island 228 and 230 formed of a dielectric material is determined by the distance that each slot 224 and 226 extends into each block 201 and 203 . In the illustrated embodiment, each slot 224 and 226 has a length that is greater than half the width of each block 201 and 203, and thus each RF signal transmission bridge 228 and 230 has a respective block 201 and 203, respectively.

Although not shown in any of the figures, the width or length of the RF signal bridges 228 and 230 may be varied accordingly by varying the thickness or width or length of the slots 224 and 226 depending on the particular application, ) Of the waveguide filter 100 can be controlled by controlling the electrical connection and the bandwidth of the waveguide filter 100.

Both the outer surfaces 202, 204, 206, 208, 210, and 212 of the blocks 201 and 203 and the inner surfaces of the slots 224 and 226, Except for the area, covered with a suitable conductive material such as silver.

Specifically, in the illustrated embodiment, the bottom outer horizontal surface 202 of each block 201 and 203 includes respective areas 400b and 402b without conductive material, The dielectric material regions 400b and 402b are formed on the lower outer horizontal surface 202 of the dielectric layer.

As will be described in greater detail below, region 400b includes direct coupling and transmission of RF signals between blocks 101 and 201 when block 201 is stacked and connected to block 101 Forming means or window. In the illustrated embodiment, the generally rectangular region 400b is adjacent, spaced, and parallel to the transverse end outer surface 212 of each of the blocks 201 and 203, 220 and more particularly between and between each transverse end outer surface 212 and each slot 224 and 226 in each of the blocks 201 and 203, It is located in a parallel relationship. In the illustrated embodiment, the region or window 400b is disposed approximately at the center of each block 201 and 203 in a relationship that intersects the longitudinal axis L ₁ and is approximately perpendicular thereto.

The region 402b is substantially annular and has a crossing of the RF signal between the blocks 101 and 201 when the block 201 is stacked on top of the block 101 and connected thereto, Or pads 403b of circularly isolated conductive material that form means for indirect coupling and transmission. Region 402b and pad 403b are spaced apart from and spaced from respective slots 224 and 226 and respective transverse outer end face 110 of each block 201 and 203 by respective resonators 214 and & 218) regions. In the illustrated embodiment, the regions or pads 402b are disposed approximately at the center of each of the blocks 201 and 203 in relation to the longitudinal axis L ₁ .

Further, in the illustrated embodiment, each of the regions 400b and 402b are disposed in a common straight line with respect to each other and on opposite sides of each slot 224 and 226 on each block 201 and 203, Are spaced apart.

The lateral vertical outer surfaces 208 and 206 of each of the blocks 201 and 203 include respective regions 600a and 600b without conductive material so that the blocks 201 and 203 are in a parallel relationship Thereby forming respective regions 600a and 600b that form the windows or the windows 600a and 600b for direct coupling and transmission of RF signals between the blocks 201 and 203 when connected together.

In the illustrated embodiment, regions or windows 600a and 600b are located on each of the blocks 201 and 203 that form respective resonators 214 and 218 and respective pads 402b, And in opposition to and spaced apart from each window 400b that is located in a collinear relationship with the pad 402 and further formed on each of the opposed resonators 216 and 220 and separated by respective slots 224 and 226, From a distance.

As shown in Figures 1 and 2, the blocks 201 and 203 are connected together and secured together in the following relationship: The vertical longitudinal outer side 208 of the block 201 is connected to the vertical longitudinal direction fixing is abutted to the outer side (206) and, thereby the block (201 and 203), the longitudinal axis (L ₂₎ and the layer or conductivity of the inner conductive material extending to a linear relationship between the ball between each of the blocks 201 and 203 of the connection by Forming a material strip 500b; Each region or window 600a and 600b on each of the outer sides 208 and 206 is aligned and abutted against each other; The respective outer horizontal surfaces 202 and 204 of each of the blocks 201 and 203 are aligned in a common straight line with each other; The respective vertical outer end faces 206 and 208 of each of the blocks 201 and 203 are aligned in a common straight line with each other; Each of the slots (224 and 226) are mutually aligned in a common straight line facing and opening toward one another, on opposite sides of the inner conductive material strip (500b) and the longitudinal axis (L ₂₎ and positioned substantially vertically with respect to these these Ending within; Each region (400b) to each other and are arranged on a common straight line and also separated from their substantially vertical position with respect to those on the opposite side of the inner conductive material strip (500b) and the longitudinal axis (L _2), and; In addition, each of the regions (402b) and the pad (403b) are positioned to each other and aligned in a common straight line is located on the opposite side of the inner conductive material strip (500b) and the longitudinal axis (L ₂₎ spaced from these.

Lower blocks 101 and 103 and upper blocks 201 and 203 are then laminated together in the following relationship: The lower outer horizontal plane 202 of each block 201 and 203 is located at the top of the lower blocks 101 and 103 An inner conductive material strip or interiors extending between the blocks 101 and 103 and the blocks 201 and 203 and in vertical and crossing relation to the inner layers or strips 500a and 500b, Forming a layer 500c of conductive material; Each of the areas 400b and 402b on each block 201 and 203 and the pad 403b are aligned with the respective areas 400a and 402a and the pad 403a on each block 101 and 103, Come in contact; Each of the outer vertical sides and end faces 206,208 and 212 of each of the blocks 201,203 also form an elongated step at the end of the filter 100 extending to the full width of the filter 100 108, and 112 of block 101 and 103, respectively.

In the illustrated embodiment, the upper blocks 201 and 203 are equal in length and shorter in length than the lower blocks 101 and 103, so that in the illustrated embodiment, the vertical outer ends of the blocks 201 and 203 The annular surface 210 is disposed in alignment with the respective through holes 146 in each block 101 and 103 in a planar area and spaced from and spaced from the vertical outer surface 110 of the blocks 101 and 103, .

According to the present invention, the waveguide filter 100 comprises a first magnetic or inductive directly coupled RF signal transmission path or transmission line for RF signals, generally indicated by arrows d in Figures 1 and 2, And these transmission paths or transmission lines continue to penetrate the through holes 147 in the lower block 101 forming the RF signal input portion inwardly and vertically upward, Pass the resonator 114 horizontally and substantially transversely with respect to the longitudinal axis L ₂ ; And then through the RF signal bridge 128 in the block 101 in the same direction as the longitudinal axis L ₂ and toward the rear outer end face 112 of the block 101 to form a resonator 116 horizontally and through it; After vertically upwards therethrough into the cavity 216 of the upper block 201, lower block 101 and upper block longitudinal axis (L ₂₎ layer (500c inside the conductive material is located transverse to the direction between the 201 Through inner RF signal transmission means or windows (400a and 400b) formed in alignment with each other; Then horizontally through the resonator 216 in the same direction as the longitudinal axis L ₁ and toward the front outer end face 210 of the block 201; An RF signal bridge 228 is then formed in the layer of internal conductive material 500b positioned laterally transverse to the longitudinal axis L ₂ direction between the two blocks 201 and 203 from the resonator 216 in block 201. [ And horizontally through and through the resonator 214 in the block 201; Then through the resonator 218 horizontally rearward in the same direction as the longitudinal axis (L ₂ ) direction; Through the RF signal bridge 230 located between the resonators 218 and 220 and into and through the resonator 220 in the block 201 horizontally rearward; Through the aligned internal direct RF signal transmission means or windows 400a and 400b formed in the layer of internal conductive material 500c located between the upper block 203 and the lower block 103, (L ₂ ) direction from the resonator (220) in the lower block (203) to the resonator (120) in the lower block (103); Then horizontally through the resonator 120 in the lower block 103 in the same direction as the longitudinal axis L ₂ and toward the through-hole 147; Through the RF signal transmission bridge 130 located on the lower block 103 between the resonators 120 and 118 and into and through the resonator 118 in the lower block 103 horizontally forward; The through hole 147 in the lower block 103 is vertically downwardly inserted into the through hole 147 formed in the lower block 103 in the vertical direction L ₂ direction forming the RF signal output portion of the waveguide filter 100 In a transverse direction.

Thus, in the illustrated embodiment, the RF signal travels through waveguide filter 100 in a substantially U-shaped pattern or path between each input / output through hole 146 on each block 101 and 103, Specifically, it travels through the waveguide 100 to a U-shaped three-dimensional direct path which is approximately twisted and meandered.

The waveguide filter 100 also forms and provides a pair of alternating or indirect or cross-coupled RF signal transmitting means or paths for the RF signal, roughly indicated by the arrows c in Figures 1 and 2.

One of the cross-coupling or indirect RF signal transmission paths c is formed by a pair of inner or inner RF signal transmission means or isolated conductive pads 403a, 403b located in the layer 500c of inner conductive material Whereby a part of the direct RF signal passes through the conductive pads 403a and 403b which are in contact with the resonator 114 of the lower block 101 in the direction transverse to the longitudinal axis L ₂ So as to be transmitted upwardly into the resonator 214 of the upper block 201; A part of the direct RF signal passes through the resonator 218 of the upper block 203 and passes through the conductive pads 403a and 403b which are in the transverse direction with respect to the longitudinal axis L ₂ direction, 103 into the resonator 118 of the resonator.

According to the present invention, the cross coupling of the RF signal as described above advantageously produces a respective first and second transmission zeros, of which the first transmission zero is the path of the waveguide filter 100 Band and the second transmission zero point will be located above the passband of the waveguide filter 100. < RTI ID = 0.0 >

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. You will know. The described embodiments are to be considered in all respects only as illustrative and not restrictive.

Claims (10)

In a waveguide filter for transmitting an RF signal,
A plurality of dielectric material blocks connected together in a side-by-side and stacked relationship;
Each of the blocks including an outer surface defining resonators and covered with a layer of conductive material and forming layers of the inner conductive material between the plurality of stacked layers of dielectric material;
First regions in the layers of inner conductive material forming first inner windows for direct transmission of RF signals between the resonators in the plurality of layers of dielectric material blocks without conductive material; And
Second regions in the layers of inner conductive material forming a second inner means for the indirect transmission of the RF signal between the resonators in the stacked plurality of dielectric material blocks without conductive material; Wherein the waveguide filter comprises: The method according to claim 1,
Wherein the second inner means for the indirect transmission of the RF signal comprises pads of isolated conductive material in the layers of inner conductive material. In a waveguide filter for transmitting an RF signal,
A plurality of dielectric material blocks coupled together in a stacked relationship in a combined parallel fashion wherein each of the plurality of dielectric material blocks comprises an outer surface covered with a layer of conductive material and forming a plurality of resonators, Blocks;
A first inner conductive material layer formed between each of the plurality of parallel dielectric material blocks by a layer of conductive material covering the outer surface of each of the plurality of dielectric material blocks;
A layer of a second inner conductive material formed between each of the plurality of stacked dielectric material blocks by a layer of the conductive material covering the outer surface of each of the plurality of dielectric material blocks;
An RF signal input unit formed in a first block of the plurality of dielectric material blocks;
An RF signal output formed in a second block of the plurality of dielectric material blocks wherein the RF signal is transmitted through the plurality of resonators in the dielectric material blocks between the RF signal input and the RF signal output The RF signal output unit;
The first and second inner conductive material layers for direct transmission of the RF signal between the resonator and the resonator in one of the plurality of dielectric material blocks and a block of the other of the plurality of dielectric material blocks, An inner direct RF signal transmitting means formed in selected regions of the inner RF signal transmitting means; And
A selected area of the first inner conductive material layer for the indirect transmission of the RF signal between the resonator and the resonator in one of the plurality of dielectric material blocks in the block of the resonator and the other of the plurality of dielectric material blocks, And an inner indirect RF signal transmission means formed in the waveguide filter. The method of claim 3,
Wherein the inner direct RF signal transmitting means is formed by a window in the layers of the first and second inner conductive material free of conductive material and the inner indirect RF signal transmitting means comprises an isolated conductive A waveguide filter for RF signal transmission, formed by a pad of material. 5. The method of claim 4,
Wherein the plurality of dielectric material blocks comprise first and second dielectric material blocks connected together in a side-by-side relationship and third and fourth dielectric material blocks joined together in a parallel relationship, Wherein the first and second dielectric material blocks are connected to the third and fourth blocks in a stacked relationship, wherein the RF signal input portion and the RF signal output portion are formed in the first and second dielectric material blocks, respectively, The inner direct RF signal transmitting means includes a first inner window formed between the first dielectric material block and the third dielectric material block, a second inner window formed between the third dielectric material block and the fourth dielectric material block, Wherein the inner indirect RF signal transmitting means is formed by a third inner window formed between the material block and the second dielectric material block, A pad of a first inner isolated conductive material between the dielectric material blocks and a pad of a second inner isolated conductive material between the second dielectric material block and the fourth dielectric material block. The method of claim 3,
Each of the RF signal input unit and the output unit is formed by an RF signal transmission through hole extending through each of the first and second blocks of the plurality of dielectric material blocks, A waveguide filter for RF signal transmission, the pad of isolated conductive material in a layer of material. In a waveguide filter for transmitting an RF signal,
First and second dielectric material blocks coupled together in a parallel relationship such that each of the first and second dielectric material blocks comprises an outer surface that forms a plurality of resonators and is covered by a layer of conductive material, Second dielectric material blocks;
Third and fourth dielectric material blocks coupled together in a parallel relationship, wherein each of the third and fourth dielectric material blocks comprises an outer surface forming a plurality of resonators and covered with a layer of conductive material, The second dielectric material blocks and the first and second dielectric material blocks being connected to each other in a stacked relationship;
Wherein the first and second dielectric material blocks are disposed between the third dielectric material block and the fourth dielectric material block by a layer of the conductive material covering the first, second, third, A layer of a first inner conductive material formed;
And a second dielectric material block between the first and third dielectric material blocks and the fourth dielectric material block by a layer of conductive material covering the first, second, third, and fourth dielectric material blocks. A layer of a second internal conductive material to be formed;
An RF signal input transmission through hole formed in the first dielectric material block;
And the RF signal output transmission through hole formed in the second dielectric material block, the RF signal is transmitted between the RF signal input transmission hole and the RF signal output transmission hole, and the first, second, third, and fourth The RF signal output transmission through holes being transmitted through the plurality of resonators in the dielectric material blocks;
Between the first dielectric material block and the third dielectric material block and between the resonator of one of the plurality of resonators in the first dielectric material block and the resonator of one of the plurality of resonators in the third dielectric material block A first inner direct RF signal transmission window formed by a first region in the layer of the first inner conductive material free of conductive material for the direct transmission of the RF signal;
Between the second dielectric material block and the fourth dielectric material block and between the resonator of one of the plurality of resonators in the fourth dielectric material block and the resonator of one of the plurality of resonators in the second dielectric material block A second inner direct RF signal transmission window formed by a second region in the layer of the first inner conductive material free of conductive material for the direct transmission of the RF signal;
Between the third dielectric material block and the fourth dielectric material block and between the resonator of one of the plurality of resonators in the third dielectric material block and the resonator of one of the plurality of resonators in the fourth dielectric material block A third inner direct RF signal transmission window formed by a first region in the layer of the second inner conductive material for the direct transmission of the RF signal of the third inner direct RF signal transmission window;
And a second dielectric material block disposed between the first dielectric material block and the third dielectric material block and between the other of the plurality of resonators in the first dielectric material block and the other resonator in the third dielectric material block. A first inner indirect RF signal transmission means formed by a third region in the layer of the first inner conductive material free of conductive material for the indirect transmission of the signal; And
And a second dielectric material block disposed between the second dielectric material block and the fourth dielectric material block and between the other resonator of the plurality of resonators in the fourth dielectric material block and the other resonator in the second dielectric material block. And a second inner indirect RF signal transmission means formed by a fourth region in the layer of the first inner conductive material free of conductive material for the indirect transmission of the signal. 8. The method of claim 7,
Wherein the first and second inner indirect RF signal transmission means comprise pads of first and second isolated conductive material formed by the third and fourth regions in the layer of the first inner conductive material, Waveguide filter for transmission. 8. The method of claim 7,
Wherein the plurality of resonators in each of the first, second, third, and fourth dielectric material blocks are separated by a slit and an RF signal transmission bridge. 10. The method of claim 9,
A slit formed in the third dielectric material block faces a slit formed in the fourth dielectric material block and a slit formed in the first dielectric material block does not face a slit formed in the second dielectric material block face away), a waveguide filter for RF signal transmission.

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