KR20180009049A - Photosensitive resin composition, color filter and liquid crystal display - Google Patents

Abstract

The present invention provides a photosensitive resin composition which has a high leveling effect, is capable of obtaining a photosensitive resin layer having excellent flatness even when containing a colorant, and is capable of reducing the generation of defects or pin marks, and a color filter and a liquid crystal display manufactured using the photosensitive resin composition. The photosensitive resin composition of the present invention contains a resin component (A), a photoresist (B), and a surfactant (C), wherein the surfactant (C) is a polymer which has a C_1-C_20 fluorinated alkyl group (provided that the C_1-C_20 fluorinated alkyl group may be interrupted by an ether bond, an ester bond, a carbonyl group, and a urethane bond) and a lyophilic group formed in a side chain thereof, and has a weight average molecular weight of 10,000 to 50,000.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition, a color filter, and a liquid crystal display (LCD)

The present invention relates to a photosensitive resin composition, and a color filter and a liquid crystal display produced using the photosensitive resin composition.

Since the photosensitive resin composition can obtain a resin pattern having a desired shape by exposure and development, it is used in various applications such as a printing plate, a photoresist, a color filter in a liquid crystal display, and a spacer. For example, in the case of manufacturing a color filter, a black photosensitive resin composition is first applied to a substrate, followed by vacuum drying (vacuum drying) using a vacuum drying device (VCD), followed by exposure and development to form a black matrix. Subsequently, coating, exposure and development are repeated for each of the R, G, and B color photosensitive resin compositions to form a pattern of each color at a predetermined position to produce a color filter.

In such applications, it is important to make the thickness of the photosensitive resin layer uniform after application. In order to make the film thickness of the conventional photosensitive resin layer uniform, it is common to add a surfactant having a leveling effect to the photosensitive resin composition (see Japanese Patent Publication Nos. 1 and 2).

[Patent Document 1] Japanese Patent Laid-Open No. 2005-107131 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-105045

However, particularly in the case of a photosensitive resin composition containing a colorant, since the structure of the dispersing agent for dispersing the coloring agent is similar to that of the surfactant, the effect of the surfactant can not be sufficiently obtained and the uniformity and flatness of the application of the photosensitive resin layer are deteriorated there was. In recent years, a high color density and a high OD (Optical Density) value are required in a color filter or a black matrix. As a result, the amount of the colorant to be added tends to increase. This leads to lowering of the fluidity of the photosensitive resin composition, The uniformity of the resin layer and the flatness of the resin layer became worse.

Further, when the photosensitive resin layer is vacuum-dried, a defect (defect) is generated in the photosensitive resin layer, or a heat treatment is applied to the photosensitive resin layer, a trace (pinch) of the proxy pin supporting the substrate remains in the photosensitive resin layer However, the inventors of the present invention investigated and found that the type and nature of the surfactant is one such factor.

SUMMARY OF THE INVENTION The present invention has been made in view of such conventional circumstances, and it is an object of the present invention to provide a photosensitive resin layer having high leveling effect and excellent coloring uniformity and uniformity even when containing a colorant, And to provide a color filter and a liquid crystal display which are produced by using the photosensitive resin composition.

In order to solve the above problems, the present inventors have conducted intensive studies on various kinds of surfactants. Since the silicone surfactant has a lower leveling effect than that of the fluorine surfactant and the application property when the other photosensitive resin composition is applied on the formed photosensitive resin layer is low and there is a possibility of coating unevenness, And further reviews were made. As a result, it has been found that the above problems can be solved by using a specific fluorine-based surfactant, and the present invention has been accomplished. Specifically, the present invention provides the following.

A first aspect of the present invention is a photosensitive resin composition containing (A) a resin component, (B) a photosensitizer and (C) a surfactant, wherein the (C) surfactant is a fluorinated alkyl group having 1 to 20 carbon atoms , An ester bond, a carbonyl group, or a urethane bond) and a side chain having a proton group and a weight average molecular weight of 10,000 to 50,000.

A second aspect of the present invention is a color filter having a pattern formed using the photosensitive resin composition according to the present invention.

A third aspect of the present invention is a liquid crystal display display having a color filter according to the present invention.

&Quot; Photosensitive resin composition &

The photosensitive resin composition according to the present invention contains (A) a resin component, (B) a photosensitizer, and (C) a surfactant. The photosensitive resin composition may be a negative type or a positive type, and in the case of a positive type, it may be a non-chemically amplified type or a chemically amplified type. Hereinafter, each component contained in the photosensitive resin composition will be described in detail.

≪ (A) Resin component >

The resin component (A) contained in the photosensitive resin composition according to the present invention differs depending on whether the photosensitive resin composition is a negative type or a positive type, or a non-chemically amplified type or a chemical amplification type.

When the photosensitive resin composition according to the present invention is a negative type, (A) an alkali-soluble resin is used as a resin component, and the alkali-soluble resin includes a photopolymerizable resin. The photopolymerizable resin is preferably a resin having an ethylenic unsaturated group.

Examples of the resin having an ethylenic unsaturated group include (meth) acrylic acid, fumaric acid, maleic acid, monomethyl fumarate, monoethyl fumarate, 2-hydroxyethyl (meth) acrylate, ethylene glycol monomethyl ether (Meth) acrylates such as glycol monoethyl ether (meth) acrylate, glycerol (meth) acrylate, (meth) acrylamide, acrylonitrile, methacrylonitrile, (Meth) acrylate, diethyleneglycol di (meth) acrylate, triethyleneglycol di (meth) acrylate, tetraethyleneglycol Di (meth) acrylate, butylene glycol dimethacrylate, propylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, (Meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, Oligomers obtained by polymerizing 6-hexanediol di (meth) acrylate, cardo epoxy diacrylate and the like; A polyester (meth) acrylate obtained by reacting a polyester prepolymer obtained by condensing a polyhydric alcohol with a monobasic acid or a polybasic acid with (meth) acrylic acid, a polyol obtained by reacting a polyol and a compound having two isocyanate groups, (Meth) acrylate; Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol or cresol novolak type epoxy resin, resol type epoxy resin, triphenol methane type epoxy resin, polycarboxylic acid polyglycidyl ester, (Meth) acrylate resins obtained by reacting an epoxy resin such as a cyydecyl ester, an aliphatic or alicyclic epoxy resin, an amine epoxy resin or a dihydroxybenzene type epoxy resin with (meth) acrylic acid. A resin obtained by reacting an epoxy (meth) acrylate resin with a polybasic acid anhydride can be suitably used.

As the resin having an ethylenic unsaturated group, a resin obtained by reacting a reaction product of an epoxy compound and an unsaturated group-containing carboxylic acid compound with a polybasic acid anhydride is suitably used.

Among them, a compound represented by the following formula (a1) is preferable. The compound represented by the formula (a1) is preferable because of its high photo-curability.

In the formula (a1), X represents a group represented by the following formula (a2).

R ^2a is independently a hydrogen atom or a methyl group, W is a single bond or a group represented by the following formula (a2): wherein R ^1a represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, or a halogen atom; (a3).

In the formula (a1), Y represents a residue obtained by removing an acid anhydride group (-CO-O-CO-) from a dicarboxylic acid anhydride. Examples of the dicarboxylic acid anhydride include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chlorodic anhydride, methyltetrahydrophthalic anhydride, And anhydrous glutaric acid.

In the above formula (a1), Z represents a residue other than the two acid anhydride groups from the tetracarboxylic acid dianhydride. Examples of the tetracarboxylic acid dianhydride include pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, biphenyl ether tetracarboxylic dianhydride, and the like.

In the formula (a1), n represents an integer of 0 to 20.

The acid value of the resin having an ethylenically unsaturated group is preferably from 10 to 150 mgKOH / g, more preferably from 70 to 110 mgKOH / g, as a resin solid content. When the acid value is 10 mgKOH / g or more, sufficient solubility in a developing solution can be obtained. When the acid value is 150 mgKOH / g or less, sufficient curability can be obtained and the surface property can be improved.

The weight average molecular weight (Mw: measured value by gel permeation chromatography (GPC) in terms of polystyrene, the same as in the present specification) of the resin having an ethylenically unsaturated group is preferably 1,000 to 4,0000, More preferably 30,000. When the weight average molecular weight is 1,000 or more, heat resistance and film strength can be improved. When the weight average molecular weight is 40,000 or less, sufficient solubility in a developer can be obtained.

On the other hand, when the photosensitive resin composition according to the present invention is a positive type, there are a non-chemically amplified photosensitive resin composition and a chemically amplified photosensitive resin composition.

When the photosensitive resin composition according to the present invention is a positive type or a non-chemically amplified type, an alkali-soluble resin is used as the resin component (A). Examples of the alkali-soluble resin include phenols (phenol, m-cresol, p-cresol, xylenol, trimethylphenol and the like), aldehydes (formaldehyde, formaldehyde precursor, propionaldehyde, 2-hydroxybenzaldehyde, Hydroxybenzaldehyde, etc.) and / or ketones (methyl ethyl ketone, acetone, etc.) in the presence of an acidic catalyst; An acrylic resin obtained by polymerizing (meth) acrylic acid or a derivative thereof; A homopolymer of hydroxystyrene or a copolymer of hydroxystyrene and another styrene-based monomer; And copolymers of hydroxystyrene and (meth) acrylic acid or derivatives thereof.

Among them, a (meth) acrylic acid derivative having a hydroxyphenyl group such as p-hydroxyphenyl (meth) acrylate and p-hydroxyphenylethyl (meth) acrylate is thermally crosslinked with glycidyl Copolymers of (meth) acrylic acid derivatives having a genital group are preferred.

The weight average molecular weight of such an alkali-soluble resin is preferably 2,000 to 50,000, more preferably 5,000 to 30,000. When the weight average molecular weight is 2,000 or more, it is possible to easily form a film. By setting the weight average molecular weight to 50,000 or less, sufficient solubility in a developing solution can be obtained.

When the photosensitive resin composition according to the present invention is a positive type or a chemically amplified type, a resin (A) whose alkali solubility is increased by the action of an acid is used as the resin component. As such a resin, an alkali-soluble resin protected by an acid dissociable, dissolution inhibiting group is used, and a large number of conventionally known ones can be used, which are used for resist resins for ArF excimer laser and KrF excimer laser.

The weight average molecular weight of the resin that increases the alkali solubility by the action of the acid is preferably 2,000 to 50,000, more preferably 3,000 to 30,000, even more preferably 4,000 to 20,000, and particularly preferably 5,000 to 20,000 desirable. When the concentration is in the above range, for example, sufficient solubility can be obtained in a resist solvent when used as a resist composition, and the dry etching resistance is improved, and the cross-sectional shape of the obtained resin pattern is also improved.

≪ (E) Photopolymerizable monomer >

When the photosensitive resin composition according to the present invention is a negative type, it is preferable that the photosensitive resin composition contains (E) a photopolymerizable monomer in addition to the photopolymerizable resin (A) as the resin component. As the (E) photopolymerizable monomer, a monofunctional monomer having a ethylenic unsaturated group or a polyfunctional monomer is preferable.

Examples of the monofunctional monomer include (meth) acrylamide, methylol (meth) acrylamide, methoxymethyl (meth) acrylamide, ethoxymethyl (meth) acrylamide, propoxymethyl (Meth) acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, maleic anhydride, maleic anhydride, (Meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isopropyl (meth) acrylate, Hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-hydroxyethyl 2-phenoxy-2-hydroxypropyl (meth) acrylate, (Meth) acrylate, glycerin mono (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylamino (meth) acrylate, glycidyl (Meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, and half . These monofunctional monomers may be used alone or in combination of two or more.

Examples of the polyfunctional monomer include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (Meth) acrylate, trimethylolpropane tri (meth) acrylate, glycerin di (meth) acrylate, butyleneglycol di (meth) acrylate, neopentyl glycol di (Meth) acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) Pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol penta Bis (4- (meth) acryloxypolyethoxyphenyl) propane, 2,2-bis (4- (meth) acryloxy diethoxyphenyl) propane, (Meth) acryloyloxypropyl (meth) acrylate, ethyleneglycol diglycidylether di (meth) acrylate, diethyleneglycol diglycidylether di (meth) acrylate, phthalic acid diglyme (Meth) acrylate, glycerin triacrylate, glycerin polyglycidyl ether poly (meth) acrylate, urethane (meth) acrylate (i.e., tolylene diisocyanate), trimethylhexamethylene diisocyanate and hexamethylene A reaction product of a diisocyanate and 2-hydroxyethyl (meth) acrylate, a reaction product of methylene bis (meth) acrylamide, (meth) acrylamide methylene ether, polyhydric alcohol and N-methylol (meth) Multi-functional monomers, such as water or the like can be given triacrylate formal. These multifunctional monomers may be used alone or in combination of two or more.

When the (E) photopolymerizable monomer is contained, the content thereof is preferably 5 to 50% by weight, more preferably 10 to 40% by weight, based on the solid content of the photosensitive resin composition. When the concentration is in the above range, a balance of sensitivity, developability and resolution tends to be easily obtained.

<(B) Photosensitizer>

The photosensitive agent (B) contained in the photosensitive resin composition according to the present invention differs depending on whether the photosensitive resin composition is negative or positive, or non-chemically amplified or chemically amplified.

When the photosensitive resin composition according to the present invention is a negative type, a photopolymerization initiator is used as the photosensitizer (B).

Examples of the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2- hydroxyethoxy) Methyl-1-propan-1-one, 1- (4-isopropylphenyl) -2-hydroxy- 2-methylpropane-1-one, 2,2-dimethoxy-1,2-diphenylethan-1-one, bis (4-dimethylaminophenyl) (Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino- Ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime), 2,4,6- trimethylbenzoyldiphenylphosphine oxide, Dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 4-dimethylamino-2-ethylhexylbenzoate, 4-dimethylamino- - isoamylbenzoic acid, benzyl -? - methoxyethyl Benzyl dimethyl ketal, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, methyl o-benzoylbenzoate, 2,4-diethyl thioxanthone, 2- But are not limited to, thioxanthone, thioxanthone, thioxanthone, thioxanthone, 2,4-dimethylthioxanthone, 1-chloro- , 2-isopropylthioxanthene, 2-ethyl anthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone, azobisisobutyronitrile, benzoyl peroxide, 2-mercaptobenzothiazole, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) -imidazole, 2-mercaptobenzoimidazole, Benzoquephenone, p, p'-bisdimethylaminobenzophenone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3-dimethyl -4-methoxybenzophenone, benzyl, benzoin, benzoin methyl ether, benz Benzoin isopropyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzoin butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, Propylphenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, .alpha., .Alpha.-butyrolactophenone, dichloroacetophenone, trichloroacetophenone, -Dichloro-4-phenoxyacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzosuberone, pentyl-4-dimethylaminobenzoate, (9-acridinyl) pentane, 1,3-bis- (9-acridinyl) propane, p-methoxy tri Azine, 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl) Yl) ethenyl] -4,6-bis (trichloro 2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- Ethyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (3,4-dimethoxyphenyl) ethenyl] (Trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) Bis (trichloromethyl) -s-triazine, 2- (4-n-butoxyphenyl) -4,6-bis Methyl-6- (3-bromo-4-methoxy) phenyl-s-triazine, 2,4-bis- trichloromethyl-6- (2,4-bis-trichloromethyl-6- (3-bromo-4-methoxy) styrylphenyl- M-4-methoxy) styrylphenyl-s-triazine. Among them, it is particularly preferable to use an oxime-type photopolymerization initiator in terms of sensitivity. These photopolymerization initiators may be used alone or in combination of two or more.

The content of the photopolymerization initiator is preferably 0.1 to 50% by weight based on the solid content of the photosensitive resin composition. By setting the amount in the above range, sufficient heat resistance and chemical resistance can be obtained, and the coating film forming ability can be improved and the photo-curing failure can be suppressed.

On the other hand, when the photosensitive resin composition according to the present invention is a positive type or a non-chemically amplified type, a quinonediazide group-containing compound is used as the photosensitive agent (B).

Examples of the quinone diazide group-containing compound include a phenol compound such as 2,3,4-trihydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, etc., and a naphthoquinone-1,2-diazide And naphthoquinone diazidesulfonic acid compounds such as naphthoquinone-1,2-diazide-4-sulfonic acid, and the like; Substituted derivatives thereof such as orthobenzoquinone diazide, orthonaphthoquinone diazide or orthoanthraquinone diazide, or orthonaphthoquinone diazidesulfonic acid esters; A compound having a hydroxyl group or an amino group such as phenol, p-methoxyphenol, dimethylphenol, hydroquinone, bisphenol A, naphthol, pyrocatechol, pyrogallol, pyrogarol monomethyl ether , Pyro-iso-1,3-dimethyl ether, molybdic acid, esterified or etherified molybdic acid leaving a part of hydroxyl group, aniline, p-aminodiphenylamine and the like. These quinone diazide group-containing compounds may be used alone or in combination of two or more.

The content of the quinone diazide group-containing compound is preferably 5 to 50 parts by weight based on 100 parts by weight of the resin component (A). By setting the thickness within the above range, it is possible to reduce the amount of film reduction after the resin pattern is formed by improving the resolution, and it is possible to impart a suitable sensitivity or transmittance.

When the photosensitive resin composition according to the present invention is a positive type or a chemically amplified type, (B) a photoacid generator is used as a photosensitizer.

As the photoacid generator, a large number of conventionally known ones can be used, which are used for resist resins such as ArF excimer laser and KrF excimer laser. For example, onium salt-based acid generators such as iodine salts and sulfonium salts, oxime sulfonate-based acid generators, bisalkyl or bisaryl sulfonyldiazomethanes, and poly (bis-sulfonyl) diazomethanes Diazomethane-based acid generators, nitrobenzylsulfonate-based acid generators, iminosulfonate-based acid generators, and disulfone-based acid generators.

The content of the photoacid generator is preferably 0.5 to 30 parts by weight, more preferably 1 to 20 parts by weight, per 100 parts by weight of the resin component (A). When the thickness is in the above range, pattern formation is sufficiently performed. In addition, a uniform solution is obtained and storage stability is improved, which is preferable.

&Lt; (C) Surfactant >

The (C) surfactant contained in the photosensitive resin composition according to the present invention is a fluorinated alkyl group having 1 to 20 carbon atoms (provided that it may be interrupted by an ether bond, an ester bond, a carbonyl group or a urethane bond) Lt; / RTI &gt;

The fluorinated alkyl group is not particularly limited as far as the number of carbon atoms is 1 to 20, and is preferably an ether bond (-O-), an ester bond (-CO-O-), a carbonyl group (-CO-), or a urethane bond (-NH-CO- it is not stopped, but may be interrupted group thereof, that is -C _k H _l F _{m (k} is an integer of 1~20, l is an integer of 0~40, m is an integer of 1-41 , And l + m = 2k + 1).

Recently, it has been reported that compounds having a perfluoroalkyl group having a fluorinated carbon number of 7 or more have ecological effects such as carcinogenicity, and may be subject to the SNUR have. Accordingly, it is preferable that the fluorinated alkyl group includes a perfluoroalkyl group having 1 to 5 carbon atoms, and the remaining carbon atoms are not fluorinated. And the number of carbon atoms of the perfluoroalkyl group is more preferably 3 to 5.

On the other hand, the labile group includes those included in conventionally known nonionic surfactants, but it is preferable to include an alkylene group interrupted by an ether bond, an ester bond or a carbonyl group. Among them, those containing a polyalkyleneoxy group (polyethyleneoxy group, polypropyleneoxy group, polybutyleneoxy group, etc.) are preferred.

The molar ratio of the fluorinated alkyl group to the chelating group varies depending on the composition of the photosensitive resin composition and is preferably 4: 6 to 9: 1, more preferably 4: 6 to 8: 2, 3 is more preferable.

Such a surfactant can be obtained by at least polymerizing a monomer having the fluorinated alkyl group and a monomer having the protonated group. The monomer having a fluorinated alkyl group and the monomer having a pendant group are preferably monomers represented by the following formulas (c1) and (c2), respectively.

In the formula (c1), R ^1c represents a hydrogen atom or a methyl group, R ^2c represents a straight chain, branched chain or cyclic alkylene group having 1 to 15 carbon atoms, preferably 1 to 10 carbon atoms, Represents a perfluoroalkyl group having 1 to 5 carbon atoms, preferably 3 to 5 carbon atoms.

In the formula (c2), R ^3c represents a hydrogen atom or a methyl group, R ^4c represents an alkylene group having 2 to 4 carbon atoms, and R ^5c represents a hydrogen atom or an alkyl group having 1 to 15 carbon atoms, preferably 1 to 10 carbon atoms .

In the above formula (c2), p represents an integer of 1 to 50.

Specific examples of the monomer represented by the formula (c1) include 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3,3-pentafluoropropyl (meth) acrylate, 2- (perfluorobutyl) ethyl (meth) acrylate, and 2- (perfluoro-3-methylbutyl) ethyl (meth) acrylate.

Specific examples of the monomer represented by the formula (c2) include (meth) acrylic acid methoxypolyethylene glycol esters (for example, the number (r) of ethylene glycol repeating units is 1 to 50) (Meth) acrylic acid methoxy polypropylene glycol esters (for example, those having a number (r) of propylene glycol repeating units of 1 to 50), methoxy poly (ethylene-propylene) glycol esters (R) of the number of repeating units and the number of propylene glycol repeating units is 2 to 50], a methoxy poly (meth) acrylate (ethylene-tetramethylene) glycol ester (R) of tetramethylene glycol repeating units of 2 to 50], (meth) acrylic acid butoxypoly (ethylene-propylene) glycol esters (for example, the number of ethylene glycol repeating units and propylene glycol repeats Sum of the number of units (r) is 2 to 50, and the sum (r) of the number of ethylene glycol repeating units and the number of propylene glycol repeating units of (meth) acrylic acid octoxy poly (ethylene-propylene) (The number of repeating units of ethylene glycol is 2 to 50), lauryl (meth) acrylate (ethylenepropylene) glycol (meth) acrylate, (Meth) acrylate, polypropylene glycol (meth) acrylate, polyethyleneglycol (meth) acrylate, polyethyleneglycol (meth) acrylate (Meth) acrylate, polyethylene glycol-polybutylene glycol (meth) acrylate, polystyrylethyl (meth) acrylate, or a light ester HOA-MS of Kyowa Chemical Industry Co., And STERO HOMS.

The mole ratio of the monomer represented by the formula (c1) and the monomer represented by the formula (c2) in the polymerization is preferably 4: 6 to 9: 1, more preferably 4: 6 to 8: 2 , And still more preferably from 5: 5 to 7: 3.

The (C) surfactant is not limited to the monomer represented by the formula (c1) and the monomer represented by the formula (c2), and the one obtained by polymerizing the alkyl (meth) acrylate within the range that does not impair the effect of the present invention It is acceptable. Specific examples of the (meth) acrylic acid alkyl ester include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, (meth) acrylate, n-octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, Acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate and isobonyl (meth) acrylate.

The surfactant may be either a random polymer or a graft polymer, but is preferably a graft polymer. By using the graft polymer, the leveling effect can be further enhanced while maintaining compatibility with (A) the alkali-soluble resin. In addition, in the case of a graft polymer, there is little fear of turbidity even if the content is increased.

The sp value of the surfactant is preferably 8.0 to 9.5 (cal / cm &lt; 3 &gt;) ^1/2 . By setting the amount within the above range, the compatibility of the resin component and the solvent can be improved, and the effect as a surfactant can be improved. The sp value can be measured by the method described in, for example, Japanese Patent Application Laid-Open No. 2005-290128.

The weight average molecular weight of the resin contained in the surfactant is 10,000 to 50,000, preferably 10,000 to 30,000. Generally, a surfactant composed of a compound having a small number of carbon atoms in the fluorinated alkyl group has a low leveling effect. However, by setting the weight average molecular weight within the above range, a sufficient leveling effect can be obtained even when the number of carbon atoms in the fluorinated alkyl group is as small as 5 or less have. By setting the weight average molecular weight within the above range, a photosensitive resin layer excellent in coating uniformity and flatness can be obtained.

That is, in general, a surfactant exhibits a surfactant effect by having an insoluble portion and a soluble portion for a solvent. However, when a fluorinated alkyl group having a small number of carbon atoms is used as an insoluble portion in a low molecular weight surfactant, the effect as an insoluble portion is too small, so that a sufficient surfactant effect can not be obtained. In addition, when the ratio of the insoluble portion is increased, the soluble portion is reduced, and sufficient solubility can not be obtained. In contrast, when the fluorinated alkyl group having a small number of carbon atoms is used, since the weight average molecular weight of the surfactant is 10,000 or more, the amount of the insoluble portion (fluorinated alkyl group) in one molecule of the surfactant can be increased, So that the surfactant effect can be secured. In addition, since the ratio of the soluble portion can be increased, the densification of the fluorinated alkyl group can be prevented by the steric hindrance caused by the soluble portion. Further, since the solubility in a solvent can be ensured, it is possible to make it difficult to become cloudy even if the addition amount of the surfactant is increased.

When the photosensitive resin composition is spin-coated, the photosensitive resin composition is dropped onto the substrate, and the substrate is rotated to be coated. When a conventional low molecular weight surfactant is used, it is possible to erase the striations, but since the liquid level of the photosensitive resin composition is generated at the end portion of the substrate, a protruding portion of the photosensitive resin composition is finally formed at the end portion .

That is, the coating uniformity and flatness are poor. In contrast, since the surfactant having a weight average molecular weight of 10,000 or more is used in the photosensitive resin composition of the present invention, it is possible to eliminate the protrusion of the end portion even in the spin application. Particularly, when the solid content concentration in the photosensitive resin composition is 30% by weight or more, there is a great effect in solving the protrusion of the end portion.

Further, in the case of coating with a slit coater, the solid content concentration of the photosensitive resin composition generally tends to be lowered. When the solid content concentration of the photosensitive resin composition is lowered, the film thickness of the applied photosensitive resin composition tends to become uneven because the flowability of the photosensitive resin composition becomes large. There is a step of drying the applied photosensitive resin composition. However, due to influence of surface tension, temperature, concentration change during drying and the like which are caused in the photosensitive resin composition once applied, liquid return from the end portion of the substrate to the central portion in the drying step The uniformity of the film thickness becomes easier to be deteriorated. Particularly, when a large substrate was used, the uniformity of the film thickness was large. In contrast, since the photosensitive resin composition according to the present invention uses a surfactant having a weight average molecular weight of 10,000 or more, the uniformity of the film thickness can be improved.

The content of the (C) surfactant is preferably 0.005 to 1 wt%, more preferably 0.01 to 0.5 wt%, and still more preferably 0.05 to 0.2 wt% with respect to the total amount of the photosensitive resin composition. When the amount is in the above-mentioned range, a photosensitive resin layer excellent in coating uniformity and flatness can be obtained. In addition, even when a color filter is manufactured, the occurrence of defects and pin marks can be reduced.

The photosensitive resin composition according to the present invention may contain other conventionally known surfactants as long as the effect of the present invention is not impaired.

&Lt; (D) Colorant >

The photosensitive resin composition according to the present invention may contain (D) a colorant. Examples of the colorant (D) include a compound classified as a pigment in a color index (CI, published by The Society of Dyers and Colourists), specifically, a color index (CI) number And the like. These coloring agents may be used alone or in combination of two or more in order to trim the color tone.

C.I. Pigment Yellow 1 (hereinafter the same shall apply to &quot; CI Pigment Yellow &quot;), 3,11,12,13,14,15,16,17,20,24,31,35,55,60 , 61, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, , 120, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, 185;

C.I. Pigment Orange 1 (hereinafter, "CI Pigment Orange" is the same and only the numbers are described below), 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51 , 55, 59, 61, 63, 64, 71, 73;

C.I. Pigment Violet 1 (hereinafter, "C.I. Pigment Violet" is the same and only the numbers are described below), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, 50;

C.I. 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16 (hereinafter the same shall apply to "CI Pigment Red" 48: 3, 48: 4, 49: 1, 49: 1, 48, : 2, 50: 1, 52: 1, 53: 1, 57, 57: 1, 57: 2, 58: 2, 58: 4, 60: 1, 63: : 1, 83, 88, 90: 1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149, 150, 151, 155, 166, 168 171, 172, 174, 175, 176, 177, 178, 179, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207, 208, 209, 215, 216, 217 , 220, 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, 265;

C.I. Pigment Blue 1 (hereinafter, "C.I. Pigment Blue" is the same and only the numbers are described), 2, 15, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66;

C.I. Pigment Green 7, C.I. Pigment Green 36, C.I. Pigment Green 37;

C.I. Pigment Brown 23, C.I. Pigment Brown 25, C.I. Pigment Brown 26, C.I. Pigment Brown 28;

C.I. Pigment Black 1, C.I. Pigment Black 7.

In addition, in the case of forming a black matrix in a liquid crystal display, a black pigment is used as the coloring agent (D).

As the black pigment, it is preferable to use carbon black or titanium black. In addition, Cu, Fe, Mn, Cr, Co, Ni, V, Zn, Se, Mg, Ca, Sr, Ba, Pd, Ag, Cd, In, Sn, Sb, Hg, Pb, And inorganic pigments such as various metal oxides, complex oxides, metal emulsions, metal sulfates and metal carbonates can also be used.

As the carbon black, known carbon blacks such as channel black, furnace black, thermal black and lamp black can be used, but channel black can be suitably used because it has excellent light shielding properties. Resin-coated carbon black may also be used. Concretely, resin-coated carbon black obtained by mixing carbon black and a resin having reactivity with a carboxyl group, hydroxyl group and carbonyl group present on the surface of the carbon black and heating the mixture at 50 to 380 ° C, a water- Resin-coated carbon black obtained by dispersing an ethylenic monomer in a surfactant mixed system and radical polymerization or radical copolymerization in the presence of a radical polymerization initiator. This resin-coated carbon black has a lower electrical conductivity than carbon black without resin coating, so that when used as a color filter of a liquid crystal display or the like, leakage of electric current is small and a display of low power consumption with high reliability is formed can do.

An organic pigment may be added to the inorganic black pigment as an auxiliary pigment. The following effects can be obtained by appropriately selecting and adding the complementary color of the inorganic black pigment to the organic pigment. For example, carbon black is reddish black. Therefore, when an organic pigment having a blue color, which is a complementary color of red as an auxiliary pigment, is added to carbon black, the red light of the carbon black disappears and the overall color is more preferable. The organic pigment is preferably 10 to 80 parts by weight, more preferably 20 to 60 parts by weight, and most preferably 20 to 40 parts by weight based on 100 parts by weight of the total of the inorganic black pigment and the organic pigment.

As the inorganic black pigment and the organic pigment, a solution in which a pigment is dispersed at an appropriate concentration using a dispersant is generally used. For example, as the inorganic black pigment, a carbon dispersion CF black (containing 20% carbon concentration) manufactured by Mikuni Color Co., a carbon dispersion CF black (containing 24% high resistance carbon) manufactured by Mikuni Color Co., Ltd., a titanium black dispersion CF Black (containing 20% of black titanium pigment), and the like. As the organic pigment, for example, blue pigment dispersion CF blue (containing 20% of blue pigment) manufactured by Mikuni Color Co., Ltd. and violet pigment dispersion (containing 10% of violet pigment) manufactured by Mikuni Color Co., As the dispersing agent, a urethane resin-based polymeric dispersing agent can be suitably used.

(D) a colorant, the content thereof is preferably 1 to 70 parts by weight, more preferably 20 to 60 parts by weight, per 100 parts by weight of the solid content of the photosensitive resin composition. By setting the content in the above range, the coloring performance of the formed color pattern can be improved and the pattern forming ability can be enhanced.

When a black pigment is used as the (D) coloring agent, it is preferable to adjust the OD value per 1 μm of the formed film to be 3.5 or more, preferably 4.0 or more. When the OD value per 1 mu m of the film thickness is 3.5 or more, sufficient display contrast can be obtained when used in a black matrix of a liquid crystal display, and necessary performance can be obtained.

Conventionally, in the photosensitive resin composition containing such a colorant, a dispersing agent having a structure similar to that of the surfactant is contained. Therefore, a sufficient leveling effect can not be obtained even when the surfactant is added due to the influence of the dispersing agent. On the other hand, since the surfactant (C) has a high leveling effect, a photosensitive resin layer excellent in coating uniformity and flatness can be obtained even when a colorant is contained in the photosensitive resin composition.

<(S) Solvent>

The photosensitive resin composition according to the present invention preferably contains (S) solvent for dilution. Examples of the (S) solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether Diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono propyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono- (Poly) alkylene glycol monoalkyl (meth) acrylate such as propylene glycol monomethyl ether, tripropylene glycol monoethyl ether, Ethers; (Poly) alkylene ethers such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate. Glycol monoalkyl ether acetates; Other ethers such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether and tetrahydrofuran; Ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone and 3-heptanone; Lactic acid alkyl esters such as methyl 2-hydroxypropionate and ethyl 2-hydroxypropionate; Methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, ethyl acetate, n-propyl acetate, isopropyl acetate, Butyl acetate, n-propyl butyrate, isopropyl butyrate, n-butyl butyric acid, methyl pyruvate, ethyl pyruvate, isobutyrate, isobutyrate, isobutyrate, isobutyrate, Other esters such as n-propyl pyruvate, methyl acetoacetate, ethyl acetoacetate and ethyl 2-oxobutanoate; Aromatic hydrocarbons such as benzene, toluene and xylene; And amides such as N-methylpyrrolidone, N, N-dimethylformamide and N, N-dimethylacetamide. Among them, it is preferable to use at least one of cyclohexanone and propylene glycol monomethyl ether acetate. These solvents may be used alone or in combination of two or more.

(S) solvent, the content thereof is preferably such that the solid content of the photosensitive resin composition is 1 to 50% by weight, more preferably 5 to 30% by weight.

&Lt; Preparation method of photosensitive resin composition >

The photosensitive resin composition according to the present invention can be obtained by mixing all of the above-mentioned components and additives, if necessary, in an agitator. Filtration may be performed using a filter so that the resulting mixture becomes uniform.

«Pattern formation method»

In the case of forming a resin pattern using the photosensitive resin composition according to the present invention, first, a contact transfer type coating device such as a roll coater, a reverse coater, a bar coater, or a noncontact type of a spinner (rotary coating device), a slit coater, The photosensitive resin composition according to the present invention is applied onto a substrate made of glass, polyethylene terephthalate, acrylic resin, polycarbonate, or the like.

Subsequently, the applied photosensitive resin composition is dried to form a photosensitive resin layer. The drying method includes, for example, a method of drying under reduced pressure at room temperature using a vacuum drying apparatus (VCD), and then drying in a hot plate at 80 to 120 캜, preferably 90 to 100 캜 for 60 to 120 seconds And the like.

Subsequently, the photosensitive resin layer is irradiated with active energy rays such as ultraviolet rays and excimer laser beams through a mask to partially expose the photosensitive resin layer. The amount of energy to be irradiated varies depending on the composition of the photosensitive resin composition, but is preferably 30 to 2,000 mJ / cm 2.

Subsequently, the exposed photosensitive resin layer is developed with a developing solution to obtain a resin pattern having a desired shape. Examples of the developing method include a dipping method and a spraying method. Examples of the developing solution include organic ones such as monoethanolamine, diethanolamine and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia and quaternary ammonium salts.

Then, the developed resin pattern is heated (post-baked) at, for example, 220 to 250 占 폚. When the applied photosensitive resin composition is of a negative type, it is preferable that the resin pattern formed at this time is exposed to the whole surface. Thus, a resin pattern having a predetermined shape can be obtained.

«Color filter»

The color filter according to the present invention has a pattern formed by using the photosensitive resin composition according to the present invention. In order to produce this color filter, first, a resin pattern is formed using the photosensitive resin composition in which the black pigment is dispersed in accordance with the pattern formation method described above. This resin pattern becomes a black matrix. Then, the same pattern formation is performed on the photosensitive resin composition in which the red, green, and blue coloring agents are dispersed to form a pixel pattern of each color. Thereby, a color filter is produced.

In the production of a color filter, it is also possible to manufacture a color filter by discharging ink of each color of red, green, and blue from each inkjet nozzle and curing the ink with heat or light in each region partitioned by the black matrix have.

When a color filter is produced by using a photosensitive resin composition containing a conventional colorant, a flat photosensitive resin layer can not be obtained by the dispersant contained in the photosensitive resin composition. Particularly, when the content of the colorant is large, the flowability of the photosensitive resin composition is lowered, and the uniformity and flatness of the coating of the photosensitive resin layer are worse. Further, in the case of manufacturing a color filter, when the photosensitive resin layer is vacuum-dried, defects (defects) are generated in the photosensitive resin layer, or when the heat treatment is applied, the trailing edge of the proxy pin There was a thing left in the strata. On the other hand, according to the photosensitive resin composition of the present invention, even when a colorant is contained, a photosensitive resin layer excellent in coating uniformity and flatness can be obtained, and occurrence of defects and pin marks can be reduced.

«LCD display»

The liquid crystal display according to the present invention has a color filter according to the present invention. In order to manufacture the liquid crystal display, the color filter is first formed on one of the substrates, and electrodes, spacers, and the like are sequentially formed. Then, an electrode or the like is formed on the other substrate, and a predetermined amount of liquid crystal is injected and sealed after both the substrates are bonded. Thereby, a liquid crystal display is manufactured.

Since the photosensitive resin composition according to the present invention has high leveling property, a photosensitive resin layer excellent in coating uniformity and flatness can be obtained even when a colorant is contained. In addition, even when a color filter of a liquid crystal display is manufactured, the occurrence of defects and pin marks in the photosensitive resin layer can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining the speckle width in the embodiment of the present invention. Fig.

Hereinafter, the present invention will be described in detail with reference to examples. The present invention is not limited to the following examples.

&Lt; Examples 1 to 7 and Comparative Examples 1 to 10 >

[(A) Synthesis of alkali-soluble resin]

First, 235 g of a bisphenol fluorene epoxy resin (epoxy equivalent 235), 110 mg of tetramethylammonium chloride, 100 mg of 2,6-di-tert-butyl-4-methylphenol and 72.0 g of acrylic acid were placed in a 500- And the mixture was heated and dissolved at 90 to 100 ° C while blowing air at a rate of 25 ml / min. Then, the solution was gradually heated up to a cloudy state, and heated to 120 DEG C to completely dissolve the solution. At this time, the solution gradually became a transparent point group, but stirring was continued. The acid value was measured, and heating and stirring were continued until it was less than 1.0 mg KOH / g. The acid value required 12 hours to reach the target value. Then, the mixture was cooled to room temperature to obtain bisphenol fluorene-type epoxy acrylate which was colorless transparent and solid phase represented by the following formula (a4).

[Figure 5]

Subsequently, 600 g of 3-methoxybutyl acetate was added to 307.0 g of the bisphenol fluorene-type epoxy acrylate thus obtained and dissolved. Then, 80.5 g of benzophenonetetracarboxylic dianhydride and 1 g of tetraethylammonium bromide were mixed , The temperature was gradually raised, and the reaction was carried out at 110 to 115 DEG C for 4 hours. After disappearance of the acid anhydride group was confirmed, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed and reacted at 90 DEG C for 6 hours to obtain a resin (A-1). The disappearance of the acid anhydride group was confirmed by IR spectrum. The weight average molecular weight was 3,400.

[Preparation of Photosensitive Resin Composition]

(S) solvent was added to the alkali-soluble resin (A), the photopolymerizable monomer (E), the surfactant (C) and the colorant (D) 17% by weight, mixed in an agitator for 2 hours, and then filtered through a 5 탆 membrane filter to prepare a photosensitive resin composition. The amount of each component in Table 1 is &quot; parts by weight &quot;.

[Table 1]

Details of the (A) alkali-soluble resin, (B) photosensitive agent, (D) colorant and (S) organic solvent used in Table 1 are as follows.

(A) -1: 3-methoxybutyl acetate was added to the resin (A-1) to prepare a preparation liquid adjusted to a solid concentration of 50% by weight

(E) -1: dipentaerythritol hexaacrylate

(B) -1: IRGACURE OXE 02 (manufactured by Ciba Specialty Chemicals)

(B) -2: IRGACURE 369 (manufactured by Ciba Specialty Chemicals)

(D) -1: carbon black (manufactured by Mikuni Color, carbon concentration: 55%, solvent: 3-methoxybutyl acetate)

(S) -1: 3-methoxybutyl acetate / cyclohexanone / propylene glycol monomethyl ether acetate = 60/20/20 (weight ratio)

Details of the surfactant (C) used in Table 1 are as shown in Table 2 below. In Table 2, the numbers in parentheses in the copolymers of (C4) -1 to (C4) -9 represent the ratio of the amounts of the respective monomers supplied when the total amount of monomers in synthesizing the copolymer is 100 parts by weight. In addition, (C8) -1 and Si-1 are manufactured by Kyowa Chemical Industry Co., Ltd.

[Table 2]

<Evaluation>

[Stain width evaluation]

Each of the photosensitive resin compositions of Examples 1 to 7 and Comparative Examples 1 to 10 obtained above was coated on a 100 mm x 100 mm glass substrate (1737 glass) using a spin coater (manufactured by MIKASA Co., Ltd.) Placed on a 5 mm wide glass piece, and prebaked at 90 DEG C for 120 seconds. The spot width at that time was measured using a surface roughness tester SurfCoder SE-2300 (manufactured by Kosaka Laboratory Co., Ltd.). The results are shown in Table 1.

In addition, the spot width is measured as the spot width (nm) by measuring the spot shown in FIG. Convection occurs from the heated place to repel the photosensitive resin composition, since the heat is transferred only from the glass piece to the glass substrate, and this repulsion becomes a bead. The smaller the bounce-off, that is, the smaller the portion where the film thickness becomes extremely thin, the better the coating uniformity and flatness are.

[Pin Mark Evaluation]

The photosensitive resin compositions of Examples 1 to 7 and Comparative Examples 1 to 10 obtained above were coated on a glass substrate of 680 mm x 880 mm using a spin coating apparatus TR-45310 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) And prebaked at 120 DEG C for 100 seconds to obtain a photosensitive resin layer having a film thickness of 1.3 mu m. The pin mark of the surface of the photosensitive resin layer was evaluated for this photosensitive resin layer using "AOI" (manufactured by TAKANO). The evaluation criteria are as follows, and the results are given in Table 1.

◎: No pin marks

○: Thin pin marks are visible, but no problem level

△: Pin marks are small.

X: Many pin marks are seen

As can be seen from Table 1, in Examples 1 to 7 using specific surfactants, a photosensitive resin layer excellent in coating uniformity and flatness was obtained even in the case of containing a colorant. No pin marks were found on the surface. On the other hand, in Comparative Examples 1 to 10 using other surfactants, the spot width was large, and coating uniformity and flatness were poor. In addition, pin marks remained on the surface.

[Evaluation of high-speed coating performance]

The photosensitive resin composition A in which the solid content concentration was changed from 15 wt% to 12 wt% in Comparative Example 1 and the photosensitive resin composition B in Comparative Example 1 and the photosensitive resin composition of Example 2, (B) was changed to 10 parts by weight of (B) -1 alone, (D) the amount of the (D) alkali-soluble resin was changed to 20 parts by weight, (E) the amount of photopolymerizable monomer was changed to 8 parts by weight, ) Was changed to 120 parts by weight, and the organic solvent was changed to 3 parts by weight of 12% by weight of a solid content concentration by changing 3-methoxybutyl acetate / cyclohexanone / propylene glycol monomethyl ether acetate = 65/25/10 (weight ratio) To prepare a photosensitive resin composition C, respectively. These photosensitive resin compositions A to C were coated at a high speed (coating speed: 250 nm / sec, coated GAP (coated)) on a 2160 mm x 2460 mm glass substrate (0.7 mm thick) using a non-spin type coating device TR130200FC (manufactured by Tokyo Ohka Kogyo Co., : 130 占 퐉), and then dried under reduced pressure at 13 Pa for 10 seconds to obtain a photosensitive resin layer. As a result, liquid breakage occurred in the photosensitive resin composition A, and high-speed coating could not be performed. In the photosensitive resin composition B, high-speed coating could be performed, but the photosensitive resin layer was waving (liquid return width of 3 to 4 mm) due to the occurrence of liquid return immediately after the application. On the other hand, in the photosensitive resin composition C, there was no liquid return after high-speed coating and the coating property was good.

[Evaluation of film thickness uniformity]

The film thickness uniformity of the substrate after coating was evaluated using a film thickness measuring device MCPD (manufactured by Otsuka Electronics Co., Ltd.). Further, the photosensitive resin composition A could not be evaluated because it could not be coated at a high speed. In addition, the photosensitive resin composition B was severely subjected to liquid return and was impossible to evaluate. On the other hand, the photosensitive resin composition C had a small film thickness nonuniformity in the plane and was a good result.

Claims (1)

1. A photosensitive resin composition comprising (A) a resin component, (B) a photosensitizer, and (C) a surfactant,
(C) the surfactant is a fluorinated alkyl group having 1 to 20 carbon atoms (provided that it may be interrupted by an ether bond, an ester bond, a carbonyl group or a urethane bond) and a side chain having a proton group at a side chain and a weight average molecular weight of 10,000 to 50,000 Of the total weight of the photosensitive resin composition.

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