KR20170132639A - Composition for encapsulating organic light emitting device and organic light emitting display using prepared the same - Google Patents

Abstract

The present invention relates to a composition for encapsulating an organic light emitting device which comprises (A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, (C) a non-silicon-based photocurable monofunctional monomer, and (D) an initiator, wherein the (A) silicone-based photocurable monofunctional monomer is represented by chemical formula 1; and to the organic light emitting display prepared therefrom.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for encapsulating an organic light emitting device and an organic light emitting diode (OLED)

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composition for encapsulating an organic light emitting device and an organic light emitting diode display device manufactured therefrom.

An organic light emitting diode display is a display device that emits light by using electroluminescence, and includes an organic light emitting diode. When the organic light emitting device is in contact with external moisture and / or oxygen, the light emitting property may be deteriorated. The organic light emitting element should be sealed with a sealing composition. The organic light emitting device is encapsulated in a multi-layered structure including an inorganic barrier layer and an organic barrier layer. The organic barrier layer may be etched by a process of forming the inorganic barrier layer by plasma deposition. In this case, the organic barrier layer may be impaired in the sealing function by etching. As a result, the organic luminescent device may have poor luminescent characteristics and poor reliability. 2. Description of the Related Art In recent years, a flexible organic light emitting diode display device having flexibility capable of folding and unfolding has been developed, replacing a glass substrate or a hardened substrate with a film in a display device. Therefore, the organic barrier layer should also have flexibility due to its low modulus.

The background art of the present invention is disclosed in Korean Patent Publication No. 2011-0071039.

An object of the present invention is to provide a composition for encapsulating an organic light emitting device which can realize an organic barrier layer having excellent plasma resistance and can improve the reliability of an organic light emitting device.

Another object of the present invention is to provide a composition for encapsulating an organic light emitting device which can realize an organic barrier layer having a high light transmittance and a high photo-curability.

It is still another object of the present invention to provide a composition for encapsulating an organic light emitting device that can be used in a flexible organic light emitting display device by realizing an organic barrier layer having a low modulus after curing.

It is still another object of the present invention to provide a composition for encapsulating an organic light emitting device which is easy to form an organic barrier layer by a method such as vapor deposition or ink jet.

The composition for encapsulating an organic luminescent element of the present invention comprises (A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, (C) a non-silicon-based photocurable monofunctional monomer, and (D) The silicone-based photocurable monofunctional monomer (A) may be represented by the following formula (1): < EMI ID =

≪ Formula 1 >

X ₁ , X ₂ , X ₃ , Y, Z and m are as defined in the detailed description of the present invention.

The organic electroluminescent display device of the present invention includes an organic light emitting device and a barrier stack formed on the organic light emitting device and including an inorganic barrier layer and an organic barrier layer, And the like.

The present invention provides a composition for encapsulating an organic light emitting device capable of realizing an organic barrier layer having plasma resistance. This improves the reliability of the organic light emitting device.

The present invention provides a composition for encapsulating an organic luminescent element having a high photo-curability. Through this, the organic barrier layer has improved light transmittance.

The present invention provides a composition for encapsulating an organic light emitting device that can be used in a flexible organic light emitting display device by implementing an organic barrier layer having a low curing modulus.

The present invention also provides a composition for encapsulating an organic light emitting device, which can easily form an organic barrier layer by a method such as vapor deposition or ink jet printing.

1 is a cross-sectional view of an OLED display device according to an embodiment of the present invention.
2 is a cross-sectional view of an OLED display device according to another embodiment of the present invention.

The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

As used herein, "(meth) acrylic" means acrylic and / or methacrylic.

As used herein, "substituted" means that at least one hydrogen atom of the functional group is replaced by a halogen (e.g. F, Cl, Br or I), a hydroxy group, a nitro group, a cyano group, , = NR, R is C1 to C10 alkyl groups), amino groups _{(-NH 2, -NH (R '} ), -N (R ") (R"'), wherein R ', R ", R"' are each A C1 to C30 alkyl group, a C6 to C30 aryl group, a C3 to C30 cycloalkyl group, a C3 to C30 heteroaryl group, a C3 to C30 heteroaryl group, a C3 to C30 heteroaryl group, Or a C2 to C30 heterocycloalkyl group.

As used herein, the term " aryl group "means a functional group in which all the elements of the substituent which is cyclic are p-orbital, and these p-orbital forms a conjugation. The aryl group includes monocyclic, non-fused polycyclic or fused polycyclic functional groups. In this case, fusion refers to a ring shape in which carbon atoms divide adjacent pairs. The aryl group also includes a biphenyl group, a terphenyl group, or a quarter-phenyl group in which two or more aryl groups are connected through a sigma bond. The aryl group may mean a phenyl group, a naphthyl group, an anthracenyl group, a phenanthrenyl group, a pyrenyl group, a chrysenyl group, or the like.

The term " heteroaryl group "as used herein means a functional group containing 1 to 3 hetero atoms selected from the group consisting of N, O, S, P and Si in the aryl group and the remainder carbon. Heteroaryl groups also include those wherein two or more heteroaryl groups are linked directly via a sigma bond. The heteroaryl group also includes two or more heteroaryl groups fused together. When a heteroaryl group is fused, each ring may contain 1 to 3 of said heteroatoms. The heteroaryl group may be, for example, a pyridinyl group, a pyrimidinyl group, a pyrazinyl group, a pyridazinyl group, a triazinyl group, a quinolinyl group, an isoquinolinyl group or the like. More specifically, the C6 to C30 aryl group and / or the C3 to C30 heteroaryl group may be substituted or unsubstituted phenyl group, substituted or unsubstituted naphthyl group, substituted or unsubstituted anthracenyl group, substituted or unsubstituted phenanthryl group A substituted or unsubstituted naphthacenyl group, a substituted or unsubstituted pyrenyl group, a substituted or unsubstituted biphenyl group, a substituted or unsubstituted p-terphenyl group, a substituted or unsubstituted m-terphenyl group, a substituted or unsubstituted pyrazinyl group, A substituted or unsubstituted thienyl group, a substituted or unsubstituted thienyl group, a substituted or unsubstituted thienyl group, a substituted or unsubstituted thienyl group, a substituted or unsubstituted thienyl group, a substituted or unsubstituted thienyl group, A substituted or unsubstituted thiazolyl group, a substituted or unsubstituted oxazolyl group, a substituted or unsubstituted pyrazolyl group, a substituted or unsubstituted imidazolyl group, a substituted or unsubstituted thiazolyl group, a substituted or unsubstituted oxazolyl group, A substituted or unsubstituted thiadiazolyl group, a substituted or unsubstituted pyridyl group, a substituted or unsubstituted pyrimidinyl group, a substituted or unsubstituted pyrazinyl group, a substituted or unsubstituted pyrazinyl group, a substituted or unsubstituted pyrazinyl group, a substituted or unsubstituted pyrazinyl group, A substituted or unsubstituted thiazolyl group, a substituted or unsubstituted benzofuranyl group, a substituted or unsubstituted benzothiophenyl group, a substituted or unsubstituted benzimidazolyl group, a substituted or unsubstituted indolyl group, a substituted or unsubstituted quinoline group, Substituted or unsubstituted quinoxalinyl groups, substituted or unsubstituted quinoxalinyl groups, substituted or unsubstituted naphthyridinyl groups, substituted or unsubstituted benzoxazinyl groups, substituted or unsubstituted quinoxalinyl groups, substituted or unsubstituted quinazolinyl groups, substituted or unsubstituted quinazolinyl groups, substituted or unsubstituted naphthyridinyl groups, A substituted or unsubstituted benzothiazyl group, a substituted or unsubstituted acridinyl group, a substituted or unsubstituted phenazinyl group, a substituted or unsubstituted phenothiazine group, a substituted or unsubstituted pyrazine group, A substituted or unsubstituted dibenzofuranyl group, a substituted or unsubstituted dibenzothiophenylene group, or a combination thereof, but is not limited thereto.

In the present specification, "composition for encapsulating an organic luminescent element" may be referred to as "encapsulating composition ".

In the present specification, the term " etching rate of organic barrier layer by plasma "or" plasma etching rate "means the initial height (T1, unit: μm) of the organic barrier layer formed by vapor- (ICP) power: 2500 W, RF (radio frequency) power: 300 W, DC bias: 200 V, Ar flow: 50 sccm, and an etching time: (T2, unit: 占 퐉) of the organic barrier layer after plasma treatment at 1 minute, pressure: 10 mtorr, and calculated by the following formula (2). At this time, the initial height (T1) of the organic barrier layer may be 1 탆 to 10 탆. The lower the value calculated by the formula (2), the better the plasma resistance of the organic barrier layer.

<Formula 2>

Etching rate (%) of organic barrier layer by plasma = (T1-T2) / T1 x 100

Hereinafter, a composition for encapsulating an organic light emitting diode according to an embodiment of the present invention will be described.

The composition for encapsulating an organic luminescent element according to an embodiment of the present invention comprises (A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, (C) a non-silicon-based photocurable monofunctional monomer, and (D) (A) a silicone-based photo-curable monofunctional monomer can be represented by the following formula (1):

&Lt; Formula 1 >

(X ₁ , X ₂ , X ₃ , Y, Z and m in the formula (1)

Accordingly, the composition for encapsulating an organic luminescent element of the present embodiment can realize an organic barrier layer having a high light curing rate, a high light transmittance after curing, and a remarkably high plasma resistance. Accordingly, the composition for encapsulating an organic light emitting diode according to an embodiment of the present invention can realize an organic barrier layer having a low etching rate due to a plasma used in formation of an inorganic barrier layer, and as a result, reliability of the organic light emitting device can be improved. Specifically, the composition for encapsulating an organic luminescent element in one embodiment of the present invention has a light curing rate of 85% or more, for example, 88% to 99%, a light transmittance of 93% or more, for example, 93.5% or more at a wavelength of 380 nm to 800 nm after curing, To 100%. In addition, the composition for encapsulating an organic light emitting diode according to an embodiment of the present invention may have an etching rate of the organic barrier layer by plasma after curing of 10% or less, for example, 8.0% or less, for example, 0.10% to 7.5%. In the range of the light curing rate, the light transmittance and the etching rate of the organic barrier layer by plasma, the sealing composition of one embodiment of the present invention can remarkably increase the reliability of the organic light emitting device.

In one embodiment, the composition for encapsulating an organic luminescent element in one embodiment of the present invention comprises (A) 5 parts by weight of a silicone-based photo-curable monofunctional monomer (A), (B) 10 to 60% by weight of (B) a photo-curable polyfunctional monomer, (C) 5 to 40% % &Lt; / RTI &gt; by weight. In this range, the photo-curability and the light transmittance are remarkably improved, the etching rate of the organic barrier layer by the plasma can be remarkably lowered, and the modulus of the organic barrier layer is remarkably low and the organic barrier layer of the flexible organic light- Can be used. The composition for encapsulating an organic luminescent element in one embodiment of the present invention may have a modulus of 6.5 GPa or less after curing, specifically 0.1 GPa to 6.5 GPa. In this range, flexibility is good and can be used in a flexible organic light emitting diode display device. As used herein, "modulus" is the elastic modulus (Young's modulus).

In the present specification, the silicone-based photo-curable monofunctional monomer, (B) the photo-curable polyfunctional monomer, (C) the non-silicon-based photo-curable monofunctional monomer and (D) the initiator are different compounds, Or more. Hereinafter, (A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, (C) a non-silicon-based photocurable monofunctional monomer, and (D) an initiator will be described in detail.

(A) Photocurable Single sensory  Monomer

(A) The silicone-based photocurable monofunctional monomer includes at least one substituted or unsubstituted C6 to C30 aryl group or a substituted or unsubstituted C7 to C30 arylalkyl group connected to a silicon atom. As a result, the composition for encapsulating an organic light emitting diode has an extremely high resistance to plasma, thereby realizing an organic barrier layer having a low plasma etching rate. More specifically, (A) the silicone-based photo-curable monofunctional monomer comprises two or more substituted or unsubstituted C6 to C30 aryl groups or substituted or unsubstituted C7 to C30 arylalkyl groups connected to the silicon atom, The resistance to plasma is remarkably high, so that the plasma etching rate may be lowered.

(A) The silicone-based photocurable monofunctional monomer may be represented by the following general formula (1).

&Lt; Formula 1 >

(In the formula 1,

X ₁ , X ₂ and X ₃ each independently represent a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C1 to C20 alkyl ether group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted Or a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C3 to C30 heteroaryl group, a substituted or unsubstituted C7 to C20 arylalkyl group, a substituted or unsubstituted C1 to C20 monoalkylamine group, A dialkylamine group or a substituted or unsubstituted C1 to C20 alkylsulfide group, or hydrogen,

At least one of X ₁ , X ₂ and X ₃ is a substituted or unsubstituted C6 to C30 aryl group or a substituted or unsubstituted C7 to C20 arylalkyl group,

Y is a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C7 to C20 arylalkyl Or a substituted or unsubstituted C1 to C20 monoalkylamino group,

Z is hydrogen or a methyl group,

and m is an integer of 0 or 1).

Specifically, in Formula 1, X ₁ , X _2, and X ₃ are each independently a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C6 to C12 aryl group, or a substituted or unsubstituted Or an arylalkyl group of C7 to C15.

Y may be a substituted or unsubstituted C1 to C10 alkylene group, specifically a substituted or unsubstituted C1 to C5 alkylene group. More specifically, the silicone-based photo-curable monofunctional monomer (A) may be represented by any one of the following formulas (1-1) and (1-2)

&Lt; Formula 1-1 >

(1-2)

(A) The silicone-based photocurable monofunctional monomer is used in an amount of 5 wt% to 50 wt%, for example, 15 wt% to 30 wt% based on the total weight of (A), (B), (C) . Within the above-mentioned range, the photo-curability and the light transmittance are remarkably improved, the etching rate of the organic barrier layer by plasma can be remarkably lowered, and the modulus of the organic barrier layer is remarkably low, It can be used as a barrier layer.

(A) The silicone-based photocurable monofunctional monomer can be synthesized by a commercially available product or by a conventional method.

Based photocurable monofunctional monomer and (C) the non-silicon-based photocurable monofunctional monomer is 10% by weight or more based on the total weight of (A), (B), (C) 60% by weight. Specifically, the organic barrier layer may include 20 wt% to 50 wt% and 30 wt% to 50 wt%. In this range, an organic barrier layer having a low plasma etching rate can be realized, and a low modulus after curing can be used for a flexible display device , The compatibility of the composition for encapsulating an organic light emitting element may be better.

(B) Photocurable Multifunctional  Monomer

(B) Photocurable multifunctional monomers are photocurable monomers having two photocurable functional groups. In this specification, the photocurable functional group may be a (meth) acrylate group or a vinyl group. (B) The photocurable multifunctional monomer may be a non-silicon photocurable monomer containing no silicon (Si). (B) The photocurable multifunctional monomer can increase the photo-curability and the light transmittance after curing of the sealing composition. Also, (B) the photo-curable multifunctional monomer has a low viscosity at 25 占 폚, so that the viscosity of the bag composition can be lowered. Thus, the sealing composition can easily form an organic barrier layer on the inorganic barrier layer that encapsulates the organic light emitting device or the organic light emitting device by an ink jet method or the like.

(B) The photocurable multifunctional monomer may be a non-aromatic system containing no aromatic group, and may include non-silicon di (meth) acrylate containing a substituted or unsubstituted long chain alkylene group. In this case, the sealing composition is easy to form an organic barrier layer on the inorganic barrier layer that encapsulates the organic light-emitting device or the organic light-emitting device by a method such as vapor deposition.

Specifically, (B) the photocurable multifunctional monomer may be a di (meth) acrylate having a substituted or unsubstituted C1 to C20 alkylene group. More specifically, (B) the photocurable multifunctional monomer may include a di (meth) acrylate having an unsubstituted C1 to C15 alkylene group between the (meth) acrylate groups. Here, the number of carbon atoms in the alkylene group means only the number of carbon atoms in the alkylene group itself excluding the carbon in the di (meth) acrylate group. In one embodiment, (B) the photo-curable multifunctional monomer can be represented by the formula (2)

(2)

(In the formula (2)

R ₁ is a substituted or unsubstituted C1 to C20 alkylene group,

R ₂ and R ₃ are each independently hydrogen or a methyl group.

The composition for encapsulating an organic luminescent element of the present invention can further increase the photo-curability and the evaporation due to the low viscosity by including the photocurable multifunctional monomer (B) represented by the general formula (2). For example, in Formula 2, R ₁ may be an unsubstituted C6 to C12 alkylene group. More specifically, (B) the photocurable multifunctional monomer may be selected from the group consisting of hexanediol di (meth) acrylate, octanediol di (meth) acrylate, nonanediol di (meth) acrylate, decanediol di (Meth) acrylate, dodecanediol (meth) acrylate, and the like.

(B) the photocurable multifunctional monomer is present in an amount of 10 wt% to 60 wt%, specifically 10 wt% to 50 wt%, and 20 wt%, based on the total weight of (A), (B), (C) % To 50 wt%, and 30 wt% to 50 wt%. In this range, the photo-curability and the light transmittance are remarkably improved, the etching rate of the organic barrier layer by the plasma can be remarkably lowered, and the modulus of the organic barrier layer is remarkably low and the organic barrier layer of the flexible organic light- Can be used.

(C) non-silicon based Photocurable Single sensory  Monomer

(C) The non-silicon photocurable monofunctional monomer is included in the composition for encapsulating an organic light emitting element to increase the photo-curability of the sealing composition, increase the light transmittance of the organic barrier layer, lower the plasma etching rate, After modulus can also be lowered. (C) The non-silicone photocurable monofunctional monomer may comprise a non-silicone monofunctional monomer that does not contain silicon and has one photocurable functional group. (C) The non-silicone photocurable monofunctional monomer may include at least one of an aromatic mono (meth) acrylate having an aromatic group and a non-aromatic mono (meth) acrylate having no aromatic group.

In one embodiment, (C) the non-silicone photocurable monofunctional monomer may comprise a mono (meth) acrylate having an aromatic group. The mono (meth) acrylate having an aromatic group and the above-mentioned (A) silicon-based photo-curable monofunctional monomer have aromatic groups, and when they are used together, they are particularly excellent in compatibility in a composition for encapsulating an organic light emitting device. Accordingly, the non-silicon photocurable monofunctional monomer (C) can further improve the miscibility with the above-mentioned (A) silicon-based photocurable monofunctional monomer. In this case, the sealing composition may be more effective in significantly lowering the plasma etching rate of the organic barrier layer.

The aromatic mono (meth) acrylate may include a mono (meth) acrylate having a substituted or unsubstituted aromatic group. The 'aromatic group' may include monocyclic or fused forms, and the like. Means a polycyclic aromatic group, or a form in which a single ring is connected by a sigma bond. For example, the aromatic group may be a substituted or unsubstituted C6 to C50 aryl group, a substituted or unsubstituted C7 to C50 arylalkyl group, a substituted or unsubstituted C3 to C50 heteroaryl group, a substituted or unsubstituted C3 to C50 heteroaryl group, C50 &lt; / RTI &gt; heteroaryl &lt; RTI ID = 0.0 &gt; alkyl &lt; / RTI &gt; More specifically, the aromatic group is selected from the group consisting of phenyl, biphenyl, terphenyl, quaterphenyl, naphthyl, anthracenyl, phenanthrenyl, chrysenyl, triphenylenyl, tetracenyl, pyrenyl, benzopyranyl, pentacenyl, , Ovalenyl, coranprenyl, benzyl, pyridinyl, pyrazinyl, pyrimidinyl, pyridazinyl, triazinyl, quinolinyl, isoquinolinyl, quinoxalinyl, acridinyl, quinazolinyl, Thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, pyrazolyl, indazolyl, imidazolyl, benzimidazolyl, furidinyl, thiophenyl, Benzothiophenyl, furanyl, benzofuranyl, isobenzofuranyl. &Lt; / RTI &gt; For example, the aromatic mono (meth) acrylate can be represented by the following formula:

(3)

(3)

R ₃ is hydrogen or a methyl group,

s is an integer from 0 to 10,

R ₆ is a substituted or unsubstituted C6 to C50 aryl group or a substituted or unsubstituted C6 to C50 aryloxy group.

In an embodiment of the present invention, R ₆ is a substituted or unsubstituted C6 to C30 aryl group or a substituted or unsubstituted C6 to C30 aryloxy group. For example, R ₆ may be a substituted or unsubstituted phenyl group, biphenyl group, naphthyl group, terphenyl group, triphenylene group, anthracenyl group, phenanthrenyl group, or oxy group thereof.

For example, R ₆ may be a phenylphenoxy group, a phenoxyethyl group, a benzyl group, a phenyl group, a phenylphenoxy group, a phenoxy group, a phenylethyl group, a phenylpropyl group, a phenylbutyl group, a methylphenylethyl group, a propylphenylethyl group, , A cyclohexylphenylethyl group, a chlorophenylethyl group, a bromophenylethyl group, a methylphenyl group, a methylethylphenyl group, a methoxyphenyl group, a propylphenyl group, a cyclohexylphenyl group, a chlorophenyl group, a bromophenyl group, a phenylphenyl group, a biphenyl group, a terphenyl ), A quaterphenyl group, an anthracenyl group, a naphthalene group, a triphenylenyl group, a methylphenoxy group, an ethylphenoxy group, a methylethylphenoxy group, a methoxyphenyloxy group, a propylphenoxy group, a cyclohexyl A phenoxy group, a chlorophenoxy group, a bromophenoxy group, a biphenyloxy group, a terphenyloxy group, a quaterphenyloxy group, an anthracenyloxy group, a naphthalenyloxy group (na phthalenyloxy group, and triphenylenyloxy group.

Specific examples of the aromatic mono (meth) acrylate include 2-phenylphenoxyethyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenyl (meth) acrylate, phenoxy (meth) (Meth) acrylate, benzyl (meth) acrylate, 2-phenylethyl (meth) acrylate, 3-phenylpropyl (meth) (Meth) acrylate, 2- (4-methylphenyl) ethyl (meth) acrylate, 2- (Meth) acrylate, 2- (4-cyclohexylphenyl) ethyl (meth) acrylate, 2- (Meth) acrylate, 2- (4-chlorophenyl) ethyl (meth) acrylate, 2- Acrylate, 2- (3-phenylphenyl) ethyl (meth) acrylate, 4- (biphenyl-2- yloxy) butyl (meth) (Meth) acrylate, 1- (biphenyl-2-yloxy) butyl (meth) acrylate, 2- (Meth) acrylate, 2- (biphenyl-2-yloxy) propyl (meth) acrylate, 3- (Meth) acrylate, 3- (biphenyl-2-yloxy) ethyl (meth) acrylate, (Meth) acrylate, 2- (biphenyl-2-yloxy) ethyl (meth) acrylate, 1- (Meth) acrylate, 1- (4-benzylphenyl) ethyl (meth) acrylate, or a structural isomer thereof But is not limited thereto. In other words, the (meth) acrylate mentioned in the present invention is not limited to only one example, and the present invention includes all the acrylates having the structural isomerism. For example, although only 2-phenylethyl (meth) acrylate is mentioned as an example of the present invention, the present invention includes all of 3-phenylethyl (meth) acrylate and 4-phenyl (meth) acrylate.

The non-aromatic mono (meth) acrylate may be a mono (meth) acrylate having a substituted or unsubstituted C1 to C20 alkyl group. Specifically, the non-aromatic mono (meth) acrylate is a mono (meth) acrylate having an unsubstituted straight-chain C1 to C20 alkyl group, more specifically an unsubstituted straight-chain C10 to C20 alkyl group (Meth) acrylate. For example, the non-aromatic mono (meth) acrylate is selected from the group consisting of decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, (Meth) acrylate, nonadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, Rate, but is not limited thereto.

(C) The non-silicon photocurable monofunctional monomer is present in an amount of from 5 wt% to 40 wt%, for example from 10 wt% to 40 wt%, based on the total weight of (A), (B), (C) &Lt; / RTI &gt; In this range, the photo-curing rate and the light transmittance are remarkably improved, the etching rate of the organic barrier layer by plasma can be remarkably lowered, and the modulus of the organic barrier layer is remarkably low, so that the organic barrier layer of the flexible organic light- .

In one embodiment of the present invention, the photocurable polyfunctional monomer (B) is a di (meth) acrylate having an unsubstituted C6 to C12 alkylene group, and the non-silicon photocurable monofunctional monomer (C) 3,

(3)

(3)

R ₃ is hydrogen or a methyl group,

s is an integer from 0 to 10,

R ₆ is a substituted or unsubstituted C6 to C50 aryl group or a substituted or unsubstituted C6 to C50 aryloxy group),

And the initiator (D) comprises a phosphorus-based initiator.

(D) Initiator

(D) an initiator is used to form an organic barrier layer by curing (A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, and (C) a non-silicon-based photocurable monofunctional monomer, Initiators may be included without limitation. (D) The initiator may include, but is not limited to, one or more of a triazine-based initiator, an acetophenone-based initiator, a benzophenone-based initiator, a thioxanone-based initiator, a benzoin-based initiator, a phosphorus-based initiator, and a oxime-based initiator. Examples of the phosphorus initiator include diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, benzyl (diphenyl) phosphine oxide, bis (2,6-dimethoxybenzoyl) 4-trimethylpentyl) phosphine oxide or mixtures thereof. For example, when using a phosphorus initiator, the composition of the present invention may exhibit better initiation performance at long wavelength UVs.

(D) The initiator may be included in an amount of 1 wt% to 10 wt%, specifically 2 wt% to 5 wt%, based on the total weight of (A), (B), (C), and (D). In the above range, the sealing composition can sufficiently perform photopolymerization upon exposure, reduce unreacted initiator remaining after the photopolymerization, and further improve the light transmittance of the organic barrier layer.

The composition for encapsulating an organic light emitting element can be formed by mixing (A) a silicone-based photo-curable monofunctional monomer, (B) a photo-curable multifunctional monomer, (C) a non-silicone photo-curable monofunctional monomer, and (D) an initiator. For example, the composition for encapsulating an organic light emitting element can be formed into a solventless type solvent-free composition. For example, when the composition of the organic light emitting diode is of the non-solvent type, the weight% is preferably (A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, (C) ) Initiator. &Lt; / RTI &gt;

The composition for encapsulating an organic light emitting element may have a viscosity of 0 cps to 200 cps, specifically 100 cps or less, more specifically 5 cps to 50 cps or 7 cps to 30 cps at 25 占 폚 (23 占 폚 to 27 占 폚). In the above range, the composition for encapsulating an organic light emitting element can facilitate the formation of an organic barrier layer. In addition, within the above range, it may be advantageous to carry out a method such as vapor deposition, ink-jetting or the like in forming the organic barrier layer.

The composition for encapsulating an organic luminescent element can be cured by irradiation for 1 second to 100 seconds at 10 mW / cm ² to 500 mW / cm ² at the UV wavelength, but is not limited thereto.

The composition for encapsulating an organic luminescent element can be used for encapsulating an organic luminescent element. Specifically, an organic barrier layer can be formed in an encapsulation structure in which an inorganic barrier layer and an organic barrier layer are sequentially formed. For example, the composition for encapsulating an organic light emitting device can form an organic barrier layer by a method such as vapor deposition or ink jet, but is not limited thereto. The composition for encapsulating an organic light-emitting element is a member for a device, particularly a member for a display device, to a gas or a liquid in the surrounding environment, for example, oxygen and / or moisture in the air and / It can also be used as an encapsulation of a member for an apparatus which can be decomposed or become defective. For example, the member for the device may be a bag such as a lighting device, a metal sensor pad, a micro disk lasers, an electrochromic device, a photochromic device, a micro electro mechanical system, a solar cell, an integrated circuit, a charge coupled device, a light emitting polymer, Structure, but is not limited thereto.

Hereinafter, a composition for encapsulating an organic light emitting diode according to another embodiment of the present invention will be described.

The composition for encapsulating an organic luminescent element of this example is substantially the same as the composition for encapsulating an organic luminescent element of the present invention except that it further contains (E) a heat stabilizer. As a result, the composition for encapsulating an organic luminescent element in another embodiment of the present invention can suppress the viscosity change at room temperature of the sealing composition. The composition for encapsulating an organic light emitting diode according to another embodiment of the present invention can further increase the light transmittance and the photo-curability and further lower the plasma etching rate compared to the sealing composition containing no heat stabilizer. The composition is the same as the composition for encapsulating an organic luminescent element in one embodiment of the present invention except that it further contains a heat stabilizer. Hereinafter, only the heat stabilizer will be described.

The heat stabilizer (E) is included in the sealing composition to suppress the change in viscosity at room temperature of the sealing composition. The heat stabilizer (E) is sterically hindered, Phenolic thermal stabilizers can be used. Specifically, the heat stabilizer (E) is pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], stearyl- 1,3,5-tris (2,6-dimethyl-3-hydroxy-4-t-butylbenzyl) isocyanurate, 1,3,5- Tris (3,5-di-t-butyl-4-hydroxybenzyl) isocyanurate, 1,3,5-tris (2-hydroxyethyl) isocyanurate, pentaerythritol tetrakis [ (4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanurate. But is not limited thereto. (E) The heat stabilizer may be contained in an amount of not more than 2000 ppm, specifically 0.01 ppm to 2000 ppm, more specifically 100 ppm to 800 ppm, based on the total weight of (A), (B), (C) and (D). In the above range, the heat stabilizer can improve the storage stability and fairness of the liquid state of the sealing composition.

Hereinafter, the composition for encapsulating an organic luminescent element of another embodiment of the present invention will be described.

The composition for encapsulating an organic luminescent element in this example is substantially the same as the composition for encapsulating an organic luminescent element in one embodiment of the present invention, except that (F) further contains another photocurable compound. (F) The other photocurable monomer is different from the above-mentioned (A), (B) and (C), and includes a trifunctional or more trifunctional to hexafunctional (meth) acrylic photopolymerizable monomer or oligomer thereof, For example, bifunctional to hexafunctional (meth) acryl-based photo-curable monomers or oligomers thereof. Specifically, (F) the other photo-curing compound is a compound having 3 to 20 carbon atoms, including trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol tri Tri (meth) acrylates of triols, tetraols, pentaols or hexaols; Tetra (meth) acrylate of tetraol, pentanol or hexanol having 4 to 20 carbon atoms, including pentaerythritol tetra (meth) acrylate, dipentaerythritol tetra (meth) acrylate and the like; Penta (meth) acrylate of pentanol or hexanol having 4 to 20 carbon atoms, including dipentaerythritol penta (meth) acrylate; Hexa (meth) acrylate having 4 to 20 carbon atoms, including dipentaerythritol hexa (meth) acrylate, and the like, but are not limited thereto.

The organic light emitting diode display of the present invention may include an organic barrier layer formed of the composition for encapsulating an organic light emitting diode of the present invention. Specifically, the organic light emitting diode display includes an organic light emitting device, and a barrier stack formed on the organic light emitting device and including an inorganic barrier layer and an organic barrier layer, and the organic barrier layer is a composition for encapsulating an organic luminescent element As shown in FIG. As a result, the organic light emitting element display device can be excellent in reliability.

In the organic light emitting diode display of the present invention, the organic barrier layer may be formed by an inkjet or vapor deposition method.

Hereinafter, an OLED display according to an embodiment of the present invention will be described with reference to FIG. 1 is a cross-sectional view of an OLED display device according to an embodiment of the present invention.

1, an organic light emitting diode display 100 according to an embodiment of the present invention includes a substrate 10, an organic light emitting diode 20 formed on the substrate 10, and an organic light emitting diode 20 formed on the organic light emitting diode 20, Layer 31 and an organic barrier layer 32. The inorganic barrier layer 31 is in contact with the organic light emitting element 20 and the organic barrier layer 32 is in contact with the organic light- May be formed of the composition for encapsulating an organic light emitting diode of the embodiments of the present invention.

The substrate 10 is not particularly limited as long as it is a substrate on which an organic light emitting element can be formed. For example, a transparent glass, a plastic sheet, a silicon or metal substrate, or the like.

Although not shown in FIG. 1, the organic light emitting diode 20 includes a first electrode, a second electrode, an organic light emitting layer formed between the first electrode and the second electrode, The light-emitting film may be formed by sequentially laminating a hole injection layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injection layer, but is not limited thereto.

The barrier stack 30 includes an organic barrier layer and an inorganic barrier layer, and each of the organic barrier layer and the inorganic barrier layer is different from each other in constituent elements of the layer.

The inorganic barrier layer is different in component from the organic barrier layer, so that the effect of the organic barrier layer can be compensated. The inorganic barrier layer may be formed of an inorganic material excellent in light transmittance and excellent in water and / or oxygen barrier properties. For example, the inorganic barrier layer may be a metal, a nonmetal, an intermetallic compound or alloy, an intermetallic compound or alloy, an oxide of a metal or a nonmetal, a fluoride of a metal or a nonmetal, a nitride of a metal or a nonmetal, A non-metallic oxygen nitride, a metal or non-metallic boride, a metal or non-metallic oxygen boride, a metal or a non-metal silicide, or a mixture thereof. The metal or base metal may be selected from the group consisting of Si, Al, Selenium, Zn, Sb, In, Ge, Sn, Bi, Metal, lanthanide metal, and the like, but are not limited thereto. Specifically, AlOx, comprising the inorganic barrier layer is a silicon oxide (SiOx), silicon nitride (SiNx), silicon oxygen nitride (SiOxNy), ZnSe, ZnO, Sb 2 O 3, Al 2 O 3 such as In ₂ O _3, SnO ₂ can be.

The inorganic barrier layer may be deposited by a plasma process, a vacuum process such as sputtering, chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma vapor deposition, and combinations thereof.

When the organic barrier layer is deposited alternately with the inorganic barrier layer, it is possible to secure the smoothing property of the inorganic barrier layer and to prevent the defect of the inorganic barrier layer from propagating to another inorganic barrier layer.

The organic barrier layer can be formed by vapor deposition, ink jet, screen printing, spin coating, blade coating, curing alone, or a combination thereof, of the composition for encapsulating an organic light emitting element in the examples of the present invention. For example, the composition for encapsulating an organic light emitting element can be coated to a thickness of 1 to 50 탆 and cured by irradiation with light at 10 mW / cm ² to 500 mW / cm ² for 1 second to 100 seconds.

The barrier stack includes an organic barrier layer and an inorganic barrier layer, but the total number of organic barrier layers and inorganic barrier layers is not limited. The total number of organic and inorganic barrier layers may vary depending on the level of permeation resistance to oxygen and / or moisture and / or water vapor and / or chemicals. For example, the total number of the organic barrier layer and the inorganic barrier layer may be 10 or less, for example, 2 to 7, and specifically, the inorganic barrier layer / organic barrier layer / inorganic barrier layer / organic barrier layer / Inorganic barrier layer / organic barrier layer / inorganic barrier layer in this order.

In the barrier stack, the organic barrier layer and the inorganic barrier layer can be alternately deposited. This is due to the effect on the organic barrier layer produced due to the physical properties of the composition described above. As a result, the organic barrier layer and the inorganic barrier layer can complement or enhance the sealing effect on the device.

Hereinafter, an OLED display according to another embodiment of the present invention will be described with reference to FIG. 2 is a cross-sectional view of an OLED display device according to another embodiment of the present invention.

2, an OLED display 200 according to another embodiment of the present invention includes a substrate 10, an organic light emitting diode 20 formed on the substrate 10, and an organic light emitting diode 20 formed on the organic light emitting diode 20, Layer 31 and an organic barrier layer 32. The inorganic barrier layer 31 encapsulates the internal space 40 in which the organic light emitting device 20 is accommodated, (32) may be formed of the composition for encapsulating an organic light emitting diode of the embodiments of the present invention. Except that the inorganic barrier layer is not in contact with the organic light emitting element.

Further, in one embodiment of the present invention, the composition for encapsulating an organic luminescent element of the present invention has a modulus of 6.5 GPa or less after curing and an etch rate of the organic barrier layer of 10% or less by plasma according to the following formula The composition for device encapsulation may be:

<Formula 2>

Etching rate (%) of organic barrier layer by plasma = (T1-T2) / T1 x 100

(In the above formula (2), T1 is the initial height of the organic barrier layer formed of the composition for encapsulating an organic luminescent element,

T2 is the height of the organic barrier layer after ICP power: 2500 W, RF power: 300 W, DC bias: 200 V, Ar flow: 50 sccm, ethching time: 1 min, pressure: 10 mtorr).

1 and 2 show the organic light emitting diode display device of the present invention, but the organic light emitting diode flexible display device can also be included in the scope of the present invention.

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Specific specifications of the components used in Examples and Comparative Examples are as follows.

(A1) monomer (Preparation Example 1), (A2) a monomer (Preparation Example 2) of the above formula (1-2), (A) a silicone-based photocurable monofunctional monomer:

(B1) 1,12-dodecanediol dimethacrylate (Sartomer), (B2) 1,6-hexanediol dimethacrylate (Sartomer)

(C) 2-phenylphenoxyethyl acrylate (Hitachi Chemical), (C2) benzyl methacrylate (Hitachi Chemical Co., Ltd.)

(D) Initiator: Darocur TPO (BASF)

Manufacturing example  One

To a 1000 ml flask equipped with a cooling tube and a stirrer was added 300 ml of ethyl acetate and 25 g of methyl (diphenyl) silane (Gelest) and 40 g of allyl alcohol (purified gold) After nitrogen purging, 72 ppm of Pt on carbon black powder (Aldrich) was added, the temperature in the flask was raised to 80 DEG C, and the mixture was stirred for 4 hours. The residual solvent was removed by distillation. 65.2 g of the obtained compound was added to 300 ml of dichloromethane, 16 g of triethylamine was added, and 15.3 g of methacryloyl chloride was added slowly while stirring at 0 占 폚. The residual solvent was removed by distillation to obtain a compound of the following formula 1-1 as an HPLC purity of 95%.

&Lt; Formula 1-1 >

Production Example 2

600 ml of dichloromethane (Sigma Aldrich) was charged into a 2000-ml flask equipped with a condenser and a stirrer, and 57.2 g of 2-hydroxyethyl methacrylate (Aldrich) and 50 ml of triethylamine, Sigma Aldrich) were added to 100 g of triphenylchlorosilane (Gelest) while stirring at 0 占 폚. The temperature was raised to 25 ° C and the mixture was stirred for 4 hours. The dichloromethane was removed by distillation under reduced pressure, and 124 g of a compound of the following formula 1-2 was obtained through a silica gel column with an HPLC purity of 96%.

(1-2)

Example  One

, 19 parts by weight of (A1), 49 parts by weight of (B1), 29 parts by weight of (C1) and 3 parts by weight of (D) were placed in a 125 mL brown polypropylene bottle and mixed at room temperature for 3 hours using a shaker, 20-27 cp at 25 &lt; 0 &gt; C).

Example  2 to Example  6 and Comparative Example  1 to Comparative Example  3

The same procedure as in Example 1 was carried out except that the kind and / or the content of (A), (B), (C) and (D) in Example 1 were changed to the following Table 1 To prepare a sealing composition.

The sealing compositions prepared in Examples and Comparative Examples were measured for physical properties shown in the following Table 1, and the results are shown in Table 1.

Example Comparative Example One 2 3 4 5 6 One 2 3 A A1 19 19 19 - - -    - 48 29 A2 - - - 19 19 19    -     -    - B B1 49 - 49 49 - 49 68 49    - B2 - 49 - - 49 - - - - C C1 29 29 - 29 29 - 29 - 29 C2 - - 29 - - 29 - - 39 D 3 3 3 3 3 3 3 3 3 result Modulus
(GPa, room temperature) 6.1 6.3 4.2 5.8 4.9 3.8 11.2 6.5 9.5 Light curing rate
(%) 92.1 90.8 92.5 93.8 94.6 90.2 93.2 89.4 85.4 Plasma etching rate (%) 5.8 5.6 6.5 6.2 5.5 6.4 7.6 13.5 7.9

As shown in Table 1, the composition for encapsulating an organic light emitting diode of the present invention can realize an organic barrier layer having a high photo-curability, a low etching rate for plasma, and a low modulus after curing. On the other hand, as shown in Table 1, the comparative examples not containing any one of (A), (B) and (C) in the composition for encapsulating an organic light emitting diode of the present invention have a high modulus or a high etching rate There was a problem.

&Lt; Property evaluation method &

(1) Modulus: A composition for sealing is applied on a glass substrate by spraying and irradiated for 10 seconds at 100 mW / cm ² to be UV-cured to obtain a specimen of 20 cm x 20 cm x 3 m (width x length x thickness). The cured film was sampled and tested using Experiment Mode: Indentation Mode (using Berkovitz), Control Mode: Force control, Max. Force: 60 μN (0213-TJ: 54 μN with 100 nm displacement control), 5 s loading → 2 s hold loading → 5 s unloading and room temperature (25 ± 3 ° C).

(2) optical path ratio: the intensity of the absorption peak in the FT-IR (NICOLET 4700, Thermo Co.) to the vicinity of 1635cm ^-1 (C = C), 1720cm ^-1 vicinity (C = O) with respect to the composition for sealing . The composition for sealing is applied on a glass substrate by spraying and irradiated for 10 seconds at 100 mW / cm ² to be UV-cured to obtain a specimen of 20 cm x 20 cm x 3 m (width x length x thickness). Obtain a cured film and, FT-IR (NICOLET 4700, Thermo Co.) is used in the vicinity of 1635cm ^-1 (C = C), 1720cm ^-1 measured intensity of the absorption peak in the vicinity of the (C = O) a. The photo-curing rate is calculated according to the following formula (1).

<Formula 1>

Photocuring rate (%) = | 1- (A / B) | x 100

(Where A is the ratio of the intensity of the absorption peak at around 1635 cm ^-1 to the intensity of the absorption peak at around 1720 cm ^-1 for the cured film,

B is the ratio of the intensity of the absorption peak near 1635 cm ^-1 to the intensity of the absorption peak near 1720 cm ^-1 for the sealing composition).

(3) Plasma etching rate: The deposition height of the organic barrier layer (T1, 1 占 퐉 to 10 占 퐉) was measured by depositing and photocuring the sealing composition to a predetermined thickness. (T2, unit: μm) after plasma treatment of the organic barrier layer at an ICP power of 2500 W, RF power of 300 W, DC bias of 200 V, Ar flow of 50 sccm, ethching time of 1 min, Were measured. The etch rate of the organic barrier layer by plasma was calculated by Equation (2).

<Formula 2>

Etching rate (%) of organic barrier layer by plasma = (T1-T2) / T1 x 100

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (11)

(A) a silicone-based photocurable monofunctional monomer, (B) a photocurable multifunctional monomer, (C) a non-silicon-based photocurable monofunctional monomer, and (D)
Wherein the silicone-based photo-curable monofunctional monomer (A) is represented by the following formula (1):
&Lt; Formula 1 >

(In the formula 1,
X ₁ , X ₂ and X ₃ each independently represent a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C1 to C20 alkyl ether group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted Or an unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C20 arylalkyl group, a substituted or unsubstituted C1 to C20 monoalkylamine group or a dialkylamine group, or a substituted or unsubstituted C1 to C20 And at least one of X ₁ , X ₂ and X ₃ is a substituted or unsubstituted C6 to C30 aryl group or a substituted or unsubstituted C7 to C20 arylalkyl group,
Y is a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, a substituted or unsubstituted C7 to C20 arylalkyl A substituted or unsubstituted C1 to C20 monoalkylamino group,
Z is hydrogen or a methyl group,
and m is an integer of 0 or 1).
The photosensitive resin composition according to claim 1, which comprises, based on the total weight of (A), (B), (C) and (D) (C) 5% by weight to 40% by weight of the non-silicon photocurable monofunctional monomer and 1% by weight to 10% by weight of the initiator (D), based on 100% by weight of the photopolymerizable multifunctional monomer By weight based on the total weight of the composition.
The compound according to claim 1, wherein in formula (1)
X ₁ , X ₂ and X ₃ are each independently a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C6 to C12 aryl group, or a substituted or unsubstituted C7 to C15 arylalkyl group,
And Y is a substituted or unsubstituted C1 to C10 alkylene group.
The composition for encapsulating an organic luminescent element according to claim 1, wherein the (A) silicon-based photo-curable monofunctional monomer is represented by any one of the following formulas (1-1) and (1-2)
&Lt; Formula 1-1 >

(1-2)

.
The composition according to claim 1, wherein the photocurable multifunctional monomer (B) is represented by the following formula (2):
(2)

(In the formula (2)
R ₁ is a substituted or unsubstituted C1 to C20 alkylene group,
R ₂ and R ₃ are each independently hydrogen or a methyl group.
The composition for encapsulating an organic light emitting device according to claim 1, wherein the (C) non-silicon photocurable monofunctional monomer comprises an aromatic mono (meth) acrylate.
The composition for encapsulating an organic luminescent element according to claim 1, wherein the composition for encapsulating an organic luminescent element further comprises a heat stabilizer.
The method according to claim 1,
The silicone-based photocurable monofunctional monomer (A) is represented by any one of the following formulas (1-1) to (1-2)
&Lt; Formula 1-1 >

(1-2)

The photocurable multifunctional monomer (B) is a di (meth) acrylate having an unsubstituted C6 to C12 alkylene group,
The non-silicon photocurable monofunctional monomer (C) is represented by the following general formula (3)
(3)

(3)
R ₃ is hydrogen or a methyl group,
s is an integer from 0 to 10,
R ₆ is a substituted or unsubstituted C6 to C50 aryl group or a substituted or unsubstituted C6 to C50 aryloxy group),
Wherein the initiator (D) comprises a phosphorus-based initiator.
The composition for encapsulating an organic luminescent element according to claim 1, wherein the composition for encapsulating an organic luminescent element has a viscosity of 5 cps to 50 cps at 25 캜 2 캜.
2. The composition for encapsulating an organic light emitting element according to claim 1, wherein the composition for encapsulating an organic luminescent element has a modulus of 6.5 GPa or less after curing and an etching rate of an organic barrier layer by plasma according to the following formula 2 is 10%
<Formula 2>
Etching rate (%) of organic barrier layer by plasma = (T1-T2) / T1 x 100
(In the above formula (2), T1 is the initial height of the organic barrier layer formed of the composition for encapsulating an organic luminescent element,
T2 is the height of the organic barrier layer after ICP power: 2500 W, RF power: 300 W, DC bias: 200 V, Ar flow: 50 sccm, ethching time: 1 min, pressure: 10 mtorr).
And a barrier stack formed on the organic light emitting device and including an inorganic barrier layer and an organic barrier layer,
Wherein the organic barrier layer is formed of the composition for encapsulating an organic light emitting diode according to any one of claims 1 to 10.

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