KR20170123893A - double side Z-pinning patch and manufacturing method thereof - Google Patents

Abstract

Provided by the present invention is a bidirectional Z-pinning patch manufacturing method which includes: a first step of arranging a first silicon pad including an allowable thickness of a preset ratio from a preset first insertion depth; a second step of arranging reinforced fiber along the surface of the first silicon pad; a third step of arranging a jig frame in which a plurality of guide holes are formed along the upper part of the arranged reinforced fiber; a fourth step in which a plurality of Z-pins are inserted into the surface of the first silicon pad so that each lower part corresponds to the first insertion depth by being pressed to penetrate each guide hole; a fifth step in which the upper part of the Z-pin exposed to the upper part of the reinforced fiber is inserted into the second silicon pad as the jig frame is removed and the second silicon pad including the allowable thickness of the set ratio from the preset second insertion depth is stacked; and a sixth step in which base resin is injected and hardened along a part between the first silicon pad and the second silicon pad. The present invention is provided to reduce a defective rate caused by the missing or transformation of Z-pin while improving structural safety by being applied to a stratified structure formed by stacking prepreg.

Description

Bidirectional Z-pinning patch and method of manufacturing the same

The present invention relates to a bi-directional Z-pinning patch and a method of manufacturing the same, and more particularly, to a bidirectional Z-pinning patch and a method of manufacturing the same, which are applied to a layered structure formed by lamination of prepregs, Z-pinning patches and a method of manufacturing the same.

Generally, a fiber-reinforced resin panel is produced by laminating a reinforcing fiber fabric prepreg which is a molding material preliminarily impregnated with a matrix resin, and heating / pressing.

Here, the fiber-reinforced resin panel is formed in a variety of structures from the simplest form of a flat sheet to a complicated structure having curved / bent portions, and is applied to various transportation machines and structures.

At this time, the fiber-reinforced resin panel is excellent in the mechanical performance against the force applied in the transverse direction and the longitudinal direction with respect to one layer in which the reinforcing fiber fabric is arranged. However, There is a risk of delamination due to lack of mechanical performance.

In order to prevent this, a technique has been disclosed in which a vertical Z pin is inserted along the lamination direction of the panel to prevent delamination.

1 is an exemplary view showing a conventional Z-pin patch.

1, the conventional Z-pin patch 1 includes a base reinforcement plate 2 and a plurality of Z pins 3 fixed to one surface of the base reinforcement plate 2.

At this time, the Z-pin patch 1 is arranged so that the lower end of the Z pin 3 comes into contact with the upper surface of the fiber-reinforced resin panel uncured after lamination of the prepreg, And is used in such a manner that it is integrally cured with the fiber-reinforced resin panel.

Here, the base reinforcing plate 2 is made of a composite material impregnated with a resin in the reinforcing fiber to maintain a constant strength at a thin thickness.

However, since the conventional Z pin patch 1 has a structure in which the end portion of the Z pin 3 is fixed to the surface of the base reinforcing plate 2, It is difficult to store the Z-pin patch 1 as a result of being easily separated from the base reinforcing plate 2, and a large number of defective products are generated in a mass-produced product.

Particularly, the Z-pin patch 1 is used for joining a pair of laminated fiber-reinforced resin panels (4,5) in place of the fastening means such as adhesives / rivets and bolting, in addition to the vertical reinforcement of the fiber- do.

However, when the conventional Z-pin patch 1 is inserted so as to pass through a pair of fiber-reinforced resin panels 4 and 5 on which the Z pins 3 provided on one surface of the base reinforcing plate 2 are laminated, 2) remain on the outer surface of the joint portion of the fiber-reinforced resin panels (4,5), thereby deteriorating the appearance of the joint portion.

In addition, when the fiber-reinforced resin panels 4, 5 are provided in a curved shape, since the lamination direction of the prepregs and the inserting direction of the Z pins 3 are shifted, there is a problem that the basic performance for preventing peeling- there was.

Korean Patent No. 10-1394408

In order to solve the above-mentioned problems, the present invention provides a bi-directional Z-pinning patch which is applied to a layered structure formed by lamination of prepregs to improve the structural stability but to reduce the defective rate due to omission or deformation of Z- And the like.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, including: a first step of disposing a first silicon pad including a predetermined margin of a predetermined thickness from a predetermined first insertion depth; A second step in which the reinforcing fibers are arranged along the surface of the first silicon pad; A third step in which a jig frame having a plurality of guide holes formed therein is disposed along an upper portion of the arranged reinforcing fibers; A fourth step in which a plurality of Z pins are inserted into the surface of the first silicon pad such that each of the Z pins is pushed through the respective guide holes so that each of the lower portions corresponds to the first insertion depth; Wherein the jig frame is removed and a second silicon pad comprising the predetermined percentage of clearance thickness is laminated from a predetermined second insertion depth so that the top of the Z pin exposed to the top of the reinforcing fiber penetrates into the interior of the second silicon pad A fifth step of inserting; And a sixth step of injecting a base resin between the first silicon pad and the second silicon pad and curing the same.

The fifth step may further include pressing the laminate of the first silicon pad and the second silicon pad so as to be closely attached to the surface of the molding die having a surface profile corresponding to the plate to be bonded.

In the sixth step, a closed space is formed between the first silicon pad and the second silicon pad. The base resin is injected into the closed space, and the injected base resin is vacuum- And a step of impregnating into a space between the fibers.

In addition, in the fourth step, the ring-shaped concavo-convex part is concavely formed at the surface of each Z pin along the vertical direction. In the sixth step, the base resin is cured It is preferable to be made of a material which is plasticized below the temperature.

A base reinforcement plate formed in close contact with the surface of the molding die so as to have a profile corresponding to a superimposed interface between a pair of plates to be joined; And the upper and lower portions are protruded in both directions from the lower surface and the upper surface portion of the base reinforcing plate to a height corresponding to the thickness of each of the plate members to be coupled, and the ring- A bi-directional Z-pinning patch comprising a plurality of Z pins to be formed.

Through the above solution, the present invention provides the following effects.

First, unlike the case where the ends of the Z pin are fixed to the surface of the base resin, the upper and lower portions of the Z pin are inserted into the silicon pad, and the central portions of the Z pins are mutually connected by the base resin and the reinforcing fibers. So that the productivity of the product can be improved.

Second, a simple process of setting the insertion depths of the upper and lower Z pins according to the thickness of the plate to be joined and preparing a pair of silicon pads corresponding to the insertion depth of each Z pin, Peening patches can be made so that a highly compatible product can be made that can be applied to the bonding between various sheets having different thicknesses.

Thirdly, a bi-directional Z-pinning patch corresponding to the overlapping interface profile between the plates to be joined is fabricated by deforming a silicon pad of a flexible material along a forming mold for pressing the plate to be joined, Direction and the insertion direction of the Z pin are precisely matched with each other, so that the interlayer peeling prevention performance can be remarkably improved.

Fourth, since the bidirectional Z-pinning patch is inserted and fixed in a plate material which is vertically in contact with the inside of the overlapping interface of the plate material to be coupled through the Z pin projected to the upper surface portion and the lower surface portion, Can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exemplary view showing a conventional Z-pin patch. FIG.
2 is a flow diagram illustrating a method of fabricating a bidirectional Z-pinning patch in accordance with one embodiment of the present invention.
FIGS. 3A, 3B, 3C and 3D illustrate examples of a method of manufacturing a bidirectional Z-pinning patch according to an embodiment of the present invention; FIGS.
FIGS. 4 and 5 illustrate exemplary bidirectional Z-pinning patches according to an embodiment of the present invention. FIG.

Hereinafter, a bidirectional Z-pinning patch according to a preferred embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

FIG. 2 is a flowchart illustrating a method of manufacturing a bidirectional Z-pinning patch according to an embodiment of the present invention. FIGS. 3A, 3B, 3C, FIGS. 4 and 5 are views showing an example of a bi-directional Z-pinning patch according to an embodiment of the present invention.

As shown in FIGS. 2 to 5, a method of manufacturing a bi-directional Z-pinning patch according to an embodiment of the present invention comprises the following steps.

3A and 3B, a first silicon pad 10 is disposed along a flat upper surface portion of the work table, the first silicon pad 10 including a predetermined allowable thickness b from a predetermined first insertion depth a s10).

The bidirectional Z-pinning patch 40 is used for joining a pair of plates to be joined f and h stacked in the vertical direction, and the first joining target plate h and the second joining target plate f, Can be applied to the boundary surface of the overlapping portion, i.e., the overlapping boundary surface.

In this case, the plate materials f and h to be bonded refer to a panel formed through lamination of a prepreg which is a molding material preliminarily impregnated with a matrix resin to a reinforcing fiber or a reinforcing fiber fabric, and a plurality of prepregs And the matrix resin is completely impregnated and heated / pressed.

Here, it is preferable that the bi-directional Z-pinning patch 40 is applied in a state before each of the plate materials f and h to be bonded is completely cured.

Specifically, it is preferable that the first insertion depth a is set to correspond to one of a pair of joining target plates f and h, that is, the thickness of the first joining target plate h.

The first insertion depth a can be understood as the depth at which the Z pin 42 is inserted into the first joining target plate h and is set so as not to exceed the thickness of the first joining target plate h .

Here, the first silicon pad 10 includes a margin thickness b of 30 to 70% of the first insertion depth a, and has a margin corresponding to 50% of the first insertion depth a Thickness is most preferable. For example, if the first insertion depth a is 5 mm, the thickness a of the first silicon pad 10 may be 7.5 mm.

At this time, if the allowable thickness b is less than 30% of the first insertion depth a, there is a fear that the Z pin 42 inserted in the subsequent process can not be stably supported. If the margin thickness exceeds 70% The Z pin 42 may be bent during the insertion process due to an increase in the insertion pressure of the Z pin 42.

Meanwhile, when the first silicon pad 10 is disposed (s10), the reinforcing fibers 41 are arranged along the surface of the first silicon pad 10 (s20). Here, the reinforcing fibers 41 may be formed of carbon fiber, glass fiber, or the like, and one or more fiber filaments may be twisted or bundled.

In this case, the reinforcing fibers 41 may be directly arranged along the surface of the first silicon pad 10, may be woven in a twill or plain weave shape, and may be arranged in the form of a fabric. It is most preferable that the material is selected to be the same as that used for the prepreg which is the molding material of the plate materials f and h to be combined.

When the reinforcing fibers 41 are arranged along the surface of the first silicon pad 10 at step s20, a plurality of guide holes 31 are formed along the upper portion of the arranged reinforcing fibers 41, 30) are arranged (s30).

Here, the jig frame 30 is formed to have a predetermined thickness so that the outer periphery of the Z pin 42 can be guided along the inner periphery of the guide hole 31, And is formed to penetrate the jig frame 30 in the vertical direction.

At this time, the number of the guide holes 31 may be set differently according to the area of the jig frame 30, but it is preferable that the guide holes 31 are arranged so as to be evenly spaced from adjacent guide holes.

The guide hole 31 is provided to have a size corresponding to the cross sectional area of the Z pin 42 so that the Z pin 42 can pass therethrough and not to flow laterally in the guide hole 31, The first silicon pad 42 can be guided accurately in the vertical direction and inserted into the first silicon pad 10.

The plurality of Z pins 42 are inserted into the surface of the first silicon pad 10 so that the lower portions thereof are pressed to penetrate the respective guide holes 31 to correspond to the first insertion depth a. (S40).

The Z pin 42 is preferably made of a high strength material such as carbon fiber or stainless steel and the length of the Z pin 42 is set such that the first insertion depth a and the arrangement thickness of the reinforcing fibers 41 , And a second insertion depth (c).

At this time, the second insertion depth c is set to correspond to the thickness of the other one of the pair of plates f and h to be coupled, i.e., the thickness of the second plate to be coupled f, Can be understood as a depth to be inserted into the second joining plate f and is preferably set to be less than the thickness of the second joining plate f.

3C, when the lower portion of the Z pin 42 is inserted into the first silicon pad 10 (S40), the jig frame 30 is removed and a predetermined second insertion depth the upper portion of the Z pin 42 exposed to the upper portion of the reinforcing fiber 41 is laminated to the upper surface of the second silicon pad (c) 20) (s50).

Here, the first silicon pad 10 and the second silicon pad 20 may be made of the same material, and each of the silicon pads 10 may have an allowable thickness from the respective insertion depths in the same ratio.

In detail, the second silicon pad 20 may include a margin thickness d corresponding to 30 to 70% of the second insertion depth c, and the first silicon pad 10 may include a first (B) corresponding to 50% of the insertion depth (a), the second silicon pad 20 includes an allowance thickness d corresponding to 50% of the second insertion depth c Is most preferable.

For example, when the first and second insertion depths are 5 mm, if the first silicon pad 10 is provided with 7.5 mm including a margin of 50% May be provided with 7.5 mm including the same ratio of allowable thickness.

In addition, if the first and second insertion depths are 5 mm and 10 mm, respectively, if the first silicon pads 10 are provided to have a margin of 7.5 mm including a margin of 50%, the second silicon pads 20 may have the same It is preferable that the thickness is 15 mm including the allowable thickness of the ratio.

At this time, when the second silicon pad 20 is stacked so as to cover the upper portion of the Z pin 42, the lower surface of the second silicon pad 20 is pressed downward so as to be in close contact with the upper portion of the reinforcing fiber 41 , And an upper portion of the Z pin 42 may be inserted into the second silicon pad 20.

That is, the lower portion of the Z pin 42 is inserted into the first silicon pad 10, and the upper portion of the Z pin 42 is inserted into the second silicon pad 20.

At this time, the first silicon pad 10 and the second silicon pad 20 are made of the same material and include the same margin of the thickness from each insertion depth. Therefore, the elastic force of each of the silicon pads 10, The positions of the plurality of Z pins 42 inserted into each of them can be uniformly aligned.

That is, the length of the lower side of the plurality of Z pins 42 inserted into the first silicon pad 10 may be aligned to correspond to the first insertion depth a, The length of the upper side of the plurality of Z pins 42 inserted into the second insertion hole c may be aligned to correspond to the second insertion depth c.

When the base resin is injected and hardened along the first silicon pad 10 and the second silicon pad 20, a bidirectional Z-pinning patch 40 is manufactured (s60).

Since the upper and lower portions of the Z pin 42 are inserted into the silicon pads 10 and 20 and the central portion of the Z pin is connected to each other by the base resin, 42 can be minimized and productivity of the product can be improved.

The upper and lower insertion depths of the Z pins 42 are set according to the thickness of the plate materials f and h to be coupled and a pair of silicon pads 10 and 20 corresponding to the insertion depths of the Z pins 42 are prepared A bi-directional Z-pinning patch 40 having Z pins 42 of various insertion depths can be manufactured.

Thus, a high-compatibility product that can be applied to the bonding between various sheets having different thicknesses can be produced.

The step (s50) of stacking the second silicon pads 20 so as to cover the upper part of the Z pins 42 is performed by stacking the first silicon pads 10 and the second silicon pads 20, f, h) of the mold (m) having a surface profile corresponding to that of the mold (m).

In detail, the plate materials f and h to be bonded are joined by the bi-directional Z-pinning patch 40 in a state before full curing, and in order to completely cure the plate materials f and h to be joined, A molding mold m for heating / pressing the plate materials f, h to be joined is required.

That is, referring to FIG. 4, the first joining target plate h is seated on the surface of the forming mold m, and the overlapping between the first joining target plate h and the second joining target plate f The bi-directional Z-pinning patch 40 is disposed along the interface, and the second joining target plate f is disposed along the upper portion of the bi-directional Z-pinning patch 40 so as to overlap.

At this time, the first joining target plate material h and the second joining target plate material f are hardened by being pressed and heated along the forming mold m and the matrix resin impregnated in the joining target plates f and h The lower portion of the Z pin 42 is fixed inside the first plate to be coupled h and the upper portion of the Z pin 42 is fixed inside the second plate to be coupled f, The plate material h and the second plate-to-be-coupled f may be coupled to each other.

The stack of the first silicon pad 10 and the second silicon pad 20 may include a first silicon pad 10, a second silicon pad 20, Fibers 41, and Z pins 42 inserted into each of them.

Specifically, the laminate is moved to the surface of the forming mold m and pressed so as to come into close contact with the surface of the forming mold m. At this time, the first silicon pad 10 and the second silicon pad 20 of a flexible material may be deformed to correspond to the surface profile of the forming mold m when pressed.

The reinforcing fibers 41 and the base resin impregnated therewith are formed so as to have a curvature corresponding to the surface profile of the forming mold m as the base resin is injected and cured in a state in which the respective silicon pads 10, The base reinforcing plate 43 is formed.

In this case, the forming molds m may be provided in pairs in the up and down direction, and the laminated body may be pressed between a pair of molding dies, and each of the joining target plates f and h may be formed by infusion molding using a bugging film. The forming mold m may be provided as one unit.

The silicon pads 10 and 20 of a flexible material are deformed along the surface profile of the forming mold m for pressing the plate materials f and h to be bonded, A corresponding bi-directional Z-pinning patch 40 can be manufactured.

At this time, the direction of each of the Z pins 42 inserted into the silicon pads 10 and 20 can be adjusted to correspond to the curvature of the silicon pads 10 and 20 at the time of deformation.

Here, the term " superposed interface " means a portion where a pair of plates to be joined f and h are mutually superimposed, and is understood to mean a portion contacting the upper and lower portions of the base reinforcing plate 43 .

Accordingly, the lamination direction of the prepreg p and the insertion direction of the Z pin 42 can be precisely matched with respect to the curved plates to be joined (f, h), so that the interlaminar peeling prevention performance of the product can be remarkably improved .

Meanwhile, the step (s60) of injecting the base resin between the first silicon pad 10 and the second silicon pad 20 may be performed by the first silicon pad 10 and the second silicon pad 20, And the base resin is injected into the closed space, and the injected base resin is vacuum-diffused to be impregnated into the space between the reinforcing fibers 41. [0033]

Specifically, when the side surfaces of the first silicon pad 10 and the second silicon pad 20 are sealed with a sealant tape or the like, the space in which the reinforcing fibers 41 are arranged can be sealed.

At this time, since each of the silicon pads 10 and 20 plays a role of a bugging film used in the infusion process, the preparation process for impregnating the reinforcing fibers 41 can be further simplified.

In addition, a vacuum valve connected to the suction pump is provided on one side of the closed space, and a resin injection port connected to the resin supply device is provided on the other side of the closed space to form a vacuum in the closed space and inject the base resin.

Here, the suction pump sucks the fluid in the closed space and discharges the fluid to the outside, thereby forming a vacuum in the closed space below the process pressure. Here, it is preferable that the process pressure is set to 0.000075 torr, which is a standard of high vacuum, but it is also possible to set 25 torr, which is the standard of vacuum for the productivity of the process.

At this time, if a vacuum is formed in the closed space, the base resin can be impregnated precisely along the space between the reinforcing fibers 41 according to the increase of the diffusion rate under a vacuum atmosphere.

Here, the space between the reinforcing fibers 41 is preferably understood to mean a space between the fiber filaments, a space between the fabric noses, a space between the fabric layer and the fabric layer, and the like.

In this way, the space in which the reinforcing fibers 41 are arranged can be easily sealed through the silicon pads 10 and 20 stacked up and down, and the base resin hardened without releasing agent or release film can be easily demoulded The productivity of the product can be improved.

The base resin may be at least one selected from the group consisting of polyetherimide (PEI), polyphenylene sulfide (PPS), polyamide-imide (PAI), polyether sulfone (PES) Polyetheretherketone (PEEK), epoxy, polyethylene (PE), and the like, and may be formed of various materials including thermosetting or thermoplastic resins depending on purposes and purposes.

For example, when the base resin is a thermoplastic resin such as polyethylene (PE), a base resin plasticized at about 120 ° C is supplied through the resin injection port, and the supplied base resin is supplied between the silicon pads 10, And can be hardened.

4 to 5, the bidirectional Z-pinning patch 40 includes a base reinforcing plate 43 formed by impregnating a base resin with the reinforcing fiber 41, and a base reinforcing plate 43 formed by insert molding And a plurality of Z pins (42).

The bidirectional Z-pinning patch 40 is disposed at an interface formed in an overlapping portion between the plates f and h to be joined when a pair of plates f and h to be joined are stacked, The upper portion of the Z pin 42 protruding from the upper surface of the base reinforcing plate 43 is inserted into the lower side joining plate member h, The two plates to be joined f and h can be integrally connected as they are inserted into the inside of the plate material f.

Accordingly, the Z pins 42 projecting upward and downward from the base reinforcing plate are inserted into the respective plates f and h, which are in contact with each other, to form a physical bridge that strengthens the strength in the vertical direction Since the plurality of Z pins 42 are connected in the horizontal direction through the reinforcing fibers 41 and the base resin, the lateral coupling force between the plate materials f and h to be coupled can be remarkably improved.

In this case, the reinforcing fibers 41 are preferably woven in a plain weaving manner in which warp and weft yarns are interwoven one by one, and the lateral strength of the base reinforcing plate 43 can be improved.

Furthermore, since the bidirectional Z-pinning patch 40 is disposed along the inside of the overlapping interface between the plates to be joined f and h, it is not exposed to the outer surfaces of the plates f and h to be coupled, Can be remarkably improved.

Since the center of the Z pin 42 is connected through the base reinforcing plate 43, even when the thickness of the base reinforcing plate 43 is reduced, the occurrence rate of failure such as separation / separation of the Z pin 42 is minimized Therefore, the productivity of the product can be improved, and an underlying technology in which the thickness of the base reinforcing plate 43 can be minimized in order to improve the unity of the lamination between the joining target plates f and h can be provided.

On the surface of each of the Z pins 42 is formed a ring-like concavo-convex portion 42a which is recessed along the circumferential direction so as to correspond to the prepreg p stacking direction of the plate materials f and h to be coupled .

That is, each of the Z pins 42 is depressed along the circumferential direction to form a ring-like concavo-convex portion 42a, and the ring concavo-convex portion 42a is formed in multiple stages in the vertical direction.

Since the contact area between the Z pin 42 and the matrix resin impregnated into the respective plates f and h may be increased through the concave and convex portions 42a, And can be firmly coupled to the inside of the target plates f and h. As a result, the peeling prevention performance of the prepreg (p) is improved in each of the plates (f, h) and the bonding force between the plates (f, h) can be improved.

The base resin impregnated in the base reinforcing plate 43 is preferably made of a material plasticized at a temperature lower than the curing start temperature of the matrix resin impregnated with the plate materials f and h to be bonded.

For example, in the case of an epoxy resin containing an amine-based curing agent, the matrix resin impregnated in the plate to be bonded is generally cured at 170 ° C and cured at around 210 ° C, It is preferable to be made of a material which is plasticized at less than 170 ° C.

At this time, the base resin is maintained in a cured state at the process temperature of the step of arranging each of the plate materials f and h to be bonded to the forming mold m, but is locked at a temperature exceeding the process temperature More preferable. That is, when the process temperature is 20 to 30 ° C, it is preferable that the material is plasticized to 40 ° C to 160 ° C in consideration of the temperature variation during the process.

Here, the base resin may be formed of polyethylene (PE) having a plasticizing temperature of about 120 ° C or the like.

Specifically, the plate materials f and h to be joined are pressurized / heated and cured while they are placed on the forming mold m. At this time, when curing heat for curing the matrix resin is supplied, the base resin of the base reinforcing plate 43 is plasticized and can be removed at the superimposed interface.

For this purpose, it is more preferable that the base resin is provided at a lower density than the matrix resin.

The reinforcing fibers 41 of the base reinforcing plate 43 are fixed to the base resin by the curing of the matrix resin. Alternatively, the matrix resin may be integrally cured between the plates to be joined f and h in a state in which the matrix resin is impregnated.

Thus, the structural strength of the joining portion between the joining target plates f and h can be remarkably improved.

As described above, the present invention is not limited to the above-described embodiments, and variations and modifications may be made by those skilled in the art without departing from the scope of the present invention. And such modifications are within the scope of the present invention.

10: first silicon pad 20: second silicon pad
30: Jig frame 40: Bi-directional Z-pinning patch
41: reinforcing fiber 42: Z pin
43: Base reinforcing plate

Claims (5)

A first step of disposing a first silicon pad including a predetermined amount of margin thickness from a predetermined first insertion depth;
A second step in which the reinforcing fibers are arranged along the surface of the first silicon pad;
A third step in which a jig frame having a plurality of guide holes formed therein is disposed along an upper portion of the arranged reinforcing fibers;
A fourth step in which a plurality of Z pins are inserted into the surface of the first silicon pad such that each of the Z pins is pushed through the respective guide holes so that each of the lower portions corresponds to the first insertion depth;
Wherein the jig frame is removed and a second silicon pad comprising the predetermined percentage of clearance thickness is laminated from a predetermined second insertion depth so that the top of the Z pin exposed to the top of the reinforcing fiber penetrates into the interior of the second silicon pad A fifth step of inserting; And
And a sixth step in which a base resin is injected and hardened between the first silicon pad and the second silicon pad. The method according to claim 1,
The fifth step
And pressing the laminate of the first silicon pad and the second silicon pad so that the laminate of the first silicon pad and the second silicon pad is closely attached to the surface of the forming mold having a surface profile corresponding to the plate to be bonded. . The method according to claim 1,
In the sixth step
Forming a sealed space between the first silicon pad and the second silicon pad;
Wherein the base resin is injected into the closed space, and the injected base resin is vacuum-diffused and impregnated into the space between the reinforcing fibers. The method according to claim 1,
In the fourth step,
The ring-shaped concavo-convex portion is recessed and formed in multiple stages along the vertical direction on the surface of each Z pin,
In the sixth step,
Wherein the base resin is made of a plastic material which is plasticized at a temperature lower than a curing start temperature of a matrix resin impregnated in a plate to be bonded. A base reinforcement plate formed in close contact with the surface of the molding die so as to have a profile corresponding to the overlapping interface between the pair of plates to be joined; And
The upper and lower portions of the upper and lower portions are protruded in both directions from the lower surface and the upper surface portion of the base reinforcing plate to a height corresponding to the thickness of the plate to be combined with each other, Lt; RTI ID = 0.0 > Z-pinning < / RTI >

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