KR20170097425A - 레이저 가공 장치 및 방법 - Google Patents

레이저 가공 장치 및 방법 Download PDF

Info

Publication number
KR20170097425A
KR20170097425A KR1020160019161A KR20160019161A KR20170097425A KR 20170097425 A KR20170097425 A KR 20170097425A KR 1020160019161 A KR1020160019161 A KR 1020160019161A KR 20160019161 A KR20160019161 A KR 20160019161A KR 20170097425 A KR20170097425 A KR 20170097425A
Authority
KR
South Korea
Prior art keywords
processing
beams
laser beam
processing beams
time
Prior art date
Application number
KR1020160019161A
Other languages
English (en)
Korean (ko)
Inventor
조성용
장재경
Original Assignee
주식회사 이오테크닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020160019161A priority Critical patent/KR20170097425A/ko
Priority to PCT/KR2016/010235 priority patent/WO2017142156A1/ko
Priority to TW105129959A priority patent/TWI628028B/zh
Publication of KR20170097425A publication Critical patent/KR20170097425A/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • B23K2203/56—

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Laser Beam Processing (AREA)
KR1020160019161A 2016-02-18 2016-02-18 레이저 가공 장치 및 방법 KR20170097425A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160019161A KR20170097425A (ko) 2016-02-18 2016-02-18 레이저 가공 장치 및 방법
PCT/KR2016/010235 WO2017142156A1 (ko) 2016-02-18 2016-09-12 레이저 가공 장치 및 방법
TW105129959A TWI628028B (zh) 2016-02-18 2016-09-14 雷射加工裝置與方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160019161A KR20170097425A (ko) 2016-02-18 2016-02-18 레이저 가공 장치 및 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020180032124A Division KR101912891B1 (ko) 2018-03-20 2018-03-20 레이저 가공 장치 및 방법

Publications (1)

Publication Number Publication Date
KR20170097425A true KR20170097425A (ko) 2017-08-28

Family

ID=59625264

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160019161A KR20170097425A (ko) 2016-02-18 2016-02-18 레이저 가공 장치 및 방법

Country Status (3)

Country Link
KR (1) KR20170097425A (zh)
TW (1) TWI628028B (zh)
WO (1) WO2017142156A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019103277A1 (ko) * 2017-11-24 2019-05-31 주식회사 이오테크닉스 앵글제어 광학계를 포함하는 레이저 가공 장치
KR102018613B1 (ko) * 2018-04-04 2019-09-06 주식회사 이오테크닉스 음향 광학 편향 시스템, 이를 포함하는 레이저 가공 장치 및 빔 차단 방법
KR102319690B1 (ko) * 2020-05-12 2021-11-02 주식회사 이오테크닉스 홀 형성 장치 및 홀 형성 방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114700628A (zh) * 2022-06-06 2022-07-05 一道新能源科技(衢州)有限公司 一种聚焦激光双折射perc电池片开槽装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003053576A (ja) * 2001-08-16 2003-02-26 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
CN101461105A (zh) * 2006-05-31 2009-06-17 彩覇阳光株式会社 激光脉冲发生装置和方法以及激光加工装置和方法
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
US7817685B2 (en) * 2007-01-26 2010-10-19 Electro Scientific Industries, Inc. Methods and systems for generating pulse trains for material processing
JP2008207210A (ja) * 2007-02-26 2008-09-11 Disco Abrasive Syst Ltd レーザー光線照射装置およびレーザー加工機
JP5274085B2 (ja) * 2008-04-09 2013-08-28 株式会社アルバック レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法
JP5770436B2 (ja) * 2010-07-08 2015-08-26 株式会社ディスコ レーザー加工装置およびレーザー加工方法
KR20130112109A (ko) * 2012-04-03 2013-10-14 주식회사 이오테크닉스 레이저 가공 균일성을 위한 레이저 출력 펄스 제어 장치 및 방법
KR101639583B1 (ko) * 2014-08-05 2016-07-14 주식회사 소재의맥 음향광변조기를 이용하여 미세 홈 또는 구멍을 가공하기 위한 레이저 장치 및 방법

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019103277A1 (ko) * 2017-11-24 2019-05-31 주식회사 이오테크닉스 앵글제어 광학계를 포함하는 레이저 가공 장치
TWI683716B (zh) * 2017-11-24 2020-02-01 南韓商Ｅｏ科技股份有限公司 包括角度控制光學系統的雷射加工裝置
KR102018613B1 (ko) * 2018-04-04 2019-09-06 주식회사 이오테크닉스 음향 광학 편향 시스템, 이를 포함하는 레이저 가공 장치 및 빔 차단 방법
KR102319690B1 (ko) * 2020-05-12 2021-11-02 주식회사 이오테크닉스 홀 형성 장치 및 홀 형성 방법
WO2021230634A1 (ko) * 2020-05-12 2021-11-18 주식회사 이오테크닉스 홀 형성 장치 및 홀 형성 방법
TWI785600B (zh) * 2020-05-12 2022-12-01 南韓商Ｅｏ科技股份有限公司 形成孔洞之裝置以及形成孔洞之方法

Also Published As

Publication number Publication date
WO2017142156A1 (ko) 2017-08-24
TWI628028B (zh) 2018-07-01
TW201729932A (zh) 2017-09-01

Similar Documents

Publication Publication Date Title
JP6837969B2 (ja) 非回折レーザビームを用いたガラス切断システムおよび方法
JP5274085B2 (ja) レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法
US9889523B2 (en) Method and device for processing a workpiece using laser radiation
KR20170097425A (ko) 레이저 가공 장치 및 방법
US8324529B2 (en) Laser machining device with a converged laser beam and laser machining method
US10707130B2 (en) Systems and methods for dicing samples using a bessel beam matrix
JP2003025085A (ja) レーザー加工方法及びレーザー加工装置
KR101912891B1 (ko) 레이저 가공 장치 및 방법
JP2008272830A (ja) レーザ加工装置
KR20160127462A (ko) 레이저 가공장치 및 그 가공방법
EP2683516B1 (en) Laser fabrication system and method
KR20210054561A (ko) 적응형 레이저빔 형성 방법 및 장치
WO2015178921A1 (en) Acousto-optic deflector with multiple transducers for optical beam steering
JP2005531797A (ja) 光作用感応構造の書き込み
KR101042687B1 (ko) 회절패턴을 이용한 프랙셔널 레이저 시스템 및 레이저 프랙셔널 조사 방법
JP2014013833A (ja) レーザ光整形装置およびレーザ光整形方法ならびにレーザ処理装置およびレーザ処理方法
KR101189537B1 (ko) 음향광학변조기를 이용한 레이저빔 제어방법
KR101423497B1 (ko) 웨이퍼 다이싱용 레이저 가공장치 및 이를 이용한 웨이퍼 다이싱 방법
KR20180060827A (ko) 레이저 가공 장치 및 레이저 가공 방법
KR101318941B1 (ko) 레이저 간섭 리소그라피 장치
KR20190038390A (ko) 스크라이브 가공 방법 및 스크라이브 가공 장치
CN217965346U (zh) 一种利用声响光学调制的激光加工装置
CN111308877B (zh) 一种全息光学元件加工装置
CN114985969A (zh) 一种利用声响光学调制的激光加工装置及激光加工方法
KR102012297B1 (ko) 멀티빔 스캐너 시스템을 이용한 패턴 형성방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
E601 Decision to refuse application
E801 Decision on dismissal of amendment
A107 Divisional application of patent