KR20170070496A - Printed circuit board - Google Patents

Abstract

The present invention relates to a printed circuit board. A printed circuit board according to an embodiment of the present invention includes a first insulating layer, a first circuit pattern formed inside the first insulating layer and having one side exposed from one side of the first insulating layer, And a second bonding portion coupled to the other surface of the pad and the first bonding portion, wherein the first bonding portion and the second bonding portion are formed on the first bonding portion and the second bonding portion, May be formed of the same material.

Description

{PRINTED CIRCUIT BOARD}

The present invention relates to a printed circuit board.

In accordance with the demand for miniaturization and high performance of electronic devices, printed circuit boards mounted on electronic devices are also being downsized and improved in performance.

Techniques have been developed in which electronic components such as passive elements or active elements are disposed inside a printed circuit board in order to realize miniaturization and high performance of electronic devices.

In the case where electronic components are disposed inside the printed circuit board, the pad formed on the electronic component and the electrodes formed on the printed circuit board must be matched and combined to ensure the reliability of the electronic device.

Korean Patent Laid-Open Publication No. 2015-0093032

According to an aspect of the present invention, there is provided a printed circuit board on which a self-alignment effect can be realized when mounting electronic components.

A printed circuit board according to an embodiment of the present invention realizes a self-alignment effect by forming a joint portion of the same material on one surface of a circuit pattern formed on an insulating layer and a pad formed on an electronic device to be mounted.

1 is a cross-sectional view schematically showing a printed circuit board according to a first embodiment of the present invention.
2 is a cross-sectional view schematically showing a printed circuit board according to a second embodiment of the present invention.
3 is a cross-sectional view schematically showing a printed circuit board according to a third embodiment of the present invention.
4 is a cross-sectional view schematically showing a printed circuit board according to a fourth embodiment of the present invention.
5 is a cross-sectional view schematically showing a printed circuit board according to a fifth embodiment of the present invention.
6 to 16 are views schematically showing a method of manufacturing a printed circuit board according to a first embodiment of the present invention.
17 to 25 are views schematically showing a method of manufacturing a printed circuit board according to a second embodiment of the present invention.
26 to 34 are views schematically showing a method of manufacturing a printed circuit board according to a third embodiment of the present invention.
35 to 42 are views schematically showing a method of manufacturing a printed circuit board according to a fourth embodiment of the present invention.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, when a component is referred to as "comprising ", it means that it can include other components as well, without excluding other components unless specifically stated otherwise. Also, throughout the specification, the term "on" means to be located above or below the object portion, and does not necessarily mean that the object is located on the upper side with respect to the gravitational direction.

In addition, the term " coupled " is used not only in the case of direct physical contact between the respective constituent elements in the contact relation between the constituent elements, but also means that other constituent elements are interposed between the constituent elements, Use them as a concept to cover each contact.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a printed circuit board according to a first embodiment of the present invention; Fig. A duplicate description will be omitted.

1st Example

1 is a cross-sectional view schematically showing a printed circuit board 1000 according to a first embodiment of the present invention.

Referring to FIG. 1, a printed circuit board 1000 according to a first embodiment of the present invention includes a first insulating layer 100, a first insulating layer 100 formed on one surface of the first insulating layer 100, A first bonding portion 10 and a pad 52 are formed on a surface of the first insulating layer 100 so as to be coupled to the first circuit pattern 1, And a second joint 20 joined to the other surface of the first joint 10 and the electronic element 50 and the pad 52.

The first bonding portion 10 and the second bonding portion 20 may be formed of the same material and at least one of solder, tin, and lead Pb may be selected and formed of the same material .

Further, the first joint portion or the second joint portion is a concept including an electrically connectable means such as soldering or bump.

The first insulating layer 100 is an insulating layer in which the electronic device 50 is embedded, and a part of the insulating layer 100 may be removed to form a through hole. As the first insulating layer 100, an insulating material such as a prepreg (PPG), an Ajinomoto Build-up Film (ABF), or a PID (Photo Imagable Dielectric) may be used. Preferably, the first insulating layer 100 may be formed of a PID, which is a photosensitive material, and the first insulating layer 100 formed of PID may be directly exposed to light and may be formed through a developing process.

Specifically, when the first insulating layer 100 is formed of PID, a separate photosensitive material may be stacked to form a through hole therein, or a laser process for removing a large area using a laser may not be performed. This can be easier.

The electronic device 50 may be embedded in the through hole formed in the first insulating layer 100.

The electronic element 50 may be electrically connected to the first circuit pattern 1 formed on the printed circuit board 1000 by forming the pad 52. [

The first circuit pattern 1 may be exposed on one surface of the first insulating layer 100. [ The first circuit pattern 1 may be an embedded circuit pattern in which a carrier member to be described later is removed and only one side of the first insulating layer 100 is exposed. In addition, tenting, SAP, MSAP And the like.

The first bonding portion 10 may be bonded to the first circuit pattern 1 on one side and the first circuit pattern 1 and the first bonding portion 10 may be formed of the same material.

The second bonding portion 20 is coupled to the other surface of the pad 52 formed on the electronic component 50 and the first bonding portion 10 to electrically connect the electronic component 50 and the first circuit pattern 1 have.

The first junction 10 and the second junction 20 formed of the same material can solve the problem that the first circuit pattern 1 and the second junction 10 are formed of different materials and the bonding force is weakened.

The first bonding portion 10 and the second bonding portion 20 of the same material have the same polarity and are easily mutually fused during melting so that the problem of displacement of the arrangement position of the electronic device 50 can be more easily corrected .

During the reflow process, the second joint portion 20 and the first joint portion 10 are melted and melted to change the state, and the second joint portion 20 and the first joint portion 10 are attracted to each other The misalignment can be corrected.

At this time, the phenomenon that the second bonding portion 20 moves in the direction of the first bonding portion 10 formed on the first circuit pattern 1 and the displacement of the arrangement position of the electronic element 50 can be corrected.

During the reflow process, the movement of the second joint portion 20 in the direction of the first joint portion 10 is performed without any other external force (self alignment).

The printed circuit board 1000 according to the first embodiment of the present invention may further include a second insulating layer 200 formed on the first insulating layer 100, And a second circuit pattern (2) formed on one surface.

A method of manufacturing the printed circuit board 1000 according to the first embodiment of the present invention will be described later.

Second Example

2 is a cross-sectional view schematically showing a printed circuit board 2000 according to a second embodiment of the present invention.

The printed circuit board 2000 according to the second embodiment differs from the printed circuit board 1000 according to the first embodiment in that the first junction part (not the first circuit pattern 1) 10 may be bonded to the first insulating layer 100 while the first bonding layer 20 is exposed.

A method of manufacturing the printed circuit board 2000 according to the second embodiment of the present invention will be described later.

Third Example

3 is a cross-sectional view schematically showing a printed circuit board 3000 according to a third embodiment of the present invention.

The printed circuit board 3000 according to the third embodiment of the present invention includes a first insulating layer 100 and a through hole 90 formed through a part of the first insulating layer 100 in the thickness direction, A first junction 10 formed inside the first insulating layer 100 and having one surface exposed at the bottom of the through hole 90, an electronic element 50 disposed inside the through hole 90, And a second bonding portion 20 for bonding the first bonding portion 10 to the pad 52 formed on the device.

The first bonding portion 10 and the second bonding portion 20 may be formed of the same material and the first bonding portion 10 may be formed in the second bonding portion 20 in a state of being embedded in the first insulating layer 100, And is coupled to the second electrode.

The printed circuit board 3000 according to the third embodiment of the present invention includes a first circuit pattern 1 formed in the first insulation layer 100 and having a first surface exposed to the first insulation layer 100 And may further include a second insulating layer 200 formed on the first insulating layer 100.

The second insulating layer 200 may be laminated on both sides of the first insulating layer 100 and the second circuit pattern 2 may be formed on the inner surface of the second insulating layer 200 have.

A via 30 may be formed under the first junction 10 to be electrically connected to the second circuit pattern 2.

Fourth Example

4 is a cross-sectional view schematically showing a printed circuit board 4000 according to a fourth embodiment of the present invention.

Referring to FIG. 4, the first bonding portion 10 may be formed to penetrate through the first insulating layer 100 in the thickness direction.

In the printed circuit board 4000 according to the fourth embodiment of the present invention, the first bonding portion 10 is formed by filling a via hole formed through the first insulating layer 100, and then selecting at least one of solder, tin, .

The first bonding portion 10 formed through the first insulating layer 100 may be directly electrically connected to the second circuit pattern 2 formed on one side or inside the second insulating layer 200.

The second insulating layer 200 may be formed in both directions with respect to the first insulating layer 100 and the second circuit pattern 2 may be formed on the inner and upper surfaces of the second insulating layer 200.

Fifth Example

5 is a cross-sectional view schematically showing a printed circuit board 5000 according to a fifth embodiment of the present invention.

Referring to FIG. 5, a second insulating layer 200 may be formed on the first insulating layer 100, and a third insulating layer 300 may be formed on the second insulating layer 200. The second insulating layer 200 and the third insulating layer 300 are stacked in one direction with respect to the first insulating layer 100 so that the electronic element 50 is exposed to one surface of the first insulating layer 100 .

The first circuit pattern 1 may be embedded in the first insulating layer 100 so that one surface of the first circuit pattern 1 is exposed to the first insulating layer 100. The circuit pattern 2 may be formed on the second insulating layer 200, As shown in FIG.

Likewise, the third circuit pattern 3 may be formed on one side or inside of the third insulating layer 300.

The first bonding portion 10 formed through the first insulating layer 100 may be electrically connected to the second circuit pattern 2.

Hereinafter, a method of manufacturing a printed circuit board according to an embodiment of the present invention will be described.

1st Example  Or second In the embodiment  For manufacturing printed circuit boards

6 to 16 are views schematically showing a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

6) of forming the carrier member 70, forming the first circuit pattern 1 on the carrier member 70 (FIG. 7), forming the first circuit pattern 1 on the carrier member 70, 8) forming the first junction 10 on the first circuit pattern 1 and forming the first insulation layer 100 on the carrier member 70 (FIG. 9) .

In the step of preparing the carrier member 70, the carrier member 70 may include the carrier core 72 and the carrier metal layer 74. The carrier member 70 may be formed with a printed circuit board on one side and then removed to form a printed circuit board that does not include the core.

In the step of forming the first circuit pattern 1 on the carrier member 70, the first circuit pattern 1 is removed from the first insulating layer 100 after the carrier member 70 is removed in the final manufacturing process Only one side can be exposed.

The first insulating layer 100 may be laminated on the carrier member 70 such that the first circuit pattern 1 is buried in the first circuit pattern 1, have.

The first insulating layer 100 may be formed in various shapes such as PID, PPG, and ABF, but it is preferable to use a PID to easily form a through-hole to be described later.

The printed circuit board 2000 according to the second embodiment may not be formed on the first circuit pattern 1 because the first bonding portion 10 is formed on one side of the carrier member 70.

In this case, when the carrier member 70 is removed, one surface of the first junction 10 may be exposed to one surface of the first insulating layer 100.

Next, a method 100 for manufacturing a printed circuit board according to the first embodiment includes forming a through hole 80 and a via hole 82 (FIG. 10) through the inside of the first insulating layer 100, (Fig. 11) of disposing the electronic element 50 in the hole 80, embedding the electronic element 50 in the first insulating layer 100 (Fig. 12) Forming the insulating layer (FIG. 12), and removing the carrier core 72 (FIG. 13).

When the first insulating layer 100 is formed of the PID in the step of forming the through holes 80 in the first insulating layer 100 (FIG. 10), as described above, It is possible to easily form the through hole 80, which is formed by removing a large area compared to the via hole 82.

The through hole 80 is preferably formed in the first insulating layer 100 corresponding to the size of the electronic device 50 so that the electronic device 50 can be disposed.

The electronic device 50 may be disposed in the first insulating layer 100 such that the first and second junctions 10 and 20 are shifted in the step of disposing the electronic element 50 in the through hole 80 have.

In general, when the electronic device 50 is disposed inside the printed circuit board, the position of the electronic device 50 disposed inside the through hole 80 is determined by a die bonding machine. In this case, When disposed, the first and second joint portions 10 and 20 can be arranged to be shifted from each other.

On the other hand, when the reflow process is performed in a state in which the first bonding portion 10 and the second bonding portion 20 are misaligned, the second bonding portion 20 is moved to the position where the first bonding portion 10 is formed It can be disposed at a position where the electronic element 50 is to be disposed.

In the step of embedding the electronic element 50 in the first insulating layer 100 (FIG. 12), the electronic element 50 is only buried in the same material as the first insulating layer 100. However, And an underfill member or the like may be filled between the electronic element 50 and the first insulating layer 100. [

After the step of forming the second insulating layer (Fig. 12) on the first insulating layer, the copper foil layer 12 may be further laminated (Fig. 12). The copper foil layer 12 is a layer on which the second circuit pattern 2 can be partially etched.

Next, a method 100 of manufacturing a printed circuit board according to the first embodiment includes a step of forming a second circuit pattern 2 on the second insulating layer 200 (FIG. 14), a step of forming a second circuit pattern 2 15) forming the third insulating layer 300 on the second insulating layer 200 so that the first insulating layer 100 is buried and the second insulating layer 100 on the first insulating layer 100 after removing the carrier metal layer 74 (FIG. 16).

The second insulating layer 200 is formed on the first insulating layer 100 from which the carrier metal layer 74 is removed after the carrier metal layer 74 is removed and the first insulating layer 100 The second insulating layer 200 may be formed in both directions.

Third In the embodiment  For manufacturing printed circuit boards

17 to 25 are views schematically showing a method of manufacturing the printed circuit board 3000 according to the third embodiment of the present invention.

The method of manufacturing the printed circuit board 3000 according to the third embodiment includes the steps of preparing the carrier member 70 including the carrier core 72 and the carrier metal layer 74 (Fig. 18) forming the first circuit pattern 1 on one side, forming the etching layer 92 (Fig. 18), forming the barrier layer 94 on the etching layer 92 19) and forming a first joint 10 on one side of the barrier layer 94 (FIG. 19).

In the step of forming the etching layer 92, the etching layer 92 is removed by an etching process to form the through hole 90, and may be formed of a metal such as copper.

Therefore, the depth of the through hole 90 can be determined according to the thickness of the etching layer 92.

In the step of forming the barrier layer 94, the barrier layer 94 is formed as a portion that is not damaged by the etchant in the process of removing the etching layer 92 in the etching process, 10).

It is preferable that the barrier layer 94 is formed of a material different from that of the ceramics layer 92. In the case where the ceramics layer 92 is formed of copper (Cu), the barrier layer 94 is preferably formed of nickel Do.

The method of manufacturing the printed circuit board 3000 according to the third embodiment includes the steps of forming the first insulating layer 100 on the carrier member 70 21) forming the second circuit pattern 2 or the via 30 on one side, and removing the carrier core 72 (Fig. 22).

Next, the manufacturing method of the printed circuit board 3000 according to the third embodiment includes the steps of removing the carrier metal layer 74 and removing the etching layer 92 (Fig. 23), removing the barrier layer 94 24) and disposing the electronic device 50 in the through hole 90 from which the etching layer 92 and the barrier layer 94 are removed (FIG. 24).

In the step of disposing the electronic element 50 in the through hole 90 from which the etching layer 92 and the barrier layer 94 are removed (FIG. 24), the first junction 10 and the second junction 10, 2 junctions 20 are arranged to be shifted, they can be arranged at positions where they are aligned in the reflow process and where the electronic elements 50 are to be arranged.

The method of manufacturing the printed circuit board 3000 according to the third embodiment includes a step of laminating the second insulating layer 200 in both directions with the first insulating layer 100 as a center, May be embedded in the insulating layer.

Fourth In the embodiment  For manufacturing printed circuit boards

26 to 34 are diagrams schematically showing a manufacturing method of the printed circuit board 4000 according to the fourth embodiment of the present invention.

The manufacturing method of the printed circuit board 4000 according to the fourth embodiment is similar to the manufacturing method of the printed circuit board 3000 according to the third embodiment, as shown in Figs. 26 and 38, The etching layer 92 and the barrier layer 94 for forming the through holes 90 may be formed.

Meanwhile, in the method of manufacturing the printed circuit board 4000 according to the fourth embodiment, the first joint 10 may be formed through the first insulating layer 100 (FIG. 29). The first bonding portion 10 may be formed through the first insulating layer 100 in the process of forming the via hole 82 and may be filled with solder tin or lead.

The first junction 10 is formed to penetrate through the first insulation layer 100 and is electrically connected to the second circuit pattern 2 formed on one exposed surface of the first insulation layer 100, .

31 to 34, the second insulating layer 200 is laminated in both directions with the first insulating layer 100 as a center, so that the electronic element 50 is embedded in the insulating layer. The substrate 4000 can be realized.

Fifth In the embodiment  For manufacturing printed circuit boards

35 to 42 are views schematically showing a method of manufacturing the printed circuit board 5000 according to the fifth embodiment of the present invention.

35 to 39, the manufacturing method of the printed circuit board 5000 according to the fifth embodiment can be performed in the same manner as the manufacturing method of the printed circuit board 4000 according to the fourth embodiment.

The manufacturing method of the printed circuit board 5000 according to the fifth embodiment includes the steps of sequentially laminating the second insulating layer 200 and the third insulating layer 300 on the first insulating layer 100 40 in that the second insulating layer 200 is laminated in both directions around the first insulating layer 100.

The carrier member 70 formed on one surface of the first insulating layer 100 is removed in a state where the second insulating layer 200 and the third insulating layer 300 are stacked (FIG. 41), and the carrier metal layer 74 The through hole 90 may be formed in the first insulating layer 100.

Therefore, in the printed circuit board 5000 according to the fifth embodiment, the electronic device 50 may be disposed in the through hole 90 formed in the first insulating layer 100 which is the outermost insulating layer.

Thereafter, in order to protect the electronic element 50, the through hole 90 in which the electronic element 50 is disposed is filled with the molding member, the insulating material, and the underfill member.

A printed circuit board according to an embodiment of the present invention includes a pad 52 and a first circuit pattern 1 on a first circuit pattern 1 and a second circuit pattern 1 on a second circuit pattern 1 to dispose the electronic device 50 inside a printed circuit board, So that the electronic device 50 can be arranged at a position where the electronic device 50 is to be arranged without any deviation.

In the manufacturing process of the printed circuit board according to the embodiment of the present invention, the size of the through hole may be variously formed according to the area and height of the etching layer 92, and the first bonding portion 10 may be embedded , Exposure, penetration, or the like, the degree of freedom of circuit design can be further increased.

In addition, the first bonding portion 10 formed in the insulating layer is limited in positional movement in a molten state, thereby realizing the self-alignment effect more effectively.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

1: first circuit pattern
2: second circuit pattern
3: Third circuit pattern
10: first connection
20: second joint
30: Via
50: Electronic device
52: Pad
80, 90: Through hole
82: Via hole
100: first insulating layer
200: second insulating layer
300: third insulating layer
1000, 2000, 3000, 4000, 5000: printed circuit board

Claims (10)

A first insulating layer;
A first circuit pattern formed inside the first insulating layer and having one surface exposed to one surface of the first insulating layer;
A first junction formed on one side of the first circuit pattern;
An electronic device formed with a pad and embedded in the first insulating layer; And
And a second joint joining the pad and the first joint,
Wherein the first junction and the second junction are formed of the same material.
The method according to claim 1,
Wherein at least one of solder, tin, and lead is selected as the material of the first bonding portion and the material of the second bonding portion.
3. The method according to claim 1 or 2,
Wherein the first circuit pattern and the first junction are formed of the same material.
3. The method according to claim 1 or 2,
Wherein the first circuit pattern and the first junction are formed of the same material.
5. The method of claim 4,
And a second circuit pattern formed on or in the second insulating layer.
A first insulating layer;
A through hole formed through a part of a thickness direction of the first insulating layer;
A first joint formed inside the first insulating layer and having one side exposed at the bottom of the through hole;
An electronic element in which a pad is formed and disposed in the through hole; And
And a second joint joining the pad and the first joint,
Wherein the first junction and the second junction are formed of the same material.
The method according to claim 6,
Wherein at least one of solder, tin, and lead is selected as the material of the first bonding portion and the material of the second bonding portion.
8. The method according to claim 6 or 7,
Wherein the first joint comprises:
And is formed so as to penetrate in a thickness direction of the first insulating layer.
The method according to claim 6,
And a first circuit pattern formed inside the first insulating layer and having one side exposed to the first insulating layer.
The method according to claim 6,
And a second insulating layer formed on the first insulating layer.

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