KR20170052294A - Temperature sensor with thermopile - Google Patents
Temperature sensor with thermopile Download PDFInfo
- Publication number
- KR20170052294A KR20170052294A KR1020150154579A KR20150154579A KR20170052294A KR 20170052294 A KR20170052294 A KR 20170052294A KR 1020150154579 A KR1020150154579 A KR 1020150154579A KR 20150154579 A KR20150154579 A KR 20150154579A KR 20170052294 A KR20170052294 A KR 20170052294A
- Authority
- KR
- South Korea
- Prior art keywords
- thermopile
- coating layer
- sensor
- infrared
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000011247 coating layer Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 24
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- -1 Polytetrafluoroethylene Polymers 0.000 claims description 5
- 150000002484 inorganic compounds Chemical class 0.000 claims description 4
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000002894 organic compounds Chemical class 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- 239000000987 azo dye Substances 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical compound N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 claims description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 3
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- AAWZDTNXLSGCEK-LNVDRNJUSA-N (3r,5r)-1,3,4,5-tetrahydroxycyclohexane-1-carboxylic acid Chemical class O[C@@H]1CC(O)(C(O)=O)C[C@@H](O)C1O AAWZDTNXLSGCEK-LNVDRNJUSA-N 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 150000004696 coordination complex Chemical class 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000003443 succinic acid derivatives Chemical class 0.000 description 1
- 239000002345 surface coating layer Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/021—Probe covers for thermometers, e.g. tympanic thermometers; Containers for probe covers; Disposable probes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/18—Homopolymers or copolymers of tetrafluoroethene
-
- C09D7/12—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
- G01J5/0011—Ear thermometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/048—Protective parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
-
- G01J5/0862—
-
- G01K13/004—
Abstract
Description
The present invention relates to a temperature sensor, and more particularly, to a thermopile temperature sensor capable of improving the performance and reliability of the temperature sensor.
Generally, two methods for measuring temperature can be classified into contact type and non-contact type. The contact type thermometer includes a mercury thermometer, an alcohol thermometer, an NTC thermometer, and a thermocouple and a platinum side thermometer for industrial use. In order to measure the temperature quickly, (Thermopile) thermometer is used.
In the case of a thermopile, it has recently been widely used as a temperature sensor element such as an ear thermometer instead of a mercury thermometer. Due to the precise measurement of the temperature, quick response speed and advantage of being able to measure without directly touching a heat source, The application range is rapidly expanding to various fields such as temperature measurement and temperature measurement of household appliances.
Referring to FIG. 1, a conventional temperature sensing apparatus using infrared rays will be described below. A temperature sensing device using infrared rays is composed of a sensor 5, a
Here, the sensor 5 includes a black body that is heated by infrared rays, and a thermopile that generates heat by the heat of the black body. Since the electrical signal from the sensor 5 is very fine, the sensor 5 is usually connected to the
When a thermopile sensor having such a structure focuses infrared light irradiated from the outside to a light receiving hole and transmits the thermopile as a thermopile, the thermopile converts the infrared light into an electric signal, and the converted electric signal is processed by the MCU to be displayed at a digital temperature .
An infrared temperature sensor element containing a thermo file is manufactured by forming a thin film of a thermocouple on a silicon wafer. Therefore, in order to improve the sensitivity of the thermopile, it is necessary to absorb the incident infrared radiation energy as much as possible and to prevent the absorbed energy from being lost.
In addition, for more accurate temperature measurement, it is essential to accurately compensate the temperature of the cold junction. However, in the case of the conventional thermopile temperature sensor, the infrared rays incident from the outside are brought into contact with the silicon wafer as well as the on-contact region, thereby raising the temperature of the silicon wafer, and the heat of the silicon wafer due to the infrared radiation is copied to the on- The temperature of the liquid is mistakenly recognized as a temperature higher than the pure temperature of the liquid.
That is, the conventional thermopile sensor affects the thermopile due to external heat and heat inside the sensor cap, which is generated through the PCB substrate, thereby deteriorating the reliability of the temperature sensor.
The thermopile temperature sensor according to the present invention has the following problems.
First, the present invention provides a thermopile temperature sensor capable of improving the performance of the temperature sensor and improving the reliability.
Second, the present invention provides a thermopile temperature sensor capable of improving stability and durability of a temperature sensor through a simple and easy structure with a low unit price.
The solution of the present invention is not limited to those mentioned above, and other solutions not mentioned can be clearly understood by those skilled in the art from the following description.
According to a first aspect of the present invention, there is provided a semiconductor device comprising: a PCB substrate; A thermopile provided on a part of the upper surface of the substrate; A lead-out IC provided on a part of the upper surface of the substrate; And a cover having a structure covering the substrate and a space formed thereon, the sensor cap having a light receiving hole at a position corresponding to an upper portion of the thermopile, wherein a coating layer for heat radiation is formed on an inner surface or an outer surface of the sensor cap .
Preferably, a coating layer made of an infrared reflective material is formed on the inner surface and the outer surface of the sensor cap. Preferably, the coating layer is made of glass and PTFE (Polytetrafluoroethylene) And a coating layer of an infrared absorbing and shielding material is formed on the outer surface.
Preferably, a lens or an infrared filter is provided under the light receiving hole or the light receiving hole, and the coating layer is made of a mixture of metal and silane and an infrared absorbing and shielding material containing an organic or inorganic compound .
In addition, the coating layer may be formed of a material including a substance group including at least one of phthalocyanine, naphthalocyanine, metal complex, azo dye, anthraquinone, squalic acid derivative, imonium dye, perylene, .
The thermopile temperature sensor according to the present invention has the following effects.
First, the present invention provides a thermopile temperature sensor which can simply improve the performance of the temperature sensor and improve the reliability.
Second, the present invention provides a thermopile temperature sensor capable of efficiently collecting infrared energy and preventing performance degradation due to an external environment.
Third, the present invention provides a high-quality thermopile temperature sensor with high performance and reliability with a simple structure of low cost.
The effects of the present invention are not limited to those mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.
1 is a view showing a structure of a conventional temperature sensing device using infrared rays.
2 is a view showing the structure of a thermopile sensor according to an embodiment of the present invention.
3 is a schematic view showing a coating layer formed on the inner and outer surfaces of the sensor cap of the thermopile temperature sensor according to another embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Wherever possible, the same or similar parts are denoted using the same reference numerals in the drawings.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms as used herein include plural forms as long as the phrases do not expressly express the opposite meaning thereto.
Means that a particular feature, region, integer, step, operation, element and / or component is specified and that other specific features, regions, integers, steps, operations, elements, components, and / It does not exclude the existence or addition of a group.
All terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Predefined terms are further interpreted as having a meaning consistent with the relevant technical literature and the present disclosure, and are not to be construed as ideal or very formal meanings unless defined otherwise.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
2 is a view showing the structure of a thermopile sensor according to an embodiment of the present invention. As shown in FIG. 2, the
In order to solve the problem of lowering the reliability of the sensor caused by the external heat of the
That is, the
As described above, each constituent element of the thermocouple has a large thermoelectric power, and the thermoelectric power of one thermoelectric material Is composed of a material having a polarity opposite to or greater than the thermoelectric power of the other thermoelectric material.
Here, the thermocouples are located at the intersection of the hot region and the cold region, and the hot junction and the cold junction are thermally isolated. Generally, the cold junction is located on the silicon substrate 110 for efficient heat sinking, and forms a black body 170 that absorbs infrared rays at the contact point.
That is, two different thermoelectric materials are placed in series on a thin diaphragm having a low thermal conductance and a low thermal capacitance, in which the
That is, in the embodiment of the present invention, when the lead-out IC is connected to the thermo-
The
A
The light receiving
2, when the
2, the
That is, as described above, in addition to efficient collection of input energy by infrared rays, factors affecting the performance of the
Therefore, in the embodiment of the present invention, in order to block factors affecting the sensitivity and performance of the thermo-
Here, the coating layer may be made of a mixture of metal and silane and an infrared absorbing and shielding material containing an organic or inorganic compound, or may be a mixture of phthalocyanine, naphthalocyanine, metal complex, azo dye, anthraquinone, Succinic acid derivatives, squalic acid derivatives, imonium dyes, perylene, quaternary and polymethine.
In addition, the coating layer as an infrared reflection or absorption / blocking agent can also be selected from the group consisting of dimethylpoly siloxane polymer, aminoalkylsilane, Mythacrylate silane, organoreactive silane, A material obtained by mixing various silanes such as a hydroxy functional silane and an organic compound or an inorganic compound may be used.
Further, by using a material including a glass material and polytetrafluoroethylene (PTFE), the coating layer can increase the heat radiation characteristic and increase the temperature and electrical stability. Here, polytetrafluoroethylene (PTFE) is a fluororesin which is excellent in chemical resistance and does not change its characteristics at a high temperature (stable at 325 degrees), has good electrical characteristics, is nonflammable and weatherable, The coefficient is also small and has the advantage of being non-toxic.
FIG. 3 is a schematic view showing the coating layers 450 and 460 formed on the inner and outer surfaces of the
In the case of infrared rays generated by external heat, the inside of the
As described above, according to the embodiment of the present invention, the inner and outer surfaces of the
The embodiments and the accompanying drawings described in the present specification are merely illustrative of some of the technical ideas included in the present invention. Accordingly, the embodiments disclosed herein are for the purpose of describing rather than limiting the technical spirit of the present invention, and it is apparent that the scope of the technical idea of the present invention is not limited by these embodiments. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
100: PCB substrate 200: thermopile
300: Lead-out IC 400: Sensor cap
430: receiving hole 450: inner side coating layer
435: Lens 460: Outer side coating layer
Claims (7)
A thermopile provided on a part of the upper surface of the substrate;
A lead-out IC provided on a part of the upper surface of the substrate; And
And a sensor cover having a structure that covers the substrate and a space to form a space therebetween, the sensor cap having a light receiving hole at a position corresponding to an upper portion of the thermopile,
Wherein a coating layer for heat radiation is formed on an inner surface or an outer surface of the sensor cap.
Wherein a coating layer made of an infrared reflecting material is formed on an inner surface and an outer surface of the sensor cap.
Wherein the coating layer comprises:
Glass, and PTFE (Polytetrafluoroethylene).
Wherein a coating layer of an infrared absorbing and shielding material is formed on an inner surface and an outer surface of the sensor cap.
And a lens or an infrared filter is provided under the light receiving hole or the light receiving hole.
The coating layer
And a mixture of infrared absorbing and shielding materials including a metal, a silane, and an organic or inorganic compound.
Wherein the coating layer comprises:
Phthalocyanine, naphthalocyanine, metal complex compounds, azo dyes, anthraquinone,
Wherein the thermopile temperature sensor is made of a material comprising a substance group including at least one of a quinic acid derivative, a coumaric acid derivative, an iminium dyestuff, perylene, quaterrier, and polymethine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150154579A KR101737400B1 (en) | 2015-11-04 | 2015-11-04 | Temperature sensor with thermopile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150154579A KR101737400B1 (en) | 2015-11-04 | 2015-11-04 | Temperature sensor with thermopile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170052294A true KR20170052294A (en) | 2017-05-12 |
| KR101737400B1 KR101737400B1 (en) | 2017-05-18 |
Family
ID=58740569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150154579A KR101737400B1 (en) | 2015-11-04 | 2015-11-04 | Temperature sensor with thermopile |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101737400B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210039750A (en) | 2019-10-02 | 2021-04-12 | 안상로 | Real-time 3d mapping system for underground space using drone(robot) |
| KR102266812B1 (en) | 2020-12-01 | 2021-06-17 | 안상로 | Three Dimension Location Mapping System of Underground Passage Using Gyro Sensors and Encoder |
| WO2022192462A1 (en) * | 2021-03-09 | 2022-09-15 | James Masten | Shielding and differentiating receiver for radiant heating processes |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021209817A1 (en) * | 2020-04-13 | 2021-10-21 | T-Smart Systems Llc | Structure and method of manufacturing for a hermetic housing enclosure for a thermal shock proof, zero thermal gradient imaging or sensing core |
-
2015
- 2015-11-04 KR KR1020150154579A patent/KR101737400B1/en active IP Right Grant
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210039750A (en) | 2019-10-02 | 2021-04-12 | 안상로 | Real-time 3d mapping system for underground space using drone(robot) |
| KR102266812B1 (en) | 2020-12-01 | 2021-06-17 | 안상로 | Three Dimension Location Mapping System of Underground Passage Using Gyro Sensors and Encoder |
| WO2022192462A1 (en) * | 2021-03-09 | 2022-09-15 | James Masten | Shielding and differentiating receiver for radiant heating processes |
| US11827966B2 (en) | 2021-03-09 | 2023-11-28 | James William Masten, JR. | Shielding and differentiating receiver for radiant heating processes |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101737400B1 (en) | 2017-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101563592B (en) | Thermal sensor with thermal barrier | |
| CN101563590B (en) | Thermal sensor with increased sensitivity | |
| KR101737400B1 (en) | Temperature sensor with thermopile | |
| CN101568813A (en) | Die temperature sensors | |
| Jones | The ultimate sensitivity of radiation detectors | |
| Keränen et al. | Infrared temperature sensor system for mobile devices | |
| CN102204779A (en) | Induction heating cooker | |
| US20130206989A1 (en) | Radiation Sensor | |
| CN111189549A (en) | Environment self-adaptive thermopile infrared sensor | |
| JP2012068115A (en) | Infrared sensor | |
| CN107543615A (en) | Heat insulation packaging structure of temperature sensor | |
| KR20170135153A (en) | Non-contact infrared temperature sensor module | |
| Minhas et al. | Effect of beam length on the uncooled microbolometer performance | |
| CN209841661U (en) | Automatic temperature-control double-channel portable colloidal gold test strip photo-thermal detection device | |
| Li et al. | Thermal simulation of micromachined bridge and self-heating for uncooled VO2 infrared microbolometer | |
| CN101021441A (en) | Filtering optical read-out micro beam temperature sensor | |
| CN111721426A (en) | Thermopile sensor and control method thereof | |
| CN201053905Y (en) | Filtering type optical reading micro-beam temperature sensor | |
| Ishii et al. | High-speed infrared radiation thermometry for microscale thermophysical property measurements | |
| Shabashkevich et al. | Optical sensor for non-selective measurements based on the cadmium antimonide | |
| Trivellin et al. | Optical temperature measurement across IR opaque Iayers by means of visible excitation and photoluminescence | |
| KR20160015611A (en) | Temperature measurement module and apparatus for portable tmeperature measurement | |
| Zhang et al. | Design and calibration of electrical substitution radiometer traced to absolute cryogenic radiometer | |
| CN211425682U (en) | Environment self-adaptive thermopile infrared sensor | |
| CN107664534A (en) | Temperature sensor packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right |