KR20170050072A - Optical lens, light emitting device package - Google Patents

Abstract

According to an embodiment, disclosed are an optical lens and a light emitting device package having the same, wherein the optical lens comprises: a first surface; a second surface facing the first surface; and a third surface connecting the first surface and the second surface. The first surface has a protruding connection unit. An area of the connection unit is 5-15% of an entire area of the first area. According to an embodiment, provided is the light emitting device package in which a coupling force between the optical lens and a driving substrate is able to be improved.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical lens and a light emitting device package including the optical lens.

An embodiment relates to an optical lens and a light emitting device package including the same.

A light emitting device (LED) is a compound semiconductor device that converts electric energy into light energy. By controlling the composition ratio of the compound semiconductor, various colors can be realized.

The nitride semiconductor light emitting device has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, a light emitting diode backlight replacing a cold cathode fluorescent lamp (CCFL) constituting a backlight of an LCD (Liquid Crystal Display) display device, a white light emitting diode lighting device capable of replacing a fluorescent lamp or an incandescent lamp, And traffic lights.

The light emitting device package can control light emitted from the light emitting device by mounting a light emitting device on a driving substrate and placing an optical lens thereon.

Embodiments provide a light emitting device package having improved coupling between an optical lens and a driving substrate.

An optical lens according to an embodiment of the present invention includes: a first surface; A second surface facing the first surface; And a third surface connecting the first surface and the second surface, wherein the first surface includes a protruding engaging portion, and the area of the engaging portion is 5% to 15% of the total area of the first surface .

The first surface may include a receiving groove extending toward the second surface.

The engaging portion may include a ring-shaped body surrounding the receiving groove.

The distance from the center of the receiving groove to the engaging portion may be 50% to 80% of the distance from the center of the receiving groove to the outer peripheral surface of the first surface.

The engaging portion may include at least one protrusion formed on an outer surface of the ring-shaped body.

And the engaging portion can perform a heat releasing path for dividing the ring-shaped body.

A light emitting device package according to an embodiment of the present invention includes: a substrate; A light emitting element disposed on the substrate; And an optical lens disposed on the substrate and controlling light emitted from the light emitting device, wherein the optical lens includes: a first surface on which light emitted from the light emitting device is incident; A second surface facing the first surface; And a third surface connecting the first surface and the second surface, wherein the first surface includes a coupling portion that engages with the substrate, and the area of the coupling portion is 5% to 5% of the total area of the first surface, 15%. ≪ / RTI >

According to the embodiment, the contact area between the optical lens and the driving substrate is enlarged, and the coupling force can be improved.

The various and advantageous advantages and effects of the present invention are not limited to the above description, and can be more easily understood in the course of describing a specific embodiment of the present invention.

1 is a conceptual view of a light emitting device package according to an embodiment of the present invention,
Fig. 2 is a plan view of the driving substrate of Fig. 1,
Fig. 3 is a perspective view of the optical lens of Fig. 1,
4 is a plan view of a conventional driving substrate,
5 is a perspective view of a conventional optical lens,
6 is a rear view of an optical lens according to an embodiment of the present invention,
7 is a rear view of an optical lens according to another embodiment of the present invention,
8 is a rear view of an optical lens according to another embodiment of the present invention,
9 is a conceptual diagram of a light emitting device according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the embodiments of the present invention are not intended to be limited to the specific embodiments but include all modifications, equivalents, and alternatives falling within the spirit and scope of the embodiments.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the embodiments, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In the description of the embodiments, in the case where one element is described as being formed "on or under" another element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, and redundant description thereof will be omitted.

FIG. 1 is a conceptual view of a light emitting device package according to an embodiment of the present invention, FIG. 2 is a plan view of the driving substrate of FIG. 1, and FIG. 3 is a perspective view of the optical lens of FIG.

1 to 3, the light emitting device package includes a driving substrate 300, a light emitting device 100 disposed on the driving substrate 300, and a light emitting device 100 disposed on the driving substrate 300, And an optical lens 200 for controlling the light emitted from the light source.

The light emitting device 100 is disposed on the driving substrate 300 and may be electrically connected to the circuit pattern of the driving substrate 300. In the embodiment, the light emitting device 100 is a light emitting diode that operates as a point light source.

The optical lens 200 can perform a function of improving the luminance uniformity of the light emitting device package by refracting the light incident from the light emitting device 100 to control the light path.

The optical lens 200 may be disposed so as to cover at least a part of the outer surface of the light emitting element 100.

The optical lens 200 may be optically separated from the light emitting device 100. [ That is, the optical lens 200 may be coupled to the driving substrate 300 to cover the light emitting device 100. However, the optical lens 200 may be implemented as an IOL (Integrated Optical Lens) type in which at least a part of the light emitting device 100 is accommodated in the optical lens 200, that is, a light emitting device integrated type.

In the embodiment, one light emitting device 100 and one optical lens 200 are disposed on one driving substrate 300, but the embodiment of the present invention is not limited thereto. For example, a plurality of light emitting elements may be disposed on one driving substrate. Further, for example, a plurality of optical lenses may be arranged corresponding to one light emitting element.

The optical lens 200 includes a first surface 201 coupled to the driving substrate 300, a second surface 202 facing the first surface 201, and a second surface 202 facing the first surface 201 and the second surface 202 (Not shown). The first surface 201 may function as a light incidence surface and the second surface 202 and the third surface 203 may function as a light exit surface. However, the function of each optical surface is not limited thereto.

The first surface 201 may include a receiving groove 205 on which the lens is seated. The receiving groove 205 may extend from the first surface 201 to the second surface 202. The size of the receiving groove 205 may be adjusted according to the size of the light emitting device 100. For example, the width d2 of the receiving groove may be 1.2 mm, and the height d1 of the lens may be 1.9 mm.

The first surface 201 may include a coupling portion 204 that engages with the driving substrate 300. The engaging portion 204 may be arranged to surround the receiving groove 205. The engaging portion 204 may protrude toward the driving substrate 300. The protruded engaging portion 204 can be inserted and fixed in the recessed groove 303 formed in the driving substrate 300. The engaging portion 204 and the concave groove 303 may be fixed by an optical adhesive. However, the present invention is not limited thereto, and the engaging portion 204 may be a groove protruding toward the second surface 202.

The second surface 202 may be disposed facing the first surface 201 and the center may be recessed toward the first surface 201. The third surface 203 may be a side connecting the first surface 201 and the second surface 202. With respect to the optical axis, the optical lens 200 may be in a symmetrical shape. Here, the optical axis may be an imaginary straight line passing through the center of the receiving groove 205 and the center of the second surface 202. Or the optical axis may be the center axis of the light emitted from the light emitting element 100.

The driving substrate 300 may include a pair of electrodes 301 and 302 electrically connected to the light emitting device 100 and a concave groove 303 to which the optical lens 200 is fixed. Further, it may further include a heat radiation pattern 304 formed on the rim portion.

FIG. 4 is a plan view of a conventional driving substrate, and FIG. 5 is a perspective view of a conventional optical lens.

4 and 5, conventionally, a plurality of leg portions 21 are formed on the optical lens 20 and a groove 31 into which the leg portion 21 is inserted is formed on the driving substrate 300. However, according to this configuration, since the leg portion 31 is inserted at a predetermined position, there is a problem that the assembly becomes complicated. Further, when the adhesive is filled excessively, there is a problem that the lens is inclined and the light flux control becomes uneven.

FIG. 6 is a rear view of an optical lens according to an embodiment of the present invention, FIG. 7 is a rear view of an optical lens according to another embodiment of the present invention, and FIG. 8 is a cross- FIG.

Referring to FIG. 6, the coupling portion 204 of the optical lens 200 may include a ring-shaped body. Therefore, there is no limitation in the direction, so that the assembly of the lens can be facilitated. In addition, the contact area between the optical lens 200 and the driving substrate increases, so that the coupling force and the adhesion force can be increased. The inner diameter d3 of the coupling portion 204 may be 3.5 mm and the outer diameter d4 may be 4.1 mm, but is not limited thereto.

The area of the engaging portion 204 may be 5% to 15% or 8% to 12% of the total area of the first surface 201. When the area of the engaging portion 204 is less than 5%, there is a problem that it is difficult to sufficiently support the lens because the contact area is small. In addition, when the area of the coupling portion 204 exceeds 15%, circuit design of the driving substrate 300 may be restricted.

At this time, the second distance R2 from the center C of the receiving groove 205 to the engaging portion 204 is the distance from the center C of the receiving groove 205 to the outer peripheral surface of the first surface 201 50% to 80%, or 60% to 70% of the distance R1. When the second distance R2 is less than 50%, the diameter of the coupling portion 204 is smaller than the lens size, which makes it difficult to sufficiently support the lens. When the second distance R2 is 80% or more, the circuit design of the driving substrate 300 is restricted .

That is, when the area of the coupling portion 204 is 5% to 15% of the first surface 201 and the second distance R2 is 50% to 80% of the first distance R1, And the driving substrate 300 can be improved.

The diameters of the receiving groove 205, the engaging portion 204, and the first surface 201 may be directly proportional to each other. For example, when the diameter R3 of the receiving groove 205 is 1.2 mm, the diameter R2 of the engaging portion may be 4.1 mm and the diameter R1 of the first surface may be 6.0 mm. At this time, when the diameter R3 of the receiving groove increases to 1.5 mm, the diameter R2 of the coupling portion increases to 5.46 mm, and the diameter R1 of the first surface increases to 8.0 mm. That is, the diameters of the receiving groove 205, the engaging portion 204, and the first surface 201 can be increased or decreased at the same ratio.

Referring to FIG. 7, at least one alignment protrusion 204a may be further formed on the outer circumferential surface of the coupling portion 204. FIG. Such an alignment protrusion 204a can align the driving substrate 300 and the optical lens 200. [ In addition, rotation of the optical lens 200 can be prevented by the alignment protrusion 204a. The number of the liner protrusions 204a is not particularly limited.

Referring to Fig. 8, the ring-shaped body constituting the engaging portion 204 can be divided into a plurality of parts. In this case, the slit region 204c between the divided bodies 204b can serve as a heat releasing path for releasing heat to the outside. As described above, since the area of the engaging portion 204 may be 5% to 15% of the total area of the first surface 201, if the area of the engaging portion 204 exceeds 15% of the first surface 201 It is possible to form the slit region 204c to adjust the area and utilize it as a heat release path.

9 is a conceptual view of the light emitting device of FIG.

The light emitting device 100 of the embodiment includes a light emitting structure 150 disposed below the substrate 110 and a pair of electrode pads 171 and 172 disposed on one side of the light emitting structure 150.

The substrate 110 includes a conductive substrate or an insulating substrate. The substrate 110 may be a material suitable for semiconductor material growth or a carrier wafer. The substrate 110 may be formed of a material selected from the group consisting of sapphire (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge. The substrate 110 can be removed as needed.

A buffer layer (not shown) may be further provided between the first semiconductor layer 120 and the substrate 110. The buffer layer may mitigate the lattice mismatch between the substrate 110 and the light emitting structure 150 provided on the substrate 110.

The buffer layer may be a combination of Group III and Group V elements or may include any one of GaN, InN, AlN, InGaN, AlGaN, InAlGaN, and AlInN. The buffer layer may be doped with a dopant, but is not limited thereto.

The buffer layer can be grown as a single crystal on the substrate 110, and the buffer layer grown with a single crystal can improve the crystallinity of the first semiconductor layer 120.

The light emitting structure 150 includes a first semiconductor layer 120, an active layer 130, and a second semiconductor layer 140. In general, the light emitting structure 150 may be cut together with the substrate 110 to be separated into a plurality of light emitting structures 150.

The first semiconductor layer 120 may be formed of a compound semiconductor such as group III-V or II-VI, and the first semiconductor layer 120 may be doped with a first dopant. The first semiconductor layer 120 may be a semiconductor material having a composition formula of In _{x 1} Al _{y 1} Ga _{1 -x1-y1} N (0? _{X1? 1} , 0 _{? Y1? 1} , 0? X1 + y1? GaN, AlGaN, InGaN, InAlGaN, and the like. The first dopant may be an n-type dopant such as Si, Ge, Sn, Se, or Te. When the first dopant is an n-type dopant, the first semiconductor layer 120 doped with the first dopant may be an n-type semiconductor layer.

The active layer 130 is a layer where electrons (or holes) injected through the first semiconductor layer 120 and holes (or electrons) injected through the second semiconductor layer 140 meet. As the electrons and the holes recombine, the active layer 130 transitions to a low energy level and can generate light having a wavelength corresponding thereto.

The active layer 130 may have any one of a single well structure, a multiple well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure, Is not limited thereto.

The second semiconductor layer 140 is formed on the active layer 130 and may be formed of a compound semiconductor such as group III-V or II-VI group. The second semiconductor layer 140 may be doped with a second dopant . A second semiconductor layer 140 is a semiconductor material having a compositional formula of _{In x5 Al y2 Ga 1 -x5- y2} N (0≤x5≤1, 0≤y2≤1, 0≤x5 + y2≤1) or AlInN, AlGaAs , GaP, GaAs, GaAsP, and AlGaInP. When the second dopant is a p-type dopant such as Mg, Zn, Ca, Sr, or Ba, the second semiconductor layer 140 doped with the second dopant may be a p-type semiconductor layer.

An electron blocking layer (EBL) may be disposed between the active layer (130) and the second semiconductor layer (140). The electron blocking layer can block the flow of electrons supplied from the first semiconductor layer 120 to the second semiconductor layer 140 and increase the probability of recombination of electrons and holes in the active layer 130. [ The energy band gap of the electron blocking layer may be greater than the energy band gap of the active layer 130 and / or the second semiconductor layer 140.

The electron blocking layer may be formed of a semiconductor material having a composition formula of In _{x 1} Al _{y 1} Ga ₁ -x ₁ -y ₁ N (0? X _{1? 1} , 0? Y _{1? 1} , 0? X 1 + _{y 1? 1} ), for example, AlGaN, InGaN, InAlGaN, and the like, but is not limited thereto.

The light emitting structure 150 includes a through hole H formed in the second semiconductor layer 140 in the direction of the first semiconductor layer 120. The insulating layer 160 may be formed on the side surfaces of the light emitting structure 150 and the through holes H. [ At this time, the insulating layer 160 may expose one surface of the second semiconductor layer 140.

The electrode layer 141 may be disposed on one side of the second semiconductor layer 140. The electrode layer 141 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide , At least one of AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrOx, RuOx, RuOx / ITO, Ni / IrOx / Au, and Ni / IrOx / Au / ITO And is not limited to these materials.

The electrode layer 141 may be formed of one of In, Co, Si, Ge, Au, Pd, Pt, Ru, Re, Mg, Zn, Hf, Ta, Rh, Ir, W, Ti, Ag, Cr, Mo, , Ni, Cu, and WTi.

The first electrode pad 171 may be electrically connected to the first semiconductor layer 120. Specifically, the first electrode pad 171 may be electrically connected to the first semiconductor layer 120 through the through hole H. The first electrode pad 171 may be electrically connected to the first solder bump 181.

The second electrode pad 172 may be electrically connected to the second semiconductor layer 140. Specifically, the second electrode pad 172 may be electrically connected to the electrode layer 141 through the insulating layer 160. The second electrode pad 172 may be electrically connected to the second solder bump 182.

The light emitting device package of the embodiment further includes optical members such as a light guide plate, a prism sheet, and a diffusion sheet, and can function as a backlight unit. Further, the light emitting device package of the embodiment can be further applied to a display device, a lighting device, and a pointing device.

At this time, the display device may include a bottom cover, a reflector, a light emitting module, a light guide plate, an optical sheet, a display panel, an image signal output circuit, and a color filter. The bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit.

The reflector is disposed on the bottom cover, and the light emitting module emits light. The light guide plate is disposed in front of the reflection plate to guide light emitted from the light emitting module forward, and the optical sheet includes a prism sheet or the like and is disposed in front of the light guide plate. The display panel is disposed in front of the optical sheet, and the image signal output circuit supplies an image signal to the display panel, and the color filter is disposed in front of the display panel.

The lighting device may include a light source module including a substrate and a light emitting device package of the embodiment, a heat dissipation unit for dissipating heat of the light source module, and a power supply unit for processing or converting an electrical signal provided from the outside, have. Further, the lighting device may include a lamp, a head lamp, or a street lamp or the like.

It will be apparent to those skilled in the art that various changes, substitutions, and alterations can be made hereto without departing from the spirit and scope of the invention as defined in the appended claims. Will be apparent to those of ordinary skill in the art.

100: Light emitting element
200: Optical lens
201: first side
202: second side
203: the third side
204:
205 receptacle

Claims (10)

A first side;
A second surface facing the first surface; And
And a third surface connecting the first surface and the second surface,
Wherein the first surface includes a protruding engaging portion, and the area of the engaging portion is 5% to 15% of the total area of the first surface.
The method according to claim 1,
Wherein the first surface includes a receiving groove extending toward the second surface.
3. The method of claim 2,
Wherein the engaging portion includes a ring-shaped body surrounding the receiving groove.
The method of claim 3,
And the distance from the center of the receiving groove to the engaging portion is 50% to 80% of the distance from the center of the receiving groove to the outer peripheral surface of the first surface.
The method of claim 3,
Wherein the engaging portion includes at least one protrusion formed on the outer surface of the ring-shaped body.
The method of claim 3,
And the coupling portion includes a conductive path for dividing the ring-shaped body.
Board;
A light emitting element disposed on the substrate; And
And an optical lens disposed on the substrate and controlling light emitted from the light emitting element,
Wherein the optical lens comprises:
A first surface on which light emitted from the light emitting device is incident;
A second surface facing the first surface; And
And a third surface connecting the first surface and the second surface,
Wherein the first surface includes a coupling portion for coupling with the substrate, and the area of the coupling portion is 5% to 15% of the total area of the first surface.
8. The method of claim 7,
Wherein the first surface includes a receiving groove in which the light emitting element is disposed.
9. The method of claim 8,
And the coupling portion includes a ring-shaped body surrounding the receiving groove.
10. The method of claim 9,
Wherein the distance from the center of the receiving groove to the engaging portion is 50% to 80% of the distance from the center of the receiving groove to the outer peripheral surface of the first surface.

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