KR20170047774A - Printed circuit board and method for manufacturing the same - Google Patents

Printed circuit board and method for manufacturing the same Download PDF

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Publication number
KR20170047774A
KR20170047774A KR1020150148252A KR20150148252A KR20170047774A KR 20170047774 A KR20170047774 A KR 20170047774A KR 1020150148252 A KR1020150148252 A KR 1020150148252A KR 20150148252 A KR20150148252 A KR 20150148252A KR 20170047774 A KR20170047774 A KR 20170047774A
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KR
South Korea
Prior art keywords
insulating material
core
insulating layer
hole
insulating
Prior art date
Application number
KR1020150148252A
Other languages
Korean (ko)
Inventor
김병문
박호식
이동근
Original Assignee
삼성전기주식회사
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Priority to KR1020150148252A priority Critical patent/KR20170047774A/en
Publication of KR20170047774A publication Critical patent/KR20170047774A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Abstract

Provided are a printed circuit board which can prevent a glass core from being damaged when being cut into unit printed circuit boards, and a manufacturing method thereof. According to an embodiment of the present invention, the printed circuit board comprises: a core unit including the glass core and a first insulating layer stacked on one surface of the glass core; a first insulating material for surrounding a part of a side surface of the core unit; and a second insulating material for surrounding a side surface of the core unit which is not surrounded by the first insulating material.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board

The present invention relates to a printed circuit board and a manufacturing method thereof.

As the printed circuit board gradually becomes thinner, deformation such as warping and twisting generated in the manufacture of the printed circuit board becomes large. To prevent this, a glass core structure in which a glass plate is formed on a core portion of a printed circuit board has been proposed.

Korea Patent Publication No. 2012-0095426

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board and a method of manufacturing the same, which can prevent breakage of a glass core when cutting a unit printed circuit board.

According to an aspect of the present invention, And a first insulating layer laminated on one surface of the glass core; A first insulating material surrounding a side portion of the core portion; And a second insulating material surrounding the side surface of the core portion in which the first insulating material is not surrounded.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: forming a core portion by laminating a first insulating layer on a surface of a glass plate; Forming a first hole in the core part along a part of a boundary between a plurality of unit printed circuit board areas; Filling the first hole with the first insulating material; Forming a second hole in the core portion along at least a portion of the boundary portion where the first hole is not formed; Filling the second hole with the second insulating material; And cutting the substrate along the boundary to form a unit printed circuit board.

1 shows a printed circuit board according to a first embodiment of the present invention.
Figure 2 shows a printed circuit board according to a second embodiment of the present invention.
3 shows a printed circuit board according to a third embodiment of the present invention.
4 to 9 are views showing a method of manufacturing a printed circuit board according to a first embodiment of the present invention.
10 to 15 show a method of manufacturing a printed circuit board according to a first embodiment of the present invention.
16 to 20 show a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a printed circuit board according to a first embodiment of the present invention; Fig. A duplicate description will be omitted.

It is also to be understood that the terms first, second, etc. used hereinafter are merely reference numerals for distinguishing between identical or corresponding components, and the same or corresponding components are defined by terms such as first, second, no.

In addition, the term " coupled " is used not only in the case of direct physical contact between the respective constituent elements in the contact relation between the constituent elements, but also means that other constituent elements are interposed between the constituent elements, Use them as a concept to cover each contact.

Printed circuit board

1 is a view illustrating a printed circuit board according to a first embodiment of the present invention.

1, the printed circuit board according to the first embodiment of the present invention includes a core 110, a first insulating material 120, and a second insulating material 130, And a first insulating layer 112 laminated on one surface of the glass core 111. The first insulating material 120 surrounds a part of the side surface of the core 110 and the second insulating material 130 ) Surrounds the lateral rest of the core portion (110).

The glass core 111 has a plate-like shape and is made of glass. As the printed circuit board is gradually thinned, warpage (warpage) occurs in the manufacture of the printed circuit board. By using a glass having a high rigidity and a low thermal expansion coefficient (CTE) .

The glass core 111 may comprise, for example, pure silicon dioxide (about 100% SiO2), soda lime glass, borosilicate glass, alumino-silicate glass, But alternative glass materials such as fluorine glass, phosphoric acid glass, chalcogen glass and the like can also be used.

In addition, other additives may be further included to form a glass having certain physical properties. Such additives include, but are not limited to, magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur and antimony as well as calcium carbonate (e.g., lime) and sodium carbonate And carbonates and / or oxides of other elements.

The first insulating layer 112 is laminated on one surface of the glass core 111. Here, one surface refers to one of the two broad surfaces of the glass core 111, that is, the upper surface of the glass core 111, and the side surface of the glass core 111, that is, the four narrow surfaces of the glass core 111 It does not mean anything.

The first insulating layer 112 protects the glass core 111. Particularly, when the hole is formed in the glass core 111, the hole can be stably formed. If holes are formed only in the glass core 111 without the first insulating layer 112, there is a high probability that the glass core 111 is cracked.

If the glass core 111 is formed with holes in a state where the first insulating layer 112 is formed, the core 110 may be further rigidized and the first insulating layer 112 may be formed on the glass core 111 And the first insulating layer 112 supports the glass core 111, so that the probability of cracking is lowered.

Cracks generated in a part of the glass core 111 are transferred to the other side, and as a result, cracks are generated in the glass core 111 as a whole, causing serious damage to the printed circuit board. The first insulating layer 112 is formed on the glass core 111 to prevent serious damage to the printed circuit board.

The first insulating layer 112 may include a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide. Further, the first insulating layer 112 may further include a reinforcing material in the resin. The reinforcement may be, for example, a fabric reinforcement, an inorganic filler, or the like. The fabric reinforcement may be a glass fiber, and the glass fiber may be impregnated with a resin to form a prepreg (PPG).

The core 110 may further include a second insulating layer 113 stacked on the other surface of the glass core 111. Like the first insulating layer 112, the second insulating layer 113 may include a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyimide. Further, the first insulating layer 112 may further include a reinforcing material in the resin. The reinforcement may be, for example, a fabric reinforcement, an inorganic filler, or the like. The fabric reinforcement may be a glass fiber, and the glass fiber may be impregnated with a resin to form a prepreg (PPG).

The second insulating layer 113 may be formed of the same material as the first insulating layer 112. The second insulating layer 113 serves to protect the glass core 111, like the first insulating layer 112. However, the first insulating layer 112 and the second insulating layer 113 do not cover the side surface of the glass core 111, but merely cover one surface and the other surface of the glass core 111.

A circuit may be formed on the core portion 110. The circuit formed on the core portion 110 may be referred to as an inner layer circuit C1. A copper foil layer is laminated on the core portion 110, and the copper foil layer is patterned to form an inner layer circuit (C1). The inner layer circuit (C1) may be formed on the upper and lower surfaces of the core portion 110.

The inner layer circuit C1 may be used without limitation as long as it is a conductive material, for example, a metal. For example, copper (Cu) may be used for the inner layer circuit C1. The inner layer circuit C1 may be formed by an additive, subtractive, or semi-additive method, but is not limited thereto.

A through vias may be formed in the core 110. The through vias may be electrically connected to the inner layer circuit (C1). The through vias may be formed of the same material as the inner layer circuit (C1), for example, copper. The through vias can electrically connect the inner layer circuit (C1) formed on the upper and lower surfaces of the core portion (110).

The through vias may be formed by filling a conductive material in the through via holes formed in the core portion 110. The through via holes may be formed by laser, etching, sawing, or the like. For example, holes may be formed in the first insulating layer 112 and the second insulating layer 113 using a laser, and holes corresponding to the holes may be etched in the glass core 111, 110 can be completed.

The conductive material of the through vias may be formed by a plating method or a conductive paste filling method, but is not limited thereto.

The first insulating material 120 is an insulating material surrounding a part of the side surface of the core part 110. When the core portion 110 includes the second insulating layer 113, the first insulating material 120 also covers (covers) the side surface of the second insulating layer 113.

Also, the first insulating material 120 may be formed on the core portion 110. That is, the first insulating material 120 may be laminated on the upper and lower surfaces of the core 110 and a part of the side surface of the core 110. The first insulating material 120 formed on one side of the core 110 and on the side of the core 110 may be integrally formed.

The through vias may be formed to penetrate not only the core portion 110 but also the first insulating material 120.

The second insulating material 130 is an insulating material surrounding the remaining portion of the side surface of the core 110 that is not surrounded by the first insulating material 120. When the core 110 includes the second insulating layer 113, the second insulating material 130 also surrounds the side surface of the second insulating layer 113. [

In addition, the second insulating material 130 may be formed on the first insulating material 120. The second insulating material 130 is formed to be in contact with the upper surface of the first insulating material 120 and to be in contact with a portion of the side surface of the core 110 that is not surrounded by the first insulating material 120. The second insulating material 130 formed on the upper surface of the first insulating material 120 and the second insulating material 130 formed on the side surface of the core 110 are integrally formed.

The first insulating material 120 and the second insulating material 130 protect the side surface of the core 110 including the glass core 111. The core portion 110 may be embedded in the first insulating material 120 and the second insulating material 130 so that the core portion 110 may not be exposed to the outside. Particularly, since the side surface of the core portion 110 is not exposed, the glass core 111 vulnerable to the impact can be protected, and defects such as the substrate widening due to the crack of the glass core 111 do not occur.

The first insulating material 120 and the second insulating material 130 may include a thermosetting resin such as an epoxy resin or a thermoplastic resin such as polyimide. Further, the first insulating layer 112 may further include a reinforcing material in the resin. The reinforcement may be, for example, a fabric reinforcement, an inorganic filler, or the like. The fabric reinforcement may be a glass fiber, and the glass fiber may be impregnated with a resin to form a prepreg (PPG).

The first insulating material 120 and the second insulating material 130 may be formed of the same material or may be formed of different materials. In all cases, the interface may be formed at the contact portion between the first insulating material 120 and the second insulating material 130, and the first insulating material 120 and the second insulating material 130 may be separated from each other.

A circuit may be formed on the first insulating material 120. The circuit formed on the first insulating material 120 may be referred to as an outer layer circuit C2. The outer layer circuit C2 may be electrically connected to the inner layer circuit C1, in which case a via may be formed on the first insulating layer 120. [

The second insulating material 130 covers the outer layer circuit C2 and exposes the pad of the outer layer circuit C2. A solder ball SB is formed on the pad of the outer layer circuit C2, and the solder ball SB can connect the printed circuit board to an external device. Another insulating material or buildup layer may be formed on the second insulating material 130.

2 is a view illustrating a printed circuit board according to a second embodiment of the present invention.

2, the printed circuit board according to the second embodiment of the present invention includes a core 110, an insulating layer, a first insulating material 120, and a second insulating material 130, 110 includes a glass core 111 and a first insulating layer 112 stacked on one side of the glass core 111. The first insulating material 120 surrounds a side surface portion of the core 110, 2 insulating material 130 surrounds the lateral rest of the core portion 110.

Here, redundant description will be minimized, and differences from the first embodiment will be described intensively.

The second insulating layer 113 is formed on one surface of the core 110 and is formed on a surface on which the first insulating layer 112 is not formed. The side surface of the core portion 110 is surrounded by the first insulating material 120 and the second insulating material 130 while the side surface of the second insulating layer 113 is surrounded by the first insulating material 120 and the second insulating material 130 And is exposed to the outside.

The second insulating layer 113 contacts the core 110 and provides rigidity to the core 110 and supports the core 110. The function of supporting the core 110 will be described in detail in the manufacturing method

The cross-sectional area of the second insulating layer 113 may be larger than the cross-sectional area of the first insulating layer 112. That is, the first insulating layer 112 may be formed to have the same area as one surface of the glass core 111. The second insulating layer 113 may have a larger area than the other surface of the glass core 111.

The first insulating material 120 and the second insulating material 130 may be formed on the core 110 so as to be in contact with one surface of the second insulating layer 113. The second insulating layer 113 is formed on one surface of the second insulating layer 113 and the second insulating layer 113 is formed to have a larger area than the core 110, The first insulating material 120 and the second insulating material 130 may be formed on the exposed portion on one side.

The first insulating material 120 is laminated on the first insulating layer 112 and the second insulating layer 113 of the core 110 and the second insulating material 130 is laminated on the first insulating material 120 Respectively.

3 is a view illustrating a printed circuit board according to a third embodiment of the present invention.

3, the printed circuit board according to the third embodiment of the present invention includes a core 110, an insulating layer, a first insulating material 120, and a second insulating material 130, 110 includes a glass core 111 and a first insulating layer 112 stacked on one side of the glass core 111. The first insulating material 120 surrounds a side surface portion of the core 110, 2 insulating material 130 surrounds the lateral rest of the core portion 110.

However, the first insulating material 120 and the second insulating material 130 do not cover the side surfaces of the second insulating layer 113, as in the second embodiment of the present invention.

The cross-sectional area of the second insulating layer 113 may be larger than the cross-sectional area of the first insulating layer 112. That is, the first insulating layer 112 may be formed to have the same area as one surface of the glass core 111. The second insulating layer 113 may have a larger area than the other surface of the glass core 111.

The first insulating material 120 may be formed on the core 110 to be in contact with one surface of the second insulating layer 113. The second insulating layer 113 is formed on one surface of the second insulating layer 113 and the second insulating layer 113 is formed to have a larger area than the core 110, A first insulating material 120 is formed on the exposed portion on one side.

The second insulating material 130 may also be formed on the exposed portion of one surface of the second insulating layer 113 so as to be in contact with one surface of the second insulating layer 113. However, the second insulating material 130 is formed in a region other than the region where the first insulating material 120 is formed on the exposed portion.

In the third embodiment of the present invention, the second insulating material 130 is formed only on the side surface of the core portion 110. That is, the second insulating material 130 is not formed on the first insulating material 120.

The first insulating material 120 and the second insulating material 130 may be made of the same material. A first insulating material 120 formed on the first insulating layer 112, a first insulating material 120 formed on a side surface of the core 110, a second insulating material 130 formed on the side surface of the core 110, Are all formed integrally, and no interface may be formed therebetween.

The first insulating material 120 may be formed on the second insulating layer 113 and may have the same area as that of the second insulating layer 113.

A third insulating material 140 may be formed on the first insulating material 130 and the second insulating material 130. The third insulating material 140 may have the same area as that of the second insulating layer 113.

Printed circuit board manufacturing method

4 to 9 are views illustrating a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

4 to 9, a method of manufacturing a printed circuit board according to a first embodiment of the present invention includes: forming a core 110 by laminating a first insulating layer 112 on a surface of a glass plate G; Forming a first hole H1, forming a first insulating material 120, forming a second hole H2, forming a second insulating material 130, And cutting.

The core portion 110 including the glass plate G is a core in a strip substrate unit. The strip substrate includes a plurality of unit printed circuit board regions (U), and the unit printed circuit board region (U) is a virtual region. The strip substrate is finally cut into unit printed circuit boards, and cutting is performed along the dicing lines. The dicing lines are located at the boundary BD between the plurality of unit printed circuit board areas U.

The step of forming the core 110 may further include the step of laminating the second insulating layer 113 on one surface of the glass plate G. [ The step of forming the core 110 may further include the step of forming the inner layer circuit C1 on the core 110.

When the metal layer M is formed on the core 110, for example, the copper foil laminate having the copper foil is prepared, the inner layer circuit C1 can be formed by patterning the copper foil.

The first insulating layer 112 and the second insulating layer 113 only cover the upper and lower surfaces of the glass plate G and do not cover the side surface of the glass plate G. [

The first hole H1 is a hole formed along a part of the boundary BD between the plurality of unit printed circuit board regions U and the first hole H1 is formed through the core portion 110. [ The first hole H1 is formed through the first insulating layer 112, the glass plate G and the second insulating layer 113 when the core 110 includes the second insulating layer 113 do.

The first hole H1 may be formed by at least one of a mechanical drill (e.g., a sandblast), a laser drill, an etching (e.g., etching with a hydrofluoric acid solution), a plasma, and the like.

In forming the first hole H1, if there is no first insulating layer 112 or first and second insulating layers, holes are formed directly on the glass plate G, so that the probability of occurrence of cracks is high, If holes are formed through the insulating layer 112 and the first and second insulating layers, the probability of occurrence of cracks is lowered, and holes can be stably formed.

The first hole (H1) is filled with the first insulating material (120). The first insulating material 120 may be formed on the core 110 and partially filled with the first hole H1. In particular, when the first insulating material 120 includes a resin, since the resin has fluidity, the resin of the first insulating material 120 flows and flows into the first hole H1. In this case, the first insulating material 120 laminated on the core 110 and the first insulating material 120 flowing into the first hole H1 are integrated, and no interface is formed between them.

After forming the first insulating material 120, forming the outer layer circuit C2 on the first insulating material 120 may be further included. The description of the outer layer circuit (C2) is as described above.

The second hole H2 is a hole formed along a portion of the boundary BD between the plurality of unit printed circuit board regions U where at least the first hole H1 is not formed. The first hole H1 and the second hole H2 may overlap, but the sum of the positions of the first hole H1 and the second hole H2 should coincide with the entire boundary BD.

The second hole H2 may be formed by a method such as a mechanical drill, a laser drill or an etching method, and is not particularly limited thereto.

The second hole H2 may extend through the core 110 and may extend through the first insulating layer 112 when the first insulating layer 112 is formed on the core 110. [

And the second hole H2 is filled with the second insulating material 130. [ The second insulating material 130 is stacked on the first insulating material 120 and a part of the second insulating material 130 flows into the second hole H2 to fill the second hole H2. When the second insulating material 130 includes a resin, the resin of the second insulating material 130 flows and flows into the second hole H2. In this case, the second insulating material 130 laminated on the first insulating material 120 and the second insulating material 130 flowing into the second hole H2 are integrally formed, and no interface is formed between them.

Meanwhile, through vias passing through the core portion 110 and the first insulating material 120 may be formed together with the second holes H2. The through vias are formed as the through via holes are plated by the plating method or filled with the conductive paste after the through via holes are formed together with the second holes (H2).

The second insulating material 130 is formed on the first insulating material 120 so as to cover the outer layer circuit C2 while the second insulating material 130 exposes the pad of the outer layer circuit C2. Solder balls SB are formed on the exposed pads.

The first hole H1 is filled with the first insulating material 120 and the second hole H2 is filled with the second insulating material 130 so as to cut along the boundary BD to form a unit printed circuit board . Since all the glass plates G existing on the boundary BD are removed and only the insulating material is present on the boundary BD, the glass sheet G is not cut during the cutting process, The risk is reduced.

Since the first insulating material 120 surrounds part of the side surface of the core unit 110 and the second insulating material 130 surrounds the other part of the unit printed circuit board thus manufactured, Lt; / RTI > Therefore, defects in the substrate expansion due to the cracks of the glass core 111 do not occur.

10 to 15 are views showing a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

10 to 15, in the method of manufacturing a printed circuit board according to the second embodiment of the present invention, a step of laminating the second insulating layer 113 on the other surface of the glass plate G of the core 110 is included do. Also, the first hole H1 and the second hole H2 do not penetrate the second insulating layer 113.

A first hole H1 is formed after the first insulating layer 112 and the second insulating layer 113 are laminated on the glass plate G. [ The first hole H1 penetrates only the first insulating layer 112 except for the second insulating layer 113 and the glass plate G as described above.

Here, the second insulating layer 113 serves to support the first insulating layer 112 and the glass plate G. The second insulating layer 113 connects the first insulating layer 112 and the glass plate G in a case where the second insulating layer 113 does not pass through than when the second insulating layer 113 is penetrated The first insulating layer 112 and the glass plate G can be more stably supported since the area is wide.

The first insulating material 120 is stacked on the core portion 110 and the second insulating layer 113 while filling the first hole H1.

The second hole H2 is formed on the boundary BD where at least the first hole H1 is not formed. The second hole H2 is formed through the first insulating material 120 and the core portion 110 and the second hole H2 does not penetrate the second insulating layer 113. [ Here, the second insulating layer 113 serves to support the first insulating layer 112 and the glass plate G. [

As a result, all the glass plates G existing on the boundary BD are removed, and only the insulating material exists on the boundary BD.

When cut along the boundary portion BD, they are separated per unit printed circuit board. The separated unit printed circuit board has a structure in which the core 110 includes a glass core 111 and a first insulating layer 112 and a second insulating layer 113 is formed on a surface opposite to the first insulating layer 112 And the area of the second insulating layer 113 is larger than the area of the first insulating layer 112.

However, the glass core 111 is completely sealed by the first insulating material 120, the second insulating material 130, and the second insulating layer 113, and is not exposed to the outside.

16 to 20 are views showing a method of manufacturing a printed circuit board according to a first embodiment of the present invention.

16 to 20, in the method of manufacturing a printed circuit board according to the third embodiment of the present invention, the second insulating layer 113 is laminated on the other surface of the glass plate G of the core 110, The holes H1 and H2 do not penetrate the second insulating layer 113 and the first holes H1 and the second holes H2 are simultaneously formed and the first holes H1 are filled The first insulating material 120 and the second insulating material 130 filling the second holes H2 are made of the same material and are integrally formed.

The first hole H1 penetrates the first insulating layer 112 of the core 110 and the glass plate G and is formed so as not to penetrate the second insulating layer 113. At the same time, a second hole H2 is formed, and a hole is formed with respect to the entire boundary BD by the first hole H1 and the second hole H2.

Even if a hole is formed with respect to the entire boundary BD by the first hole H1 and the second hole H2, since the second insulating layer 113 exists, the first hole H1 and the second hole H2 H2 are not completely separated from each other.

The first hole H1 is filled with the first insulating material 120 and the first insulating material 120 is formed on the core portion 110 and the second insulating layer 113, And is filled with the second insulating material 130. At this time, the first insulating material 120 filled in the first hole H1, the first insulating material 120 formed on the core portion 110, and the second insulating material 130 filled in the second hole H2, Since they are formed integrally and made of the same material, no interface is formed between them.

On the other hand, the inner layer circuit C1 is formed on the core portion 110, the first insulating material 120 covers the inner layer circuit C1, the outer layer circuit C2 is formed on the first insulating material 120, 3 The insulating material 140 covers the outer layer circuit C2 and exposes the pad of the outer layer circuit C2.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

110: core part
111: glass core
112: first insulating layer
113: second insulating layer
120: first insulating material
130: Second insulating material
140: Third insulating material
C1: Inner layer circuit
C2: outer layer circuit
SB: Solder ball
G: Glass plate
BD: boundary
H1: 1st hole
H2: Second hole
U: Unit printed circuit board area

Claims (17)

Glass core; And a first insulating layer laminated on one surface of the glass core;
A first insulating material surrounding a side portion of the core portion; And
And a second insulating material surrounding the side surface of the core portion in which the first insulating material is not enclosed.
The method according to claim 1,
Wherein the core portion further comprises a second insulating layer laminated on the other surface of the glass core.
3. The method according to claim 1 or 2,
The first insulating material is formed on the core portion,
Wherein the second insulating material is formed on the first insulating material.
3. The method of claim 2,
Wherein the core portion is embedded by the first insulating material and the second insulating material and is not exposed to the outside.
The method according to claim 1,
And a second insulating layer laminated on the other surface of the glass core.
6. The method of claim 5,
Wherein a cross-sectional area of the second insulating layer is larger than a cross-sectional area of the first insulating layer.
The method according to claim 6,
Wherein the first insulating material and the second insulating material are in contact with one surface of the second insulating layer.
8. The method according to any one of claims 5 to 7,
Wherein the first insulating material and the second insulating material are made of the same material.
Laminating a first insulating layer on one surface of a glass plate to form a core portion;
Forming a first hole in the core part along a part of a boundary between a plurality of unit printed circuit board areas;
Filling the first hole with the first insulating material;
Forming a second hole in the core portion along at least a portion of the boundary portion where the first hole is not formed;
Filling the second hole with the second insulating material; And
And cutting the substrate along the boundary to form a unit printed circuit board.
10. The method of claim 9,
The forming of the core portion may include:
And laminating a second insulating layer on the other surface of the glass plate.
11. The method of claim 10,
Wherein the first hole penetrates both the first insulating layer, the glass plate, and the second insulating layer.
10. The method of claim 9,
The first insulating material is laminated on the core portion,
And the second hole penetrates the core portion and the first insulating material.
10. The method of claim 9,
Wherein the second insulating material is laminated on the first insulating material.
10. The method of claim 9,
Wherein the cut-out core portion of the unit printed circuit board is embedded by the first insulating material and the second insulating material and is not exposed to the outside.
10. The method of claim 9,
After the step of forming the core portion,
And forming a second insulating layer on the other surface of the glass plate.
16. The method of claim 15,
Wherein the first hole and the second hole penetrate the core portion excluding the second insulating layer.
16. The method of claim 15,
Wherein the first insulating material and the second insulating material are made of the same material.
KR1020150148252A 2015-10-23 2015-10-23 Printed circuit board and method for manufacturing the same KR20170047774A (en)

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Application Number Priority Date Filing Date Title
KR1020150148252A KR20170047774A (en) 2015-10-23 2015-10-23 Printed circuit board and method for manufacturing the same

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Publication Number Publication Date
KR20170047774A true KR20170047774A (en) 2017-05-08

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