KR20170035783A - 산성 구리 전기도금조 및 낮은 내부 응력 및 양호한 연성 구리 침착물을 전기도금하는 방법 - Google Patents

산성 구리 전기도금조 및 낮은 내부 응력 및 양호한 연성 구리 침착물을 전기도금하는 방법 Download PDF

Info

Publication number
KR20170035783A
KR20170035783A KR1020160114935A KR20160114935A KR20170035783A KR 20170035783 A KR20170035783 A KR 20170035783A KR 1020160114935 A KR1020160114935 A KR 1020160114935A KR 20160114935 A KR20160114935 A KR 20160114935A KR 20170035783 A KR20170035783 A KR 20170035783A
Authority
KR
South Korea
Prior art keywords
copper
internal stress
stress
acid
electroplating
Prior art date
Application number
KR1020160114935A
Other languages
English (en)
Korean (ko)
Inventor
웨이 링윈
화 카오 위
헤이즈브룩 레베카
코로나 로버트
르페브르 마크
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 filed Critical 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
Publication of KR20170035783A publication Critical patent/KR20170035783A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020160114935A 2015-09-09 2016-09-07 산성 구리 전기도금조 및 낮은 내부 응력 및 양호한 연성 구리 침착물을 전기도금하는 방법 KR20170035783A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562216054P 2015-09-09 2015-09-09
US62/216,054 2015-09-09

Publications (1)

Publication Number Publication Date
KR20170035783A true KR20170035783A (ko) 2017-03-31

Family

ID=56802398

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160114935A KR20170035783A (ko) 2015-09-09 2016-09-07 산성 구리 전기도금조 및 낮은 내부 응력 및 양호한 연성 구리 침착물을 전기도금하는 방법

Country Status (6)

Country Link
US (1) US20170067173A1 (zh)
EP (1) EP3141634A1 (zh)
JP (1) JP2017053031A (zh)
KR (1) KR20170035783A (zh)
CN (1) CN106521571A (zh)
TW (1) TW201712160A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190093448A (ko) * 2018-02-01 2019-08-09 케이씨에프테크놀로지스 주식회사 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102647950B1 (ko) * 2017-11-20 2024-03-14 바스프 에스이 레벨링제를 포함하는 코발트 전기도금용 조성물
US11746433B2 (en) * 2019-11-05 2023-09-05 Macdermid Enthone Inc. Single step electrolytic method of filling through holes in printed circuit boards and other substrates
WO2023117128A1 (en) * 2021-12-24 2023-06-29 Circuit Foil Luxembourg Electrolytic copper foil having high tensile strength and secondary battery comprising the same
CN116041236A (zh) * 2022-12-30 2023-05-02 光华科学技术研究院(广东)有限公司 二硫代酯类有机物及其制备方法与应用、镀铜液

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4388611B2 (ja) * 1998-09-14 2009-12-24 イビデン株式会社 銅被膜からなる配線を有するプリント配線板およびその製造方法、並びに銅被膜からなる回路を有する回路板
US6610192B1 (en) 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US6800188B2 (en) 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7128822B2 (en) 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
JP2005029818A (ja) * 2003-07-09 2005-02-03 Ebara Corp めっき方法
EP1741804B1 (en) 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Electrolytic copper plating method
EP2576696B1 (en) * 2010-06-01 2017-10-04 Basf Se Composition for metal electroplating comprising leveling agent
US20120024713A1 (en) * 2010-07-29 2012-02-02 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) with heated substrate and cooled electrolyte
JP2012127003A (ja) * 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
US9243339B2 (en) * 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
SG2012066940A (en) * 2012-09-09 2014-04-28 Rohm & Haas Elect Mat Low internal stress copper electroplating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190093448A (ko) * 2018-02-01 2019-08-09 케이씨에프테크놀로지스 주식회사 고온 치수 안정성 및 집합조직 안정성을 갖는 전해동박 및 그 제조방법
US11346015B2 (en) 2018-02-01 2022-05-31 Kcf Technologies Co., Ltd. Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor

Also Published As

Publication number Publication date
EP3141634A1 (en) 2017-03-15
CN106521571A (zh) 2017-03-22
US20170067173A1 (en) 2017-03-09
JP2017053031A (ja) 2017-03-16
TW201712160A (zh) 2017-04-01

Similar Documents

Publication Publication Date Title
JP6496755B2 (ja) 低内部応力銅電気めっき方法
KR20170035783A (ko) 산성 구리 전기도금조 및 낮은 내부 응력 및 양호한 연성 구리 침착물을 전기도금하는 방법
CN101435094B (zh) 镀铜浴的配方
KR20160127647A (ko) 낮은 내부 스트레스 및 우수한 전성 구리 증착물을 전기도금하는 산 구리 전기도금조 및 방법
KR102332676B1 (ko) 시아나이드를 함유하지 않는 산성 무광택 은 전기도금 조성물 및 방법
WO2022041093A1 (en) Method of electroplating stress-free copper film
US20120205250A1 (en) Electrolytic copper plating solution composition
US11555252B2 (en) Satin copper bath and method of depositing a satin copper layer
KR20170066209A (ko) 뒤틀림을 억제하기 위한 박막 기판 상에 낮은 내부 응력 구리 침착물을 전기도금하는 방법
CN108441898B (zh) 一种电镀溶液及方法
EP2620529B1 (en) Method for producing matt copper deposits
US10590556B2 (en) Copper electroplating baths containing compounds of reaction products of amines and quinones
SG2012066940A (en) Low internal stress copper electroplating method
CN111485262A (zh) 铟电镀组合物和在镍上电镀铟的方法
US12071700B2 (en) Electroplating with a polycarboxylate ether supressor

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application