KR20170026718A - Apparatus for fine pattern formation using Roll-to-roll printed electronics process - Google Patents
Apparatus for fine pattern formation using Roll-to-roll printed electronics process Download PDFInfo
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- KR20170026718A KR20170026718A KR1020150120666A KR20150120666A KR20170026718A KR 20170026718 A KR20170026718 A KR 20170026718A KR 1020150120666 A KR1020150120666 A KR 1020150120666A KR 20150120666 A KR20150120666 A KR 20150120666A KR 20170026718 A KR20170026718 A KR 20170026718A
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- roll
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- flexible substrate
- alignment mark
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- H01L51/0004—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/951—Supplying the plurality of semiconductor or solid-state bodies
- H01L2224/95115—Supplying the plurality of semiconductor or solid-state bodies using a roll-to-roll transfer technique
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a fine pattern forming apparatus using a roll-to-roll printing electronic process technology capable of realizing a fine pattern, including an alignment mark generating unit for marking a first alignment mark on a flexible substrate, A printing unit for printing a second alignment mark on the flexible substrate and printing a pattern on the flexible substrate, and an image forming unit for forming an image of the first alignment mark and the image of the second alignment mark formed on the flexible substrate, An image acquiring unit that acquires a pattern of a pattern to be formed on a substrate by using a roll-to-roll printing electronic processing technique.
Description
The present invention relates to an apparatus and a method for forming a fine pattern using a roll-to-roll printing electronic processing technique capable of forming a fine pattern.
BACKGROUND ART [0002] In recent years, the field of printed electronics has been attracting attention as a printing method of producing electronic devices such as RFID antennas, organic transistors, flexible displays, and solar cells. Such an electronic device is manufactured by a printing apparatus on a general flexible substrate, and a product capable of performing the function of an electronic device can be mass-produced only by maintaining the accuracy to several tens of microns.
In the flexible substrate printing apparatus used for manufacturing the above-described electronic device, accurate pressure control and tension control play an important role in increasing the transfer rate of the functional ink and ensuring uniform transfer quality. In addition, in order to produce electronic elements such as transistors by superimposing printing on functional inks such as insulating, semiconducting, and conductive, alignment accuracy of each ink layer must be raised to the order of several to several tens of microns.
As a conventional flexible substrate printing apparatus, for example, in the case of offset printing, a roll-to-roll type flexible substrate printing apparatus using three rolls (gravure roll, printing roll, and backup roll) is used.
However, in the apparatus for forming a fine pattern using the conventional roll-to-roll printing electronic processing technology, there is a problem in that it is difficult to form a fine pattern because there is a limitation in inserting and ejecting ink into a pattern stamped on the depth or width of the pattern imprinted on the printing roll. .
SUMMARY OF THE INVENTION The present invention provides a fine pattern forming apparatus using a roll-to-roll printing electronic process technology capable of realizing a fine pattern and solving various problems including the above problems. However, these problems are exemplary and do not limit the scope of the present invention.
According to one aspect of the present invention, there is provided an alignment mark forming apparatus comprising: an alignment mark generation unit for marking a first alignment mark on a flexible substrate; a second alignment mark printed on the flexible substrate transferred by the alignment mark generation unit; A printing unit for printing on a substrate, and an image obtaining unit for obtaining an image of the first alignment mark and the second alignment mark formed on the flexible substrate printed by the printing unit. There is provided an apparatus for forming a fine pattern.
The alignment mark generator may include a generating laser module for generating the first alignment mark with a laser on the flexible substrate.
The printing unit includes a printing roll for printing the pattern on the flexible substrate, a first plate making roll for turning off only the portion unnecessary for printing the pattern on the flexible substrate, Modules.
The printing unit may further include a second plate making roll, and the first plate making roll and the second plate making roll may be selectively turned off from the printing roll.
And a defective pattern correcting unit for removing a defective pattern printed on the flexible substrate and applying a metal to the removed portion.
The defective pattern correcting unit may include a removal laser module for removing the defective pattern by irradiating the defective pattern with a laser, and a metal jet module for depositing a metal at the defective pattern removed portion.
According to one embodiment of the present invention as described above, it is possible to implement a fine pattern forming apparatus using a roll-to-roll printing electronic processing technique capable of realizing a fine pattern. Of course, the scope of the present invention is not limited by these effects.
1 is a conceptual diagram schematically showing an apparatus and a method for forming a fine pattern using a roll-to-roll printing electronic processing technique according to an embodiment of the present invention.
2 is a conceptual diagram schematically showing a part of an apparatus and a method of manufacturing a fine pattern using a roll-to-roll printing electronic processing technique according to an embodiment of the present invention.
FIG. 3 is a conceptual diagram schematically showing a part of a device for forming a fine pattern using a roll-to-roll printing electronic processing technique and a manufacturing method according to another embodiment of the present invention.
FIG. 4 is a conceptual diagram schematically showing an apparatus and method for forming a fine pattern using a roll-to-roll printing electronic processing technique according to another embodiment of the present invention.
FIG. 5 is a conceptual view schematically showing a part of a device for forming a fine pattern using a roll-to-roll printing electronic processing technique and a manufacturing method according to another embodiment of the present invention.
FIG. 6 is a conceptual diagram schematically showing a part of a device for forming a fine pattern using a roll-to-roll printing electronic processing technique and a manufacturing method according to another embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.
In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, but can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.
While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing.
The terms first, second, A, B, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.
It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a conceptual diagram schematically showing an apparatus for manufacturing a fine pattern using a roll-to-roll printing electronic process technology and a manufacturing method thereof according to an embodiment of the present invention. An apparatus for fine pattern formation using a roll-to-roll printing electronic processing technique according to this embodiment includes an alignment mark generating unit, a printing unit, and an image obtaining unit. In the following embodiments, an apparatus for fine pattern formation using roll-to-roll printing electronic processing technology can perform a continuous roll-to-roll printing electronic process.
The alignment mark generation unit may mark the first alignment mark on the flexible substrate. The alignment mark generating unit may mark the first alignment mark on the flexible substrate using a laser. That is, the alignment mark generator may include a generating laser module for generating a first alignment mark with a laser on the flexible substrate. Here, the generated laser module may use CO2, Fiber, YAG laser or the like having various outputs.
And the generating laser module is disposed on a flexible substrate between the rolls. For example, the generating laser module may be disposed on the upper surface of the flexible substrate to irradiate the flexible substrate with a laser.
The printing unit can print the second alignment mark on the flexible substrate fed from the alignment mark generating unit by using the roll. The printing unit can print a pattern for forming the circuit on the flexible substrate. The description of the printing unit will be described later in detail.
The image obtaining unit may obtain an image of a first alignment mark and a second alignment mark formed on the flexible substrate printed in the printing unit. Specifically, the first alignment mark and the second alignment mark generated on the flexible substrate are marks for confirming the alignment state of the flexible substrate. When the second alignment mark is printed in conformity with the first alignment marks, And the rollers are aligned correctly.
Accordingly, in order to grasp the alignment state in the control unit, the image obtaining unit may obtain an image of the first alignment mark and the second alignment mark, and transmit the image to the control unit. The image acquiring unit may include a camera such as an infrared camera.
The image acquiring unit is disposed apart from the printing unit, and can be disposed on the opposite side to the alignment mark generating unit with respect to the printing unit. That is, the alignment mark generation unit, the printing unit, and the image acquisition unit may be arranged in this order. The flexible substrate may pass through the alignment mark generating unit, the printing unit, and the image acquiring unit in this order.
The printing unit may further include a control unit for receiving the image of the first alignment mark and the second alignment mark from the image acquiring unit and determining the alignment state of the flexible substrate. The control unit may adjust the conveying speed of the flexible substrate so as to match the first alignment mark and the second alignment mark, adjust the rotation speed of the printing unit, or change the position of the roller or the position of the axis of the printing unit.
2 is a conceptual diagram schematically showing a printing unit of a fine pattern forming apparatus using a roll-to-roll printing electronic processing technique according to an embodiment of the present invention. The printing unit will be described in detail with reference to Fig.
The printing unit can form a pattern on a flexible substrate by applying a reverse offset method and a gravure offset method.
Conventionally, the reverse offset method implements a fine line width of 5 mm, but is not suitable for a fine pattern forming apparatus using a roll-to-roll printing electronic process technology. The gravure offset method is capable of performing roll-to-roll printing, but it is difficult to stably implement a line width of 10 mm or less.
However, the printing unit according to the present embodiment is applicable to a roll-to-roll type printing electron and can realize a fine line width of 5 mu m or less.
Specifically, referring to Fig. 2, the printing unit may include a printing roll, a first plate making roll, and an ink supply module.
The printing roll can receive the pattern from the first plate making roll and print the pattern on the flexible substrate. That is, the printing roll may be a blanket roll. The printing roll is supplied with ink by the ink supply device and turns off the pattern through contact with the relief portion of the first plate making roll, and the pattern turned off on the printing roll sets the ink on the flexible substrate .
The first plate making roll is formed with a pattern embossed. The outer circumferential surface of the first plate making roll is formed with a pattern of relief, and is generally called crease. That is, the first plate making roll is a roll-type crease, and the roll-type crease may be a pattern roll using a photolithography process to realize a fine pattern. The first plate making roll may have a first groove formed only in a portion necessary for printing.
Therefore, according to the present embodiment, the printing unit uses a roller type as the first plate making roll, and enables the reverse offset method to be applied not only to the roll-to-plate method but also to the roll-to-roll method. Therefore, the printing unit according to the present embodiment can realize a fine line width of 5 mm or less in the roll-to-roll method.
On the other hand, the printing unit may include an ink supply module for supplying ink to the printing roll.
The ink supply module is capable of supplying ink to the printing roll in a slot die type by arranging the ink along the longitudinal direction of the printing roll. Of course, the present invention is not limited to the slot die type, and the ink supply module may supply ink to the printing roll in other types such as dipping type.
The ink supply module may include a nozzle, a pump, and a tank in which ink is stored, for supplying ink.
In addition, the printing unit may further comprise a cleaning module for cleaning the first plate making roll. The cleaning module may be of the roll type, or the first plate making roll may be cleaned using the cleaning melt, or the first plate making roll may be cleaned using vacuum adsorption.
Further, the printing unit may further include a drying module for improving the durability of the printing roll. The drying module can increase the viscosity of the printing roll to dry the outer circumferential surface of the printing roll to smooth off the ink, and improve the durability of the blanket by drying the solvent contained in the printing roll composed of a blanket or the like . Such a drying module may include a far infrared heater. Of course, the drying module is not limited to a far-infrared heater, and the drying module can be modified in various ways such as drying a printing roll using hot air or the like.
3 is a conceptual diagram schematically showing an apparatus for forming a fine pattern using a roll-to-roll printing electronic processing technique according to another embodiment of the present invention. FIG. 2 is a conceptual diagram schematically showing a printing unit of a fine pattern forming apparatus using roll-to-roll printing electronic processing technology. The apparatus for fine pattern formation using the roll-to-roll printing electronic process technology according to the present embodiment is the same as or similar to the electronic device according to the above-described embodiment. Therefore, redundant description will be omitted.
According to this embodiment, the printing unit further includes a second plate making roll in the printing unit according to the above embodiment, and the first plate making roll and the second plate making roll can be selectively turned off from the printing roll.
The second plate making roll can turn off the ink from the printing roll by applying a gravure offset method. The second plate making roll is patterned at a negative angle, and supplies ink to the patterned portion at an engraved surface and turns off the supplied ink from the printing roll.
The printing roll can be selectively rotated in the forward and reverse directions by the first and second plate making rolls.
Meanwhile, FIG. 4 is a conceptual diagram schematically showing an apparatus for forming a fine pattern using a roll-to-roll printing electronic processing technique according to another embodiment of the present invention. The fine pattern forming apparatus using the roll-to-roll printing electronic processing technique according to the present embodiment may further include a bad pattern correcting unit in the fine pattern forming apparatus using the roll-to-roll printing electronic processing technique according to the above-described embodiment. Therefore, redundant description will be omitted.
The defective pattern correcting unit can detect defective of the flexible substrate on which the pattern is printed in the printing unit, and correct the detected defective pattern.
Specifically, the defective pattern correcting section may include a photographing section for photographing the flexible substrate and a detecting section for receiving an image from the photographing section and detecting a defective pattern. Here, the detection unit may be the control unit described above.
The bad pattern correcting unit can remove the detected bad pattern. Specifically, the defective pattern correcting section may include a defective laser module for removing a defective pattern by irradiating the defective pattern with a laser. For example, a removal laser module can remove a defective pattern by using a laser ablation method.
Specifically, the laser ablation technique is called LIFT (Laser Induced Forward Transfer) technology, and a conductive material coated on a separate flexible substrate and a separate flexible substrate is prepared on a defective pattern. At this time, the conductive material coated on the separate flexible substrate is prepared to face the defective pattern. For example, as shown, the conductive material is located above the defective pattern.
Using a laser, a conductive material coated on a separate flexible substrate is scanned in the same pattern as the defective pattern. The scanned conductive material moves to the place where the defective pattern is located, replacing the defective pattern.
6 is a conceptual diagram schematically showing an apparatus for forming a fine pattern using a roll-to-roll printing electronic processing technique according to another embodiment of the present invention. The printing electronic device according to the present embodiment is the same as or similar to the printing electronic device according to the above-described embodiments. Particularly, the metal jet module of the defective pattern correcting unit according to the present embodiment may be different from the metal jet module of the defective pattern correcting unit according to the above-described embodiment. The apparatus for fine pattern formation using roll-to-roll printing electronic processing technology may include any one or both of the metal jet module according to the present embodiment and the metal jet module according to the above embodiment.
MetalJet modules can be filled with defective metal patterns using organic vapor jet printing (OVJP).
At this time, the metal jet module can perform the metal jet process which can be realized at room temperature. For example, a conventional patterning method of an ink jet or EHD method basically contains a solvent, and an additional sintering process is required. However, since the metal jet module melts the metal material at a temperature lower than the melting temperature of the polymer film, which is a flexible substrate, and jetting the metal material, a separate solvent is not required and an additional sintering process is not required.
In addition, the defective pattern correcting unit may include a metal jet module for jetting metal to a portion where the defective pattern is removed. In this embodiment, the metal jet module may be a technique of jetting a metal piece generated by ablation by pulse laser of a metal material by a low-temperature metal jet method through a hydrodynamic technique after focusing.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.
Claims (6)
A printing unit for printing a second alignment mark on the flexible substrate transferred by the alignment mark generation unit and printing a pattern on the flexible substrate,
An image acquiring unit for acquiring an image of the first alignment mark and the second alignment mark formed on the flexible substrate printed by the printing unit,
Wherein the fine pattern forming apparatus is a roll forming apparatus.
Wherein the alignment mark generator comprises a generating laser module for generating the first alignment mark with a laser on the flexible substrate.
The printing unit includes:
A printing roll for printing the pattern on the flexible substrate,
A first plate-making roll for turning off only the portion unnecessary for printing the pattern on the flexible substrate from the printing roll, and
An ink supplying module for supplying ink to the printing roll;
Wherein the fine pattern is formed by a roll-to-roll printing electronic process.
Wherein the printing unit further includes a second plate making roll, and the first plate making roll and the second plate making roll are selectively turned off from the printing roll.
Further comprising a defective pattern correcting unit for removing a defective pattern printed on the flexible substrate and applying a metal to the removed portion.
Wherein the bad pattern correcting unit comprises:
A removal laser module for removing the defective pattern by irradiating the defective pattern with a laser, and
And a metal jet module for depositing a metal on the portion where the defective pattern is removed.
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| KR1020150120666A KR101787013B1 (en) | 2015-08-27 | 2015-08-27 | Apparatus for fine pattern formation using Roll-to-roll printed electronics process |
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| KR1020150120666A KR101787013B1 (en) | 2015-08-27 | 2015-08-27 | Apparatus for fine pattern formation using Roll-to-roll printed electronics process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023075348A1 (en) * | 2021-10-25 | 2023-05-04 | 서울대학교산학협력단 | Method for manufacturing multilayer thin-film fpcb and heater |
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| KR102253704B1 (en) | 2017-10-31 | 2021-05-18 | 금오공과대학교 산학협력단 | Method for manufacturing high resolution large-area fine pattern and flat panel display manufactured by the same |
| KR102089581B1 (en) | 2017-10-31 | 2020-03-16 | 금오공과대학교 산학협력단 | Method for manufacturing high resolution large-area fine pattern and flat panel display manufactured by the same |
| KR102404682B1 (en) | 2020-04-23 | 2022-06-07 | 성균관대학교산학협력단 | Roll-to-roll fabricated apparatus for molecular diagnosis through graphene based surface plasmon resonance and Method of fabricating the same |
| KR102539869B1 (en) | 2020-06-29 | 2023-06-08 | 성균관대학교산학협력단 | Roll-to-roll fabricated apparatus for molecular diagnosis through metal-graphene based surface plasmon resonance and Method of fabricating the same |
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| TWI455235B (en) * | 2007-09-11 | 2014-10-01 | 尼康股份有限公司 | A manufacturing method of a display element, and a manufacturing apparatus for a display element |
| FI124325B (en) * | 2012-06-08 | 2014-06-30 | Tecnomar Oy | Laser process alignment measurement method |
| KR101629728B1 (en) | 2014-10-01 | 2016-06-13 | 한국기계연구원 | Roll to roll printing system with a precision alignment marker |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023075348A1 (en) * | 2021-10-25 | 2023-05-04 | 서울대학교산학협력단 | Method for manufacturing multilayer thin-film fpcb and heater |
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