KR20170022123A - Composition of synthetic resine pellet having sericite and method of preparing the same - Google Patents
Composition of synthetic resine pellet having sericite and method of preparing the same Download PDFInfo
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- KR20170022123A KR20170022123A KR1020150116719A KR20150116719A KR20170022123A KR 20170022123 A KR20170022123 A KR 20170022123A KR 1020150116719 A KR1020150116719 A KR 1020150116719A KR 20150116719 A KR20150116719 A KR 20150116719A KR 20170022123 A KR20170022123 A KR 20170022123A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B7/00—Mixing; Kneading
- B29B7/80—Component parts, details or accessories; Auxiliary operations
- B29B7/86—Component parts, details or accessories; Auxiliary operations for working at sub- or superatmospheric pressure
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- B29C47/0011—
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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Abstract
A synthetic resin chip composition using a sericite as a base material for making a product and a method of manufacturing the same are disclosed. To this end, a synthetic resin chip composition using sericite comprising 30 to 80 wt% of a sericite powder and 20 to 70 wt% of a binder resin is provided. Also, it is preferable that a mixing step of adding 30 to 80% by weight of a sericite powder and 20 to 70% by weight of a binder resin powder to a blender equipped with a high-speed stirring device and stirring to produce a mixture, A molding step of extruding and molding the melt into an extruder, and a processing step of drying and cutting the molded extrudate. The present invention also provides a method of producing a synthetic resin chip composition using the sericite. The synthetic resin chip composition according to the present invention can be used for various interior materials such as interior interiors, ducts for air conditioning, covering materials for cables and electronic product housings, Thereby improving the health of the user.
Description
The present invention relates to a synthetic resin chip composition using a sericite as a base material for producing a product and a method of manufacturing the same. More particularly, the present invention relates to a method of manufacturing a synthetic resin chip composition To a synthetic resin chip composition using the sericite which can be used and a manufacturing method thereof.
As the air pollution and the destruction of the natural environment are caused by the development of the electronic civilization and the private culture by the development of the modern heavy chemical industry, it becomes a big problem of the society. Therefore, the body of the person The quality of the air around them has become an important issue, and atmospheric air has been found to be charged by cations.
This cationization not only increases the major problems of human health such as headache, dizziness, vomiting, nausea and discomfort, but it also stimulates the autonomic nerves by oxidizing the cells of the human tissues to exacerbate the circulation of the endocrine system, ≪ / RTI >
On the other hand, there are many negative ions in the water-rich areas such as forests, ponds, reservoirs, lakes, and waterfalls in the suburbs, where the air is clear and clean, and all of them can feel pleasant and refreshing.
Since these anions are known to have a great influence on the growth of plants and animals in the ecosystem, there are increasing signs that the industrial field that utilizes the useful role according to negative ions today will be used in various fields, and many products that are focused on practical functionality are being developed.
In addition, unlike cations which deteriorate the health and lower the oxygen absorption capacity of the lungs, the anions secrete excessive amounts of serotonin / histamine in the human body, thereby increasing the ionization rate of the minerals and the like in the blood, It cleanses the blood and promotes the exchange of electric materials in the cell membrane, so that the metabolism can be accelerated and the waste in the body can be expelled quickly, while the amount of the immune component in the serum is increased to increase the resistance and to activate the autonomic nervous system, blood and lymphatic fluid .
Accordingly, in recent years, development of a product to which a substance capable of releasing a large amount of anions has been added is being studied, and in particular, the importance of sericite has been increasing in particular among substances emitting anions.
These sericites have superiority over efflorescence and efficacy over loess, paulownia and crustaceans, which are widely known to be beneficial to health. In particular, sericite is 10 times more effective than loess in the amount of anion radiation used as a direct indicator of health. And the sericite is in an excellent position in various indicators and effects related to well-being and skin.
In particular, sericite has attracted attention as natural minerals that are effective in all industrial fields such as antibacterial, deodorization, healthcare, medical supplies, far-infrared radiation, anion emission, electromagnetic shielding and the like due to its excellent functionality containing rich essential minerals and trace elements have.
Conventionally, the use of sericite has been used for example in construction materials and wallpaper. Korean Utility Model No. 20-0230083 discloses a method for producing bricks and blocks by crushing and mixing natural sericite to produce deodorizing effect and soundproofing effect. A building brick and a block are disclosed.
However, since the sericite is a natural mineral, it is used only to the extent that it is crushed finely and mixed with a brick or a cement composition, and a sericite which can be used for manufacturing various articles such as a cable covering material and an electronic product case by utilizing various effects such as antimicrobial Pellets have not been developed yet.
Accordingly, an object of the present invention is to provide a synthetic resin chip composition using a sericite capable of delaying a fire, blocking an electromagnetic wave, and enhancing the health of a user by increasing far infrared rays and anion emission amount.
A second object of the present invention is to provide a method for producing a synthetic resin chip composition using a sericite that can be easily used for various interior materials, air ducts, coating materials for cables, and electronic product housings.
In order to accomplish the first object of the present invention, there is provided a synthetic resin chip composition using a sericite comprising 30 to 80% by weight of a sericite powder and 20 to 70% by weight of a binder resin in an embodiment of the present invention.
In order to attain the second object of the present invention, there is provided a method for producing a resin composition, which comprises mixing a mixture of 30 to 80% by weight of a sericite powder and 20 to 70% by weight of a binder resin powder, A molding step of extruding and molding the molten material into an extruder, and a step of cutting and drying the molded extrudate to produce a synthetic resin chip composition using a sericite ≪ / RTI >
Industrial Applicability According to the present invention, it is possible to manufacture various kinds of products such as various interior linings, air conditioning ducts, cable coverings and electronic product housings.
The present invention can block various harmful substances, provide deodorization, antibacterial and antifungal properties, and emit a large amount of far-infrared rays and negative ions, thereby promoting the blood circulation of the user and improving the health of the user.
Particularly, when the present invention is used in the production of children's toys, it is harmless to prevent the leakage of harmful components from the children's toys so that the children's toys come into contact with the child's mouth. In addition, when the present invention is used in the manufacture of automobile interior materials, it emits far-infrared rays and negative ions to promote the blood circulation of the driver to prevent drowsiness, to make the air in the vehicle comfortable and to improve the driver's health, Provides a pleasant operating space by removing odor.
In addition, the present invention can impart flame retardancy to delay the occurrence of fire, and can block electromagnetic waves emitted from an electronic product when used in an electronic product.
Furthermore, the present invention can be applied to the production of electric appliances such as electric cords, plugs, and outlets, which are excellent in heat resistance and durability by containing ore water, and even when a spark or the like is generated due to overheating or short- can do.
In addition, since the present invention does not use carbon black or the like which affects the color of a product, it is possible to produce a molded product in various colors
1 is a flow chart for explaining a method of manufacturing a synthetic resin chip composition according to the present invention.
Hereinafter, a synthetic resin chip composition using sericite according to preferred embodiments of the present invention (hereinafter, referred to as "synthetic resin chip composition") will be described in detail with reference to the accompanying drawings.
The synthetic resin chip composition according to the present invention comprises 30 to 80% by weight of a sericite powder and 20 to 70% by weight of a binder resin, which is a raw material of various kinds of interior materials, interior materials for air conditioning ducts and cables, .
Each of these components functions together by chemical action. Therefore, it can be said that the present invention has a specific combination of various composition combinations and combination amounts thereof rather than depending on specific functional ingredients.
Specifically, the synthetic resin chip composition according to an embodiment of the present invention includes sericite powder.
As a main material of the synthetic resin chip composition of the present invention, the sericite powder is a substance having the function of promoting blood circulation in the human body, releasing 90% or more of far-infrared rays for activating cell activity, absorbing various harmful substances by emitting strong anions, And 30 to 80% by weight based on 100% by weight of the total of the synthetic resin chip composition.
If the content of the sericite powder in the synthetic resin chip composition is less than 30% by weight, it is possible to provide anion and far-infrared rays sufficient for the user of the molded product made of the synthetic resin chip as a base material. However, And it becomes difficult to give an electromagnetic wave shielding effect to the covering material of the cable and the electronic product housing. If the content of the sericite powder is more than 80% by weight, the possibility that a molded article made of the synthetic resin chip is cracked is increased, and the flexibility is lowered, so that the possibility of breakage easily increases due to an external impact.
This sericite is a type of clay minerals, the color of which is silver white, and the silk gloss is strong. Mineralogically, it belongs to the mica group. Its chemical composition and crystal structure are similar to muscovite, the far-infrared emissivity is about 93%, the anion generation is about 700 / cc and the safest anion, It has a function to adsorb various harmful substances. It is also known that the sericite has an alkaline pH of 8.8, so it has excellent antioxidant and neutralizing action at acidified sites.
Far infrared rays emitted from the sericite infiltrate skin cells to cause air-conditioning vibration in water molecules of each cell to activate cell tissue to promote metabolism of the human body, improve blood circulation, and enhance deodorizing power. In addition, sericite radiates alpha (α) waves to inhibit harmful bacteria generation by more than 70%, adsorbs and decomposes heavy metals, organic matter, odor and germs, and provides abundantly beneficial minerals to the human body.
On the other hand, the above-mentioned sericite powder is obtained by crushing sericite in a crusher, and the grain size of the sericite powder is preferably 1 to 10 mu m. At this time, if the grain size of the sericite powder exceeds 10 탆, the particles are thick, so that a smooth appearance can not be provided when a molded product is manufactured. Also, if the average grain size of the sericite powder is less than 1 탆, it may not be uniformly mixed with the synthetic resin and tangled with each other.
If necessary, the above-mentioned sericite powder is preferably calcined at 800 to 1,500 占 폚 and pulverized to have a grain size of 1 to 10 占 퐉. This is because when the sintering process is performed, the porosity of the sericite is maximized, so that the abrasion resistance is improved as compared with before sintering. As a result, the molded article made of the base material of the synthetic resin chip containing the sintered sericite powder can be improved in wear resistance.
The synthetic resin chip composition according to one embodiment of the present invention includes a binder resin.
The binder resin enhances the bonding force between the sericite powder particles as the main raw material and partially penetrates into the sericite pores to improve the durability and strength of the sericite. It is preferable that 20 to 70% by weight, based on 100% .
If the content of the binder resin is less than 20% by weight, there may arise a problem of separation of the sericite powder from the molded product using the synthetic resin chip composition as a base material. If the content of the binder resin exceeds 70% by weight, Cracks may occur thereafter, and the amount of the sericite powder used is relatively reduced, thereby lowering the functionality of the sericite powder.
The binder resin may be a linear low density polyethylene (LLDPE), a low density polyethylene (LDPE), a high density polyethylene (LDPE), a polypropylene (PP), a polystyrene ), Polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyvinylchloride (PVC), styrene-acrylonitrile copolymer (SAN) Non-degradable thermoplastic resins such as acrylonitrile butadiene styrene (ABS) and polycarbonate (PC) can be used.
The synthetic resin chip composition according to an embodiment of the present invention may further include an anion emitting material.
The anion-releasing material is provided to maximize the amount of anion released to the human body by supporting the sericite and includes 10 to 50 parts by weight based on 100 parts by weight of the sericite powder.
As the anion emission material, at least one aggregate selected from the group consisting of tourmaline, loess, amethyst, biotite, urethane, geysin, obsidian, and elvan can be used. At this time, it is preferable that the anion emission material is pulverized so that the particle diameter becomes 1 to 10 mu m.
If the particle size of the anion emission material is less than 1 탆, the physical properties of the synthetic resin chip composition are not improved in comparison with the grinding cost. If the particle size of the anion emission material exceeds 10 탆, a smooth surface can not be provided.
The synthetic resin chip composition according to an embodiment of the present invention may further include natural dyes.
The natural dyes are added to the synthetic resin chip composition in order to impart various colors to the molded product made of the synthetic resin chip, and the natural dyes can be appropriately changed in accordance with the concentration of the color.
The natural dyes may be selected from the group consisting of vegetable dyes such as gardenia, yellowtail, saffron, lucerne, indigo, pine needles, animal dyes such as cochenille, kermes, or mineral dyes such as perilla, Dyes can be used.
Particularly, in order to form a pattern having various colors on the above-mentioned molded product, it is possible to use yellow, green, and yellow colors to express the yellow color, In order to do so, it is possible to use pigments of Tang Zhu Hong, Zhangjiagang, Kao Zhu Zhu, and Zhu Zhu Hong. In order to express the color of the green system, it uses the lower leaves, the seokhwa, the thrush, and the eruption. In order to express the color of the blue system, You can use Cheonghwa Mok, Lee Cheong, and Sam Cheong. Also, in order to express the color of the white system, it is possible to use the pine flower to express the true color or the black color and the black color.
The synthetic resin chip composition according to an embodiment of the present invention may further include a rare earth ore.
The rare earth ore maximizes the anion emission effect and the electromagnetic wave shielding effect of the sericite and the anion emission material, and includes 10 to 20 parts by weight based on 100 parts by weight of the sericite powder.
As the rare earth ore, any one or more selected from the group consisting of strontium, vanadium, zirconium, cerium, nepheline, lanthanum, barium, rubidium, cesium and gallium may be used.
The rare earth ore is preferably pulverized to have a particle diameter of 1 to 10 mu m. At this time, if the particle size of the rare earth ore is less than 1 탆, the physical properties of the synthetic resin chip composition are not improved against the grinding cost, and if the particle size of the rare earth ore exceeds 10 탆, a smooth surface can not be provided in the molded article.
In addition, if the rare earth ore is added in an amount of less than 10 parts by weight based on 100 parts by weight of the sericite powder, the synergistic action of the anion release effect is insignificant. If the rare earth ore is added in an amount exceeding 20 parts by weight, It does not improve.
The synthetic resin chip composition according to one embodiment of the present invention may further include a methyl methacrylate-butadiene-styrene-based graft copolymer.
The methyl methacrylate-butadiene-styrene-based graft copolymer imparts impact resistance and thermal stability to a molded article made of a synthetic resin chip as a base material, and it contains 11 to 20 parts by weight based on 100 parts by weight of the binder resin. As a specific embodiment, LG 808 of LG Chem may be used as the methyl methacrylate-butadiene-styrene graft copolymer according to the present invention.
If the methyl methacrylate-butadiene-styrene-based graft copolymer is added in an amount of less than 11 parts by weight based on 100 parts by weight of the binder resin, the desired effect can not be obtained. If the amount exceeds 20 parts by weight, the tensile strength, elongation There is a possibility that the mechanical properties such as the mechanical strength and the like may be deteriorated.
The synthetic resin chip composition according to an embodiment of the present invention may further include calcium oxide.
The calcium oxide blocks 5 to 10 parts by weight based on 100 parts by weight of the binder resin when a fire occurs in an interior material or an air conditioning duct made of a synthetic resin chip composition.
More specifically, the calcium oxide binds with the inorganic substance and reacts with water to generate a part of calcium hydroxide (Ca (OH) 2 ). The calcium hydroxide produced in the fire gives flame retardancy to the molded product in the event of fire, .
When the amount of the calcium oxide is less than 5 parts by weight based on 100 parts by weight of the binder resin, the effect of generating volatile organic compounds (VOCs) and blocking the generation of toxic gases in the event of a fire is weakened. The physical properties of the molded product may be deteriorated.
Meanwhile, the present invention provides a method for producing a synthetic resin chip composition. 1 is a flow chart for explaining a method of manufacturing a synthetic resin chip composition according to the present invention.
Referring to FIG. 1, the method for producing a synthetic resin chip composition according to the present invention includes a mixing step (S100) of mixing a mixture of a sericite powder and a binder resin powder to produce a mixture, a melting step A molding step S300 for putting the melt into an extruder for extrusion and molding, and a shaping step S400 for cutting and drying the molded extrudate.
More specifically, in the blending step (S100) according to the present invention, 30 to 80% by weight of the sericite powder and 20 to 70% by weight of the binder resin powder are added to a blender equipped with a high-speed agitator, Min to uniformly blend the sericite powder and the binder resin powder.
This compounding step (SlOO) is preferably carried out in a reduced pressure environment below the standard atmospheric pressure. This is because a large number of pores are formed in the sericite, and air is contained in the pores. If the compound is compounded at a standard atmospheric pressure, a problem occurs that the binder resin can not penetrate the pores.
In other words, when the sericite powder and the binder resin powder are mixed under a reduced-pressure environment, the air remaining in the pores of the sericite comes out of the pores. Since the binder resin penetrates this space, It is possible to manufacture a synthetic resin chip having strength.
If desired, the present invention may further comprise a sericite crushing step prior to blending (S100).
The step of crushing the sericite may include crushing the sericite, and may include a first crushing process, a sediment removal process, and a second crushing process.
In the primary pulverizing step, the sericite ore is crushed to a size of 10 mm to 30 mm by a compressive force using a roll crusher or a cone crusher.
Here, the roll crusher is a machine that rotates two parallel rolls in opposite directions to supply ore between them and crushes them, which is also called a crushing roll. When the ore is supplied from above the roll crusher, the ore is brittle by the frictional force of the two rolls, and is broken down from the narrow neck and discharged downward. In addition, the cow crusher is a machine that breaks rocks by eccentric rotation of the umbrella shaft.
The precipitate removing step may be carried out by dipping the sericite powder that has undergone the first pulverizing step in distilled water or alcohol for 6 to 8 days in a closed vessel and removing the precipitate.
Here, when the sericite powder is mixed with the distilled water, the impurities contained in the sericite powder are precipitated, thereby collecting the sericite powder that has floated to the upper part of the distilled water to produce pure sericite from which the impurities have been removed. In addition, when the sericite powder is mixed with the alcohol, the impurities contained in the sericite powder are killed or removed to produce pure sericite.
In the second milling step, the sericite powder from which the impurities have been removed is put into a ball mill, an attrition mill, a vertical mill, and a horizontal mill through a precipitate removing step to crush do. As such, the microstructure of the granulated groundnut powder can be used in various molded articles due to the extremely fine size of the particles.
In the melting step (S200) according to the present invention, the powder agitated through the mixing step (S100) is reacted at a temperature of 170 to 270 DEG C using an extruder equipped with a screw capable of inducing high shear force and long residence time Producing a melt of the sericite powder and the synthetic resin powder.
The forming step S300 according to the present invention is a step of extruding and molding a melt through an extruder.
In the processing step (S400) according to the present invention, the molded extrudate is dried and cut at intervals of 3 to 15 mm to produce a pellet-shaped synthetic resin chip.
More specifically, although the shape of the synthetic resin chip is not particularly limited, it is preferably a cylindrical shape having a length of 3 to 15 mm.
Further, when the length of the synthetic resin chip is 3 mm or more, it is easy to handle, and when the length is 15 mm or less, the insertability into the molding machine is excellent and it can be stably supplied to the molding machine.
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to one preferred embodiment. It should be noted, however, that the present invention is not limited to the following examples.
[Assessment Methods]
(1) Anion emission (ea / cc)
The anion generation measurement experiment was carried out according to KICM-FIR-1042, which is an experimental method of measuring an anion generation amount which is generally used.
(2) Appearance (탆)
The welded part height of a molded article obtained by using a welded angle plate mold of 80 mm ㅧ 80 mm ㅧ 1 mm (resin filled from two points of the flank of the feces) was measured by a surface roughness meter. The smaller the value, the better the appearance.
(3) Charpy impact strength (kj / m 2)
Charpy impact strength with notch was measured according to ISO179 standard. The larger the value, the more desirable it is because it can withstand breakage such as when the molded article falls.
(4) Volumetric resistance (Ω)
The volume resistance was measured according to the RS M 0015 standard of reliability evaluation.
≪ Example 1 > Production of a synthetic resin chip
1. 300 g of sericite powder and 700 g of polypropylene as a binder resin were charged into a stirrer and stirred at 1,000 rpm for 30 minutes to form a mixture.
2. The mixture was poured into a twin-screw extruder (TEX30, Japan Steel Works, Japan) and heated at 260 DEG C to extrudate and mold the warp and polypropylene in a sufficiently melted state.
3. The extrudate was cooled and cut with a cutter at intervals of 3 mm.
4. The cut extrudate was dried in vacuum at 80 ° C for 5 hours or longer to produce a 3 mm long synthetic resin chip.
≪ Example 2 >
A synthetic resin chip was prepared using 500 g of sericite powder and 500 g of polypropylene instead of 300 g of the above-mentioned sericite powder and 700 g of polypropylene, in the same manner as in Example 1.
≪ Example 3 >
A synthetic resin chip was prepared in the same manner as in Example 1 except that 800 g of sericite powder and 200 g of polypropylene were used in place of 300 g of the above-mentioned sericite powder and 700 g of polypropylene.
≪ Comparative Example 1 &
A synthetic resin chip was prepared by using 100 g of sericite powder and 900 g of polypropylene instead of 300 g of the above-mentioned sericite powder and 700 g of polypropylene.
≪ Comparative Example 2 &
A synthetic resin chip was prepared using 900 g of sericite powder and 100 g of polypropylene in place of 300 g of the above-mentioned sericite powder and 700 g of polypropylene, in the same manner as in Example 1.
<Experimental Example>
The synthetic resin chips prepared in Examples 1 to 3 and Comparative Examples 1 and 2 were placed in an injection molding machine (J350EII-SP, Nihon Seiko Co., Ltd., Japan) to prepare molded product test pieces. The injection temperature was set to 280 ° C, the mold temperature was set to 80 ° C, the injection time was set to 10 seconds, the cooling time was set to 20 seconds, the injection speed was set to 70% of the maximum set value of the injection molding machine, To prepare molded product test pieces.
The physical properties of the molded product test pieces produced in the experimental examples were evaluated by the above-mentioned methods. The evaluation results are shown in Table 1.
According to Table 1, the molded article made of the synthetic resin chips of Examples 1 to 3 emits a large amount of anions, has excellent appearance, has a high Charpy impact strength, and has a volume resistance ranging from 10 3 to 10 4 Ω Respectively.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.
Claims (7)
And 20 to 70% by weight of a binder resin.
Wherein the cemented carbide is calcined at 800 to 1500 占 폚 and pulverized to have an average grain size of 1 to 10 占 퐉.
Wherein at least one rare earth ore selected from the group consisting of strontium, vanadium, zirconium, cerium, nepheline, lanthanum, barium, rubidium, cesium and gallium is further contained.
A melting step of melting the stirred mixture to produce a melt;
A molding step of putting the melt into an extruder and extruding and molding the melt; And
A method for producing a synthetic resin chip composition using a sericite comprising cutting and drying a molded extrudate.
Characterized in that the method is carried out in a reduced pressure environment below a standard atmospheric pressure.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115246977A (en) * | 2022-08-31 | 2022-10-28 | 金发科技股份有限公司 | High-infrared-permeability glass fiber reinforced MBS composite material and preparation method and application thereof |
| CN115246977B (en) * | 2022-08-31 | 2024-03-22 | 金发科技股份有限公司 | Glass fiber reinforced MBS composite material with high infrared permeability and preparation method and application thereof |
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