KR20170018912A - 급속 경화 에폭시 접착제 조성물 - Google Patents

급속 경화 에폭시 접착제 조성물 Download PDF

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Publication number
KR20170018912A
KR20170018912A KR1020177000950A KR20177000950A KR20170018912A KR 20170018912 A KR20170018912 A KR 20170018912A KR 1020177000950 A KR1020177000950 A KR 1020177000950A KR 20177000950 A KR20177000950 A KR 20177000950A KR 20170018912 A KR20170018912 A KR 20170018912A
Authority
KR
South Korea
Prior art keywords
curable composition
weight
less
present
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020177000950A
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English (en)
Korean (ko)
Inventor
소하이브 엘지미아비
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20170018912A publication Critical patent/KR20170018912A/ko
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • C08K7/24Expanded, porous or hollow particles inorganic
    • C08K7/28Glass
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J2201/622
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020177000950A 2014-06-17 2015-06-17 급속 경화 에폭시 접착제 조성물 Withdrawn KR20170018912A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14172755.2A EP2957584B1 (en) 2014-06-17 2014-06-17 Rapid curing epoxy adhesive compositions
EP14172755.2 2014-06-17
PCT/US2015/036189 WO2015195775A1 (en) 2014-06-17 2015-06-17 Rapid curing epoxy adhesive compositions

Publications (1)

Publication Number Publication Date
KR20170018912A true KR20170018912A (ko) 2017-02-20

Family

ID=50942204

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177000950A Withdrawn KR20170018912A (ko) 2014-06-17 2015-06-17 급속 경화 에폭시 접착제 조성물

Country Status (10)

Country Link
US (1) US10882947B2 (enExample)
EP (1) EP2957584B1 (enExample)
JP (1) JP6626012B2 (enExample)
KR (1) KR20170018912A (enExample)
CN (1) CN106414546A (enExample)
BR (1) BR112016029780A2 (enExample)
CA (1) CA2952248A1 (enExample)
ES (1) ES2625552T3 (enExample)
PL (1) PL2957584T3 (enExample)
WO (1) WO2015195775A1 (enExample)

Cited By (1)

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WO2021206471A1 (ko) * 2020-04-09 2021-10-14 코오롱인더스트리 주식회사 접착제 조성물 및 고무 보강재

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EP3275914B1 (en) * 2016-07-29 2022-05-11 3M Innovative Properties Company Flame retardant adhesive composition
EP3275915B1 (en) * 2016-07-29 2022-11-30 3M Innovative Properties Company Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties
EP3385297A1 (en) * 2017-04-04 2018-10-10 3M Innovative Properties Company Epoxy-silicone hybrid sealant composition with low shrinkage and lower postcuring properties with chemical resistance for aerospace applications
CN108929518B (zh) * 2017-05-26 2022-11-25 洛阳尖端技术研究院 一种环氧树脂吸波复合材料及其制备方法
US10792884B2 (en) * 2017-06-15 2020-10-06 The Boeing Company Composite panel sandwich structures with integrated joints
EP3569629B1 (de) 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
US11359048B2 (en) * 2018-05-17 2022-06-14 Evonik Operations Gmbh Fast-curing epoxy systems
US11286335B2 (en) * 2018-05-17 2022-03-29 Evonik Operations Gmbh Fast-curing epoxy systems
EP3569630B1 (de) 2018-05-17 2022-08-03 Evonik Operations GmbH Schnell härtende epoxysysteme
WO2020033036A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033037A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
EP3626757A1 (de) * 2018-09-19 2020-03-25 Hilti Aktiengesellschaft Verwendung von salzen als beschleuniger in einer epoxidharzmasse zur chemischen befestigung
EP3660069B1 (de) 2018-11-29 2024-01-03 Evonik Operations GmbH Schnell härtende epoxysysteme
EP3733731A1 (de) * 2019-04-30 2020-11-04 Hilti Aktiengesellschaft Härterzusammensetzung für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem mit verbesserter tieftemperaturhärtung
WO2021019741A1 (ja) * 2019-07-31 2021-02-04 昭和電工マテリアルズ株式会社 接着剤セット
EP4011978B1 (en) * 2019-08-06 2025-11-19 Kaneka Corporation Curable composition
CN110530924A (zh) * 2019-08-08 2019-12-03 西安交通大学 一种可施加电场的dsc电极系统
US11453744B2 (en) 2019-10-15 2022-09-27 Evonik Operations Gmbh Compositions consisting of BrØnsted acids and monoamines
CN111748079A (zh) * 2020-07-14 2020-10-09 道生天合材料科技(上海)股份有限公司 一种可快速固化的固化剂及使用该固化剂的环氧树脂系统
US20220112321A1 (en) * 2020-10-09 2022-04-14 Rohm And Haas Electronic Materials Llc High refractive index materials
EP3981817B1 (de) 2020-10-12 2025-09-10 Evonik Operations GmbH Zusammensetzungen umfassend brönstedtsäuren und monoamine
EP4194516A1 (en) 2021-12-09 2023-06-14 Jotun A/S Coatings
WO2025116899A1 (en) * 2023-11-29 2025-06-05 Uniseal, Inc. Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components

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US3282015A (en) 1962-04-20 1966-11-01 Frederick W Rohe Moldable insert fastener with dual potting ports in head
US3271498A (en) 1964-01-27 1966-09-06 Rohe Method of installation of moldable insert in sandwich panel
GB1500206A (en) * 1975-10-23 1978-02-08 Ciba Geigy Ag Compositions for curing epoxide resins
CA1249691A (en) * 1984-07-18 1989-01-31 Janis Robins Fast curing epoxy resin compositions
US4668736A (en) * 1984-07-18 1987-05-26 Minnesota Mining And Manufacturing Company Fast curing epoxy resin compositions
DE3674902D1 (de) 1985-06-26 1990-11-15 Dow Chemical Co Mit rubber modifizierte epoxyzusammensetzungen.
US4941785A (en) 1989-09-13 1990-07-17 Witten Donald W Potted insert for honeycomb panels
JP5604771B2 (ja) * 2006-04-24 2014-10-15 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料およびその製造方法
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
WO2008099858A1 (ja) * 2007-02-13 2008-08-21 Kaneka Corporation 硬化性組成物
US8853309B2 (en) * 2008-09-29 2014-10-07 Kaneka Corporation Curable composition and cured product thereof
CN102307925B (zh) * 2009-02-06 2013-11-06 3M创新有限公司 室温固化环氧树脂粘合剂
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
CN103068946B (zh) * 2010-08-10 2015-05-06 3M创新有限公司 环氧树脂结构粘合剂
US9139699B2 (en) * 2012-10-04 2015-09-22 Dow Corning Corporation Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts
DE102012203794A1 (de) * 2012-03-12 2013-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch lösbarer Polyamid-Klebstoff
JP2014139293A (ja) * 2012-12-20 2014-07-31 Dow Global Technologies Llc エポキシ樹脂組成物、それを製造する方法、およびその物品

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021206471A1 (ko) * 2020-04-09 2021-10-14 코오롱인더스트리 주식회사 접착제 조성물 및 고무 보강재
US12473468B2 (en) 2020-04-09 2025-11-18 Kolon Industries, Inc. Adhesive composition and rubber reinforcing material

Also Published As

Publication number Publication date
BR112016029780A2 (pt) 2017-08-22
US20170088664A1 (en) 2017-03-30
US10882947B2 (en) 2021-01-05
ES2625552T3 (es) 2017-07-19
JP2017519869A (ja) 2017-07-20
PL2957584T3 (pl) 2017-08-31
EP2957584A1 (en) 2015-12-23
WO2015195775A1 (en) 2015-12-23
CN106414546A (zh) 2017-02-15
JP6626012B2 (ja) 2019-12-25
CA2952248A1 (en) 2015-12-23
EP2957584B1 (en) 2017-03-01

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20170112

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination