PL2957584T3 - Szybko utwardzane epoksydowe kompozycje klejące - Google Patents
Szybko utwardzane epoksydowe kompozycje klejąceInfo
- Publication number
- PL2957584T3 PL2957584T3 PL14172755T PL14172755T PL2957584T3 PL 2957584 T3 PL2957584 T3 PL 2957584T3 PL 14172755 T PL14172755 T PL 14172755T PL 14172755 T PL14172755 T PL 14172755T PL 2957584 T3 PL2957584 T3 PL 2957584T3
- Authority
- PL
- Poland
- Prior art keywords
- adhesive compositions
- epoxy adhesive
- rapid curing
- curing epoxy
- rapid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/28—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14172755.2A EP2957584B1 (en) | 2014-06-17 | 2014-06-17 | Rapid curing epoxy adhesive compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2957584T3 true PL2957584T3 (pl) | 2017-08-31 |
Family
ID=50942204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL14172755T PL2957584T3 (pl) | 2014-06-17 | 2014-06-17 | Szybko utwardzane epoksydowe kompozycje klejące |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10882947B2 (enExample) |
| EP (1) | EP2957584B1 (enExample) |
| JP (1) | JP6626012B2 (enExample) |
| KR (1) | KR20170018912A (enExample) |
| CN (1) | CN106414546A (enExample) |
| BR (1) | BR112016029780A2 (enExample) |
| CA (1) | CA2952248A1 (enExample) |
| ES (1) | ES2625552T3 (enExample) |
| PL (1) | PL2957584T3 (enExample) |
| WO (1) | WO2015195775A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3275914B1 (en) * | 2016-07-29 | 2022-05-11 | 3M Innovative Properties Company | Flame retardant adhesive composition |
| EP3275915B1 (en) * | 2016-07-29 | 2022-11-30 | 3M Innovative Properties Company | Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties |
| EP3385297A1 (en) * | 2017-04-04 | 2018-10-10 | 3M Innovative Properties Company | Epoxy-silicone hybrid sealant composition with low shrinkage and lower postcuring properties with chemical resistance for aerospace applications |
| CN108929518B (zh) * | 2017-05-26 | 2022-11-25 | 洛阳尖端技术研究院 | 一种环氧树脂吸波复合材料及其制备方法 |
| US10792884B2 (en) * | 2017-06-15 | 2020-10-06 | The Boeing Company | Composite panel sandwich structures with integrated joints |
| EP3569629B1 (de) | 2018-05-17 | 2022-07-06 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| US11359048B2 (en) * | 2018-05-17 | 2022-06-14 | Evonik Operations Gmbh | Fast-curing epoxy systems |
| US11286335B2 (en) * | 2018-05-17 | 2022-03-29 | Evonik Operations Gmbh | Fast-curing epoxy systems |
| EP3569630B1 (de) | 2018-05-17 | 2022-08-03 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| WO2020033036A1 (en) * | 2018-08-08 | 2020-02-13 | Dow Global Technologies Llc | Epoxy resin composition |
| WO2020033037A1 (en) * | 2018-08-08 | 2020-02-13 | Dow Global Technologies Llc | Epoxy resin composition |
| EP3626757A1 (de) * | 2018-09-19 | 2020-03-25 | Hilti Aktiengesellschaft | Verwendung von salzen als beschleuniger in einer epoxidharzmasse zur chemischen befestigung |
| EP3660069B1 (de) | 2018-11-29 | 2024-01-03 | Evonik Operations GmbH | Schnell härtende epoxysysteme |
| EP3733731A1 (de) * | 2019-04-30 | 2020-11-04 | Hilti Aktiengesellschaft | Härterzusammensetzung für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem mit verbesserter tieftemperaturhärtung |
| WO2021019741A1 (ja) * | 2019-07-31 | 2021-02-04 | 昭和電工マテリアルズ株式会社 | 接着剤セット |
| EP4011978B1 (en) * | 2019-08-06 | 2025-11-19 | Kaneka Corporation | Curable composition |
| CN110530924A (zh) * | 2019-08-08 | 2019-12-03 | 西安交通大学 | 一种可施加电场的dsc电极系统 |
| US11453744B2 (en) | 2019-10-15 | 2022-09-27 | Evonik Operations Gmbh | Compositions consisting of BrØnsted acids and monoamines |
| WO2021206471A1 (ko) * | 2020-04-09 | 2021-10-14 | 코오롱인더스트리 주식회사 | 접착제 조성물 및 고무 보강재 |
| CN111748079A (zh) * | 2020-07-14 | 2020-10-09 | 道生天合材料科技(上海)股份有限公司 | 一种可快速固化的固化剂及使用该固化剂的环氧树脂系统 |
| US20220112321A1 (en) * | 2020-10-09 | 2022-04-14 | Rohm And Haas Electronic Materials Llc | High refractive index materials |
| EP3981817B1 (de) | 2020-10-12 | 2025-09-10 | Evonik Operations GmbH | Zusammensetzungen umfassend brönstedtsäuren und monoamine |
| EP4194516A1 (en) | 2021-12-09 | 2023-06-14 | Jotun A/S | Coatings |
| WO2025116899A1 (en) * | 2023-11-29 | 2025-06-05 | Uniseal, Inc. | Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical components |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3282015A (en) | 1962-04-20 | 1966-11-01 | Frederick W Rohe | Moldable insert fastener with dual potting ports in head |
| US3271498A (en) | 1964-01-27 | 1966-09-06 | Rohe | Method of installation of moldable insert in sandwich panel |
| GB1500206A (en) * | 1975-10-23 | 1978-02-08 | Ciba Geigy Ag | Compositions for curing epoxide resins |
| CA1249691A (en) * | 1984-07-18 | 1989-01-31 | Janis Robins | Fast curing epoxy resin compositions |
| US4668736A (en) * | 1984-07-18 | 1987-05-26 | Minnesota Mining And Manufacturing Company | Fast curing epoxy resin compositions |
| DE3674902D1 (de) | 1985-06-26 | 1990-11-15 | Dow Chemical Co | Mit rubber modifizierte epoxyzusammensetzungen. |
| US4941785A (en) | 1989-09-13 | 1990-07-17 | Witten Donald W | Potted insert for honeycomb panels |
| JP5604771B2 (ja) * | 2006-04-24 | 2014-10-15 | 東レ株式会社 | エポキシ樹脂組成物、繊維強化複合材料およびその製造方法 |
| US20070293603A1 (en) * | 2006-06-19 | 2007-12-20 | Ashland Licensing And Intellectual Property Llc | Epoxy adhesive composition and use thereof |
| WO2008099858A1 (ja) * | 2007-02-13 | 2008-08-21 | Kaneka Corporation | 硬化性組成物 |
| US8853309B2 (en) * | 2008-09-29 | 2014-10-07 | Kaneka Corporation | Curable composition and cured product thereof |
| CN102307925B (zh) * | 2009-02-06 | 2013-11-06 | 3M创新有限公司 | 室温固化环氧树脂粘合剂 |
| EP2223966B1 (en) * | 2009-02-25 | 2017-08-16 | 3M Innovative Properties Company | Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
| GB0905362D0 (en) | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
| CN103068946B (zh) * | 2010-08-10 | 2015-05-06 | 3M创新有限公司 | 环氧树脂结构粘合剂 |
| US9139699B2 (en) * | 2012-10-04 | 2015-09-22 | Dow Corning Corporation | Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| DE102012203794A1 (de) * | 2012-03-12 | 2013-09-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrisch lösbarer Polyamid-Klebstoff |
| JP2014139293A (ja) * | 2012-12-20 | 2014-07-31 | Dow Global Technologies Llc | エポキシ樹脂組成物、それを製造する方法、およびその物品 |
-
2014
- 2014-06-17 PL PL14172755T patent/PL2957584T3/pl unknown
- 2014-06-17 ES ES14172755.2T patent/ES2625552T3/es active Active
- 2014-06-17 EP EP14172755.2A patent/EP2957584B1/en not_active Not-in-force
-
2015
- 2015-06-17 JP JP2016573583A patent/JP6626012B2/ja active Active
- 2015-06-17 BR BR112016029780A patent/BR112016029780A2/pt not_active Application Discontinuation
- 2015-06-17 US US15/301,126 patent/US10882947B2/en active Active
- 2015-06-17 WO PCT/US2015/036189 patent/WO2015195775A1/en not_active Ceased
- 2015-06-17 KR KR1020177000950A patent/KR20170018912A/ko not_active Withdrawn
- 2015-06-17 CA CA2952248A patent/CA2952248A1/en not_active Abandoned
- 2015-06-17 CN CN201580031090.3A patent/CN106414546A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| BR112016029780A2 (pt) | 2017-08-22 |
| US20170088664A1 (en) | 2017-03-30 |
| US10882947B2 (en) | 2021-01-05 |
| ES2625552T3 (es) | 2017-07-19 |
| JP2017519869A (ja) | 2017-07-20 |
| EP2957584A1 (en) | 2015-12-23 |
| WO2015195775A1 (en) | 2015-12-23 |
| CN106414546A (zh) | 2017-02-15 |
| JP6626012B2 (ja) | 2019-12-25 |
| CA2952248A1 (en) | 2015-12-23 |
| EP2957584B1 (en) | 2017-03-01 |
| KR20170018912A (ko) | 2017-02-20 |
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