KR20170014871A - Chamber unit for real time detecting temperature of laser irradiated area and laser processing system including the chamber unit - Google Patents

Chamber unit for real time detecting temperature of laser irradiated area and laser processing system including the chamber unit Download PDF

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Publication number
KR20170014871A
KR20170014871A KR1020150108865A KR20150108865A KR20170014871A KR 20170014871 A KR20170014871 A KR 20170014871A KR 1020150108865 A KR1020150108865 A KR 1020150108865A KR 20150108865 A KR20150108865 A KR 20150108865A KR 20170014871 A KR20170014871 A KR 20170014871A
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KR
South Korea
Prior art keywords
window
laser beam
chamber unit
cover plate
base plate
Prior art date
Application number
KR1020150108865A
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Korean (ko)
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KR101715353B1 (en
Inventor
황대순
조대엽
김영중
Original Assignee
주식회사 이오테크닉스
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Application filed by 주식회사 이오테크닉스 filed Critical 주식회사 이오테크닉스
Priority to KR1020150108865A priority Critical patent/KR101715353B1/en
Priority to PCT/KR2016/007509 priority patent/WO2017022969A1/en
Priority to TW105123522A priority patent/TWI607611B/en
Publication of KR20170014871A publication Critical patent/KR20170014871A/en
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Publication of KR101715353B1 publication Critical patent/KR101715353B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0066—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Disclosed are a chamber unit for real-time temperature measurement of a laser irradiated area, and a laser processing system including the same. The disclosed chamber unit comprises: a base plate; a cover plate provided to cover the base plate; a first window provided on the cover plate through which a laser beam is transmitted; and a second window provided on the cover plate to be spaced apart from the first window, transmitting a measurement beam for temperature measurement to a specific region of an object to be processed.

Description

Technical Field [0001] The present invention relates to a chamber unit for real-time temperature measurement of a laser irradiation region and a laser processing system including the chamber unit.

The present invention relates to a chamber unit for laser processing, and more particularly to a chamber unit for real time temperature measurement of a laser irradiation area and a laser processing system including such a chamber unit.

The laser processing system irradiates a laser beam emitted from a laser light source onto an object using an optical system and performs marking, dicing, and scribing on the object by irradiation of the laser beam. And the like.

Generally, a laser machining operation is carried out by loading an object to be processed in a chamber unit whose interior is held in a vacuum, and irradiating the object with a laser beam through a window of the chamber unit. In this case, it is necessary to measure the temperature with respect to the laser irradiation area of the object. Conventionally, a laser beam is irradiated to the object using one window, and a measurement beam is irradiated from the temperature measurement unit onto the laser irradiation area, Was used. However, in order to use such a method, there is a problem that the wavelength of the laser beam passing through the window provided in the chamber unit must match the wavelength of the measuring beam.

At least one embodiment of the present invention provides a chamber unit for real-time temperature measurement of a laser irradiation area and a laser processing system including such a chamber unit.

In one aspect of the present invention,

1. A chamber unit provided with an object to be processed therein and irradiating the object with a laser beam transmitted from the outside,

A base plate;

A cover plate covering the base plate;

A first window provided on the cover plate and through which the laser beam is transmitted; And

And a second window which is provided on the cover plate so as to be spaced apart from the first window and through which a measurement beam for temperature measurement for a specific region of the object is transmitted.

The first and second windows may be provided on the first and second wall surfaces of the cover plate. Here, the second wall surface may be formed to be inclined with respect to the first wall surface.

The chamber unit may be provided on the base plate and may further include a stage on which the object to be processed is placed. Here, the stage may be movably provided on the base plate. In addition, the stage may be provided such that one end of the stage moves up and down so as to be inclined with respect to the base plate.

The laser beam may be incident obliquely with respect to the surface of the object to be processed, which is placed on the stage. A part of the laser beam reflected from the object may proceed to an area of the inner wall surface of the cover plate where the first and second windows are not formed.

The laser beam and the measurement beam may have different wavelengths, so that the first window and the second window may include different materials. The interior of the chamber unit can be kept vacuum.

In another aspect,

A laser irradiation unit for emitting a laser beam to an object to be processed;

A temperature measurement unit for emitting a measurement beam for temperature measurement of a specific region of the object; And

And a chamber unit in which the object to be processed is provided,

Wherein the chamber unit comprises:

A base plate;

A cover plate provided to cover the base plate;

A first window provided on the cover plate and through which the laser beam is transmitted; And

And a second window that is provided on the cover plate so as to be spaced apart from the first window and through which the measurement beam is transmitted.

The laser processing system may further comprise a vacuum unit for holding the interior of the chamber unit under vacuum.

The first and second windows may be provided on the first and second wall surfaces of the cover plate, and the second wall surface may be formed to be inclined with respect to the first wall surface.

The chamber unit may be provided on the base plate, and may further include a stage on which the object to be processed is placed. Here, the stage may be provided movably on the base plate, and the stage may be provided such that one end of the stage moves up and down so as to be inclined with respect to the base plate.

In yet another aspect,

1. A method for measuring a temperature of an object to be processed provided in a chamber unit including a base plate and a cover plate covering the base plate,

The laser beam is irradiated onto the object to be processed through the first window of the cover plate to perform a laser beam machining operation and a measurement beam for temperature measurement is irradiated onto the object to be processed through the second window of the cover plate, There is provided a method of measuring the temperature of a workpiece to measure a temperature of a specific region of the workpiece.

According to at least one embodiment of the present invention, the cover plate of the chamber unit is provided with first and second windows on different first and second wall surfaces, respectively, so that the laser beam is transmitted through the first window, And the measurement beam passes through the second window to measure the temperature of the specific region of the object to be processed. Accordingly, it is possible to measure and monitor the temperature of a specific region (for example, a laser irradiation region or a peripheral region thereof) of the object to be processed in real time while the laser processing operation is proceeding, You can check in real time. The measuring beam may be light of various wavelengths having different wavelengths from the laser beam.

1 is a perspective view of a chamber unit according to an exemplary embodiment of the present invention.
2 is a side view of the chamber unit shown in Fig.
Fig. 3 shows an internal cross-section of the chamber unit shown in Fig. 1, in which the stage is inclined at a first angle? 1 relative to the base plate
Fig. 4 shows an internal cross-section of the chamber unit shown in Fig. 1, in which the stage is inclined at a second angle [theta] 2 with respect to the base plate.
5 is an internal cross-sectional view of a chamber unit according to another exemplary embodiment of the present invention.
6 is a perspective view schematically showing a laser processing system according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments illustrated below are not intended to limit the scope of the invention, but rather are provided to illustrate the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation. Also, when a given component is described as being present, for example, on a substrate, the component may be present in direct contact with the substrate, and other components may be present therebetween. In the following embodiments, the material constituting each component is merely exemplary, and other materials may be used.

The chamber unit according to the exemplary embodiment described below is provided with an object to be processed therein, and the laser beam is irradiated from the outside through the chamber unit to the object to be processed, thereby proceeding with the laser machining operation.

1 is a perspective view of a chamber unit according to an exemplary embodiment of the present invention, and Fig. 2 is a side view of the chamber unit shown in Fig. 3 and 4 show the inner cross-section of the chamber unit.

Referring to FIGS. 1 to 4, the chamber unit 100 includes a base plate 105 and a cover plate 110 that covers the base plate 105. Here, the cover plate 110 is provided with first and second windows 121 and 122. The base plate 105 is provided with a stage 130 on which the object W is placed.

The first window 121 may be provided on the first wall surface 110a of the cover plate 110 (the upper surface of the cover plate in FIG. 1) where the external laser beam L is transmitted. The laser beam L emitted from the laser irradiation unit 200 provided outside the chamber unit 100 such as the chamber unit 100 is transmitted through the first window 121 of the cover plate 110 And can be irradiated onto the object W to be processed placed on the stage 130.

The first window 121 may include a material capable of transmitting the wavelength of the incident laser beam L well. For example, when the laser beam L has a wavelength in the ultraviolet range of, for example, 248 nm, 266 nm, 355 nm, or the like, the first window 121 includes, for example, fused silica . In addition, when the laser beam L has a wavelength in the range of visible light, the first window 121 may include, for example, quartz. If the laser beam L has a wavelength in the infrared range, the first window 121 may include ZnSe or the like. However, the material of the first window 121 mentioned above is merely exemplary. In addition, the first window 121 may include various other materials.

The second window 122 may be provided on the second wall surface 110b of the cover plate 110 (one side of the cover plate 110 in Fig. 1) where the measurement beam DL for temperature measurement is transmitted have. The measurement beam DL emitted from the temperature measurement unit 300 provided outside the chamber unit 100, for example, at one side of the chamber unit 100, is reflected by the second window 122 of the cover plate 110 And can be irradiated onto a specific region of the object W to be processed which is placed on the stage 130. [ Accordingly, the temperature measuring unit 300 can measure and monitor the temperature for a specific region of the object 130 in real time.

The second wall surface 110b on which the second window 122 is formed may be formed to be inclined with respect to the first wall surface 110a on which the first window 121 is provided. The second wall surface 110b on which the second window 122 through which the measurement beam DL is transmitted passes through the first wall surface 110a where the first window 121 through which the laser beam L passes, The measurement beam DL is incident on the object W in the chamber unit 100 by adjusting the angle at which the measurement beam DL emitted to the temperature measurement unit 300 is incident on the second window 122. [ So that a desired position of the image can be accurately reached. The second wall surface 110b on which the second window 122 is provided is not inclined with respect to the first wall surface 110a on which the first window 121 is provided It is possible.

The measurement beam DL transmitted through the second window 122 may have a wavelength different from that of the laser beam L transmitted through the first window 121, but is not limited thereto. The second window 122 may include a material capable of transmitting the wavelength of the incident measurement beam DL well. For example, if the measurement beam DL has a wavelength in the infrared range, the second window 122 may include ZnSe or the like. However, this is only exemplary. The measuring beam DL used in the present embodiment may have various wavelength ranges, and accordingly, the second window 122 may include a material capable of transmitting light of the wavelength well.

On the upper surface of the base plate 105, a stage 130 on which the object W is placed may be provided. As will be described later, the stage 130 may be disposed at an inclined angle with respect to the base plate 105, and the angle of inclination may be variously adjusted. One end of the stage 130 is vertically movable with respect to the base plate 105 through a guide member 137. The other end of the stage 130 is connected to a pin 135 ). The tilting of the stage 130 with respect to the base plate 105 can prevent the laser beam L passing through the first window 121 or the measuring beam DL passing through the second window 122, So that it can be incident on a desired region of the object W accurately. On the other hand, the stage 130 provided on the base place 105 is installed on the base plate 105 so as to be movable to a desired position.

The interior of the chamber unit 100 according to the present embodiment is preferably kept in a vacuum. This is because the object W to be processed must not be disturbed by other gases or impurities in the process of reacting by the irradiation of the laser beam L and the specific gas reactive to the object W in the vacuum state must be introduced into the chamber unit 100, it is possible to perform a highly reliable machining process.

Fig. 3 shows an internal cross-section of the chamber unit shown in Fig. 1, in which the stage is inclined at a first angle? 1 with respect to the base plate.

3, a laser irradiation unit 200 for emitting a laser beam L is provided at an upper portion of the chamber unit 100. A measurement beam DL for measuring a temperature is provided on one side of the chamber unit 100, A temperature measurement unit 300 for outputting the temperature measurement result. And, inside the chamber unit 100, the stage 130 is inclined at a first angle? 1 with respect to the base plate 105, The workpiece W is mounted on the upper surface of the stage 130 which is inclined in this manner.

In this structure, the laser beam L emitted from the laser irradiation unit 200 is transmitted through the first window 121 provided on the first wall face 110a (for example, the upper face) of the cover plate 110 And is irradiated onto the object W to be processed. Here, the laser beam L may be inclined with respect to the surface of the object W to be processed. As described above, the laser beam L is irradiated to a predetermined region of the object W so that the machining operation can be performed.

In this laser processing process, a part of the laser beam L incident on the object W may be reflected, and the reflected laser beam RL may be reflected by the first and second windows (121, 122) is not formed. When the laser beam RL reflected by the object W travels toward the first window 121 or the second window 122, the reflected laser beam RL is reflected by the first or second window 121 or 122 ) May be damaged.

The measurement beam DL emitted from the temperature measurement unit 300 is transmitted through the second window 122 provided on the inclined second wall face 110b (for example, the side face) of the cover plate 110, W). ≪ / RTI > Accordingly, the temperature measuring unit 300 can measure and monitor the temperature of a specific region of the object W in real time during the laser machining operation. Here, the specific region of the object W to be measured may be a laser irradiation region, but not limited thereto, and may be a peripheral region or another region of the laser irradiation region.

Fig. 4 shows an internal cross-section of the chamber unit shown in Fig. 1, in which the stage is inclined at a second angle [theta] 2 with respect to the base plate.

3, the stage 130 is linearly moved in one direction on the base plate 105, and the stage 130 is moved to a second angle? 1, which is larger than the first angle? 1 shown in FIG. 3, ([theta] 2). The laser beam L emitted from the laser irradiating unit 200 and transmitted through the first window 121 can be irradiated onto other areas of the object W to perform the laser machining operation. The measurement beam DL emitted from the temperature measurement unit 300 and passing through the second window 122 is irradiated to a specific region of the object W to measure and monitor the temperature in real time. On the other hand, the inclination angles [theta] 1 and [theta] 2 of the stage 130 shown in FIGS. 3 and 4 can be set such that the angle at which the laser beam L and / or the measurement beam DL enters the object W can be optimized . ≪ / RTI >

As described above, in the chamber unit 100 according to the present embodiment, the first and second windows 121 and 122 are formed on the other wall surfaces of the cover plate 110, that is, the first and second wall surfaces 110a and 110b, respectively The laser beam L is transmitted through the first window 121 to be irradiated onto a predetermined region of the object W to proceed with laser processing and the measurement beam DL is transmitted through the second window 122 The temperature of the specific region of the object W can be measured. Accordingly, it is possible to measure and monitor the temperature of a specific region (for example, a laser irradiation region or a peripheral region thereof) of the object W in real time while the laser processing operation is proceeding, You can check the quality of work in real time.

As a specific example, in the case of a specific object to be processed such as a silicon thin film or the like, it can be measured in real time by the temperature or the damage section of the object to be reacted by the irradiation of the laser beam. In addition, when the laser beam is irradiated to the photomask in the state where the etching gas is injected into the chamber unit, the etching process can be performed only in a desired region by measuring the temperature of the irradiated region of the laser beam or the surrounding region. The desired annealing process can be performed by measuring the temperature of a specific irradiation region of the laser beam or its surrounding region in real time while performing the wafer annealing process.

By providing the first and second windows 121 and 122 through which the laser beam L and the measurement beam DL respectively pass through the cover plate 110 of the chamber unit 100, A variety of light beams can be used as the measurement beam (DL).

5 is an internal cross-sectional view of a chamber unit according to another exemplary embodiment of the present invention.

5, in the chamber unit 100 'according to the present embodiment, the stage 130 is not provided to be inclined with respect to the base plate 105, but is arranged in parallel with the base plate 105 have. Here, the stage 130 is installed so as to be movable to a desired position on the base plate 105, whereby the laser beam L and the measurement beam DL can be irradiated to various regions of the object W to be processed.

The laser irradiation unit 200 may be disposed such that the laser beam L is inclined with respect to the surface of the object W placed on the stage 130. As described above, the embodiment in which the stage 130 is provided in parallel to the base plate 105 can be applied, for example, when the size of the laser beam L irradiated on the object W is large.

6 is a perspective view schematically showing a laser processing system according to another embodiment of the present invention. 6 shows a laser processing system 1000 including the chamber unit 100 described above.

6, the laser processing system 1000 according to the present embodiment may include a laser irradiation unit 200, a temperature measurement unit 300, and a chamber unit 100. [ For example, the laser irradiation unit 200 may be provided on the upper part of the chamber unit 100, and the temperature measurement unit 300 may be provided on one side of the chamber unit 100. However, this is merely an example, and the positions of the laser irradiation unit 200 and the temperature measurement unit 300 may be variously modified.

The laser irradiation unit 200 is for irradiating a laser beam L to an object to be processed W provided in the chamber unit 100 and performing a processing operation. For example, the laser irradiation unit 200 irradiates a laser beam L can be emitted. However, this is merely an example, and in addition, the laser irradiation unit 200 can emit the laser beam L of various wavelength ranges according to the type of the machining operation.

The temperature measuring unit 300 irradiates the measuring beam DL used for temperature measurement to measure the temperature of the object W to be irradiated with the laser beam L, will be. For example, the temperature measurement unit 300 may irradiate a measurement beam DL having a wavelength in the visible light or infrared range, but is not limited thereto. As the temperature measurement unit 300, for example, a thermal imaging camera, a pyrometer, or the like may be used. However, the present invention is not limited thereto.

3, the chamber unit 100 includes a base plate 105, a cover plate 110 provided to cover the base plate 105, first and second Windows 121 and 122, respectively. The first window 121 may be provided on the first wall surface 110a of the cover plate 110, for example, the upper surface of the cover plate 110, where the laser beam L is transmitted. The laser beam L emitted from the laser irradiation unit 200 provided on the upper portion of the chamber unit 100 is transmitted through the first window 121 of the cover plate 110 to be processed on the stage 130 W) in a predetermined area. The first window 121 may include a material capable of transmitting the wavelength of the incident laser beam L well.

The second window 122 is provided at a position where the measurement beam DL for temperature measurement is transmitted and is provided at the second wall face 110b of the cover plate 110, for example, at one side of the cover plate 110 . The measurement beam DL emitted from the temperature measurement unit 300 provided on the upper side of the chamber unit 100 is transmitted through the second window 122 of the cover plate 110 to the object 130, (W). Accordingly, the temperature measuring unit 300 can measure the temperature for a specific region of the object W in real time. The second wall surface 110b on which the second window 122 is formed may be formed to be inclined with respect to the first wall surface 110a on which the first window 121 is provided. The measurement beam DL transmitted through the second window 122 may have a wavelength different from that of the laser beam L transmitted through the first window 121, but the measurement beam DL is not limited thereto. The second window 122 may include a material capable of transmitting the wavelength of the incident measurement beam DL well.

The base plate 105 is provided with a stage 130 on which the object W is mounted. The stage 130 is provided on the base plate 105 so as to be movable. The stage 130 may be inclined with respect to the base plate 105. On the other hand, the stage 130 may not be inclined with respect to the base plate 105.

A vacuum unit 400 may further be provided under the chamber unit 100. The vacuum unit 400 may be connected to the chamber unit 100 to maintain the interior of the chamber unit 100 in a vacuum state. A pressure display unit 500 may be further provided on the vacuum unit 400 to display the internal pressure of the chamber unit 100.

The laser beam L is transmitted through the first window 121 and the laser beam L is irradiated onto the predetermined portion of the work W by providing the first and second windows 121 and 122 on the cover plate 110 of the chamber unit 100. [ And the measurement beam DL can be transmitted through the second window 122 to measure the temperature of the specific region of the object W. [ Therefore, it is possible to measure and monitor the temperature of a specific region (for example, a laser irradiation region or a peripheral region thereof) of the object W in real time while the laser processing operation is proceeding. Also, as the measurement beam DL, light of various wavelengths having different wavelengths from the laser beam L can be used.

The chamber unit 100 according to the embodiment of the present invention described above can be utilized in various fields using laser processing. As an example, the chamber unit 100 may be used for laser annealing, glue removal of a photomask, etching using a laser, and the like. Also, it can be used to measure a temperature characteristic change or a phase transition depending on the absorption rate of an object to be processed by using a laser.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims.

100, 100 '.. chamber unit
105. Base plate
110 .. Cover Plate
121 .. 1st window
122 .. second window
130 .. Stage
135 .. pin
137. Guide member
200 .. Laser Irradiation Unit
300 .. Temperature measuring unit
400 .. Vacuum unit
500 .. Pressure display unit
1000 .. Laser Processing System
L .. laser beam
RL .. Reflected laser beam
DL .. Measuring beam
W .. The object to be processed

Claims (19)

1. A chamber unit provided with an object to be processed therein and irradiating the object with a laser beam transmitted from the outside,
A base plate;
A cover plate covering the base plate;
A first window provided on the cover plate and through which the laser beam is transmitted; And
And a second window which is provided on the cover plate so as to be spaced apart from the first window and through which a measurement beam for temperature measurement for a specific region of the object is transmitted. The method according to claim 1,
Wherein the first and second windows are provided on first and second wall surfaces of the cover plate. 3. The method of claim 2,
And the second wall surface is inclined relative to the first wall surface. The method according to claim 1,
Further comprising a stage provided on the base plate on which the object to be processed is placed. 5. The method of claim 4,
Wherein the stage is movably provided on the base plate. 6. The method of claim 5,
Wherein the stage is provided such that one end of the stage moves up and down so as to be inclined with respect to the base plate. 5. The method of claim 4,
Wherein the laser beam is incident obliquely with respect to a surface of the object to be processed which is placed on the stage. 8. The method of claim 7,
Wherein a part of the laser beam reflected from the object to be processed advances to an area of the inner wall surface of the cover plate where the first and second windows are not formed. The method according to claim 1,
Wherein the laser beam and the measurement beam have different wavelengths, and wherein the first window and the second window comprise different materials. The method according to claim 1,
Wherein the interior of the chamber unit is maintained in vacuum. A laser irradiation unit for emitting a laser beam to an object to be processed;
A temperature measurement unit for emitting a measurement beam for temperature measurement of a specific region of the object; And
And a chamber unit in which the object to be processed is provided,
Wherein the chamber unit comprises:
A base plate;
A cover plate provided to cover the base plate;
A first window provided on the cover plate and through which the laser beam is transmitted; And
And a second window which is provided on the cover plate so as to be spaced apart from the first window and through which the measurement beam is transmitted. 12. The method of claim 11,
Further comprising a vacuum unit for maintaining the interior of the chamber unit under vacuum. 12. The method of claim 11,
Wherein the first and second windows are provided on the first and second wall surfaces of the cover plate and the second wall surface is inclined with respect to the first wall surface. 12. The method of claim 11,
Wherein the chamber unit is provided on the base plate and further comprises a stage on which the object to be processed is placed. 15. The method of claim 14,
Wherein the stage is movably provided on the base plate. 16. The method of claim 15,
And the stage is provided so that one end of the stage moves up and down so as to be inclined with respect to the base plate. 15. The method of claim 14,
Wherein the laser beam is inclined with respect to a surface of the object placed on the stage, and a part of the laser beam reflected from the object is reflected by the inner wall surface of the cover plate, A laser processing system that progresses to a region. 12. The method of claim 11,
Wherein the laser beam and the measurement beam have different wavelengths and the first window and the second window comprise different materials. 1. A method for measuring a temperature of an object to be processed provided in a chamber unit including a base plate and a cover plate covering the base plate,
The laser beam is irradiated onto the object to be processed through the first window of the cover plate to perform a laser beam machining operation and a measurement beam for temperature measurement is irradiated onto the object to be processed through the second window of the cover plate, Wherein the temperature of the specific region of the object is measured.
KR1020150108865A 2015-07-31 2015-07-31 Chamber unit for real time detecting temperature of laser irradiated area and laser processing system including the chamber unit KR101715353B1 (en)

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KR1020150108865A KR101715353B1 (en) 2015-07-31 2015-07-31 Chamber unit for real time detecting temperature of laser irradiated area and laser processing system including the chamber unit
PCT/KR2016/007509 WO2017022969A1 (en) 2015-07-31 2016-07-11 Chamber unit for real-time temperature measurement of laser irradiation region, and laser processing system including same
TW105123522A TWI607611B (en) 2015-07-31 2016-07-26 Chamber unit for real time detecting temperature of laser irradiated area, laser processing system including the chamber unit, and temperature measuring method of processed object

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CN111975191B (en) * 2020-08-17 2023-01-24 北京中科镭特电子有限公司 Processing cavity assembly and laser processing device

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JPH05320917A (en) * 1992-05-15 1993-12-07 Sumitomo Electric Ind Ltd Thin film forming device
JP2006294717A (en) * 2005-04-07 2006-10-26 Alfa Ec Co Ltd Substrate heating apparatus
JP2011121093A (en) * 2009-12-10 2011-06-23 Mitsubishi Materials Corp Laser beam machining apparatus and laser beam machining method of tool using the same
JP2012110945A (en) * 2010-11-26 2012-06-14 Toshiba Corp Laser beam machining apparatus

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JPH05320917A (en) * 1992-05-15 1993-12-07 Sumitomo Electric Ind Ltd Thin film forming device
JP2006294717A (en) * 2005-04-07 2006-10-26 Alfa Ec Co Ltd Substrate heating apparatus
JP2011121093A (en) * 2009-12-10 2011-06-23 Mitsubishi Materials Corp Laser beam machining apparatus and laser beam machining method of tool using the same
JP2012110945A (en) * 2010-11-26 2012-06-14 Toshiba Corp Laser beam machining apparatus

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