KR20170009443A - Micro contact array structure for semiconductor device test - Google Patents

Micro contact array structure for semiconductor device test Download PDF

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Publication number
KR20170009443A
KR20170009443A KR1020150101507A KR20150101507A KR20170009443A KR 20170009443 A KR20170009443 A KR 20170009443A KR 1020150101507 A KR1020150101507 A KR 1020150101507A KR 20150101507 A KR20150101507 A KR 20150101507A KR 20170009443 A KR20170009443 A KR 20170009443A
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KR
South Korea
Prior art keywords
semiconductor device
micro
contact
array structure
microcontact
Prior art date
Application number
KR1020150101507A
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Korean (ko)
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KR101707853B1 (en
Inventor
양희성
Original Assignee
(주) 지엘피
양희성
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Priority to KR1020150101507A priority Critical patent/KR101707853B1/en
Publication of KR20170009443A publication Critical patent/KR20170009443A/en
Application granted granted Critical
Publication of KR101707853B1 publication Critical patent/KR101707853B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Abstract

The present invention relates to a micro contact array structure for inspecting a semiconductor device, in which one end is in contact with a terminal of a semiconductor device and the other end is in contact with a test substrate of the tester to electrically connect the semiconductor device and the tester, A plurality of microcontact elements to be elastically compressed into a plurality of microcontact elements; A supporting member which is provided in the form of wrapping around an intermediate portion excluding the both ends of the micro contact elements, to support the micro contact elements so as to be elastically compressible; And a plurality of micro-contact elements which are coupled to the support member so as to receive and expose one end of the micro-contact elements toward the semiconductor device, and guide terminals of the semiconductor device so that terminals of the semiconductor device can contact one end of the micro- Wherein the micro-contact element includes a symmetrical circular or elliptical elastic compression portion, the elastic compression portion being configured to be in contact with an intermediate portion of the micro-contact element received in the support member .

Description

[0001] MICRO CONTACT ARRAY STRUCTURE FOR SEMICONDUCTOR DEVICE TEST [0002]

The present invention relates to a microcontact array structure applicable to a socket or interposer for inspection of semiconductor devices.

In order to inspect whether or not a manufactured semiconductor device is defective, a process of analyzing the electrical characteristics of the subject by applying an electrical signal to the semiconductor device using a tester is performed. In such a process, a semiconductor device to be inspected and a tester Separate test sockets are required for mutual electrical connection.

In addition, the structural characteristics associated with the electrical connection, such as the terminal structure, the shape and the arrangement interval of the semiconductor device manufactured through the microfabrication process, are different for each semiconductor device to be inspected, For compatibility, an interposer, which is used to convert the space, is required between the inspection object and the inspection object.

A micro contact array applied to an electrical connection device such as a test socket or an interposer that is involved in electrical connection between a test object and a test object is positioned between the test object and the test object, As the external force is applied repetitively in the process of being pressed to the test object side for inspection, the structural recovery of the microcontact array is largely related to the durability of the whole equipment such as the test socket or interposer and the reliability of the test result.

Prior art documents related to the prior art for preventing structural deterioration of the external force applied to the microcontact array and reliability of the inspection process are disclosed in Korean Patent Registration No. 10-1514636 entitled "Semiconductor Device Test Socket Using Cantilever Structure " (Hereinafter referred to as " prior art "). In this conventional technique, the structure of the contact element in the microcontact array is transformed into the shape of a cantilever structure, thereby reducing the damage and deformation of the structure due to the external force applied. The test has been made to increase the durability of the socket.

However, the structure of a contact element in a micro contact array, which is suitably applied to an existing test socket or interposer including the prior art and performs electrical connection between a semiconductor device and a tester, As a result, the contact position of the contact element with respect to the terminal of the object to be inspected is varied according to the inspection process of the object to be tested repeatedly, and furthermore, the test socket or interposer to which such a micro- There is a problem that the reliability of inspection of the same apparatus is deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a micro contact array which is disposed in a process of being pressed to a tester side in order to electrically connect a semiconductor device to a tester The present invention is to provide a technology that distributes the external force uniformly and evenly, and maintains reliability of a high-level inspection result even when the repeated inspection process is performed.

In order to accomplish the above object, the present invention provides a micro contact array structure for inspecting a semiconductor device, the one end of the micro contact array structure contacting a terminal of a semiconductor device and the other end contacting a test substrate of the tester, A plurality of micro contact elements which are elastically compressed in a direction in which an external force is applied; A supporting member which is provided in the form of wrapping around an intermediate portion excluding the both ends of the micro contact elements, to support the micro contact elements so as to be elastically compressible; And a plurality of micro-contact elements which are coupled to the support member so as to receive and expose one end of the micro-contact elements toward the semiconductor device, and guide terminals of the semiconductor device so that terminals of the semiconductor device can contact one end of the micro- And a guide member formed with a plurality of guide holes, wherein the microcontact element includes an elastic compression portion in the form of a ring having an elastic hole at its center.

In addition, the elastic compression portion is provided in a bilaterally symmetrical shape, and is located at an intermediate portion of the micro contact element accommodated in the support member.

Here, the micro contact element may include: a first connection portion extending from the elastic compression portion toward the semiconductor device; And a second connection part extending from the elastic compression part to the tester side, wherein the first connection part and the second connection part are formed at positions corresponding to left and right symmetry axes of the elastic compression part.

Further, a contact groove is formed at an end of the first connection portion accommodated in the guide member, the contact groove being embedded into the tester side with a predetermined curvature,

In addition, the terminal of the semiconductor device is provided in the form of a solder ball, and the contact groove is embedded into the tester side with a greater curvature than the curvature of the terminal of the semiconductor device of the solder ball type.

Further, the support member is made of a material having an elastic deformation and insulation function, and more specifically, it is prepared by curing one of liquid silicone rubber or liquid urethane.

According to the present invention, the following effects can be obtained.

First, the elastic compressed portion of the microcontact device is provided in a symmetrical circular or elliptical shape, so that the external force generated in the process of inspecting the semiconductor device for defects can be uniformly and uniformly distributed right and left.

Secondly, the external force applied to the microcontact device is balancedly dispersed by the support member surrounding the interruption of the microcontact device, and the degree of stress generated from the microcontact device is lowered even in the course of the continuous inspection process. The durability and inspection reliability of the test socket or interposer to which the micro-contact array structure for inspecting the semiconductor device of the invention is applied is increased.

Thirdly, the external force applied to the microcontact device is balanced by the structural characteristics of the microcontact device, so that the frequency of occurrence of deformation with respect to the contact position between the microcontact device and the terminal of the semiconductor device is minimized The test reliability of the test socket or interposer to which the micro-contact array structure for inspecting a semiconductor device of the present invention is applied is increased.

Fourth, since the interruption of the microcontact device is wrapped and supported by the support member provided by the elastic deformation and the insulating material, it is possible to provide the structural restoration by the elasticity of the microcontact device and secure the stability of the electrical connection performance.

1 is a sectional view schematically showing a micro contact array structure for inspection of a semiconductor device of the present invention.
2 is a sectional view schematically showing a micro contact array structure for inspection of a semiconductor device according to another embodiment of the present invention.
3 is a reference diagram for explaining an operation mode of the micro contact array structure for inspection of the semiconductor device of FIG.
4 is a reference view for explaining a conventional operation mode of a micro contact array structure for inspection of a semiconductor device.
5 is a reference diagram for explaining an operation mode of the micro contact array structure for inspection of the semiconductor device of FIG.

The preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings, in which the technical parts already known will be omitted or compressed for the sake of brevity.

1. Description of components of a microcontact array structure for semiconductor device inspection

Referring to FIGS. 1 to 3, a micro contact array structure 100 for inspecting a semiconductor device according to a first embodiment of the present invention will be described. A micro contact array structure 100 for inspecting a semiconductor device includes a plurality of micro contact elements 110); A support member 120; And a guide member (130).

The micro contact element 110 has one end contacting the terminal SB of the semiconductor device D and the other end contacting the test substrate TCB of the tester to electrically connect the semiconductor device D and the tester And a plurality of them are provided.

Here, the micro contact element 110 is located between the semiconductor device D and the tester, and when the inspection of the semiconductor device D is required, the semiconductor device D is pressed toward the tester side to move, and the semiconductor device D- After the microcontact element 110 is touched and electrically connected, the tester applies an electrical signal to the semiconductor device D via the microcontact element 110.

In the inspection process, an external force is applied to the microcontact element 110 in the process of being pressed toward the tester side. By this external force, the microcontact element 110 is supported by the support member 120, So that the micro contact element 110 is structurally restored based on the elasticity of the support member 120 in a pre-pressurized state when an external force is removed.

More specifically, structural characteristics of the microcontact device 110 will be described with reference to an elastic compression portion 111 provided in a ring-like structure having an elastic hole at the center and having left-right symmetry, 111 and the first connecting portion 112 extending from the portion near the semiconductor device D toward the semiconductor device D among the positions corresponding to the left and right symmetry axes of the elastic compression portion 111 and the elastic compression portion 111, And a second connecting portion 113 extending from the portion near the tester to the tester side.

Here, the elastic compression portion 111 is located at the middle portion MS of the microcontact element 110, so that the elastic compression portion 111 is accommodated in the support member 120 to be described below.

The micro contact element 110 may be made of a conductive material and may be made of at least one of a nickel alloy such as Ni, NiCo and NiW, gold (Au), rhodium (Rh), and platinum (Pt) It can be prepared using a combination of two or more.

The support member 120 is provided in the form of wrapping around an intermediate portion MS excluding both ends of the plurality of micro contact elements 110 and is made of a material having an elastic deformation and insulation function so that a plurality of micro contact elements 110 So that elastic compression is possible.

The suspended portion MS of the microcontact element 110 wrapped and supported by the support member 120 has a first connecting portion 112 extending from the elastic compression portion 111 and the elastic compression portion 111, A part of the elastic coupling portion 111 side of the second coupling portion 113 is included.

Here, the material of the support member 120 will be described in more detail. It is preferable to provide the support member 120 by curing one of the liquid silicone rubber and the liquid urethane.

The guide member 130 is configured to accommodate one end of the micro contact element 110 so that one end of the micro contact element 110 can be exposed toward the terminal SB of the semiconductor device D, (D).

The guide member 130 also has a plurality of guides for guiding the position of the terminals SB of the semiconductor device D so that one end of the micro contact element 110 can be contacted with the terminals SB of the semiconductor device D. [ A hole 131 is formed.

In other words, one end of the micro-contact element 110 is positioned in the guide hole 131 formed in the guide member 130. When the semiconductor device D is pressed and moved toward the tester for electrical connection, The terminal SB of the microcontact element 110 is guided to the inside of the guide hole 131 and pushes one end of the microcontact element 110 toward the tester side to contact each other.

Referring to FIGS. 2 and 5, a micro contact array structure 200 for inspecting a semiconductor device according to a first embodiment of the present invention will be described. A micro contact array structure 200 for inspecting a semiconductor device includes a plurality of micro contact elements 210); A support member 220; And a guide member (230).

The second embodiment of the present invention will be described mainly on the differences from the first embodiment, and a duplicate description will be simplified or omitted.

The elastic compression portion 211, the second connection portion 213, and the support member (not shown) in the plurality of microcontact elements 210 of the microcontact array structure 200 for inspection of a semiconductor device according to the second embodiment of the present invention 220 and the guide member 230 are the elastic compression portions 111 in the plurality of microcontact elements 110 of the microcontact array structure 100 for testing semiconductor devices according to the first embodiment of the present invention, The second connection portion 113, the support member 120, and the guide member 130, detailed description thereof will be omitted.

However, as shown in the enlarged view of FIG. 2, the first connecting portion 212 of the plurality of micro contact elements 210 has a predetermined curvature at the end portion thereof and is embedded into the tester side to form the contact groove 212H.

This is because the semiconductor device D of the BGA (Ball Grid Array) package type is in contact with one end (the end of the first connecting portion) of the plurality of microcontact elements 210 to check whether the semiconductor device D is defective, Since the terminal SB of the semiconductor device D forming the connection is provided in the form of a solder ball so as to widen the mutual contact area suitable for the structure of the terminal SB to ensure the accuracy and ease of electrical contact .

The inclined curvature of the contact groove 212H formed at the end of the first connecting portion 212 on the side of the semiconductor device D is the same as that of the solder ball So that the terminal SB of the semiconductor device D can be more easily brought into contact with the microcontact element 210. [

2. Description of operation of micro contact array structure for semiconductor device inspection

3 to 5, the operation of the micro contact array structure 100 for inspection of a semiconductor device according to the present invention and the conventional micro contact array structure 10 for inspection of a semiconductor device will be described below.

First, the structure of the microcontact element 11 constituting the conventional micro-contact array structure 10 for inspecting a semiconductor device is asymmetric with respect to the left and right, and is formed by bending one pin structure which is not formed by branching .

Here, the defect inspection process of the semiconductor device D using the conventional micro-contact array structure 10 for inspecting a semiconductor device is performed as follows. As shown in FIG. 4A, a semiconductor device D is mounted between a semiconductor device D and a test substrate TCB. The semiconductor device D is pressed to the tester side and electrically connected to each other as shown in FIG. 4B in a state where the inspection micro-contact array structure 10 is disposed. After the tester is electrically connected to the tester side, The semiconductor device D is inspected for defects by applying an electrical signal to the semiconductor device D through the micro contact array structure 10. When the inspection process is repeatedly performed, the problem of structural deformation of the micro- As shown in FIG. 4C, the semiconductor device ends of the microcontact elements 11 The contact position and the form of the (SB) is deformed by the external force in the continuous defect testing whether a semiconductor device (D), a problem of lowering the reliability test of the test socket or interposer to be applied has been found.

3 and 5, in order to inspect the semiconductor device (D) for defects, the semiconductor device (D) is pressed toward the tester side Even if an external force is applied to the micro contact elements 110 and 210, the elastic compressed portions 111 and 211 of the micro contact elements 110 and 210 form a circular or elliptical shape symmetrical to the left and right, The first connecting portions 112 and 212 and the second connecting portions 113 and 213 extending upward and downward also distribute the external force exerted by the elastic compression portions 111 and 211 ), Thereby further supporting the above-described effect of balanced dispersion of the external force.

As a result, the stress generated in the micro contact elements 10 and 20 and the degree of the elastic force required for the structural recovery after the end of the inspection process are lowered, so that the conventional micro contact array structure 10 It is possible to overcome the problems of contact position and shape change of the contact element 11 with respect to the semiconductor device terminal SB and deterioration of the inspection reliability due to the repetitive inspection.

5, a contact groove (not shown) formed at the end of the first connection portion 211 of the micro contact element 211 in the micro contact array structure 200 for inspecting a semiconductor device according to the second embodiment of the present invention 212H are embedded in a curvature larger than the curvature of the solder ball type semiconductor device (D) terminal SB to form a space, so that a wider contact area is pressed than a conventional semiconductor device D).

In addition, the contact groove 212H of the micro contact array structure 200 for inspecting a semiconductor device according to the second embodiment of the present invention is such that the terminal SB of the semiconductor device is contacted By providing a sufficient amount of free space, the ease of mutual contact can be improved.

The embodiments disclosed in the present invention are not intended to limit the scope of the present invention but to limit the scope of the technical idea of the present invention. The scope of protection is to be construed in accordance with the following claims, and all technical ideas within the scope of equivalents thereof should be construed as being included in the scope of the present invention.

D: Semiconductor device
SB: Terminal of semiconductor device
TCB: Tester's Test Board
100, 200: Micro contact array structure for semiconductor device inspection
110, 210: a microcontact element
111, 211: elastic compression part
112, 212: first connecting portion
212H: contact groove
113, 213: second connecting portion
120, 220: Support member
130, 230: guide member
131, 231: guide hole

Claims (7)

A plurality of micro contact elements, one end of which is in contact with a terminal of the semiconductor device and the other end thereof is in contact with a test substrate of the tester to electrically connect the semiconductor device and the tester, and is elastically compressed in a direction in which an external force is applied;
A supporting member which is provided in the form of wrapping around an intermediate portion excluding the both ends of the micro contact elements, to support the micro contact elements so as to be elastically compressible; And
And a plurality of terminals for guiding the position of the terminals of the semiconductor device so that the terminals of the semiconductor device are brought into contact with one end of the micro-contact elements, the terminals being coupled to the support member to receive one end of the micro- And a guide member having a guide hole formed therein,
Characterized in that said microcontact element comprises a resiliently compressed portion in the form of a ring having an elastic bore in its center
Microcontact array structure for semiconductor device inspection.
The method according to claim 1,
Wherein the resiliently compressed portion is provided in a symmetrical manner and is located at an intermediate portion of the micro contact element accommodated in the support member
Microcontact array structure for semiconductor device inspection.
The method according to claim 1,
The micro-
A first connecting portion extending from the elastic compression portion to the semiconductor device side; And
And a second connecting portion extending from the elastic compression portion to the tester side,
Wherein the first connection portion and the second connection portion are formed at positions corresponding to the left and right symmetry axes of the elastic compression portion
Microcontact array structure for semiconductor device inspection.
The method of claim 3,
And a contact groove is formed at an end of the first connection part accommodated in the guide member and having a predetermined curvature and being embedded into the tester side.
Microcontact array structure for semiconductor device inspection.
5. The method of claim 4,
The terminal of the semiconductor device is provided in the form of a solder ball,
And the contact groove is embedded in the tester side with a greater curvature than the curvature of the terminal of the solder ball type semiconductor device
Microcontact array structure for semiconductor device inspection.
The method according to claim 1,
Wherein the support member is made of a material having elastic deformation and insulation function
Microcontact array structure for semiconductor device inspection.
The method according to claim 6,
Characterized in that the support member is provided by curing one of liquid silicone rubber or liquid urethane
Microcontact array structure for semiconductor device inspection.
KR1020150101507A 2015-07-17 2015-07-17 Micro contact array structure for semiconductor device test KR101707853B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150101507A KR101707853B1 (en) 2015-07-17 2015-07-17 Micro contact array structure for semiconductor device test

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Application Number Priority Date Filing Date Title
KR1020150101507A KR101707853B1 (en) 2015-07-17 2015-07-17 Micro contact array structure for semiconductor device test

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KR20170009443A true KR20170009443A (en) 2017-01-25
KR101707853B1 KR101707853B1 (en) 2017-02-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210158533A (en) * 2020-06-24 2021-12-31 양희성 Test socket for semiconductor package
KR20220047015A (en) * 2020-10-08 2022-04-15 주식회사 아이에스시 Connector for electrical connection

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030085610A (en) * 2002-04-29 2003-11-07 인터스타 테크놀러지(주) A contactor for semiconductor device test socket
JP2006090772A (en) * 2004-09-22 2006-04-06 Matsushita Electric Ind Co Ltd Inspection jig for semiconductor device
KR20130064920A (en) * 2011-12-09 2013-06-19 주식회사 유니세트 Interposer for interposer socket and interposer socket
KR101416266B1 (en) * 2014-05-23 2014-08-07 주식회사 엔에스티 Connector for testing semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030085610A (en) * 2002-04-29 2003-11-07 인터스타 테크놀러지(주) A contactor for semiconductor device test socket
JP2006090772A (en) * 2004-09-22 2006-04-06 Matsushita Electric Ind Co Ltd Inspection jig for semiconductor device
KR20130064920A (en) * 2011-12-09 2013-06-19 주식회사 유니세트 Interposer for interposer socket and interposer socket
KR101416266B1 (en) * 2014-05-23 2014-08-07 주식회사 엔에스티 Connector for testing semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210158533A (en) * 2020-06-24 2021-12-31 양희성 Test socket for semiconductor package
KR20220047015A (en) * 2020-10-08 2022-04-15 주식회사 아이에스시 Connector for electrical connection

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