KR20170008455A

KR20170008455A - Socket assembly for testing semiconductor package

Info

Publication number: KR20170008455A
Application number: KR1020150099659A
Authority: KR
Inventors: 최명수; 임형도
Original assignee: 주식회사 티에프이
Priority date: 2015-07-14
Filing date: 2015-07-14
Publication date: 2017-01-24
Also published as: KR101744547B1

Abstract

The present invention provides a socket assembly for testing a semiconductor package, which includes: a socket which includes a socket pin connected to the semiconductor package; a holding plate which is arranged on the lower side of the socket and includes an insertion hole into which a free end of the socket pin is inserted; and a circuit board which is arranged on the lower side of the holding plate and includes a conductive pillar conducted with the socket pin. Accordingly, the present invention can simply connect the socket pin with a fine interval to the circuit board.

Description

[0001] SOCKET ASSEMBLY FOR TESTING SEMICONDUCTOR PACKAGE [0002]

The present invention relates to a socket assembly for testing semiconductor packages.

Generally, a semiconductor package completed by a manufacturing process is checked for proper operating characteristics through a test (inspection) process. As a result, only semiconductor packages classified as good are shipped.

For this test, the semiconductor package may be electrically connected to the main board while being inserted into the socket assembly.

At this time, since the interval between the electrodes of the semiconductor package is miniaturized, it is difficult to manufacture a socket assembly that can cope with this.

It is an object of the present invention to provide a socket assembly for testing a semiconductor package, which can solve the difficulty of connecting the socket pin having a fine gap to the circuit board.

It is another object of the present invention to provide a socket assembly for testing a semiconductor package, which is capable of limiting the circuit configuration area on the circuit board by the socket pin.

According to an aspect of the present invention, there is provided a socket assembly for testing a semiconductor package, comprising: a socket having a socket pin connected to a semiconductor package; A holding plate disposed below the socket and having an insertion hole into which a free end of the socket pin is inserted; And a circuit board disposed on the lower side of the holding plate and including a conductive column electrically connected to the socket pin.

The holding plate may further include a conductive charging unit that is filled in the insertion hole, surrounds the free end of the socket pin, and contacts the conductive pillars.

Here, the charging unit may be formed to surround the lower end of the free end of the socket pin, and the socket pin may be electrically connected to the conductive pillar through the charging unit.

Here, the inner diameter of the insertion hole may be 1.5 to 2 times the diameter of the socket pin.

The holding plate may further include a metal part attached to the inner wall of the insertion hole and coupled with the charging part.

Here, the charging part may be fused to the conductive pillars.

Here, the holding plate may include an upper surface in close contact with a lower surface of the socket.

Here, the socket may further include ridges formed at the center of the lower surface, and the holding plate may be disposed in the recessed portion.

Here, the insulative molding may be further provided to fill the socket, and to bond the socket and the circuit board.

Here, the socket may further include a coupling protrusion protruding from a portion surrounding the recess, and the circuit board may further include a coupling hole for receiving the coupling protrusion.

According to the socket assembly for testing a semiconductor package according to the present invention, the socket pin having a minute gap can be simply connected to the circuit board.

In addition, the circuit configuration area is not restricted by the socket pin on the circuit board.

FIG. 1 is a perspective view showing a socket assembly 100 for testing a semiconductor package according to an embodiment of the present invention, which is mounted on a main board M. FIG.
2 is a cross-sectional view of a socket assembly 100 for testing a semiconductor package taken along line II-II in FIG.
3 is an enlarged cross-sectional view of the holding plate 130 of FIG.

Hereinafter, a socket assembly for testing a semiconductor package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

FIG. 1 is a perspective view showing a socket assembly 100 for testing a semiconductor package according to an embodiment of the present invention, which is mounted on a main board M. FIG.

Referring to the drawings, a semiconductor device testing board device may include a main board M and a socket assembly 100 mounted thereon.

A circuit for testing is constituted on the main board (M). The circuit is for controlling the socket assembly 100. At this time, a plurality of socket assemblies 100 may be mounted on the main board M. A connecting portion C to which the connector 159 (FIG. 2) of the socket assembly 100 is connected may be formed in an area where each socket assembly 100 is mounted.

The socket assembly 100 is mounted on the main board M with the semiconductor package P accommodated therein. Thus, the semiconductor package P is electrically connected to the main board M via the socket assembly 100.

The specific structure of the socket assembly 100 will be described with reference to FIGS. 2 and 3. FIG.

2 is a cross-sectional view of a socket assembly 100 for testing a semiconductor package taken along line II-II in FIG.

Referring to the drawings, the socket assembly 100 may include a socket 110, a holding plate 130, a circuit board 150, and a molding 170.

The socket 110 is a structure that receives the semiconductor package P and is electrically connected thereto. Specifically, the socket 110 may have a body 111, a socket pin 113, and a coupling protrusion 115.

The body 111 may have a generally hexahedral shape. A receiving portion 111a for receiving the semiconductor package P may be formed on the upper portion of the body 111. A recess portion 111b may be formed at the center of the lower portion of the body 111. [ The ceiling surface of the recess portion 111b may be the lower surface 111c of the body 111. [

The socket pin (113) extends through the body (111). The socket pin 113 has an upper end connected to the semiconductor package P accommodated in the accommodating portion 111a. The lower end of the socket pin 113 is a free end exposed to the outside of the body 111, specifically, the recess portion 111b.

The engaging projection 115 is a projection projecting from the lower end of the body 111. Specifically, the engaging projection 115 may protrude from a portion defining the recessed portion 111b.

The holding plate 130 is configured to receive and hold the free end of the socket pin 113 and also to electrically connect the socket pin 113 to the circuit board 150. Specifically, the holding plate 130 may have a body 131, an insertion hole 133, and a charging unit 135.

The body 131 may be an insulating member having a substantially plate shape. Further, the body 131 is disposed in the recess portion 111b. The upper surface 131a of the body 131 may be formed in parallel with and in contact with the lower surface 111c of the body 111 of the socket 110. [

The insertion hole 133 is opened in the body 131 in correspondence with the socket pin 113. The insertion hole 133 may be formed through the body 131 in detail. The insertion hole 133 may have an inner diameter of 1.5 to 2 times the diameter of the socket pin 113.

The charging part 135 is a conductive material filled in the insertion hole 133. And the charging part 135 surrounds the free end of the socket pin 113. Thereby, the charging portion 135 may be wrapped not only to the side of the free end of the socket pin 113 but also downward.

The circuit board 150 is arranged below the holding plate 130 and is electrically connected to the socket pin 113. Specifically, the circuit board 150 may have a body 151, a conductive column 153, a fitting hole 155, a circuit pattern 157, and a connector 159.

The body 151 may have a size approximately equal to the size of the body 111 of the socket 110. In this figure, the shape of the body 151 is larger than that of the body 111.

The conductive pillars 153 form conductive paths passing through the body 151 up and down. The conductive pillar 153 is located corresponding to the socket pin 113. The ceiling portion 153a of the conductive pillar 153 may be bonded to the bottom portion 135a of the charging portion 135 in a reflow manner. Specifically, the bottom portion 135a and the ceiling portion 153a are each formed of a solder paste, hardened, and then bonded (fused) to each other while being melted and solidified.

The engaging hole 155 is formed corresponding to the engaging projection 115 of the socket 110. The coupling holes 155 may be located outside the conductive pillars 153.

The circuit pattern 157 may be disposed between the conductive pillars 153. At this time, the narrower the interval between the conductive pillars 153, the more difficult it is to form the circuit pattern 157.

The connector 159 is a structure for structurally and electrically connecting the circuit board 150 to the main board M (FIG. 1).

The molding 170 is a structure for bonding the socket 110 and the circuit board 150. The molding 170 may be an insulating adhesive filled in the recess portion 111b in detail.

According to this configuration, the socket pin 113 can be connected to the ceiling portion 153a of the conductive pillar 153 without passing through the conductive pillar 153. Thereby, the socket pin 113 does not need to be fitted to the conductive pillar 153 having the minimum width for forming the circuit pattern 157 with difficulty.

Further, since the insertion hole 133 of the holding plate 130 in which the socket pin 113 is inserted is not limited in width as the conductive pillar 153, the process of fitting the socket pin 113 into the insertion hole 133 Can be made easier than by sandwiching it on the conductive pillars (153).

Further, since the socket pin 113 is not fitted in the conductive column 153, the width of the conductive column 153 can be made narrower than when the socket pin 113 is fitted. This means that the formation of the circuit pattern 157, which is limited by the spacing between the conductive pillars 153, can be made easier in a wider space.

Further, by adding the molding 170 in addition to the fusion of the charging part 135 and the conductive pillar 153, the strength of the connection between the socket 110 and the circuit board 150 can be further increased.

Next, the detailed structure of the holding plate 130 will be described with reference to Fig.

3 is an enlarged cross-sectional view of the holding plate 130 of FIG.

Referring to this figure, the holding plate 130 may further have a metal part 137. [

The metal part 137 is formed on the inner wall of the insertion hole 133.

With the metal portion 137, the charging portion 135 filled in the insertion hole 133 can be easily combined with the metal portion 137. This is because the charging part 135 is a conductive material and is easily fused to the metal part 137.

As a result, the charging portion 135 is stably coupled to the metal portion 137 and the socket pin 113. This ensures accurate alignment between the metal portion 137 and the conductive pillar 153 and rigid bonding due to reflow.

The socket assembly for testing a semiconductor package as described above is not limited to the configuration and operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: Socket assembly for semiconductor package test
110: socket 111: body
113: socket pin 115: engaging projection
130: holding plate 131: body
133: insertion hole 135:
150: circuit board 151: body
153: conductive column 155: coupling hole
157: Circuit pattern 170: Molding

Claims

A socket having a socket pin connected to a semiconductor package;
A holding plate disposed below the socket and having an insertion hole into which a free end of the socket pin is inserted; And
And a circuit board disposed on the lower side of the holding plate, the circuit board including a conductive pillar electrically connected to the socket pin.

The method according to claim 1,
Wherein the holding plate comprises:
Further comprising a conductive charging portion that is filled in the insertion hole and surrounds the free end of the socket pin and contacts the conductive pillar.

3. The method of claim 2,
The charging unit includes:
Wherein the socket pin is configured to wrap under the free end of the socket pin such that the socket pin is energized with the conductive pillar through the live part.

3. The method of claim 2,
Wherein an inner diameter of the insertion hole is 1.5 to 2 times the diameter of the socket pin.

3. The method of claim 2,
Wherein the holding plate comprises:
Further comprising a metal portion attached to an inner wall of the insertion hole and coupled with the charging portion.

The method of claim 3,
The charging unit includes:
Wherein the conductive pillar is fused to the conductive pillar.

The method according to claim 1,
Wherein the holding plate comprises:
And an upper surface in close contact with a lower surface of the socket.

The method according to claim 1,
The socket includes:
And further comprising a lid formed at the center of the lower surface,
Wherein the holding plate comprises:
Wherein the recessed portion is disposed within the recessed portion.

9. The method of claim 8,
Further comprising an insulating molding filled in the socket to bond the socket and the circuit board.

9. The method of claim 8,
The socket includes:
And a coupling protrusion protruding from a portion surrounding the recess portion,
The circuit board includes:
And a coupling hole for receiving the coupling protrusion.