KR20160147504A - Pressure sensor device and method of fabricating the same - Google Patents

Abstract

The present invention provides a pressure sensor device and a method of fabricating the same, wherein the pressure sensor device comprises: a housing having an atmospheric inlet and a fluid inlet; a substrate arranged in an internal space of the housing, having a first through hole and a second through hole for the atmosphere to pass; a pressure sensor chip mounted on the substrate to cover the first through hole to measure relative pressure of a fluid with respect to atmospheric pressure, wherein a lower portion is exposed to the atmosphere through the first through hole; and a pressure transmission medium having an interconnected structure for the atmosphere to reach the pressure sensor chip exposed by the first through hole as the atmosphere flowing through the atmosphere inlet passes through the internal space divided by the housing and the first through hole in order by passing through the second through hole.

Description

Technical Field The present invention relates to a pressure sensor device and a manufacturing method thereof,

The present invention relates to a pressure sensor device and a method of manufacturing the same, and more particularly, to a pressure sensor for detecting a water level and a method of manufacturing the same.

In general, a washing machine is an apparatus for washing laundry through washing, rinsing and dewatering processes using the action of water and detergent supplied into the washing tub, and the washing machine is installed in the washing machine according to a predetermined water level A pressure sensor capable of appropriately adjusting the supply amount of water is provided.

The pressure sensor has a structure in which a metal coil and a magnetic bar move through a change in air pressure according to a change in the water level of a water level sensing object, and the frequency is oscillated through a change in inductance thereof.

Meanwhile, in recent years, a drum washing machine for spraying steam by spraying steam has also been commercialized, and a lot of researches on pressure sensors have been conducted to detect a more accurate water level. However, the pressure sensor has a sensitivity of changing the output frequency of several kHz, and the output value changes in the form of a nonlinear quadratic curve, which causes a problem that the level can not be precisely detected. Also, there is a problem that excessive pressure is generated due to excessive steam generation or water pressure continuously supplied, resulting in breakage or failure of the pressure sensor in severe cases.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a pressure sensor device capable of sensing a precise level and preventing breakage by washing water and a method of manufacturing the same, . However, these problems are exemplary and do not limit the scope of the present invention.

According to one aspect of the present invention, a pressure sensor device is provided. The pressure sensor device comprising: a housing having an atmospheric fluid inlet and a fluid fluid inlet; A substrate disposed in the inner space of the housing, the substrate having a first through hole and a second through hole to allow air to pass therethrough; And a pressure sensor chip mounted on the substrate so as to cover the first through hole, wherein a lower portion of the pressure sensor chip is exposed to atmosphere through the first through hole to measure a relative pressure of the fluid with respect to the atmospheric pressure, The air introduced through the air inlet passes sequentially through the first through-hole and the inner space separated by the housing through the second through-hole, thereby to prevent the pressure sensor chip exposed by the first through- And can have a communicated structure so that the atmosphere can be reached.

In the pressure sensor device, the housing may be divided into an upper housing and a lower housing with respect to the substrate, and the upper housing may further include a partition wall contacting the substrate and defining an inner space.

The pressure sensor device may further include a pressure transmission medium disposed in the internal space to protect the pressure sensor chip and to transmit pressure of the fluid so as to measure pressure in the pressure sensor chip.

The pressure sensor device may be divided into a space through which the atmospheric air introduced from the air inlet by the partition wall can move and a space through which the pressure transmission medium can be formed.

In the pressure sensor device, the partition wall is bonded to the upper surface of the substrate, the upper housing is bonded to the partition wall, and the lower housing is bonded to the lower surface of the substrate.

In the pressure sensor device, the lower housing may be in contact with the substrate and communicated with the air inlet.

In the pressure sensor device, the air inlet and the fluid inlet may extend in the same direction on the same side of the housing.

In the pressure sensor device, the pressure transmission medium may have a waterproof function so that the fluid does not directly touch the pressure sensor chip.

In the pressure sensor device, the pressure transmission medium may include a gel that can be deformed according to a pressure of the fluid.

In the pressure sensor device, the pressure transmission medium may include silicone or epoxy, which may be deformed depending on the pressure of the fluid.

The pressure sensor device may include an integrated circuit (IC) chip mounted on the substrate and converting an analog signal output generated from the pressure sensor chip into a digital signal output.

In the pressure sensor device, the substrate and the pressure sensor chip may be electrically connected to each other by using a conductive lead, and the pressure sensor chip and the conductive lead may be sealed using the pressure transmission medium.

The pressure sensor device may further include a regulator mounted on the substrate and capable of maintaining a constant voltage.

According to another aspect of the present invention, a pressure sensor device is provided. The pressure sensor device comprising: a substrate having a first through hole and a second through hole to allow air to pass therethrough; Wherein the pressure sensor chip is mounted on the substrate so as to cover the first through hole and the lower portion is exposed to the atmosphere through the first through hole to measure a relative pressure of the fluid with respect to the atmospheric pressure. A partition wall defining an inner space by being joined to an upper surface of the substrate so as to protect the pressure sensor chip; An upper housing having an air inlet and a fluid inlet, which are bonded to the partition wall to protect at least a part of the pressure sensor chip; And a lower portion which is joined to a lower surface of the substrate to protect the pressure sensor chip, thereby forming a passage so that air introduced through the air inlet may sequentially pass through the second through hole and the first through hole, And a housing.

The pressure sensor device may include a pressure transmission medium which seals the pressure sensor chip and can transmit the pressure of the fluid so as to measure pressure in the pressure sensor chip.

According to another aspect of the present invention, a method of manufacturing a pressure sensor device is provided. The method of manufacturing the pressure sensor device includes: preparing a substrate having at least two through holes so that air can pass therethrough; Forming a pressure sensor chip on the substrate so as to cover the through hole and measuring the relative pressure of the fluid with respect to the atmospheric pressure so that the lower part is exposed to the atmosphere through the through hole; Forming an integrated circuit (IC) chip on the substrate; Forming a partition wall defining an internal space in contact with the substrate to protect the pressure sensor chip and the integrated circuit chip; Forming a pressure transmission medium capable of sealing at least a part of the pressure sensor chip and the integrated circuit chip in the internal space; Forming a lower housing to protect the pressure sensor chip exposed by the through hole at a lower portion of the substrate; And forming an upper housing on the partition wall, the upper housing having an atmospheric inlet and a fluid inlet.

According to the embodiment of the present invention described above, it is possible to provide a pressure sensor device capable of realizing miniaturization, saving water and reducing power consumption through precise level control, and preventing breakage by washing water, The manufacturing method can be implemented. Of course, the scope of the present invention is not limited by these effects.

FIG. 1 is a process flowchart schematically illustrating a method of manufacturing a pressure sensor device according to an embodiment of the present invention.
2A to 2I are perspective views schematically illustrating a method of manufacturing a pressure sensor device according to an embodiment of the present invention.
3 is a cross-sectional view taken along line A-A 'of the pressure sensor device shown in FIG. 2I.
4 is a schematic view illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, Is provided to fully inform the user. Also, for convenience of explanation, the components may be exaggerated or reduced in size.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions illustrated herein, but should include, for example, changes in shape resulting from manufacturing.

FIG. 1 is a process flowchart schematically illustrating a method of manufacturing a pressure sensor device according to an embodiment of the present invention.

Referring to FIG. 1, a method of manufacturing a pressure sensor device according to an embodiment of the present invention includes preparing a substrate having at least two through-holes so that air can pass therethrough (S100) Forming a pressure sensor chip on the substrate so as to cover the through hole and exposing the air to the atmosphere through the through hole; S200 forming an integrated circuit chip on the substrate; S300 (S400) of forming a partition defining the internal space while contacting the substrate so as to protect the pressure sensor chip and the integrated circuit chip (S400); sealing the pressure sensor chip and the integrated circuit chip (S500); forming a lower housing (S600) to protect the pressure sensor chip exposed by the through hole at the lower portion of the substrate (S600); and introducing the atmospheric pressure inlet and the fluid inlet It may include a step (S700) of forming the upper housing on the partition wall. Hereinafter, a detailed description of the construction and manufacturing method of the pressure sensor device will be given later with reference to Figs. 2A to 2I, 3 and 4. Fig.

2A to 2I are perspective views schematically illustrating a method of manufacturing a pressure sensor device according to an embodiment of the present invention.

First, referring to FIG. 2A, a substrate 100 having at least two through holes can be prepared. The through hole may include a first through hole (102) and a second through hole (104). The substrate 100 may use, for example, a printed circuit board (PCB) or a lead frame. The first through hole 102 and the second through hole 104 are passages through which air can be introduced and can be connected to an air inlet of the upper housing to be described later with reference to FIG.

2B and 2C, in order to measure the relative pressure of the fluid with respect to the atmospheric pressure, the substrate 100 is mounted on the substrate 100 so as to cover the first through-hole 102, The pressure sensor chip 200 may be formed to be exposed to the atmosphere. The silicon patterning 202 may be formed on the rim of the pressure sensor chip 200 beforehand. The silicon patterning 202 may perform an adhesive function so that the pressure sensor chip 200 can be fixed on the substrate 100. Here, the fluid includes both a liquid and a gas, and the pressure sensor chip 200 is a well-known technique, and a detailed description thereof will be omitted.

2D and 2E, the pressure sensor chip 200 is mounted on the same surface of the substrate 100 in the same manner as the pressure sensor chip 200, and the integrated signal output from the pressure sensor chip 200 is converted into a digital signal output A circuit (IC) chip 300 may be formed. Here, the integrated circuit chip 300 can be understood as an analog front end, for example.

At least two selected ones of the substrate 100, the pressure sensor chip 200, and the integrated circuit chip 300 may be electrically connected to each other by using the conductive leads 800. For example, the pressure sensor chip 200 and the integrated circuit chip 300 may be electrically connected to the substrate 100 through a wire bonding process using the conductive leads 800, The integrated circuit chips 300 may also be electrically connected to each other through the wire bonding process using the conductive leads 800. [

In addition, the pressure sensor device may further include a regulator (not shown) mounted on the substrate 100 and capable of maintaining a constant voltage. The regulator can be understood as, for example, an LDO regulator (Low Dropout Regulator). Here, the regulator may be used or unused depending on the combination of the sensor and the integrated circuit. The regulator is a well known technique and its detailed description is omitted.

Referring to FIGS. 2F and 2G, the barrier rib 700a may be bonded to at least a part of the upper surface of the substrate 100. FIG. The partition wall 700a can precisely form the pressure transmission medium 500 in the inner space by contacting the substrate 100 and defining the inner space. A pressure transmitting medium 500 is filled in the internal space to electrically connect at least a part of the substrate 100 to the pressure sensor chip 200, the integrated circuit chip 300, the regulator (not shown) The leads 800 can be sealed.

Here, the pressure transmission medium 500 may be made of, for example, a silicone-based material (Young's modulus value is 0.001 GPa to 0.05 GPa) or an epoxy-based material (Young's modulus value is 2.0 GPa to 2.0 GPa) 20.0 GPa) can be used. Both of these materials are excellent in waterproofing function, and the silicon-based material is superior to the epoxy-based material in the pressure transfer function. This can be determined by the difference in young's modulus of the materials. The Young's modulus value means the longitudinal modulus of elasticity, and the smaller the Young's modulus value, the better the shrinkage, which means that the pressure transfer is good.

The pressure transmitting medium 500 may be formed of a flexible material such that fluid pressure may be applied to a diaphragm (not shown) provided on the pressure sensor chip 200 to generate an electrical signal . The materials may use a gel-like material capable of transferring the pressure of the fluid to the diaphragm and performing a waterproof function. The gel is a state in which the colloid solution is solidified at a predetermined concentration or more like a jelly, and the force transmitted by the pressure applied to the pressure transmission medium 500 formed on the diaphragm can be directly transmitted to the diaphragm . In addition, the pressure transmission medium 500 can be formed by covering the surfaces of the chips 200 and 300 very thinly so that pressure can be applied to the diaphragm. Accordingly, the pressure transmission medium 500 can prevent the pressure sensor chip 200 from being damaged due to electrical defects or excessive water pressure caused by moisture outside the apparatus.

Referring to FIGS. 2h and 2i, a lower housing 700b may be formed below the substrate 100. FIG.

Referring to FIG. 2H, the lower housing 700b may be bonded to at least a part of the lower surface of the substrate 100. FIG. The lower housing 700b may form a passage through which the atmosphere entering the pressure sensor device can reach the lower portion of the pressure sensor chip 200 to measure the standard pressure. The lower housing 700b may be formed of the same material as the partition 700a but may be made of a different material depending on the physicochemical properties of the substrate 100 and the pressure transmission medium 500. [

2I, finally, an upper housing 700c having an air inlet 210 through which air can be introduced and a fluid inlet 220 through which fluid can flow can be joined on the partition 700a The pressure sensor device 1000 can be manufactured.

Meanwhile, the atmosphere inlet 210 and the fluid inlet 220 may extend in the same direction on the same surface of the upper housing 700c. The atmosphere inlet 210 may be larger than the diameter of the fluid inlet 220 and may be larger in size. On the other hand, the size and formation direction of the air inlet 210 and the fluid inlet 220 are determined by the position of the pressure sensor chip 200 disposed in the device, the position of the through hole provided in the substrate 100, The position of each sensor chip, and the like. An example of this will be described later with reference to Fig.

3 is a cross-sectional view taken along line A-A 'of the pressure sensor device shown in FIG. 2I.

3 is a cross-sectional view of a pressure sensor device 1000 according to an embodiment of the present invention. First, the pressure sensor device 1000 may include a housing 700 formed on the substrate 100. The substrate 100 may be, for example, a printed circuit board (PCB). It can be understood that the resist film of the printed circuit board is generally formed thin on the upper surface 100a and the lower surface 100b of the substrate 100. [

The housing 700 may include a partition 700a, a lower housing 700b, and an upper housing 700c. For example, the partition 700a may be bonded onto at least a part of the substrate 100. [ The lower housing 700b may be bonded to at least a part of the lower surface of the substrate 100. [ In addition, the upper housing 700c may be bonded onto the partition 700a. The upper housing 700c may have an air inlet 210 and a fluid inlet 220 extending in the same direction on the same plane.

The detailed description of the substrate 100, the pressure sensor chip 200, the integrated circuit chip 300, and the pressure transmission medium 500 is the same as that described above with reference to FIGS. 2A to 2I.

The partition 700a, the lower housing 700b and the upper housing 700c may be made of the same material and may be made of different materials depending on the physicochemical properties of the substrate 100 or the pressure transmission medium 500 have. The barrier rib 700a can accurately fill the pressure transmission medium 500 in the region where the pressure sensor chip 200 is disposed by separating at least a part of the substrate 100. [

In addition, a passageway through which the atmosphere can move can be formed by embedding the pressure transmission medium 500 in the internal space defined by the partition 700a and forming the lower housing 700b below the substrate 100. [ The atmospheric air passes through the second through-hole 104 and the first through-hole 102 provided in the substrate 100 sequentially through the atmospheric pressure inlet 200 and the pressure sensor chip 200, Can be used to measure the relative pressure of the fluid.

The pressure sensor device 1000 can be formed by assembling the upper housing 700c on the partition 700a. Although the air inlet 210 and the fluid inlet 220 of the upper housing 700c are formed in the same direction as the exemplary embodiment, the air inlet 210 and the fluid inlet 220 may be formed in different directions depending on the position and size of the partition.

Although not shown in the drawing, for example, when the height of the partition formed between the area where the pressure sensor chip 200 is disposed and the passage through which the air is introduced is high, the direction of the air- Lt; / RTI > If the substrate 100 does not have the second through hole 104 that can pass through the atmosphere, the air inlet 210 may be formed on either side of the lower housing 700b.

 As described above, since the pressure sensor device 1000 can be formed in such a manner that the partition 700a, the lower housing 700b, and the upper housing 700c are bonded onto the substrate, the printed circuit board The pressure sensor device 1000 can be easily formed without a separate molding process.

4 is a schematic view illustrating the configuration of a pressure sensor device according to another embodiment of the present invention.

Referring to FIG. 4, a pressure sensor device 1100 according to another embodiment of the present invention may use a lead frame as the substrate 100. Although not shown in the drawings, when the lead frame is used as the substrate 100, a separate molding part capable of electrically connecting each lead frame may be further included.

When the lead frame is used as the substrate 100, the partition 700a and the lower housing 700b shown in FIG. 3 may be integrally formed. At this time, the lower housing 700b may be omitted. The partition 700a functions to protect the pressure sensor chip 200 by performing the function of the lower housing 700b and forms a communicated fluid flow path so that the atmosphere can move. The upper housing 700c may be assembled on the barrier 700a to form the pressure sensor device 1100. [ Here, the step of molding each of the lead frames used as the substrate 100 is further included.

INDUSTRIAL APPLICABILITY As described above, the present invention can prevent a device defect due to fluid or moisture from occurring in a pressure sensor chip, an integrated circuit chip and the like by introducing a pressure transmission medium. In addition, since the mounting form of the pressure sensor device is a shape in which the fluid inlet is downward, the lower waterproofing of the pressure sensor device may be relatively weak. Therefore, it is possible to prevent defects due to moisture by covering the housing with a waterproof function and protecting the outside.

In addition, when the characteristics of the pressure transmission medium are hardened, the characteristic of the sensor changes, and the operation of the pressure sensor can be smoothly performed by introducing the partition wall structure for fixing the pressure transmitting medium in the form of a waterproof gel having a low viscosity. In addition, each housing has a detachable structure, and the fluid inlet and the air inlet are located at the top of the substrate, so that the productivity is improved by automatic assembly and the like, and the structure is simple, and the sensor chip and the integrated circuit It is possible to realize a pressure sensor device which can be easily mounted.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: substrate
102: first through hole
104: second through hole
200: Pressure sensor chip
202: Silicon patterning
210: Air intake
220: Fluid inlet
300: integrated circuit chip
500: protective member
700: Housing
700a: partition wall
700b: Lower housing
700c: upper housing
800: conductive lead
1000: Pressure sensor device

Claims (16)

A housing having an atmospheric fluid inlet and a fluid fluid inlet;
A substrate disposed in the inner space of the housing, the substrate having a first through hole and a second through hole to allow air to pass therethrough; And
And a pressure sensor chip mounted on the substrate so as to cover the first through hole, wherein a lower portion of the pressure sensor chip is exposed to the atmosphere through the first through hole to measure a relative pressure of the fluid with respect to the atmospheric pressure,
The air introduced through the air inlet passes sequentially through the first through-hole and the inner space separated by the housing through the second through-hole, thereby to prevent the pressure sensor chip exposed by the first through- And having a communicated structure so that the atmosphere can reach,
Pressure sensor device. The method according to claim 1,
Wherein the housing is divided into an upper housing and a lower housing with respect to the substrate, the upper housing further including a partition wall contacting the substrate and defining an inner space,
Pressure sensor device. 3. The method of claim 2,
Further comprising a pressure delivery medium disposed in the inner space to protect the pressure sensor chip and to transmit pressure of the fluid to measure pressure in the pressure sensor chip,
Pressure sensor device. The method of claim 3,
Wherein the partition wall separates the space into which the atmospheric air flowing from the atmospheric pressure inlet can move and the space through which the pressure transmission medium can be formed,
Pressure sensor device. 3. The method of claim 2,
Wherein the upper housing is bonded to the upper surface of the substrate and the lower housing is bonded to a lower surface of the substrate,
Pressure sensor device. 3. The method of claim 2,
Wherein the lower housing is in contact with the substrate and is in communication with the atmospheric air inlet.
Pressure sensor device. The method according to claim 1,
Wherein the atmospheric fluid inlet and the fluid fluid inlet extend in the same direction on the same side of the housing,
Pressure sensor device. The method of claim 3,
Wherein the pressure transmitting medium has a waterproof function so that the fluid does not directly touch the pressure sensor chip,
Pressure sensor device. The method of claim 3,
Wherein the pressure transmission medium comprises a gel that can be deformed in response to a pressure of the fluid.
Pressure sensor device. The method of claim 3,
Wherein the pressure transmitting medium comprises silicone or epoxy which can be deformed according to a pressure of the fluid.
Pressure sensor device. The method according to claim 1,
And an integrated circuit (IC) chip mounted on the substrate for converting the analog signal output generated by the pressure sensor chip into a digital signal output.
Pressure sensor device. The method of claim 3,
Wherein the substrate and the pressure sensor chip are electrically connected to each other by using a conductive lead, the pressure sensor chip and the conductive lead are sealed using the pressure transmission medium,
Pressure sensor device. The method according to claim 1,
Further comprising a regulator mounted on the substrate and capable of maintaining a constant voltage,
Pressure sensor device. A substrate having a first through hole and a second through hole to allow air to pass therethrough;
Wherein the pressure sensor chip is mounted on the substrate so as to cover the first through hole and the lower portion is exposed to the atmosphere through the first through hole to measure a relative pressure of the fluid with respect to the atmospheric pressure.
A partition wall defining an inner space by being joined to an upper surface of the substrate so as to protect the pressure sensor chip;
An upper housing having an air inlet and a fluid inlet, which are bonded to the partition wall to protect at least a part of the pressure sensor chip; And
And a lower housing coupled to the lower surface of the substrate to protect the pressure sensor chip so that the atmosphere introduced through the atmospheric air inlet may sequentially pass through the second through hole and the first through hole, ;
/ RTI >
Pressure sensor device. 15. The method of claim 14,
And a pressure delivery medium that seals the pressure sensor chip and is capable of transferring the pressure of the fluid so as to measure pressure in the pressure sensor chip.
Pressure sensor device. Preparing a substrate having at least two through holes so that the atmosphere can pass through;
Forming a pressure sensor chip on the substrate so as to cover the through hole and measuring the relative pressure of the fluid with respect to the atmospheric pressure so that the lower part is exposed to the atmosphere through the through hole;
Forming an integrated circuit (IC) chip on the substrate;
Forming a partition wall defining an internal space in contact with the substrate to protect the pressure sensor chip and the integrated circuit chip;
Forming a pressure transmission medium capable of sealing at least a part of the pressure sensor chip and the integrated circuit chip in the internal space;
Forming a lower housing to protect the pressure sensor chip exposed by the through hole at a lower portion of the substrate; And
Forming an upper housing on the partition wall having an atmospheric inlet and a fluid inlet;
/ RTI >
A method of manufacturing a pressure sensor device.

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