KR20160146060A - Manufacturing method for carrier by molding and carrier thereby - Google Patents

Manufacturing method for carrier by molding and carrier thereby Download PDF

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Publication number
KR20160146060A
KR20160146060A KR1020150082645A KR20150082645A KR20160146060A KR 20160146060 A KR20160146060 A KR 20160146060A KR 1020150082645 A KR1020150082645 A KR 1020150082645A KR 20150082645 A KR20150082645 A KR 20150082645A KR 20160146060 A KR20160146060 A KR 20160146060A
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KR
South Korea
Prior art keywords
carrier
opening
plate
stage
carrier plate
Prior art date
Application number
KR1020150082645A
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Korean (ko)
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이열
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이열
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Publication date
Application filed by 이열 filed Critical 이열
Priority to KR1020150082645A priority Critical patent/KR20160146060A/en
Publication of KR20160146060A publication Critical patent/KR20160146060A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

SUMMARY OF THE INVENTION It is an object of the present invention to provide a carrier having a high productivity and price competitiveness by making a manufacturing method of a carrier unlike the conventional method.
According to the above object, the present invention provides a method of manufacturing a carrier having a step,
A carrier plate having a first end formed to have a stepped portion to be formed in the opening pattern and having an opening pattern formed in the carrier and forming a plane,
A step of forming an opening pattern having the same opening pattern as that of the carrier at the first end and having an opening pattern advanced in the opening by a step portion to be formed in the opening pattern, in order to form a step formed in the opening pattern of the carrier, The carrier plate is manufactured using a mold,
And the carrier plate of the first stage and the carrier plate of the second stage are attached to each other to manufacture a carrier having a stepped portion.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of manufacturing a carrier using a metal mold,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a carrier for an electronic component and a carrier, and more particularly, to a method of manufacturing a carrier using a mold.

A carrier for an electronic component is an article that is necessary for carrying out various processes such as inspection, measurement, cleaning and the like by mounting an electronic component or a module type assembled through a certain assembling process. Regarding semiconductor parts, trays are used for almost the same purpose in addition to carriers. Such a carrier has a specific shape for mounting a specific part or module. The body is generally made of a rigid body having no warpage, and an opening is formed at a place where the article is to be mounted thereon, and a step is provided at a predetermined end of the opening so that the article is seated without falling off the opening portion. Therefore, most carriers for electronic parts are manufactured using metal, that is, Al, stainless steel, or the like. The tolerance of flatness must be 0.1 mm, because it must be maintained during transport and various processes. For example, in the case of a carrier that carries a camera module applied to a mobile device to carry out cleaning, measurement, and inspection processes, an opening having a specific shape is provided at a place where the camera module is mounted to allow the cleaning liquid to be discharged during a cleaning process, So that the camera module is seated. Further, such a carrier is composed of an upper plate and a lower plate, is carried through a lower plate, and is subjected to a process, and an additional process is performed on a camera module sandwiched between the upper plate and the upper plate. The lower plate carrier includes two stages at its height, because the plane formed by the body itself and the height of the plane formed by the step formed at the opening are different. Unlike the lower plate, the upper plate carrier is further formed with a concave portion on which the magnet is seated, and includes a height of three stages as a whole.

Such a carrier is of various thicknesses, for example, of the order of 0.7 mm to 3 mm, and forms a complex pattern of openings by laser cutting or wire cutting a metal disc. Next, one end of the opening and the other end facing the opening are milled to form a step. The permissible tolerance for such machining is 5 / 1,000 mm and very precise machining should be done. Therefore, it is necessary to have very expensive equipments, and the productivity is very low because of the long time required for wire cut discharge machining and milling. In order to improve the productivity, even if a plurality of discs are stacked and subjected to wire-cut electric discharge machining, one to two carriers are produced per hour, which is still very low productivity. In addition, the carrier manufactured in this manner has a poor machining precision of the superimposed disk, and since expensive equipment is used, the equipment cost is so high that the price of each product is set at a very high price, which is not reasonable in terms of price competitiveness.

Disadvantages of the conventional processing method appear in terms of quality. That is, the burr and R are formed in the wire-cut electric discharge machining and the milling work, so that there is a limit in the shape accuracy, and the warping of the plate occurs while continuing the wire cut electric discharge machining and the milling for a long time. The flatness is deteriorated.

Therefore, it is an object of the present invention to provide a carrier having a high productivity and price competitiveness by making a manufacturing method of a carrier different from conventional ones.

According to the above object, the present invention provides a method of manufacturing a carrier having a step,

A carrier plate having a first end formed to have a stepped portion to be formed in the opening pattern and having an opening pattern formed in the carrier and forming a plane,

A step of forming an opening pattern having the same opening pattern as that of the carrier at the first end and having an opening pattern advanced in the opening by a step portion to be formed in the opening pattern, in order to form a step formed in the opening pattern of the carrier, The carrier plate is manufactured using a mold,

And the carrier plate of the first stage and the carrier plate of the second stage are attached to each other to manufacture a carrier having a stepped portion.

As a method for attaching the carrier plate of the first stage and the carrier plate of the second stage in the above, there is a method of applying the thermosetting resin, followed by laminating, bonding the thermosetting adhesive sheet, can do.

In the case where three steps are to be formed in the carrier, the third step is formed so as to have the same opening pattern as that of the carrier of the second stage, and to have the opening pattern advanced in the opening by the step portion to be formed in the opening pattern The carrier plate of the first stage, the carrier plate of the second stage, and the carrier plate of the third stage are attached to each other to manufacture a carrier having a stepped portion. do.

When the depressed portion formed in the carrier has a concave portion with a predetermined pattern and the depressed portion is stepped, an opening portion of the pattern forming the concave portion is formed in the upper carrier plate, and a portion corresponding to the concave portion is formed in the plane The carrier plate at the upper end and the carrier plate at the lower end are adhered to each other to form a concave portion having a step in the carrier.

In addition, in the above, when the thermosetting adhesive sheet is sandwiched and the carrier plates are adhered, the sheet has an opening shape retreated with respect to the opening pattern formed on the carrier ultimately manufactured so that the post- Wherein the carrier is made to be free from any crack.

According to the present invention, the productivity is improved by about 50 times as compared with the conventional carrier manufacturing method, and a cost of 30% or more is saved when manufacturing 2000 or more carriers.

In addition, according to the present invention, carrier bending phenomenon does not occur during the carrier manufacturing process, so that the carrier flatness is good, the bending strength is rather improved, and the height of the stepped portion is the same for every opening portion.

Burrs and Rs generated in the production of the carrier plate by the mold of the present invention are formed at positions opposite to those generated by the conventional milling method, and R formed on the upper surface provides a curved surface to facilitate mounting of the articles, The burr formed at the lower end can play a role of holding the sheet when using the combined sheet, thereby obtaining a subsidiary advantage.

1 is a perspective view showing each carrier plate made of a metal mold for manufacturing a carrier having three stepped portions according to an embodiment of the present invention.
Fig. 2 is a perspective view showing a carrier manufactured by laminating the respective carrier plates shown in Fig. 1;
3 is a partial enlarged view of Fig.
FIG. 4 is a cross-sectional view for explaining the problems of burrs and Rs generated according to the prior art, and the gains of R and burrs according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The present invention provides a method for manufacturing a carrier having stepped portions by press-forming carrier plates as many as the number of steps, with a die, and joining them, for producing a carrier having a stepped portion. That is, a mold is formed and press-molded so as to have an opening pattern on the carrier plate of the first end, and the opening area is narrower than that of the opening pattern and the opening shape is further advanced The carrier plate of the second stage is press-formed by a die, and these are joined together to produce a carrier having a step at the opening. In some cases, in the carrier plate of the second stage, the opening is eliminated and the flat surface is maintained to obtain the carrier having the concave portion having the post-lamination step.

FIG. 1 shows each carrier plate made of a metal mold for manufacturing a carrier having three steps in accordance with the present invention. That is, the shapes of the first-stage carrier plate 100, the second-stage carrier plate 200, and the third-stage carrier plate 300 are shown. The original carrier 500 incorporating the three carrier plates is shown in Fig. The original carrier 500 has an opening pattern on which the article is mounted and a circular recess 350 on which the magnet is mounted and the circular recess 350 has a plane height And the article seating portion 250 formed at the end of the opening pattern is also lower in planar height than the main body of the carrier 500 to form another stepped portion. These stepped portions are provided for stable mounting of the article and have a function of preventing the magnet 500 and the article from being removed from the place where the magnet 500 and the article are carried.

In this embodiment, the plane formed by the first-stage carrier plate 100 is set as a reference end (first end), and the two-stage in which the article seating portion 250 forms a plane lower in height than the reference end, 350 form the three-tiered carrier 500 having the lowest height by coalescing the three carrier plates.

The final carrier 500 is provided with an opening 140 having a predetermined pattern for discharging the cleaning liquid in the cleaning process or the like, and a step is provided at the end or corner of the opening 140. Therefore, in both the carrier plate 100 of the first stage, the carrier plate 200 of the second stage, and the carrier plate 300 of the third stage, substantially the same as the opening 140 formed in the carrier plate 100 of the first stage Thereby forming an opening of the pattern. However, the shape of the opening 140 formed in the carrier plate 100 of the first stage and the shape of the opening 240 formed in the carrier plate 200 of the second stage have an aberration due to the stepped portion. That is, the boundary part 130 forming the boundary with respect to the part on which the article is mounted in the pattern of the opening part 140 is slightly protruded or advanced relative to the pattern of the opening part 140, The area of the opening 240 formed in the boundary portion 140 is larger than that of the boundary portion 140. That is, when the carrier plate 100 of the first stage and the carrier plate 200 of the second stage are joined to each other, the upper plate opening 140 and the lower plate opening 240 are overlapped to form an opening, A lower stepped portion indicating a step is formed to form the article seating portion 250. In the present embodiment, the article placing portion 250 is formed at the center of the opening portion at a quadrangular shape to support the article in a stable manner.

In the case of the circular concave portion 350, the bottom surface of the third-stage carrier plate 300 is formed so that the plane with the lowest height is the bottom surface. Therefore, the circular openings 150 and 220 are formed at the same positions in the carrier plate 100 of the first stage and the carrier plate 200 of the second stage. There is no opening at the corresponding position of the carrier plate 300 of the third stage and is composed of the plane itself of the carrier plate 300 of the third stage. The carrier plate 300 of the third stage has an opening for receiving the article and has an opening having the same shape as the opening 240 of the carrier plate 200 of the second stage. And has the same advancing portion 330. The other openings 120 formed in the other carrier 500 are formed in the same size and the same size in all three carrier plates.

The lamination of the three carrier plates is carried out by sandwiching and thermally curing the thermosetting adhesive sheets 400 between the respective carrier plates. At this time, the shape of the thermosetting adhesive sheet is made such that the area of the opening is larger and the overall shape is smaller than the shape of the first-stage carrier plate 100 having the largest size or area of the opening. That is, the thermosetting adhesive sheet 400 has an opening pattern that is more inwardly retracted with respect to the carrier plate, so that the post-adhesion sheet is not exposed at all.

The joints of the three carrier plates may be formed by applying a thermosetting resin between the respective carrier plates and thermally cementing them, or may be bonded by welding. It is also possible to attach them together with a fixing member such as a bolt / nut. In this case, a fixture is formed on each carrier plate.

Although the above embodiment has been described with reference to the manufacture of a top plate carrier for a camera module, in the case of a bottom plate carrier, only an article seating portion is formed without a concave portion so that it has two steps. Therefore, the carrier plate is fabricated in two sheets, and the manufacturing principle is the same as described above. The laminating method is also as described above. That is, the opening pattern has a wider opening area in the first-stage carrier plate and a narrower opening area in the second-stage carrier plate. The opening pattern of the carrier plate of the second stage with respect to the opening pattern of the carrier plate of the first stage has a further advanced portion and the portion advanced by the coalescence of the carrier plate of the carrier plate of the first- So that a stepped portion is formed.

Figure 2 shows a completed carrier 500, which is the appearance of a carrier top plate for a camera module. Fig. 3 is a partial enlarged view of Fig. 2, which shows a carrier plate 100 of a first stage forming a plane of a reference end, a two-stage article seating portion 250 of a plane lower in height than a reference end, The three-step concave portion 350 clearly shows the step difference. In addition, in FIG. 3, the thermosetting adhesive sheet 400 is not shown at all, showing that the shape of the thermosetting adhesive sheet 400 is formed to be smaller than all the shapes of the carrier plates and is not completely buried between the carrier plates.

Meanwhile, according to the present invention, it is possible to obtain an incidental gain by the burr and R. This will be described with reference to FIG.

FIG. 4 is a cross-sectional view showing a point where burrs and Rs are generated when a carrier is manufactured according to a conventional technique. When the opening and the step are formed by the conventional wire-cut electric discharge machining and the milling, burrs are formed at the upper end of the machined portion and curvature R is formed at the inner surface of the lower end. These burrs may interfere with the loading of the article, which may result in damage to the article or a problem of the article jumping out during the automated article loading process. In addition, R represents a result including an error in a process (inspection or measurement process, etc.) in which a step on which an article is placed does not form a vertical plane but forms a curved surface and an error occurs in the position of the article.

On the other hand, the carrier manufactured according to the present invention generates R at the upper end and burrs at the lower end. This is the result of press molding through the mold. The curvature of R formed at the upper end of the article receiving portion of the carrier naturally induces the article to the receiving portion. There is no fear that the article will come out or be damaged in the article mounting process by the automated process. In addition, burrs are formed at the lower end of the article placing portion, burrs are draped downward, and the effect of the blocking wall against the thermosetting adhesive sheet sandwiched between the carrier plates can be obtained. Therefore, the carrier manufacturing method of the present invention obtains a subsidiary gain by burrs and Rs.

On the other hand, in order to vary the thickness of the entire carrier, it is possible to perform forming (embossing) processing on the entire carrier plate. That is, if a thickness of 0.23 mm is required for a 0.2 mm thick carrier plate, the desired thickness can be met by forming.

Compared with the prior art in which the opening pattern is formed by wire-cut electric discharge machining and the required step is formed in the end portion of the opening by the milling process, by press-molding and laminating as many carrier plates as the number of steps using the metal mold, The productivity can be improved.

Although the above embodiments have been described by taking a carrier having a specific shape as an example, the present invention can be applied to the production of a carrier having steps in different shapes.

In addition, the method of manufacturing the carrier is a so-called electronic component carrying member, which is substantially the same member as the carrier, but is equally applicable to the manufacture of a product called a tray in the art.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

100: carrier plate of the first stage
120: opening
130:
140: opening
150: opening
200: carrier plate of the second stage
220: opening
240: opening
250:
300: Third stage carrier plate
330:
350:
500: Carrier

Claims (11)

A method of manufacturing a carrier including steps different in height with respect to an upper surface of a carrier,
A first-stage carrier plate having a stepped portion formed as an opening;
And a second-stage carrier plate having a stepped portion formed on the same plane as the carrier plate with respect to the first-stage carrier plate;
And joining the carrier plate of the first end and the carrier plate of the second end,
When the stepped portion formed in the carrier finally manufactured through the laminating step is a concave portion, an opening portion of a predetermined pattern is formed on the carrier plate of the first end, and a pattern is formed on the carrier plate of the second- Without leaving the plane itself,
When the stepped portion formed in the carrier finally manufactured through the lapping step is the end of the opening, an opening portion of a predetermined pattern is formed in the carrier plate of the first end, and the opening of the pattern advanced in the opening portion is formed in the carrier plate of the second end. Of the carrier. 2. The method according to claim 1, wherein when the stepped portion is at least two stages and n (n is a natural number equal to or greater than 3), the carrier plate of the first stage is laminated to the lower end of the carrier plate of the n- Forming the carrier plate of the n < th > stage by press-molding each of the mold plates,
The carrier plate at the n-
When the stepped portion formed in the carrier finally manufactured through the laminating step is a concave portion, an opening portion of a predetermined pattern is formed up to the carrier plate of the (n-1) th stage, and the carrier plate of the n- With the plane itself without the pattern,
When the stepped portion formed in the carrier finally manufactured through the lapping step is the end of the opening, an opening portion of a predetermined pattern is formed in the carrier plate up to the n-1th stage, and the carrier plate at the n- Thereby forming an opening of the pattern. 3. The method according to claim 1 or 2,
Wherein the heat-curable adhesive sheet is formed by any one of the following methods: sandwich heat-seal adhesion of a heat-curable adhesive sheet, heat bonding after application of a thermosetting resin, application of a fixing member, or welding. The method according to claim 3, wherein, when the thermosetting adhesive sheet is sandwiched and the carrier plates are bonded together, the sheet has an opening shape retreated with respect to the opening pattern formed on the carrier ultimately manufactured so that the post- Thereby avoiding the risk of damage to the carrier. A carrier as claimed in claim 1 or 2. A carrier as claimed in claim 4. A method of manufacturing a traction comprising steps different in elevation with respect to an upper surface of a tray,
A first stage tray plate having a stepped portion formed as an opening;
And a second stage tray plate having a stepped portion formed on the same plane as the tray plate with respect to the first stage tray plate;
And joining the tray plate of the first stage and the tray plate of the second stage,
When the stepped portion formed in the finally fabricated through the laminating step is a concave portion, an opening portion of a predetermined pattern is formed on the tray plate of the first end, and a pattern is formed on the tray plate of the second- Without leaving the plane itself,
When the stepped portion formed in the finally fabricated through the lapping step is the end of the opening portion, an opening portion of a predetermined pattern is formed on the tray plate of the first end, and an opening portion of the pattern advanced in the opening portion is formed on the tray plate of the second- ≪ / RTI > The method according to claim 7, wherein when the stepped portion is formed by two or more steps and is n (n is a natural number equal to or greater than 3), the trailing plate of the first stage to the trailing plate of the n- And a step of producing a mold by press molding the tray plates of the n-th stage, respectively,
The tray plate of the n-
When the stepped portion formed in the finally fabricated through the laminating step is a concave portion, an opening portion of a predetermined pattern is formed up to the tray plate of the (n-1) th stage, and the tray plate of the n- With the plane itself without the pattern,
When the stepped portion formed in the finally fabricated through the lapping step is the end of the opening portion, an opening portion of a predetermined pattern is formed on the tray plate up to the n-1th stage, and the tray plate of the n- Thereby forming an opening of the pattern. 9. The method according to claim 7 or 8,
Wherein the heat-curable adhesive sheet is formed by any one of the following methods: sandwich heat-seal adhesion of a heat-curable adhesive sheet, heat bonding after application of a thermosetting resin, fixing member application, or welding. The method as claimed in claim 9, wherein when the thermosetting adhesive sheet is sandwiched and the tray plates are bonded together, the sheet has an opening shape retreated with respect to the opening pattern formed by the coalescing and ultimately manufactured trays, So that there is no fear in the manufacturing process. 3. The method of claim 2, wherein each carrier plate is formed.


KR1020150082645A 2015-06-11 2015-06-11 Manufacturing method for carrier by molding and carrier thereby KR20160146060A (en)

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KR1020150082645A KR20160146060A (en) 2015-06-11 2015-06-11 Manufacturing method for carrier by molding and carrier thereby

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Application Number Priority Date Filing Date Title
KR1020150082645A KR20160146060A (en) 2015-06-11 2015-06-11 Manufacturing method for carrier by molding and carrier thereby

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818484A (en) * 2018-01-22 2018-11-16 朱宰哲 Pallet is used in camara module manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818484A (en) * 2018-01-22 2018-11-16 朱宰哲 Pallet is used in camara module manufacture
KR101938384B1 (en) * 2018-01-22 2019-04-11 주재철 Tray for making camera module
CN108818484B (en) * 2018-01-22 2021-04-20 朱宰哲 Tray for manufacturing camera module

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