KR20160137226A

KR20160137226A - Metal PCB formed hole for flip chip therein and method for manufacturing the same

Info

Publication number: KR20160137226A
Application number: KR1020150072061A
Authority: KR
Inventors: 성재복
Original assignee: 성재복
Priority date: 2015-05-22
Filing date: 2015-05-22
Publication date: 2016-11-30

Abstract

The present invention relates to a substrate on which a processing hole for a flip chip is formed and a processing hole processing method. In a substrate 10 on which such a zener diode 13 integrated flip chip 12 is mounted, a pair of processing holes h1 and h2 are formed at adjacent positions of the electrodes 14 and 16 arranged on the upper surface of the substrate 10, A seating groove 18 is formed in which the Zener diode 13 under the flip chip 12 is inserted when the portion between the electrodes 14 and 16 on which the flip chip 12 is mounted is formed by forming the Zener diode 13, The displacement due to the pressurization is absorbed by the pair of processing holes h1 and h2.

Description

Technical Field [0001] The present invention relates to a metal PCB formed with a flip chip for a flip chip,

The present invention relates to a metal PCB for a flip chip and a method of processing the hole, and more particularly, to a technique for easily mounting a flip chip on a PCB by improving the shape and position of a groove formed in the PCB.

In general, when a flip chip is attached to a circuit board, an additional connecting structure such as a metal lead (wire) or an intermediate medium such as a ball grid array (BGA) Semiconductors.

That is, the flip chip is omitted from the package structure, so that wire bonding is not required and the flip chip can be directly attached to the substrate.

However, since the flip chip can omit the package, the manufacturing cost can be reduced. However, since the zener diode is indispensably required, the zener diode must be connected to the flip chip by a separate wiring.

Therefore, in order to solve such a problem, as shown in FIGS. 1 and 2, a form in which a zener diode is integrally formed on a flip chip has been proposed.

That is, the Zener diode 3 is integrally mounted on the lower part of the flip chip 1 and is mounted on the substrate 5.

However, in the case of such a structure, when the flip chip 1 is mounted on the substrate, since the lower zener diode 3 is brought into contact with the substrate 5 as shown in Fig. 1 (a) There is a problem that it is difficult to SMT because of the gap between the substrate 5 and the substrate 5.

Therefore, a method of forming the seating groove 7 by recessing the upper surface of the substrate 5 on which the flip chip 1 is mounted as shown in Fig. 1 (b) has been proposed. The flip chip 1 can be smoothly mounted on the upper surface of the substrate by forming the seating groove 7 on the upper surface of the substrate 5 and inserting the zener diodes 3 into the seating groove 7. [

However, when the seating groove 7 is formed on the upper surface of the substrate 5 as described above, the upper surface of the substrate is pressed by a tool or the like in order to form the seating groove 7 as shown in FIG. 2, The substrate 5 is damaged, and the flatness of the circuit is affected.

Therefore, a method has been proposed in which a separate groove (h) is further processed at the bottom surface position of the substrate (5) corresponding to the seating groove (7) on the upper surface of the substrate (5).

However, in this method, since the grooves are formed on the bottom surface of the substrate, the damage to the substrate and the flatness of the circuit during the punching of the upper seating groove are reduced, while the grooves on the bottom surface must be further processed, .

Further, when the groove on the bottom surface of the substrate is machined, it is necessary to accurately process the groove so as to correspond to the upper seating groove, so that the machining time is long and precision is reduced.

Patent application No. 10-2012-7026385 (name: lead frame, wiring board, light emitting unit, lighting device)

SUMMARY OF THE INVENTION It is therefore an object of the present invention to solve the problems of the present invention by providing a method of manufacturing a flip- And to provide a technique capable of easily machining a chip groove.

In order to accomplish the object of the present invention as described above, an embodiment of the present invention is a substrate 10 on which a flip chip 12 with integrated zener diode 13 is mounted,

A pair of processing holes h1 and h2 are formed at the adjacent positions of the electrodes 14 and 16 disposed on the upper surface of the substrate 10 so that the portion between the electrodes 14 and 16 on which the flip chip 12 is mounted A seating groove 18 into which the zener diodes 13 under the flip chip 12 are inserted is formed so that the displacement due to the pressing is absorbed by the pair of processing holes h1 and h2 .

Further, another embodiment of the present invention includes: a step S100 of forming a pair of processing holes h1 and h2 at positions adjacent to both electrodes 14 and 16 on the substrate 10;

(S110) forming a seating groove (18) by punching the substrate (10) between the electrodes (14, 16) by a press; And

And a step (S120) of inserting a zener diode (13) into the seating groove (18) and mounting the flip chip (12) on the substrate (10).

The substrate having the flip chip forming hole according to the present invention has the following effects.

First, by forming a pair of processing holes at the adjacent positions of the electrode on which the flip chip is mounted, in order to form on the substrate a seating groove into which the zener diode provided at the lower part of the flip chip can be inserted, The displacement caused by the pushing force is moved to and absorbed by the pair of processing holes, so that the seating groove can be formed into an accurate shape and dimensions.

Second, by punching a pair of machining holes with a press machine only in the upper direction of the substrate, it is not necessary to separately process grooves on the bottom surface of the substrate as in the conventional method, thereby reducing the machining cost.

Third, the shapes of the machining holes can be variously selected according to the design by making the shapes of the pair of machining holes equal in the upper and lower diameters, or making the upper diameters longer or shorter than the lower diameters.

1 (a) and 1 (b) are views showing a process of mounting a conventional flip chip on a top surface of a substrate.
FIG. 2 is a view showing a state in which grooves are formed on the upper and lower surfaces in order to mount the conventional flip chip on a substrate.
3 is a perspective view showing a structure in which a flip chip is mounted on a substrate on which a flip chip processing hole according to an embodiment of the present invention is perforated.
4 is a partially enlarged perspective view showing a state in which a machining hole for a flip chip shown in FIG. 3 is perforated on a substrate.
Fig. 5 (a) is a view showing a state where the flip chip forming hole shown in Fig. 4 is perforated, Fig. 5 (b) is a view after the flip chip forming hole shown in Fig. Fig. 5 (c) is a view showing a state in which the flip chip is mounted on the machining hole shown in Fig.
6 is a view showing a side structure of a machining hole for a flip chip shown in Fig.
FIG. 7 is a flowchart showing a procedure of processing a processing hole for a flip chip into a substrate according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 to 4, the processing holes h1 and h2 for the flip chip 12 proposed by the present invention are disposed adjacent to the electrodes 14 and 16 formed on the upper surface of the substrate 10, Is formed at a position where the flip chip 12 is mounted.

The processing holes h1 and h2 for the flip chip 12 are formed as a pair and formed on one side and the other side of the electrodes 14 and 16, respectively.

Therefore, in the case where the interval between the electrodes 14 and 16 is punched by a tool such as a press in order to mount the flip chip 12 on the substrate 10, 10 are pushed by the pressing force of the press to cause displacement, and the portion where the displacement occurs is moved to the pair of processing holes h1 and h2.

Since the pair of the processing holes h1 and h2 absorb the displacement caused by the punching, the portion between the punched electrodes 14 and 16 is formed only in the downward direction, and the other portion Deformation due to punching is not generated.

The flip chip 12 may be mounted on the substrate 10 by inserting a Zener diode 13 provided under the flip chip 12 into the seating groove 18 formed between the electrodes 14 and 16 have.

The pair of machining holes h1 and h2 may be machined into a circular shape, but it is not limited thereto, and may be deformed into a polygonal shape such as a rectangle, a pentagon, or the like.

Although the pair of processing holes h1 and h2 may be formed through the upper and lower portions of the substrate 10, they may be punched only to a predetermined depth of the thickness of the substrate 10 without being completely penetrated. That is, it is sufficient that the displacement of the substrate 10 when pressed by the press can be moved and absorbed into the processing holes h1 and h2.

Further, although the pair of machining holes h1 and h2 are described as being punched on both sides of the electrodes 14 and 16, the present invention is not limited thereto and may be changed in other ways. For example, two machining holes h1 and h2 may be formed on both sides of the electrodes 14 and 16, respectively, or may be further drilled. The number of the machining holes h1 and h2 sufficient to absorb the displacement of the substrate 10 when pressurizing with a press is sufficient.

As shown in Fig. 6, the upper and lower diameters D1 and D2 may be the same in the side surface shape of the machining holes h1 and h2 as in the cylindrical shape, but other shapes are possible .

For example, the lower diameter D2 of the machining holes h1 and h2 may be longer or the upper diameter D1 may be longer than the lower diameter D2. This can be appropriately selected according to the design and specifications of the processing holes h1 and h2.

On the other hand, the machining holes h1 and h2 for the flip chip 12 can be processed in the following order.

7A and 7B, a method of processing a flip chip machining hole according to an embodiment of the present invention includes the steps of: (S100) of forming a pair of processing holes (h1, h2); (S110) forming a seating groove (18) by punching the substrate (10) between the electrodes (14, 16) by a press; And a step (S120) of inserting a zener diode (13) into the seating groove (18) to mount the flip chip (12) on the substrate (10).

In the step of forming the pair of machining holes h1 and h2 in the machining method of the machining holes h1 and h2, a machining hole is formed in the vicinity of the both electrodes 14 and 16 on the substrate 10, (h1, h2) are to be formed. At this time, it is preferable that the positions of the machining holes h1 and h2 are determined in consideration of the displacement amount and direction in which the substrate 10 is pressed and pushed during the press working.

When the positions of the processing holes h1 and h2 are determined, the substrate 10 is pierced by a tool such as a drill or a press machine to form a pair of processing holes h1 and h2.

When the pair of machining hole forming step S100 is completed, the step of forming the seating groove 18 (S110) proceeds. That is, the zener diodes 13 of the flip chip 12 are inserted into the mounting grooves 18, and the mounting grooves 18 are formed with a length and a width enough to insert the zener diodes 13 therein.

The seating groove 18 is formed between the electrodes 14 and 16 and can be formed at a predetermined depth on the substrate 10 by pressing by a press machine.

When the upper surface of the substrate 10 is pressed by the press machine, the upper surface of the substrate 10 on which the seating groove 18 is formed is pushed downward by an external force transmitted to the lower portion, Lateral displacement occurs.

At this time, a pair of machining holes h1 and h2 are formed adjacent to the lateral displacement and the downward displacement, and the displacement moves in the direction of the pair of machining holes h1 and h2 to be absorbed.

Therefore, even when the seating groove 18 is formed by the press machine, the seating groove 18 can be perforated in an accurate shape, and the deformed portion is absorbed by the pair of processing holes h1 and h2.

When the mounting groove forming step S110 is completed, the step S120 of mounting the flip chip 12 on the substrate 10 proceeds. That is, after the seating groove 18 is formed on the substrate 10, the flip chip 12 is mounted by attaching the flip chip 12 on both the electrodes 14 and 16 on the substrate 10.

The Zener diode 13 provided at the lower portion of the flip chip 12 is not interfered with the substrate 10 by being inserted into the seating groove 18 so that the flip chip 12 smoothly moves on the substrate 10 Can be mounted.

Claims

In the substrate 10 on which the zener diode integral type flip chip 12 is mounted,
A pair of processing holes h1 and h2 are formed at the adjacent positions of the electrodes 14 and 16 disposed on the upper surface of the substrate 10 so that the portion between the electrodes 14 and 16 on which the flip chip 12 is mounted A seating groove 18 into which the zener diodes 13 under the flip chip 12 are inserted is formed so that the displacement due to the pressing is absorbed by the pair of processing holes h1 and h2 A substrate (10).

The method according to claim 1,
And the pair of processing holes (h1, h2) are formed on the one side and the other side of the electrodes (14, 16), respectively.

The method according to claim 1,
Wherein the pair of processing holes (h1, h2) have the same upper or lower diameters or different diameters.

(S100) forming a pair of processing holes (h1, h2) at positions adjacent to both electrodes (14, 16) on the substrate (10);
(S110) forming a seating groove (18) by punching the substrate (10) between the electrodes (14, 16) by a press; And
The process holes h1 and h2 for the flip chip 12 including the step of mounting the flip chip 12 on the substrate 10 by inserting the zener diodes 13 into the mounting grooves 18, (10).

5. The method of claim 4,
In the step S110 of forming the pair of processing holes h1 and h2, the pair of processing holes h1 and h2 are formed such that the upper and lower diameters D1 and D2 are equal to each other or different from each other To the substrate.