KR20160111203A - Printed circuit board having means for reducing conductive noise - Google Patents

Abstract

The present invention relates to a printed circuit board having a means for reducing a conductive noise, capable of reducing the conductive noise which flows along a conductor or a connector combined with the outside by a dielectric inserted between first and second conductors installed around a penetration hole formed on a substrate. According to the embodiment of the present invention, as a substrate having a penetration hole, the substrate includes the means for reducing a conductive noise installed around the penetration hole. The means for reducing a conductive noise includes first and second conductors installed around the penetration hole, and a dielectric which is inserted between the first and the second conductors.

Description

[0001] DESCRIPTION [0002] PRINTED CIRCUIT BOARD HAVING MEANS FOR REDUCING CONDUCTIVE NOISE [

The present invention relates to a substrate having a conductive noise reducing means, and more particularly to a substrate having conductive noise reducing means that flows out through a connector or a conductor which is externally connected by a dielectric inserted between first and second conductors provided around a through- The present invention relates to a substrate having conductive noise reduction means capable of reducing conductive noise.

Electro magnetic interference (EMI) problems and test regulatory values are becoming increasingly strong due to the increase in electronic devices in automotive environments. There is a need for countermeasures against electromagnetic noise, commonly referred to EMI, especially for conductive noise flowing through connectors or conductors.

Especially, since electric field controllers are connected with wire bundles of other devices, conductive noise may cause malfunction due to electromagnetic interference in other devices.

Conventionally, when a conductive noise problem occurs, the problem is solved by using electronic elements that meet the frequency characteristics of an inductor, a bead, and a capacitor as a solution. However, due to parasitic components generated at high frequency, it has a self-resonance frequency (SRF), and in particular, it is difficult to satisfy characteristics at high frequencies.

Further, the impedance of the lead wire and the electrode is not suitable for the noise path at the high frequency because it deforms the characteristic of the capacitance at the high frequency.

Korean Published Patent Application No. 2012-0058861 (2012.06.08) "Capacitor embedded printed circuit board using via hole and manufacturing method thereof"

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive noise reduction device capable of reducing a conductive noise flowing on a connector or a conductor which is externally connected by a dielectric inserted between first and second conductors provided around a through- In the substrate.

According to an aspect of the present invention, there is provided a substrate having a through-hole formed thereon, the substrate including conductive noise reduction means provided around the through-hole, wherein the conductive noise reduction means includes: 1 and a second conductor, and a dielectric interposed between the first and second conductors.

The first conductor may be closer to the through hole than the second conductor, and the first conductor may be provided with a metal mask.

The substrate may be a PCB.

According to the embodiment of the present invention, there is an effect that the conductive noise flowing on the connector or conductor externally connected by the dielectric inserted between the first and second conductors provided around the through hole formed in the substrate can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a substrate having a conductive noise reduction means according to an embodiment of the present invention;
Fig. 2 is an enlarged view of "A"

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a view showing a substrate having a conductive noise reducing means according to an embodiment of the present invention, and FIG. 2 is an enlarged view of "A" shown in FIG.

Referring to FIG. 1, the substrate having the conductive noise reducing means according to the embodiment of the present invention includes a conductive noise reducing means provided around the through hole h.

The through hole h is formed on the substrate 1, that is, the printed circuit board (PCB). As shown in FIG. 1, a plurality of substrates may be formed on one side of the substrate. The through holes h may be formed to be spaced apart at equal intervals by the same diameter. Also, through-holes having different diameters may be formed.

The through hole h shown in Fig. 1 is a connector portion of an electronic control unit (ECU) provided inside the vehicle. The connector portion of the electronic control unit is connected to power lines (BATT, IGN, GND), a communication line (CAN) to an external controller, a sensor line for receiving a signal input, and an output line for signal output.

The conductive noise reducing means 10 provided around the through hole h will be described with reference to FIG. 2. The conductive noise reducing means 10 includes first and second conductors 11 and 13 and a dielectric 12 inserted between the first and second conductors 11 and 13. By inserting the dielectric 12 between the first and second conductors 11 and 13, a built-in capacitor can be formed to form a bypass capacitor.

Accordingly, it is not necessary to provide a bypass capacitor, which is conventionally required for removing the conductive noise, in the vicinity of the connector on the printed circuit board, thereby further securing the space of the printed circuit board.

Particularly, the conductive noise reducing means 10 is constituted by a connector 12, a first conductor 11 or a second conductor 13, which are connected by a dielectric 12 inserted between the first and second conductors 11 and 13 It is possible to filter the flowing conductive noise.

The first conductor 11 corresponds to the positive pole, the second conductor 13 corresponds to the negative pole, and the material of the dielectric 12 inserted between the first conductor 11 and the second conductor 13 may be a solid body of a solid state.

The first conductor 11 is adjacent to the through hole h with respect to the second conductor 13 and a metal mask 14 is provided on the first conductor 11.

The first and second conductors 11 and 13 are provided around the through hole h and thus have a larger diameter than the through hole h and the second conductor 13 has a larger diameter than the first conductor 11 .

The conductive noise reducing means 10 according to the embodiment of the present invention has a structure in which the dielectric 12 is connected between the first conductor 11 and the second conductor 13 so that there is no lead, The capacitance value can be maintained, which is effective for noise reduction. In other words, the conductive noise reducing means 10 increases the inductance due to the parasitic component of the lead wire at the time of high frequency, and thus it is possible to solve the problem that the characteristic of the capacitance is modified, which is not suitable for the noise path.

The invention being thus described, it will be obvious that the same way may be varied in many ways. Such modifications are intended to be within the spirit and scope of the invention as defined by the appended claims.

1: substrate 10: conductive noise means
11: first conductor 12: dielectric
13: second conductor 14: metal mask
h: Through hole

Claims (3)

A substrate on which a through hole is formed,
And conductive noise reducing means provided around the through hole,
The conductive noise reducing means
A first and a second conductor provided around the through hole, and a dielectric inserted between the first and second conductors. The method according to claim 1,
Wherein the first conductor is closer to the through hole than the second conductor, and the first conductor is provided with a metal mask. The method according to claim 1,
Wherein the substrate is a PCB.

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