KR20160103030A - A process for die bonding in electronic products - Google Patents

Abstract

A method of die bonding in an electronic product such as a memory card is provided, including a dam-fill method and a printing method. The dam-fill method uses dam material and fill material, and the printing method uses printed steel stencil and paste material.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a die bonding method for electronic products,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding method in an electronic product, and more particularly to a die bonding method in a memory card such as a built-in multimedia card.

Electronics, such as memory cards, are experiencing high turnover rates and exemplifying an embedded multimedia card (briefly "eMMC"), eMMC is one of the main specifications for a straightforward path to elegant, high-quality mobile design in a short- It is extended from the multimedia card for built-in memory. The current trend in eMMC development is that the controller die is moved to the substrate and down the memory die for the purpose of space saving, minimization and multi-functionalization, which means that the mother memory die must be pre-attached to the top of the controller die or other similar part .

The existing solution to this change is to use FOD (film over die) to attach the memory die. There is already a commercial product for this kind of FOD material. However, if the controller die and the memory die, which is one of the trends for the memory device, are larger, there will be a serious warpage problem because both the substrate and the memory die are very thin and can not withstand large stresses. On the other hand, the cost for FOD is so high that it can not be tolerated by many memory device players. Development was attempted. An alternative solution 1 is to use a spacer die to bond the bottom memory die to the substrate, followed by standard stack die bonding, wire bonding and molding. While this solution is cheaper than FOD, the risk of die cracks during wire bonding is high and the yields are quite low. An alternative solution 2 is to use a standard molding method to mold the controller die and / or other similar parts and then to standard stack die bonding, wire bonding and molding. In both of these alternative solutions, the extra film material usually has to be attached to the memory die, which increases the total material cost, and adhesion between the film and the molding compound is usually very limited. Thus, none of these alternative solutions have been shown to be very positive due to die cracking problems, delamination, high warpage or low yields.

Dams and fill materials are known in the adhesive arts and have also been applied for some time in electronics packaging. However, in the prior art, dams and fill materials were used in packaging to protect the components in the complex. It has not been attempted to develop dams and fill materials that can be used for packaging as well as dies, which may additionally be used to directly bond parts in electronics, such as die parts.

Considering the current technical trends for die packaging in electronics, particularly memory cards, one object of the present invention is to provide an easy and inexpensive method of die bonding and to solve problems in existing solutions such as warp, low yield and high cost . Surprisingly, the present inventors have found that the printing method (simple printing method) by using the dam material and the method by using the fill material (briefly DF method) and the printing steel stencil and paste material with the specific opening set It is possible to solve the warping and die cracking problems that often arise while using other alternative solutions. Both methods achieve good adhesion and low stress / strip bending in die bonding, which is an easy and inexpensive method suitable for large controller die and ultra thin memory die. In some cases, additional film or die attach material is not required to attach the memory die.

In one aspect of the invention, a D-F method is provided, and the die bonding D-F method comprises the steps of:

1) the dam material is distributed around the at least one first die on the substrate;

2) the fill material is dispensed into the region defined by the dam material, and optionally the substrate is heated during this time;

3) Optionally, the fill material is partially cured;

4) the second die is bonded onto the fill material; And

5) Steps in which the dam and fill material are fully cured.

In the DF method, the fill material has a very low viscosity and very good flowability that can easily flow and fully coat the substrate, wire, die and other parts within a very short time after dispensing, while the dam material has an inherent Similar to a standard DA (Die Attachment) paste that helps maintain shape, but has a relatively large viscosity and a large TI.

In another aspect of the invention, a printing method is provided, the printing method comprising the steps of:

1) a printed steel stencil with a particular set of apertures is used to cover one or more first die on a substrate;

2) printing the paste material with an opening to cover the at least one first die;

3) optionally, the paste material is partially cured;

4) the second die is bonded onto the paste material; And

5) the step in which the paste material is completely cured.

The printing method is even easier than the D-F method and provides a very high UPH (unit per hour).

The present invention also provides a memory card, such as a built-in multimedia card made from a D-F method or a printing method.

The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure in any way.
Figures 1A and 1B are schematic diagrams showing a conventional arrangement of an eMMC package,
Figure 2 is a schematic diagram showing a modified arrangement of the eMMC package,
Figure 3 is a flow chart showing the steps in the DF method,
4 is a flow chart showing the steps in the printing method.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control. Except as expressly stated, trademarks are shown in capital letters. Unless otherwise stated, all percentages, parts, and percentages are by weight.

Where an amount, concentration, or other value or parameter is given as an enumeration of ranges, preferred ranges, or preferred upper and lower preferred values, it is understood that any range of any upper range limit or desired value and any It should be understood that the lower range limits or all ranges formed by the preferred values are specifically disclosed. Where a numerical range is recited in the specification, unless stated otherwise, the range is intended to include its endpoints, and all integers and fractions within the range. The scope of the present invention is not intended to be limited to the specific values that are mentioned when limiting the scope.

When the term "about" is used to describe a value or an endpoint of a range, the disclosure should be understood to include the particular value or endpoint that is referred to.

As used herein, the terms "comprise," "comprise," "contain," "contain," "having," "having," "includes, Any other variation is intended to cover an inclusion which is not exclusive. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to such elements, but may be any element that is not explicitly listed or inherent to such composition, process, method, Element. Moreover, unless expressly stated to the contrary, "or" does not mean " comprehensive "or" For example, the condition A or B is satisfied by either: A is true (or exists), B is false (or not present), A is false (or nonexistent) Is true (or present), and A and B are both true (or present).

In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are intended to be non-limiting with respect to the number of elements or components (ie, occurrences). Accordingly, "one" and "an" should be understood to include one or at least one, and the singular forms of the elements or components include plural forms unless the number clearly indicates singular.

The materials, methods, and examples in this application are by way of example only and are not intended to be limiting, except as expressly stated. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described herein.

The present invention is described in detail herein below.

D-F method

In the D-F method, the dam material includes a basic resin, an epoxy hardener, a hardener, a filler and other additives, wherein the basic resin is at least one selected from the group consisting of an epoxy resin, a BMI resin and a vinyl resin.

Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers containing epoxide groups such as bisphenol-A epoxy, CTBN modified epoxy, and the like. Epoxy resins can be reacted (crosslinked) with various self-reactants including themselves or with multifunctional amines, acids (and acid anhydrides), phenols, alcohols and thiols through catalytic single polymerization. These co-reactants are often referred to as epoxy hardners.

BMI resin, the abbreviation of bismaleimide resin, is a class of compounds having a maleimide group linked by a nitrogen atom through a linker (the link is, for example, an alkylene group). Poly- (oxytetra-methylene) -di- (2-maleimidoacetate) is a BMI resin of this kind.

Vinyl resins are a class of monomers, prepolymers or polymers containing vinyl groups such as phenoxyethyl acrylate and polybutadiene.

Epoxy harders include various co-reactants that react with epoxy resins, including polyfunctional amines, acids (and acid anhydrides), phenols, alcohols, and thiols, as described for the epoxy resins above.

Like the epoxy hardener, the curing agent is a component that helps harden or cure another substrate. For example, peroxides are generally curing agents for BMI resins as well as for vinyl resins.

The filler is a particulate material added to the matrix material to improve its properties such as viscosity, TI, internal strength and coefficient of thermal expansion. Silica and alumina are typical fillers.

In addition to basic resins, epoxy hardeners, hardeners and fillers, and some other chemicals are added in formulations to improve adhesion, to control T.I., to improve miscibility, and the like. These chemicals are classified as additives, for example, silanes.

No particular limitation is imposed on these components in the dam material, and it may be any ordinary and conventional component selected by a person skilled in the art as long as the dam material has a relatively large viscosity and a large T.I. to help maintain the original shape after dispensing. For example, a basic resin may simultaneously contain an epoxy resin, a BMI resin, and a vinyl resin, an epoxy hardener may cure the epoxy resin, a hardener may cure the BMI and the vinyl resin, and a filler may control the TI And to improve strength and the like. In addition, the additives were included to increase the adhesion, flowability and control T.I. In particular, the dam material comprises 0 to 20%, preferably 4 to 8%, preferably 0 to 30%, preferably 20 to 20%, of BMI resin, based on the total weight of the dam material and such that the sum of the respective components is 100% 0 to 5%, preferably 0.2 to 1.0%, curing agent 0 to 5%, preferably 0.2 to 1.2%, filler 30 to 80%, epoxy resin 0 to 30% Preferably 40-60%, and the other additives 0-5%, preferably 0.5-2.0%.

In the DF method, the viscosity of the dam material at 25 ° C at 5 rpm is in the range of 5,000-500,000 mPa · s, preferably in the range of 40,000-50,000 mPa · s, and the thixotropic index (TI) of the dam material exceeds 1.0 , Preferably 4.0 to 6.0.

Further, in the D-F method, the fill material includes a basic resin, an epoxy hardener, a curing agent, a filler and other additives, wherein the basic resin is at least one selected from the group consisting of an epoxy resin, a BMI resin and a vinyl resin. The definition of these components is the same as that provided for the dam material. For example, the epoxy resin may be selected from bisphenol-A epoxy and bisphenol-F epoxy.

There is no particular limitation to these components in the fill material, and the skilled artisan will appreciate that the fill material can have a very low viscosity and very good flowability that can easily flow and fully coat the substrate, wire, die and other parts within a very short time after dispensing Lt; RTI ID = 0.0 > and / or < / RTI > For example, a basic resin may simultaneously contain an epoxy resin, a BMI resin, and a vinyl resin, an epoxy hardener may cure an epoxy resin, a hardener may cure a BMI resin and a vinyl resin, It is used to adjust and improve strength and so on. In addition, the additive was included to increase adhesion, to prevent spillage and to control T.I. In particular, the fill material comprises 0-30% epoxy resin, preferably 8-16%, BMI resin 0-40%, preferably 25-40% epoxy resin, based on the total weight of the fill material and 100% 0-40%, preferably 6-16%, epoxy hardener 0-5%, preferably 0.2-1.2%, curing agent 0-5%, preferably 0.6-1.0%, filler 0-70% Preferably 45-50%, and the other additives 0-5%, preferably 0.8-1.5%.

Preferably, the viscosity of the fill material at 25 占 폚 is in the range of less than 50,000 mPa 占 퐏, more preferably less than 10,000 mPa 占 퐏, and the TI of the fill material is less than 3.0, more preferably less than 1.5.

In an embodiment of the D-F method, the first die is a controller die and the second die is a memory die. The terms "first die" and "second die" within the meaning of the present invention are used to distinguish the die used in the different steps and should not be construed as being limited to any particular type of "first die & Which may include not only the type of common die used in a memory card but also other components such as passive components such as capacitance, resistance, inductance and other functional dies such as RF-related dies, security dies, sensor dies, Power die, digital signal processor die, logic die, transceiver die, and the like.

In a preferred embodiment of the D-F method in step 2), the substrate is slightly heated to improve the flow and coverage of the fill material.

In a preferred embodiment of the D-F process, the curing is carried out via UV or heating.

In a preferred embodiment of the D-F method, the area defined by the dam material has an area of about 70% -100%, preferably 90% of the area of the second die.

Printing method

In one embodiment of the printing method, the paste material comprises a basic resin, an epoxy hardener, a curing agent, a filler and other additives, wherein the basic resin is at least one selected from the group consisting of an epoxy resin, a BMI resin and a vinyl resin. The definition of these components is the same as that provided for the dam material. For example, the epoxy resin may be selected from bisphenol-A epoxy and bisphenol-F epoxy.

There is no particular limitation on these ingredients in the paste material, and the paste material may be any ordinary and conventional ingredient selected by those skilled in the art having a viscosity in the range of 1,000-500,000 mPa.s at 25 DEG C and a TI in excess of 1.0 . For example, a basic resin may simultaneously contain an epoxy resin, a BMI resin, and a vinyl resin, an epoxy hardener may cure the epoxy resin, a hardener may cure the BMI and the vinyl resin, and a filler may control the TI And to improve strength and the like. In addition, the additive increases the adhesive strength and T.I. And so on. In particular, the paste material comprises 0 to 30%, preferably 5 to 10%, preferably 0 to 30%, preferably 20 to 20%, of BMI resin, based on the total weight of the paste material and such that the sum of the respective components is 100% 0 to 6%, preferably 0.2 to 1.5%, curing agent 0 to 5%, preferably 0.2 to 1.0%, filler 30 to 70%, epoxy resin 0 to 30%, vinyl resin 0 to 30%, preferably 15 to 28% Preferably 30-55% and the other additives 0-5%, preferably 1.0-1.5%.

In the printing process, the viscosity of the paste material at 25 占 폚 is in the range of 1,000-500,000 mPa 占 퐏, preferably in the range of 15,000-50,000 mPa 占 퐏, and the TI of the paste material is more than 1.0, preferably 1.5-3.0.

In an embodiment of the printing method, prior to step 1), the dam material may optionally be distributed around the at least one first die on the substrate. The dam material is the same as the dam material applied in the D-F method, and a discussion of the dam material is omitted here.

In an embodiment of the printing method, the first die is a controller die and the second die is a memory die. The terms "first die" and "second die" within the meaning of the present invention are used to distinguish the die used in the different steps and should not be construed as being limited to any particular type of "first die & Which may include not only the type of common die used in a memory card but also other components such as passive components such as capacitance, resistance, inductance and other functional dies such as RF-related dies, security dies, sensor dies, Signal processor die, logic die, transceiver die, and the like.

In an embodiment of the printing process, the curing is carried out by UV or heating.

Example

The present invention will be described in further detail with reference to the following examples and drawings.

Ⅰ. Test Methods

Viscosity

Viscosities for dam, fill and paste materials were measured with a Brookfield model HBDV-III (CP-51) supplied by Brookfield at 25 rpm at 5 rpm.

T.I. . ( Thixotropy  Indices)

T.I. for dam material, fill material and paste material. Was calculated on the basis of the following formula.

TI = (viscosity at 0.5 rpm) / (viscosity at 5.0 rpm)

Viscosities at 0.5 rpm and 5.0 rpm were measured at 25 占 폚 with Brookfield model HBDV-III (CP-51) supplied by Brookfield Corporation.

DSC  (Differential scanning calorimeter) measurement

The cure reaction profile of the dam, fill and paste materials was measured using a Perkin-Elmer differential scanning calorimeter (DSC-7) supplied by Perkin-Elmer Inc., As a function of temperature. The temperature range was 25 占 폚 to 300 占 폚 at a temperature rising rate of 10 占 폚 / min.

die  Shear strength

Definition: The value of the tangential force required to break the bond between the die and the substrate in a uniform direction

The die shear tester was 4000, supplied by Dage.

BLT  (bond Line thickness )

Definition: The thickness of the adhesive layer measured with a Nikon microscope MM-40 (supplied by Nikon Corporation).

Strip bending ( ㎛  Recorded)

The strip warpage was measured by placing the object on a horizontal plane and measuring the difference between the maximum and minimum points of deflection with a Vantage-2 cyber scan laser profile (supplied by Cyber Technologies).

Ⅱ. material

SR 495B: The isodecyl, as supplied by Sartomer,

Acrylate monomer

SR 610: The poly (ethylene glycol) < RTI ID = 0.0 >

Diacrylate

RAS-1: The functionalized epoxies supplied by Henkel

City Resin

EPON resin 58005 supplied by Hexion,

CTBN modified epoxy resin

Art resin UN 9200: Negami Chemical Co., Ltd.

The polyurethane modified acrylate

SRM-1: BMI resin supplied by Henkel

Ricon 131 MA10: The maleic anhydride < RTI ID = 0.0 > butadiene <

Ene copolymer

Catalyst 313 B: N, N ' - (4-methyl-

1,3-phenylene) di (pyrrolidine-1-carboxamide),

Epoxy hardener

Dicumyl peroxide: At Akzo Nobel

The peroxides

Z 6040: Dow Corning, supplied by Dow Corning,

3 (- glycidoxypropyl) trimethoxysilane

Z 6030: Supplied by Dow Corning,

Trimethoxysilylpropyl methacrylate

BYK-333: Supplied by BYK Chemie,

The silicon-based polymer

Fomblin T4 By Solvay Solexis

The supplied 2-oxirane methanol,

Of the reduced polymerized and oxidized tetrafluoroethylene

Polymer with reduced Me ester

Dow Corning Anti-Foam 1400: a silicone compound supplied by Dow Corning

AO-802: Supplied by Admatechs,

Alumina

XG-1270: The silica, supplied by Gelest,

SE6100 Admatech Company Limited

(Supplied by Admatechs company limited)

Spherical silica having an average particle size of 1.8 탆

SE1050 Supplied by Admatech Company Limited,

Spherical silica having an average particle size of 0.8 탆

Example 1

Preparation of fill material 1

, 8.60 g of SR 495 B (vinyl resin), 8.33 g of RAS-1 (epoxy resin), 25.60 g of SRM-1 (BMI resin), 5.12 g of Ricon 131 MA10 (vinyl resin), 0.48 g of Z6040 (additive) 0.36 g of BYK-333 (additive), 0.24 g of catalyst 313B (epoxy hardener), 0.71 g of dicumyl peroxide (curing agent) and 50.00 g of AO-802 (filler) were mixed together to prepare a fill material. The viscosity of the fill material at 5 rpm was measured at 3992 mPa · s and the viscosity at 0.5 rpm was measured at 4643 mPa · s, so that TI of fill material 1 was 1.163. Data relating to DSC peaks for fill material 1 are reported in Table 1.

Example 2

Preparation of fill material 2

Peel Material 2 was prepared in the same manner as Peel Material 1, except that the amount of each component in Peel Material 2 was changed according to the data shown in Table 1.

Example 3

Production of fill material 3

Peel Material 3 was prepared in the same manner as Peel Material 1, except that the amount of each component in Peel Material 3 was changed according to the data shown in Table 1.

<Table 1>

The composition of the fill material in Examples 1-3

Example 4

Manufacture of dam material 4

, 6.64 g of Epon resin 58005 (epoxy resin), 1.53 g of Art resin UN 9200 (vinyl resin), 23.45 g of SRM-1 (BMI resin), 9.27 g of Ricon 131 MA10 (vinyl resin) 0.34 g of Z6040 (additive), 0.33 g of Z6030 (additive), 0.33 g of Z6040 (additive) and 0.33 g of XG-1270 (filler) were added to a solution of 0.24 g of catalyst 313B (epoxy hardener), 0.22 g of dicumyl peroxide (curing agent), 0.33 g of Dow Corning anti- And 50.70 g were mixed together to prepare a dam material 4. The viscosity of the dam material at 5 rpm was measured at 44370 mPa · s and its viscosity at 0.5 rpm was measured at 164400 mPa · s, so that the TI of the dam material 4 was 3.705. Data relating to the DSC peak for dam material 4 are reported in Table 2.

Example 5

Manufacture of dam material 5

The dam material 5 was prepared in the same manner as the dam material 4, except that the amount of each component in the dam material 5 was changed in accordance with the data shown in Table 2.

Example 6

Manufacture of dam material 6

The dam material 6 was prepared in the same manner as the dam material 4, except that the amount of each component in the dam material 6 was changed in accordance with the data shown in Table 2.

<Table 2>

The composition of the dam material in Examples 4-6

Example 7

Production of paste material 7

1.96 g of AR 495B (vinyl resin), 6.12 g of Epon resin 58005 (epoxy resin), 1.95 g of Art resin UN 9200 (vinyl resin), 23.48 g of SRM-1 (BMI resin), 10.92 g of Ricon 131 MA10 0.27 g of Pombulin T4 (additive), 0.44 g of Z6040 (additive), 0.33 g of Z6030 (additive), 0.24 g of catalyst 313B (epoxy hardener), 0.44 g of dicumyl peroxide (curing agent) and 43.80 g And 6.55 g of AO-802 (filler) were mixed together to prepare paste material 7. The viscosity of the paste material at 5 rpm was measured at 21990 mPa · s and its viscosity at 0.5 rpm was measured at 45420 mPa · s, so the TI of paste material 7 was 2.065. Data relating to DSC peaks for paste material 7 are reported in Table 3. &lt; tb &gt; &lt; TABLE &gt;

Example 8

Production of paste material 8

Paste material 8 was prepared in the same manner as paste material 7 except that the amount of each component in paste material 8 was changed in accordance with the data shown in Table 3. [

<Table 3>

The composition of the paste material in Examples 7-8

Performance Example 9

Die bonding formed according to D-F method

The die bonding test of thirteen groups was carried out according to the DF method. Taking Group # 1 as an example, the dam material 4 was first distributed around the controller die and its viscosity (44370 mPa.s) was greater than the viscosity of the standard die bonding (about 10000 mPa.s) there was. The nozzle size (inner diameter) of the dam material with the frame distribution pattern was 0.30 mm. To distribute the dam material, the atmospheric pressure was 0.34 MPa, the dispense velocity was 9 mm / s, and the dispense height was 0.08 mm. The stage temperature was 25 占 폚. The fill material had a very low viscosity and TI that could have very good fluidity on the BGA substrate. The nozzle size of the fill material with the Maize v2 distribution pattern was 0.50 mm. To dispense the fill material, the air pressure was 0.12 MPa, the dispense rate was 37.5 mm / s, and the dispense height was 0.14 mm. The substrate was slightly heated to improve flow and coverage. The stage temperature was 65 占 폚. After filling the fill material and complete application, the fill material was pre-heated to form a sticky surface. The memory die was then attached over it. The bond force was 200 g and the bond time was 1000 ms. The partially cured material was then placed in an oven for complete curing. After curing, the die bond results are shown in Table 4, i.e., the BLT was 80 占 퐉, the adhesive strength at room temperature was 4.3 kgf / mm ² , and the strip warpage was 50 占 퐉. Other twelve groups were performed in the same manner as group # 1, except that the corresponding process parameters were changed according to the parameters shown in Table 4.

<Table 4>

From Table 4 it can be clearly seen that the performance of the DF method is excellent for BLT, adhesive strength and strip bending at room temperature. It has been demonstrated that BLT is controllable according to the DF method of the present invention, such as in the range of 80 to 200 mu m. The adhesion at room temperature according to the DF method of the present invention is greater than 3.9 kgf / mm ² , which is much greater than the average value of about 2.5 kgf / mm ² in the prior art. Strip warpage is much better, on the one hand, since the warpage according to the method of the invention is much less than 100 μm, which means that it is better than the average value in the prior art, which is not visible to the naked eye and on the other hand is greater than 100 μm.

Performance Example 10

Die bonding formed according to the printing method

Eight groups of die bonding tests were performed according to the printing method. Taking Group # 1 as an example, a printed steel stencil having a thickness of 125 [mu] m with a certain set of apertures was used to cover the controller die on the substrate and then the paste material 7 was printed open to cover the controller die. The squeegee pressure was 1 kg at a squeegee speed of 10 mm / sec and a separation speed of 0.5 mm / sec. The paste material was partially cured. The memory die was then attached over the paste material. The bond force was 200 g and the bond time was 1000 ms. The partially cured material was then placed in an oven for complete curing. After curing, the die bond results are shown in Table 5, i.e., the BLT was 100 占 퐉, the adhesive strength at room temperature was 4.3 kgf / mm ² , and the strip warpage was 50 占 퐉. Seven other groups were performed in the same manner as group # 1 except that the corresponding process parameters were changed according to the parameters shown in Table 5.

<Table 5>

From Table 5 it can clearly be seen that the performance of the printing method is excellent with respect to adhesion and strip bending at room temperature, BLT. It has been demonstrated that BLT is controllable according to the printing method of the present invention, such as in the range of 80 to 100 mu m. The adhesion at room temperature according to the printing method of the present invention is at least 4.06 kgf / mm ² , which is much greater than the average value of about 2.5 kgf / mm ² in the prior art. Strip warpage is much better, on the one hand, since the warpage according to the method of the invention is much less than 100 μm, which means that it is better than the average value in the prior art, which is not visible to the naked eye and on the other hand is greater than 100 μm.

Although this disclosure has been described in the specification and described with reference to various embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure as defined in the claims It will be understood. Further, unless the context clearly indicates that the various aspects, elements, and / or functions of the various embodiments are expressly contemplated and contemplated herein, one of ordinary skill in the art will readily appreciate from the disclosure that the features, elements, and / May be properly included in yet another embodiment. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the essential scope thereof. Accordingly, the present disclosure is not intended to be limited to the particular embodiments described in the drawings and described herein as the best mode contemplated for carrying out this disclosure, and this disclosure is not intended to limit the scope of the present invention to any implementation And are intended to include embodiments.

Claims (14)

1) the dam material is distributed around the at least one first die on the substrate;
2) the fill material is dispensed into the region defined by the dam material, and optionally the substrate is heated during this time;
3) Optionally, the fill material is partially cured;
4) the second die is bonded onto the fill material;
5) Steps in which the dam and fill material are fully cured
Wherein the die material and the fill material are used. The process according to claim 1, characterized in that the viscosity of the dam material at 25 ° C at 5 rpm is in the range of 5,000-500,000 mPa · s, preferably in the range of 40,000-50,000 mPa · s, and the thixotropic index (TI) Lt; RTI ID = 0.0 &gt; 1.0, &lt; / RTI &gt; A process according to any one of the preceding claims wherein the viscosity of the fill material at 5 rpm at 25 rpm is in the range of less than 50,000 mPa s, preferably less than 10,000 mPa, and the TI of the fill material is less than 3.0, preferably less than 1.5 Lt; RTI ID = 0.0 &gt; 1, &lt; / RTI &gt; 4. The method according to any one of claims 1 to 3, wherein the dam material comprises a basic resin, an epoxy hardener, a hardener, a filler and other additives, wherein the basic resin is selected from the group consisting of an epoxy resin, a BMI resin and a vinyl resin Wherein at least one of the plurality of die bonding methods is one or more die bonding methods. 5. The filler material according to any one of claims 1 to 4, wherein the filler material comprises a basic resin, an epoxy hardener, a curing agent, a filler and other additives, and the basic resin is selected from the group consisting of an epoxy resin, a BMI resin and a vinyl resin Wherein at least one of the plurality of die bonding methods is one or more die bonding methods. 5. The method of claim 4 wherein the dam material comprises 0-20% epoxy resin, preferably 4-8% epoxy resin, 0-30% BMI resin, based on the total weight of the dam material, and such that the sum of each component is 100% Preferably 20 to 28%, vinyl resin 0 to 30%, preferably 14 to 20%, epoxy hardener 0 to 5%, preferably 0.2 to 1.0%, curing agent 0 to 5%, preferably 0.2 to 1.2% -80%, preferably 40-60%, and the other additives 0-5%, preferably 0.5-2.0%. 6. The method of claim 5, wherein the fill material is selected from the group consisting of 0-30% epoxy resin, preferably 8-16% epoxy resin, 0-40% BMI resin, based on the total weight of the fill material, Preferably 25 to 30%, vinyl resin 0 to 40%, preferably 6 to 16%, epoxy hardener 0 to 5%, preferably 0.2 to 1.2%, curing agent 0 to 5%, preferably 0.6 to 1.0% -70%, preferably 45-50%, and the other additives 0-5%, preferably 0.8-1.5%. 8. A die bonding method according to any one of claims 1 to 7, wherein the first die is a controller die and the second die is a memory die. 1) a printed steel stencil with a particular set of apertures is used to cover one or more first die on a substrate;
2) printing the paste material with an opening to cover the at least one first die;
3) optionally, the paste material is partially cured;
4) the second die is bonded onto the paste material; And
5) step in which the paste material is completely cured
Wherein the printed stencil and paste material comprises a printed stencil and a paste material. 10. The process of claim 9, wherein the viscosity of the paste material at 5 rpm at 25 rpm is in the range of 1,000 to 500,000 mPa.s, preferably in the range of 15,000 to 50,000 mPa.s, and the TI of the paste material is greater than 1.0, 1.5 to 3.0. &Lt; / RTI &gt; The paste material according to claim 9 or 10, wherein the paste material comprises a basic resin, an epoxy hardener, a curing agent, a filler and other additives, and the basic resin is at least one selected from the group consisting of an epoxy resin, a BMI resin and a vinyl resin . 12. The composition of claim 11, wherein the paste material comprises 0-30%, preferably 5-10%, epoxy resin, 0-30% BMI resin, based on the total weight of the paste material and such that the sum of each component is 100% Preferably 20-30%, vinyl resin 0-30%, preferably 15-28%, epoxy hardener 0-6%, preferably 0.2-1.5%, curing agent 0-5%, preferably 0.2-1.0%, filler 30 -70%, preferably 30-55%, and the other additives 0-5%, preferably 1.0-1.5%. 13. A method according to any one of claims 9 to 12, wherein the first die in the memory card is a controller die and the second die is a memory die. 14. A memory card, in particular a built-in multimedia card, manufactured in accordance with one of the claims 1 to 13.

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