KR20160101064A - 초고속 레이저 빔 광학기기로 컷팅되는 스택화 투명 재료, 붕괴 층 및 다른 층 - Google Patents

초고속 레이저 빔 광학기기로 컷팅되는 스택화 투명 재료, 붕괴 층 및 다른 층 Download PDF

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Publication number
KR20160101064A
KR20160101064A KR1020167019198A KR20167019198A KR20160101064A KR 20160101064 A KR20160101064 A KR 20160101064A KR 1020167019198 A KR1020167019198 A KR 1020167019198A KR 20167019198 A KR20167019198 A KR 20167019198A KR 20160101064 A KR20160101064 A KR 20160101064A
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South Korea
Prior art keywords
laser beam
layer
laser
workpiece
line
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KR1020167019198A
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Korean (ko)
Inventor
로버트 조지 만리
사스하 마랴노비치
가렛 앤드류 피츠
세르지오 츠다
로버트 스테펜 와그너
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코닝 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/0087—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • C03B33/078—Polymeric interlayers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B23K2203/54—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020167019198A 2013-12-17 2014-12-11 초고속 레이저 빔 광학기기로 컷팅되는 스택화 투명 재료, 붕괴 층 및 다른 층 Withdrawn KR20160101064A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361917092P 2013-12-17 2013-12-17
US61/917,092 2013-12-17
US201462022896P 2014-07-10 2014-07-10
US62/022,896 2014-07-10
US14/530,457 US20150165563A1 (en) 2013-12-17 2014-10-31 Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US14/530,457 2014-10-31
PCT/US2014/069714 WO2015094898A2 (en) 2013-12-17 2014-12-11 Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers

Publications (1)

Publication Number Publication Date
KR20160101064A true KR20160101064A (ko) 2016-08-24

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KR1020167019198A Withdrawn KR20160101064A (ko) 2013-12-17 2014-12-11 초고속 레이저 빔 광학기기로 컷팅되는 스택화 투명 재료, 붕괴 층 및 다른 층

Country Status (7)

Country Link
US (1) US20150165563A1 (enExample)
EP (1) EP3083512A2 (enExample)
JP (1) JP6585050B2 (enExample)
KR (1) KR20160101064A (enExample)
CN (1) CN106457476B (enExample)
TW (1) TWI649149B (enExample)
WO (1) WO2015094898A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200125954A (ko) * 2018-02-26 2020-11-05 코닝 인코포레이티드 투명 마더 시트로부터 투명 물품을 레이저 형성하고 현장에서 투명 물품을 처리하는 방법
KR20220049010A (ko) * 2019-08-15 2022-04-20 코닝 인코포레이티드 액체 렌즈의 어레이를 제조하고 어레이를 개별 액체 렌즈로 분리하는 것과 같은, 접합부를 통해 기판들을 접합하고 접합된 기판의 일부를 분리하는 방법

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150166393A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser cutting of ion-exchangeable glass substrates
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
JP6262039B2 (ja) 2014-03-17 2018-01-17 株式会社ディスコ 板状物の加工方法
JP6301203B2 (ja) * 2014-06-02 2018-03-28 株式会社ディスコ チップの製造方法
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) * 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
WO2016138054A1 (en) 2015-02-27 2016-09-01 Corning Incorporated Optical assembly having microlouvers
ES2879275T3 (es) * 2015-03-11 2021-11-22 Panasonic Ip Man Co Ltd Procedimiento de fabricación para una unidad de panel de vidrio y procedimiento de fabricación para una ventana de vidrio
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
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US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
DE102015111490A1 (de) * 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
WO2017034958A1 (en) * 2015-08-21 2017-03-02 Corning Incorporated Glass substrate assemblies having low dielectric properties
CN105855244B (zh) * 2016-04-25 2018-11-09 江苏大学 一种曲轴油孔的激光空化清洁强化装置及清洁强化方法
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR102363273B1 (ko) * 2016-07-25 2022-02-15 엠플리튜드 다중 빔 펨토초 레이저에 의해 재료를 절단하는 방법 및 장치
CN109803934A (zh) 2016-07-29 2019-05-24 康宁股份有限公司 用于激光处理的装置和方法
WO2018044843A1 (en) * 2016-08-30 2018-03-08 Corning Incorporated Laser processing of transparent materials
EP3296054B1 (de) * 2016-09-19 2020-12-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur herstellung eines mikrobearbeiteten werkstücks mittels laserabtrag
CN107876971A (zh) * 2016-09-30 2018-04-06 上海微电子装备（集团）股份有限公司 一种激光切割装置及方法
CN109803786B (zh) * 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) * 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) * 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10668561B2 (en) 2016-11-15 2020-06-02 Coherent, Inc. Laser apparatus for cutting brittle material
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
JP6955684B2 (ja) * 2017-03-09 2021-10-27 株式会社リコー 光加工装置、及び光加工物の生産方法
WO2018189296A1 (en) 2017-04-12 2018-10-18 Saint-Gobain Glass France Electrochromic structure and method of separating electrochromic structure
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
JP6893691B2 (ja) * 2017-09-29 2021-06-23 三星ダイヤモンド工業株式会社 複層脆性材料基板の作製方法および作製システム
JP2019093449A (ja) * 2017-11-27 2019-06-20 日東電工株式会社 プラスチックフィルムのレーザ加工方法及びプラスチックフィルム
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP2019109396A (ja) * 2017-12-19 2019-07-04 シャープ株式会社 表示パネルの製造方法
JP2019139182A (ja) * 2018-02-15 2019-08-22 株式会社ディスコ 液晶パネルの製造方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11992894B2 (en) 2018-02-23 2024-05-28 Corning Incorporated Method of separating a liquid lens from an array of liquid lenses
US11401195B2 (en) * 2018-03-29 2022-08-02 Corning Incorporated Selective laser processing of transparent workpiece stacks
TWI677395B (zh) * 2018-03-31 2019-11-21 財團法人工業技術研究院 硬脆材料切割方法及其裝置
US11344973B2 (en) 2018-04-19 2022-05-31 Corning Incorporated Methods for forming holes in substrates
DE102018110211A1 (de) 2018-04-27 2019-10-31 Schott Ag Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
US12011783B2 (en) * 2018-05-25 2024-06-18 Corning Incorporated Scribing thin ceramic materials using beam focal line
US11059131B2 (en) * 2018-06-22 2021-07-13 Corning Incorporated Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
US11524366B2 (en) * 2018-07-26 2022-12-13 Coherent Munich GmbH & Co. KG Separation and release of laser-processed brittle material
CN109693046B (zh) * 2019-03-07 2021-03-16 大族激光科技产业集团股份有限公司 一种双层基板的孔结构激光加工方法
US11054574B2 (en) 2019-05-16 2021-07-06 Corning Research & Development Corporation Methods of singulating optical waveguide sheets to form optical waveguide substrates
CN110723900A (zh) * 2019-09-16 2020-01-24 深圳市裕展精密科技有限公司 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备
DE102019135283A1 (de) * 2019-12-19 2021-06-24 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Lasermaterialbearbeitung und Laserbearbeitungsanlage
KR20230020534A (ko) * 2020-06-10 2023-02-10 코닝 인코포레이티드 탑햇 에너지 분포를 사용하여 코팅 기판을 레이저 가공하는 방법
BR112023003143A2 (pt) * 2020-08-21 2023-04-04 Araujo Dayrell Ivan Padrão de filtragem para feixes de laser adequados para a produção de supercapacitores
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
DE102020213776A1 (de) 2020-11-03 2022-05-05 Q.ant GmbH Verfahren zum Spalten eines Kristalls
EP4011846A1 (en) 2020-12-09 2022-06-15 Schott Ag Method of structuring a glass element and structured glass element produced thereby
CN112719628B (zh) * 2020-12-18 2023-08-29 浙江泰仑电力集团有限责任公司 基于异物透明度的复色激光异物清除装置及方法
US12304005B2 (en) 2021-02-01 2025-05-20 Corning Incorporated Sacrificial layers to enable laser cutting of textured substrates
WO2022223683A1 (de) * 2021-04-23 2022-10-27 Schott Ag Verfahren zum kontrollieren einer mittels eines linienfokus eines laserstrahls innerhalb eines substrats eingebrachten energieverteilung und substrat
FR3125292B1 (fr) * 2021-07-16 2023-12-29 Saint Gobain Procédé de découpage d’un panneau de verre feuilleté
FR3125293B1 (fr) * 2021-07-16 2023-12-29 Saint Gobain Procédé de découpage d’un panneau de verre feuilleté
WO2023096776A2 (en) * 2021-11-29 2023-06-01 Corning Incorporated Laser cutting methods for multi-layered glass assemblies having an electrically conductive layer
CN114309987A (zh) * 2022-01-13 2022-04-12 武汉华工激光工程有限责任公司 一种显示面板激光切割方法及设备
CN114425665B (zh) * 2022-02-14 2023-11-10 上海赛卡精密机械有限公司 水导激光系统和双层材料切割方法
CN114633035B (zh) * 2022-05-11 2022-08-12 东莞市盛雄激光先进装备股份有限公司 一种正极极片的制片方法、制片系统及正极极片
CN115647606B (zh) * 2022-11-15 2024-12-13 上海赛卡精密机械有限公司 一种水导激光阻断防护方法
WO2025042557A1 (en) 2023-08-23 2025-02-27 Corning Incorporated Systems and methods for separating continuous glass tubing into individual lengths of glass tubes
CN117182351B (zh) * 2023-11-03 2024-01-30 江苏迅镭激光科技有限公司 激光切割平台和激光切割方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156030A (en) * 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
JP3185869B2 (ja) * 1997-10-21 2001-07-11 日本電気株式会社 レーザ加工方法
DE19908630A1 (de) * 1999-02-27 2000-08-31 Bosch Gmbh Robert Abschirmung gegen Laserstrahlen
US6259151B1 (en) * 1999-07-21 2001-07-10 Intersil Corporation Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors
JP2003154517A (ja) * 2001-11-21 2003-05-27 Seiko Epson Corp 脆性材料の割断加工方法およびその装置、並びに電子部品の製造方法
WO2004080643A1 (ja) * 2003-03-12 2004-09-23 Hamamatsu Photonics K.K. レーザ加工方法
FR2855084A1 (fr) * 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
JP4742751B2 (ja) * 2005-08-30 2011-08-10 セイコーエプソン株式会社 表示パネル、表示パネルのレーザスクライブ方法及び電子機器
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7838331B2 (en) * 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
US20070111480A1 (en) * 2005-11-16 2007-05-17 Denso Corporation Wafer product and processing method therefor
JP2008037943A (ja) * 2006-08-03 2008-02-21 Nitto Denko Corp 衝撃吸収粘着剤シートおよびその製造方法
CN101516566B (zh) * 2006-09-19 2012-05-09 浜松光子学株式会社 激光加工方法和激光加工装置
US7867907B2 (en) * 2006-10-17 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US8076605B2 (en) * 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
US7842583B2 (en) * 2007-12-27 2010-11-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
JP2009297734A (ja) * 2008-06-11 2009-12-24 Nitto Denko Corp レーザー加工用粘着シート及びレーザー加工方法
KR20120073249A (ko) * 2009-08-28 2012-07-04 코닝 인코포레이티드 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
KR102088722B1 (ko) * 2010-07-12 2020-03-17 로핀-시나르 테크놀로지스 엘엘씨 레이저 필라멘테이션에 의한 재료 가공 방법
CN103025478B (zh) * 2010-07-26 2015-09-30 浜松光子学株式会社 基板加工方法
US20120299219A1 (en) * 2011-05-27 2012-11-29 Hamamatsu Photonics K.K. Laser processing method
US8635887B2 (en) * 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
WO2013043173A1 (en) * 2011-09-21 2013-03-28 Raydiance, Inc. Systems and processes that singulate materials
FR2980859B1 (fr) * 2011-09-30 2013-10-11 Commissariat Energie Atomique Procede et dispositif de lithographie
JP5887929B2 (ja) * 2011-12-28 2016-03-16 三星ダイヤモンド工業株式会社 被加工物の分断方法および光学素子パターン付き基板の分断方法
JP2013152986A (ja) * 2012-01-24 2013-08-08 Disco Abrasive Syst Ltd ウエーハの加工方法
WO2013130581A1 (en) * 2012-02-28 2013-09-06 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US9938180B2 (en) * 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US20130344684A1 (en) * 2012-06-20 2013-12-26 Stuart Bowden Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material
US9346706B2 (en) * 2012-11-29 2016-05-24 Corning Incorporated Methods of fabricating glass articles by laser damage and etching
US11053156B2 (en) * 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200125954A (ko) * 2018-02-26 2020-11-05 코닝 인코포레이티드 투명 마더 시트로부터 투명 물품을 레이저 형성하고 현장에서 투명 물품을 처리하는 방법
KR20220049010A (ko) * 2019-08-15 2022-04-20 코닝 인코포레이티드 액체 렌즈의 어레이를 제조하고 어레이를 개별 액체 렌즈로 분리하는 것과 같은, 접합부를 통해 기판들을 접합하고 접합된 기판의 일부를 분리하는 방법

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