KR20160096877A

KR20160096877A - The Cutting Method of PC Light Guide Plate Ejection Mold Gate

Info

Publication number: KR20160096877A
Application number: KR1020150018482A
Authority: KR
Inventors: 조성희
Original assignee: 조성희
Priority date: 2015-02-06
Filing date: 2015-02-06
Publication date: 2016-08-17

Abstract

The method of cutting the light guide panel used in the mobile phone and various monitors is mainly a method of cutting with a blade made of a material such as a carbide, a highspeed, an SK Eleven, or a steel, so that a scratch, chipping polycrystalline (or multimolecular) The haze phenomenon occurs due to the minute bonding of the micro-bonding agent generated by the combination of the light and the light, or the light is emitted or reflected light absorption is hindered to suppress the function of the light guide plate requiring high purity light, Dust and foreign matter generated are attached to the finished light guide plate by static electricity or spontaneously, which degrades the product quality.
Accordingly, in order to solve the above-described problems and meet the needs of the producers and consumers, it is a technique to finely cut and polish the LGP with a fixed diamond saw, and to solve the problems described above, thereby eliminating defective products.

Description

[0001] The present invention relates to a PC light guide plate ejection mold gate cutting method,

The present invention relates to a method of cutting a gate portion of a PC light guide plate injection (hereinafter referred to as " light guide plate ") used for a mobile phone and various monitors without defect.

Generally, when cutting the gates of LGP used in mobile phones and various monitors, the main method is cutting with a blade made of materials such as carbide, highs, SK Eleven, and steel, so that after cutting the product, scratches, chipping polycrystals Molecules), which are caused by the haze of the micro-complexes generated by the combination of the light and the light emission or reflected light absorption is obstructed to suppress the function of the LGP that requires high-purity light . In addition, dust and foreign matter generated during cutting are electrostatically or naturally attached to the light-guiding plate having been cut to degrade quality.

Therefore, to solve the above-mentioned problems and meet the needs of producers and consumers.

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SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and aims to improve the quality of a product by eliminating scratches, chipping, or mist caused by scratches, chipping or molecular fissures using a bite with natural diamonds and to provide a high efficiency of productivity. . To summarize the method, dust and foreign matter are removed by using an ion generating device and an air suction device when cutting a light guide plate, and an air suction device is installed to remove defective elements due to shaking of a work piece (light guide plate) , It is necessary to move the pads and the clamps of the cutting tool in order to eliminate the cause of the defect in the cut section, so that the cut diamond can be passed through the fixed diamond bite and the cut surface is finely cut and polished so as to produce a product with no defect rate .

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. When a light guide plate produced in an injection molding machine to be cut is put on a vacuum device of a cutter and a pad having an air clamp (FIG. 1) The gate or cut surface of the light guide plate is cut. At this time, the vacuum air clamp is first operated to fix the light guide plate, and at the same time, the ion generating device and the dust suction device are operated to cut the light guide plate, and the vacuum pad and the cutting pad with the air cylinder clamp mounted thereon (FIG. 2) passing through a natural diamond attaching bite (FIG. 2) and then moved to the position of FIG. 1 again after the fine cutting abrasion is performed and the cut light guide plate is collected and packed. In order to prevent interference with the light guide plate during the fine grinding, the angle of the diamond saw blade is maintained at 1 to 20 degrees (Fig. 8) And the two-stage angle is maintained at 3 degrees to 25 degrees (Fig. 10).

The width of the diamond cutting edge is preferably 0.5 to 4.5 mm (FIG. 11) in consideration of the thickness of the light guide plate, and the c-side of 10 to 80 degrees (FIG. 12) The diamond of 0.2-3.0 mm (Fig. In this case, the diamond-bonded bite was attached to the portion of Fig. 2 at a length of 10 to 100 mm (Fig. 14) Adjust the length of the cutter and cut as much as necessary.

The main constitution of the present invention is a method and apparatus for fixing an ion generating device (Fig. 5), an air suction device (Fig. 6), a light guide plate by a vacuum and an air cylinder clamp (Fig. 1) (FIG. 2) for fine cutting and polishing the cut surface, a micrometer device (FIG. 3) for fine adjustment of the natural diamond attaching bite, and an apparatus for adjusting the angle of natural diamond insert (FIG. 4) The gate and the gate-attached surface are subjected to cutting polishing and polishing.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. When a light guide plate produced in an injection molding machine to be cut is put on a vacuum device of a cutter and a pad having an air clamp (FIG. 1) The gate or cut surface of the light guide plate is cut. At this time, the vacuum air clamp is first operated to fix the light guide plate, and at the same time, the ion generating device and the dust suction device are operated to cut the light guide plate, and the vacuum pad and the cutting pad with the air cylinder clamp mounted thereon (FIG. 2) passing through a natural diamond attaching bite (FIG. 2) and then moved to the position of FIG. 1 again after the fine cutting abrasion is performed and the cut light guide plate is collected and packed. In order to prevent interference with the steel sheet during the fine cutting, the angle of the diamond saw blade is maintained at 1 to 20 degrees (Fig. 8) , And the two-stage angle is maintained at 3 to 25 degrees (Fig. 10).

The width of the diamond cutting edge is preferably 0.5 to 4.5 mm (Fig. 11) in consideration of the thickness of the light guide plate, and the c-side of 10 to 80 degrees (Fig. 12) And a diamond of 0.2-3.0 mm (Fig. At this time, the diamond-bonded bite was attached to the portion of the length of 10 to 100 mm (Fig. 14) without dividing into the shape (Fig. 2) and the angle of the bite was adjusted (Fig. 4) Adjust the length of the diamond bite and cut as much as you need.

According to the present invention, it is possible to eliminate defective elements so that the original purpose of the light guide plate can be sufficiently attained without causing dust and foreign matter to be cut on the cut surface of the light guide plate generated from the injection machine, Completely eliminates it, so you can get close to 100% productivity.

In addition, productivity can be maximized through automation of production equipment and production line.

1): A device (pad) used after fixing the light guide plate with a vacuum and air cylinder clamp,
2): natural diamond attachment bite
3): a micrometer device for fine tuning a natural diamond attachment bite
4): a device for adjusting the angle of natural diamond bite
5): Ion generator
6): The air suction device
8): Byte and diamond-coated blade angle (1 to 20 degrees)
9): one-stage angle (2-10 degrees)
10): two-stage angle (3 to 25 degrees)
11): diamond cutting edge (0.5-4.5 mm)
12): c side cutting (10-80 degrees)
13): Diamond protruding blades - 0.2-3.0 mm diamonds are attached to the blades
14): Diamond-attached bite (10 to 100 mm long)

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Claims

[Claim 1]
(FIG. 8) - (FIG. 14) in which cut surfaces were attached with natural diamond while fixing and transferring the gate and gate mounting surfaces of a light guide plate used for a mobile phone and various monitors, using a vacuum and air cylinder clamp, and finely cut and polished Method and apparatus for making polish.

[Claim 2]
Claims [1] A micrometer device for fine tuning by mounting a natural diamond-bonded bite and a method and apparatus for adjusting the diamond angle.

[Claim 3]
A method of transferring a workpiece in a diamond processing method of a light guide plate cut surface according to claim 1, and a method of transferring a diamond attachment bite.