KR20160093554A - Manufacturing method for packing material and manufacturing method of electronic device using the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a packaging material for packaging a light emitting chip, comprising the steps of: preparing solid resin powder and phosphor powder; mixing the solid resin powder and the phosphor powder to prepare mixture powder; and molding the mixture powder to prepare a tablet. According to an embodiment of the present invention, since a packaging material including a phosphor material is molded, there is no need to perform a separate process of dispensing or filling the phosphor material on a chip device again, thereby shortening a molding time. Thus, the present invention prevents the phosphor material from settling around the chip device, thereby enhancing luminous efficiency and obtaining uniform brightness.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging material re-manufacturing method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging material remanufacturing method and a method of manufacturing an electronic device using the same. More particularly, the present invention relates to a packaging material remanufacturing method capable of improving light emitting efficiency and luminance uniformity.

LED (Light-Emitting Diode) is a semiconductor device that emits light (that is, light) when current is passed through a pn junction of a semiconductor. These LEDs emit light in different colors depending on the characteristics of the material. Various phosphor materials that emit fluorescent light are used as the material for determining the color of light. For example, gallium arsenide (GaAs) is used for LEDs emitting infrared rays, gallium aluminum (GaAlAs) is used for LEDs emitting infrared or red light, and gallium arsenide Arsenic (GaAsP) is used, and gallium phosphide (GaP) is used for LED emitting red, green or yellow, and Cr · Tm · Tb (rare earth element) As active ions are mixed and applied.

2. Description of the Related Art In general, a light-emitting diode (LED) is classified into a lamp type LED and a surface mount type (SMD) LED.

In this case, the lamp-type LED has two lead frames (metal electrodes) formed on the upper side of the substrate to mount the LED module, and the resin is molded on the outer side thereof to package the LED module Cover), which has a large thermal resistance and is difficult to discharge heat, and thus has a problem in that it is difficult to utilize it for high output power.

The surface mount type LED is manufactured by bonding an LED module on a substrate formed of a ceramic or a printed circuit board (PCB), molding the resin on the LED module, (Or cover), which is advantageous in that heat generated from an LED module can be easily emitted as compared with a lamp-type LED. As the luminance is improved, a color display panel and a lighting device Is widely used in the field.

The LED package for packaging the LED module is a molding process in which a liquid molding material in which a liquid resin and a phosphor are mixed is dispensed on the LED chip and the wire bonding mounted on the substrate and cured, .

However, in the LED package manufacturing process, the LED chip is die-bonded on the upper surface of the substrate, the LED chip is wire-bonded, and then the liquid resin and the phosphor are bonded to the wire- There is a problem that the manufacturing process of the LED package is complicated such as dispensing.

In manufacturing the LED package, the liquid resin and the phosphor are dispensed and cured on the LED chip and the wire, and the curing time is long, so that the phosphor is precipitated in the periphery of the LED chip and the wire. In other words, after the liquid resin and the phosphor are dispensed, a curing time of 3 hours to 5 hours is required. At this time, the phosphor particles go downward and settle to the periphery of the LED chip and the wire.

The light emitted from the LED chip is interfered by the precipitated phosphor, and the interference of the light causes the luminance of the light emitted from the LED package or the uneven emission efficiency.

Korean Patent Publication 2006-0034976

The present invention provides a packaging material remanufacturing method capable of improving luminous efficiency and luminance uniformity, and a method of manufacturing an electronic device using the same.

The present invention also provides a packaging material remanufacturing method capable of minimizing the precipitation of the phosphor and simplifying the manufacturing process, and a method of manufacturing an electronic device using the same.

The present invention relates to a packaging material manufacturing method for packaging a light emitting chip, comprising the steps of: preparing a solid resin powder and a phosphor powder; Mixing the solid resin powder and the phosphor powder to prepare a mixed powder; And molding the mixed powder to produce a tablet; .

Charging the mixed powder into the inner space of the mold in the process of manufacturing the tablet; And applying heat and pressure to the mixed powder charged in the forming die to produce a tablet having a shape corresponding to the inner space of the forming die.

It is preferable that the temperature applied to the mixed powder charged in the mold is 50 to 120 캜.

It is preferable that the pressure applied to the mixed powder charged in the mold is 100 to 300 mPa.

The tablet may have any one of a circular shape, an elliptical shape, and a polygonal shape.

The combination of the solid resin powder and the phosphor

The solid resin powder and the phosphor powder (B) are mixed in an amount of 80 wt% to 85 wt% and 15 wt% to 20 wt%, respectively, based on 100 wt% of the mixed powder in which the solid resin powder and the phosphor powder are mixed.

The present invention relates to a method of manufacturing an electronic device for packaging a chip device emitting light, comprising the steps of: preparing a packaging material made of solid tablets by mixing a solid resin powder and a phosphor powder; Bonding the chip element on a substrate; And a step of molding the packaging material so as to cover the upper side of the chip element, the step of molding to cover the chip element comprises the steps of installing the chip element in a mold unit; Injecting the tablet-like packaging material into the mold unit; And melting the packaging material in the form of a tablet in the mold unit, injecting the molten packaging material so as to cover the top of the chip device, and curing the packaging material covering the chip device; .

In the process of melting the tabular packaging material, it is preferable to apply heat of 120 ° C to 180 ° C to the tabular packaging material.

It is preferable to apply a pressing force to the tablet-like packaging material while applying heat to the tablet-like packaging material at 120 ° C to 180 ° C.

Wherein the mold unit comprises: a lower mold on which the substrate on which the chip element is mounted is seated; And an upper mold provided on the upper mold to cover the chip element and having a cavity filled with the packaging material melted therein, wherein the upper mold faces the upper surface of the lower mold opposite to the substrate, And a channel for preventing thermal deformation of the substrate by blocking the heat transfer of the molten packaging material to at least one of the periphery of the mounting portion and the lower periphery of the upper mold facing the lower mold is provided .

According to the embodiment of the present invention, it is not necessary to carry out a separate process of dispensing or filling the fluorescent material again on the chip element by molding the packaging material containing the fluorescent material, so that the molding time can be shortened. Thus, the problem that the fluorescent material is deposited around the chip element can be prevented, the light emission efficiency can be improved, and the luminance can be made uniform.

In addition, the solid resin powder and the phosphor powder are mixed with each other to produce solid or tablet-like packaging material, which is advantageous in that it is easy to store and move as compared with a liquid packaging material.

Further, by forming a channel that blocks or minimizes the movement of heat to the mold, deformation of the substrate due to the packaging material can be prevented while the packaging material is injected and cured.

1 and 2 schematically show an electronic device in which a chip device is packaged using a packaging agent provided with a packaging material re-manufacturing method according to an embodiment of the present invention
3 is a view conceptually showing a method of manufacturing a picky jig according to an embodiment of the present invention
5 is a view conceptually showing an example of a packaging apparatus according to an embodiment of the present invention;
6 is a view showing a state in which a molten unit and a mold unit of a packaging apparatus according to an embodiment of the present invention are stuck together
7 is a view showing the lower mold of the mold unit according to the embodiment of the present invention
8 is a view showing a lower mold of the mold unit according to the embodiment of the present invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know.

FIG. 1 and FIG. 2 are views schematically showing an electronic device in which a chip device is packaged using a packaging agent provided with a packaging material re-manufacturing method according to an embodiment of the present invention. FIG. 3 is a conceptual view illustrating a method of manufacturing pickled jig according to an embodiment of the present invention.

1 and 2, an electronic device manufactured by a method according to an embodiment of the present invention includes a substrate 10, a chip device 20 formed on the substrate 10 and emitting light, a chip device 20 (Not shown) to cover the periphery or top of the chip device 20 to protect the chip device 20 from the external environment and convert the wavelength of the light emitted from the chip device 20 to determine the hue do.

Hereinafter, a vertical LED will be described as an example of an electronic device in explaining a method of manufacturing an electronic device according to an embodiment of the present invention.

The substrate 10 according to an embodiment of the present invention is in the form of a plate made of metal, and has a positive electrode terminal and a negative electrode terminal formed thereon. Further, the substrate 10 may be a plate-like body constituted by a lead frame and a mounting portion in which the chip element 20 is mounted, which is an inner region of the lead frame, and a part of the lead frame is cut out.

The substrate 10 according to the embodiment is formed of copper (Cu), but the present invention is not limited thereto. The substrate 10 may be made of stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg) Or at least one of copper (Cu), stainless steel, aluminum (Al), nickel (Ni), magnesium (Mg), zinc (Zn) and decontamination (Ta) And is made of at least one alloy material.

The chip element 20 is a vertical type LED and includes a chip (hereinafter, light emitting chip), a light emitting chip (not shown) and a cathode terminal and a cathode terminal formed on the substrate 10 for emitting light And a wire (not shown) electrically connected thereto. Here, the light emitting chip is mounted on the substrate 10 by a die bonding method. In addition, the chip element 20 may include a light emitting chip and a primer (not shown) coated on the surface of the wire.

The primer is coated on at least the surface of the light emitting chip and the wire to facilitate the bonding of the packaging part (40). That is, the primer is formed between the chip element 20 and the packaging portion 40, and serves as an interface bonding agent for improving the bonding strength of the packaging portion. Here, the bonding force of the packaging portion can be reduced by the heat transmitted from the chip element 20, and it is necessary to block or prevent the heat of the chip element 20 from being transmitted to the packaging portion 40. Therefore, in the embodiment of the present invention, the material having heat resistance is formed of a primer, for example, silicon (Si) is used. Thus, the heat generated from the chip element 20 by the primer formed of the heat resistant material is minimized or prevented from being transferred to the packaging portion 40, so that the packaging portion 40 is easily adhered.

Of course, the primer is not limited to the above-described silicon (Si) material but may be any material that is transmissive and thermostable to allow light transmission.

On the other hand, there is a problem that the packaging portion 40 is separated from the upper portion of the chip element 20 due to heat generated from the chip element, and the chip element is not operated at a constant current or more. However, in the present invention, since the primer is formed to minimize or prevent the heat generated from the chip element from being transferred to the primer, the packaging portion 40 has heat resistance against heat, which is higher than that of the prior art, Even if the chip element is operated by the current, it is possible to prevent the deterioration of the bonding strength of the packaging portion 40 due to heat.

The packaging unit 40 packages the chip device 20 formed on the substrate 10 by using the solid or the tabular packaging material manufactured by the method according to the embodiment of the present invention. The packaging portion 40 according to the embodiment is not limited to the hemispherical or semicircular shape, but can be changed into various shapes that can cover the chip element 20. [

In the present invention, a packaging material in the form of a solid (or solid or solid) and a predetermined shape, for example, a tablet, is used for packaging the chip element 20. That is, a packaging material in the form of a solid or a tablet is melted at the time of a packaging process, and the packaging material is packaged by injection molding, dispensing or dispensing the chip material onto the chip device 20 and curing the packaging material.

As described above, the packaging material according to the present invention is a tablet in a solid state, and has advantages of easy storage and transportation of the packaging material.

Hereinafter, a method of manufacturing a packaging material according to an embodiment of the present invention will be described with reference to FIG.

A method of manufacturing a packaging material according to an embodiment of the present invention is a method of manufacturing a packaging material by mixing a solid resin powder (A) and the phosphor powder (B) in a process of providing a solid resin powder (A) and a phosphor powder (B) 3B) of preparing the mixed powder AB and a process (FIG. 3C) of producing the solid or the tabular packing material P by molding the mixed powder AB.

The solid resin powder (A) is a resin which can transmit light in a liquid state and can be cured by heat or light. In the embodiment, EMC (Epoxy Mold Compound) resin, which is a thermosetting resin that is cured by heat, is applied, but it is possible to apply various resins capable of transmitting light during melting and capable of being cured by heat or light Do.

The phosphor determines the color of the light when the light emitted from the chip element 20 is emitted to the outside, and various materials are used depending on the color to be emitted such as infrared, red, green, blue, and white. These phosphors are provided in the form of solid, i.e., powder, and mixed with the solid resin powder (A).

In the present invention, in producing the tabular packing material (P), the solid resin powder (P) and the phosphor powder (B) are mixed or blended to prepare a mixed powder (AB) Thereby forming a tablet. When mixing and mixing the solid resin powder (A) and the phosphor powder (B), the solid resin powder (A) accounts for 80 wt% to 85 wt% and the phosphor powder (B) B) to 15% by weight to 20% by weight.

In addition, in the embodiment of the present invention, when the light generated from the chip device 20 passes through the packaging material and is emitted, it becomes white. For this purpose, in the embodiment, a phosphor powder is mixed with a green phosphor powder and a red phosphor powder. That is, the phosphor powder (B) according to the embodiment includes a green phosphor powder and a red phosphor powder. In this case, when the entire phosphor powder (B) is 100 wt%, the green phosphor powder is mixed to 85 wt% to 87 wt% and the red phosphor powder is 13 wt% to 15 wt% .

Table 1 is a table showing the optical characteristics generated during manufacture of the packaging material using the tablet and the tablet according to the embodiments of the present invention and the comparative examples. Where Cx and Cy represent the X and Y axis values in the color coordinate system.

In the first to sixth embodiments, the solid resin powder (A) is mixed with 80 wt% to 85 wt% and the phosphor powder (B) is mixed with 15 wt% to 20 wt%, and the phosphor powder (B) ) Phosphor powder is 85% by weight to 87% by weight, and the red phosphor powder is 13% by weight to 15% by weight, and a packaging material manufactured using the tablet.

The first and second comparative examples are tablets composed of the solid resin powder (A) in an amount of more than 85% by weight and the phosphor powder (B) in an amount of less than 15% by weight, and a packaging material produced using the tablet.

division
Phosphor powder Phosphor powder
content
weight%
Resin content
(weight%)
Optical property characteristic
judgment Green phosphor powder content
(weight%) Red phosphor powder content
(weight%) Cx Cy Luminance
(lm) Driving current
(mA) Driving voltage
(V) Comparative Example 1 85 15 10 90 0.191 0.107 7.19 20 5.26 Poor First Embodiment 85 15 15 85 0.221 0.216 7.77 20 5.26 good Second Embodiment 85 15 17 83 0.237 0.275 8.23 20 5.26 Great Third Embodiment 85 15 20 80 0.253 0.332 8.34 20 5.26 good Second comparison 87 13 10 90 0.228 0.114 7.23 20 5.26 Poor Fourth Embodiment 87 13 15 85 0.261 0.212 7.89 20 5.26 good Fifth Embodiment 87 13 17 83 0.274 0.264 8.31 20 5.26 Great Sixth Embodiment 87 13 20 80 0.297 0.302 8.38 20 5.26 good

Referring to Table 1, in the case of the first to sixth embodiments, the color coordinates are white (White), and the luminance is as high as 7.7 lm or more. However, in the first comparative example, the color coordinate value is yellow rather than white, and the luminance is as low as 7.1 lm. In the second comparative example, the color coordinate values are blue rather than white and the brightness is low as 7.2.

Therefore, in the embodiment of the present invention, the solid resin powder (A) is mixed with 80 wt% to 85 wt% and the phosphor powder (B) is mixed with 15 wt% to 20 wt% in producing the tablet. Also, the phosphor powder (B) is constituted so that the amount of the green phosphor powder is 85 wt% to 87 wt%, and the amount of the red phosphor powder is 13 wt% to 15 wt%. Thus, according to the tablet manufacturing method according to the embodiments of the present invention, it is possible to manufacture a packaging material having a high luminance and emitting white light.

The mixed powder AB in which the solid resin powder A and the phosphor powder B are mixed is charged into a molding frame (not shown) having an inner space corresponding to the shape of the tablet to be manufactured. When the molding frame and the mixed powder AB are molded by applying heat and pressure, a tablet including a resin and a fluorescent material is produced (see Fig. 3C). At this time, the heat applied to the mixed powder is 50 ° C to 120 ° C, more preferably 50 ° C to 80 ° C, and a pressure of 100 mPa to 300 MPa is applied.

The solid resin powder (A) and the phosphor powder (B) have mutual bonding force when the heat applied to the mixed powder (AB) is less than 50 캜, more than 80 캜, less than 100 mpa or more than 300 mpa It is not easy to form and it may be difficult to manufacture the tablet.

In the present invention, a tablets packaging material (P) having a circular cross-sectional shape is produced by molding using the mixed powder (AB). However, the shape of the packaging material P is not limited to this, and may be modified into various shapes having a predetermined size, such as an ellipse or a polygon. The tablet-like packaging material thus produced is melted in the packaging process and molded on the chip element 20.

4 is a view conceptually showing a packaging material manufacturing method according to an embodiment of the present invention.

When a solid, that is, a tablet-like packaging material P is produced, the solid material, that is, the packaging material P in the form of tablets is melted by applying heat and pressure to the packaging material P to form a liquid phase having fluidity, Gel state. Thereafter, the molten packaging material P flows onto the chip element 20, covers the chip element 20, and is hardened and molded. At this time, when a plurality of chip elements 20 are mounted on the substrate 10, the plurality of chip elements 20 are simultaneously packaged by a single molding process. That is, the packaging section 40 is formed in each of the plurality of chip elements 20 by the single molding process as described above.

In the embodiment of the present invention, the packaging material is packed on the chip element 20 by the transfer molding method. Hereinafter, the packaging method of the method according to the embodiment will be described with reference to FIG.

First, the substrate 10 on which the chip device 20 is mounted is placed on the mold unit 3000 of the packaging device, and the tabular packaging material P is placed in the melting unit 1000 located above the mold unit 3000. (Fig. 4B). Then, while transfer 1300 is lowered and the packaging material P charged into the melting unit 1000 is pressed, heat is applied at a temperature of 50 ° C to 80 ° C to be melted. The packaging material P in a liquid state, which is molten and has fluidity, is discharged from the melting unit 1000, moves into the mold unit 3000, flows into the upper portion of the chip device 20, ).

As an example of the object to be mounted in the above, a vertical LED having a structure that electrically connects each of the cathode terminal and the cathode terminal formed on the substrate with the light emitting chip is described as an example. However, the chip device to be processed is not limited to the above-described vertical type LED, but can be applied to various LED structures. For example, there may be a horizontal type LED in which a light emitting chip having an electrode is electrically connected to a substrate through a single wire, an LED type in which a light emitting chip having an electrode at a lower portion thereof is flip chip bonded on a substrate, and the like.

In the present invention, the resin and the fluorescent material are simultaneously molded and packaged on the chip element 20 by a single molding process using the packaging material P containing the fluorescent material. Accordingly, it is not necessary to carry out a separate process of dispensing or filling the fluorescent substance again on the chip element 20, so that the molding time can be shortened. Therefore, it is possible to prevent the problem that the fluorescent material is deposited around the chip element 20, thereby improving the luminous efficiency and making the luminance uniform.

In addition, in the present invention, the solid resin powder and the phosphor powder are mixed to produce a solid or a tablet-like packaging material, which is advantageous in that it can be easily stored and transported as compared with a liquid packaging material.

Hereinafter, an example of a packaging apparatus according to an embodiment of the present invention will be described with reference to FIGS. 5 to 8. FIG.

5 is a conceptual illustration of an example of a packaging apparatus according to an embodiment of the present invention. 6 is a view showing a state in which a molten unit and a mold unit of a packaging apparatus according to an embodiment of the present invention are stuck together. 7 is a view showing a lower mold of a mold unit according to an embodiment of the present invention. Here, FIG. 7A is a top view of the lower mold viewed from above, FIG. 7B is a cross-sectional view taken along line A-A 'of FIG. 7A, and FIG. 7C is a cross-sectional view taken along line B-B' of FIG. 7A. 8 is a view showing a lower mold of the mold unit according to the embodiment of the present invention. 8A is a bottom view of the lower mold facing the lower mold, FIG. 8B is a sectional view taken along line C-C 'of FIG. 8A, FIG. 8C is a sectional view taken along the line D-D' Fig.

Hereinafter, a packaging apparatus according to an embodiment of the present invention will be described with reference to Figs. 5 to 8. Fig.

As shown in Figs. 5 and 6, the packaging apparatus includes a melting unit 1000 for melting a solid or a tabular packaging material, a lifting unit (not shown) for lifting and lowering the melting unit 1000, A table 2000 installed on the lower side of the melting unit 1000 and a substrate 10 mounted between the melting unit 1000 and the table 2000 on which the chip element 20 to be packaged is mounted, And a mold unit 3000 for allowing the molten packaging material P to flow from above the chip element 20 onto the chip element 20 to be molded. The mold unit 3000 is seated and detachable on the table 2000.

The molten unit 1000 is installed on the upper side of the mold unit 3000 and is capable of accommodating the packaging material P in the form of a tablet and discharging the molten packaging material P to the mold unit 3000 a heater 1200 for heating the packaging material P in the form of a solid or a tablet packed in the port 1110, a port 1110 provided in the melt body 1100, And a transfer 1300 for applying pressure to the tablet packaging material P, as shown in FIG.

The molten body 1100 is larger than the mold unit 3000, has an area corresponding to the table 2000, and has a shape corresponding to the mold unit 3000, for example, a cross-sectional shape of a square. Of course, the shape of the molten body 1100 is not limited to the above-described rectangle, but can be changed into various shapes corresponding to the mold unit 3000 so that the molten body 1100 can be attached or adhered to the upper part of the mold unit 3000.

A port 1110 according to an embodiment includes a part of the molten body 1100 in a vertical direction And the upper side and the lower side are opened. More specifically, the port 1110 is capable of accommodating the tabular packaging material P, and a space in which the package keying material P is melted communicates with the molten portion 1111 and the lower side of the molten portion 1111 And includes a discharge portion 1112 for discharging the molten packaging material P to the mold unit 3000. The melted portion 1111 is formed to have a larger inner diameter than the packaging material P and the transfer 1300 so that the tabular packaging material P and the transfer 1300 can be received or inserted into the melted portion 1111 An upper side corresponding to the upper surface of the molten body 1100 and a lower side communicating with the discharge portion 1112 are opened. The discharging portion 1112 has a smaller inner diameter than the melting portion 1111 and the packaging material P and the transfer 1300 are formed in such a manner that the tabular packaging material P and the transfer 1300 can not be received and inserted. As shown in FIG. As described above, the upper side of the discharge portion 1112 is opened to be able to communicate with the molten portion 1111 and the lower opening, and the lower side of the discharge portion 1112 is also open to discharge or discharge of the molten packaging material P Respectively. Accordingly, the inside of the port 1110 has a shape provided with a step between the melted portion 1111 and the discharge portion 1112, and the tablet packaging material P is seated on the step or step.

The heater 1200 is installed inside the melt body 1100 and is preferably installed around the port 1110 inside the melt body 1100. The heater 1200 is applicable to various types of heating means capable of melting the packaging material P in the form of a tablet.

The transfer 1300 moves up and down, that is, can move up and down, and applies pressure (or pressing force) to the packaging material P put into the port 1110. The transfer 1300 according to the embodiment includes a rod that can move up and down in the molten portion 1111 and a cylinder connected to the rod, but the present invention is not limited thereto, It is possible to apply various means capable of squeezing the pressure (or pressing force).

The table 2000 is installed on the lower side of the melting unit 1000 so that the mold unit 3000 can be mounted on the upper part. The table 2000 according to the embodiment has a rectangular shape corresponding to the shape of the mold unit, for example, the shape of the transverse section thereof, so as to facilitate the mold unit 3000 at the top. A heater 2100 may be provided in the table 2000.

The mold unit 3000 is positioned between the melting unit 1000 and the table 2000 and is seated on the table 2000 to receive the molten packaging material P from the melting unit 1000, (20). The mold unit 3000 according to the embodiment of the present invention includes a lower mold 3100 on which the substrate 10 on which the chip element 20 is mounted is mounted or supported, and a lower mold 3100 mounted on the upper portion of the lower mold 3100, And an upper mold 3200 for receiving the molten packaging material P from the unit 1000 and molding the molten packaging material P onto the chip element 20.

5, 6, and 7, the lower mold 3100 has a shape corresponding to the upper mold 3200 and is provided on the upper surface of the lower body 3110 on one side facing the upper mold 3200 Mounting portions 3120a and 3120b having a plurality of mounting portions 3121 on which the substrate 10 with the chip element 20 mounted thereon is supported, mounting portions 3120a and 3120b on the upper surface of the lower body 3110, An injection part 3130 serving as a passage so that the liquid packaging material P supplied from the melting unit 1000 can be injected in the direction in which the seating parts 3120a and 3120b are positioned, The lower channels 3140a and 3140b for preventing deformation of the substrate 10 or the lower body 3110 due to heat and hardening of the packaging material P are formed in a groove shape provided between the plurality of mounting portions 3121 on the body 3110, And a fastening member 3150 provided at an edge of the lower body 3110 and fastened to the upper mold 3200.

The lower body 3110 has a shape and an area corresponding to the upper mold 3200 so as to facilitate attachment and fastening with the upper mold 3200 as a lead frame in which the wire bonding is completed, I have. The lower body 3110 according to the embodiment may have a shape in which the cross section is in the shape of a rectangle but is not limited thereto and may be a shape of the upper mold 3200 or a shape in which a plurality of chip elements 20 are mounted on the substrate 10 As shown in FIG.

The mounting portions 3120a and 3120b are provided on the upper surface of the lower body 3110, that is, the surfaces facing the upper mold 3200, and are spaces or regions where the substrate 10 is seated. A plurality of seating portions 3120a and 3120b such as two seating portions 3120a and 3120b are spaced apart from each other and two seating portions (hereinafter, referred to as first and second seating portions 3120a, and 3120b). That is, a first seat portion 3120a is provided on one side of the injection portion 3130 and a second seat portion 3120b is provided on the other side of the injection portion 3130. [ The first seating portion 3120a and the second seating portion 3120b have the same shape and configuration. Each of the first and second mounting portions 3120a and 3120b includes a plurality of mounting portions 3121 which are a plurality of regions in which a plurality of chip elements 20 are spaced apart and mounted. The plurality of mounting portions 3121 are arranged in at least one direction. In the lower mold 3100 according to the embodiment, the plurality of mounting portions 3121 are arranged in the long side direction and the short side direction of the lower body 3110 . More specifically, when a plurality of mounting portions 3121G are arranged in the long side direction of the lower body 3110, a plurality of mounting portion groups 3121G are arranged in the short side direction of the lower body 3110 . In other words, the mounting portion group 3121G composed of the plurality of mounting portions 3121 is arranged in a plurality of rows in the short side direction of the lower body 3110. [

The injection unit 3130 includes a main groove 3131 corresponding to a lower side of a discharge portion of an upper mold 3200 to be described later and a pair of right and left grooves 3120a and 3120b branched from the main groove 3131 Runners 3132a and 3132b and a pair of lower gates 3133a and 3133b provided to communicate with the ends of the pair of runners 3132a and 3132b. The main groove 3131 is provided at the center of the lower body 3110 or between the two seating portions 3120a and 3120b and the first runner 3132a extends from the main groove 3131 to the first seating portion And the second runner 3132b is extended from the main groove 3131 in the direction in which the second seating portion 3120b is located. The lower gates 3133a and 3133b extend in a direction intersecting the extending direction of the runners 3132a and 3132b and the first lower gate 3133a is connected to the end of the first runner 3132a, And the lower gate 3133b is connected to the end of the second runner 3132b.

The lower channels 3140a and 3140b are formed in an upward direction in which the upper mold 3200 is located in the region of the seating portions 3120a and 3120b of the lower body 3110. The lower channels 3140a and 3140b are disposed in a direction in which the plurality of mounting portions 3121 are arranged, And extends in the longitudinal direction of the lower body 3110. In the embodiment, the plurality of mounting portions 3121G are arranged in the short side direction of the lower body 3110, so that a plurality of lower channels 3140a and 3140b are provided. The plurality of lower channels 3140a and 3140b are arranged in a direction in which the plurality of mounting portion groups 3121G are arranged so as to be positioned between the outside of the mounting portion group 3121G and the mounting portion group 3121G, . At this time, in the embodiment, the lower channels 3140a and 3140b are formed between the two mounting part groups 3121G and the other mounting part groups 3121G, and the mounting part group 3121G located on the outermost side of both sides is formed. And lower channels 3140a and 3140b are further provided on the outer sides of the lower channels 3140a and 3140b. That is, a first lower channel 3140a is provided between the two mounting portion groups 3121G and the other two mounting portions 3121G on the first mounting portion 3120a, and a second lower mounting portion 3120b is formed on the second mounting portion 3120b. And a second lower channel 3140b is provided between the mounting portion group 3121G and the other mounting portion group 3121G.

The fastening member 3150 is a means provided to allow the upper mold 3200 to be easily seated and fastened to the upper portion of the lower body 3110. For example, Respectively. More specifically, they are provided in the outer peripheral region of the first seating portion 3120a and the outer peripheral region of the second seating portion 3120b, respectively, and they are inserted into the coupling groove 3280 provided in the upper mold described later.

Referring to FIGS. 5, 6 and 8, the upper mold 3200 has a shape corresponding to the lower body 3110 and includes an upper body 3210 to be joined or fastened to the lower body 3110 in the molding process, The upper body 3210 is provided to penetrate the upper body 3210 so as to communicate with the port 1110 provided in the unit 1000 and to discharge the molten packaging material P to the injection part 3130 of the lower mold 3100 3120b on the lower surface of the upper body 3210 opposed to the discharge part 3220 and the lower body 3110 and covers the upper part of the chip element 20, Molding parts 3250a and 3250b having a plurality of cavities 3251 which are empty spaces in which the packaging material P is filled and molded parts 3250a and 3250b on the lower surface of the upper body 3210, 3250b, and at least a portion thereof is formed to correspond to the lower gates 3133a, 3133b provided in the lower mold 3100, The upper gates 3230a and 3230b for causing the packaging material P introduced from the negative gates 3133a and 3133b to flow in the direction in which the molding portions 3250a and 3250b are positioned, (3240a, 3240b) for allowing the air (P) to flow into each cavity (3251). The upper mold 3200 is formed in a groove shape provided between the plurality of cavities 3251 on the upper body 3210 so that the deformation of the substrate 10 and the upper body 3210 due to heat and hardening of the packaging material P The upper channels 3270a and 3270b and the upper gates 3230a and 3230b are provided on one side of the molding portions 3250a and 3250b so as to be provided on the other side of the molding portions 3250a and 3250b, The packaging material P includes the dummy grooves 3260a and 3260b which are acceptable.

The upper body 3210 has a shape and an area corresponding to the lower body 3110 so that the upper body 3210 can be easily attached and fastened to the lower body 3110. The upper body 3210 according to the embodiment may have a rectangular cross-sectional shape, but is not limited thereto. The upper body 3210 may be deformed into a variety of shapes corresponding to the arrangement of the cavities 3251 or the lower body 3110 .

The discharging unit 3220 includes a discharging unit 1112 disposed at the upper side and a part of the upper body 3210 communicating with the injecting unit 3130 of the lower mold 3100 disposed at the lower side in the vertical direction Respectively. That is, the discharging portion 3220 is a hole type provided so as to vertically penetrate the upper body 3210. The upper opening corresponds to the discharging portion 1112 and the lower opening corresponds to the main groove 3131 of the injecting portion 3130. [ As shown in Fig.

The molding parts 3250a and 3250b are provided in a number corresponding to the seating parts 3120a and 3120b and two molding parts 3250a and 3250b are provided so as to correspond to the two seating parts 3120a and 3120b in the embodiment . That is, the first molding part 3250a is provided on one side of the lower body 3110 so as to correspond to the first seating part 3120a with respect to the discharge part 3220, and the second molding part 3250a is provided on the other side of the discharge part 3220, The molding portion 3250b is provided so as to be positioned in correspondence with the second seat portion 3120b. The discharge portion 3220 is preferably located at the center between the first molding portion 3250a and the second molding portion 3250b.

The first molding part 3250a and the second molding part 3250b have the same shape and configuration. Each of the first and second molding portions 3250a and 3250b has a plurality of cavities 3251 having a space into which the molten packaging material P can be injected. The plurality of cavities 3251 are arranged on the lower surface of the upper body 3210 so as to correspond to the directions and shapes in which the plurality of mounting portions 3121 are arranged. That is, the cavity 3251 is provided in a number corresponding to the plurality of mounting portions 3121, and when the lower body 3110 and the upper body 3210 are attached to each other, the cavity 3251 is formed on the upper side of each of the plurality of mounting portions 3121 A plurality of cavities 3251 are arranged so as to be positioned. Accordingly, the plurality of cavities 3251 according to the embodiment are formed to be aligned in the long side direction and the short side direction of the upper body 3210, respectively.

The cavity 3251 has an internal space into which the packaging material P is introduced and into which the chip device 20 can be accommodated and the direction in which the chip device 20 is located, . The cavity 3251 has a shape corresponding to that of the packaging part 40 to be molded. The cavity 3251 according to the embodiment has a hemispherical shape that is convex in the upward direction of the chip element 20. Of course, the shape of the cavity 3251 is not limited to the hemispherical shape described above, but may be variously changed according to the shape of the packaging part 40 to be molded.

A plurality of cavity groups 3251G are arranged in the direction of the short side of the upper body 3210 when the plurality of cavities 3251 are arranged in the long side direction on the lower surface of the upper body 3210 as a cavity group 3251G do. In other words, the cavity groups 3251G consisting of the plurality of cavities 3251 are arranged in a plurality of rows in the short side direction of the upper body 3210. [

The upper gates 3230a and 3230b are provided to correspond to the molding portions 3250a and 3250b and the first upper gate 3230a is provided with a plurality of grooves 3250a and 3250b for moving or supplying the packaging material P to the first molding portion 3250a. And the first upper gate 3230a is a flow path for moving or supplying the packaging material P to the first molding portion 3250a.

The first upper gate 3230a and the second upper gate 3230b have the same shape and configuration. Each of the first and second upper gates 3230a and 3230b is formed between the discharge portion 3220 and the molding portions 3250a and 3250b in a direction in which the plurality of cavities 3251 constituting the molding portions 3250a and 3250b are arranged Shaped main passage 3231 extending between the main passage 3231 and the molding portions 3250a and 3250b and each end of the main passage 3231 is connected to the main passage 3231 so that the molding portions 3250a and 3250b And a plurality of auxiliary flow paths 3132 spaced apart from each other in a direction in which the main flow path 3231 extends.

That is, the first upper gate 3230a is located between the discharge portion 3220 and the first molding portion 3250a and extends in one direction in which the plurality of cavities 3251 are arranged, for example, in the short side direction of the upper body 3210 The first main passage 3231 is connected to the first main passage 3231 and extends in the direction in which the first molding portion 3250a is located and is spaced apart in the extending direction of the first main passage 3231 And includes a first auxiliary flow path 3232 arranged in a row. Likewise, the second upper gate 3230b is located between the discharge portion 3220 and the second molding portion 3250b and extends in one direction in which the plurality of cavities 3251 are arranged, for example, in the short side direction of the upper body 3210 The second main flow path 3231 is connected to the second main flow path 3231 and extends in the direction in which the second molding part 3250b is located and is spaced apart in the extending direction of the second main flow path 3231 And a second auxiliary flow path 3232 arranged in a row.

Each of the first and second main flow paths 3231 has an inner space through which the packaging material P can flow and is opened in a direction in which the lower body 3110 is located on the lower surface of the upper body 3210. The main flow path 3231 according to the embodiment of the present invention is formed to extend in the short side direction of the upper body 3210. The main flow path 3231 includes a plurality of cavity groups 3251G whose both ends are arranged in the short side direction, It is preferable to extend so as to be positioned corresponding to the second lens 3251G.

The first and second auxiliary flow paths 3132 have an inner space through which the packaging material P can flow and are opened in a direction in which the lower body 3110 is located on the lower surface of the upper body 3210, And the molding portions 3250a and 3250b. The auxiliary flow path 3132 is extended from the main flow path 3231 in the direction in which the molding portions 3250a and 3250b are located to move the packaging material P introduced into the auxiliary flow path 3132 toward the molding portion It serves as a supply. In the embodiment, a plurality of auxiliary flow paths 3132 are provided, and they are provided in a number corresponding to the number of the plurality of cavity groups 3251G arranged in the short side direction. The plurality of auxiliary flow paths 3132 are arranged so as to correspond to the direction in which the plurality of cavity groups 3251G are arranged, and are respectively connected to the main flow path 3231. [

The connection flow paths 3240a and 3240b supply the packaging material P introduced from the upper gates 3230a and 3230b to the molding portions 3250a and 3250b to supply the auxiliary flow path 3132 with the cavity 3251 and the cavity 3251 And the cavity 3251, as shown in Fig. Hereinafter, for convenience of explanation, one cavity group 3251G of the plurality of cavity groups 3251G arranged in the short side direction will be described with reference to the connection flow paths 3240a and 3240b. The one cavity group 3251G is constituted by a plurality of cavities 3251 arranged in the longitudinal direction of the upper body 3210 as described above and the plurality of connection channels 3240a and 3240b are provided for one cavity group 3251G do. That is, the connection flow paths 3240a and 3240b are formed between the auxiliary flow path 3132 corresponding to the outside of the one cavity group 3251G and the cavity 3251 positioned closest to the auxiliary flow path 3132, And the cavity 3251. The connection paths 3240a and 3240b have an internal space through which the packaging material P can flow and are opened in a direction in which the lower body 3110 is located on the lower surface of the upper body 3210. [ At this time, it is preferable that the depths of the connection flow paths 3240a and 3240b are formed to be lower than those of the upper gates 3230a and 3230b and the cavity 3251.

The upper channels 3270a and 3270b are formed in the lower part of the molding part 3250a and 3250b of the upper body 3210 in a downward direction in which the lower mold 3100 is located and in a direction in which the plurality of cavities 3251 are arranged, Direction. More preferably, upper channels 3270a and 3270b are provided at positions corresponding to the lower channels 3140a and 3140b.

A plurality of upper channels 3270a and 3270b are provided to effectively prevent the deformation of the substrate 10 and the upper body 3210 because a plurality of cavity groups 3251G are provided in the embodiment. The plurality of upper channels 3270a and 3270b are arranged such that a plurality of the cavity groups 3251G are arranged in the direction in which the cavity groups 3251G are arranged and in the short side direction of the upper body 3210 so as to be positioned between the cavity groups 3251G and the cavity group 3251G. . At this time, in the embodiment, the upper channels 3270a and 3270b are formed between the two cavity groups 3251G and the other two cavity groups 3251G, and the upper channels 3270a and 3270b are formed outside the cavity group 3251G at the outermost sides Upper channels 3270a and 3270b are further provided.

The dummy grooves 3260a and 3260b are grooves that receive the remaining or surplus packaging material P after the packaging material P is introduced from the upper gates 3230a and 3230b and filled with the plurality of cavities 3251 . These dummy grooves 3260a and 3260b are provided on the other side of the molding portions 3250a and 3250b facing the upper gates 3230a and 3230b and more specifically two upper channels 3270a and 3270b, Respectively.

The fastening groove 3280 is a space into which the fastening member 3150 is inserted so that the lower body 3110 can be easily seated and fastened to the upper body 3210. The fastening groove 3280 is formed in a shape corresponding to the fastening member 3150 at the edge of the upper body 3210 .

Hereinafter, a method of manufacturing an electronic device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8. FIG.

First, as shown in FIGS. 1 and 2, a plurality of light emitting chips are mounted on a substrate 10 by a die bonding method, and each of the light emitting chips and a cathode terminal And wire bonding for electrically connecting the negative terminal. Thereafter, a heat resistant primer is coated to cover at least the light emitting chip and the surface of the wire in several angstroms. In an embodiment, the primer is sprayed by spraying, and the primer may be, for example, silicon.

Subsequently, the substrate 10 on which the plurality of chip elements 20 are mounted is placed on the lower mold 3100 of the packaging apparatus. At this time, it is preferable that the substrate 10 is placed on each of the first and second seating portions 3120a and 3120b provided on the upper portion of the lower mold 3100. When the substrate 10 is placed on the lower mold 3100, the upper mold 3200 is mounted on or adhered to the lower mold 3100, as shown in FIGS. 5 and 6, So that the first and second molding parts 3250a and 3250b provided on the lower surface face the lower mold 3100. The molding portions 3250a and 3250b are positioned above the first and second seating portions 3120a and 3120b of the lower mold 3100, respectively.

Further, the molten unit 1000 is lowered so that the lower part of the molten unit 1000 is attached to or adhered to the upper part of the upper mold 3200.

The prepared solid or tabular packaging material P is put into the molten portion 1111 of the port 1110 and the heater 1200 of the molten unit 1000 is operated to heat the packaging material P at 120 ° C to The transfer material 1300 is lowered while applying pressure to the packaging material P while heating to 180 캜, more preferably 150 캜 to 180 캜. The liquid packaging material P is discharged from the discharging portion 1100 of the upper mold 3200 through the discharging portion 1112 located below the melting portion 1111 3220).

The transfer 1300 is a process in which the packaging material P passes through the first and second top gates 3230a and 3230b of the upper mold 3200 to form a plurality of cavities 3251 of the first and second molding portions 3250a and 3250b ) Until it is filled. The falling time or the falling speed of the transfer 1300 can be changed according to the array length of the cavity 3251 and the number of the cavities 3251.

The liquid packaging material P supplied to the discharge portion 3220 of the upper mold 3200 is filled in the main groove 3131 of the injection portion 3130 provided in the lower mold 3100. When the packaging material P is continuously discharged from the discharge portion 3220, the packaging material P filled in the main groove 3131 flows through the first and second runners 3132a and 3132b branched in both directions And moves to the first and second lower gates 3133a and 3133b. The packaging material P of the lower gates 3133a and 3133b is filled in the first and second sub-gates 3133a and 3133b provided in the upper mold 3200 when the packaging material P is filled to a depth equal to or more than the depths of the first and second sub- And then flows into the second upper gate 3230a and 3230b. The packaging material of the upper gates 3230a and 3230b flows through the connection flow paths 3240a and 3240b and is supplied to fill the plurality of cavities 3251. [

The excess packaging material P that has flowed into the molding parts 3250a and 3250b and fills the plurality of cavities 3251 is accommodated in the plurality of dummy grooves 3260a and 3260b.

When the predetermined time has elapsed after the packaging material P is filled in each of the plurality of cavities 3251, the packaging material P is cured to complete the molding, and a semi-spherical packaging unit (40) is formed.

In the present invention, the upper channels 3270a and 3270b and the lower channels 3270b and 3270b may be deformed while the packaging material P is filled in the plurality of cavities 3251 and hardened. 3140a, and 3140b, the movement of the heat of the packaging material P is cut off or minimized, so that deformation of the substrate 10 can be prevented.

Further, in the present invention, by molding the packaging material P containing a fluorescent material, it is not necessary to perform a separate process of dispensing or filling the fluorescent substance again on the chip element 20, and the molding time can be shortened have. Thus, it is possible to prevent the problem that the fluorescent material is deposited around the chip element 20, thereby improving the luminous efficiency and making the luminance uniform.

10: substrate 20: chip element
40:
1000: melting unit 3000: mold unit
3100: lower mold 3130: injection part
3131: main groove 3132a, 3132b: runner
3133a, 3133b: bottom gate 3140a, 3140b: channel
3200: upper mold 3220:
3230a, 3230b: upper gate 3240a, 3240b:
32501: Cavity 3260a, 3260b: Dummy groove
3270a, 3270b: upper channel

Claims (10)

A packaging remanufacturing method for packaging a light emitting chip,
Preparing a solid resin powder and a phosphor powder;
Mixing the solid resin powder and the phosphor powder to prepare a mixed powder; And
Preparing a tablet by molding the mixed powder;
≪ / RTI > The method according to claim 1,
In the process of manufacturing the tablet,
Charging the mixed powder into the inner space of the mold;
Preparing a tablet having a shape corresponding to the inner space of the forming die by applying heat and pressure to the mixed powder charged in the forming die;
≪ / RTI > The method of claim 2,
Wherein the temperature applied to the mixed powder charged in the forming mold is 50 ° C to 120 ° C. The method of claim 2,
Wherein the pressure applied to the mixed powder charged in the mold is 100 to 300 mPa. The method of claim 2,
Wherein the tablet has a shape of a circle, an ellipse, or a polygon. The method according to any one of claims 1 to 6,
Wherein the solid resin powder and the phosphor powder are mixed in an amount of 80 wt% to 85 wt% and 15 wt% to 20 wt%, respectively, based on 100 wt% Way. A method of manufacturing an electronic device for packaging a chip element emitting light,
Preparing a packaging material made of a solid state tablet by mixing the solid resin powder and the phosphor powder;
Bonding the chip element on a substrate; And
Molding the packaging material so as to cover the upper side of the chip element;
/ RTI >
The step of molding to cover the chip element includes:
Installing the chip device in a mold unit;
Injecting the tablet-like packaging material into the mold unit; And
Melting the packaging material in the form of a tablet in the mold unit, injecting the molten packaging material so as to cover the upper portion of the chip device, and curing the packaging material covering the chip device;
/ RTI > The method of claim 7,
And applying heat to the tablet-like packaging material in a process of melting the tablet-like packaging material at a temperature of 120 ° C to 180 ° C. The method of claim 8,
And applying a pressing force to the tablet-like packaging material while applying heat to the tablet-like packaging material at 120 ° C to 180 ° C. The method of claim 7,
Wherein the mold unit comprises: a lower mold on which the substrate on which the chip element is mounted is seated; And
An upper mold provided at an upper side of the lower mold and covering the chip element and having a cavity filled with the packaging material melted therein;
Lt; / RTI >
The heat transfer of the molten packaging material to at least one of the periphery of the lower mold facing the substrate and the periphery of the cavity around the mounting portion where the substrate is seated and the lower surface of the upper mold facing the lower mold is blocked And a channel for preventing thermal deformation of the substrate is provided.

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