KR20160091962A - Composition - Google Patents
Composition Download PDFInfo
- Publication number
- KR20160091962A KR20160091962A KR1020167017094A KR20167017094A KR20160091962A KR 20160091962 A KR20160091962 A KR 20160091962A KR 1020167017094 A KR1020167017094 A KR 1020167017094A KR 20167017094 A KR20167017094 A KR 20167017094A KR 20160091962 A KR20160091962 A KR 20160091962A
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- composition
- mass
- dicarboxylic acid
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 74
- -1 dicarboxylic acid diester Chemical class 0.000 claims abstract description 61
- 239000000178 monomer Substances 0.000 claims abstract description 22
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 15
- 239000003999 initiator Substances 0.000 claims abstract description 14
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 13
- 125000003396 thiol group Chemical class [H]S* 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 119
- 239000000853 adhesive Substances 0.000 claims description 47
- 230000001070 adhesive effect Effects 0.000 claims description 47
- 239000011342 resin composition Substances 0.000 claims description 27
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 21
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 14
- 229920006295 polythiol Polymers 0.000 claims description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 10
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 9
- 239000004417 polycarbonate Substances 0.000 claims description 9
- 229920000515 polycarbonate Polymers 0.000 claims description 9
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 7
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 229920002313 fluoropolymer Polymers 0.000 claims description 4
- 239000004811 fluoropolymer Substances 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 abstract description 8
- 229920005862 polyol Polymers 0.000 description 34
- 238000012360 testing method Methods 0.000 description 34
- 238000001723 curing Methods 0.000 description 30
- 150000001875 compounds Chemical class 0.000 description 25
- 150000003077 polyols Chemical class 0.000 description 23
- 239000005062 Polybutadiene Substances 0.000 description 20
- 229920002857 polybutadiene Polymers 0.000 description 20
- 238000000034 method Methods 0.000 description 18
- 239000000047 product Substances 0.000 description 14
- 239000005056 polyisocyanate Substances 0.000 description 13
- 229920001228 polyisocyanate Polymers 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 10
- 150000003573 thiols Chemical class 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 8
- 229920005906 polyester polyol Polymers 0.000 description 8
- 230000005484 gravity Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 6
- 238000000016 photochemical curing Methods 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 239000001361 adipic acid Substances 0.000 description 5
- 235000011037 adipic acid Nutrition 0.000 description 5
- 238000002845 discoloration Methods 0.000 description 5
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 5
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical class CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000007859 condensation product Substances 0.000 description 3
- 229940031569 diisopropyl sebacate Drugs 0.000 description 3
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical group CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 3
- XFKBBSZEQRFVSL-UHFFFAOYSA-N dipropan-2-yl decanedioate Chemical compound CC(C)OC(=O)CCCCCCCCC(=O)OC(C)C XFKBBSZEQRFVSL-UHFFFAOYSA-N 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 2
- HBTAOSGHCXUEKI-UHFFFAOYSA-N 4-chloro-n,n-dimethyl-3-nitrobenzenesulfonamide Chemical compound CN(C)S(=O)(=O)C1=CC=C(Cl)C([N+]([O-])=O)=C1 HBTAOSGHCXUEKI-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- JKRZOJADNVOXPM-UHFFFAOYSA-N Oxalic acid dibutyl ester Chemical compound CCCCOC(=O)C(=O)OCCCC JKRZOJADNVOXPM-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical group CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 2
- HMOFGLGHQFZQDS-UHFFFAOYSA-N bis(2-methylpropyl) decanedioate Chemical compound CC(C)COC(=O)CCCCCCCCC(=O)OCC(C)C HMOFGLGHQFZQDS-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- 229940031578 diisopropyl adipate Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VBQMTEHUPQSMFY-UHFFFAOYSA-N (2-diethoxyphosphorylphenyl)-(2,4,6-trimethylphenyl)methanone Chemical compound CCOP(=O)(OCC)c1ccccc1C(=O)c1c(C)cc(C)cc1C VBQMTEHUPQSMFY-UHFFFAOYSA-N 0.000 description 1
- RGCVYEOTYJCNOS-UHFFFAOYSA-N (4-cyano-2-methylphenyl)boronic acid Chemical compound CC1=CC(C#N)=CC=C1B(O)O RGCVYEOTYJCNOS-UHFFFAOYSA-N 0.000 description 1
- ASJSTPTYZKPRTF-UHFFFAOYSA-N (6-diethoxyphosphoryl-2,3,4-trimethylphenyl)-phenylmethanone Chemical compound CCOP(=O)(OCC)c1cc(C)c(C)c(C)c1C(=O)c1ccccc1 ASJSTPTYZKPRTF-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- CICDSZCELMNDRA-UHFFFAOYSA-N 10-(2-ethylhexoxy)-10-oxodecanoic acid Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(O)=O CICDSZCELMNDRA-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 2,3-dimethylbutane Chemical group CC(C)C(C)C ZFFMLCVRJBZUDZ-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- DFYQRCOZAAHDOU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;2-[2-(2-hydroxyethoxy)ethoxy]ethanol Chemical compound OCCOCCO.OCCOCCOCCO DFYQRCOZAAHDOU-UHFFFAOYSA-N 0.000 description 1
- YWEJNVNVJGORIU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-hydroxy-2-phenylacetate Chemical compound OCCOCCOC(=O)C(O)C1=CC=CC=C1 YWEJNVNVJGORIU-UHFFFAOYSA-N 0.000 description 1
- DUGUUGONTBUPHJ-UHFFFAOYSA-N 2-[2-(2-phenylacetyl)oxyethoxy]ethyl 2-oxo-2-phenylacetate Chemical compound C=1C=CC=CC=1C(=O)C(=O)OCCOCCOC(=O)CC1=CC=CC=C1 DUGUUGONTBUPHJ-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- DMXBZAANBCMUMR-UHFFFAOYSA-N 2-oxo-2-propoxyacetic acid Chemical compound CCCOC(=O)C(O)=O DMXBZAANBCMUMR-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 1
- LADUTIDKCQPHJG-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-propylphenol Chemical compound CCCC1=CC(C)=C(O)C(C(C)(C)C)=C1 LADUTIDKCQPHJG-UHFFFAOYSA-N 0.000 description 1
- QSHVAZMOLNGWSY-UHFFFAOYSA-N 3-butyl-4-methoxyphenol Chemical compound CCCCC1=CC(O)=CC=C1OC QSHVAZMOLNGWSY-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- PCOCFIOYWNCGBM-UHFFFAOYSA-M 4-[(2-methylpropan-2-yl)oxy]-4-oxobutanoate Chemical compound CC(C)(C)OC(=O)CCC([O-])=O PCOCFIOYWNCGBM-UHFFFAOYSA-M 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- PDOSDCQRPAABHW-UHFFFAOYSA-N 4-oxo-4-propoxybutanoic acid Chemical compound CCCOC(=O)CCC(O)=O PDOSDCQRPAABHW-UHFFFAOYSA-N 0.000 description 1
- MBGYSHXGENGTBP-UHFFFAOYSA-N 6-(2-ethylhexoxy)-6-oxohexanoic acid Chemical compound CCCCC(CC)COC(=O)CCCCC(O)=O MBGYSHXGENGTBP-UHFFFAOYSA-N 0.000 description 1
- UJUCBOIXAMPUQL-UHFFFAOYSA-N 7-aminothieno[2,3-b]pyrazine-6-carboxylic acid Chemical compound C1=CN=C2C(N)=C(C(O)=O)SC2=N1 UJUCBOIXAMPUQL-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- WMONOXOCMIPNNU-UHFFFAOYSA-N C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O Chemical compound C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O WMONOXOCMIPNNU-UHFFFAOYSA-N 0.000 description 1
- PLNRJAOPKDGABD-UHFFFAOYSA-N CC1=C(C(=O)C2=C(C=CC=C2)P(OC)(OC)=O)C(=CC(=C1)C)C Chemical compound CC1=C(C(=O)C2=C(C=CC=C2)P(OC)(OC)=O)C(=CC(=C1)C)C PLNRJAOPKDGABD-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- YUXIBTJKHLUKBD-UHFFFAOYSA-N Dibutyl succinate Chemical compound CCCCOC(=O)CCC(=O)OCCCC YUXIBTJKHLUKBD-UHFFFAOYSA-N 0.000 description 1
- DKMROQRQHGEIOW-UHFFFAOYSA-N Diethyl succinate Chemical compound CCOC(=O)CCC(=O)OCC DKMROQRQHGEIOW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- LOMVENUNSWAXEN-UHFFFAOYSA-N Methyl oxalate Chemical compound COC(=O)C(=O)OC LOMVENUNSWAXEN-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- DRUKNYVQGHETPO-UHFFFAOYSA-N Nonanedioic acid dimethyl ester Natural products COC(=O)CCCCCCCC(=O)OC DRUKNYVQGHETPO-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 150000007860 aryl ester derivatives Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- SWQUTKGVXGTROS-UHFFFAOYSA-N bis(2-ethoxyethyl) butanedioate Chemical compound CCOCCOC(=O)CCC(=O)OCCOCC SWQUTKGVXGTROS-UHFFFAOYSA-N 0.000 description 1
- WMNULTDOANGXRT-UHFFFAOYSA-N bis(2-ethylhexyl) butanedioate Chemical compound CCCCC(CC)COC(=O)CCC(=O)OCC(CC)CCCC WMNULTDOANGXRT-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940100539 dibutyl adipate Drugs 0.000 description 1
- IQYKLRJIMOPPKB-UHFFFAOYSA-N dibutyl heptanedioate Chemical compound CCCCOC(=O)CCCCCC(=O)OCCCC IQYKLRJIMOPPKB-UHFFFAOYSA-N 0.000 description 1
- 229960002097 dibutylsuccinate Drugs 0.000 description 1
- TZAMQIAPGYOUKF-UHFFFAOYSA-N diethoxyphosphoryl(phenyl)methanone Chemical compound CCOP(=O)(OCC)C(=O)C1=CC=CC=C1 TZAMQIAPGYOUKF-UHFFFAOYSA-N 0.000 description 1
- OUWSNHWQZPEFEX-UHFFFAOYSA-N diethyl glutarate Chemical compound CCOC(=O)CCCC(=O)OCC OUWSNHWQZPEFEX-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- LKKOGZVQGQUVHF-UHFFFAOYSA-N diethyl heptanedioate Chemical compound CCOC(=O)CCCCCC(=O)OCC LKKOGZVQGQUVHF-UHFFFAOYSA-N 0.000 description 1
- WYACBZDAHNBPPB-UHFFFAOYSA-N diethyl oxalate Chemical compound CCOC(=O)C(=O)OCC WYACBZDAHNBPPB-UHFFFAOYSA-N 0.000 description 1
- VIGLJKSIDLNMGH-UHFFFAOYSA-N dihexyl oxalate Chemical compound CCCCCCOC(=O)C(=O)OCCCCCC VIGLJKSIDLNMGH-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SHWINQXIGSEZAP-UHFFFAOYSA-N dimethyl heptanedioate Chemical compound COC(=O)CCCCCC(=O)OC SHWINQXIGSEZAP-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- PEJVLWCOQVHCAF-UHFFFAOYSA-N dioctyl oxalate Chemical compound CCCCCCCCOC(=O)C(=O)OCCCCCCCC PEJVLWCOQVHCAF-UHFFFAOYSA-N 0.000 description 1
- XVKKIGYVKWTOKG-UHFFFAOYSA-N diphenylphosphoryl(phenyl)methanone Chemical compound C=1C=CC=CC=1P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 XVKKIGYVKWTOKG-UHFFFAOYSA-N 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- YPLYFEUBZLLLIY-UHFFFAOYSA-N dipropan-2-yl butanedioate Chemical compound CC(C)OC(=O)CCC(=O)OC(C)C YPLYFEUBZLLLIY-UHFFFAOYSA-N 0.000 description 1
- MCQNUBHLBYBDRS-UHFFFAOYSA-N dipropan-2-yl nonanedioate Chemical compound CC(C)OC(=O)CCCCCCCC(=O)OC(C)C MCQNUBHLBYBDRS-UHFFFAOYSA-N 0.000 description 1
- ITHNIFCFNUZYLQ-UHFFFAOYSA-N dipropan-2-yl oxalate Chemical compound CC(C)OC(=O)C(=O)OC(C)C ITHNIFCFNUZYLQ-UHFFFAOYSA-N 0.000 description 1
- QRVSDVDFJFKYKA-UHFFFAOYSA-N dipropan-2-yl propanedioate Chemical compound CC(C)OC(=O)CC(=O)OC(C)C QRVSDVDFJFKYKA-UHFFFAOYSA-N 0.000 description 1
- HUVBTIZUJMDKKQ-UHFFFAOYSA-N dipropyl octanedioate Chemical compound CCCOC(=O)CCCCCCC(=O)OCCC HUVBTIZUJMDKKQ-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- QSVAYRBPFFOQMK-UHFFFAOYSA-N ditert-butyl hexanedioate Chemical compound CC(C)(C)OC(=O)CCCCC(=O)OC(C)(C)C QSVAYRBPFFOQMK-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- XVKLLVZBGMGICC-UHFFFAOYSA-N o-[3-propanethioyloxy-2,2-bis(propanethioyloxymethyl)propyl] propanethioate Chemical compound CCC(=S)OCC(COC(=S)CC)(COC(=S)CC)COC(=S)CC XVKLLVZBGMGICC-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- PWGIEBRSWMQVCO-UHFFFAOYSA-N phosphono prop-2-enoate Chemical compound OP(O)(=O)OC(=O)C=C PWGIEBRSWMQVCO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1812—C12-(meth)acrylate, e.g. lauryl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/106—Esters of polycondensation macromers
- C08F222/1065—Esters of polycondensation macromers of alcohol terminated (poly)urethanes, e.g. urethane(meth)acrylates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/11—Esters; Ether-esters of acyclic polycarboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
심부 경화성이 뛰어난 조성물을 제공한다.
하기 (P) , (C) 내지 (F) 을 함유한 조성물.
(P) 중합성 비닐 모노머, (C) 광중합 개시제, (D) 산화방지제, (E)티올, (F) 디카르복실산 디에스테르.A composition having excellent deep curability is provided.
A composition comprising (P), (C) to (F)
(P) a polymerizable vinyl monomer, (C) a photopolymerization initiator, (D) an antioxidant, (E) a thiol, and (D) a dicarboxylic acid diester.
Description
본 발명은 조성물에 관한 것이다 .The present invention relates to compositions.
LCD (액정 디스플레이) 등의 표시체 위에 탑재하는 터치패널로서 저항막식, 정전용량식, 전자유도식, 광학식 등이 있다. 이들의 터치패널의 표면에 외관의 디자인성을 부여하는 화장판이나 터치하는 위치를 지정하는 아이콘 시트를 첩합(貼合)하는 경우가 있다. 정전용량식 터치패널은 투명기판 위에 투명전극을 형성하고 그 위에 투명판이 첩합되는 구조를 가지고 있다.A touch panel mounted on a display body such as an LCD (liquid crystal display) or the like includes a resistive film, a capacitance type, an electromagnetic induction type, and an optical type. There is a case where a bright plate for giving a design of appearance to the surface of these touch panels or an icon sheet for designating a position to be touched is stuck (pasted). The capacitive touch panel has a structure in which a transparent electrode is formed on a transparent substrate and a transparent plate is bonded on the transparent electrode.
종래, 화장판과 터치패널과의 첩합, 아이콘시트와 터치패널과의 첩합, 및 투명기판과 투명판과의 첩합에서는 접착제를 사용하고 있다.Conventionally, an adhesive is used for bonding a bright plate and a touch panel, bonding an icon sheet and a touch panel, and bonding a transparent substrate and a transparent plate.
이러한 아이콘시트나 터치패널은 표시체의 구동용IC나 배선이나 LCD의 테두리 밀봉제를 감추고 표시 구역만을 드러나게 했고, 디자인성을 향상시키기 위하여, 차광 테두리를 인쇄 등으로 피복하는 경우가 있다. 이런 차광 테두리가 있으면 차광 테두리 아래의 광경화성 접착제 조성물은 차광 테두리에 의해 빛이 가려져 빛이 비추지 못함으로 인하여 경화되지 않기 때문에 접착이 불충분 하다.Such an icon sheet or a touch panel hides the driving IC or wiring of the display body or the rim sealing agent of the LCD and exposes only the display area. In order to improve the design property, the shielding frame may be covered with printing or the like. If such a shading frame is present, the photocurable adhesive composition under the shading frame is insufficiently adhered because it is not cured due to shading of light due to the shading frame.
이러한 미경화에 의한 불충분한 접착문제를 해결하기 위하여 빛을 경사지게 혹은 옆으로부터 조사하는 등 빛의 조사각도를 조정하는 방법이나 광경화성 접착제 조성물에 열경화성 촉매를 첨가하여 광경화성 이외에 열경화성을 부여하고 빛과 열로 경화하는 방법 등이 사용되고 있다.In order to solve this insufficient adhesion problem due to uncured curing, there is a method of adjusting the irradiation angle of light such as light inclination or lateral irradiation, or a method of adding a thermosetting catalyst to the photo- And a method of curing by heat are used.
그러나 광선의 조사각도를 조정하는 방법에서는 차광 테두리의 폭이 넓어지므로 인해 차광 테두리 아래의 광경화성 접착제 조성물 전체를 충분히 경화시키는 것이 어려워지고, 미경화 부분이 잔존하기 쉽다는 과제가 존재한다. 광경화성 접착제 조성물에 열경화성을 부여하여 빛과 열로 경화하는 방법은 LCD, EL디스플레이, LED디스플레이 등의 표시패널을 60 내지 80℃에서 30 내지 60분 가열할 필요가 있기 때문에 품질의 악화, 상품수명을 짧게 하는 등의 우려가 있는 과제가 존재한다.However, in the method of adjusting the irradiation angle of the light beam, since the width of the light shielding frame is widened, it is difficult to sufficiently cure the entire photo-curable adhesive composition under the light shielding frame, and there is a problem that uncured portions are likely to remain. The method of applying the photo-curable adhesive composition to thermosetting and curing with light and heat requires heating the display panel of LCD, EL display, LED display, etc. at 60 to 80 ° C for 30 to 60 minutes, There is a problem that there is a concern such as shortening.
특허문헌 1은 (A) 폴리이소프렌, 폴리부타디엔 또는 폴리우레탄을 골격으로 하는 (메타)아크릴레이트 올리고머, (B) 유연화성분, 및 (C1) 페녹시에틸(메타)아크릴레이트, 페녹시폴리에틸렌글리콜(메타)아크릴레이트, 2-히드록시-3-페녹시프로필(메타)아크릴레이트, 시클로헥실(메타)아크릴레이트, 노닐페놀EO부가물 (메타)아크릴레이트, 메톡시트리에틸렌글리콜(메타)아크릴레이트 및 테트라히드로푸르푸릴(메타)아크릴레이트에서 선택되는 (메타)아크릴레이트모노머를 포함하는 광경화형 수지 조성물이 개시되어 있다.Patent Document 1 discloses a composition comprising (A) a (meth) acrylate oligomer having polyisoprene, polybutadiene or polyurethane skeleton, (B) a softening component, and (C1) phenoxyethyl (meth) acrylate, phenoxypolyethylene glycol (Meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, nonylphenol EO adduct (meth) acrylate, methoxy triethylene glycol And (meth) acrylate monomers selected from tetrahydrofurfuryl (meth) acrylate.
최근 LCD 등의 표시체의 유리가 얇어지고 있다. 유리 두께가 엷어지면 외부응력에 의한 LCD의 변형도 쉬워진다. 얇은 유리를 이용한 LCD등의 표시체와, 아크릴판이나 폴리카보네이트판 등의 광학 기능 재료를 첩합시킬 경우, 유리와 아크릴 등의 선팽창의 차이나, 아크릴판이나 폴리카보네이트 등의 플라스틱 성형재료의 성형 시의 변형으로 인해 내열 시험과 내습(耐濕) 시험에서 성형 변형의 완화나 흡습/건조가 일어나고, 치수 변화나 휘어짐 등의 면정밀도(面精度)의 변화가 생긴다. 특허문헌 2는 우레탄계(메타)아크릴레이트, 폴리부타디엔계(메타)아크릴레이트 및 이소프렌계(메타)아크릴레이트를 성분으로 하는 경화수지가 개시되어 있다.Recently, the glass of a display body such as an LCD has become thinner. When the thickness of the glass becomes thin, deformation of the LCD due to external stress becomes easy. When an optical functional material such as an acrylic plate or a polycarbonate plate is adhered to a display body such as an LCD using a thin glass, a difference in linear expansion between glass and acrylic or the like, or a difference in thermal expansion during molding of a plastic molding material such as an acrylic plate or polycarbonate The deformation causes relaxation of mold deformation and moisture absorption / drying in the heat resistance test and the moisture resistance test, and a change in surface precision (dimensional accuracy) such as dimensional change and warpage occurs. Patent Document 2 discloses a cured resin composed of urethane (meth) acrylate, polybutadiene (meth) acrylate and isoprene (meth) acrylate.
화장판과 터치패널과의 첩합, 아이콘시트와 터치패널과의 첩합, 투명기판과 투명판자와의 첩합 등과 같은 용도에서는, 사용환경을 상정한 가온(加溫) 분위기에서의 피착체의 변형에 추수할수 있을 정도의 유연성을 갖는 것이 바람직하다.In applications such as blending of a bright plate and a touch panel, bonding of an icon sheet and a touch panel, bonding of a transparent substrate and a transparent plate, and the like, It is desirable to have a degree of flexibility.
한편, 사용환경을 상정한 가온 분위기에서의 피착체의 변형에 추수할수 있는 정도의 유연성을 가지는 경우, 내열시 험후의 착색과 변색, 내습시험 이후의 강도저하 등 과제가 있다는 것도 밝혀지고 있다. 상기 과제의 해결책으로서 특허문헌 4는 폴리이소프렌(메타)아크릴레이트올리고머, 폴리부타디엔(메타)아크릴레이트올리고머 및 폴리우레탄(메타)아크릴레이트올리고머로 이루어지는 군에서 선택되는1종 이상의 올리고머와 힌더드아민을 함유하는 광경화 접착조성물이 개시되어 있다.On the other hand, it has been found that there are problems such as discoloration and discoloration after heat resistance test and strength reduction after humidity resistance test when the flexibility of the product to be harvested in the warming atmosphere assumed in the use environment is harvested. As a solution to the above-mentioned problem, Patent Document 4 discloses a method for producing a polyurethane resin composition comprising at least one oligomer selected from the group consisting of a polyisoprene (meth) acrylate oligomer, a polybutadiene (meth) acrylate oligomer and a polyurethane Curing adhesive composition containing a curing agent.
특허문헌 5에는 (A) 특정의 유황함유 (메타)아크릴레이트 화합물 또는 이를 포함한 라디칼 반응성 조성물, (B) 자외선 흡수제, (C) 산화방지제, 및 (D) 중합개시제를 포함하는 것을 특징으로 하는 광경화 조성물이 개시되어 있다.Patent Document 5 discloses a spectacle lens comprising (A) a specific sulfur-containing (meth) acrylate compound or a radical reactive composition containing the same, (B) an ultraviolet absorber, (C) an antioxidant, and (D) A composition is disclosed.
특허문헌 6에는 아크릴폴리머 (E), 불포화 이중결합을 가지는 관능기를 2개이상 함유하는 우레탄(메타)아크릴레이트 (A), 불포화 이중결합을 함유하는 관능기를 1개 함유하는 단량체 (B), 광중합개시제 (C), 티올기를 2개이상 함유하는 폴리티올화합물 (D) 을 함유하는 조성물에 있어서, 상기 조성물 중의 우레탄(메타)아크릴레이트 (A) 의 중량 비율이 2중량% 내지 30중량%인 광경화성 투명 접착제 조성물이 기재되어 있다.Patent Document 6 discloses an acrylic polymer (E), a urethane (meth) acrylate (A) containing two or more functional groups having an unsaturated double bond, a monomer (B) containing one functional group containing an unsaturated double bond, (C) and a polythiol compound (D) containing two or more thiol groups, wherein the weight ratio of the urethane (meth) acrylate (A) in the composition is 2% by weight to 30% by weight A transparent transparent adhesive composition is disclosed.
특허문헌 7에는 말단에 알릴기를 가진 알릴에스테르올리고머에 있어서, 그 구성 성분중 10 내지 80몰%를 이타콘산으로부터 유도된 유기 잔기를 포함하는 지방족 디카르복시산이며, 잔부가 이타콘산 이외의 불포화기를 포함하는 지방족 및/또는 포화 지방족 및/또는 방향족 지방족 디카르복실다산으로부터 유도된 유기 잔기와 폴리올 로부터 유도되는 유기 잔기를 포함하는 아릴에스테르올리고머를 열경화성 수지 조성물로서 사용하는 것이 개시되어 있다.Patent Document 7 discloses an allyl ester oligomer having an allyl group at the terminal, wherein an aliphatic dicarboxylic acid containing an organic residue derived from itaconic acid in an amount of 10 to 80 mol% of the constituent components thereof and the remaining part of which contains an unsaturated group other than itaconic acid Discloses the use of an aryl ester oligomer comprising an organic moiety derived from an aliphatic and / or saturated aliphatic and / or aromatic aliphatic dicarboxylic acid and an organic moiety derived from a polyol as a thermosetting resin composition.
그러나, 상기 문헌에 기재된 기존 기술은 다음과 같은 점에서 개선의 여지를 가지고 있다. However, the existing technology described in the above document has room for improvement in the following points.
특허문헌 2의 방법은 면정밀도 변화 등 변형을 억제할 경우 접착면이 벗겨지거나 LCD가 깨지거나 LCD 표시가 고르지 않는 문제가 존재한다.In the method of Patent Document 2, there is a problem that the adhesive surface is peeled off, the LCD is broken, and the LCD display is uneven when the deformation is suppressed such as changes in surface precision.
특허문헌 2의 과제의 해결책으로서 특허문헌 3의 UV경화형 수지를 들 수 있다. 그러나 특허문헌 3에서는 이소볼닐(메타)아크릴레이트처럼 강직한 골격단량체를 기반으로 하는 고탄성 수지를 사용하기 때문에 고온 신뢰성 시험 (내습열성 시험) 에서 피착체의 팽창수축에 견디지 못하고 벗겨짐이 생긴다.As a solution to the problem of Patent Document 2, a UV curable resin of Patent Document 3 can be mentioned. However, in Patent Document 3, since a high-elasticity resin based on skeletal monomers that are rigid like isobornyl (meth) acrylate is used, peeling occurs in the high-temperature reliability test (resistance to humid heat) without being able to withstand the expansion and contraction of the adherend.
또한, 그 어느 문헌의 기술에서도 예를 들어 터치패널 등의 표시체에 사용되는 화장판이나 아이콘 시트를 첩합시킬 경우, 투명기판과 투명기판 사이를 첩합시킬 경우, 및 인쇄가공된 부분을 첩합시킬 등 경우에는, 피착체 정면의 인쇄 등으로 인해 차광 테두리의 정면으로부터 가시광선 또는 자외선이 닿지 않는 부분을 측면으로부터의 가시광선 또는 자외선을 통해 경화시킬 경우, 차광 테두리 아래의 경화성 수지 조성물이 경화 불량을 일으키는 과제가 있었다.In addition, in the technique of any of these documents, for example, when a bright plate or an icon sheet used in a display body such as a touch panel is fused, when a transparent substrate and a transparent substrate are fused and when a printed portion is fused , When a portion of the front surface of the object to be adhered with the visible light or the ultraviolet light is cured through visible light or ultraviolet light from the side due to printing on the front surface of the adherend or the like, the curable resin composition under the light- There was a challenge.
본 발명은 상기 사정에 비추어 이뤄진 것이며, 예를 들면, 터치패널 등의 표시체에 사용되는 화장판이나 아이콘시트를 첩합시킬 경우, 투명기판과 투명기판 사이를 첩합시킬 경우, 및 표시체와 광학 기능재료를 첩합시킬 경우에 바람직하게사용할수 있는 조성물을 제공하고는것을 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a display device, a display device, a display device, It is an object of the present invention to provide a composition which can be preferably used when a material is adhered.
즉, 본 발명에 의하면, 하기 (P), (C) 내지 (F) 을 함유하는 조성물이 제공된다.That is, according to the present invention, there is provided a composition containing the following (P), (C) to (F).
(P) 중합성 비닐 모노머(P) a polymerizable vinyl monomer
(C) 광중합 개시제(C) a photopolymerization initiator
(D) 산화방지제(D) Antioxidants
(E) 티올(E) Thiol
(F) 디카르복실산디에스테르(F) dicarboxylic acid diester
상기 (F) 가 식 (1)로 나타내는 디카르복실산디에스테르인 조성물인 것이 바람직하다.The composition (F) is preferably a dicarboxylic acid diester represented by the formula (1).
(R1, R2는 탄소수가 1 내지 18인 알킬기이며, R3는 탄소수가 1 내지 10 인 알킬렌기이며, R1, R2와 동일해도 되고 상이해도 된다.)(Wherein R 1 and R 2 are alkyl groups having 1 to 18 carbon atoms and R 3 is an alkylene group having 1 to 10 carbon atoms and may be the same as or different from R 1 and R 2 )
상기 (E) 티올이 폴리티올인것이 바람직하다.The thiol (E) is preferably a polythiol.
상기 (P) 중합성 모노머가 (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트를 함유하는 상기 조성물인것이 바람직하다.It is preferable that the (P) polymerizable monomer is the above composition containing (A) a polyfunctional (meth) acrylate and (B) a monofunctional (meth) acrylate.
또한, 상기 (A) 다관능(메타)아크릴레이트가 우레탄(메타)아크릴레이트인 상기 조성물인 것이 바람직하다.Further, it is preferable that the above-mentioned (A) polyfunctional (meth) acrylate is urethane (meth) acrylate.
상기 (B) 단관능(메타)아크릴레이트가 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상을 포함하는 상기 조성물인것이 바람직하다.It is preferable that the (B) monofunctional (meth) acrylate is at least one selected from the group consisting of hydroxyalkyl (meth) acrylate and alkyl (meth) acrylate.
상기 (F) 디카르복실산디에스테르의 함유량은 (P) 중합성 비닐 모노머 및 (F) 디카르복실산디에스테르의 합계가 100질량부일 경우에 5 내지 50질량부인 상기 조성물인것이 바람직하다.The content of the (D) dicarboxylic acid diester is preferably from 5 to 50 parts by mass when the total amount of the (P) polymerizable vinyl monomer and (D) dicarboxylic acid diester is 100 parts by mass.
또한, 본 발명에 의하면 상기 조성물을 포함하는 경화성수지조성물이 제공된다.According to the present invention, there is also provided a curable resin composition comprising the composition.
또한, 본 발명에 의하면 상기 조성물을 포함하는 접착제 조성물이 제공된다.According to the present invention, there is also provided an adhesive composition comprising the composition.
또한, 본 발명에 의하면 상기 접착제 조성물의 경화체가 제공된다.According to the present invention, there is also provided a cured product of the adhesive composition.
또한, 본 발명에 의하면 상기 경화체에 의해 피착체가 피복 또는 접합된 복합체가 제공된다.According to the present invention, there is also provided a composite in which an adherend is covered or bonded by the cured body.
상기 피착체는 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속 등에서 1종 이상을 포함하는 복합체인것이 바람직하다.The adherend is preferably a composite comprising at least one of triacetylcellulose, a fluorine-based polymer, a polyester, a polycarbonate, a polyolefin, a glass, and a metal.
또한, 본 발명에 의하면 상기 접착제 조성물에 의한 피착체를 첩합시킨터치패널 적층체가 제공된다.Further, according to the present invention, there is provided a touch panel laminate obtained by bonding an adherend with the adhesive composition.
또한, 본 발명에 의하면 상기 접착제 조성물에 의한 피착체를 첩합시킨 액정패널 적층체가 제공된다.According to the present invention, there is also provided a liquid crystal panel laminate obtained by bonding an adherend with the adhesive composition.
또한, 본 발명에 의하면 상기 터치패널 적층체를 사용한 디스플레이가 제공된다.Further, according to the present invention, a display using the touch panel laminate is provided.
또한, 본 발명에 의하면 상기 액정패널 적층체를 사용한 디스플레이가 제공된다.According to the present invention, there is provided a display using the liquid crystal panel laminate.
본 발명에 의하면 심부 경화성(深部硬化性)이 뛰어난 조성물을 제공할 수 있다.According to the present invention, it is possible to provide a composition excellent in deep portion curability (deep portion curability).
이하, 본 발명의 실시형태에 관하여 상세히 설명한다. 본 발명의 조성물은 하기 (P), (C) 내지 (F) 을 함유한다.Hereinafter, embodiments of the present invention will be described in detail. The composition of the present invention contains the following (P), (C) to (F).
(P) 중합성 비닐 모노머(P) a polymerizable vinyl monomer
(C) 광중합 개시제(C) a photopolymerization initiator
(D) 산화 방지제(D) Antioxidants
(E) 티올(E) Thiol
(F) 디카르복실산디에스테르(F) dicarboxylic acid diester
상기 조성에 따르면 터치패널 등의 표시체에 사용되는 화장판이나 아이콘시트를 접착시길 경우, 투명기판과 투명기판 사이를 첩합시킬 경우, 및 인쇄가공된 부분을 첩합시길 경우, 피착체 정면에서부터는 인쇄 등의 차광 테두리에 인해 정면으로부터 가시광선 또는 자외선이 조사되지 않는 부분을 측면으로부터의 가시광선 또는 자외선을 통해 경화하는 경화성 수지조성물을 제공할 수 있다.According to the composition described above, when a bright plate or an icon sheet used for a display body such as a touch panel is adhered, a transparent substrate and a transparent substrate are adhered to each other, and when a printed portion is adhered to the adherend, It is possible to provide a curable resin composition which hardens a portion not exposed to visible light or ultraviolet rays from the front side through visible light or ultraviolet rays from the side due to a light shielding frame such as printing.
또한, 상기 조성에 따르면 심부 경화성이 뛰어난 조성물을 제공할수 있으므로 차광 테두리 아래 측의 경화성 수지 조성물의 경화가 가능하며 접착제의 경화 불량을 억제하는 효과를 가질수 있다.Further, according to the composition, it is possible to provide a composition having excellent deep curability, so that it is possible to cure the curable resin composition on the side under the light shield frame and to suppress the curing failure of the adhesive.
본 발명중의 한가지 실시형태의 조성물은 상기한 바와 같이 (P), (C) 내지 (F) 을 함유하고 있으므로 이소볼닐(메타)아크릴레이트와 같은 강직한 골격의 단량체를 사용하지 않더라도 신뢰성 시험에 견딜수 있다.Since the composition of one embodiment of the present invention contains (P), (C) to (F) as described above, even when a monomer having a rigid skeleton such as isobornyl (meth) acrylate is not used, I can endure.
<(P) 중합성 비닐 모노머>≪ (P) Polymerizable vinyl monomer >
(P) 중합성 비닐 모노머로서 (메타)아크릴레이트를 사용하는 것이 바랍직하며, (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트를 함유하는 것이 보다 바람직하다.It is desirable to use (meth) acrylate as the (P) polymerizable vinyl monomer, and it is more preferable to contain (A) a polyfunctional (meth) acrylate and (B) a monofunctional (meth) acrylate.
<(A) 다관능(메타)아크릴레이트>≪ (A) polyfunctional (meth) acrylate >
(A) 다관능(메타)아크릴레이트란 (메타)아크릴로일기를 2개이상 가지고 있는 (메타)아크릴레이트를 가리킨다. 다관능(메타)아크릴레이트로서는 올리고머/폴리머 말단 혹은 측쇄에 2개 이상의 (메타)아크릴로일기화된 다관능(메타)아크릴레이트의 올리고머/폴리머 등이 있다.(A) A polyfunctional (meth) acrylate refers to a (meth) acrylate having two or more (meth) acryloyl groups. Examples of the polyfunctional (meth) acrylate include an oligomer / polymer of a polyfunctional (meth) acrylate having two or more (meth) acryloyl groups at the oligomer / polymer end or side chain.
예를 들면, 다관능(메타)아크릴레이트의 올리고머/폴리머로서 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트 (예를 들면, 니폰 소다샤 제 "TEA-1000"), 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물 (예를 들면, 1,2-폴리부타디엔 골격 중의 탄소-탄소 결합에 수소가 부가된 수소화 폴리부타디엔의 양 말단에 (메타)아크릴로일옥시기를 가지는 우레탄(메타)아크릴레이트를 가리킨다. 예를 들면, 니폰 소다샤 제 "TEAI-1000", 다이셀ㅇ올넥스샤 (DAICEL-ALLNEX LTD.) 제 "KRM-8776", "KRM-8792"), 1,4-폴리부타디엔 말단 우레탄(메타)아크릴레이트 (예를 들면, 오사카 유기 가가쿠샤 제 "BAC-45"), 폴리이소프렌 말단 (메타)아크릴레이트, 폴리에스테르계 우레탄(메타)아크릴레이트 (예를 들면 니폰 고으세이샤 제 "UV-2000B", "UV-3000B", "UV-7000B", 네가미 고으교샤 제 "KHP-11", "KHP-17"), 폴리에테르계 우레탄(메타)아크릴레이트 (예를 들면 니폰 고으세이샤 제 "UV-3700B", "UV-6100B"), 비스페놀 A형 에폭시(메타)아크릴레이트 등이 있다. For example, 1,2-polybutadiene-terminated urethane (meth) acrylates (e.g., Nippon Soda ash "TEA-1000"), 1,2-poly Butadiene-terminated urethane (meth) acrylate (for example, a urethane (meth) acrylate having a (meth) acryloyloxy group at both terminals of a hydrogenated polybutadiene in which hydrogen is added to a carbon- KROM-8792 ", "KRM-8792" manufactured by DAICEL-ALLNEX LTD.), 1 (methacrylic acid) (Meth) acrylate (e.g., polybutadiene-terminated urethane (meth) acrylate (e.g., "BAC-45" manufactured by Osaka Organic Chemical Industry Co., UV-2000B "," UV-3000B "," UV-7000B "," KHP- Quot; UV-3700B ", "UV-6100B"), bisphenol A type epoxy (meth) acrylate .
또한 폴리부타디엔 말단 (메타)우레탄아크릴레이트는 분자 구조의 말단이 (메타)아크릴레이트 이다.Also, the polybutadiene-terminated (meth) urethane acrylate has (meth) acrylate at the end of its molecular structure.
상기한 다관능(메타)아크릴레이트의 올리고머/폴리머 중 에서 효과가 크다는 관점으로부터 우레탄(메타)아크릴레이트가 바람직하다.Urethane (meth) acrylate is preferred from the viewpoint that the effect is great among oligomers / polymers of the polyfunctional (meth) acrylate.
또한 우레탄(메타)아크릴레이트 중에서 폴리부타디엔계 우레탄(메타)아크릴레이트, 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물, 폴리에스테르계 우레탄(메타)아크릴레이트 및 폴리에테르계 우레탄(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종이상이 바람직하며, 폴리부타디엔계 우레탄(메타)아크릴레이트 및/또는 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물이 보다 마람직하며, 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물이 가장 바람직하다.(Meth) acrylate, a polybutadiene-based urethane (meth) acrylate, a polybutadiene-terminated urethane (meth) acrylate hydrogenated product, a polyester-based urethane (Meth) acrylate and / or polybutadiene-terminated urethane (meth) acrylate are more preferable, and polybutadiene-terminated urethane (meth) acrylate and / or polybutadiene- Hydrogenation of acrylates is most preferred.
또한, 폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물중에서 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트의 수소 첨가물이 바람직하다. 폴리부타디엔계 우레탄(메타)아크릴레이트 중에서 1,4-폴리부타디엔 말단 우레탄(메타)아크릴레이트가 바람직하다.Also, among the hydrogenated products of polybutadiene-terminated urethane (meth) acrylate, hydrogenated products of 1,2-polybutadiene-terminated urethane (meth) acrylate are preferred. Among the polybutadiene-based urethane (meth) acrylates, 1,4-polybutadiene-terminated urethane (meth) acrylates are preferred.
그중, 우레탄(메타)아크릴레이트는 폴리올 화합물 (이후 X로 표시한다) 과 유기 폴리 이소시아네이트 화합물 (이후 Y로 표시한다) 과 히드록시(메타)아크릴레이트 (이후 Z로 표시한다) 를 반응 (예를 들면 중축합 반응) 시켜 얻은 분자 내에 우레탄 결합을 가지는 우레탄(메타)아크릴레이트를 가리킨다.The urethane (meth) acrylate is reacted with a polyol compound (hereinafter referred to as X), an organic polyisocyanate compound (hereinafter referred to as Y) and hydroxy (meth) acrylate Refers to a urethane (meth) acrylate having a urethane bond in the molecule obtained by a polycondensation reaction.
폴리올 화합물 (X) 로서 에틸렌글리콜, 디에틸렌글리콜 트리에틸렌글리콜, 테트라에틸렌글리콜, 폴리에틸렌글리콜, 프로필렌글리콜, 지프로필렌글리콜, 폴리프로필렌글리콜, 부틸렌글리콜, 1,4-부탄디올, 폴리부틸렌글리콜, 1,5-펜탄디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 3-메틸-1,5-펜탄디올, 2,4-디에틸1,5-펜탄디올, 2,2-부틸에틸-1,3-프로판디올, 네오펜칠글리콜, 시클로헥산지메탄올, 수소화비스페놀 A, 폴리카프로락톤, 트리메틸올에탄, 트리메틸올프로판, 폴리트리메틸올프로판, 펜타에리스리톨, 폴리펜타에리스리톨, 솔비톨, 만니톨, 글리세린, 폴리글리세린, 폴리테트라메틸렌글리콜 등의 다가 알코올이거나, 폴리에틸렌옥사이드, 폴리프로필렌옥사이드, 에틸렌옥사이드/프로필렌옥사이드의 블록 또는 랜덤 공중합의 적어도 1종의 구조를 가지는 폴리에테르폴리올, 상기 다가 알코올 또는 폴리에테르폴리올과, 말레산무수물, 말레산, 푸마르산, 무수이타콤산, 이타콤산, 아디핀산, 이소프탈산 등의 다염기산과의 축합물인 폴리에스테르폴리올, 카프로락톤 변성 폴리테트라메틸렌폴리올 등의 카프로락톤 변성 폴리올, 폴리올레핀계 폴리올,폴리카보네이트계 폴리올, 폴리부타디엔폴리올, 폴리이소프렌폴리올, 수소화폴리부타디엔폴리올, 수소화폴리이소프렌폴리올 등의 폴리디엔계 폴리올, 폴리디메틸실록산폴리올 등의 실리콘폴리올 등이 있다.Examples of the polyol compound (X) include polyhydric alcohols such as ethylene glycol, diethylene glycol triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, butylene glycol, , Pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 2,4- , 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, trimethylol ethane, trimethylol propane, pentaerythritol, There may be mentioned polyhydric alcohols such as erythritol, sorbitol, mannitol, glycerin, polyglycerin and polytetramethylene glycol, or polyols such as polyethylene oxide, polypropylene oxide, block or random copolymerization of ethylene oxide / propylene oxide A polyester polyol which is a condensation product of a polyether polyol, the polyhydric alcohol or polyether polyol with a polybasic acid such as maleic anhydride, maleic acid, fumaric acid, itaconic anhydride, itaconic acid, adipic acid or isophthalic acid, a polyester polyol such as caprolactone- Caprolactone-modified polyols such as tetramethylene polyol, polyamides such as polyolefin-based polyols, polycarbonate-based polyols, polybutadiene polyols, polyisoprene polyols, hydrogenated polybutadiene polyols, hydrogenated polyisoprene polyols and the like, polydimethylsiloxane polyols Polyols and the like.
이들 중에서 폴리올화합물 (X) 로서 폴리부타디엔폴리올, 수소화폴리부타디엔폴리올, 폴리에테르폴리올과 폴리에스테르폴리올 중의 1종 이상을 포함하는 것이 바람직하며, 수소화 폴리부타디엔폴리올이 보다 바람직하다. 수소화 폴리부타디엔폴리올 중에서 식 (3) 으로 나타내는 화합물 (n은 정수) 이 바람직하다.Among them, polyol compound (X) preferably contains at least one of polybutadiene polyol, hydrogenated polybutadiene polyol, polyether polyol and polyester polyol, and hydrogenated polybutadiene polyol is more preferable. Among the hydrogenated polybutadiene polyols, a compound represented by the formula (3) (n is an integer) is preferable.
여기에서 폴리부타디엔계 우레탄(메타)아크릴레이트는 예를 들면 폴리올 화합물 (X) 이 폴리부타디엔폴리올이다. 또한, 폴리에스테르계 우레탄(메타)아크릴레이트는 예를 들면 폴리 올 화합물 (X) 이 폴리에스테르폴리올이다. 또한, 폴리에테르계 우레탄(메타)아크릴레이트는 예를 들면 폴리올화합물 (X) 이 폴리에테르폴리올이다.The polybutadiene-based urethane (meth) acrylate is, for example, a polybutadiene polyol such as polyol compound (X). As the polyester-based urethane (meth) acrylate, for example, the polyol compound (X) is a polyester polyol. The polyether-based urethane (meth) acrylate is, for example, a polyether polyol such as polyol compound (X).
유기 폴리이소시아네이트 화합물 (Y) 로서 특히 한정되지는 않지만, 예를 들어 방향족계, 지방족계, 환식지방족계, 지방족고리계 등 폴리이소시아네이트를 사용할수 있다. As the organic polyisocyanate compound (Y), although not particularly limited, for example, polyisocyanates such as aromatic, aliphatic, cyclic aliphatic, and aliphatic ring systems can be used.
폴리 이소시아네이트중에서도 톨릴렌디이소시아네이트 (TDI), 디페닐메탄디이소시아네이트 (MDI), 수소 첨가화 디페닐메탄디이소시아네이트 (H-MDI), 폴리페닐메탄폴리이소시아네이트 (크루드 MDI), 변성 디페닐메탄디이소시아네이트 (변성 MDI), 수소 첨가화 크실렌디이소시아네이트 (H-XDI), 크실렌디이소시아네이트 (XDI), 헥사디이소시아네이트 (HMDI), 트리메틸헥사디이소시아네이트 (TMXDI), 테트라메틸크실렌디이소시아네이트(m-TMXDI), 이소폴론디이소시아네이트 (IPDI), 노르보르넨디이소시아네이트 (NBDI), 1,3-비스(이소시아네이토메틸)시클로헥산 (H6XDI) 등의 폴리이소시아네이트랑, 이들의 폴리이소시아네이트의 삼량체 화합물이랑, 이들의 폴리이소시아네이트과 폴리올의 반응생성물 등이 바람직하게 사용된다. Among the polyisocyanates, polyisocyanates such as tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (crude MDI), modified diphenylmethane diisocyanate (Modified MDI), hydrogenated xylene diisocyanate (H-XDI), xylene diisocyanate (XDI), hexadiisocyanate (HMDI), trimethylhexadiisocyanate (TMXDI), tetramethylxylene diisocyanate (m- Polyisocyanates such as isophorone diisocyanate (IPDI), norbornene diisocyanate (NBDI) and 1,3-bis (isocyanatomethyl) cyclohexane (H6XDI), trimellitic compounds of these polyisocyanates, And a reaction product of a polyisocyanate and a polyol are preferably used.
상기 물질 중에서 유기폴리이소시아네이트 화합물 (Y) 로서 수소 첨가화 크실렌디이소시아네이트 (H-XDI) 및/또는 이소폴론디이소시아네이트 (IPDI) 가 바람직하며, 이소폴론디이소시아네이트 (IPDI) 가 보다 바람직하다.Among them, hydrogenated xylene diisocyanate (H-XDI) and / or isophorone diisocyanate (IPDI) are preferable as the organic polyisocyanate compound (Y), and isophorone diisocyanate (IPDI) is more preferable.
히드록시(메타)아크릴레이트 (Z) 로서, 2-히드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 2-히드록시에틸(메타)아크릴로일포스페이트, 4-히드록시부틸(메타)아크릴레이트, 2-(메타)아크릴로일옥시에틸-2-히드록시프로필프탈레이트, 글리세린디(메타)아크릴레이트, 2- 히드록시-3-(메타)아크릴로일옥시프로필아크릴레이트, 카프로락톤 변성 2-히드록시에틸(메타)아크릴레이트, 펜타에리트리톨트리(메타)아크릴레이트, 디펜타에리트리톨펜타(메타)아크릴레이트, 카프로락톤 변성 2-히드록시에틸(메타)아크릴레이트 등이 있다.Examples of the hydroxy (meth) acrylate (Z) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2- (Meth) acryloyl phosphate, 4-hydroxybutyl (meth) acrylate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, glycerin di (Meth) acrylate, caprolactone-modified (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, caprolactone Modified 2-hydroxyethyl (meth) acrylate, and the like.
그중, 히드록시(메타)아크릴레이트 (Z) 로서, 히드록시알킬(메타)아크릴레이트가 바람직하다. 히드록시알킬(메타)아크릴레이트 중에서2-히드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하다.Among them, hydroxyalkyl (meth) acrylate is preferable as the hydroxy (meth) acrylate (Z). (Meth) acrylate selected from the group consisting of 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and 2-hydroxybutyl .
다관능(메타)아크릴레이트의 중량 평균분자량은 특히 한정되지 않지만 1000 내지 60000이 바람직하며, 1500 내지 40000이 보다 바람직하다. 중량 평균분자량은 하기 조건에서 용제로서 테트라히드로푸란을 사용하고, GPC 시스템 (토소샤 제 SC-8010) 등을 사용하고, 시판의 표준 폴리스티렌에서 분석 곡선을 작성하여 구했다.The weight average molecular weight of the polyfunctional (meth) acrylate is not particularly limited, but is preferably from 1,000 to 60,000, more preferably from 1,500 to 40,000. The weight average molecular weight was obtained by preparing an analytical curve on a commercially available standard polystyrene using tetrahydrofuran as a solvent and using a GPC system (SC-8010 manufactured by Tosoh Corporation) under the following conditions.
유속: 1.0ml/minFlow rate: 1.0 ml / min
설정 온도: 40℃Setting temperature: 40 ℃
컬럼 구성: 토소샤 제 "TSK guardcolumn MP(×L)"6.0mmID×4.0cm 1개 및 토소샤 제 "TSK-GELMULTIPOREHXL-M" 7.8mmID×30.0cm (이론 단수 16,000단) 2개, 합계 3개 (전체 이론 단수 32,000단)Column configuration: one TSK guardcolumn MP (x L) 6.0 mm ID x 4.0 cm and two TSK-GELMULTIPOREHXL-M 7.8 mm ID x 30.0 cm (theoretical number of stages: 16,000 columns), three in total (Total theoretical number of stages of 32,000)
샘플 주입량: 100μl (시료 용액 농도 1mg/ml)Sample injection volume: 100 μl (sample solution concentration 1 mg / ml)
송액 압력: 39kg/cm2 Pumping pressure: 39 kg / cm 2
검출기: RI 검출기Detector: RI detector
<(B) 단관능(메타)아크릴레이트>≪ (B) Monofunctional (meth) acrylate >
(B) 단관능(메타)아크릴레이트는 (메타)아크릴로일기를 1개 가지고 있는 (메타)아크릴레이트를 가리 킨다. (B) 단관능(메타)아크릴레이트 중에서 히드록시(메타)아크릴레이트와 알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상이 바람직하며, 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트를 병용하는 것이 보다 바람직하다. (B) monofunctional (meth) acrylate refers to (meth) acrylate having one (meth) acryloyl group. (Meth) acrylate and alkyl (meth) acrylate among the monofunctional (meth) acrylate (B), and at least one selected from the group consisting of hydroxyalkyl (meth) acrylate and alkyl ) Acrylate is more preferably used.
또한, 본 발명중 한가지 실시형태로서 예를 들면 이소볼닐(메타)아크릴레이트와 같은 강직한 골격의 모노머를 사용하지 않아도 된다. 왜냐하면 본 발명중 한가지 실시형태는 이소볼닐(메타)아크릴레이트를 사용하지 않아도 내습성 시험에서 좋은 결과를 나타낼수 있다.Further, as one embodiment of the present invention, for example, it is not necessary to use a rigid skeleton monomer such as isobornyl (meth) acrylate. This is because one embodiment of the present invention can exhibit good results in moisture resistance test without using isobornyl (meth) acrylate.
히드록시알킬(메타)아크릴레이트 중에서 식 (2) 로 나타내는 (메타)아크릴레이트가 바람직하다. Among the hydroxyalkyl (meth) acrylates, (meth) acrylates represented by the formula (2) are preferred.
(Z는 (메타)아크릴로일기, R1은 알킬렌기, p는 1 내지 10의 정수를 나타낸다.) (Z is a (meth) acryloyl group, R 1 is an alkylene group, and p is an integer of 1 to 10.)
또한, 식 (2) 에서 R1의 알킬렌기의 탄소수는 1 내지 8이 바람직하고, 2 내지 6이 보다 바람직하다.In the formula (2), the alkyl group of R 1 preferably has 1 to 8 carbon atoms, more preferably 2 to 6 carbon atoms.
히드록시알킬(메타)아크릴레이트로서 2-히드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-히드록시부틸(메타)아크릴레이트, 디에틸렌글리콜모노(메타)아크릴레이트 및 폴리 프로필렌글리콜(메타)아크릴레이트 등이 있다. 이들 중에서, 접착성이나 내습성의 관점으로부터 2-히드록시부틸(메타)아크릴레이트가 바람직하다.Examples of the hydroxyalkyl (meth) acrylate include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, diethylene glycol mono And polypropylene glycol (meth) acrylate. Of these, 2-hydroxybutyl (meth) acrylate is preferable from the viewpoints of adhesiveness and moisture resistance.
알킬(메타)아크릴레이트 중에서 (메타)아크릴산알킬에스테르가 바람직하다. 알킬에스테르 중에서 알킬기의 탄소수 1 내지 16이 바람직하며, 탄소수 2 내지 14가 보다 바람직하며, 탄소수 4 내지 12가 가장 바람직하고, 탄소수 6 내지 10이 더욱 바람직하다. 알킬기는 포화 지방족탄화수소기가 바람직하다. 또한, 알킬기는 비치환인 것이 바람직하다.Among alkyl (meth) acrylates, alkyl (meth) acrylates are preferred. Of the alkyl esters, the number of carbon atoms of the alkyl group is preferably from 1 to 16, more preferably from 2 to 14, most preferably from 4 to 12, and still more preferably from 6 to 10 carbon atoms. The alkyl group is preferably a saturated aliphatic hydrocarbon group. The alkyl group is preferably unsubstituted.
알킬(메타)아크릴레이트로서 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 노르말옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, 데실(메타)아크릴레이트, 이소데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 스테아릴(메타)아크릴레이트, 이소스테아릴(메타)아크릴레이트 등을 들 수 있다. 이들 중에서, 접착성이나 내습성의 관점으로부터 옥틸(메타)아크릴레이트가 바람직하며, 노르말옥틸(메타)아크릴레이트가 보다 바람직하다.(Meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (Meth) acrylate, isooctyl (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, isodecyl And the like. Of these, octyl (meth) acrylate is preferable and n-octyl (meth) acrylate is more preferable from the viewpoints of adhesiveness and moisture resistance.
(P) 중합성 비닐 모노머의 함유량은 (P) 및 (F) 의 합계량이 100질량부일 경우에, 50 내지95질량부가 바람직하고, 55 내지 90질량부가 보다 바람직하고 60 내지 80질량부가 가장 바람직하다. (P) 중합성 비닐 모노머의 함유량이 50질량부 이상일 경우, 보다 우수한 경화성을 얻을수 있고, 95질량부 이하일 경우, 접착성의 저하를 보다 억제할수 있다. (P) 중합성 비닐 모노머의 함유량은 예를 들어 50, 51, 54, 55, 56, 59, 60, 61, 65, 69, 70, 71, 75, 79, 80, 81, 85, 89, 90, 91, 94 또는 95질량부 이여도 되고 그들 중 임의의 2개의 값의 범위내에 있어도 된다.The content of the (P) polymerizable vinyl monomer is preferably 50 to 95 parts by mass, more preferably 55 to 90 parts by mass, and most preferably 60 to 80 parts by mass, in the case where the total amount of (P) and (F) is 100 parts by mass . When the content of the (P) polymerizable vinyl monomer is 50 parts by mass or more, excellent curability can be obtained, and when it is 95 parts by mass or less, deterioration of adhesion can be further suppressed. The content of the (P) polymerizable vinyl monomer may be, for example, 50, 51, 54, 55, 56, 59, 60, 61, 65, 69, 70, 71, 75, 79, 80, 81, , 91, 94, or 95 parts by mass, and may be in the range of any two of them.
(P) 중합성 비닐 모노머가, (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트를 함유할 경우, (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트의 함유량은 (A) 다관능(메타)아크릴레이트 및 (B) 단관능(메타)아크릴레이트의 합계 100질량부 중, 질량비 (A):(B)=30 내지 95:5 내지70이 바람직하며, 40 내지 90:10 내지 60이 보다 바람직하며 50 내지 70:30 내지 50이 가장 바람직하다.When the (P) polymerizable vinyl monomer contains (A) a polyfunctional (meth) acrylate and (B) a monofunctional (meth) acrylate, The content of the functional (meth) acrylate is preferably from 30 to 95: 1 in a mass ratio (A) :( B) to a total of 100 parts by mass of the polyfunctional (meth) acrylate and the monofunctional (meth) More preferably from 5 to 70, even more preferably from 40 to 90: 10 to 60, most preferably from 50 to 70: 30 to 50. [
(B) 단관능(메타)아크릴레이트가 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트를 병용하는 경우, 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트의 함유량은 히드록시알킬(메타)아크릴레이트와 알킬(메타)아크릴레이트의 합계 100질량부 중, 질량비로 히드록시알킬(메타)아크릴레이트:알킬(메타)아크릴레이트=5 내지 70:30 내지 95이 바람직하며, 10 내지 50:50 내지90이 보다 바람직하고, 20 내지 40:60 내지 80이 가장 바람직하다.When the monofunctional (meth) acrylate (B) is used in combination with a hydroxyalkyl (meth) acrylate and an alkyl (meth) acrylate, the content of the hydroxyalkyl (meth) acrylate and the alkyl (meth) Hydroxyalkyl (meth) acrylate: alkyl (meth) acrylate = 5 to 70:30 to 95 is preferable in a mass ratio in the total 100 parts by mass of the alkyl (meth) acrylate and the alkyl (meth) acrylate, 10 to 50:50 to 90 is more preferable, and 20 to 40:60 to 80 is most preferable.
<(C) 광중합 개시제><(C) Photopolymerization initiator>
(C) 광중합 개시제는 가시광선이나 자외선의 활성 광선에 의해 증감시키고 수지 조성물의 광경화를 촉진하기 위해 사용된다.(C) The photopolymerization initiator is used to increase or decrease the visible light or the ultraviolet light, and to accelerate the photopolymerization of the resin composition.
광중합 개시제로서 벤조페논 및 그 유도체, 벤질 및 그 유도체, 안트라퀴논 및 그 유도체, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인프로필에테르, 벤조인이소부틸에테르 등의 벤조인 유도체, 벤질디메틸케탈, 1-히드록시시클로헥실페닐케톤, 2-히드록시-2-메틸-1-페닐-프로판-1-온 등의 알킬페놀 유도체, 디에톡시아세토페논, 4-t-부틸트리클로로아세토페논 등의 아세토페논 유도체, 2-디메틸아미노에틸벤조에이트, P-디메틸아미노에틸벤조에이트, 디페닐디설피드, 티옥산톤 및 그 유도체, 캄퍼퀴논, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복실산, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복시-2-브로모에틸에스테르, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복시-2-메틸에스테르, 7,7-디메틸-2,3-디오키소비시크로[2.2.1]헵탄-1-카르복실산클로라이드 등의 캄퍼퀴논 유도체, 2-메틸-1[4-(메틸티올)페닐]-2-모르포리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르포리노페닐)-부타논-1 등의 α-아미노알킬페논 유도체, 벤조일디페닐포스핀옥사이드, 2,4,6-트리메틸벤조일디페닐포스핀옥사이드, 벤조일디에톡시포스핀옥사이드, 2,4,6- 트리메틸벤조일디메톡시페닐포스핀옥사이드, 2,4,6-트리메틸벤조일디에톡시페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드 등의 아실포스핀옥사이드 유도체, 옥시-페닐-아세틱애시드2-[2-옥소-2-페닐-아세톡시-에톡시]-에틸에스테르 및 옥시-페닐-아세틱애시드2-[2-히드록시-에톡시]-에틸에스테르 등이 있다. (C) 광중합 개시제는 1종 또는 2종 이상을 조합하여 사용할수 있다. 상기한 중에서 효과가 크다는 관점으로부터 (C) 광중합 개시제는 알킬페논 유도체와 아실포스핀옥사이드 유도체로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하며, 알킬페논 유도체와 아실포스핀옥사이드 유도체를 병용하는 것이 보다 바람직하다. Benzoin derivatives such as benzophenone and its derivatives, benzyl and its derivatives, anthraquinone and its derivatives, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether and benzoin isobutyl ether as the photopolymerization initiator, Alkylphenol derivatives such as dimethyl ketal, 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methyl-1-phenyl-propan-1-one, diethoxyacetophenone, 4-t-butyl trichloroacetophenone Dimethylaminoethyl benzoate, diphenyl disulfide, thioxanthone and its derivatives, camphorquinone, 7,7-dimethyl-2,3-dioxin Heptane-1-carboxy-2-bromoethyl ester, 7,7-dimethyl-2,3-dioxystacyro [2.2.1] heptane- Dimethyl-2,3-dioxysuccro [2.2.1] heptane-1-carboxy-2-methyl ester, 7,7- Methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino- (4-morpholinophenyl) -butanone-1, benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, Trimethylbenzoyldiethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide, and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide. Phenyl-acetic acid 2- [2-oxo-2-phenyl-acetoxy-ethoxy] -ethyl ester and oxy-phenyl- acetic acid 2- [2-hydroxy-ethoxy] - ethyl ester. The photopolymerization initiator (C) may be used alone or in combination of two or more. The photopolymerization initiator (C) preferably contains at least one member selected from the group consisting of an alkylphenone derivative and an acylphosphine oxide derivative from the viewpoint that the effect is large in the above-mentioned one, and the combination of an alkylphenone derivative and an acylphosphine oxide derivative .
알킬 페논 유도체와 아실포스핀옥사이드 유도체를 병용할 경우, 병용 비율은 아실포스핀옥사이드 유도체 100질량부에 대하여 알킬페논 유도체를 50 내지 400질량부인 것이 바람직하고, 100 내지 300질량부인 것이 보다 바람직하며, 150 내지 250질량부인 것이 가장 바람직하다.When the alkylphenone derivative and the acylphosphine oxide derivative are used in combination, the alkylphenone derivative is preferably used in an amount of 50 to 400 parts by mass, more preferably 100 to 300 parts by mass based on 100 parts by mass of the acylphosphine oxide derivative, Most preferably 150 to 250 parts by mass.
알킬 페논 유도체 중에서는 벤질디메틸케탈과 1-히드록시시클로헥실페닐케톤으로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하다. 또한, 아실포스핀옥사이드 유도체 중에서 2,4,6-트리메틸벤조일디페닐포스핀옥사이드와 비스(2,4,6-트리메치루 벤조일)-페닐포스핀옥사이드로 이루어지는 군에서 선택되는 1종 이상을 포함하는 것이 바람직하다.Among the alkylphenone derivatives, those containing at least one member selected from the group consisting of benzyldimethylketal and 1-hydroxycyclohexyl phenyl ketone are preferred. Further, in the acylphosphine oxide derivative, at least one compound selected from the group consisting of 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide .
(C) 광중합 개시제 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우에 0.01 내지 10질량부가 바람직하며, 0.05 내지 5질량부가 보다 바람직하며, 0.1 내지 1질량부가 가장 바람직하다. 광중합 개시제 함유량이 0.01질량부 이상일 경우 보다 우수한 경화성을 얻을수 있으며, 10질량부 이하일 경우 보다 우수한 심부 경화성을 얻을수 있다. (C) 광중합 개시제는 예를 들어 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.09, 1, 1.01, 1.5, 1.9, 2, 3, 4, 4.5, 4.9, 5, 6, 7, 8, 9 또는 10질량부이여도 되고, 그들 중의 임의의 2개의 값의 범위 내이여도 된다.When the total amount of (P) and (F) is 100 parts by mass, the content of the photopolymerization initiator (C) is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass, and most preferably 0.1 to 1 part by mass. When the content of the photopolymerization initiator is 0.01 parts by mass or more, excellent curability can be obtained, and when the content is 10 parts by mass or less, deep curability can be obtained more excellent. (C) the photopolymerization initiator is, for example, 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.09, 1, 1.01, 1.5, 1.9, 2, 3, 4, 4.5, 4.9, Or 10 parts by mass, or may be within the range of any two of them.
<(D) 산화 방지제>≪ (D) Antioxidant >
(D) 산화 방지제는 저장 안전성을 향상시킬수 있다.(D) Antioxidants can improve storage stability.
산화방지제는 메틸히드로퀴논, 히드로퀴논, 2,2-메틸렌비스(4-메틸-6-터셔리부틸페놀), 6-tert-부틸-4-[3[(2,4,8,10-테트라-tert-부틸디벤조[d,f][1,3,2]디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀, 카테콜, 히드로퀴논모노메틸에테르, 모노터셔리부틸히드로퀴논, 2,5-디터셔리부틸히드로퀴논, p-벤조퀴논, 2,5-디페닐-p-벤조퀴논, 2,5-디터셔리부틸-p-벤조퀴논, 피크린산, 시트르산, 페노티아진, 터셔리부틸카테콜, 2-부틸-4-히드록시아니솔 및 2,6-터셔리부틸-p-크레졸 등이 있다.Antioxidants include methylhydroquinone, hydroquinone, 2,2-methylenebis (4-methyl-6-tertiarybutylphenol), 6-tert-butyl- 4- [ Propyl] -2-methylphenol, catechol, hydroquinone monomethyl ether, mono tertiary butyl hydroquinone, 2 < RTI ID = 0.0 > , 2,5-di-tert-butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, Butyl-4-hydroxyanisole, and 2,6-tertiary-butyl-p-cresol.
(D) 항산화제의 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우, 0.001 내지 0.5질량부가 바람직하며, 0.005 내지 0.1질량부가 보다 바람직하다. 항산화제의 함유량이 0.001질량부 이상일 경우, 경화성 수지조성물의 열에 의한 착색이나 변색이 보다 적아지며, 0.5질량부 이하일 경우, 보다 우수한 심부 경화성을 얻을 수 있다. (D) 산화 방지제는 예를 들어, 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.009, 0.010, 0.011, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.20, 0.30, 0.40, 0.45, 0.49 또는 0.5질량부이여도 좋고, 그들 중의 임의의 2개의 값의 범위 내여도 된다.The content of the antioxidant (D) is preferably from 0.001 to 0.5 parts by mass, and more preferably from 0.005 to 0.1 part by mass, when the total of (P) and (F) is 100 parts by mass. When the content of the antioxidant is 0.001 parts by mass or more, coloration or discoloration due to heat of the curable resin composition becomes less, and when it is 0.5 parts by mass or less, more excellent deep curing property can be obtained. (D) The antioxidant may be present in an amount of from 0.001, 0.002, 0.003, 0.004, 0.005, 0.006, 0.009, 0.010, 0.011, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.20, 0.30, 0.40, 0.49 or 0.5 part by mass, or may be in the range of any two of them.
<(E) 티올><(E) Thiol>
(E) 티올은 1개 이상의 티올기를 가지는 화합물이다. 티올 중에서 심부 경화성의 관점으로부터 폴리 티올이 바람직하다. (E) 폴리 티올은 2개 이상의 티올기를 가지는 화합물을 가리킨다. 폴리 티올로서, 펜타에리트리톨테트라키스(3-메르캅토부티레이트), 펜타에리트리톨테트라키스(3-메르캅토프로피오네이트), 트리메틸올프로판트리스(3-메르캅토프로피오네이트), 트리메틸올프로판트리스티오프로피오네이트, 펜타에리트리톨테트라키스티오프로피오네이트, 디펜타에리트리톨헥사키스(3-메르캅토프로피오네이트), 트리스[(3-메르캅토프로피오닐옥시)-에틸]이소시아누레이트, 3-메르캅토부티레이트 유도체 등을 들 수 있다. 상기한 폴리티올에서 1종 이상 사용할 수 있다.(E) Thiol is a compound having at least one thiol group. Among the thiols, a polythiol is preferable from the viewpoint of deep curability. (E) polythiol refers to a compound having two or more thiol groups. Examples of the polythiol include pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptopropionyloxy) -ethyl] isocyanurate, pentaerythritol tetrakisthiopropionate, dipentaerythritol hexacis (3-mercaptopropionate), tris 3-mercaptobutyrate derivatives, and the like. One or more of these polythiols may be used.
폴리티올 중에서 3-메르캅토부티레이트 유도체가 바람직하다. 3-메르캅토부티레이트 유도체로서, 1,4-비스(3-메르캅토부티릴옥시)부탄, 1,3,5-트리스(3-메르캅토부틸옥시에틸)-1,3,5-토리아진-2,4,6-(1H, 3H, 5H)-트리온, 펜타에리트리톨테트라키스(3-메르캅토부티레이트) 등이 있다. 폴리티올 중에서 2급의 폴리티올이 바람직하다.Among polythiols, 3-mercaptobutyrate derivatives are preferred. As the 3-mercaptobutyrate derivative, 1,4-bis (3-mercaptobutyryloxy) butane, 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5- 2,4,6- (1H, 3H, 5H) -thione, pentaerythritol tetrakis (3-mercaptobutyrate), and the like. Among the polythiols, a polythiol of the second class is preferable.
(E) 티올의 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우 0.1 내지 10질량부가 바람직하며, 0.5 내지 5질량부가 보다 바람직하다. (E) 티올의 함유량이 (P) 및 (F) 의 합계 100질량부에 대하여 0.1질량부 이상일 경우, 보다 우수한 심부 경화성을 얻을수 있으며, 10질량부 이하일 경우, 경화성 수지조성물이 열에 의한 착색이나 변색이 보다 적어진다. 또한 (E) 티올은 예를 들어 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.9, 1.0, 2.0, 3.0, 4.0, 4.5, 4.9, 5.0, 6.0, 7.0, 8.0, 9.0, 9.9 또는 10질량부이여도 되고 그들 중의 임의의 2개의 값의 범위 내여도 된다.When the total amount of (P) and (F) is 100 parts by mass, the content of (E) thiol is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass. When the content of the thiol (E) is 0.1 parts by mass or more based on 100 parts by mass of the total of (P) and (F), excellent deep curing properties can be obtained, and when the content is 10 parts by mass or less, . The thiol (E) may be, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.9, 1.0, 2.0, 3.0, 4.0, 4.5, 4.9, 5.0, 6.0, 7.0, 8.0, 9.0, 9.9, Or may be in the range of any two of them.
<(F) 디카르복실산디에스테르>≪ (F) Dicarboxylic acid diester >
(F) 디카르복실산디에스테르로서는, 지방족 이염기산의 디에스테르가 바람직하다. 지방족 이염기산의 디에스테르로는 식 (1) 로 나타내는 화합물이 바람직하다.As the dicarboxylic acid diester (F), a diester of an aliphatic dibasic acid is preferable. The diester of an aliphatic dibasic acid is preferably a compound represented by the formula (1).
[화학식 1][Chemical Formula 1]
식 (1)Equation (1)
(R1, R2는 탄소수가 1 내지 18인 알킬기이며, R3는 탄소수가 1 내지 10 일 알킬렌기이며, R1, R2와 동일해도 되고 상이부동해도 된다.)(R 1 and R 2 are alkyl groups having 1 to 18 carbon atoms, and R 3 is an alkylene group having 1 to 10 carbon atoms, and may be the same as or different from R 1 and R 2 ).
식 (1)에 나타내는 화합물의 R1, R2는 포화지방족 탄화수소기가 바람직하다. 또한, 상기의 R1, R2는 비치환인 것이 바람직하다. 상기의 R1, R2는 탄소수 2 내지 12인 알킬기가 바람직하며, 탄소수 4 내지 10인 알킬기가 보다 바람직하며, 탄소수 8인 알킬기가 가장 바람직하다. 식 (1)에 나타내는 화합물에서 R3은 포화지방족 탄화수소기가 바람직하다. 또한, 상기 R3은 비치환인 것이 바람직하다. 상기 R3은 탄소수 4 내지 10인 알킬렌기가 바람직하며, 탄소수 7 내지 8인 알킬렌기가 보다 바람직하며, 탄소수 8인 알킬렌기가 가장 바람직하다.R 1 and R 2 in the compounds represented by the formula (1) are preferably saturated aliphatic hydrocarbon groups. It is preferable that R 1 and R 2 are unsubstituted. R 1 and R 2 are preferably an alkyl group having 2 to 12 carbon atoms, more preferably an alkyl group having 4 to 10 carbon atoms, and most preferably an alkyl group having 8 carbon atoms. In the compound represented by the formula (1), R 3 is preferably a saturated aliphatic hydrocarbon group. It is preferable that R 3 is unsubstituted. The R 3 is preferably an alkylene group having 4 to 10 carbon atoms, more preferably an alkylene group having 7 to 8 carbon atoms, and most preferably an alkylene group having 8 carbon atoms.
(F) 디카르복실산디에스테르는심부 경화성을 우수하게 하며 점도를 조정하기 위하여 사용되는 화합물이다. (F) 화학식 (1) 에 나타내는 디카르복실산디에스테르로서, 옥살산디메틸, 옥살산디에틸, 옥살산프로필, 옥살산디이소프로필, 옥살산디부틸, 옥살산디헥실, 옥살산디옥틸, 말론산디이소프로필, 말론산디부틸, 숙신산디에틸, 숙신산디프로필, 숙신산디이소프로필, 숙신산디부틸, 숙신산t-부틸, 숙신산비스(2-에틸헥실), 숙신산비스(2-에톡시에틸), 글루타르산디에틸, 글루타르산디부틸, 아디프산디메틸, 아디프산디에틸, 아디프산디프로필, 아디프산디이소프로필, 아디프산디부틸, 아디프산디t-부틸, 아디프산비스(2-에틸헥실),아디프산디옥틸, 피멜산디메틸, 피멜산디에틸, 피멜산디이소프로필, 피멜산디부틸, 수베르산디메틸, 수베르산디에틸, 수베르산디프로필, 수베르산디이소프로필, 아젤라산디메틸, 아젤라산디에틸, 아젤라산디프로필, 아젤라산디이소프로필, 아젤라산디부틸, 아젤라산비스(2-에틸헥실), 세바스산디메틸, 세바스산디에틸, 세바스산디프로필, 세바스산디이소프로필, 세바스산디부틸, 세바스산비스(2-에틸헥실) 등이 있다. 이들 디카르복실산디에스테르 중 1종 이상을 사용할 수 있다. (F) 디카르복실산디에스테르 중에서 세바스산비스(2-에틸헥실)이 가장 바람직하다.(F) The dicarboxylic acid diester is a compound used for adjusting the viscosity, which improves deep curing property. (F) The dicarboxylic acid diester represented by the formula (1) is preferably selected from the group consisting of dimethyl oxalate, diethyl oxalate, propyl oxalate, diisopropyl oxalate, dibutyl oxalate, dihexyl oxalate, dioctyl oxalate, diisopropyl malonate, Propyl succinate, diethyl succinate, diisopropyl succinate, dibutyl succinate, t-butyl succinate, bis (2-ethylhexyl) succinate, bis (2-ethoxyethyl) succinate, diethyl glutarate, (2-ethylhexyl) adipate, diisopropyl adipate, diisopropyl adipate, dibutyl adipate, di-t-butyl adipate, adipic acid bis But are not limited to, octyl, dimethyl pimelate, diethyl pimelate, diisopropyl pimelate, dibutyl pimelate, dimethyl suuberate, diethyl suverate, dipropyl suberate, diisopropyl suabertate, dimethyl azelate, diethyl azelate, Profile, Azela Sandi (2-ethylhexyl) sebacate, diisopropyl sebacate, diisobutyl sebacate, diisobutyl sebacate, diisopropyl sebacate, diisopropyl sebacate, diisopropyl azelate, . One or more of these dicarboxylic acid diesters may be used. Among the dicarboxylic acid diesters (F), sebacic acid bis (2-ethylhexyl) is most preferable.
(F) 디카르복실산디에스테르의 함유량은 (P) 및 (F) 의 합계가 100질량부일 경우, 5 내지 50질량부가 바람직하며, 10 내지 45질량부가 보다 바람직하며, 20 내지 40질량부가 가장 바람직하다. (F) 디카르복실산디에스테르의 함유량이 5질량부 이상일 경후, 보다 우수한 점도와 심부경화성을 얻을수 있고, 50질량부 이하일 경우, 보다 우수한 심부 경화성을 얻을 수 있다. (F) 디카르복실산디에스테르의 함유량은 예를 들어, 5, 6, 7, 8, 9, 10, 11, 15, 20, 21, 25, 29, 30, 31, 35, 39, 40, 41, 49 또는 50질량부 이여도 되고, 그것들 중 임의의 2개 값의 범위내여도 된다.The content of the dicarboxylic acid diester (F) is preferably from 5 to 50 parts by mass, more preferably from 10 to 45 parts by mass, more preferably from 20 to 40 parts by mass, in the case where the total of (P) and (F) is 100 parts by mass Do. (F) When the content of the dicarboxylic acid diester is 5 parts by mass or more, excellent viscosity and deep curing property can be obtained. When the content is 50 parts by mass or less, more excellent deep curing property can be obtained. The content of the dicarboxylic acid diester (F) is, for example, 5,6, 7,8, 9,10, 11,15,20,21,25,29,30,31,35,39,40,41 , 49 or 50 parts by mass, or may be in the range of any two of them.
본 발명의 한가지 실시형태의 조성물은 본 발명의 목적을 방해하지 않는 범위에서 일반적으로 사용되고 있는 아크릴 고무, 우레탄 고무, 아크릴로니트릴-부타디엔-스티렌 고무 등의 각종 엘라스토머, 극성유기용매 등의 용제, 증량제, 보강재, 가소제, 증점제, 염료, 안료, 발화지연제, 실란 커플링제 및 계면활성제 등의 첨가제를 사용하여도 좋다.The composition of one embodiment of the present invention may contain various kinds of additives such as acrylic rubber, urethane rubber, various kinds of elastomers such as acrylonitrile-butadiene-styrene rubber, solvents such as polar organic solvents, , A reinforcing material, a plasticizer, a thickener, a dye, a pigment, a fire retardant, a silane coupling agent, and a surfactant may be used.
본 발명의 한가지 실시 형태의 조성물로 접착한 경화체는 완전히 경화시킨 후에 재작업 (재활용) 할 수 있다. 재작업의 방법으로서 특별한 제한은 없지만 접착시킨 1종 또는 2종의 피착체 사이에 0.01 내지 100N의 하중을 부하함으로써 피착체 끼리를 해체하고 해체 후의 피착체를 다시 이용할 수 있다.The cured product adhered with the composition of one embodiment of the present invention can be reworked (recycled) after being completely cured. As a method of rework, there is no particular limitation, but it is possible to disassociate adherends by applying a load of 0.01 to 100 N between adhered one or two adherends, and to use the adherend after disassembly.
본 발명의 한가지 실시형태의 조성물은경화성 수지조성물이며, 또한, 접착제 조성물로서 사용할 수 있다. 본 발명의 한가지 실시형태의 조성물은 가시광선 또는 자외선을 파장 365nm에서 100mJ/cm2로 조사할 경우 3mm보다 크며, 4mm이상의 심부경화가 가능한 조성물이 바람직하다. 본 발명의 한가지 실시형태의 조성물은 가시광선 또는 자외선을 피착체의 정면측 으로부터 조사한후 가시광선 또는 자외선이 투과하지 않는 개소(箇所)를 피착체의 측면으로부터 조사하여 피착체를 접착할수 있는 접착제 조성물이다.The composition of one embodiment of the present invention is a curable resin composition and can also be used as an adhesive composition. The composition of one embodiment of the present invention is preferably a composition which is visible light ray or ultraviolet ray when exposed at a wavelength of 365 nm to 100 mJ / cm < 2 > The composition of one embodiment of the present invention is an adhesive composition capable of adhering an adherend by irradiating visible light or ultraviolet rays from the front side of an adherend and then irradiating a portion where a visible ray or ultraviolet ray is not transmitted through the side surface of the adherend to be.
본 발명의 한가지 실시형태의 접착제 조성물은가시광선 또는 자외선을 조사함으로써 접착제 조성물의 경화체를 얻을수 있다.The adhesive composition of one embodiment of the present invention can obtain a cured product of an adhesive composition by irradiating visible light or ultraviolet light.
본 발명의 한가지 실시형태의 경화체로부터 피착체가 피복 또는 접합된 복합체를 얻을수 있다. 또한, 피착체는 특별히 한정되지 않지만, 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속으로 이루어지는 군에서 선택되는 1종 이상을 포함하는것이 바람직하다.A composite in which an adherend is coated or bonded from a cured product of one embodiment of the present invention can be obtained. The adherend is not particularly limited, but preferably includes at least one selected from the group consisting of triacetylcellulose, fluoropolymer, polyester, polycarbonate, polyolefin, glass, and metal.
본 발명의 한가지 실시형태의 접착제 조성물을 사용하여 공지방법에 의해 피착체를 첩합시켜 터치 패널 적층체를 얻을 수 있다.A touch panel laminate can be obtained by bonding an adherend by a known method using the adhesive composition of one embodiment of the present invention.
또한, 본 발명의 한가지 실시형태의 접착제 조성물을 사용하여 공지 방법에 의해 피착체를 첩합시킨 터치 패널 적층체를 얻을수 있다. 또한, 상기 터치 패널 적층체를 사용하여 디스플레이를 얻을 수 있다.Further, a touch panel laminate obtained by bonding an adherend by a known method using the adhesive composition of one embodiment of the present invention can be obtained. Further, a display can be obtained by using the touch panel laminate.
또한, 본 발명의 한가지 실시형태의 접착제 조성물을 사용하여 공지 방법에 의해 피착체를 첩합시킨 액정패널 적층체를 얻을수 있다. 또한, 상기 액정패널 적층체를 사용하여 디스플레이를 얻을수 있다.In addition, a liquid crystal panel laminate obtained by bonding an adherend by a known method using the adhesive composition of one embodiment of the present invention can be obtained. Further, a display can be obtained by using the liquid crystal panel laminate.
[실시예][Example]
이하는 실험예로부터 본 발명을 더욱 상세하게 설명하지만, 본 발명은 여기에 한정되는 것이 아니다.Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.
(실험예)(Experimental Example)
특기하지 않는 한 23℃에서 실험을 진행했다. 표1, 표2에 나타내는 조성의 경화성 수지 조성물을 조제하여 평가했다. 그 결과는 표3, 표4에 나타낸다.Experiments were conducted at 23 ° C unless otherwise noted. Curable resin compositions having the compositions shown in Tables 1 and 2 were prepared and evaluated. The results are shown in Tables 3 and 4.
실험예에 기재된 경화성 수지조성물 중의 각 성분으로서, 이하의 화합물을 선택했다.As the respective components in the curable resin composition described in the Experimental Examples, the following compounds were selected.
단, 표의 KRM-8776은, 다이셀싸이텍 제 "KRM-8776" 중에 함유된 우레탄아크릴레이트의 양을 기재한 것이다. 표의 NOAA는, 다이셀싸이텍 제 "KRM-8776" 중에 함유된 n-옥틸아크릴레이트의 양을 기재한 것이다. 다이세루싸이텍 제 "KRM-8776"을 사용하지 않은 경우, 오사카 유기 가가쿠샤 제 n-옥틸아크릴레이트 사용했다.KRM-8776 in the table describes the amount of urethane acrylate contained in "KRM-8776" manufactured by Daicel Scientex. The NOAA in the table lists the amount of n-octyl acrylate contained in the " KRM-8776 " When "KRM-8776" manufactured by Daicel Chemical was not used, n-octyl acrylate manufactured by Osaka Organic Chemical Industry Co., Ltd. was used.
<(P) 중합성 비닐 모노머 (A) 다관능(메타)아크릴레이트><(P) Polymerizable vinyl monomer (A) polyfunctional (meth) acrylate>
(A) 성분의 다관능(메타)아크릴레이트로서, 이하의 화합물을 선택했다.As the polyfunctional (meth) acrylate of the component (A), the following compounds were selected.
(A-1) 폴리에스테르계 우레탄아크릴레이트올리고머 (네가미 고으교샤 제 "KHP-11" 구조는 이하와 같이, 폴리올 화합물은 1,4-부탄디올과 아디프산 사이의 축합물인 폴리에스테르폴리올, 에틸렌글리콜, 및 아디프산과의 축합물인 폴리에스테르폴리올을 가지는 화합물 (1,4-부탄디올과 아디프산 사이의 축합물인 폴리에스테르폴리올과, 에틸렌글리콜과 아디프산 사이의 축합물인 폴리에스테르폴리올=2:3 (몰비), 유기 폴리이소시아네이트 화합물은 이소폴론디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸아크릴레이트, GPC에 의한 폴리스티렌 환산에 의한 중량 평균분자량 25000)(A-1) Polyester-based urethane acrylate oligomer ("KHP-11" structure produced by Negami Kogyo Co., Ltd.) is a polyester polyol which is a condensation product between 1,4-butanediol and adipic acid, (A polyester polyol which is a condensate between 1,4-butanediol and adipic acid and a polyester polyol which is a condensation product between ethylene glycol and adipic acid at a ratio of 2: 3 (molar ratio), isophoronediisocyanate as the organic polyisocyanate compound, 2-hydroxyethyl acrylate as the hydroxy (meth) acrylate, and a weight average molecular weight of 25000 as measured by polystyrene conversion by GPC)
(A-2) 폴리에스테르계 우레탄아크릴레이트올리고마 (니폰 고으세이 가가쿠샤제 "UV-3000B", 구조는 이하와 같이, 폴리올 화합물은 수소화 폴리부타디엔폴리올과 아디프산 사이의 축합물인 폴리에스테르폴리올, 유기 폴리이소시아네이트 화합물은 이소폴론디이소시아네이트, 히드록시(메타)아크릴레이트는 4-히드록시부틸아크릴레이트, GPC에 의한 폴리스티렌 환산에 의한 중량평균분자량 15000, 수소화 폴리부타디엔폴리올은 식 (3) 에 나타내는 화합물 (n은 정수))(A-2) Polyester-based urethane acrylate oligomer ("UV-3000B" manufactured by Nippon Gohsei Kagakusha Co., Ltd .; the polyol compound is a polyester polyol as a condensate between hydrogenated polybutadiene polyol and adipic acid Hydroxybutyl acrylate, a weight average molecular weight of 15,000 in terms of polystyrene conversion by GPC, and a hydrogenated polybutadiene polyol represented by the formula (3). The polyisocyanate compound represented by the formula Compound (n is an integer))
(A-3) 폴리부타디엔계 우레탄아크릴레이트 (다이셀싸이텍 제 "KRM-8776", 수소화 폴리부타디엔 골격을 가지는 우레탄아크릴레이트 이다. 또한 구조는 이하와 같이, 폴리올화합물은 수소화 폴리부타디엔폴리올, 유기 폴리이소시아네이트 화합물은 이소폴론디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸아크릴레이트, GPC에 의한 폴리스티렌 환산에 의한 중량 평균분자량은 19000, 수소화 폴리부타디엔폴리올은 식 (3) 에 나타내는 화합물 (n은 정수), 다만 희석 모노머로서, n-옥틸아크릴레이트를 30질량% 함유)(A-3) Polybutadiene-based urethane acrylate ("KRM-8776" manufactured by Daicel Scientex, urethane acrylate having a hydrogenated polybutadiene skeleton. The polyol compound is a hydrogenated polybutadiene polyol, The weight average molecular weight of the polyisocyanate compound in the case of isophorone diisocyanate, hydroxy (meth) acrylate in 2-hydroxyethyl acrylate, polystyrene conversion by GPC is 19000, and the hydrogenated polybutadiene polyol is a compound represented by the formula (3) (n is an integer), but diluting monomer containing 30 mass% of n-octyl acrylate)
<(P) 중합성 비닐 모노머의 단관능(메타)아크릴레이트><Unifunctional (meth) acrylate of (P) polymerizable vinyl monomer>
(B) 성분의 단관능(메타)아크릴레이트로서, 이하의 화합물을 선택했다.As the monofunctional (meth) acrylate of the component (B), the following compounds were selected.
(B-1) 라우릴아크릴레이트 (오사카 유기 가가쿠샤 제 "LA")(B-1) lauryl acrylate ("LA" manufactured by Osaka Organic Chemical Industry Co., Ltd.)
(B-2) 2-히드록시부틸아크릴레이트 (교에이 가가쿠샤 제 "HOB-A")(B-2) 2-hydroxybutyl acrylate ("HOB-A" manufactured by Kyowa Chemical Co., Ltd.)
(B-3) n-옥틸아크릴레이트 (이하 "NOAA"로 생략한다)(B-3) n-octyl acrylate (hereinafter abbreviated as "NOAA &
<(C) 광중합 개시제><(C) Photopolymerization initiator>
(C) 성분의 광중합 개시제로서, 이하의 화합물을 선택했다.As the photopolymerization initiator of the component (C), the following compounds were selected.
(C-1) 1-히드록시-시클로헥실페닐케톤 (BASF샤 제 "Irgacure184", 이하 "I-184" 로 생략한다)(C-1) 1-Hydroxy-cyclohexyl phenyl ketone ("Irgacure 184", hereinafter abbreviated as "I-184"
(C-2) 2,4,6-트리메틸벤조일디페닐포스핀옥사이드 (BAS사 제 "LucirinTPO", 이하 "TPO"로 생략한다)(C-2) 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("Lucirin TPO" by BAS, hereinafter abbreviated as "TPO"),
<(D) 산화 방지제>≪ (D) Antioxidant >
(D) 성분의 산화 방지제로서, 이하의 화합물을 선택했다.As the antioxidant of the component (D), the following compounds were selected.
(D-1) 6-tert-부틸-4-[3-[(2,4,8,10-테트라-tert-부틸디벤조[d, f][1,3,2] 디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀 (스미토모 가가쿠 고으교샤 제 "수미라이저 GP") (이하 "GP"로 생략한다)(D-1) 6-tert-Butyl-4- [3 - [(2,4,8,10-tetra-butyldibenzo [d, f] [1,3,2] dioxaphosphper- Yl) oxy] propyl] -2-methylphenol ("Sumilizer GP" manufactured by Sumitomo Chemical Co., Ltd.) (hereinafter abbreviated as "GP"
<(E) 티올><(E) Thiol>
티올 화합물로서, 이하의 화합물을 선택했다.As thiol compounds, the following compounds were selected.
(E-1) 펜타에리트리톨테트라키스(3-메르캅토부티레이트) (쇼와 덴코샤 제 "카렌즈 MT PE1") (이하 "MT-PE1"로 생략한다)(Hereinafter referred to as " MT-PE1 ") (E-1) pentaerythritol tetrakis (3-mercaptobutyrate)
(E-2) 펜타 에리트 리톨 테트라 키스 ( 3- 머 캅토 프로 피오 네이트 ) (SC 유기 가가쿠 제 "PBMP")(E-2) pentaerythritol tetrakis (3-mercaptopropionate) (SC Organic Gagaku "PBMP")
(E-3) 1- 도데칸 티올(시그마/올드리치샤 제"DDT")(E-3) 1-Dodecanethiol (Sigma / Aldrich Chase "DDT")
<(F) 디카르복실산디에스테르>≪ (F) Dicarboxylic acid diester >
(F) 에 관하여 식 (1) 로 나타내는 디카르복실산디에스테르로서, 이하의 화합물을 선택했다.(F), the following compounds were selected as the dicarboxylic acid diester represented by the formula (1).
(F-1) 세바스산비스(2-에틸헥실) (신니폰 리카샤 제 "상서사이자 DOS") (이하 "DOS"로 생략한다)(Hereinafter referred to as "DOS") (F-1) bis (2-ethylhexyl) sebacate
(F-2) 세바스산디부틸 (와코 쥰야크샤 제) (이하 "DBS"로 생략한다)(F-2) dibutyl sebacate (Wako Pure Yakusha) (hereinafter abbreviated as "DBS"),
(F-3) 아젤라산비스(2-에틸헥실) (와코 쥰야크샤 제) (이하 "DOZ"로 생략한다)(F-3) Azela acid bis (2-ethylhexyl) (Wako Pure Yakusha) (hereinafter referred to as "DOZ"
(F-4) 아디핀산비스(2-에틸헥실) (와코 쥰야크샤 제) (이하 "DOA"로 생략한다)(F-4) adipic acid bis (2-ethylhexyl) (Wako Pure Yakusha) (hereinafter referred to as "DOA"
각 물성은 이하와 같이 측정했다.Each physical property was measured as follows.
[광경화성][Photocurable]
온도 23℃에서 측정했다. 광경화성에 관해서는 텐팍스 유리 (폭 25mm×길이 25mm×두께 2mm)의 표면에 경화성 수지 조성물을 두께 0.1mm가 되도록 도포했다. 그 후, 무전극 방전 램프를 사용한 퓨전사제 경화장치를 이용하여 파장 365nm의 UV광선을 적산광량 2000mJ/cm2의 조건에서 조사하여 경화시켰다.And the temperature was measured at 23 캜. Regarding the photo-curability, the curable resin composition was applied to the surface of a tenpax glass (25 mm wide × 25 mm long × 2 mm thick) so as to have a thickness of 0.1 mm. Thereafter, UV light having a wavelength of 365 nm was irradiated under the condition of an accumulated light quantity of 2000 mJ / cm 2 by using a Fusion-type curing apparatus using a non-electrode discharge lamp, and cured.
경화율은 FT-IR를 사용하여 이하의 방식으로 산출했다. 탄소와 탄소의 이중결합의 흡수 스펙트럼은 1600cm- 1부근의 피크를 사용했다.The curing rate was calculated in the following manner using FT-IR. Absorption spectrum of the carbon-carbon double bond is 1600cm - used the peak in the vicinity of 1.
(경화 비율)=100-(경화 후의 탄소와 탄소의 이중 결합의 흡수 스펙트럼의 강도)/(경화 전의, 탄소와 탄소의 이중 결합의 흡수 스펙트럼의 강도)×100(%)(Intensity of absorption spectrum of double bond of carbon and carbon after curing) / (intensity of absorption spectrum of double bond of carbon and carbon before curing) x 100 (%)
[경화 수축률][Curing shrinkage rate]
비중병에 경화성 수지 조성물을 충전(充塡)하고 대기 중의 질량 및 순수(純水)에서의 질량을 측정하고, 액체 비중을 산출했다. 또한, 경화성 수지 조성물을 [광경화성]에 기재된 방법으로 경화시켜, 너비 25mm×길이 25mm×두께 2mm의 경화물을 제작하여, 대기 중에서의 질량 및 순수에서의 질량을 측정하여 경화물 비중을 산출했다. 액체 비중 및 경화물 비중의 비율로 경화 수축률을 산출했다.The curing resin composition was filled in a syringe bottle, and the mass in the atmosphere and the mass in the pure water were measured, and the liquid specific gravity was calculated. Further, the curable resin composition was cured by the method described in [Photocurable property] to prepare a cured product having a width of 25 mm, a length of 25 mm and a thickness of 2 mm, and the mass in the atmosphere and pure water was measured to calculate the specific gravity of the cured product . And the hardening shrinkage ratio was calculated by the ratio of the specific gravity of the liquid and the specific gravity of the cured product.
경화 수축률=(경화물 비중-액체 비중)/경화물 비중)×100(%)Cure shrinkage ratio = (cured product specific gravity - liquid specific gravity) / cured product specific gravity) x 100 (%)
[심부 경화성][Deep curing property]
직경 5mmφ의 구멍이 뚫린 길이가 20mm 검정색 튜브에 경화성 수지 조성물을 충전시키고, 상부로부터 블랙 라이트로 1mW/cm2 (365nm)의 광선을 100초간 조사한다 (적산 광량은 100mJ/cm2). 그 후 검정색 튜브에서 경화물을 꺼내어 경화되지 못한 부분을 제거한 후 경화된 부분을 마이크로미터로 두께를 측정했다.A curable resin composition was filled in a 20 mm black tube having a hole having a diameter of 5 mm in diameter and irradiated with a beam of 1 mW / cm 2 (365 nm) for 100 seconds from the upper side (total light quantity: 100 mJ / cm 2 ). The cured product was then removed from the black tube to remove the non-cured portion and the cured portion was measured in micrometer thickness.
[폴리에틸렌테레프탈레이트 (PET)의 접착성 평가 (폴리에틸렌테레프탈레이트 시험편 간의 박리 접착 강도)][Evaluation of adhesion of polyethylene terephthalate (PET) (peel adhesion strength between polyethylene terephthalate test pieces)]
2축 연신 PET필름 (루미러 T60, 평균 두께 190μm, 도레이사 제)의 시험편 (너비 50mm×길이 10mm×두께 0.19mm)끼리를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 30μm로 접착면적을 세로 40mm×가로 10mm로 접착시켰다. 광조사에 의해 경화 시킨후 접착제 조성물로 접착한 상기 시험편의 밀착되지 않은 2개소의 필름 단부를 당겨서 필름 사이가 밀착된 부분을 박리시킴으로써 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은[광경화성]에서 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm)는 인장(引張) 시험기를 이용하여 온도 23℃, 습도 50%의 환경에서 인장 속도 50mm/분에서 측정했다.A test piece (width 50 mm x length 10 mm x thickness 0.19 mm) of a biaxially stretched PET film (Loumirer T60, average thickness 190 占 퐉, manufactured by Doreya Co., Ltd.) was used as an adhesive composition, Was bonded in a length of 40 mm and a width of 10 mm. The initial 180 ° peel adhesion strength was measured by pulling out the two unfouled film ends of the test piece adhered with the adhesive composition after curing by light irradiation to peel off the portion where the films were in close contact with each other. The light irradiation conditions were as described in [Photocurable property]. The peel adhesion strength (unit: N / cm) was measured at a tensile rate of 50 mm / min in an environment of a temperature of 23 DEG C and a humidity of 50% using a tensile tester.
[유리 접착성 평가 (내열 유리 시험편 사이의 인장 접착 강도)][Evaluation of glass adhesion property (Tensile adhesion strength between heat resistant glass test pieces)] [
내열 유리 시험편 (폭 25mm×길이 25mm×두께 2.0mm)끼리를 두께 80μm×폭 11.5mm×길이 25mm의 테플론 (등록 상표) 테이프를 스페이서로 사용하고, 경화성 수지 조성물을 접착제 조성물로 사용하여 접착시켰다 (접착 면적 3cm2). 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 상기 조건에서 접착제 조성물을 경화 시킨 뒤, 시험편의 양면에 전기화학공업사 제 접착제 조성물 "G-55" 를 사용하여 아연 도금 강판 (폭 100mm×길이 25mm×두께 2.0mm, 엔지니어링 테스트 서비스샤 제)을 접착시켰다. 경화후 접착제 조성물로 접착시킨 시험편을 사용하여 아연 도금 강판을 체크하여, 초기의 인장 전단 접착 강도를 측정했다. 전단 접착 강도 (단위:MPa) 는 인장 시험기를 이용하여 온도 23℃, 습도 50%의 환경에서 인장 속도 10mm/분에서 측정했다.A Teflon (registered trademark) tape having a thickness of 80 m, a width of 11.5 mm and a length of 25 mm was used as a spacer between the heat-resistant glass test pieces (25 mm in width x 25 mm in length x 2.0 mm in thickness) and adhered using a curable resin composition as an adhesive composition Adhesive area 3 cm 2 ). The light irradiation conditions were in accordance with the method described in [Photocuring property]. After curing the adhesive composition under the above conditions, a galvanized steel sheet (100 mm wide × 25 mm long × 2.0 mm thick, Engineering Test Service) was adhered to both surfaces of the test piece using an adhesive composition "G-55" . After curing, the zinc plated steel sheet was checked using a test piece adhered with an adhesive composition, and initial tensile shear bond strength was measured. The shear bond strength (unit: MPa) was measured at a tensile rate of 10 mm / min in an environment of a temperature of 23 ° C and a humidity of 50% using a tensile tester.
[시클로올레핀 폴리머 (COP) 접착성 평가 (시클로올레핀 폴리머 시험편 사이의 박리 접착 강도)][Evaluation of Cycloolefin Polymer (COP) Adhesion (Peel Adhesion Strength Between Cycloolefin Polymer Test Specimens)]
COP 필름 (ZEONOR, 평균 두께 40μm, 일본제온사 제)의 시험편 (너비 50mm×길이 10mm×두께 0.04mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 10μm로 접착 면적을 세로 40mm×가로 10mm로 접착시켰다. 광조사에 의해 경화시킨후, 접착제로 접착된 해당 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은 [광경화성]에서 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm) 는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 50mm/분에서 측정했다.A curing resin composition was used as an adhesive composition between a COP film (ZEONOR, average thickness 40 μm, manufactured by Japan K.K.) test piece (width 50 mm × length 10 mm × thickness 0.04 mm) 10 mm in width. The initial 180 ° peel adhesion strength was measured by curing by light irradiation and then pulling the end portions of the two unfiltered films of the test specimen glued with the adhesive to separate the adhered portions between the films. The light irradiation conditions were as described in [Photocurable property]. The peel adhesion strength (unit: N / cm) was measured at a tensile speed of 50 mm / min under an environment of a temperature of 23 캜 and a humidity of 50% using a tensile tester.
[트리아세틸셀룰로오스 접착성 평가 (트리아세틸셀룰로오스 시험편 사이의 박리 접착 강도)][Evaluation of Triacetyl Cellulose Adhesion (Peel Adhesion Strength Between Triacetyl Cellulose Test Specimens)
트리아세틸셀룰로오스 (TAC) 필름 (평균 두께 40μm, 후지 필름샤 제)의 시험편 (너비 50mm×길이 10mm×두께 0.04mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 10μm로 접착 면적을 세로 40mm×가로 10mm로 접착시켰다. 접착제 조성물로 접착시킨 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사로 경화시킨 뒤, 접착제 조성물로 접착한 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm) 는 인장 시험기를 이용하여 온도 23℃, 습도 50%의 환경하에서 인장속도 50mm/분에서 측정했다.A curable resin composition was used as an adhesive composition between a triacetyl cellulose (TAC) film (average thickness: 40 占 퐉, manufactured by Fuji Film Co., Ltd.) (width 50 mm x length 10 mm x thickness 0.04 mm) 40 mm in length x 10 mm in width. The initial 180 ° peel adhesion strength was measured by pulling the ends of two unfiltered films of the test piece adhered with the adhesive composition to separate the close contact between the films. The initial 180 ° peel adhesion strength was measured by curing by light irradiation and then pulling the ends of the two unfiltered films of the test piece adhered with the adhesive composition to separate the adhered portions between the films. The light irradiation conditions were in accordance with the method described in [Photocuring property]. Peel adhesion strength (unit: N / cm) was measured at a tensile speed of 50 mm / min under an environment of a temperature of 23 캜 and a humidity of 50% using a tensile tester.
[불소계 폴리머 접착성 평가 (불소 폴리머 시험편 사이의 박리 접착 강도)][Evaluation of fluoropolymer adhesiveness (peel adhesion strength between fluoropolymer test pieces)]
PVDF (Polyvinylidene fluoride) 필름 (평균 두께 40μm, 덴키 가가쿠 고교샤 제 "DX필름") 의 시험편 (폭 50mm×길이 10mm×두께 0.04mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 10μm로 접착 면적을 세로 40mm×가로 10mm로 접착시켰다. 접착제 조성물로 접착시킨 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로서 초기의 180° 박리 접착 강도를 측정했다. 광조사로 경화시킨뒤, 접착제 조성물로 접착한 상기 시험편의 밀착되지 못한 2개소의 필름의 단부를 당겨서 필름 사이의 밀착된 부분을 분리시킴으로써 초기의 180° 박리 접착 강도를 측정했다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 박리 접착 강도 (단위:N/cm)는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 50mm/분에서 측정했다.A curable resin composition was used as an adhesive composition between a test piece (width 50 mm x length 10 mm x thickness 0.04 mm) of a PVDF (polyvinylidene fluoride) film (average thickness 40 m, "DX film" manufactured by Denki Kagaku Kogyo K.K.) 10 mm, and the bonding area was bonded with a length of 40 mm and a width of 10 mm. The initial 180 ° peel adhesion strength was measured by pulling the ends of two unfiltered films of the test piece adhered with the adhesive composition to separate the close contact between the films. The initial 180 ° peel adhesion strength was measured by curing by light irradiation and then pulling the ends of the two unfiltered films of the test piece adhered with the adhesive composition to separate the adhered portions between the films. The light irradiation conditions were in accordance with the method described in [Photocuring property]. The peel adhesion strength (unit: N / cm) was measured at a tensile speed of 50 mm / min under an environment of a temperature of 23 캜 and a humidity of 50% using a tensile tester.
[폴리카보네이트 접착성 평가 (폴리카보네이트 시험편 사이의 인장 접착 강도)][Evaluation of Polycarbonate Adhesion (Tensile Adhesion Strength Between Polycarbonate Test Specimens)
폴리카보네이트 (테이진샤 제 "판라이트") 시험편 (폭 25mm×길이 25mm×두께 2.0mm) 사이를 두께 80μm×폭 12.5mm×길이 25mm의 테플론 (등록 상표) 테이프를 스페이서로 사용하고, 경화성 수지조성물을 접착제 조성물로 사용하여 접착시켰다 (접착 면적 3cm2). 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 전단 접착 강도 (단위:MPa)는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 10mm/분에서 측정했다.A Teflon (registered trademark) tape having a thickness of 80 占 퐉, a width of 12.5 mm and a length of 25 mm was used as a spacer between polycarbonate ("Panlite") test piece (25 mm in width × 25 mm in length × 2.0 mm in thickness) (Adhesive area: 3 cm < 2 >). The light irradiation conditions were in accordance with the method described in [Photocuring property]. The shear bond strength (unit: MPa) was measured at a tensile speed of 10 mm / min under an environment of a temperature of 23 ° C and a humidity of 50% using a tensile tester.
[내습열성 평가 (고온 고습 폭로 후의 내열 유리 시험편 사이의 인장 접착 강도)][Evaluation of Humidity Resistance (Tensile Adhesive Strength Between Heat-Resistant Glass Test Specimens After High-Temperature and High-humidity Exposure)]
텐팍스 (등록 상표) 유리 (폭 25mm×길이 25mm×두께 2mm) 사이를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 100μm로 접착 면적을 1.0cm2로 접착시킨 후 경화시켰다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 경화 후 접착제 조성물로 접착한 시험편을,항온 항습 장치를 사용하여 온도 85℃, 상대 습도 85%의 환경하에서 1000시간 폭로(暴露)했다. 폭로 후의 시험편을 이용하여 전단 접착 강도를 측정했다. 전단 접착 강도 (단위:MPa) 는 인장 시험기를 사용하여 온도 23℃, 습도 50%의 환경하에서 인장 속도 10mm/분에서 측정했다.A curable resin composition was used as an adhesive composition between Tenpaks (registered trademark) glass (25 mm in width x 25 mm in length x 2 mm in thickness), and an adhesive area of 100 m in thickness was bonded at 1.0 cm < 2 > The light irradiation conditions were in accordance with the method described in [Photocuring property]. After curing, the test piece adhered with the adhesive composition was exposed (exposed) for 1000 hours under a temperature of 85 캜 and a relative humidity of 85% using a constant temperature and humidity device. The shear bond strength was measured using a test piece after exposure. The shear bond strength (unit: MPa) was measured at a tensile speed of 10 mm / min under an environment of a temperature of 23 ° C and a humidity of 50% using a tensile tester.
[내습열성(耐濕熱性) 평가 (외관관찰 (면정밀도 변화와 황변도(黃變度))][Evaluation of heat and humidity resistance (Appearance observation (change in surface precision and yellowing degree)]
텐팍스 (등록 상표) 유리 (폭 25mm×길이 25mm×두께 2mm) 를 경화성 수지 조성물을 접착제 조성물로 사용하고, 접착층의 두께 100μm로 접착 면적을 1.0cm2로 접착, 경화시켰다. 광조사 조건은 [광경화성]에 기재된 방법에 따랐다. 경화 후 접착제 조성물로 접착한 시험편을 항온 항습 장치를 사용하여 온도 85℃, 상대습도 85%의 환경하에 1000시간 폭로했다. 폭로 후 접착제 조성물로 접착한 상기 시험편의 Δb값을 칼라 측정 장치 (SHIMADZU사 제 "UV-VISIBLE SPECTROPOHOTOMETER"로 황변도를 측정했다. 폭로 후 접착 부위의 외관을 눈으로 관찰하여 면정밀도 변화의 판단 기준으로서 치수변화나휘어짐 여부, 황변 여부를 조사했다.Tenax (registered trademark) glass (25 mm in width x 25 mm in length x 2 mm in thickness) was used as an adhesive composition, and the adhesive layer was bonded and cured at an adhesive area of 1.0 cm 2 with a thickness of 100 m. The light irradiation conditions were in accordance with the method described in [Photocuring property]. After the curing, the test pieces adhered with the adhesive composition were exposed for 1000 hours under a temperature of 85 캜 and a relative humidity of 85% using a constant temperature and humidity device. The? B value of the test piece adhered with the adhesive composition after exposure was measured with a color measuring device ("UV-VISIBLE SPECTROPHOHOTOMETER" manufactured by SHIMADZU Co., Ltd.). The appearance of the adhesion portion was visually observed after exposure, , Whether or not dimensional changes and warpage, and whether or not they were yellow.
실험예에서, 이하와 같은 점을 알수 있다. 본 발명의 실시예에 해당되는 경화성 수지 조성물은 심부 경화성이 뛰여나다. 예를 들면, 빛을 차광 테두리의 사선 방향이나 가로 방향에서 조사하는 경우에도, 차광 테두리 아래측 경화성 수지 조성물을 심부까지 경화시킬 수 있다.In the experimental example, the following points can be known. The curable resin composition according to the embodiment of the present invention has deep curing properties. For example, even when light is irradiated in the oblique direction or the transverse direction of the light-shielding frame, the light-curing resin composition under the light-shielding frame can be cured to the core portion.
더욱이, 본 발명의 실시예에 해당되는 경화성 수지 조성물은 차광 테두리 아래 측에서도 미약한 빛 (예를 들면, 적산 광량 1000 내지 3000mJ/cm2의 빛) 으로 심부까지 경화시킬 수 있다.Furthermore, the curable resin composition according to the embodiment of the present invention can be cured to a deep portion with a weak light (for example, light with an accumulated light quantity of 1000 to 3000 mJ / cm 2 ) even on the side below the light shielding frame.
본 발명의 실시예에 해당되는 경화성 수지 조성물의 실험예는 경화 수축률이 낮으므로 내습열성 시험 후의 치수변화나 휘어짐 등의 면정밀도의 변화가 보이지 않았다. 실험예 6은 (E) 성분의 티올기의 개수가 1개이기때문에, 실험예 2, 실험예 3의 폴리티올을 이용한 경화성 수지 조성물보다 심부 경화성이 작았다.Experimental examples of the curable resin compositions corresponding to the examples of the present invention showed no change in surface precision such as dimensional change and warpage after the moisture resistance thermostability test because the hardening shrinkage rate was low. In Experimental Example 6, since the number of thiol groups in the component (E) was one, deep curing properties were smaller than those of the curable resin compositions using the polythiol of Experimental Examples 2 and 3.
본 발명의 실시예에 해당되는 경화성 수지 조성물은 내열시험 이후의 착색과 변색, 내습시험 이후의 강도 저하 등 문제가 일어나지 않았다.The curable resin composition according to the examples of the present invention did not cause problems such as discoloration and discoloration after the heat resistance test and decrease in strength after the humidity resistance test.
Claims (16)
(P) 중합성 비닐 모노머,
(C) 광중합 개시제,
(D) 산화방지제,
(E) 티올,
(F) 디카르복실산디에스테르.A composition comprising (P), (C) to (F)
(P) a polymerizable vinyl monomer,
(C) a photopolymerization initiator,
(D) antioxidants,
(E) thiol,
(F) dicarboxylic acid diester.
식 (1)
(R1, R2는 탄소수가 1 내지 18인 알킬기이며, R3는 탄소수가 1 내지 10인 알킬렌기이며, R1, R2와 동일해도 되고 상이해도 된다.)The composition according to claim 1, wherein the (D) dicarboxylic acid diester is a dicarboxylic acid diester represented by Formula (1).
Equation (1)
(Wherein R 1 and R 2 are alkyl groups having 1 to 18 carbon atoms and R 3 is an alkylene group having 1 to 10 carbon atoms and may be the same as or different from R 1 and R 2 )
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013245340 | 2013-11-27 | ||
| JPJP-P-2013-245340 | 2013-11-27 | ||
| PCT/JP2014/081115 WO2015080101A1 (en) | 2013-11-27 | 2014-11-25 | Composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160091962A true KR20160091962A (en) | 2016-08-03 |
| KR102241678B1 KR102241678B1 (en) | 2021-04-19 |
Family
ID=53199041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167017094A KR102241678B1 (en) | 2013-11-27 | 2014-11-25 | Composition |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6594208B2 (en) |
| KR (1) | KR102241678B1 (en) |
| CN (1) | CN105764930B (en) |
| TW (1) | TWI653282B (en) |
| WO (1) | WO2015080101A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201709762XA (en) * | 2015-05-26 | 2017-12-28 | Denka Company Ltd | Composition |
| JP6886302B2 (en) * | 2016-06-01 | 2021-06-16 | ミネベアミツミ株式会社 | UV curable resin composition and sliding member |
| CN108264882A (en) * | 2017-01-03 | 2018-07-10 | 台虹科技股份有限公司 | Adhesive composition and flexible laminate structure |
| JP6906860B2 (en) * | 2017-09-19 | 2021-07-21 | 日本化薬株式会社 | Display adhesive |
| KR20190032222A (en) * | 2017-09-19 | 2019-03-27 | 닛뽄 가야쿠 가부시키가이샤 | Adhesive for display |
| WO2021019756A1 (en) * | 2019-08-01 | 2021-02-04 | 株式会社オートネットワーク技術研究所 | Wire harness, wire harness manufacturing method, photocurable composition, and cured product of same |
| JP7419697B2 (en) * | 2019-08-01 | 2024-01-23 | 株式会社オートネットワーク技術研究所 | Wire Harness |
| WO2021019757A1 (en) * | 2019-08-01 | 2021-02-04 | 株式会社オートネットワーク技術研究所 | Wire harness, method for manufacturing wire harness, light-curable composition, and cured product thereof |
| CN110540825B (en) * | 2019-09-16 | 2021-05-04 | 杭州得力科技股份有限公司 | Preparation method of high-refractive-index UV curing adhesive and product |
| JP7303713B2 (en) * | 2019-09-24 | 2023-07-05 | アイカ工業株式会社 | UV curable resin composition |
| JP7426218B2 (en) * | 2019-12-04 | 2024-02-01 | アイカ工業株式会社 | UV curable resin composition |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6485209A (en) | 1987-09-25 | 1989-03-30 | Kemitetsuku Kk | Ultraviolet ray curable adhesive composition |
| JPH07324123A (en) | 1994-04-07 | 1995-12-12 | Showa Denko Kk | Thermosetting allylic resin composition excellent in curability |
| JP2002097224A (en) | 2000-09-26 | 2002-04-02 | Mitsubishi Chemicals Corp | Photosetting composition and its cured product |
| JP2004077887A (en) | 2002-06-18 | 2004-03-11 | Sony Corp | Display and electronic equipment having display |
| JP2009001655A (en) | 2007-06-21 | 2009-01-08 | Nippon Kayaku Co Ltd | Light curing transparent adhesive composition |
| JP2010027041A (en) | 2008-06-18 | 2010-02-04 | Ricoh Co Ltd | Information processing apparatus and program |
| JP2012046658A (en) | 2010-08-27 | 2012-03-08 | Kyoritsu Kagaku Sangyo Kk | Photocurable adhesive composition for pasting optical display or touch sensor and optical display or touch sensor pasted by using the same |
| KR20120056788A (en) * | 2010-11-25 | 2012-06-04 | 니폰 쇼쿠바이 컴파니 리미티드 | Ultraviolet curable resin composition for optical use, cured product and display device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001026608A (en) * | 1999-05-10 | 2001-01-30 | Denki Kagaku Kogyo Kk | Photocurable resin composition |
| JP2006293094A (en) * | 2005-04-12 | 2006-10-26 | Mitsubishi Chemicals Corp | Photopolymerizable composition, image forming material and imaging material |
| JP5174331B2 (en) * | 2006-07-06 | 2013-04-03 | 昭和電工株式会社 | Electron beam curable composition, electron beam curable resin and use thereof |
| KR20100112148A (en) * | 2007-12-28 | 2010-10-18 | 이 아이 듀폰 디 네모아 앤드 캄파니 | Actinically curable adhesive composition |
| JP2009223216A (en) * | 2008-03-18 | 2009-10-01 | Sekisui Chem Co Ltd | Curable resin composition for column spacer, column spacer, and liquid crystal display element |
| JP5476758B2 (en) * | 2009-03-19 | 2014-04-23 | Ｊｓｒ株式会社 | Radiation sensitive resin composition, interlayer insulating film of liquid crystal display element, protective film, spacer and method for forming the same |
| JP5764040B2 (en) * | 2010-11-25 | 2015-08-12 | 株式会社日本触媒 | Optical UV-curable resin composition, cured product, and display device |
| TW201317315A (en) * | 2011-08-26 | 2013-05-01 | Denki Kagaku Kogyo Kk | Curable resin composition |
| JP5843348B2 (en) * | 2011-09-14 | 2016-01-13 | デンカ株式会社 | Highly adhesive acrylic resin composition and use thereof |
| JP5869916B2 (en) * | 2012-03-02 | 2016-02-24 | デンカ株式会社 | Photocurable resin composition |
| CN106978092B (en) * | 2012-03-22 | 2020-06-23 | 日立化成株式会社 | Photocurable resin composition |
-
2014
- 2014-11-25 JP JP2015550935A patent/JP6594208B2/en active Active
- 2014-11-25 CN CN201480065140.5A patent/CN105764930B/en active Active
- 2014-11-25 KR KR1020167017094A patent/KR102241678B1/en active IP Right Grant
- 2014-11-25 WO PCT/JP2014/081115 patent/WO2015080101A1/en active Application Filing
- 2014-11-26 TW TW103140931A patent/TWI653282B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6485209A (en) | 1987-09-25 | 1989-03-30 | Kemitetsuku Kk | Ultraviolet ray curable adhesive composition |
| JPH07324123A (en) | 1994-04-07 | 1995-12-12 | Showa Denko Kk | Thermosetting allylic resin composition excellent in curability |
| JP2002097224A (en) | 2000-09-26 | 2002-04-02 | Mitsubishi Chemicals Corp | Photosetting composition and its cured product |
| JP2004077887A (en) | 2002-06-18 | 2004-03-11 | Sony Corp | Display and electronic equipment having display |
| JP2009001655A (en) | 2007-06-21 | 2009-01-08 | Nippon Kayaku Co Ltd | Light curing transparent adhesive composition |
| JP2010027041A (en) | 2008-06-18 | 2010-02-04 | Ricoh Co Ltd | Information processing apparatus and program |
| JP2012046658A (en) | 2010-08-27 | 2012-03-08 | Kyoritsu Kagaku Sangyo Kk | Photocurable adhesive composition for pasting optical display or touch sensor and optical display or touch sensor pasted by using the same |
| KR20120056788A (en) * | 2010-11-25 | 2012-06-04 | 니폰 쇼쿠바이 컴파니 리미티드 | Ultraviolet curable resin composition for optical use, cured product and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6594208B2 (en) | 2019-10-23 |
| KR102241678B1 (en) | 2021-04-19 |
| WO2015080101A1 (en) | 2015-06-04 |
| CN105764930A (en) | 2016-07-13 |
| CN105764930B (en) | 2018-11-16 |
| JPWO2015080101A1 (en) | 2017-03-16 |
| TWI653282B (en) | 2019-03-11 |
| TW201546159A (en) | 2015-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102241678B1 (en) | Composition | |
| KR102532767B1 (en) | composition | |
| KR101942546B1 (en) | Curable resin composition | |
| TWI649389B (en) | Ultraviolet-curable adhesive composition, method for producing ultraviolet-curable adhesive sheet, and method for producing laminated body | |
| JP6625534B2 (en) | UV curable adhesive composition for touch panel and article | |
| JP6767869B2 (en) | Composition | |
| JPWO2015190552A1 (en) | UV curable resin composition for touch panel, laminating method and article using the same | |
| KR20170020344A (en) | Ultraviolet curable resin composition for touch panel, bonding method using same, and product | |
| WO2015190558A1 (en) | Double-sided adhesive sheet for image display devices, and article | |
| JPWO2015190563A1 (en) | UV curable resin composition for touch panel, laminating method and article using the same | |
| KR20170105523A (en) | Method for producing image display device, curable resin composition to be used therein, touch panel, and image display device | |
| JP6130154B2 (en) | Curable resin composition | |
| KR102004534B1 (en) | Curable resin composition | |
| JP6454268B2 (en) | Curable resin composition | |
| JP6404552B2 (en) | Curable resin composition | |
| KR20190092486A (en) | Composition | |
| JP2016222861A (en) | Double-sided adhesive sheet for picture display unit and article | |
| KR102278154B1 (en) | Dual curable adhesive composition | |
| TW201627458A (en) | Ultraviolet-curable adhesive agent composition, method for manufacturing ultraviolet-curable adhesive sheet, and method for manufacturing laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |