KR102532767B1 - composition - Google Patents
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- KR102532767B1 KR102532767B1 KR1020177036960A KR20177036960A KR102532767B1 KR 102532767 B1 KR102532767 B1 KR 102532767B1 KR 1020177036960 A KR1020177036960 A KR 1020177036960A KR 20177036960 A KR20177036960 A KR 20177036960A KR 102532767 B1 KR102532767 B1 KR 102532767B1
- Authority
- KR
- South Korea
- Prior art keywords
- meth
- acrylate
- composition
- mass
- parts
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 84
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 131
- -1 vinyl compound Chemical class 0.000 claims abstract description 71
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 42
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 10
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 150000003573 thiols Chemical class 0.000 claims abstract description 9
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 34
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 239000011342 resin composition Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 150000003505 terpenes Chemical class 0.000 claims description 18
- 235000007586 terpenes Nutrition 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- WNLRTRBMVRJNCN-UHFFFAOYSA-N hexanedioic acid Natural products OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 13
- 229920006295 polythiol Polymers 0.000 claims description 13
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 12
- 229920000515 polycarbonate Polymers 0.000 claims description 12
- 239000004417 polycarbonate Substances 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 11
- 125000002947 alkylene group Chemical group 0.000 claims description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 229920000728 polyester Polymers 0.000 claims description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 9
- 239000001361 adipic acid Substances 0.000 claims description 7
- 235000011037 adipic acid Nutrition 0.000 claims description 7
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- 239000005011 phenolic resin Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 150000005690 diesters Chemical class 0.000 claims description 5
- CXMXRPHRNRROMY-UHFFFAOYSA-N n-Decanedioic acid Natural products OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 5
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 3
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229920005862 polyol Polymers 0.000 description 37
- 150000001875 compounds Chemical class 0.000 description 29
- 239000005062 Polybutadiene Substances 0.000 description 28
- 229920002857 polybutadiene Polymers 0.000 description 28
- 150000003077 polyols Chemical class 0.000 description 27
- 238000001723 curing Methods 0.000 description 21
- 238000012360 testing method Methods 0.000 description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 239000005056 polyisocyanate Substances 0.000 description 11
- 229920001228 polyisocyanate Polymers 0.000 description 11
- 229920005906 polyester polyol Polymers 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 7
- 238000002845 discoloration Methods 0.000 description 7
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 5
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 5
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920001195 polyisoprene Polymers 0.000 description 5
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 4
- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- SUODCTNNAKSRHB-UHFFFAOYSA-N 2-ethylhexyl 3-sulfanylpropanoate Chemical compound CCCCC(CC)COC(=O)CCS SUODCTNNAKSRHB-UHFFFAOYSA-N 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical group OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- VJHINFRRDQUWOJ-UHFFFAOYSA-N dioctyl sebacate Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(=O)OCC(CC)CCCC VJHINFRRDQUWOJ-UHFFFAOYSA-N 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- BJZNEZSUNWJHQQ-UHFFFAOYSA-N 2,2-bis(2-ethylhexyl)decanedioic acid Chemical compound CCCCC(CC)CC(C(O)=O)(CC(CC)CCCC)CCCCCCCC(O)=O BJZNEZSUNWJHQQ-UHFFFAOYSA-N 0.000 description 2
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 2
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical class CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- JKRZOJADNVOXPM-UHFFFAOYSA-N Oxalic acid dibutyl ester Chemical compound CCCCOC(=O)C(=O)OCCCC JKRZOJADNVOXPM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- ALOUNLDAKADEEB-UHFFFAOYSA-N dimethyl sebacate Chemical compound COC(=O)CCCCCCCCC(=O)OC ALOUNLDAKADEEB-UHFFFAOYSA-N 0.000 description 2
- UHGPEWTZABDZCE-UHFFFAOYSA-N dipropyl decanedioate Chemical compound CCCOC(=O)CCCCCCCCC(=O)OCCC UHGPEWTZABDZCE-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VBQMTEHUPQSMFY-UHFFFAOYSA-N (2-diethoxyphosphorylphenyl)-(2,4,6-trimethylphenyl)methanone Chemical compound CCOP(=O)(OCC)c1ccccc1C(=O)c1c(C)cc(C)cc1C VBQMTEHUPQSMFY-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- PAEWNKLGPBBWNM-UHFFFAOYSA-N 1,3,5-tris[2-(3-sulfanylbutoxy)ethyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(S)CCOCCN1C(=O)N(CCOCCC(C)S)C(=O)N(CCOCCC(C)S)C1=O PAEWNKLGPBBWNM-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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- 239000004014 plasticizer Substances 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- UQFSVBXCNGCBBW-UHFFFAOYSA-M tetraethylammonium iodide Chemical compound [I-].CC[N+](CC)(CC)CC UQFSVBXCNGCBBW-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Chemical class 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Abstract
경화 후도 표면에 접착성을 유지하는 조성물을 제공한다. 하기 (P), (C)~(E)를 함유하는 조성물. (P) 중합성 비닐 화합물, (C) 광중합 개시제, (D) 디카르본산 디에스테르, (E) 점착 부여제. 상기 조성물로 이루어지는 접착제 조성물. (F) 티올이나 (G) 산화 방지제를 더 함유해도 된다. (P) 중합성 비닐 화합물은 (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하는 것이 바람직하다.A composition that maintains adhesion to a surface even after curing is provided. A composition containing the following (P) and (C) to (E). (P) a polymerizable vinyl compound, (C) a photopolymerization initiator, (D) a dicarboxylic acid diester, and (E) a tackifier. An adhesive composition comprising the above composition. (F) You may further contain a thiol and (G) antioxidant. (P) The polymerizable vinyl compound preferably contains (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate.
Description
본 발명은 조성물에 관한 것이다.The present invention relates to a composition.
LCD(액정 디스플레이) 등의 표시체 상에 탑재하는 터치 패널에는 저항막식, 정전용량식, 전자유도식, 광학식 등이 있다. 이들 터치 패널의 표면에 외관 디자인성을 좋게 하는 화장판이나 터치하는 위치를 지정하는 아이콘 시트를 맞추어붙이는 경우가 있다. 정전용량식 터치 패널은 투명 기판 상에 투명 전극을 형성하고 그 위에 투명판을 맞추어붙인 구조를 갖고 있다.BACKGROUND OF THE INVENTION Touch panels mounted on display bodies such as LCDs (liquid crystal displays) include resistive, capacitance, electromagnetic induction, optical, and the like. In some cases, decorative plates for improving appearance design or icon sheets for specifying touch positions are attached to the surfaces of these touch panels. A capacitive touch panel has a structure in which a transparent electrode is formed on a transparent substrate and a transparent plate is bonded thereon.
종래 화장판과 터치 패널의 맞추어붙임, 아이콘 시트와 터치 패널의 맞추어붙임, 투명 기판과 투명판의 맞추어붙임에는 접착제를 이용하였다.Conventionally, an adhesive was used for the alignment of a decorative board and a touch panel, the alignment of an icon sheet and a touch panel, and the alignment of a transparent substrate and a transparent board.
특히, 광경화성 접착제 조성물로 이들 각 부재끼리를 맞추어붙일 때 대표적인 방법으로서 양 피착체에 접착제를 사이에 두고 맞추어붙인 후 디스플레이의 정면 방향에서 가시광선 혹은 자외선을 조사하여 접착제를 경화시킴으로써 양 피착체를 접착하는 방법이 있다.In particular, as a typical method of attaching each member to another with a photocurable adhesive composition, after attaching the adhesive to both adherends, the adhesive is cured by irradiating visible light or ultraviolet rays in the front direction of the display to cure both adherends. There is a way to attach it.
특허문헌 1은 (A) 폴리이소프렌, 폴리부타디엔 또는 폴리우레탄을 골격으로 갖는 (메타)아크릴레이트 올리고머, (B) 유연화 성분, (C1) 페녹시에틸 (메타)아크릴레이트, 페녹시폴리에틸렌글리콜 (메타)아크릴레이트, 2-히드록시-3-페녹시프로필 (메타)아크릴레이트, 시클로헥실 (메타)아크릴레이트, 노닐페놀 EO 부가물 (메타)아크릴레이트, 메톡시트리에틸렌글리콜 (메타)아크릴레이트 및 테트라히드로푸르푸릴 (메타)아크릴레이트에서 선택한 (메타)아크릴레이트 모노머를 포함하는 광경화형 수지 조성물이 기재되어 있다. 그러나, 본 발명의 조성물, 특히 (D) 디카르본산 디에스테르를 함유하는 조성물에 대해 특허문헌 1에는 기재가 없다.Patent Document 1 discloses (A) a (meth)acrylate oligomer having polyisoprene, polybutadiene or polyurethane as a backbone, (B) a softening component, (C1) phenoxyethyl (meth)acrylate, phenoxypolyethylene glycol (meth) ) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, nonylphenol EO adduct (meth) acrylate, methoxytriethylene glycol (meth) acrylate and A photocurable resin composition comprising a (meth)acrylate monomer selected from tetrahydrofurfuryl (meth)acrylate is described. However, Patent Document 1 does not describe the composition of the present invention, particularly the composition containing the dicarboxylic acid diester (D).
최근에 LCD 등의 표시체의 유리가 얇아지고 있다. 유리가 얇아지면 외부 응력으로 LCD가 변형되기 쉬워진다. 얇은 유리를 이용한 LCD 등의 표시체와 아크릴판이나 폴리카보네이트판 등의 광학 기능 재료를 맞추어붙인 경우 유리와 아크릴 등의 선팽창 차이나 아크릴판이나 폴리카보네이트 등의 플라스틱 성형재의 성형시의 변형에 의해 내열 시험이나 내습 시험에서 성형 변형의 완화나 흡습/건조가 일어나고 치수 변화나 휨 등의 면 정밀도 변화가 일어난다.In recent years, the glass of displays such as LCDs has become thinner. As the glass becomes thinner, the LCD becomes more susceptible to deformation due to external stress. When a display body such as an LCD using thin glass and an optical function material such as an acrylic plate or a polycarbonate plate are bonded together, a heat resistance test is performed due to the difference in linear expansion between glass and acrylic or deformation during molding of a plastic molding material such as an acrylic plate or polycarbonate. However, in the moisture resistance test, relief of molding deformation or moisture absorption/drying occurs, and surface precision changes such as dimensional change or warpage occur.
특허문헌 2는 우레탄계 (메타)아크릴레이트, 폴리부타디엔계 (메타)아크릴레이트 및 이소프렌계 (메타)아크릴레이트를 성분으로 하는 경화 수지가 기재되어 있다. 그러나, 특허문헌 2의 방법에 의해 이 변형을 억제하고자 한 경우 접착면이 벗겨지거나 LCD가 갈라지거나 LCD가 표시 얼룩이 되는 과제가 있었다.Patent Document 2 describes a cured resin containing urethane-based (meth)acrylate, polybutadiene-based (meth)acrylate, and isoprene-based (meth)acrylate as components. However, when trying to suppress this deformation by the method of patent document 2, the adhesive surface peeled off, the LCD cracked, or the LCD displayed the subject that there was unevenness.
특허문헌 2의 과제의 해결책으로서 특허문헌 3과 같은 UV 경화형 수지가 기재되어 있다. 특허문헌 3은 이소보닐 (메타)아크릴레이트와 같은 강직한 골격 모노머를 베이스로 한 고탄성 수지이기 때문에 고온 신뢰성 시험에서 피착체의 팽창 수축에 견딜 수 없어 벗겨짐을 일으킬 가능성이 있었다. 본 발명은 이소보닐 (메타)아크릴레이트와 같은 강직한 골격의 모노머를 사용하지 않고도 고온 신뢰성 시험에서 피착체의 팽창 수축에 견디는 설계를 가진다.As a solution to the problem of Patent Document 2, a UV curable resin such as Patent Document 3 is described. Since Patent Document 3 is a highly elastic resin based on a rigid skeleton monomer such as isobornyl (meth)acrylate, it could not withstand expansion and contraction of the adherend in a high-temperature reliability test and could cause peeling. The present invention has a design that withstands expansion and contraction of an adherend in a high-temperature reliability test without using a rigid backbone monomer such as isobornyl (meth)acrylate.
화장판과 터치 패널의 맞추어붙임, 아이콘 시트와 터치 패널의 맞추어붙임, 투명 기판과 투명판의 맞추어붙임 등의 용도에서는 사용 환경을 상정한 가온 분위기에서 피착체의 변형에 추종할 수 있을 정도의 유연성을 갖는 것이 바람직하다고 되어 있다.Flexible enough to follow the deformation of the adherend in a heated atmosphere that assumes the use environment for applications such as bonding between decorative board and touch panel, bonding between icon sheet and touch panel, and bonding between transparent substrate and transparent board. It is said that it is desirable to have.
한편, 사용 환경을 상정한 가온 분위기에서 피착체의 변형에 추종할 수 있을 정도의 유연성을 가지기 때문에 내열 시험 후의 착색, 변색, 내습 시험 후의 강도 저하 등의 과제가 있는 것도 명백해진다. 상기 과제의 해결책으로서 특허문헌 4는 폴리이소프렌 (메타)아크릴레이트 올리고머, 폴리부타디엔 (메타)아크릴레이트 올리고머 및 폴리우레탄 (메타)아크릴레이트 올리고머로 이루어지는 군에서 선택된 1종 이상의 올리고머와 힌다드아민을 함유하는 광경화형 접착 조성물이 기재되어 있다. 그러나, 본 발명의 조성물, 특히 (D) 디카르본산 디에스테르를 함유하는 조성물에 대해 특허문헌 4에는 기재가 없다.On the other hand, since it has flexibility enough to follow the deformation of the adherend in a heated atmosphere assuming a use environment, it is also clear that there are problems such as discoloration and discoloration after the heat resistance test and decrease in strength after the moisture resistance test. As a solution to the above problem, Patent Document 4 contains at least one oligomer selected from the group consisting of polyisoprene (meth) acrylate oligomer, polybutadiene (meth) acrylate oligomer and polyurethane (meth) acrylate oligomer and hindadamine. A photocurable adhesive composition is described. However, Patent Document 4 does not describe the composition of the present invention, particularly the composition containing (D) a dicarboxylic acid diester.
특허문헌 5에는 특정의 유황 함유 (메타)아크릴레이트 화합물 또는 이를 포함하는 라디칼 반응성 조성물, 자외선 흡수제, 광중합 개시제 및 산화 방지제를 포함하는 것을 특징으로 하는 광경화성 조성물이 기재되어 있다. 그러나, 본 발명의 조성물, 특히 (D) 디카르본산 디에스테르를 함유하는 조성물에 대해 특허문헌 5에는 기재가 없다.Patent Document 5 describes a photocurable composition comprising a specific sulfur-containing (meth)acrylate compound or a radical reactive composition containing the same, a UV absorber, a photopolymerization initiator, and an antioxidant. However, Patent Document 5 does not describe the composition of the present invention, particularly the composition containing (D) a dicarboxylic acid diester.
특허문헌 6에는 불포화 이중 결합을 갖는 관능기를 2개 이상 갖는 우레탄(메타)아크릴레이트(A), 불포화 이중 결합을 갖는 관능기를 하나 갖는 모노머(B), 광중합 개시제(C), 티올기를 2개 이상 갖는 폴리티올 화합물(D)을 함유하는 조성물로서 상기 조성물 중에서의 우레탄(메타)아크릴레이트(A)의 중량 비율이 2중량%~30중량%인 광경화형 투명 접착제 조성물이 기재되어 있다. 그러나, 본 발명의 조성물, 특히 (D) 디카르본산 디에스테르를 함유하는 조성물에 대해 특허문헌 6에는 기재가 없다.In Patent Document 6, urethane (meth)acrylate (A) having two or more functional groups having an unsaturated double bond, a monomer (B) having one functional group having an unsaturated double bond, a photopolymerization initiator (C), and two or more thiol groups As a composition containing a polythiol compound (D), a photocurable transparent adhesive composition in which the weight ratio of urethane (meth)acrylate (A) in the composition is 2% to 30% by weight is described. However, Patent Document 6 does not describe the composition of the present invention, particularly the composition containing (D) a dicarboxylic acid diester.
접착제 조성물의 경화 후에도 표면의 점접착성을 유지하는 방법으로서 점착 부여제를 첨가하는 방법이 있다. 특허문헌 7에 점착 부여제로서 수소화 로진 수지 점착 부여제 또는 지방족 완전 포화 탄화수소 수지 점착 부여제 또는 수소화 테르펜 수지 점착 부여제를 함유하는 아크릴계 점착제가 기재되어 있다. 그러나, 본 발명의 조성물, 특히 (D) 디카르본산 디에스테르를 함유하는 조성물에 대해 특허문헌 7에는 기재가 없다.As a method of maintaining the viscous adhesiveness of the surface even after the adhesive composition is cured, there is a method of adding a tackifier. Patent Document 7 describes an acrylic pressure-sensitive adhesive containing a hydrogenated rosin resin tackifier, an aliphatic completely saturated hydrocarbon resin tackifier, or a hydrogenated terpene resin tackifier as a tackifier. However, Patent Document 7 does not describe the composition of the present invention, particularly the composition containing the dicarboxylic acid diester (D).
본 발명은 예를 들어 터치 패널 등의 표시체에 사용되는 화장판이나 아이콘 시트를 맞추어붙이는 경우, 투명 기판과 투명 기판을 맞추어붙이는 경우, 표시체와 광학 기능 재료를 맞추어붙이는 경우에 접착면이 벗겨지거나 표시체의 유리가 갈라진다는 종래 기술의 과제, 내열, 내습 시험 후의 변색, 강도 저하라는 과제를 해결하는 경화성 수지 조성물을 제공한다.In the present invention, for example, when bonding decorative plates and icon sheets used for display bodies such as touch panels, when bonding transparent substrates and transparent substrates, and when bonding display bodies and optical function materials, the adhesive surface is peeled off. Provided is a curable resin composition that solves the prior art problems of cracking or cracking of glass of a display body, discoloration after heat resistance and moisture resistance tests, and reduction in strength.
즉, 본 발명은 하기 (P), (C)~(E)를 함유하는 조성물로서,That is, the present invention is a composition containing the following (P), (C) to (E),
(P) 중합성 비닐 화합물(P) polymerizable vinyl compound
(C) 광중합 개시제(C) photopolymerization initiator
(D) 디카르본산 디에스테르(D) dicarboxylic acid diesters
(E) 점착 부여제(E) tackifier
(D)가 식(1)으로 나타나는 디카르본산 디에스테르인 상기 조성물이고,(D) is the above composition wherein dicarboxylic acid diester represented by formula (1);
(식 중, R1, R2는 탄소수 1~18의 알킬기, R3은 탄소수 1~10의 알킬렌기, R1, R2는 동일해도 되고 달라도 된다),(Wherein, R 1 and R 2 are an alkyl group having 1 to 18 carbon atoms, R 3 is an alkylene group having 1 to 10 carbon atoms, and R 1 and R 2 may be the same or different);
(D)가 세바스산 디에스테르인 상기 조성물이며, (F) 티올을 더 함유하는 상기 조성물이고, 상기 (F) 티올이 폴리티올인 상기 조성물이며, (G) 산화 방지제를 더 함유하는 상기 조성물이고, 상기 (P) 중합성 비닐 화합물이 (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하는 상기 조성물이며, (A) 다관능 (메타)아크릴레이트가 우레탄(메타)아크릴레이트인 상기 조성물이고, (B) 단관능 (메타)아크릴레이트가 페놀알킬렌옥사이드 변성 (메타)아크릴레이트, 알킬(메타)아크릴레이트, 히드록시알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상인 상기 조성물이며, (D)의 사용량이 (P) 및 (D)의 합계 100질량부 중 5~50질량부인 상기 조성물이고, (E) 점착 부여제가 완전 수소화 로진 수지, 방향족 변성 테르펜 수지, 테르펜페놀 수지로 이루어지는 군 중 1종 이상인 상기 조성물이며, 상기 조성물로 이루어지는 경화성 수지 조성물이고, 상기 조성물로 이루어지는 접착제 조성물이며, 상기 접착제 조성물의 경화체이고, 상기 경화체에 의해 피착체가 피복 또는 접합된 복합체이며, 상기 피착체가 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속으로 이루어지는 군에서 선택되는 1종 이상인 복합체이고, 상기 접착제 조성물에 의해 피착체를 맞추어붙인 터치 패널 적층체이며, 상기 접착제 조성물에 의해 피착체를 맞추어붙인 액정 패널 적층체이고, 상기 터치 패널 적층체를 이용한 디스플레이이며, 상기 액정 패널 적층체를 이용한 디스플레이이고, 상기 (P) 중합성 비닐 화합물이 (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하며, (A) 다관능 (메타)아크릴레이트가 우레탄(메타)아크릴레이트이고, (B) 단관능 (메타)아크릴레이트가 페놀알킬렌옥사이드 변성 (메타)아크릴레이트, 알킬(메타)아크릴레이트, 히드록시알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상이며, (A) 다관능 (메타)아크릴레이트의 사용량은 (A), (B) 및 (D)의 합계량 100질량부 중 10~90질량부이고, (B) 단관능 (메타)아크릴레이트의 사용량은 (A), (B) 및 (D)의 합계량 100질량부 중 3~80질량부이며, (D) 디카르본산 디에스테르의 사용량은 (P) 및 (D)의 합계 100질량부에 대해 1~50질량부이고, (E) 점착 부여제가 완전 수소화 로진 수지, 방향족 변성 테르펜 수지, 테르펜페놀 수지로 이루어지는 군 중 1종 이상이며, (E) 점착 부여제의 사용량은 (P) 및 (D)의 합계 100질량부에 대해 1~40질량부이고, (P) 및 (D)의 합계 100질량부에 대해 0.1~10질량부의 (F) 폴리티올을 더 함유하며, (G) 산화 방지제를 더 함유하는 상기 접착제 조성물이다.(D) is the composition wherein (D) is a sebacic acid diester, (F) is the composition further contains a thiol, (F) is the composition wherein the thiol is a polythiol, and (G) is the composition further contains an antioxidant; , The above composition in which the (P) polymerizable vinyl compound contains (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate, and (A) polyfunctional (meth)acrylate is urethane (Meth) acrylate composition, (B) monofunctional (meth) acrylate is a group consisting of phenolalkylene oxide-modified (meth) acrylate, alkyl (meth) acrylate, hydroxyalkyl (meth) acrylate (D) is the composition in which the amount of (D) is 5 to 50 parts by mass based on the total of 100 parts by mass of (P) and (D), and (E) the tackifier is a fully hydrogenated rosin resin, an aromatic The above composition is at least one of the group consisting of a modified terpene resin and a terpene phenol resin, a curable resin composition comprising the above composition, an adhesive composition comprising the above composition, and a cured body of the adhesive composition, wherein an adherend is coated or A touch panel in which the adherend is at least one selected from the group consisting of triacetyl cellulose, fluorine-based polymer, polyester, polycarbonate, polyolefin, glass, and metal, and the adherend is bonded together by the adhesive composition. A laminate, a liquid crystal panel laminate in which adherends are bonded together by the adhesive composition, a display using the touch panel laminate, a display using the liquid crystal panel laminate, and the (P) polymerizable vinyl compound ( A) contains polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate, (A) polyfunctional (meth)acrylate is urethane (meth)acrylate, (B) monofunctional (meth)acrylate ) acrylate is at least one selected from the group consisting of phenolalkylene oxide-modified (meth)acrylates, alkyl (meth)acrylates, and hydroxyalkyl (meth)acrylates, (A) polyfunctional (meth)acrylic The amount of the rate used is 10 to 90 parts by mass out of 100 parts by mass of the total amount of (A), (B) and (D), and the amount of the monofunctional (meth)acrylate (B) is (A), (B) and ( 3 to 80 parts by mass in 100 parts by mass of the total amount of D), (D) the amount of dicarboxylic acid diester used is 1 to 50 parts by mass with respect to 100 parts by mass in total of (P) and (D), (E) The tackifier is at least one of the group consisting of a fully hydrogenated rosin resin, an aromatic modified terpene resin, and a terpene phenol resin, and (E) the amount of tackifier used is 1 to 100 parts by mass in total of (P) and (D) It is 40 parts by mass, and further contains 0.1 to 10 parts by mass of (F) polythiol with respect to 100 parts by mass of the total of (P) and (D), and further contains (G) antioxidant.
본 발명은 예를 들어 경화 후도 표면에 접착성을 유지하는 조성물을 제공할 수 있다.The present invention can provide a composition that maintains adhesion to a surface even after curing, for example.
(P) 중합성 비닐 화합물로서는 (메타)아크릴레이트가 바람직하고, (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하는 것이 보다 바람직하다. (A) 다관능 (메타)아크릴레이트란 (메타)아크릴로일기를 2개 이상 갖는 (메타)아크릴레이트를 말한다. 다관능 (메타)아크릴레이트로서는 올리고머/폴리머 말단 또는 측쇄에 2개 이상 (메타)아크로일화된 다관능 (메타)아크릴레이트의 올리고머/폴리머 등을 들 수 있다.(P) As a polymeric vinyl compound, (meth)acrylate is preferable, and what contains (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate is more preferable. (A) Multifunctional (meth)acrylate refers to (meth)acrylate having two or more (meth)acryloyl groups. Examples of the polyfunctional (meth)acrylate include oligomers/polymers of polyfunctional (meth)acrylates in which two or more (meth)acryloyls are formed at the oligomer/polymer terminals or side chains.
다관능 (메타)아크릴레이트의 올리고머/폴리머로서는 1,2-폴리부타디엔 말단 우레탄(메타)아크릴레이트, 1,2-수소화 폴리부타디엔 말단 우레탄(메타)아크릴레이트(예를 들어 니폰 소다사 제품 「TEAI-1000」), 1,4-폴리부타디엔 말단 우레탄(메타)아크릴레이트, 폴리이소프렌 말단 (메타)아크릴레이트, 폴리에스테르계 우레탄(메타)아크릴레이트, 폴리에테르계 우레탄(메타)아크릴레이트, 비스페놀 A형 에폭시(메타)아크릴레이트 등을 들 수 있다. 폴리부타디엔 말단 (메타)우레탄아크릴레이트나 수소화 폴리부타디엔 말단 우레탄(메타)아크릴레이트는 분자 구조의 말단이 (메타)아크릴레이트이다. 이들 중에서는 효과가 큰 점에서 우레탄(메타)아크릴레이트가 바람직하다. 우레탄(메타)아크릴레이트 중에서는 폴리부타디엔계 우레탄(메타)아크릴레이트, 수소화 폴리부타디엔 말단 우레탄(메타)아크릴레이트, 폴리에스테르계 우레탄(메타)아크릴레이트 및 폴리에테르계 우레탄(메타)아크릴레이트로 이루어지는 군 중 1종 이상이 바람직하고, 수소화 폴리부타디엔계 우레탄(메타)아크릴레이트, 폴리에스테르계 우레탄(메타)아크릴레이트로 이루어지는 군 중 1종 이상이 보다 바람직하다. 수소화 폴리부타디엔계 우레탄(메타)아크릴레이트 중에서는 1,2-수소화 폴리부타디엔 말단 우레탄(메타)아크릴레이트가 바람직하다.As the oligomer/polymer of the polyfunctional (meth)acrylate, 1,2-polybutadiene terminal urethane (meth)acrylate, 1,2-hydrogenated polybutadiene terminal urethane (meth)acrylate (for example, Nippon Soda Co., Ltd. "TEAI -1000”), 1,4-polybutadiene terminal urethane (meth)acrylate, polyisoprene terminal (meth)acrylate, polyester urethane (meth)acrylate, polyether urethane (meth)acrylate, bisphenol A Type epoxy (meth)acrylate etc. are mentioned. In polybutadiene-terminated (meth)urethane acrylate or hydrogenated polybutadiene-terminated urethane (meth)acrylate, the terminal of the molecular structure is (meth)acrylate. Among these, urethane (meth)acrylate is preferred because of its high effect. Among the urethane (meth)acrylates, polybutadiene-based urethane (meth)acrylates, hydrogenated polybutadiene terminal urethane (meth)acrylates, polyester-based urethane (meth)acrylates, and polyether-based urethane (meth)acrylates At least one of the groups is preferred, and at least one of the group consisting of hydrogenated polybutadiene-based urethane (meth)acrylates and polyester-based urethane (meth)acrylates is more preferred. Among the hydrogenated polybutadiene-based urethane (meth)acrylates, 1,2-hydrogenated polybutadiene terminal urethane (meth)acrylates are preferred.
여기서, 우레탄(메타)아크릴레이트란 예를 들어 폴리올 화합물(이후, X로 나타냄)과 유기 폴리이소시아네이트 화합물(이후, Y로 나타냄)과 히드록시(메타)아크릴레이트(이후, Z로 나타냄)를 반응(예를 들어 중축합 반응)시킴으로써 얻어지는, 분자 내에 우레탄 결합을 갖는 우레탄(메타)아크릴레이트를 말한다.Here, the urethane (meth)acrylate is, for example, a reaction of a polyol compound (hereinafter referred to as X), an organic polyisocyanate compound (hereinafter referred to as Y), and a hydroxy (meth)acrylate (hereinafter referred to as Z). It refers to urethane (meth)acrylate having a urethane bond in the molecule obtained by (for example, polycondensation reaction).
폴리올 화합물(X)로서는 에틸렌글리콜, 디에틸렌글리콜, 트리에틸렌글리콜, 테트라에틸렌글리콜, 폴리에틸렌글리콜, 프로필렌글리콜, 디프로필렌글리콜, 폴리프로필렌글리콜, 부틸렌글리콜, 1,4-부탄디올, 폴리부틸렌글리콜, 1,5-펜탄디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 3-메틸-1,5-펜탄디올, 2,4-디에틸-1,5-펜탄디올, 2,2-부틸에틸-1,3-프로판디올, 네오펜틸글리콜, 시클로헥산디메탄올, 수소화 비스페놀 A, 폴리카프로락톤, 트리메틸올에탄, 트리메틸올프로판, 폴리트리메틸올프로판, 펜타에리트리톨, 폴리펜타에리트리톨, 소르비톨, 만니톨, 글리세린, 폴리글리세린, 폴리테트라메틸렌글리콜 등의 다가 알코올이나, 폴리에틸렌옥사이드, 폴리프로필렌옥사이드, 에틸렌옥사이드/프로필렌옥사이드의 블록 또는 랜덤 공중합의 적어도 1종의 구조를 갖는 폴리에테르폴리올, 카프로락톤 변성 폴리테트라메틸렌폴리올 등의 카프로락톤 변성 폴리올, 폴리올레핀계 폴리올, 폴리카보네이트계 폴리올, 폴리부타디엔 폴리올, 폴리이소프렌 폴리올, 수소화 폴리부타디엔 폴리올, 수소화 폴리이소프렌 폴리올 등의 폴리디엔계 폴리올, 폴리디메틸실록산 폴리올 등의 실리콘 폴리올 등을 들 수 있다. 상기 다가 알코올 또는 상기 폴리올과 무수 말레인산, 말레인산, 푸마르산, 무수 이타콘산, 이타콘산, 아디프산, 이소프탈산 등의 다염기산의 축합물인 폴리에스테르 폴리올 등도 들 수 있다.Examples of the polyol compound (X) include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, butylene glycol, 1,4-butanediol, polybutylene glycol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5- Pentanediol, 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, trimethylolethane, trimethylolpropane, polytrimethylolpropane, pentaerythritol Polyhydric alcohols such as polypentaerythritol, sorbitol, mannitol, glycerin, polyglycerin, polytetramethylene glycol, polyethylene oxide, polypropylene oxide, ethylene oxide / propylene oxide having at least one structure of block or random copolymerization Polyether polyols, caprolactone-modified polyols such as caprolactone-modified polytetramethylene polyol, polyolefin-based polyols, polycarbonate-based polyols, polybutadiene polyols, polyisoprene polyols, hydrogenated polybutadiene polyols, and polydiene-based polyols such as hydrogenated polyisoprene polyols and silicone polyols such as polydimethylsiloxane polyol. and polyester polyols which are condensates of the above polyhydric alcohols or the above polyols with polybasic acids such as maleic anhydride, maleic acid, fumaric acid, itaconic anhydride, itaconic acid, adipic acid, and isophthalic acid.
이들 중에서는 폴리올 화합물(X)로서 폴리부타디엔 폴리올, 수소화 폴리부타디엔 폴리올, 폴리에테르 폴리올, 폴리에스테르 폴리올로 이루어지는 군 중 1종 이상이 바람직하고, 수소화 폴리부타디엔 폴리올, 폴리에스테르 폴리올로 이루어지는 군 중 1종 이상이 보다 바람직하다. 수소화 폴리부타디엔 폴리올 중에서는 식(2)으로 나타나는 화합물(n은 양수)이 바람직하다.Among these, as the polyol compound (X), at least one member from the group consisting of polybutadiene polyol, hydrogenated polybutadiene polyol, polyether polyol, and polyester polyol is preferred, and one member from the group consisting of hydrogenated polybutadiene polyol and polyester polyol is preferred. The above is more preferable. Among the hydrogenated polybutadiene polyols, compounds represented by formula (2) (n is a positive number) are preferred.
(식 중, n은 양수이다.)(In the formula, n is a positive number.)
여기서, 폴리부타디엔계 우레탄(메타)아크릴레이트는 예를 들어 폴리올 화합물(X)이 폴리부타디엔 폴리올이다. 폴리에스테르계 우레탄(메타)아크릴레이트는 예를 들어 폴리올 화합물(X)이 폴리에스테르 폴리올이다. 폴리에테르계 우레탄(메타)아크릴레이트는 예를 들어 폴리올 화합물(X)이 폴리에테르 폴리올이다.Here, the polyol compound (X) of the polybutadiene-based urethane (meth)acrylate is, for example, polybutadiene polyol. As for the polyester-based urethane (meth)acrylate, for example, the polyol compound (X) is a polyester polyol. As for the polyether-based urethane (meth)acrylate, for example, the polyol compound (X) is a polyether polyol.
유기 폴리이소시아네이트 화합물(Y)로서는 특별히 한정될 필요는 없지만, 예를 들어 방향족계, 지방족계, 환식 지방족계, 지환식계 등의 폴리이소시아네이트를 사용할 수 있다. 그 중에서도 톨릴렌 디이소시아네이트(TDI), 디페닐메탄 디이소시아네이트(MDI), 수소 첨가 디페닐메탄 디이소시아네이트(H-MDI), 폴리페닐메탄 폴리이소시아네이트(천연 MDI), 변성 디페닐메탄 디이소시아네이트(변성 MDI), 수소 첨가 크실릴렌 디이소시아네이트(H-XDI), 크실릴렌 디이소시아네이트(XDI), 헥사메틸렌 디이소시아네이트(HMDI), 트리메틸헥사메틸렌 디이소시아네이트(TMXDI), 테트라메틸크실릴렌 디이소시아네이트(m-TMXDI), 이소포론 디이소시아네이트(IPDI), 노르보르넨 디이소시아네이트(NBDI), 1,3-비스(이소시아나트메틸)시클로헥산(H6XDI) 등의 폴리이소시아네이트, 이들 폴리이소시아네이트의 3량체 화합물, 이들 폴리이소시아네이트와 폴리올의 반응 생성물 등이 적합하게 이용된다. 이들 중에서는 수소 첨가 크실릴렌 디이소시아네이트(H-XDI) 및/또는 이소포론 디이소시아네이트(IPDI)가 바람직하다.Although there is no need to specifically limit as organic polyisocyanate compound (Y), For example, aromatic, aliphatic, cyclic aliphatic, alicyclic, etc. polyisocyanate can be used. Among them, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (natural MDI), modified diphenylmethane diisocyanate (modified MDI), hydrogenated xylylene diisocyanate (H-XDI), xylylene diisocyanate (XDI), hexamethylene diisocyanate (HMDI), trimethylhexamethylene diisocyanate (TMXDI), tetramethylxylylene diisocyanate ( m-TMXDI), isophorone diisocyanate (IPDI), norbornene diisocyanate (NBDI), polyisocyanates such as 1,3-bis(isocyanatemethyl)cyclohexane (H6XDI), and trimer compounds of these polyisocyanates. , reaction products of these polyisocyanates and polyols, and the like are suitably used. Among these, hydrogenated xylylene diisocyanate (H-XDI) and/or isophorone diisocyanate (IPDI) are preferred.
히드록시(메타)아크릴레이트(Z)로서는 예를 들어 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 2-히드록시부틸 (메타)아크릴레이트 등의 히드록시알킬 (메타)아크릴레이트, 2-히드록시에틸 (메타)아크릴로일 포스페이트, 4-히드록시부틸 (메타)아크릴레이트, 2-(메타)아크릴로일옥시 에틸-2-히드록시프로필 프탈레이트, 글리세린 디(메타)아크릴레이트, 2-히드록시-3-(메타)아크릴로일옥시프로필 아크릴레이트, 카프로락톤 변성 2-히드록시에틸 (메타)아크릴레이트, 펜타에리트리톨 트리(메타)아크릴레이트, 디펜타에리트리톨 펜타(메타)아크릴레이트, 카프로락톤 변성 2-히드록시에틸 (메타)아크릴레이트 등을 들 수 있다. 이들 중에서는 히드록시알킬 (메타)아크릴레이트가 바람직하다.Examples of the hydroxy (meth)acrylate (Z) include hydroxyl such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. Alkyl (meth)acrylate, 2-hydroxyethyl (meth)acryloyl phosphate, 4-hydroxybutyl (meth)acrylate, 2-(meth)acryloyloxy ethyl-2-hydroxypropyl phthalate, glycerin Di(meth)acrylate, 2-hydroxy-3-(meth)acryloyloxypropyl acrylate, caprolactone-modified 2-hydroxyethyl (meth)acrylate, pentaerythritol tri(meth)acrylate, di Pentaerythritol penta(meth)acrylate, caprolactone modified 2-hydroxyethyl (meth)acrylate, etc. are mentioned. Among these, hydroxyalkyl (meth)acrylates are preferred.
히드록시알킬 (메타)아크릴레이트 중에서는 식(3)으로 나타나는 히드록시알킬 (메타)아크릴레이트가 바람직하다.Among hydroxyalkyl (meth)acrylates, hydroxyalkyl (meth)acrylates represented by formula (3) are preferred.
Z-O-(R4-O-)p-H 식(3)ZO-(R 4 -O-) p -H Equation (3)
(식 중, Z는 (메타)아크릴로일기, R4는 알킬렌기, p는 1~10의 정수를 나타낸다.)(In the formula, Z is a (meth)acryloyl group, R 4 is an alkylene group, and p represents an integer of 1 to 10.)
식(3)에서의 R4의 알킬렌기의 탄소수는 1~8이 바람직하고, 2~6이 보다 바람직하다.1-8 are preferable and, as for carbon number of the alkylene group of R <4> in Formula (3), 2-6 are more preferable.
히드록시알킬 (메타)아크릴레이트 중에서는 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 4-히드록시부틸 (메타)아크릴레이트로 이루어지는 군 중 1종 이상이 바람직하다. 우레탄(메타)아크릴레이트의 제법은 예를 들어 일본공개특허 평7-25957호 공보, 일본공개특허 2002-173515호 공보, 일본공개특허 평7-292048호 공보, 일본공개특허 2000-351819호 공보 등에 기재되어 있다.Among the hydroxyalkyl (meth)acrylates, at least one of the group consisting of 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate is used. desirable. The production method of urethane (meth)acrylate is disclosed in, for example, Japanese Unexamined Patent Publication No. 7-25957, Japanese Unexamined Patent Publication No. 2002-173515, Japanese Unexamined Patent Publication No. 7-292048, Japanese Unexamined Patent Publication No. 2000-351819, etc. are listed.
다관능 (메타)아크릴레이트의 중량 평균 분자량은 1000~60000이 바람직하고, 1500~40000이 보다 바람직하다. 중량 평균 분자량은 하기의 조건으로 용제로서 테트라히드로푸란을 이용하고 GPC 시스템(토소사 제품 SC-8010) 등을 사용하여 시판의 표준 폴리스티렌으로 검량선을 작성하여 구한다.1000-60000 are preferable and, as for the weight average molecular weight of polyfunctional (meth)acrylate, 1500-40000 are more preferable. The weight average molecular weight is obtained by drawing a calibration curve with commercially available standard polystyrene using tetrahydrofuran as a solvent under the following conditions and using a GPC system (SC-8010 manufactured by Tosoh Corporation) or the like.
유속: 1.0ml/minFlow Rate: 1.0ml/min
설정 온도: 40℃Set temperature: 40℃
칼럼 구성: 토소사 제품 「TSK guardcolumn MP(×L)」 6.0mmID×4.0cm 1개 및 토소사 제품 「TSK-GELMULTIPOREHXL-M」 7.8mmID×30.0cm(이론단수 16,000단) 2개, 총 3개(전체적으로 이론단수 32,000단)Column composition: Tosoh Corporation 「TSK guardcolumn MP(×L)」 6.0mmID×4.0cm 1ea and Tosoh company 「TSK-GELMULTIPOREHXL-M」 7.8mmID×30.0cm (theoretical plate number 16,000) 2ea, total 3ea (32,000 theoretical stages in total)
샘플 주입량: 100μl(시료액 농도 1mg/ml)Sample injection amount: 100μl (sample solution concentration 1mg/ml)
송액 압력: 39kg/㎠Feeding pressure: 39kg/cm2
검출기: RI 검출기Detector: RI detector
(P) 중합성 비닐 화합물이 (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하는 경우, (A) 다관능 (메타)아크릴레이트의 사용량은 (A), (B) 및 (D)의 합계량 100질량부 중 10~90질량부가 바람직하고, 30~90질량부가 보다 바람직하며, 40~85질량부가 더욱 바람직하고, 30~80질량부가 보다 더욱 바람직하며, 40~75질량부가 가장 바람직하다. 10질량부 이상이면 접착성이 저하될 우려가 없고, 90질량부 이하이면 양호한 경화성을 얻을 수 있다.(P) When the polymerizable vinyl compound contains (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate, the amount of (A) polyfunctional (meth)acrylate used is (A) , (B) and (D) of 100 parts by mass of the total amount, preferably 10 to 90 parts by mass, more preferably 30 to 90 parts by mass, still more preferably 40 to 85 parts by mass, even more preferably 30 to 80 parts by mass, 40 to 75 parts by mass is most preferred. When it is 10 parts by mass or more, there is no fear of deterioration in adhesiveness, and when it is 90 parts by mass or less, good curability can be obtained.
(B) 단관능 (메타)아크릴레이트란 (메타)아크릴로일기를 1개 갖는 (메타)아크릴레이트를 말한다. (B) 단관능 (메타)아크릴레이트 중에서는 페놀알킬렌옥사이드 변성 (메타)아크릴레이트, 알킬(메타)아크릴레이트, 히드록시알킬 (메타)아크릴레이트로 이루어지는 군 중 1종 이상이 바람직하다.(B) Monofunctional (meth)acrylate refers to (meth)acrylate having one (meth)acryloyl group. (B) Among the monofunctional (meth)acrylates, at least one of the group consisting of phenolalkylene oxide-modified (meth)acrylates, alkyl (meth)acrylates, and hydroxyalkyl (meth)acrylates is preferred.
페놀알킬렌옥사이드 변성 (메타)아크릴레이트 중에서는 식(4)으로 나타나는 페놀알킬렌옥사이드 변성 (메타)아크릴레이트가 바람직하다.Among the phenolalkylene oxide-modified (meth)acrylates, the phenolalkylene oxide-modified (meth)acrylate represented by formula (4) is preferable.
(식 중, R1은 수소 또는 탄소수 1~16의 알킬기이다. R2는 알킬렌기이다. R3은 수소 또는 메틸기이다. m은 1~6이다.)(In the formula, R 1 is hydrogen or an alkyl group having 1 to 16 carbon atoms. R 2 is an alkylene group. R 3 is hydrogen or a methyl group. m is 1 to 6.)
R1은 알킬기가 바람직하다. 알킬기의 탄소수는 5~13이 바람직하고, 9가 바람직하다. R2는 에틸렌기가 바람직하다. m은 4가 바람직하다. R1이 탄소수 9의 알킬기인 노닐페놀알킬렌옥사이드 변성 (메타)아크릴레이트로서는 노닐페놀에틸렌옥사이드 변성 (메타)아크릴레이트, 노닐페놀(에틸렌옥사이드 4몰 변성) (메타)아크릴레이트, 노닐페놀(에틸렌옥사이드 8몰 변성) (메타)아크릴레이트, 노닐페놀(프로필렌옥사이드 2.5몰 변성) (메타)아크릴레이트 등을 들 수 있다.R 1 is preferably an alkyl group. 5-13 are preferable and, as for carbon number of an alkyl group, 9 is preferable. R 2 is preferably an ethylene group. As for m, 4 is preferable. Examples of the nonylphenol alkylene oxide-modified (meth)acrylate in which R 1 is an alkyl group having 9 carbon atoms include nonylphenol ethylene oxide-modified (meth)acrylate, nonylphenol (ethylene oxide-modified 4 moles) (meth)acrylate, and nonylphenol (ethylene oxide). oxide 8 mol modified) (meth)acrylate, nonylphenol (propylene oxide 2.5 mol modified) (meth)acrylate, etc. are mentioned.
알킬(메타)아크릴레이트 중에서는 탄소수 2~16의 알킬기를 갖는 알킬(메타)아크릴레이트가 바람직하다. 알킬기는 포화 지방족 탄화수소기가 바람직하다. 알킬기는 비치환인 것이 바람직하다.Among the alkyl (meth)acrylates, alkyl (meth)acrylates having an alkyl group of 2 to 16 carbon atoms are preferable. The alkyl group is preferably a saturated aliphatic hydrocarbon group. It is preferable that an alkyl group is unsubstituted.
탄소수 2~16개의 알킬기를 갖는 알킬(메타)아크릴레이트로서는 에틸(메타)아크릴레이트, 프로필(메타)아크릴레이트, 부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 노말옥틸(메타)아크릴레이트, 이소옥틸(메타)아크릴레이트, 데실(메타)아크릴레이트, 이소데실(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 스테아릴(메타)아크릴레이트, 이소스테아릴(메타)아크릴레이트 등을 들 수 있다. 이들 중에서는 접착성이나 내습성의 점에서 옥틸(메타)아크릴레이트가 바람직하고, 노말옥틸(메타)아크릴레이트가 보다 바람직하다.Examples of the alkyl (meth)acrylate having an alkyl group having 2 to 16 carbon atoms include ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and normal octyl (metha)acrylate. )Acrylate, isooctyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate A rate etc. are mentioned. Among these, from the viewpoint of adhesiveness or moisture resistance, octyl (meth)acrylate is preferred, and normaloctyl (meth)acrylate is more preferred.
히드록시알킬 (메타)아크릴레이트 중에서는 전술한 식(3)으로 나타나는 히드록시알킬 (메타)아크릴레이트가 바람직하다.Among the hydroxyalkyl (meth)acrylates, hydroxyalkyl (meth)acrylates represented by the formula (3) described above are preferable.
Z-O-(R4-O-)p-H 식(3)ZO-(R 4 -O-) p -H Equation (3)
(Z는 (메타)아크릴로일기, R4는 알킬렌기, p는 1~10의 정수를 나타낸다.)(Z is a (meth)acryloyl group, R 4 is an alkylene group, and p represents an integer of 1 to 10.)
식(3)에서의 R4의 알킬렌기의 탄소수는 1~8이 바람직하고, 2~6이 보다 바람직하다.1-8 are preferable and, as for carbon number of the alkylene group of R <4> in Formula (3), 2-6 are more preferable.
히드록시알킬 (메타)아크릴레이트로서는 2-히드록시에틸 (메타)아크릴레이트, 2-히드록시프로필 (메타)아크릴레이트, 2-히드록시부틸 (메타)아크릴레이트, 4-히드록시부틸 (메타)아크릴레이트, 디에틸렌글리콜 모노(메타)아크릴레이트 및 폴리프로필렌글리콜 (메타)아크릴레이트 등을 들 수 있다. 이들 중에서는 접착성이나 내습성의 점에서 4-히드록시부틸 (메타)아크릴레이트가 바람직하다.Examples of hydroxyalkyl (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. acrylate, diethylene glycol mono(meth)acrylate, polypropylene glycol (meth)acrylate, and the like. Among these, 4-hydroxybutyl (meth)acrylate is preferable in terms of adhesiveness and moisture resistance.
(P) 중합성 비닐 화합물이 (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하는 경우, (B) 단관능 (메타)아크릴레이트의 사용량은 (A), (B) 및 (D)의 합계량 100질량부 중 3~80질량부가 바람직하고, 5~80질량부가 보다 바람직하며, 15~65질량부가 보다 더욱 바람직하고, 20~60질량부가 가장 바람직하다. 3질량부 이상이면 양호한 경화성을 얻을 수 있고, 80질량부 이하이면 접착성이 저하될 우려가 없다.(P) When the polymerizable vinyl compound contains (A) polyfunctional (meth)acrylate and (B) monofunctional (meth)acrylate, the amount of (B) monofunctional (meth)acrylate used is (A) , (B) and (D) in 100 parts by mass, preferably 3 to 80 parts by mass, more preferably 5 to 80 parts by mass, still more preferably 15 to 65 parts by mass, and most preferably 20 to 60 parts by mass. If it is 3 parts by mass or more, good curability can be obtained, and if it is 80 parts by mass or less, there is no fear that adhesiveness will decrease.
(C) 광중합 개시제는 가시광선이나 자외선의 활성 광선에 의해 증감시켜 수지 조성물의 광경화를 촉진하기 위해 사용하는 것이다. 광중합 개시제로서는 벤조페논 및 그 유도체, 벤질 및 그 유도체, 안트라퀴논 및 그 유도체, 벤조인, 벤조인메틸에테르, 벤조인에틸에테르, 벤조인프로필에테르, 벤조인이소부틸에테르, 벤질디메틸케탈 등의 벤조인 유도체, 디에톡시아세토페논, 4-t-부틸트리클로로아세토페논 등의 아세토페논 유도체, 2-디메틸아미노에틸벤조에이트, p-디메틸아미노에틸벤조에이트, 디페닐디술피드, 티옥산톤 및 그 유도체, 캄퍼퀴논, 7,7-디메틸-2,3-디옥소비시클로[2.2.1]헵탄-1-카르본산, 7,7-디메틸-2,3-디옥소비시클로[2.2.1]헵탄-1-카르복시-2-브로모에틸에스테르, 7,7-디메틸-2,3-디옥소비시클로[2.2.1]헵탄-1-카르복시-2-메틸에스테르, 7,7-디메틸-2,3-디옥소비시클로[2.2.1]헵탄-1-카르본산 클로라이드 등의 캄퍼퀴논 유도체, 2-메틸-1-[4-(메틸티오)페닐]-2-모르포리노프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-모르포리노페닐)-부탄온-1 등의 α-아미노알킬페논 유도체, 벤조일디페닐포스핀옥사이드, 2,4,6-트리메틸벤조일 디페닐포스핀옥사이드, 벤조일디에톡시포스핀옥사이드, 2,4,6-트리메틸벤조일 디메톡시페닐포스핀옥사이드, 2,4,6-트리메틸벤조일 디에톡시페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드 등의 아실포스핀옥사이드 유도체, 옥시-페닐-아세틱애시드 2-[2-옥소-2-페닐-아세톡시-에톡시]-에틸에스테르 및 옥시-페닐-아세틱애시드 2-[2-히드록시-에톡시]-에틸에스테르, 1-히드록시-시클로헥실-페닐-케톤 등을 들 수 있다. 광중합 개시제는 1종 또는 2종 이상을 조합하여 이용할 수 있다. 이들 중에서는 효과가 큰 점에서 벤조인 유도체, 1-히드록시-시클로헥실-페닐-케톤, 아실포스핀옥사이드 유도체로 이루어지는 군 중 1종 이상이 바람직하다. 벤조인 유도체 중에서는 벤질디메틸케탈이 바람직하다. 아실포스핀옥사이드 유도체 중에서는 2,4,6-트리메틸벤조일 디페닐포스핀옥사이드, 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드로 이루어지는 군 중 1종 이상이 바람직하다.(C) The photopolymerization initiator is used to promote photocuring of the resin composition by sensitizing with actinic rays of visible light or ultraviolet rays. Examples of the photopolymerization initiator include benzophenone and derivatives thereof, benzyl and derivatives thereof, anthraquinone and derivatives thereof, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal. Phosphorus derivatives, acetophenone derivatives such as diethoxyacetophenone and 4-t-butyltrichloroacetophenone, 2-dimethylaminoethylbenzoate, p-dimethylaminoethylbenzoate, diphenyldisulfide, thioxanthone and derivatives thereof , camphorquinone, 7,7-dimethyl-2,3-dioxicyclo[2.2.1]heptane-1-carboxylic acid, 7,7-dimethyl-2,3-dioxicyclo[2.2.1]heptane-1 -Carboxy-2-bromoethyl ester, 7,7-dimethyl-2,3-dioxobicyclo[2.2.1]heptane-1-carboxy-2-methyl ester, 7,7-dimethyl-2,3-dioxyl Camphorquinone derivatives such as sobicyclo[2.2.1]heptane-1-carboxylic acid chloride, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl α-aminoalkylphenone derivatives such as -2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide , Benzoyldiethoxyphosphine oxide, 2,4,6-trimethylbenzoyl dimethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyl diethoxyphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)- Acylphosphine oxide derivatives such as phenylphosphine oxide, oxy-phenyl-acetic acid 2-[2-oxo-2-phenyl-acetoxy-ethoxy]-ethyl ester and oxy-phenyl-acetic acid 2-[ 2-hydroxy-ethoxy]-ethyl ester, 1-hydroxy-cyclohexyl-phenyl-ketone, and the like. A photoinitiator can be used singly or in combination of two or more. Among these, at least one kind from the group consisting of benzoin derivatives, 1-hydroxy-cyclohexyl-phenyl-ketones, and acylphosphine oxide derivatives is preferred in terms of high effect. Among the benzoin derivatives, benzyldimethylketal is preferred. Among the acylphosphine oxide derivatives, at least one of the group consisting of 2,4,6-trimethylbenzoyl diphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide is preferred.
(C) 광중합 개시제의 사용량은 (A), (B) 및 (D)의 합계 100질량부에 대해 0.01~10질량부가 바람직하고, 0.1~1질량부가 보다 바람직하다. 0.01질량부 이상이면 양호한 경화성을 얻을 수 있고, 10질량부 이하이면 양호한 심부 경화성을 얻을 수 있다.(C) The amount of photopolymerization initiator used is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass, based on 100 parts by mass in total of (A), (B) and (D). If it is 0.01 parts by mass or more, good curability can be obtained, and if it is 10 parts by mass or less, good deep-side curability can be obtained.
(D) 디카르본산 디에스테르로서는 지방족 이염기산 디에스테르가 바람직하다. 지방족 이염기산 디에스테르로서는 식(1)으로 나타나는 화합물이 바람직하다.(D) As the dicarboxylic acid diester, an aliphatic dibasic acid diester is preferable. As an aliphatic dibasic acid diester, the compound represented by Formula (1) is preferable.
(식 중, R1, R2 및 R3의 정의는 상술한 바와 같다.)(In the formula, the definitions of R 1 , R 2 and R 3 are as described above.)
식(1)으로 나타나는 화합물의 R1, R2는 포화 지방족 탄화수소기가 바람직하다. 또한, 상기 R1, R2는 비치환인 것이 바람직하다. 상기 R1, R2는 탄소수 2~12의 알킬기가 바람직하고, 탄소수 4~10의 알킬기가 보다 바람직하며, 탄소수 8의 알킬기가 가장 바람직하다. 식(1)으로 나타나는 화합물의 R3은 포화 지방족 탄화수소기가 바람직하다. 또한, 상기 R3은 비치환인 것이 바람직하다. 상기 R3은 탄소수 4~10의 알킬렌기가 바람직하고, 탄소수 7~8의 알킬렌기가 보다 바람직하며, 탄소수 8의 알킬렌기가 가장 바람직하다.As for R1 and R2 of the compound represented by Formula (1), a saturated aliphatic hydrocarbon group is preferable. In addition, it is preferable that the above R 1 and R 2 are unsubstituted. As for R 1 and R 2 , an alkyl group having 2 to 12 carbon atoms is preferable, an alkyl group having 4 to 10 carbon atoms is more preferable, and an alkyl group having 8 carbon atoms is most preferable. R 3 of the compound represented by Formula (1) is preferably a saturated aliphatic hydrocarbon group. Also, R 3 is preferably unsubstituted. The R 3 is preferably an alkylene group having 4 to 10 carbon atoms, more preferably an alkylene group having 7 to 8 carbon atoms, and most preferably an alkylene group having 8 carbon atoms.
(D) 디카르본산 디에스테르는 예를 들어 심부 경화성을 양호하게 하고 점도를 조정하기 위해 사용되는 화합물이다.(D) Dicarboxylic acid diesters are compounds used, for example, to improve deep curability and adjust viscosity.
(D) 식(1)으로 나타나는 디카르본산 디에스테르로서 옥살산 디메틸, 옥살산 디에틸, 옥살산 디프로필, 옥살산 디이소프로필, 옥살산 디부틸, 옥살산 디헥실, 옥살산 디옥틸, 말론산 디이소프로필, 말론산 디부틸, 호박산 디에틸, 호박산 디프로필, 호박산 디이소프로필, 호박산 디부틸, 호박산 디t-부틸, 호박산 비스(2-에틸헥실), 호박산 비스(2-에톡시에틸), 글루탈산 디에틸, 글루탈산 디부틸, 아디프산 디메틸, 아디프산 디에틸, 아디프산 디프로필, 아디프산 디이소프로필, 아디프산 부틸, 아디프산 디t-부틸, 아디프산 비스(2-에틸헥실), 아디프산 디옥틸, 피멜산 디메틸, 피멜산 디에틸, 피멜산 디이소프로필, 피멜산 디부틸, 수베르산 디메틸, 수베르산 디에틸, 수베르산 디프로필, 수베르산 디이소프로필, 아젤라산 디메틸, 아젤라산 디에틸, 아젤라산 디프로필, 아젤라산 디이소프로필, 아젤라산 디부틸, 세바스산 디메틸, 세바스산 디에틸, 세바스산 디프로필, 세바스산 디프로필, 세바스산 디이소프로필, 세바스산 디부틸, 세바스산 비스(2-에틸헥실) 등을 들 수 있다. 이들 디카르본산 디에스테르는 1종 또는 2종 이상을 사용할 수 있다. (D) 디카르본산 디에스테르 중에서는 세바스산 디에스테르가 바람직하다. 세바스산 디에스테르 중에서는 세바스산 비스(2-에틸헥실)이 바람직하다.(D) Dicarboxylic acid diesters represented by Formula (1) include dimethyl oxalate, diethyl oxalate, dipropyl oxalate, diisopropyl oxalate, dibutyl oxalate, dihexyl oxalate, dioctyl oxalate, diisopropyl malonate, and horse Dibutyl ronate, diethyl succinate, dipropyl succinate, diisopropyl succinate, dibutyl succinate, dit-butyl succinate, bis(2-ethylhexyl) succinate, bis(2-ethoxyethyl) succinate, diethyl glutarate , dibutyl glutalate, dimethyl adipate, diethyl adipate, dipropyl adipate, diisopropyl adipate, butyl adipate, dit-butyl adipate, bis(2- adipate) Ethylhexyl), Dioctyl Adipate, Dimethyl Pimelate, Diethyl Pimelate, Diisopropyl Pimelate, Dibutyl Pimelate, Dimethyl Suberate, Diethyl Suberate, Dipropyl Suberate, Suberic Acid Diisopropyl, Dimethyl Azelaate, Diethyl Azelaate, Dipropyl Azelaate, Diisopropyl Azelaate, Dibutyl Azelaate, Dimethyl Sebacate, Diethyl Sebate, Dipropyl Sebacate, Dipropyl Sebacate, Sebacic Acid Diisopropyl, dibutyl sebacate, bis(2-ethylhexyl) sebacate, etc. are mentioned. These dicarboxylic acid diesters can use 1 type, or 2 or more types. (D) Among dicarboxylic acid diesters, sebacic acid diesters are preferred. Among the sebacic acid diesters, bis(2-ethylhexyl) sebacic acid is preferred.
(D) 디카르본산 디에스테르의 사용량은 (P) 및 (D)의 합계 100질량부에 대해 1~50질량부가 바람직하고, 5~45질량부가 보다 바람직하며, 8~20질량부가 가장 바람직하다. 1질량부 이상이면 양호한 점도를 얻을 수 있고, 50질량부 이하이면 양호한 심부 경화성을 얻을 수 있다.(D) The amount of dicarboxylic acid diester used is preferably 1 to 50 parts by mass, more preferably 5 to 45 parts by mass, most preferably 8 to 20 parts by mass, based on 100 parts by mass of the total of (P) and (D). . If it is 1 part by mass or more, good viscosity can be obtained, and if it is 50 parts by mass or less, good deep part curability can be obtained.
(E) 점착 부여제는 예를 들어 일반적으로 태키파이어 혹은 점착 부여 수지라고도 불리는 화합물로서, 경화 후도 접착제 경화물 표면에 점착성을 유지하기 위해 사용되는 화합물이다. 점착 부여제로는 자외선에 의해 열화되기 어렵고 내후성이 높은 점착 부여제가 바람직하다. 점착 부여제로서는 수소화 로진 수지(완전 수소화 로진 수지), 지방족 완전 포화 탄화수소 수지, 수소화 테르펜 수지(완전 수소화 테르펜 수지), 방향족 변성 수소화 테르펜 수지, 방향족 변성 테르펜 수지, 스티렌 수지, 테르펜페놀 수지, 수소화 테르펜페놀 수지 등을 들 수 있다. 이들 중에서는 완전 수소화 로진 수지, 방향족 변성 테르펜 수지, 테르펜페놀 수지로 이루어지는 군 중 1종 이상이 바람직하다.(E) The tackifier is, for example, a compound generally referred to as tackifier or tackifying resin, and is a compound used to maintain tackiness on the surface of the adhesive cured product even after curing. As the tackifier, a tackifier that is resistant to deterioration by ultraviolet rays and has high weather resistance is preferable. As the tackifier, hydrogenated rosin resin (fully hydrogenated rosin resin), aliphatic fully saturated hydrocarbon resin, hydrogenated terpene resin (fully hydrogenated terpene resin), aromatic modified hydrogenated terpene resin, aromatic modified terpene resin, styrene resin, terpene phenol resin, hydrogenated terpene A phenol resin etc. are mentioned. Among these, at least one of the group consisting of fully hydrogenated rosin resins, aromatic modified terpene resins, and terpene phenol resins is preferable.
(E) 점착 부여제의 사용량은 (P) 및 (D)의 합계 100질량부에 대해 1~40질량부가 바람직하고, 3~30질량부가 보다 바람직하며, 5~25질량부가 가장 바람직하고, 10~20질량부가 보다 더욱 바람직하다. 1질량부 이상이면 경화 후의 표면에 양호한 점착력을 얻을 수 있고, 40질량부 이하이면 양호한 투명성을 얻을 수 있다.(E) The amount of tackifier used is preferably 1 to 40 parts by mass, more preferably 3 to 30 parts by mass, most preferably 5 to 25 parts by mass, and 10 parts by mass to a total of 100 parts by mass of (P) and (D). -20 parts by mass is even more preferred. When it is 1 part by mass or more, good adhesiveness can be obtained on the surface after curing, and when it is 40 parts by mass or less, good transparency can be obtained.
본 발명의 조성물은 (F) 티올을 사용할 수 있다. (F) 티올이란 1개 이상의 티올기를 갖는 화합물을 말한다. 티올 중에서는 심부 경화성의 점에서 폴리티올이 바람직하다. (F) 폴리티올이란 2개 이상의 티올기를 갖는 화합물을 말한다. 폴리티올로서는 트리메틸올프로판 트리스티오프로피오네이트, 펜타에리트리톨 테트라키스티오프로피오네이트, 디펜타에리트리톨 헥사키스(3-메르캅토프로피오네이트), 트리스[(3-메르캅토프로피오닐옥시)-에틸]이소시아누레이트, 2-에틸헥실-3-메르캅토프로피오네이트, 3-메르캅토부틸레이트 유도체 등을 들 수 있다. 이들 폴리티올은 1종 또는 2종 이상을 사용할 수 있다.The composition of the present invention may use (F) thiol. (F) A thiol refers to a compound having one or more thiol groups. Among the thiols, polythiols are preferred from the viewpoint of deep curability. (F) Polythiol refers to a compound having two or more thiol groups. As the polythiol, trimethylolpropane trithiopropionate, pentaerythritol tetrakithiopropionate, dipentaerythritol hexakis(3-mercaptopropionate), tris[(3-mercaptopropionyloxy)- ethyl] isocyanurate, 2-ethylhexyl-3-mercaptopropionate, 3-mercaptobutyrate derivatives and the like. These polythiols can use 1 type, or 2 or more types.
(F) 폴리티올 중에서는 3-메르캅토부틸레이트 유도체와 메르캅토프로피오네이트 유도체로 이루어지는 군 중 1종 이상이 바람직하다. 예를 들어 1,4-비스(3-메르캅토부티릴옥시)부탄, 1,3,5-트리스(3-메르캅토부틸옥시에틸)-1,3,5-트리아진-2,4,6-(1H,3H,5H)-트리온, 펜타에리트리톨 테트라키스(3-메르캅토부틸레이트), 펜타에리트리톨 테트라키스(3-메르캅토부틸레이트), 트리메틸올프로판 트리스(3-메르캅토프로피오네이트), 2-에틸헥실-3-메르캅토프로피오네이트 등을 들 수 있다. (F) 폴리티올 중에서는 1급 또는 2급 폴리티올이 바람직하다.(F) Among the polythiols, at least one of the group consisting of 3-mercaptobutyrate derivatives and mercaptopropionate derivatives is preferred. For example 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6 -(1H,3H,5H)-trione, pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptopro cionate), 2-ethylhexyl-3-mercaptopropionate, and the like. (F) Among the polythiols, primary or secondary polythiols are preferred.
(F) 폴리티올의 사용량은 (P) 및 (D)의 합계 100질량부에 대해 0.1~10질량부가 바람직하고, 0.5~5질량부가 보다 바람직하다. 0.1질량부 이상이면 양호한 심부 경화성을 얻을 수 있고, 10질량부 이하이면 경화성 수지 조성물의 열에 의한 착색이나 변색이 작아진다.(F) The amount of polythiol used is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, based on 100 parts by mass in total of (P) and (D). If it is 0.1 parts by mass or more, good deep curability can be obtained, and if it is 10 parts by mass or less, coloring or discoloration due to heat of the curable resin composition is reduced.
본 발명의 조성물은 저장 안정성 향상을 위해 (G) 산화 방지제를 사용할 수 있다. 산화 방지제로서는 메틸하이드로퀴논, 하이드로퀴논, 2,2-메틸렌-비스(4-메틸-6-터셔리부틸페놀), 6-tert-부틸-4-[3-[(2,4,8,10-테트라-tert-부틸 디벤조[d,f][1,3,2]디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀, 카테콜, 하이드로퀴논 모노메틸에테르, 모노터셔리부틸 하이드로퀴논, 2,5-디터셔리부틸 하이드로퀴논, p-벤조퀴논, 2,5-디페닐-p-벤조퀴논, 2,5-디터셔리부틸-p-벤조퀴논, 피크르산, 구연산, 페노티아진, 터셔리부틸카테콜, 2-부틸-4-히드록시아니솔 및 2,6-디터셔리부틸-p-크레졸 등을 들 수 있다. 이들 중에서는 6-tert-부틸-4-[3-[(2,4,8,10-테트라-tert-부틸 디벤조[d,f][1,3,2]디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀이 바람직하다.In order to improve the storage stability of the composition of the present invention, (G) antioxidant may be used. Examples of antioxidants include methylhydroquinone, hydroquinone, 2,2-methylene-bis(4-methyl-6-tert-butylphenol), 6-tert-butyl-4-[3-[(2,4,8,10 -Tetra-tert-butyl dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl)oxy]propyl]-2-methylphenol, catechol, hydroquinone monomethyl ether, monoter Sherrybutyl hydroquinone, 2,5-ditertiarybutyl hydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-ditertbutyl-p-benzoquinone, picric acid, citric acid, phenol nothiazine, tert-butyl catechol, 2-butyl-4-hydroxyanisole, and 2,6-di-tertiary butyl-p-cresol; and the like. Among these is 6-tert-butyl-4-[3-[(2,4,8,10-tetra-tert-butyl dibenzo[d,f][1,3,2]dioxaphosphepine-6- yl)oxy]propyl]-2-methylphenol is preferred.
(G) 산화 방지제의 사용량은 (P) 및 (D)의 합계 100질량부에 대해 0.001~0.5질량부가 바람직하고, 0.005~0.1질량부가 보다 바람직하다. 0.001질량부 이상이면 경화성 수지 조성물의 열에 의한 착색이나 변색이 작고, 0.5질량부 이하이면 양호한 심부 경화성을 얻을 수 있다.(G) The amount of antioxidant used is preferably 0.001 to 0.5 parts by mass, more preferably 0.005 to 0.1 parts by mass, based on 100 parts by mass in total of (P) and (D). If it is 0.001 parts by mass or more, coloring or discoloration due to heat of the curable resin composition is small, and if it is 0.5 parts by mass or less, good deep curability can be obtained.
본 발명의 조성물은 본 발명의 목적을 손상시키지 않는 범위에서 일반적으로 사용되고 있는 아크릴 고무, 우레탄 고무, 아크릴로니트릴-부타디엔-스티렌 고무 등의 각종 엘라스토머, 극성 유기용매 등의 용제, 증량재, 보강재, 가소제, 증점제, 염료, 안료, 난연제, 실란 커플링제 및 계면활성제 등의 첨가제를 사용해도 된다.The composition of the present invention includes various elastomers such as acrylic rubber, urethane rubber, and acrylonitrile-butadiene-styrene rubber, solvents such as polar organic solvents, extenders, reinforcing materials, You may use additives, such as a plasticizer, a thickener, dye, a pigment, a flame retardant, a silane coupling agent, and surfactant.
본 발명의 조성물로 접착한 경화체는 완전 경화시킨 후에 리워크(재이용)하는 것이 가능하다. 리워크 방법으로서는 특별히 제한은 없지만, 맞추어붙여진 1종 또는 2종의 피착체 사이에 0.01~100N의 하중을 부하함으로써 피착체끼리를 해체하고 해체 후의 피착체를 재이용하는 것이 가능해진다.A cured product bonded with the composition of the present invention can be reworked (reused) after completely cured. The rework method is not particularly limited, but by applying a load of 0.01 to 100 N between one or two adherends put together, it becomes possible to dismantle the adherends and reuse the adherends after disassembly.
본 발명의 조성물은 예를 들어 경화성 수지 조성물이고, 접착제 조성물로서 사용할 수 있다. 본 발명의 조성물은 경화율이 90% 이상에 이른 경화물 상태에서도 각종 피착체의 맞추어붙임에 충분한 접착성·점착성을 유지한 조성물이다. 본 발명의 조성물은 예를 들어 한쪽의 피착체 상에 도포한 접착제 조성물에 가시광선 혹은 자외선을 조사한 후 다른 한쪽의 피착체와 맞추어붙임으로써 가시광선 혹은 자외선이 투과하지 않는 개소도 관계없이 경화하여 피착체를 맞추어붙일 수 있는 접착제 조성물이다.The composition of the present invention is, for example, a curable resin composition and can be used as an adhesive composition. The composition of the present invention is a composition that maintains sufficient adhesiveness and tackiness for bonding of various adherends even in the state of a cured product having a curing rate of 90% or more. The composition of the present invention, for example, by irradiating visible light or ultraviolet rays to the adhesive composition applied on one adherend and then attaching it to the other adherend, thereby curing regardless of the location where visible light or ultraviolet rays do not transmit, It is an adhesive composition to which a complex can be bonded.
본 발명의 접착제 조성물은 예를 들어 가시광선 혹은 자외선을 조사함으로써 접착제 조성물의 경화체를 얻을 수 있다.The adhesive composition of the present invention can be obtained as a cured product of the adhesive composition by, for example, irradiating visible light or ultraviolet light.
본 발명의 경화체에 의해 피착체가 피복 또는 접합된 복합체를 얻을 수 있다. 피착체는 특별히 한정하지 않지만, 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속으로 이루어지는 군에서 선택되는 1종 이상이 바람직하다.With the cured product of the present invention, a composite in which an adherend is coated or bonded can be obtained. The adherend is not particularly limited, but at least one selected from the group consisting of triacetyl cellulose, fluorine-based polymers, polyesters, polycarbonates, polyolefins, glass, and metals is preferable.
본 발명의 접착제 조성물을 이용하여 피착체를 맞추어붙인 터치 패널 적층체를 얻을 수 있다.Using the adhesive composition of the present invention, a touch panel laminate in which adherends are bonded together can be obtained.
본 발명의 접착제 조성물을 이용하여 피착체를 맞추어붙인 터치 패널 적층체를 얻을 수 있다. 상기 터치 패널 적층체를 이용하여 디스플레이를 얻을 수 있다.Using the adhesive composition of the present invention, a touch panel laminate in which adherends are bonded together can be obtained. A display can be obtained using the touch panel laminate.
본 발명의 접착제 조성물을 이용하여 피착체를 맞추어붙인 액정 패널 적층체를 얻을 수 있다. 상기 액정 패널 적층체를 이용하여 디스플레이를 얻을 수 있다.Using the adhesive composition of the present invention, a liquid crystal panel laminate in which adherends are bonded together can be obtained. A display can be obtained using the liquid crystal panel laminate.
실시예Example
이하에 실험예를 들어 본 발명을 더욱 상세하게 설명하지만, 본 발명은 이들에 한정되는 것은 아니다. 특기하지 않는 한 23℃에서 실험하였다.The present invention will be described in more detail below with reference to experimental examples, but the present invention is not limited thereto. Unless otherwise specified, experiments were conducted at 23°C.
(실험예 1)(Experimental Example 1)
표 1에 나타내는 조성의 경화성 수지 조성물을 조제하여 평가하였다. 결과를 표 1에 나타낸다.A curable resin composition having a composition shown in Table 1 was prepared and evaluated. The results are shown in Table 1.
실험예에 기재된 경화성 수지 조성물 중의 각 성분으로서는 이하의 화합물을 선택하였다.As each component in the curable resin composition described in Experimental Examples, the following compounds were selected.
(A)성분의 다관능 (메타)아크릴레이트로서 이하의 화합물을 선택하였다.(A) The following compounds were selected as the polyfunctional (meth)acrylate of the component.
(A-2) 폴리에스테르계 우레탄아크릴레이트 올리고머(「올리고머 2」, 구조는 이하와 같고, 폴리올 화합물은 1,4-부탄디올과 아디프산의 축합물인 폴리에스테르 폴리올과, 에틸렌글리콜과 아디프산의 축합물인 폴리에스테르 폴리올을 갖는 화합물(1,4-부탄디올과 아디프산의 축합물인 폴리에스테르 폴리올 : 에틸렌글리콜과 아디프산의 축합물인 폴리에스테르 폴리올=2:3(몰비)), 유기 폴리이소시아네이트 화합물은 이소포론 디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸 아크릴레이트, GPC에 의한 폴리스티렌 환산의 중량 평균 분자량 18000)(A-2) polyester urethane acrylate oligomer ("Oligomer 2", the structure is as follows, the polyol compound is a polyester polyol that is a condensate of 1,4-butanediol and adipic acid, ethylene glycol and adipic acid A compound having a polyester polyol that is a condensate of (polyester polyol that is a condensate of 1,4-butanediol and adipic acid: polyester polyol that is a condensate of ethylene glycol and adipic acid = 2:3 (molar ratio)), organic polyisocyanate Compound is isophorone diisocyanate, hydroxy (meth) acrylate is 2-hydroxyethyl acrylate, weight average molecular weight in terms of polystyrene by GPC 18000)
(A-1) 폴리에스테르계 우레탄아크릴레이트 올리고머(「올리고머 1」, 구조는 이하와 같고, 폴리올 화합물은 수소화 폴리부타디엔 폴리올과 아디프산의 축합물인 폴리에스테르 폴리올, 유기 폴리이소시아네이트 화합물은 이소포론 디이소시아네이트, 히드록시(메타)아크릴레이트는 4-히드록시부틸 아크릴레이트, GPC에 의한 폴리스티렌 환산의 중량 평균 분자량 25000, 수소화 폴리부타디엔 폴리올은 식(3)으로 나타나는 화합물(n은 양수))(A-1) polyester urethane acrylate oligomer ("Oligomer 1", the structure is as follows, the polyol compound is a polyester polyol that is a condensate of hydrogenated polybutadiene polyol and adipic acid, the organic polyisocyanate compound is isophorone di Isocyanate and hydroxy (meth) acrylate are 4-hydroxybutyl acrylate, weight average molecular weight of 25000 in terms of polystyrene by GPC, and hydrogenated polybutadiene polyol are compounds represented by formula (3) (n is a positive number)
(A-3) 수소화 폴리부타디엔계 우레탄아크릴레이트(「올리고머 3」, 수소화 폴리부타디엔 골격을 갖는 우레탄아크릴레이트이다. 또, 구조는 이하와 같고, 폴리올 화합물은 수소화 폴리부타디엔 폴리올, 유기 폴리이소시아네이트 화합물은 이소포론 디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸 아크릴레이트, 중량 평균 분자량 19000, 수소화 폴리부타디엔 폴리올은 식(2)으로 나타나는 화합물(n은 양수))(A-3) Hydrogenated polybutadiene-based urethane acrylate ("Oligomer 3", urethane acrylate having a hydrogenated polybutadiene skeleton. The structure is as follows, and the polyol compound is hydrogenated polybutadiene polyol, and the organic polyisocyanate compound is Isophorone diisocyanate, hydroxy (meth) acrylate is 2-hydroxyethyl acrylate, weight average molecular weight 19000, hydrogenated polybutadiene polyol is a compound represented by formula (2) (n is a positive number))
(A-4) 수소화 폴리부타디엔계 우레탄아크릴레이트(「올리고머 4」, 단 희석 모노머로서 n-옥틸아크릴레이트 20질량% 함유하고, 수소화 폴리부타디엔 골격을 갖는 우레탄아크릴레이트이다. 또, 구조는 이하와 같고, 폴리올 화합물은 수소화 폴리부타디엔 폴리올, 유기 폴리이소시아네이트 화합물은 이소포론 디이소시아네이트, 히드록시(메타)아크릴레이트는 2-히드록시에틸 아크릴레이트, 중량 평균 분자량 35000, 수소화 폴리부타디엔 폴리올은 식(2)으로 나타나는 화합물(n은 양수))(A-4) Hydrogenated polybutadiene-based urethane acrylate ("Oligomer 4", however, is a urethane acrylate containing 20% by mass of n-octyl acrylate as a dilute monomer and having a hydrogenated polybutadiene skeleton. The structure is as follows The same, the polyol compound is hydrogenated polybutadiene polyol, the organic polyisocyanate compound is isophorone diisocyanate, the hydroxy (meth) acrylate is 2-hydroxyethyl acrylate, the weight average molecular weight is 35000, the hydrogenated polybutadiene polyol is formula (2) Compound represented by (n is a positive number)
(B)성분의 단관능 (메타)아크릴레이트로서 이하의 화합물을 선택하였다.(B) The following compounds were selected as monofunctional (meth)acrylates of component.
(B-1) 노닐페녹시 폴리에틸렌글리콜 아크릴레이트(식(4)에서는 m=4)(토아 합성사 제품 「M-113」)(B-1) Nonylphenoxy polyethylene glycol acrylate (m = 4 in Formula (4)) ("M-113" manufactured by Toa Seong Co., Ltd.)
(B-2) 라우릴 아크릴레이트(오사카 유기사 제품 「LA」)(B-2) Lauryl acrylate (“LA” manufactured by Osaka Yugi Co., Ltd.)
(B-3) 4-히드록시부틸 (메타)아크릴레이트(니폰 카세이사 「4HBA」)(B-3) 4-hydroxybutyl (meth)acrylate ("4HBA" manufactured by Nippon Kasei)
(B-4) n-옥틸아크릴레이트(이하, 「NOAA」라고 함)(B-4) n-octyl acrylate (hereinafter referred to as "NOAA")
(C)성분의 광중합 개시제로서 이하의 화합물을 선택하였다.(C) The following compounds were selected as photopolymerization initiators of the component.
(C-1) 1-히드록시시클로헥실페닐케톤(BASF사 제품 「Irgacure184」)(C-1) 1-hydroxycyclohexylphenyl ketone ("Irgacure184" manufactured by BASF)
(C-2) 2,4,6-트리메틸벤조일-디페닐-포스핀옥사이드(BASF사 제품 「LucirinTPO」)(C-2) 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide (“LucirinTPO” manufactured by BASF)
(C-3) 비스(2,4,6-트리메틸벤조일)-페닐포스핀옥사이드(BASF사 제품 「Irgacure819」)(C-3) bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide ("Irgacure819" manufactured by BASF)
(D)성분의 디카르본산 디에스테르로서 이하의 화합물을 선택하였다.The following compounds were selected as dicarboxylic acid diesters of component (D).
(D-1) 세바스산 비스(2-에틸헥실)(신니혼 리카사 제품 「샌소사이저 DOS」)(이하, 「DOS」라고 함)(D-1) Bis(2-ethylhexyl) sebacic acid ("Sansosizer DOS" manufactured by New Japan Rica Co., Ltd.) (hereinafter referred to as "DOS")
(D-2) 아디프산 비스(2-에틸헥실)(이하, 「DOA」라고 함)(D-2) bis(2-ethylhexyl) adipic acid (hereinafter referred to as "DOA")
(E)성분의 점착 부여제로서 이하의 화합물을 선택하였다.(E) The following compounds were selected as the tackifier of the component.
(E-1) 하리마 화성 제품 하리택 F85(완전 수소화 로진 수지)(E-1) Haritac F85 (fully hydrogenated rosin resin) manufactured by Harima Chemicals
(E-2) 야스하라 케미컬 제품 YS 레진 TR105(방향족 변성 테르펜 수지)(E-2) Yasuhara Chemical YS Resin TR105 (aromatic modified terpene resin)
(E-3) 야스하라 케미컬 제품 YS 폴리스터 TH130(테르펜페놀 수지)(E-3) Yasuhara Chemical YS Polyster TH130 (Terpenephenol Resin)
(F)성분의 티올 화합물로서 이하의 화합물을 선택하였다.(F) As a thiol compound of component, the following compounds were selected.
(F-1) 펜타에리트리톨 테트라키스(3-메르캅토부틸레이트)(쇼와 덴코사 제품 「카렌즈 MT PE1」)(이하, 「MT-PE1」이라고 함)(F-1) pentaerythritol tetrakis(3-mercaptobutyrate) ("Karenz MT PE1" manufactured by Showa Denko Co., Ltd.) (hereinafter referred to as "MT-PE1")
(F-2) 2-에틸헥실-3-메르캅토프로피오네이트(SC 유기 화학 제품 「EHMP」)(F-2) 2-ethylhexyl-3-mercaptopropionate (SC Organic Chemicals "EHMP")
(G)성분의 산화 방지제로서 이하의 화합물을 선택하였다.(G) The following compounds were selected as antioxidants of component.
(G-1) 6-tert-부틸-4-[3-[(2,4,8,10-테트라-tert-부틸 디벤조[d,f][1,3,2]디옥사포스페핀-6-일)옥시]프로필]-2-메틸페놀(스미토모 화학 공업사 제품 「스밀라이저 GP」)(이하, 「GP」라고 함)(G-1) 6-tert-butyl-4-[3-[(2,4,8,10-tetra-tert-butyl dibenzo[d,f][1,3,2]dioxaphosphepine- 6-yl)oxy]propyl]-2-methylphenol (Sumitomo Chemical Co., Ltd. "Sumilizer GP") (hereinafter referred to as "GP")
각종 물성은 다음과 같이 측정하였다.Various physical properties were measured as follows.
〔광경화성〕[Photocurable]
온도 23℃에서 측정하였다. 광경화성에 관해서는 텐팍스 유리(폭 25mm×길이 25mm×두께 2mm)의 표면에 경화성 수지 조성물을 두께 0.1mm가 되도록 도포하였다. 그 후, 무전극 방전 램프를 사용한 퓨전사 제품 경화 장치를 이용하여 파장 365nm의 UV광을 적산광량 1500mJ/㎠의 조건으로 조사하고 경화시켰다.It was measured at a temperature of 23°C. Regarding photocurability, a curable resin composition was applied to the surface of Tempax glass (25 mm wide x 25 mm long x 2 mm thick) to a thickness of 0.1 mm. Thereafter, UV light having a wavelength of 365 nm was irradiated and cured under conditions of a cumulative light amount of 1500 mJ/cm 2 using a curing device manufactured by Fusion Co. using an electrodeless discharge lamp.
경화율은 FT-IR을 사용하여 이하의 식에 의해 산출하였다. 탄소와 탄소의 이중 결합의 흡수 스펙트럼은 1600cm-1 부근의 피크를 이용하였다.The curing rate was calculated by the following formula using FT-IR. For the absorption spectrum of carbon and the carbon double bond, a peak around 1600 cm -1 was used.
(경화율)=100-(경화 후 탄소와 탄소의 이중 결합의 흡수 스펙트럼의 강도)/(경화 전 탄소와 탄소의 이중 결합의 흡수 스펙트럼의 강도)×100(%)(curing rate) = 100 - (intensity of absorption spectrum of carbon and double bond after curing) / (intensity of absorption spectrum of carbon and double bond before curing) × 100 (%)
〔유리 접착성 평가(유리 항장력 평가)〕[Evaluation of glass adhesion (evaluation of tensile strength of glass)]
슬라이드 유리 시험편(시판품, 폭 20mm×길이 76mm×두께 1.1mm)의 중앙부에 두께 200μm×폭 20mm×길이 20mm의 테플론(등록상표) 테이프를 스페이서로서 이용하여 경화성 수지 조성물을 반경 4mm의 원형으로 도포한 후 광을 조사하여 경화시켰다. 광조사 조건은 상기 〔광경화성〕 페이지에 기재된 방법에 따라 경화성 수지 조성물을 경화시킨 후에 동일 크기의 슬라이드 유리 시험편과 십자형상이 되도록 맞추어붙이고 1kgf/㎠의 압력을 걸어 접착하였다(접착 면적 50㎟). 상기 조건으로 슬라이드 유리 시험편끼리를 접착한 후, 만능 시험기를 이용하여 십자형상으로 접착한 슬라이드 유리 시험편 중 한쪽에만 압력을 걸어 항장력(단위: kPa)을 측정하였다. 항장력은 온도 23℃, 습도 50%의 환경 하에서 속도 10mm/분으로 측정하였다.A curable resin composition was applied in a circular shape with a radius of 4 mm using a Teflon (registered trademark) tape having a thickness of 200 μm × width 20 mm × length 20 mm as a spacer at the center of a slide glass test piece (commercial product, width 20 mm × length 76 mm × thickness 1.1 mm). After that, it was cured by irradiating light. For light irradiation conditions, after curing the curable resin composition according to the method described on the [Photocuring] page, it was attached to a slide glass test piece of the same size in a cross shape and bonded by applying a pressure of 1 kgf / cm 2 (bonding area 50 mm 2). After the slide glass test pieces were adhered to each other under the above conditions, the tensile strength (unit: kPa) was measured by applying pressure to only one of the slide glass test pieces bonded in a cross shape using a universal tester. Tensile strength was measured at a speed of 10 mm/min under an environment of a temperature of 23° C. and a humidity of 50%.
〔폴리카보네이트 접착성 평가(폴리카보네이트 항장력 평가)〕[Evaluation of polycarbonate adhesiveness (evaluation of polycarbonate tensile strength)]
폴리카보네이트 시험편(테이진사 제품 「팬라이트」, 폭 25mm×길이 25mm×두께 2.0mm)의 중앙부에 두께 200μm×폭 20mm×길이 20mm의 테플론(등록상표) 테이프를 스페이서로서 이용하여 경화성 수지 조성물을 반경 4mm의 원형으로 도포한 후 광을 조사하여 경화시켰다. 광조사 조건은 상기 〔광경화성〕 페이지에 기재된 방법에 따라 경화성 수지 조성물을 경화시킨 후에 동일 크기의 폴리카보네이트 시험편과 십자형상이 되도록 맞추어붙이고 1kgf/㎠의 압력을 걸어 접착하였다(접착 면적 50㎟). 상기 조건으로 폴리카보네이트 시험편끼리를 접착한 후, 만능 시험기를 이용하여 십자형상으로 접착한 폴리카보네이트 시험편 중 한쪽에만 압력을 걸어 항장력(단위: kPa)을 측정하였다. 항장력은 온도 23℃, 습도 50%의 환경 하에서 속도 10mm/분으로 측정하였다.A Teflon (registered trademark) tape with a thickness of 200 μm × width 20 mm × length 20 mm was used as a spacer at the center of a polycarbonate test piece (“Panlite” manufactured by Teijin, width 25 mm × length 25 mm × thickness 2.0 mm), and a curable resin composition was applied to the radius. After applying in a circular shape of 4 mm, it was cured by irradiating light. For light irradiation conditions, after curing the curable resin composition according to the method described on the [Photocurable] page, it was attached to a polycarbonate test piece of the same size in a cross shape and bonded by applying a pressure of 1 kgf / cm 2 (adhesion area 50 mm 2). After the polycarbonate test pieces were bonded to each other under the above conditions, the tensile strength (unit: kPa) was measured by applying pressure to only one of the polycarbonate test pieces bonded in a cross shape using a universal tester. Tensile strength was measured at a speed of 10 mm/min under an environment of a temperature of 23° C. and a humidity of 50%.
〔내습열성 평가(외관 관찰(황변도))〕[Evaluation of heat and moisture resistance (observation of appearance (yellowing degree))]
EAGLE XG(등록상표) 유리(폭 50mm×길이 70mm×두께 0.7mm)끼리를 경화성 수지 조성물을 이용하여 경화성 수지 조성물층의 두께를 200μm로 하여 접착시켜 경화시켰다. 광조사 조건은 상기 〔광경화성〕 페이지에 기재된 방법에 따랐다. 경화 후, 이러한 접착 시험편을 항온 항습조를 이용하여 온도 85℃, 상대습도 95%의 환경 하에 1000시간 폭로하였다. 폭로 후, 이러한 접착 시험편의 Δb값을 컬러 측정 장치(SHIMADZU사 제품 「UV-VISIBLE SPECTROPHOTOMETER」)로 측정하여 황변도로 하였다.EAGLE XG (registered trademark) glass (50 mm in width x 70 mm in length x 0.7 mm in thickness) was bonded to each other using a curable resin composition with a thickness of the curable resin composition layer of 200 µm, and cured. Light irradiation conditions followed the method described in the above [Photocurable] page. After curing, this adhesive test piece was exposed to an environment of a temperature of 85°C and a relative humidity of 95% for 1000 hours using a constant temperature and humidity chamber. After exposure, the Δb value of this adhesive test piece was measured with a color measuring device ("UV-VISIBLE SPECTROPHOTOMETER" manufactured by SHIMADZU) to determine the degree of yellowing.
표 1로부터 이하가 인정되었다. 본 발명은 우수한 효과를 가진다. 점착 부여제를 사용하지 않는 경우(비교예 1) 접착성이 작고 본 발명의 효과를 가지지 못한다. 점착 부여제가 많으면 투명성이 작아지고 경화성이 작아진다(실시예 6).The following was recognized from Table 1. The present invention has excellent effects. When no tackifier is used (Comparative Example 1), the adhesiveness is low and the effect of the present invention is not obtained. When there are many tackifiers, transparency becomes small and hardenability becomes small (Example 6).
(실험예 2)(Experimental Example 2)
표 2에 나타내는 조성의 경화성 수지 조성물을 이용하여 심부 경화성을 평가하였다. 결과를 표 2에 나타낸다.Deep curability was evaluated using the curable resin composition having the composition shown in Table 2. The results are shown in Table 2.
〔심부 경화성〕[deep curing]
직경 5mmΦ의 구멍이 열린 길이 20mm 검은 튜브에 경화성 수지 조성물을 충전하고 상부로부터 블랙 라이트로 1mW/㎠(365nm)의 광을 100초간 조사하였다(적산광량은 100mJ/㎠). 그 후, 검은 튜브로부터 경화물을 취출하여 미경화 부분을 제거하고 경화되어 있는 부분의 두께를 마이크로미터로 측정하였다.A 20 mm long black tube with a diameter of 5 mm ? was filled with the curable resin composition, and 1 mW/cm 2 (365 nm) light was irradiated from the top with a black light for 100 seconds (integrated light amount: 100 mJ/cm 2 ). Then, the cured product was taken out from the black tube, the uncured portion was removed, and the thickness of the cured portion was measured with a micrometer.
표 2로부터 이하가 인정되었다. 티올을 사용한 경우 심부 경화성을 가진다.From Table 2, the following was recognized. When thiol is used, it has deep curability.
(실험예 3)(Experimental Example 3)
표 3에 나타내는 조성의 경화성 수지 조성물을 이용하여 점도를 평가하였다. 결과를 표 3에 나타낸다.Viscosity was evaluated using the curable resin composition of the composition shown in Table 3. The results are shown in Table 3.
〔점도〕〔viscosity〕
조성물의 점도는 E형 점도계를 이용하여 온도 25℃, 회전수 20rpm의 조건 하에서 측정하였다.The viscosity of the composition was measured using an E-type viscometer under conditions of a temperature of 25°C and a rotation speed of 20 rpm.
표 3으로부터 이하가 인정되었다. 본 발명은 우수한 효과를 가진다. 디카르본산 디에스테르를 사용하지 않는 경우(비교예 2) 점도가 크다. 점도가 작은 경우 피착체에 도포하기 쉬워져 도포 작업성이 우수하다.The following was recognized from Table 3. The present invention has excellent effects. When no dicarboxylic acid diester is used (Comparative Example 2), the viscosity is high. When the viscosity is low, it is easy to apply to the adherend and the application workability is excellent.
본 발명은 예를 들어 경화 후도 표면에 접착성을 유지하는 조성물을 제공할 수 있다. 나아가 이하 효과도 가진다.The present invention can provide a composition that maintains adhesion to a surface even after curing, for example. Furthermore, it has the following effects.
피착체인 아이콘 시트나 터치 패널은 표시체의 구동용 IC나 배선이나 LCD의 테두리 시일제를 숨기고 표시 영역만을 보이도록 하여 디자인성을 향상시키기 위해 차광부를 인쇄 등으로 피복하는 경우가 있다. 종래의 광경화성 접착제 조성물은 경화가 진행될수록 표면의 점접착력(택력이라고도 불림, 본고에서는 점접착력으로 통일함)이 저하되는 경향이 있었다. 이 때문에 피착체끼리를 접착하려면 접착제를 한쪽의 피착체 상에 도포한 후, 미경화의 액상인 채로 혹은 접착제를 완전히 경화하지 않을 정도로 경화시킨(「반경화」 「가경화」 등이라고도 불림) 상태로 다른 한쪽의 피착체를 맞추어붙인 후에 자외광을 조사하여 경화시키는 방식이 자주 취해진다. 이 때 전술한 차광부가 존재하면 차광부 아래의 광경화성 접착제 조성물은 광이 닿지 않아 경화하지 않기 때문에 접착이 불충분한 경우가 있었다.An icon sheet or touch panel, which is an adherend, may cover the light-shielding portion with printing or the like to improve design by hiding the driving IC or wiring of the display body or the edge sealant of the LCD so that only the display area is visible. Conventional photocurable adhesive compositions have a tendency to decrease the point adhesive force (also called tack force, unified as point adhesive force in this paper) on the surface as curing progresses. For this reason, in order to adhere the adherends to each other, the adhesive is applied on one adherend, and then the adhesive is cured in an uncured liquid state or to the extent that the adhesive is not completely cured (also called "semi-cured" or "temporarily cured"). After bonding the adherend on the other side of the adhesive, a method of curing by irradiating ultraviolet light is often taken. At this time, if the light-shielding portion is present, the photocurable adhesive composition under the light-shielding portion is not exposed to light and is not cured, so adhesion may be insufficient.
본 발명은 상기 과제도 해결한 발명으로, 예를 들어 이하의 효과를 가진다. 본 발명은 한쪽의 피착체 상에 도포한 접착제 조성물을 미리 경화하고 나서 피착체끼리를 맞추어붙임으로써 피착체에 차광부가 존재해도 그 영향을 받지 않고 경화성 수지 조성물을 경화하는 것이 가능하다. 본 발명은 경화 수축율이 작고 치수 변화나 휨 등의 면 정밀도 변화가 일어나지 않는다. 본 발명은 고온 신뢰성 시험에서 피착체의 팽창 수축에 견딜 수 있다. 본 발명은 내열 시험 후의 착색, 변색, 내습 시험 후의 강도 저하 등의 문제가 일어나지 않는다.This invention is an invention which also solved the said subject, and has the following effects, for example. In the present invention, the curable resin composition can be cured without being affected even if a light-shielding portion exists in the adherend by bonding the adherends together after curing the adhesive composition applied on one adherend in advance. The curing shrinkage of the present invention is small, and surface accuracy change such as dimensional change or warpage does not occur. The present invention can withstand expansion and contraction of an adherend in a high-temperature reliability test. In the present invention, problems such as discoloration and discoloration after a heat resistance test and decrease in strength after a moisture resistance test do not occur.
본 발명은 예를 들어 터치 패널 등의 표시체에 사용되는 화장판이나 아이콘 시트를 맞추어붙이는 경우, 투명 기판과 투명 기판을 맞추어붙이는 경우, 인쇄 가공된 부분을 맞추어붙이는 경우에 인쇄 등의 차광부에 의해 피착체 정면에서는 가시광선 혹은 자외선이 닿지 않는 개소에서도 각 피착체를 맞추어붙이기 전에 한쪽의 피착체 상에 도포한 접착제에 미리 가시광선 혹은 자외선을 조사하고 경화시킴으로써 차광부의 유무에 관계없이 맞추어붙임면의 접착제가 똑같이 경화한 경화성 수지 조성물을 제공할 수 있다. 본 발명은 차광부 아래의 경화성 접착 수지의 경화가 가능하고 접착제의 경화 불량을 억제하는 효과를 가진다.The present invention is applied, for example, to light-shielding parts such as printing in the case of gluing decorative plates or icon sheets used in display bodies such as touch panels, in the case of gluing transparent substrates and transparent substrates, in the case of piecing together printed parts. Even in places where visible light or ultraviolet rays do not reach from the front of the adherend, before bonding each adherend, the adhesive applied on one adherend is irradiated with visible light or ultraviolet rays in advance and cured, regardless of the presence or absence of a light-shielding part. It is possible to provide a curable resin composition in which the adhesive of the cotton is cured in the same way. The present invention has an effect of enabling curing of the curable adhesive resin under the light-shielding portion and suppressing poor curing of the adhesive.
Claims (21)
(P) 중합성 비닐 화합물,
(C) 광중합 개시제,
(D) 아디프산 디에스테르 및 시클로헥산 디카르본산 디에스테르를 제외한 지방족 이염기산 디에스테르,
(E) 점착 부여제.A composition containing the following (P), (C) to (E):
(P) a polymerizable vinyl compound;
(C) a photopolymerization initiator;
(D) aliphatic dibasic acid diesters other than adipic acid diesters and cyclohexane dicarboxylic acid diesters;
(E) a tackifier.
(D)가 식(1)으로 나타나는 지방족 이염기산 디에스테르인 조성물.
[화학식 1]
(식 중, R1, R2는 탄소수 1~18의 알킬기이고, R3은 탄소수 1~10의 알킬렌기이며, R1, R2는 동일해도 되고 달라도 된다.)The method of claim 1,
A composition in which (D) is an aliphatic dibasic acid diester represented by formula (1).
[Formula 1]
(In the formula, R 1 and R 2 are alkyl groups having 1 to 18 carbon atoms, R 3 is an alkylene group having 1 to 10 carbon atoms, and R 1 and R 2 may be the same or different.)
(D)가 세바스산 디에스테르인 조성물.The method of claim 2,
(D) is a sebacic acid diester.
(F) 티올을 더 함유하는 조성물.The method of claim 1,
(F) A composition further containing a thiol.
상기 (F) 티올이 폴리티올인 조성물.The method of claim 4,
The composition (F) wherein the thiol is a polythiol.
(G) 산화 방지제를 더 함유하는 조성물.The method of claim 1,
(G) A composition further containing an antioxidant.
상기 (P) 중합성 비닐 화합물이 (A) 다관능 (메타)아크릴레이트 및 (B) 단관능 (메타)아크릴레이트를 함유하는 조성물.The method of claim 1,
A composition in which the (P) polymerizable vinyl compound contains (A) a multifunctional (meth)acrylate and (B) a monofunctional (meth)acrylate.
(A) 다관능 (메타)아크릴레이트가 우레탄(메타)아크릴레이트인 조성물.The method of claim 7,
(A) A composition in which the polyfunctional (meth)acrylate is urethane (meth)acrylate.
(B) 단관능 (메타)아크릴레이트가 페놀알킬렌옥사이드 변성 (메타)아크릴레이트, 알킬(메타)아크릴레이트, 히드록시알킬(메타)아크릴레이트로 이루어지는 군에서 선택되는 1종 이상인 조성물.The method of claim 7,
(B) A composition in which the monofunctional (meth)acrylate is at least one selected from the group consisting of phenolalkylene oxide-modified (meth)acrylates, alkyl (meth)acrylates, and hydroxyalkyl (meth)acrylates.
(D)의 사용량이 (P) 및 (D)의 합계 100질량부 중 5~50질량부인 조성물.The method of claim 1,
A composition in which the amount of (D) used is 5 to 50 parts by mass in 100 parts by mass of the total of (P) and (D).
(E) 점착 부여제가 완전 수소화 로진 수지, 방향족 변성 테르펜 수지, 테르펜페놀 수지로 이루어지는 군 중 1종 이상인 조성물.The method of claim 1,
(E) A composition in which the tackifier is at least one of the group consisting of fully hydrogenated rosin resins, aromatic modified terpene resins, and terpene phenol resins.
피착체가 트리아세틸셀룰로오스, 불소계 폴리머, 폴리에스테르, 폴리카보네이트, 폴리올레핀, 유리, 금속으로 이루어지는 군에서 선택되는 1종 이상인 복합체.The method of claim 15
A composite wherein the adherend is at least one member selected from the group consisting of triacetyl cellulose, fluorine-based polymers, polyesters, polycarbonates, polyolefins, glass, and metals.
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EP3660104A4 (en) * | 2017-07-24 | 2021-04-21 | Sekisui Chemical Co., Ltd. | Resin film and glass-plate-containing laminate |
TWI752299B (en) * | 2018-03-30 | 2022-01-11 | 法商阿科瑪法國公司 | Curable compositions for use as adhesives having properties capable of being altered based on external stimuli and methods of making and using the same |
JP7398367B2 (en) * | 2018-06-15 | 2023-12-14 | デンカ株式会社 | Composition |
JP7227087B2 (en) * | 2019-06-26 | 2023-02-21 | 株式会社イノアックコーポレーション | Adhesive, adhesive tape and method for producing adhesive |
CN111826090B (en) * | 2020-01-16 | 2022-06-03 | 东莞市派乐玛新材料技术开发有限公司 | Borderless full-lamination frame glue, borderless full-lamination face glue and display panel |
CN112295500B (en) * | 2020-11-30 | 2022-06-21 | 上海奥威日化有限公司 | Surfactant composition and preparation method thereof |
JPWO2022224934A1 (en) * | 2021-04-19 | 2022-10-27 | ||
JP7090366B1 (en) | 2021-09-17 | 2022-06-24 | Yamakin株式会社 | Dental surface smooth composition |
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CN105764930B (en) * | 2013-11-27 | 2018-11-16 | 电化株式会社 | Composition |
WO2016027580A1 (en) * | 2014-08-18 | 2016-02-25 | 富士フイルム株式会社 | Actinic-ray-curable resin composition, optical member, pressure-sensitive adhesive sheet, laminate for touch panel, and capacitive touch panel |
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TW201708485A (en) | 2017-03-01 |
JPWO2016190361A1 (en) | 2018-03-15 |
KR20180005257A (en) | 2018-01-15 |
TWI689569B (en) | 2020-04-01 |
CN107614544B (en) | 2020-10-30 |
CN107614544A (en) | 2018-01-19 |
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