KR20160085215A - Pressure-sensitive adhesive tape - Google Patents
Pressure-sensitive adhesive tape Download PDFInfo
- Publication number
- KR20160085215A KR20160085215A KR1020160000327A KR20160000327A KR20160085215A KR 20160085215 A KR20160085215 A KR 20160085215A KR 1020160000327 A KR1020160000327 A KR 1020160000327A KR 20160000327 A KR20160000327 A KR 20160000327A KR 20160085215 A KR20160085215 A KR 20160085215A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive tape
- pressure
- sensitive adhesive
- meth
- base polymer
- Prior art date
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims description 83
- 229920005601 base polymer Polymers 0.000 claims abstract description 76
- 239000002390 adhesive tape Substances 0.000 claims abstract description 68
- 239000002253 acid Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 20
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 56
- 238000004804 winding Methods 0.000 claims description 38
- 239000003990 capacitor Substances 0.000 claims description 34
- 229910052782 aluminium Inorganic materials 0.000 claims description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000000470 constituent Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000000178 monomer Substances 0.000 description 48
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 41
- 239000003431 cross linking reagent Substances 0.000 description 27
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 238000011156 evaluation Methods 0.000 description 23
- -1 polyethylene terephthalate Polymers 0.000 description 23
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 16
- 239000004734 Polyphenylene sulfide Substances 0.000 description 16
- 229920000069 polyphenylene sulfide Polymers 0.000 description 16
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 15
- 239000004642 Polyimide Substances 0.000 description 14
- 239000012948 isocyanate Substances 0.000 description 14
- 229920001721 polyimide Polymers 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 13
- 238000006073 displacement reaction Methods 0.000 description 13
- 125000000524 functional group Chemical group 0.000 description 13
- 150000002513 isocyanates Chemical class 0.000 description 13
- 239000000203 mixture Substances 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 11
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229920001577 copolymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000001035 drying Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 229920002530 polyetherether ketone Polymers 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- KFIGICHILYTCJF-UHFFFAOYSA-N n'-methylethane-1,2-diamine Chemical compound CNCCN KFIGICHILYTCJF-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 150000003505 terpenes Chemical class 0.000 description 5
- 235000007586 terpenes Nutrition 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229920006272 aromatic hydrocarbon resin Polymers 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- YLLIGHVCTUPGEH-UHFFFAOYSA-M potassium;ethanol;hydroxide Chemical compound [OH-].[K+].CCO YLLIGHVCTUPGEH-UHFFFAOYSA-M 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000013032 Hydrocarbon resin Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 229920006271 aliphatic hydrocarbon resin Polymers 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229920006270 hydrocarbon resin Polymers 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000003918 potentiometric titration Methods 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- IAUGBVWVWDTCJV-UHFFFAOYSA-N 1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C=C IAUGBVWVWDTCJV-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- ZUCZTOKYCDKFJF-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(C)(C)CO ZUCZTOKYCDKFJF-UHFFFAOYSA-N 0.000 description 1
- KQSMCAVKSJWMSI-UHFFFAOYSA-N 2,4-dimethyl-1-n,1-n,3-n,3-n-tetrakis(oxiran-2-ylmethyl)benzene-1,3-diamine Chemical compound CC1=C(N(CC2OC2)CC2OC2)C(C)=CC=C1N(CC1OC1)CC1CO1 KQSMCAVKSJWMSI-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- PGMMQIGGQSIEGH-UHFFFAOYSA-N 2-ethenyl-1,3-oxazole Chemical compound C=CC1=NC=CO1 PGMMQIGGQSIEGH-UHFFFAOYSA-N 0.000 description 1
- MZNSQRLUUXWLSB-UHFFFAOYSA-N 2-ethenyl-1h-pyrrole Chemical compound C=CC1=CC=CN1 MZNSQRLUUXWLSB-UHFFFAOYSA-N 0.000 description 1
- ZDHWTWWXCXEGIC-UHFFFAOYSA-N 2-ethenylpyrimidine Chemical compound C=CC1=NC=CC=N1 ZDHWTWWXCXEGIC-UHFFFAOYSA-N 0.000 description 1
- 125000006176 2-ethylbutyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- YYIOIHBNJMVSBH-UHFFFAOYSA-N 2-prop-2-enoyloxynaphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=C(OC(=O)C=C)C=CC2=C1 YYIOIHBNJMVSBH-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- JSZCJJRQCFZXCI-UHFFFAOYSA-N 6-prop-2-enoyloxyhexanoic acid Chemical compound OC(=O)CCCCCOC(=O)C=C JSZCJJRQCFZXCI-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OXEQQZYKYLWOGO-UHFFFAOYSA-N C(CCC(NCC1OC1)OCC1OC1)CCOCC1OC1 Chemical compound C(CCC(NCC1OC1)OCC1OC1)CCOCC1OC1 OXEQQZYKYLWOGO-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- KJVBXWVJBJIKCU-UHFFFAOYSA-N [hydroxy(2-hydroxyethoxy)phosphoryl] prop-2-enoate Chemical compound OCCOP(O)(=O)OC(=O)C=C KJVBXWVJBJIKCU-UHFFFAOYSA-N 0.000 description 1
- 239000000783 alginic acid Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- KBWLNCUTNDKMPN-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) hexanedioate Chemical compound C1OC1COC(=O)CCCCC(=O)OCC1CO1 KBWLNCUTNDKMPN-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- FLKYBGKDCCEQQM-WYUVZMMLSA-M cefazolin sodium Chemical compound [Na+].S1C(C)=NN=C1SCC1=C(C([O-])=O)N2C(=O)[C@@H](NC(=O)CN3N=NN=C3)[C@H]2SC1 FLKYBGKDCCEQQM-WYUVZMMLSA-M 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- KZNICNPSHKQLFF-UHFFFAOYSA-N dihydromaleimide Natural products O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- OIAUFEASXQPCFE-UHFFFAOYSA-N formaldehyde;1,3-xylene Chemical compound O=C.CC1=CC=CC(C)=C1 OIAUFEASXQPCFE-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- XVQUOJBERHHONY-UHFFFAOYSA-N isometheptene Chemical group CNC(C)CCC=C(C)C XVQUOJBERHHONY-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000000954 titration curve Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C09J7/0217—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C09J7/02—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2481/00—Presence of sulfur containing polymers
- C09J2481/006—Presence of sulfur containing polymers in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
Description
본 발명은 점착 테이프에 관한 것이다. 보다 상세하게는, 콘덴서 소자의 권회 고정에 사용될 수 있는 점착 테이프에 관한 것이다.The present invention relates to an adhesive tape. More particularly, the present invention relates to an adhesive tape which can be used for winding and fixing a capacitor element.
일반적으로, 콘덴서 소자는, 양극박과 음극박 사이에 전해지를 삽입하고, 원통형으로 권회하여 구성된다. 종래, 이러한 콘덴서 소자의 권회 고정에는, 점착 테이프가 다용되고 있다(예를 들어, 특허문헌 1, 2).Generally, the condenser element is constituted by inserting an electrolytic sheet between a cathode foil and a cathode foil and winding it into a cylindrical shape. BACKGROUND ART [0002] Conventionally, an adhesive tape is widely used for winding and fixing such a capacitor element (for example, Patent Documents 1 and 2).
최근 들어, 콘덴서 소자는, 종래보다도 높은 온도 하에서 행하여지는 공정에 제공되게 되어, 예를 들어, 리플로우 공정에 있어서 종래보다도 높은 온도(예를 들어, 종래 230℃에 비하여 260℃)로 가열되는 경우가 있다. 또한, 고온 하(예를 들어, 150℃)에서의 장기 보존성도 요구되고 있다.In recent years, a capacitor element is provided in a process which is performed at a temperature higher than a conventional one. For example, in a case where the capacitor device is heated at a higher temperature than the conventional temperature (for example, 260 DEG C compared with 230 DEG C conventionally) . Further, long-term storage stability at a high temperature (for example, 150 DEG C) is also required.
상기와 같이 보다 높은 내열성이 요구되는 용도에 있어서, 종래의 점착 테이프에 의해 권회 고정을 행하면, 콘덴서 소자의 권취 이완, 권취 어긋남 등이 발생하여, 그 콘덴서 소자의 용량 저하가 발생한다는 문제가 있다.In applications where higher heat resistance is required as described above, if winding fixation is performed by a conventional adhesive tape, there is a problem that winding of the capacitor element is relaxed, winding displacement occurs, and the capacity of the capacitor element is lowered.
본 발명은 상기 종래의 과제를 해결하기 위하여 이루어진 것으로서, 그 목적으로 하는 점은, 내열성이 우수하고, 고온 하에서도 콘덴서 소자를 양호하게 권회 고정할 수 있는 점착 테이프를 제공하는 데 있다.An object of the present invention is to provide a pressure-sensitive adhesive tape excellent in heat resistance and capable of winding and fixing a capacitor element well under a high temperature.
본 발명의 점착 테이프는, 기재와, 그 기재의 적어도 편면에 배치된 점착제층을 구비하고, 그 점착제층이 베이스 폴리머를 포함하고, 그 베이스 폴리머의 산가가 45mgKOH/g 내지 150mgKOH/g이다.The pressure-sensitive adhesive tape of the present invention comprises a base material and a pressure-sensitive adhesive layer disposed on at least one side of the base material, wherein the pressure-sensitive adhesive layer comprises a base polymer and the base polymer has an acid value of 45 mgKOH / g to 150 mgKOH / g.
일 실시 형태에 있어서는, 상기 베이스 폴리머가 아크릴계 폴리머이다.In one embodiment, the base polymer is an acrylic polymer.
일 실시 형태에 있어서는, 상기 아크릴계 폴리머가 분지상의 알킬기를 갖는 (메트)아크릴산알킬에스테르 유래의 구성 단위를 포함한다.In one embodiment, the acrylic polymer includes a structural unit derived from a (meth) acrylic acid alkyl ester having a branched alkyl group.
일 실시 형태에 있어서는, 상기 분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르에 있어서의, 그 분지 알킬기의 탄소수가 6 내지 24이다.In one embodiment, the branched alkyl group of the (meth) acrylic acid alkyl ester having the branched alkyl group has 6 to 24 carbon atoms.
일 실시 형태에 있어서는, 상기 베이스 폴리머로서, 2종 이상의 베이스 폴리머가 사용된다.In one embodiment, two or more base polymers are used as the base polymer.
일 실시 형태에 있어서는, 상기 점착제층의 산가가, 45mgKOH/g 내지 250mgKOH/g이다.In one embodiment, the acid value of the pressure-sensitive adhesive layer is 45 mgKOH / g to 250 mgKOH / g.
일 실시 형태에 있어서는, 본 발명의 점착 테이프는, 알루미늄판에 접착한 후, 260℃에서 1시간, 가열 처리를 했을 때의 수축률이 5％ 이하이다.In one embodiment, the adhesive tape of the present invention has a shrinkage ratio of 5% or less when heat-treated at 260 占 폚 for 1 hour after adhering to an aluminum plate.
일 실시 형태에 있어서는, 본 발명의 점착 테이프는, 알루미늄판에 접착하고, 260℃에서 1시간, 가열 처리를 한 후의 그 알루미늄판에 대한 보유 지지력이 20mm 이하이다.In one embodiment, the adhesive tape of the present invention is bonded to an aluminum plate and has a holding force of 20 mm or less with respect to the aluminum plate after heat treatment at 260 占 폚 for 1 hour.
일 실시 형태에 있어서는, 상기 기재가 내열성 기재이다.In one embodiment, the substrate is a heat-resistant substrate.
일 실시 형태에 있어서는, 본 발명의 점착 테이프는, 전기 화학 디바이스의 고정에 사용된다.In one embodiment, the adhesive tape of the present invention is used for fixing an electrochemical device.
일 실시 형태에 있어서는, 본 발명의 점착 테이프는, 콘덴서 소자의 권회 고정에 사용된다.In one embodiment, the adhesive tape of the present invention is used for winding the capacitor element.
본 발명에 따르면, 특정한 산가를 갖는 폴리머를 점착제층의 베이스 폴리머로서 사용함으로써, 고온 하에 있어서도 변형되기 어려운 점착제층을 구비하는 점착 테이프를 얻을 수 있다. 본 발명의 점착 테이프를, 콘덴서 소자의 권회 고정에 사용하면, 그 콘덴서 소자의 권취 이완, 권취 어긋남 등을 방지할 수 있다.INDUSTRIAL APPLICABILITY According to the present invention, by using a polymer having a specific acid value as a base polymer of a pressure-sensitive adhesive layer, it is possible to obtain an pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer which is not easily deformed even under high temperature. When the adhesive tape of the present invention is used for winding and fixing the capacitor element, it is possible to prevent the winding of the capacitor element from loosening, winding displacement, and the like.
도 1은 본 발명의 일 실시 형태에 의한 점착 테이프의 개략 단면도이다.1 is a schematic cross-sectional view of an adhesive tape according to an embodiment of the present invention.
A. A. 점착 테이프의Of adhesive tape 전체 구성 Overall configuration
도 1은, 본 발명의 일 실시 형태에 의한 점착 테이프의 개략 단면도이다. 점착 테이프(100)는, 기재(10)와 점착제층(20)을 구비한다. 점착제층(20)은, 기재(10)의 편면에 배치되어 있어도 되고, 양면에 배치되어 있어도 된다. 예를 들어, 점착 테이프(100)가, 전기 화학 디바이스의 고정용(예를 들어, 콘덴서 소자의 권회 고정용)으로 사용되는 경우, 도시된 예와 같이, 점착제층(20)은 기재(10)의 편면에 배치된다. 도시하고 있지는 않지만, 본 발명의 점착 테이프는, 사용에 제공할 때까지의 동안, 점착면을 보호할 목적으로, 점착제층의 외측에 박리 라이너가 설치되어 있어도 된다.1 is a schematic cross-sectional view of an adhesive tape according to an embodiment of the present invention. The adhesive tape (100) comprises a substrate (10) and a pressure - sensitive adhesive layer (20). The pressure-sensitive
본 발명의 점착 테이프를 폴리에틸렌테레프탈레이트(PET) 필름에 접착한 때에 23℃에서의 점착력은, 바람직하게는 0.5N/20mm 이상이며, 보다 바람직하게는 2N/20mm 내지 10N/20mm이며, 더욱 바람직하게는 4N/20mm 내지 8N/20mm이다. 이러한 범위라면, 전기 화학 디바이스의 고정용으로 바람직한 점착 테이프로 할 수 있다. 본 명세서에 있어서 점착력이란, JIS Z 0237:2000에 준한 방법에 의해 측정한 점착력이며, 2kg의 롤러를 1 왕복시켜 점착 테이프를 PET 필름에 접착하고, 23℃ 하에서 30분간 방치한 후, 박리 각도 180°, 박리 속도(인장 속도) 300mm/min의 조건에서, 점착 테이프를 떼서 측정된다.When the pressure-sensitive adhesive tape of the present invention is adhered to a polyethylene terephthalate (PET) film, the adhesive strength at 23 캜 is preferably 0.5 N / 20 mm or more, more preferably 2 N / 20 mm to 10 N / 20 mm, 20 mm to 8 N / 20 mm. In such a range, it is possible to make a preferable adhesive tape for fixing an electrochemical device. In the present specification, the adhesive force refers to the adhesive force measured by the method according to JIS Z 0237: 2000, and the adhesive tape is bonded to the PET film by reciprocating one roller of 2 kg for one hour. After leaving for 30 minutes at 23 캜, Deg.] And a peeling speed (tensile speed) of 300 mm / min.
본 발명의 점착 테이프를 알루미늄판에 접착한 후, 260℃에서 1시간, 가열 처리를 했을 때, 그 점착 테이프의 수축률은, 바람직하게는 5％ 이하이고, 보다 바람직하게는 3％ 이하이고, 더욱 바람직하게는 1％ 이하이다. 이러한 범위라면, 점착 테이프를 콘덴서 소자의 권회 고정에 사용한 때에, 그 콘덴서 소자의 권취 이완, 권취 어긋남 등을 방지하는 효과가 현저해진다. 상기 수축률은, 알루미늄판(표면 조도 Ra: 0.2㎛)에 점착 테이프(30mm×30mm)를 2kg 롤러를 5mm/초의 속도로 1 왕복시키는 압착 조건에서 접착하고, 그 후, 260℃ 하에서 1시간, 가열 처리했을 때의 가열 전후의 면적 변화로부터, 하기 식에 의해 산출된다.When the adhesive tape of the present invention is adhered to an aluminum plate and then heat-treated at 260 DEG C for one hour, the shrinkage percentage of the adhesive tape is preferably 5% or less, more preferably 3% or less Preferably 1% or less. In such a range, when the adhesive tape is used for winding and fixing the capacitor element, the effect of preventing the winding of the capacitor element from being relaxed and the winding displacement is remarkable. The shrinkage percentage was measured by adhering an adhesive tape (30 mm x 30 mm) to an aluminum plate (surface roughness Ra: 0.2 m) under pressure bonding conditions in which a 2 kg roller was reciprocated one time at a speed of 5 mm / sec, From the change in area before and after heating when treated.
수축률(％)=(1-가열 후의 면적/가열 전의 면적)×100Shrinkage percentage (%) = (1 - area after heating / area before heating) x 100
본 발명의 점착 테이프를 알루미늄판에 접착하고, 260℃에서 1시간, 가열 처리한 후의, 그 알루미늄판에 대한 점착 테이프의 보유 지지력은, 바람직하게는 20mm 이하이고, 보다 바람직하게는 10mm 이하이고, 더욱 바람직하게는 5mm 이하이다. 이러한 범위라면, 점착 테이프를 콘덴서 소자의 권회 고정에 사용한 때에, 그 콘덴서 소자의 권취 이완, 권취 어긋남 등을 방지하는 효과가 현저해진다. 상기 보유 지지력은, 이하와 같이 측정할 수 있다. (i) 알루미늄판(표면 조도 Ra: 0.2㎛)에 점착 테이프를, 2kg 롤러를 5mm/초의 속도로 1 왕복시키는 압착 조건에서 접착하여 평가용 시료(접착 면적: 폭 10mm×길이 20mm)를 제작하고, (ii) 점착 테이프의 길이 방향이 상하 방향이 되도록 평가용 시료를 세우고, 점착 테이프의 하단부에 하중 100g의 추를 매달고, (iii) 260℃에서 1시간의 가열 처리를 행하고, (iv) 가열 처리 후의 점착 테이프의 어긋남의 길이를 측정하고, 그 어긋남의 길이를 보유 지지력으로 한다.The holding strength of the adhesive tape to the aluminum plate after the adhesive tape of the present invention is adhered to the aluminum plate and heated at 260 DEG C for 1 hour is preferably 20 mm or less, more preferably 10 mm or less, More preferably 5 mm or less. In such a range, when the adhesive tape is used for winding and fixing the capacitor element, the effect of preventing the winding of the capacitor element from being relaxed and the winding displacement is remarkable. The holding force can be measured as follows. (i) Adhesive tape was bonded to an aluminum plate (surface roughness Ra: 0.2 占 퐉), and a 2 kg roller was bonded to the aluminum plate at a speed of 5 mm / sec for one round to make an evaluation sample (adhesive area:
상기 점착 테이프의 두께는, 바람직하게는 7㎛ 내지 100㎛이며, 보다 바람직하게는 10㎛ 내지 100㎛이며, 더욱 바람직하게는 20㎛ 내지 50㎛이다.The thickness of the adhesive tape is preferably 7 탆 to 100 탆, more preferably 10 탆 to 100 탆, and still more preferably 20 탆 to 50 탆.
상기 점착제층의 두께는, 바람직하게는 2㎛ 내지 100㎛이며, 보다 바람직하게는 5㎛ 내지 50㎛이며, 더욱 바람직하게는 10㎛ 내지 40㎛이다.The thickness of the pressure-sensitive adhesive layer is preferably 2 占 퐉 to 100 占 퐉, more preferably 5 占 퐉 to 50 占 퐉, and still more preferably 10 占 퐉 to 40 占 퐉.
상기 기재의 두께는, 바람직하게는 5㎛ 내지 100㎛이며, 보다 바람직하게는 10㎛ 내지 50㎛이다.The thickness of the substrate is preferably 5 to 100 탆, and more preferably 10 to 50 탆.
B. B. 점착제층The pressure-
상기 점착제층은, 베이스 폴리머를 포함한다. 베이스 폴리머의 산가는, 45mgKOH/g 내지 150mgKOH/g이다.The pressure-sensitive adhesive layer includes a base polymer. The acid value of the base polymer is from 45 mgKOH / g to 150 mgKOH / g.
종래의 점착 테이프에 있어서는, 고온 하에 있어서의 기재 또는 피착체의 수축 또는 팽창에 의해 점착제층이 변형되고, 그 변형에 기인하여 기재와 점착제층이 어긋나거나, 피착체와 점착 테이프 자체가 어긋나거나 하는 경우가 있다. 이러한 종래의 점착 테이프를 콘덴서 소자의 권회 고정에 사용하면, 고온 하(예를 들어, 리플로우 공정)에 있어서, 그 콘덴서 소자의 권취 이완, 권취 어긋남 등이 발생하여, 콘덴서 소자의 용량 저하가 발생한다. 한편, 본 발명의 점착 테이프에 있어서는, 점착제층에 함유시키는 베이스 폴리머의 산가를 45mgKOH/g 이상으로 함으로써, 고온 하에 있어서의 점착제층의 응집력이 높아져서, 점착제층의 변형이 방지된다. 이러한 점착 테이프를 콘덴서 소자의 권회 고정에 사용하면, 고온 하(예를 들어, 리플로우 공정)에 있어서도, 그 콘덴서 소자의 권취 이완, 권취 어긋남 등이 방지된다.In the conventional adhesive tape, the pressure-sensitive adhesive layer is deformed due to shrinkage or expansion of the substrate or the adherend under a high temperature, the substrate and the pressure-sensitive adhesive layer are displaced due to the deformation, or the adherend and the pressure- There is a case. If such a conventional adhesive tape is used for winding and fixing the capacitor element, the winding of the capacitor element is relaxed and the winding displacement occurs at a high temperature (for example, a reflow step), and the capacity of the capacitor element is lowered do. On the other hand, in the pressure-sensitive adhesive tape of the present invention, when the acid value of the base polymer contained in the pressure-sensitive adhesive layer is 45 mgKOH / g or more, the cohesive force of the pressure-sensitive adhesive layer at high temperature is increased, and deformation of the pressure-sensitive adhesive layer is prevented. If such a pressure-sensitive adhesive tape is used for winding and fixing the capacitor element, the winding of the capacitor element can be prevented from being unwound, the winding displacement, and the like even at a high temperature (for example, a reflow step).
상기 베이스 폴리머의 산가는, 바람직하게는 45mgKOH/g 내지 100mgKOH/g이며, 보다 바람직하게는 45mgKOH/g 내지 75mgKOH/g이다. 베이스 폴리머의 산가가 45mgKOH/g 내지 150mgKOH/g라면, 상기와 같이 고온 하에서의 변형이 작고, 또한, 적당한 경도의 점착제층을 형성할 수 있다. 이러한 점착제층을 구비하는 점착 테이프는, 상기한 바와 같이 콘덴서 소자의 권취 이완 방지에 유효하고, 또한, 부착 성이 우수하다. 또한, 베이스 폴리머의 산가를 150mgKOH/g 이하로 함으로써, 콘덴서 소자 등의 전자 부품에 적용한 경우, 점착제층과 기재의 계면에 전해액이 침입하는 것을 방지할 수 있다. 산가의 측정 방법은 후술한다.The acid value of the base polymer is preferably 45 mgKOH / g to 100 mgKOH / g, and more preferably 45 mgKOH / g to 75 mgKOH / g. If the acid value of the base polymer is from 45 mgKOH / g to 150 mgKOH / g, the pressure-sensitive adhesive layer with less strain at high temperatures and having a suitable hardness can be formed as described above. The pressure-sensitive adhesive tape having such a pressure-sensitive adhesive layer is effective for preventing winding-up relaxation of the capacitor element as described above, and is also excellent in adhesion. When the acid value of the base polymer is 150 mgKOH / g or less, it is possible to prevent the electrolytic solution from intruding into the interface between the pressure-sensitive adhesive layer and the base material when it is applied to an electronic component such as a capacitor element. The acid value measurement method will be described later.
상기 점착제층의 산가는, 베이스 폴리머의 산가, 및 첨가제(예를 들어, 점착 부여제)의 종류, 양 등에 따라 변화한다. 「베이스 폴리머의 산가」와 「점착제층의 산가」는 상이한 개념인 것에 유의하기 바란다. 점착 부여제를 첨가하여, 점착제층의 산가를 높게 해도, 고온 하에서의 점착제층의 변형을 억제하는 효과는 불충분하다. 고온 하에서의 점착제층의 변형을 억제한다는 관점에서, 「베이스 폴리머의 산가」를 상기 범위로 함으로써, 콘덴서 소자의 권취 이완 방지에 유효한 점착 테이프를 얻은 것이, 본 발명의 성과의 하나이다. 또한, 점착제층의 산가는, 점착 테이프의 부착성에 영향을 미친다. 점착제층의 산가는, 바람직하게는 45mgKOH/g 내지 250mgKOH/g이며, 보다 바람직하게는 45mgKOH/g 내지 200mgKOH/g이다. 이러한 범위라면, 베이스 폴리머의 산가를 특정하는 효과와 더불어, 콘덴서 소자의 권취 이완 방지 효과와 부착성이 고도로 양립한 점착 테이프를 얻을 수 있다.The acid value of the pressure-sensitive adhesive layer varies depending on the acid value of the base polymer and the kind, quantity and the like of the additive (for example, tackifier). Note that the "acid value of the base polymer" and the "acid value of the pressure-sensitive adhesive layer" are different concepts. Even when the tackifier is added to increase the acid value of the pressure-sensitive adhesive layer, the effect of suppressing the deformation of the pressure-sensitive adhesive layer at a high temperature is insufficient. From the viewpoint of suppressing the deformation of the pressure-sensitive adhesive layer under high temperature, it is one of the achievements of the present invention that the pressure-sensitive adhesive tape effective for preventing winding relaxation of the capacitor element is obtained by setting the "acid value of the base polymer" within the above range. Further, the acid value of the pressure-sensitive adhesive layer affects the adhesion of the pressure-sensitive adhesive tape. The acid value of the pressure-sensitive adhesive layer is preferably 45 mgKOH / g to 250 mgKOH / g, and more preferably 45 mgKOH / g to 200 mgKOH / g. In such a range, it is possible to obtain a pressure-sensitive adhesive tape having both an effect of specifying the acid value of the base polymer and an effect of preventing winding-up relaxation of the capacitor element and a highly adhesive property.
상기 점착제층에 25℃에서의 나노인덴테이션법에 의한 탄성률은, 바람직하게는 0.02MPa 내지 20MPa이며, 보다 바람직하게는 0.05MPa 내지 10MPa이며, 더욱 바람직하게는 0.1MPa 내지 3MPa이다. 나노인덴테이션법에 의한 탄성률이란, 압자를 시료(점착면)에 압입했을 때의, 압자에 대한 부하 하중과 압입 깊이를 부하 시, 제하 시에 걸쳐 연속적으로 측정하고, 얻어진 부하 하중-압입 깊이 곡선으로부터 구해지는 탄성률을 말한다. 본 명세서에 있어서, 나노인덴테이션법에 의한 탄성률이란, 측정 조건을 하중: 1mN, 부하·제하 속도: 0.1mN/s, 유지 시간: 1s로 하여 상기와 같이 측정한 탄성률을 말한다.The pressure-sensitive adhesive layer has a modulus of elasticity of preferably from 0.02 MPa to 20 MPa, more preferably from 0.05 MPa to 10 MPa, and still more preferably from 0.1 MPa to 3 MPa by the nanoindentation method at 25 캜. The elastic modulus according to the nanoindentation method is a method in which the load applied to the indenter and the indentation depth when the indenter is press-fitted into the sample (adhesive surface) are continuously measured at the time of unloading under load, and the obtained load- Refers to the elastic modulus obtained from a curve. In the present specification, the elastic modulus according to the nanoindentation method refers to a modulus of elasticity measured under the conditions of a load of 1 mN, a load / unload rate of 0.1 mN / s, and a holding time of 1 s.
상기 베이스 폴리머로서는, 아크릴계 폴리머가 바람직하게 사용된다. 아크릴계 폴리머로서는, 예를 들어, 1종 또는 2종 이상의 (메트)아크릴산알킬에스테르 유래의 구성 단위를 포함하는 아크릴계 폴리머를 들 수 있다. 바람직하게는, (메트)아크릴산알킬에스테르를 주 모노머로 하고, 그 주 모노머와 산 관능기를 갖는 모노머로 구성되는 아크릴계 폴리머가 사용된다.As the base polymer, an acrylic polymer is preferably used. Examples of the acrylic polymer include an acrylic polymer containing a structural unit derived from one or more (meth) acrylic acid alkyl esters. Preferably, an acrylic polymer comprising a (meth) acrylic acid alkyl ester as a main monomer and a monomer having an acid functional group and a main monomer is used.
상기 (메트)아크릴산알킬에스테르 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여 바람직하게는 50중량부 내지 97중량부이며, 보다 바람직하게는 70중량부 내지 94중량부이다.The content of the constituent unit derived from the (meth) acrylic acid alkyl ester is preferably 50 parts by weight to 97 parts by weight, more preferably 70 parts by weight to 94 parts by weight, based on 100 parts by weight of the base polymer.
바람직하게는, 상기 (메트)아크릴산알킬에스테르는, 탄소수가 1 내지 24(보다 바람직하게는 3 내지 20, 더욱 바람직하게는 6 내지 18)인 직쇄상 또는 분지상의 알킬기를 갖는다.Preferably, the (meth) acrylic acid alkyl ester has a straight chain or branched alkyl group having 1 to 24 carbon atoms, more preferably 3 to 20, and still more preferably 6 to 18 carbon atoms.
상기 (메트)아크릴산알킬에스테르로서는, 예를 들어, (메트)아크릴산메틸, (메트)아크릴산에틸, (메트)아크릴산프로필, (메트)아크릴산부틸, (메트)아크릴산펜틸, (메트)아크릴산헥실, (메트)아크릴산헵틸, (메트)아크릴산옥틸, (메트)아크릴산노닐, (메트)아크릴산데실, (메트)아크릴산에이코실 등을 들 수 있다.Examples of the alkyl (meth) acrylate ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, Octyl (meth) acrylate, octyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate and eicosyl (meth) acrylate.
일 실시 형태에 있어서는, 상기 (메트)아크릴산알킬에스테르로서, 분지상의 알킬기를 갖는 (메트)아크릴산알킬에스테르가 사용된다. 분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르를 사용하면, 전해액이 배어들기 어려운 점착 테이프를 얻을 수 있다. 상기 분지상 알킬기의 탄소수는, 바람직하게는 6 내지 24이며, 보다 바람직하게는 6 내지 18이며, 더욱 바람직하게는 6 내지 12이다. 직쇄상 알킬기를 갖는 (메트)아크릴산알킬에스테르와, 분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르를 병용해도 된다. 또한, (메트)아크릴산알킬에스테르로서, 분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르를 단독으로 사용해도 된다.In one embodiment, as the (meth) acrylic acid alkyl ester, a (meth) acrylic acid alkyl ester having a branched alkyl group is used. When a (meth) acrylic acid alkyl ester having a branched alkyl group is used, it is possible to obtain a pressure-sensitive adhesive tape in which the electrolyte is hardly infiltrated. The number of carbon atoms in the branched alkyl group is preferably 6 to 24, more preferably 6 to 18, and still more preferably 6 to 12. (Meth) acrylic acid alkyl ester having a linear alkyl group and a (meth) acrylic acid alkyl ester having a branched alkyl group may be used in combination. As the (meth) acrylic acid alkyl ester, a (meth) acrylic acid alkyl ester having a branched alkyl group may be used alone.
일 실시 형태에 있어서는, 상기 베이스 폴리머에 있어서, 분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르 유래의 구성 단위의 함유 비율은, (메트)아크릴산알킬에스테르 유래의 구성 단위 100중량부(즉, 직쇄상 알킬기를 갖는 (메트)아크릴산알킬에스테르와, 분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르의 합계량 100중량부)에 대하여 50중량부 내지 100중량부이다.In one embodiment, the content of the constituent unit derived from the (meth) acrylic acid alkyl ester having a branched alkyl group in the base polymer is 100 parts by weight of the constituent unit derived from the alkyl (meth) acrylate (that is, (Meth) acrylic acid alkyl ester having an alkyl group and a (meth) acrylic acid alkyl ester having a branched alkyl group in an amount of 50 parts by weight to 100 parts by weight.
분지상 알킬기를 갖는 (메트)아크릴산알킬에스테르로서는, 예를 들어, (메트)아크릴산이소부틸, (메트)아크릴산s-부틸, (메트)아크릴산t-부틸, (메트)아크릴산2-에틸헥실, (메트)아크릴산이소옥틸, (메트)아크릴산이소노닐, (메트)아크릴산이소데실, (메트)아크릴산2-에틸부틸, (메트)아크릴산2-메틸부틸 등을 들 수 있다. 그 중에서도 바람직하게는, (메트)아크릴산2-에틸헥실, (메트)아크릴산이소옥틸, (메트)아크릴산이소노닐 또는 (메트)아크릴산이소데실이며, 보다 바람직하게는 (메트)아크릴산2-에틸헥실이다. (메트)아크릴산2-에틸헥실은, 단독 중합체의 유리 전이 온도가 낮다. 이러한 아크릴산2-에틸헥실을 사용하면, 유연성이 우수한 아크릴계 폴리머가 얻어진다. 그 결과, 피착체와의 밀착성이 우수한 점착제층이 형성되어, 전해액이 배어들기 어려운 점착 테이프를 얻을 수 있다.Examples of the (meth) acrylic acid alkyl ester having a branched alkyl group include isobutyl (meth) acrylate, s-butyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl Isobutyl (meth) acrylate, isooctyl (meth) acrylate, isonyl (meth) acrylate, isodecyl (meth) acrylate, 2-ethylbutyl (meth) acrylate and 2-methylbutyl (meth) acrylate. Among them, preferred is 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate or isodecyl (meth) acrylate, more preferably is 2-ethylhexyl to be. 2-ethylhexyl (meth) acrylate has a low glass transition temperature of the homopolymer. When such 2-ethylhexyl acrylate is used, an acrylic polymer having excellent flexibility can be obtained. As a result, a pressure-sensitive adhesive layer having excellent adhesiveness to an adherend is formed, and an adhesive tape which is hardly infiltrated with an electrolyte can be obtained.
상기 산 관능기를 갖는 모노머로서는, 예를 들어, 카르복실기 함유 모노머, 산 무수물기 함유 모노머, 인산기 함유 모노머, 술폰산기 함유 모노머 등을 들 수 있다. 상기 베이스 폴리머의 산가는, 산 관능기의 함유 비율을 조정함으로써 제어할 수 있다.Examples of the monomer having an acid functional group include a carboxyl group-containing monomer, an acid anhydride group-containing monomer, a phosphoric acid group-containing monomer, and a sulfonic acid group-containing monomer. The acid value of the base polymer can be controlled by adjusting the content ratio of the acid functional group.
상기 카르복실기 함유 모노머로서는, 예를 들어, (메트)아크릴산, 카르복시에틸아크릴레이트, 카르복시펜틸아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산 등을 들 수 있다. 그 중에서도 바람직하게는 아크릴산이다. 아크릴산은 카르복실기 함유 모노머 중에서는 Tg가 낮다. 따라서 산가를 높게 하기 위하여 아크릴산의 함유량을 증가시켜도, 다른 카르복실기 함유 모노머보다도 Tg가 높아지지 않아, 피착체와의 밀착성이라고 하는 관점에서 유리해진다.Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid and crotonic acid. Among them, acrylic acid is preferable. Acrylic acid has a low Tg among the carboxyl group-containing monomers. Therefore, even if the content of acrylic acid is increased to increase the acid value, the Tg is not higher than that of the other carboxyl group-containing monomers, which is advantageous from the viewpoint of adhesion with an adherend.
상기 산 무수물기 함유 모노머로서는, 예를 들어, 무수 말레산, 무수 이타콘산, 및 상기 카르복실기 함유 모노머의 무수물체 등을 들 수 있다.Examples of the acid anhydride group-containing monomer include maleic anhydride, itaconic anhydride, and anhydride of the carboxyl group-containing monomer.
상기 인산기 함유 모노머로서는, 예를 들어, 2-히드록시에틸아크릴로일포스페이트 등을 들 수 있다.Examples of the phosphate group-containing monomer include 2-hydroxyethyl acryloyl phosphate and the like.
상기 술폰산기 함유 모노머로서는, 예를 들어, 스티렌술폰산, 알릴술폰산, 2-(메트)아크릴아미드-2-메틸프로판술폰산, (메트)아크릴아미도프로판술폰산, 술포프로필(메트)아크릴레이트, (메트)아크릴로일옥시나프탈렌술폰산 등을 들 수 있다.Examples of the sulfonic acid group-containing monomer include styrene sulfonic acid, allylsulfonic acid, 2- (meth) acrylamide-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) ) Acryloyloxynaphthalenesulfonic acid, and the like.
상기 산 관능기를 갖는 모노머 유래의 구성 단위의 함유 비율은, 원하는 베이스 폴리머의 산가에 따라 조정된다. 일 실시 형태에 있어서는, 산 관능기를 갖는 모노머 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여 바람직하게는 3중량부 내지 30중량부이며, 보다 바람직하게는 6중량부 내지 25중량부이며, 더욱 바람직하게는 18중량부 내지 25중량부이다. 이러한 범위라면, 콘덴서 소자의 권취 이완, 권취 어긋남 등을 유효하게 방지할 수 있는 점착 테이프를 얻을 수 있다. 또한, 2종 이상의 베이스 폴리머를 사용하는 경우, 상기 「산 관능기를 갖는 모노머 유래의 구성 단위의 함유 비율」은, 2종 이상의 베이스 폴리머에 포함되는 산 관능기를 갖는 모노머 유래의 구성 단위의 합계의 함유 비율이며, 베이스 폴리머의 합계량 100중량부를 기준으로 한다.The content ratio of the structural unit derived from a monomer having an acid functional group is adjusted according to the acid value of the desired base polymer. In one embodiment, the content ratio of the monomer-derived constituent unit having an acid functional group is preferably 3 parts by weight to 30 parts by weight, more preferably 6 parts by weight to 25 parts by weight, per 100 parts by weight of the base polymer More preferably 18 parts by weight to 25 parts by weight. With such a range, it is possible to obtain a pressure-sensitive adhesive tape which can effectively prevent winding-up relaxation and winding displacement of the capacitor element. When two or more kinds of base polymers are used, the "content ratio of monomer units derived from monomers having an acid functional group" is preferably such that the total content of constituent units derived from monomers having an acid functional group contained in two or more base polymers , Based on 100 parts by weight of the total amount of the base polymer.
일 실시 형태에 있어서는, 주 모노머로서 아크릴산2-에틸헥실을 사용하고, 산 관능기를 갖는 모노머로서 아크릴산을 사용한다. 이 실시 형태에 있어서, 아크릴산 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여 바람직하게는 3중량부 내지 30중량부이며, 보다 바람직하게는 6.5중량부 내지 25중량부이며, 더욱 바람직하게는 18중량부 내지 23중량부이다.In one embodiment, 2-ethylhexyl acrylate is used as a main monomer, and acrylic acid is used as a monomer having an acid functional group. In this embodiment, the content ratio of the acrylic acid-derived constituent unit is preferably 3 parts by weight to 30 parts by weight, more preferably 6.5 parts by weight to 25 parts by weight, per 100 parts by weight of the base polymer, 18 to 23 parts by weight.
상기 베이스 폴리머(아크릴계 폴리머)는 응집력, 내열성, 가교성 등의 개질을 목적으로 하여, 필요에 따라, 상기 (메트)아크릴산알킬에스테르 및 산 관능기를 갖는 모노머와 공중합 가능한 다른 모노머 유래의 구성 단위를 포함하고 있어도 된다. 이러한 다른 모노머로서, 예를 들어, (메트)아크릴산히드록시에틸, (메트)아크릴산히드록시프로필, (메트)아크릴산히드록시부틸, (메트)아크릴산히드록시헥실, (메트)아크릴산히드록시옥틸, (메트)아크릴산히드록시데실, (메트)아크릴산히드록시라우릴, (4-히드록시메틸시클로헥실)메틸메타크릴레이트 등의 히드록실기 함유 모노머; (메트)아크릴아미드, N,N-디메틸(메트)아크릴아미드, N-부틸(메트)아크릴아미드, N-메틸올(메트)아크릴아미드, N-메틸올프로판(메트)아크릴아미드 등의 (N-치환)아미드계 모노머; (메트)아크릴산아미노에틸, (메트)아크릴산N,N-디메틸아미노에틸, (메트)아크릴산t-부틸아미노에틸 등의 (메트)아크릴산아미노알킬계 모노머; (메트)아크릴산메톡시에틸, (메트)아크릴산에톡시에틸 등의 (메트)아크릴산알콕시알킬계 모노머; N-시클로헥실말레이미드, N-이소프로필말레이미드, N-라우릴말레이미드, N-페닐말레이미드 등의 말레이미드계 모노머; N-메틸이타콘이미드, N-에틸이타콘이미드, N-부틸이타콘이미드, N-옥틸이타콘이미드, N-2-에틸헥실이타콘이미드, N-시클로헥실이타콘이미드, N-라우릴이타콘이미드 등의 이타콘이미드계 모노머; N-(메트)아크릴로일옥시메틸렌숙신이미드, N-(메트)아크릴로일-6-옥시헥사메틸렌숙신이미드, N-(메트)아크릴로일-8-옥시옥타메틸렌숙신이미드 등의 숙신이미드계 모노머; 아세트산비닐, 프로피온산비닐, N-비닐피롤리돈, 메틸비닐피롤리돈, 비닐피리딘, 비닐피페리돈, 비닐피리미딘, 비닐피페라진, 비닐피라진, 비닐피롤, 비닐이미다졸, 비닐옥사졸, 비닐모르폴린, N-비닐카르복실산아미드류, 스티렌, α-메틸스티렌, N-비닐카프로락탐 등의 비닐계 모노머; 아크릴로니트릴, 메타크릴로니트릴 등의 시아노아크릴레이트 모노머; (메트)아크릴산글리시딜 등의 에폭시기 함유 아크릴계 모노머; (메트)아크릴산폴리에틸렌글리콜, (메트)아크릴산폴리프로필렌글리콜, (메트)아크릴산메톡시에틸렌글리콜, (메트)아크릴산메톡시폴리프로필렌글리콜 등의 글리콜계 아크릴에스테르 모노머; (메트)아크릴산테트라하이드로푸르푸릴, 불소(메트)아크릴레이트, 실리콘(메트)아크릴레이트 등의 복소환, 할로겐 원자, 규소 원자 등을 갖는 아크릴산에스테르계 모노머; 헥산디올디(메트)아크릴레이트, (폴리)에틸렌글리콜디(메트)아크릴레이트, (폴리)프로필렌글리콜디(메트)아크릴레이트, 네오펜틸글리콜디(메트)아크릴레이트, 펜타에리트리톨디(메트)아크릴레이트, 트리메틸올프로판트리(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 에폭시아크릴레이트, 폴리에스테르아크릴레이트, 우레탄아크릴레이트 등의 다관능 모노머; 이소프렌, 부타디엔, 이소부틸렌 등의 올레핀계 모노머; 비닐에테르 등의 비닐에테르계 모노머 등을 들 수 있다. 이 단량체 성분은, 단독으로, 또는 2종 이상 조합하여 사용해도 된다.The above base polymer (acrylic polymer) includes other monomer-derived constituent units copolymerizable with the above (meth) acrylic acid alkyl ester and monomers having an acid functional group, if necessary, for the purpose of modifying cohesive force, heat resistance, . Examples of such other monomers include (meth) acrylic acid hydroxyethyl, (meth) acrylate hydroxypropyl, (meth) acrylate hydroxybutyl, (meth) acrylate hydroxyhexyl, Hydroxyl group-containing monomers such as (meth) acrylic acid hydroxydecyl, (meth) acrylate hydroxylauryl and (4-hydroxymethylcyclohexyl) methyl methacrylate; (Meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol -Substituted) amide-based monomers; (Meth) acrylic acid aminoalkyl monomers such as aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate and t-butylaminoethyl (meth) acrylate; (Meth) acrylic acid alkoxyalkyl monomers such as methoxyethyl (meth) acrylate and ethoxyethyl (meth) acrylate; Maleimide-based monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide and N-phenylmaleimide; N-diisopropylethylenediamine, N-methylethylenediamine, N-methylethylenediamine, N-methylethylenediamine, N-methylethylenediamine, N-methylethylenediamine, Itaconimide-based monomers such as N-methylmaleimide, N-lauryl itaconimide and the like; (Meth) acryloyloxymethylenesuccinimide, N- (meth) acryloyl-6-oxyhexamethylenesuccinimide, N- (meth) acryloyl-8- Succinimide monomers; Vinyl pyrrolidone, vinyl pyrrolidone, vinyl pyridine, vinyl piperidone, vinyl pyrimidine, vinylpiperazine, vinyl pyrazine, vinyl pyrrole, vinyl imidazole, vinyl oxazole, vinyl Vinyl monomers such as morpholine, N-vinylcarboxylic acid amides, styrene,? -Methylstyrene, and N-vinylcaprolactam; Cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; An epoxy group-containing acrylic monomer such as glycidyl (meth) acrylate; Glycol type acrylic ester monomers such as (meth) acrylic acid polyethylene glycol, (meth) acrylic acid polypropylene glycol, (meth) acrylic acid methoxyethylene glycol and (meth) acrylic acid methoxypolypropylene glycol; Acrylic ester monomers having a heterocyclic ring such as (meth) acrylate tetrahydrofurfuryl, fluorine (meth) acrylate or silicone (meth) acrylate, halogen atoms, silicon atoms and the like; (Meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, (poly) ethylene glycol di (Meth) acrylate, trimethylol propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, and urethane acrylate Monomers; Olefin monomers such as isoprene, butadiene and isobutylene; And vinyl ether-based monomers such as vinyl ether. These monomer components may be used alone or in combination of two or more.
상기 다른 모노머 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여 바람직하게는 20중량부 이하이고, 보다 바람직하게는 15중량부 이하이고, 더욱 바람직하게는 1중량부 내지 10중량부이다.The content of the other monomer-derived constituent unit is preferably 20 parts by weight or less, more preferably 15 parts by weight or less, and even more preferably 1 part by weight to 10 parts by weight, based on 100 parts by weight of the base polymer .
상기 베이스 폴리머의 중량 평균 분자량은, 바람직하게는 30만 내지 200만이며, 보다 바람직하게는 50만 내지 150만이다. 중량 평균 분자량은, GPC(용매: THF)에 의해 측정될 수 있다.The weight average molecular weight of the base polymer is preferably from 300,000 to 2,000,000, and more preferably from 500,000 to 1,500,000. The weight average molecular weight can be measured by GPC (solvent: THF).
바람직하게는, 2종 이상의 베이스 폴리머가 사용되고, 보다 바람직하게는 2종의 베이스 폴리머가 사용된다. 2종 이상의 베이스 폴리머를 사용하면, 베이스 폴리머를 1종만 사용할 때의 문제(모노머 반응 속도의 차이 등으로 생산상의 제한이 발생하는 등)를 피하는 것이 가능하게 된다. 그로 인해, 콘덴서 소자의 권취 이완 방지 효과를 확보하면서, 다른 특성(예를 들어, 점착성, 유연성, 내용제성 등)을 제어하는 것이 용이하게 된다.Preferably, two or more base polymers are used, and more preferably two types of base polymers are used. When two or more kinds of base polymers are used, it becomes possible to avoid a problem in using only one type of base polymer (such as a limitation in production due to a difference in monomer reaction rate, etc.). As a result, it becomes easy to control other characteristics (for example, adhesiveness, flexibility, solvent resistance, etc.) while securing the effect of preventing winding-up relaxation of the capacitor element.
2종 이상의 베이스 폴리머(아크릴계 폴리머)를 사용하는 경우, 콘덴서 소자의 권취 이완 방지 효과 향상의 관점에서, 각각의 베이스 폴리머가 산 관능기를 갖는 모노머 유래의 구성 단위를 포함하는 것이 바람직하다. 산 관능기를 갖는 모노머로서는, 카르복실기 함유 모노머가 바람직하고, (메트)아크릴산이 더욱 바람직하다. 일 실시 형태에 있어서는, 제1 베이스 폴리머와 제2 베이스 폴리머가 사용되고, 제1 베이스 폴리머 중의 산 관능기를 갖는 모노머 유래의 구성 단위의 함유 비율이, 제1 베이스 폴리머 100중량부에 대하여 8중량부 이상(바람직하게는 8중량부 내지 15중량부)이며, 제2 베이스 폴리머 중의 산 관능기를 갖는 모노머 유래의 구성 단위의 함유 비율이, 제2 베이스 폴리머 100중량부에 대하여 7중량부 이하(바람직하게는 3중량부 내지 7중량부)이다.When two or more kinds of base polymer (acrylic polymer) are used, it is preferable that each base polymer includes a monomer-derived constituent unit having an acid functional group from the viewpoint of improving the effect of preventing winding-up relaxation of the capacitor element. As the monomer having an acid functional group, a carboxyl group-containing monomer is preferable, and (meth) acrylic acid is more preferable. In one embodiment, the first base polymer and the second base polymer are used, and the content ratio of the monomer-derived constituent unit having an acid functional group in the first base polymer is at least 8 parts by weight based on 100 parts by weight of the first base polymer (Preferably 8 to 15 parts by weight), and the content ratio of the monomer-derived constituent unit having an acid functional group in the second base polymer is 7 parts by weight or less based on 100 parts by weight of the second base polymer 3 parts by weight to 7 parts by weight).
상기 점착제층은, 필요에 따라 임의의 적절한 첨가제를 포함할 수 있다. 그 첨가제로서는, 예를 들어, 가교제, 점착 부여제, 가소제(예를 들어, 트리멜리트산에스테르계 가소제, 피로멜리트산에스테르계 가소제), 안료, 염료, 충전제, 노화 방지제, 도전재, 자외선 흡수제, 광 안정제, 박리 조정제, 연화제, 계면 활성제, 난연제, 산화 방지제, 용제 등을 들 수 있다.The pressure-sensitive adhesive layer may contain any suitable additives as needed. Examples of the additive include additives such as a crosslinking agent, a tackifier, a plasticizer (for example, a trimellitate ester plasticizer, a pyromellitate ester plasticizer), a pigment, a dye, a filler, an antioxidant, a conductive material, A light stabilizer, a release modifier, a softener, a surfactant, a flame retardant, an antioxidant, and a solvent.
상기 점착 부여제로서는, 임의의 적절한 점착 부여제가 사용된다. 점착 부여제로서는, 예를 들어, 점착 부여 수지가 사용된다. 점착 부여 수지의 구체예로서는, 로진계 점착 부여 수지(예를 들어, 미변성 로진, 변성 로진, 로진 페놀계 수지, 로진 에스테르계 수지 등), 테르펜계 점착 부여 수지(예를 들어, 테르펜계 수지, 테르펜페놀계 수지, 스티렌 변성 테르펜계 수지, 방향족 변성 테르펜계 수지, 수소 첨가 테르펜계 수지), 탄화수소계 점착 부여 수지(예를 들어, 지방족계 탄화수소 수지, 지방족계 환상 탄화수소 수지, 방향족계 탄화수소 수지(예를 들어, 스티렌계 수지, 크실렌계 수지 등), 지방족·방향족계 석유 수지, 지방족·지환족계 석유 수지, 수소 첨가 탄화수소 수지, 쿠마론계 수지, 쿠마론인덴계 수지 등), 페놀계 점착 부여 수지(예를 들어, 알킬페놀계 수지, 크실렌 포름알데히드계 수지, 레졸, 노볼락 등), 케톤계 점착 부여 수지, 폴리아미드계 점착 부여 수지, 에폭시계 점착 부여 수지, 엘라스토머계 점착 부여 수지 등을 들 수 있다.As the tackifier, any suitable tackifier is used. As the tackifier, for example, a tackifier resin is used. Specific examples of the tackifier resin include rosin-based tackifying resins (for example, unmodified rosin, modified rosin, rosin phenol-based resin, rosin ester-based resin and the like), terpene-based tackifying resins (for example, (For example, aliphatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, and aromatic hydrocarbon resins (for example, aliphatic hydrocarbon resin, aromatic hydrocarbon resin, or aromatic hydrocarbon resin), a terpene type phenolic resin, a terpene type phenolic resin, a styrene type modified terpene type resin, an aromatic modified terpene type resin, Aliphatic and alicyclic petroleum resins, aliphatic and alicyclic petroleum resins, hydrogenated hydrocarbon resins, coumarone resins, coumarone-indene resins and the like), phenolic tackifier resins (for example, styrene resins and xylene resins) For example, an alkylphenol resin, a xylene formaldehyde resin, a resole, a novolak, etc.), a ketone-based tackifying resin, a polyamide-based tackifying resin, an epoxy- Tackifying resins, and elastomer-based tackifying resins.
상기 가교제로서는, 예를 들어, 이소시아네이트계 가교제, 에폭시계 가교제, 멜라민계 가교제, 과산화물계 가교제 외에, 요소계 가교제, 금속 알콕시드계 가교제, 금속 킬레이트계 가교제, 금속염계 가교제, 카르보디이미드계 가교제, 옥사졸린계 가교제, 아지리딘계 가교제, 아민계 가교제 등을 들 수 있다. 그 중에서도 바람직하게는, 이소시아네이트계 가교제 또는 에폭시계 가교제이다.Examples of the crosslinking agent include crosslinking agents such as a urethane crosslinking agent, a metal alkoxide crosslinking agent, a metal chelating crosslinking agent, a metal salt crosslinking agent, a carbodiimide crosslinking agent, an oxazole crosslinking agent, a urea crosslinking agent, A zolin-based crosslinking agent, an aziridine-based crosslinking agent, and an amine-based crosslinking agent. Among them, an isocyanate crosslinking agent or an epoxy crosslinking agent is preferable.
상기 이소시아네이트계 가교제의 구체예로서는, 부틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트 등의 저급 지방족 폴리이소시아네이트류; 시클로펜틸렌디이소시아네이트, 시클로헥실렌디이소시아네이트, 이소포론디이소시아네이트 등의 지환족 이소시아네이트류; 2,4-톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트, 크실릴렌디이소시아네이트 등의 방향족 이소시아네이트류; 트리메틸올프로판/톨릴렌디이소시아네이트 삼량체 부가물(닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 L」), 트리메틸올프로판/헥사메틸렌디이소시아네이트 삼량체 부가물(닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트 HL」), 헥사메틸렌디이소시아네이트의 이소시아누레이트체(닛본 폴리우레탄 고교사 제조, 상품명 「코로네이트HX」) 등의 이소시아네이트 부가물; 등을 들 수 있다. 이소시아네이트계 가교제의 함유량은, 원하는 점착력에 따라, 임의의 적절한 양으로 설정될 수 있고, 베이스 폴리머 100중량부에 대하여 대표적으로는 0.1중량부 내지 20중량부이며, 보다 바람직하게는 0.5중량부 내지 10중량부이다.Specific examples of the isocyanate crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; Cycloaliphatic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; Aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate and xylylene diisocyanate; Trimethylolpropane / tolylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: Coronate L), trimethylolpropane / hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Nate HL "), an isocyanate adduct of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name" Coronate HX "); And the like. The content of the isocyanate-based crosslinking agent may be set to any suitable amount depending on the desired adhesive strength, and is typically 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, per 100 parts by weight of the base polymer Parts by weight.
상기 에폭시계 가교제로서는, 예를 들어, N,N,N',N'-테트라글리시딜-m-크실렌디아민, 디글리시딜아닐린, 1,3-비스(N,N-글리시딜아미노메틸)시클로헥산(미츠비시 가스 가가쿠사 제조, 상품명 「테트라드 C」), 1,6-헥산디올디글리시딜에테르(교에샤 가가쿠사 제조, 상품명 「에폴라이트 1600」), 네오펜틸글리콜디글리시딜에테르(교에샤 가가쿠사 제조, 상품명 「에폴라이트 1500NP」), 에틸렌글리콜디글리시딜에테르(교에샤 가가쿠사 제조, 상품명 「에폴라이트 40E」), 프로필렌글리콜디글리시딜에테르(교에샤 가가쿠사 제조, 상품명 「에폴라이트 70P」), 폴리에틸렌글리콜디글리시딜에테르(니혼 유시사 제조, 상품명 「에피올 E-400」), 폴리프로필렌글리콜디글리시딜에테르(니혼 유시사 제조, 상품명 「에피올 P-200」), 소르비톨폴리글리시딜에테르(나가세 켐텍스사 제조, 상품명 「데나콜 EX-611」), 글리세롤폴리글리시딜에테르(나가세 켐텍스사 제조, 상품명 「데나콜 EX-314」), 펜타에리트리톨폴리글리시딜에테르, 폴리글리세롤폴리글리시딜에테르(나가세 켐텍스사 제조, 상품명 「데나콜 EX-512」), 소르비탄폴리글리시딜에테르, 트리메틸올프로판폴리글리시딜에테르, 아디프산디글리시딜에스테르, o-프탈산디글리시딜에스테르, 트리글리시딜-트리스(2-히드록시에틸)이소시아누레이트, 레조르신디글리시딜에테르, 비스페놀-S-디글리시딜에테르, 분자 내에 에폭시기를 2개 이상 갖는 에폭시계 수지 등을 들 수 있다. 에폭시계 가교제의 함유량은, 원하는 점착력에 따라, 임의의 적절한 양으로 설정될 수 있고, 베이스 폴리머 100중량부에 대하여 대표적으로는 0.01중량부 내지 10중량부이며, 보다 바람직하게는 0.03중량부 내지 5중량부이다.Examples of the epoxy cross-linking agent include N, N, N ', N'-tetraglycidyl-m-xylenediamine, diglycidyl aniline, 1,3-bis (N, N-glycidylamino 1,6-hexanediol diglycidyl ether (trade name: Epolite 1600, manufactured by Kyowa Chemical Co., Ltd.), neopentyl glycol di (methacrylic acid) (Trade name " Epolite 1500NP "), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Gagaku Co., Ltd., trade name "Epolite 40E"), propylene glycol diglycidyl ether (Trade name: Epiolite 70P, manufactured by Kyowa Shagakuka), polyethylene glycol diglycidyl ether (Epiol E-400, manufactured by Nippon Oil Co., Ltd.), polypropylene glycol diglycidyl ether Epiol P-200 "), sorbitol polyglycidyl ether (manufactured by Nagase Chemtech Co., (Trade name, "Denacol EX-611", manufactured by Nagase ChemteX Corporation), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (Trade name " Denacol EX-512 ", manufactured by Nagase ChemteX Corporation), sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl (2-hydroxyethyl) isocyanurate, resorcin sodium glycidyl ether, bisphenol-S-diglycidyl ether, epoxy resin having two or more epoxy groups in the molecule, etc. . The content of the epoxy-based crosslinking agent may be set to any suitable amount depending on the desired adhesive force, and is typically 0.01 to 10 parts by weight, more preferably 0.03 to 5 parts by weight, per 100 parts by weight of the base polymer Parts by weight.
C. 기재C. substrate
상기 기재로서는, 예를 들어, 수지 필름, 크라프트지, 마닐라마지, 합성 섬유지 등을 들 수 있다. 수지 시트를 구성하는 수지로서는, 예를 들어, 폴리에틸렌테레프탈레이트(PET), 폴리페닐렌술피드(PPS), 폴리이미드(PI), 폴리에테르이미드(PEI), 폴리술폰(PSF), 폴리에테르에테르케톤(PEEK), 폴리아릴레이트(PAR) 등을 들 수 있다. 상기 수지 필름은, 연신 필름이어도 된다. 그 중에서도 바람직하게는, 폴리페닐렌술피드(PPS), 폴리이미드(PI) 또는 폴리에테르에테르케톤(PEEK)이다.Examples of the substrate include a resin film, kraft paper, manila marjor, synthetic island paper, and the like. Examples of the resin constituting the resin sheet include a resin such as polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyimide (PI), polyetherimide (PEI), polysulfone (PSF), polyetheretherketone (PEEK), polyarylate (PAR), and the like. The resin film may be a stretched film. Among them, polyphenylene sulfide (PPS), polyimide (PI) or polyether ether ketone (PEEK) are preferable.
바람직하게는, 상기 기재로서, 내열성 기재가 사용된다. 또한, 내열성 기재란, 유리 전이 온도가 70℃ 이상인 재료로 구성된 기재를 의미한다. 내열성 기재를 구성하는 재료의 유리 전이 온도는, 바람직하게는 80℃ 이상이며, 보다 바람직하게는 90℃ 이상이다. 내열성 기재를 사용하면, 고온 하에서의 수축이 억제되어서, 콘덴서 소자의 권취 이완 방지 효과에 우수한 점착 테이프를 얻을 수 있다. 내열성 기재의 구체예로서는, 예를 들어, 폴리페닐렌술피드(PPS), 폴리이미드(PI) 또는 폴리에테르에테르케톤(PEEK)로 구성되는 수지 필름을 들 수 있다. 또한, 「유리 전이 온도」란, DMA법(인장법)에 있어서, 승온 속도 5℃/min, 샘플 폭 5mm, 척간 거리 20mm, 주파수 10Hz의 조건에 있어서 확인되는 손실 정접(tanδ)의 피크를 나타내는 온도를 의미한다.Preferably, a heat-resistant substrate is used as the substrate. The term "heat resistant base member" means a base composed of a material having a glass transition temperature of 70 ° C or higher. The glass transition temperature of the material constituting the heat resistant substrate is preferably 80 占 폚 or higher, and more preferably 90 占 폚 or higher. When a heat-resistant base material is used, the shrinkage under high temperature is suppressed, and an adhesive tape excellent in the effect of preventing winding-up relaxation of the capacitor element can be obtained. Specific examples of the heat-resistant base material include a resin film composed of, for example, polyphenylene sulfide (PPS), polyimide (PI), or polyetheretherketone (PEEK). The term "glass transition temperature" means a peak of loss tangent (tan?) Confirmed under the conditions of a temperature raising rate of 5 占 폚 / min, a sample width of 5 mm, a chuck distance of 20 mm and a frequency of 10 Hz in the DMA method (tensile method) Lt; / RTI >
본 발명의 점착 테이프는, 임의의 적절한 방법에 의해 제조될 수 있다. 예를 들어, 상기 기재에, 상기 베이스 폴리머와, 필요에 따라 첨가되는 첨가제를 포함하는 조성물을 도포하고, 그 후, 건조하여 형성할 수 있다. 또한, 별도의 지지체에 점착제층을 형성한 후, 그 점착제층을 기재에 전사해도 된다.The adhesive tape of the present invention can be produced by any suitable method. For example, a composition containing the base polymer and an additive to be added as required may be applied to the substrate, and then dried to form the base polymer. Alternatively, after the pressure-sensitive adhesive layer is formed on a separate support, the pressure-sensitive adhesive layer may be transferred to the substrate.
본 발명의 점착 테이프는, 바람직하게는 전기 화학 디바이스의 고정에 사용되고, 보다 바람직하게는 콘덴서 소자의 권회 고정에 사용될 수 있다.The adhesive tape of the present invention is preferably used for fixing an electrochemical device, and more preferably for winding a capacitor element.
[실시예][Example]
이하, 실시예에 의해 본 발명을 구체적으로 설명하지만, 본 발명은 이들 실시예에 의해 한정되는 것은 아니다. 실시예에 있어서의 평가 방법은 이하와 같다. 또한, 실시예에 있어서, 특히 명기하지 않는 한, 「부」 및 「％」는 중량 기준이다.Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples. The evaluation method in the examples is as follows. In the examples, " part " and "% " are by weight unless otherwise specified.
(1) 산가 측정(1) Acid value measurement
JIS K 0070-1992에 규정되는 전위차 적정법에 준하여 산가를 측정하였다. 구체적으로는, 디에틸에테르와 에탄올을 체적비 4:1로 혼합하여 얻어진 용제 50mL에, 정칭 채취한 시료를 첨가하고, 완전히 용해시키고, 또한 지시약으로서 페놀프탈레인액을 첨가하여 측정용 용액을 조제하였다. 그 측정용 용액에 대해서, 0.1mol/L 수산화칼륨에탄올 용액으로 전위차 적정을 행하고, 얻어진 적정 곡선의 변곡점을 종점으로 하였다. 산가는, 이하의 식으로부터 구하였다.The acid value was measured according to the potentiometric titration method specified in JIS K 0070-1992. Specifically, a sample obtained by adding a quadrature sample to 50 mL of a solvent obtained by mixing diethyl ether and ethanol at a volume ratio of 4: 1 was completely dissolved and a phenolphthalein solution was added as an indicator to prepare a measurement solution. The measurement solution was subjected to potentiometric titration with a 0.1 mol / L potassium hydroxide ethanol solution, and the inflection point of the titration curve obtained was regarded as an end point. Acid value was obtained from the following equation.
산가(mgKOH/g)=(B×F×5.611)/SAcid value (mgKOH / g) = (B x F x 5.611) / S
B: 종점에 있어서의 0.1mol/L 수산화칼륨에탄올 용액의 적하량(mL)B: Drop amount (mL) of 0.1 mol / L potassium hydroxide ethanol solution at the end point
F: 0.1mol/L 수산화칼륨에탄올 용액(1.0)F: 0.1 mol / L potassium hydroxide ethanol solution (1.0)
S: 시료의 채취량 (g)S: Weight of sample (g)
또한, 베이스 폴리머를 시료로 할 경우, 점착제층을 클로로포름에 투입하여 얻어진 혼합액을 12시간 정치하고, 그 후, 그 혼합액을 필터로 여과하고, 중량 평균 분자량이 1만 이상(GPC에서 측정)인 물질을 시료(베이스 폴리머)로 하여, 산가를 구하였다.When the base polymer is used as a sample, the pressure-sensitive adhesive layer is put into chloroform and the resulting mixture is allowed to stand for 12 hours. Thereafter, the mixture is filtered to obtain a substance having a weight average molecular weight of 10,000 or more (measured by GPC) Was used as a sample (base polymer), and the acid value was determined.
(2) 수축률(2) Shrinkage
점착 테이프의 수축률을 이하와 같이 하여 측정하였다.The shrinkage percentage of the adhesive tape was measured as follows.
(i) 알루미늄판(표면 조도 Ra: 0.2㎛)에, 점착 테이프(30mm×30mm)를 압착하여 평가용 시료를 제작한다. 압착 조건: 2kg 롤러를 5mm/초의 속도로 1 왕복(i) An adhesive tape (30 mm x 30 mm) was pressed on an aluminum plate (surface roughness Ra: 0.2 m) to prepare evaluation samples. Crimping conditions: 2 kg rollers were driven at a speed of 5 mm /
(ii) 평가용 시료를 260℃의 열풍 건조기에 투입하고, 1시간 정치한다.(ii) The sample for evaluation is placed in a hot-air dryer at 260 占 폚, and left for 1 hour.
(iii) 가열 후의 점착 테이프 면적을 측정한다.(iii) The area of the adhesive tape after heating is measured.
(iv) 수축률(％)=(1-가열 후의 면적/가열 전의 면적)×100의 식에 의해 수축률을 산출한다.(iv) Shrinkage percentage (%) = (1-area after heating / area before heating) × 100 The shrinkage ratio is calculated by the following formula.
(3) 보유 지지력(3) Holding force
점착 테이프의 보유 지지력을 이하와 같이 하여 측정하였다.The holding force of the adhesive tape was measured as follows.
(i) 알루미늄판(표면 조도 Ra: 0.2㎛)에, 점착 테이프를 압착하여 평가용 시료(접착 면적: 폭 10mm×길이 20mm)를 제작한다. 압착 조건: 2kg 롤러를 5mm/초의 속도로 1 왕복(i) An adhesive tape was pressed on an aluminum plate (surface roughness Ra: 0.2 占 퐉) to prepare an evaluation sample (adhesive area:
(ii) 점착 테이프의 길이 방향이 상하 방향이 되도록 평가용 시료를 세우고, 점착 테이프의 하단부에 하중 100g의 추를 매단다.(ii) A sample for evaluation is placed so that the longitudinal direction of the adhesive tape is the vertical direction, and a weight of 100 g is attached to the lower end of the adhesive tape.
(iii) 260℃에서 1시간의 가열 처리를 행한다.(iii) Heat treatment is performed at 260 占 폚 for 1 hour.
(iv) 가열 처리 후의 점착 테이프의 어긋남의 길이를 측정하고, 그 어긋남의 길이를 보유 지지력으로 한다.(iv) The length of the displacement of the adhesive tape after the heat treatment is measured, and the length of the displacement is regarded as the holding force.
(4) 단말 박리(4) Terminal peeling
3.2mmφ의 알루미늄 막대에, 점착 테이프(폭 3mm)를 2주 권회하여 평가용 시료를 제작하였다. 그 평가용 시료를 γ부티로락톤에 3일간 침지시켜, 점착 테이프 단말의 박리 유무를 확인하였다. 또한, γ부티로락톤은 전해액으로서 다용되는 용제이다. 각 실시예 및 비교예에 대해서, 이 평가를 10회 행하고, 표 1에 있어서는, 박리가 발생한 횟수를 나타낸다.An adhesive tape (width 3 mm) was wound on an aluminum rod having a diameter of 3.2 mm for 2 weeks to prepare an evaluation sample. The sample for evaluation was immersed in gamma -butyrolactone for 3 days to confirm the peeling of the adhesive tape terminal. Also,? -Butyrolactone is a solvent widely used as an electrolytic solution. For each of the examples and comparative examples, this evaluation was carried out ten times, and in Table 1, the number of peeling occurred is shown.
(5) 소자 고정 테이프로서의 권취 이완, 권취 어긋남 평가(5) Evaluation of winding relaxation and winding deviation as element fixing tape
알루미늄박을 간극 없이 원통형으로 권회하여, 3mmφ의 알루미늄 막대를 제작하였다. 또한, 이 알루미늄 막대는, 콘덴서 소자를 의사적으로 재현하는 것이다. 이 알루미늄 막대에 점착 테이프(폭 3mm)를 2주 권회하여, 알루미늄 막대의 권회 고정을 행하였다. 이렇게 제작한 평가용 시료를, 260℃의 환경 하에 1시간 정치하고, 알루미늄 막대의 권취 이완, 권취 어긋남을 육안 확인하였다. 각 실시예 및 비교예에 대해서, 이 평가를 10회 행하고, 표 1에 있어서는, 권취 이완 또는 권취 어긋남이 발생한 횟수를 나타낸다.The aluminum foil was wound into a cylindrical shape without a gap to produce an aluminum rod having a diameter of 3 mm. Further, this aluminum rod is to reproduce the capacitor element in a pseudo manner. An adhesive tape (width 3 mm) was wound around the aluminum rod for two weeks, and the aluminum rod was wound and fixed. The thus-prepared sample for evaluation was allowed to stand under an environment of 260 DEG C for 1 hour, and the winding relaxation and winding displacement of the aluminum rod were visually confirmed. For each of the Examples and Comparative Examples, this evaluation was performed 10 times, and Table 1 shows the number of times that winding relaxation or winding deviation occurred.
[실시예 1][Example 1]
2에틸헥실아크릴레이트 90부와 아크릴산 10부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 및 이소시아네이트계 가교제 1부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리페닐렌술피드(PPS)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 73.9였다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) comprising 90 parts of 2-ethylhexyl acrylate and 10 parts of acrylic acid, and 1 part of an isocyanate crosslinking agent. This composition was applied onto a substrate (made of polyphenylene sulfide (PPS), thickness 25 mu m) so that the thickness after drying was 20 mu m and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 73.9. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[실시예 2][Example 2]
2에틸헥실아크릴레이트 93부와 아크릴산 7부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 및 이소시아네이트계 가교제 3부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리이미드(PI)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 51.7이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) containing 93 parts of 2-ethylhexyl acrylate and 7 parts of acrylic acid, and 3 parts of an isocyanate-based crosslinking agent. This composition was applied to a substrate (polyimide (PI), thickness 25 mu m) so as to have a thickness of 20 mu m after drying, and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 51.7. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[실시예 3][Example 3]
2에틸헥실아크릴레이트 80부와 아크릴산 20부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 및 이소시아네이트계 가교제 1부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리이미드(PI)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 147.8이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) comprising 80 parts of 2-ethylhexyl acrylate and 20 parts of acrylic acid, and 1 part of an isocyanate crosslinking agent. This composition was applied to a substrate (polyimide (PI), thickness 25 mu m) so as to have a thickness of 20 mu m after drying, and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 147.8. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[실시예 4][Example 4]
2에틸헥실아크릴레이트 90부와 아크릴산 10부를 포함하는 공중합체 폴리머(베이스 폴리머) 30부, 2에틸헥실아크릴레이트 95부와 아크릴산 5부를 포함하는 공중합체 폴리머(베이스 폴리머) 70부, 및 이소시아네이트계 가교제 1부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리페닐렌술피드(PPS)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 48.0이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.30 parts of a copolymer polymer (base polymer) comprising 90 parts of 2-ethylhexyl acrylate and 10 parts of acrylic acid, 70 parts of a copolymer polymer (base polymer) comprising 95 parts of 2-ethylhexyl acrylate and 5 parts of acrylic acid, 1 part was prepared. This composition was applied onto a substrate (made of polyphenylene sulfide (PPS), thickness 25 mu m) so that the thickness after drying was 20 mu m and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 48.0. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[실시예 5][Example 5]
부틸아크릴레이트 92부와 아크릴산 8부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 이소시아네이트계 가교제 2부 및 로진 페놀계 점착 부여제 20부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리페닐렌술피드(PPS)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 62.3이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) containing 92 parts of butyl acrylate and 8 parts of acrylic acid, 2 parts of an isocyanate crosslinking agent and 20 parts of a rosin phenolic tackifier was prepared. This composition was applied onto a substrate (made of polyphenylene sulfide (PPS), thickness 25 mu m) so that the thickness after drying was 20 mu m and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 62.3. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[실시예 6][Example 6]
스테아릴아크릴레이트 90부와 아크릴산 10부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부 및 이소시아네이트계 가교제 3부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리페닐렌술피드(PPS)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 72.1이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) comprising 90 parts of stearyl acrylate and 10 parts of acrylic acid and 3 parts of an isocyanate crosslinking agent was prepared. This composition was applied onto a substrate (made of polyphenylene sulfide (PPS), thickness 25 mu m) so that the thickness after drying was 20 mu m and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 72.1. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[비교예 1][Comparative Example 1]
2에틸헥실아크릴레이트 95부와 아크릴산 5부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 및 이소시아네이트계 가교제 1부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리이미드(PI)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 36.9였다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) comprising 95 parts of 2-ethylhexyl acrylate and 5 parts of acrylic acid, and 1 part of an isocyanate-based crosslinking agent. This composition was applied to a substrate (polyimide (PI), thickness 25 mu m) so as to have a thickness of 20 mu m after drying, and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 36.9. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[비교예 2][Comparative Example 2]
2에틸헥실아크릴레이트 75부와 아크릴산 25부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 및 이소시아네이트계 가교제 1부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리이미드(PI)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 184.7이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) comprising 75 parts of 2-ethylhexyl acrylate and 25 parts of acrylic acid, and 1 part of an isocyanate crosslinking agent was prepared. This composition was applied to a substrate (polyimide (PI), thickness 25 mu m) so as to have a thickness of 20 mu m after drying, and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 184.7. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
[비교예 3][Comparative Example 3]
2에틸헥실아크릴레이트 95부와 아크릴산 5부를 포함하는 공중합체 폴리머(베이스 폴리머) 100부, 이소시아네이트계 가교제 2부, 및 로진 페놀계 점착 부여제 50부를 포함하는 조성물을 조제하였다. 이 조성물을, 건조 후의 두께가 20㎛가 되도록, 기재(폴리페닐렌술피드(PPS)제, 두께 25㎛)에 도포, 건조하여, 기재 상에 점착제층을 구비하는 점착 테이프를 얻었다. 그 점착제층에 포함되는 베이스 폴리머의 산가는 36.9였다. 또한, 점착제층의 산가는 50.4이었다. 얻어진 점착 테이프를 상기 평가 (2) 내지 (5)에 제공하였다. 결과를 표 1에 나타내었다.100 parts of a copolymer polymer (base polymer) containing 95 parts of 2-ethylhexyl acrylate and 5 parts of acrylic acid, 2 parts of an isocyanate-based crosslinking agent, and 50 parts of a rosin phenol-based tackifier was prepared. This composition was applied onto a substrate (made of polyphenylene sulfide (PPS), thickness 25 mu m) so that the thickness after drying was 20 mu m and dried to obtain a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer on the substrate. The acid value of the base polymer contained in the pressure-sensitive adhesive layer was 36.9. The acid value of the pressure-sensitive adhesive layer was 50.4. The resulting adhesive tape was provided in the above evaluations (2) to (5). The results are shown in Table 1.
표 1로부터 명백해진 바와 같이, 본원 발명의 점착 테이프는, 콘덴서 소자의 권회 고정용의 테이프로서, 바람직하다. 보다 상세하게는, 점착제층 중의 베이스 폴리머의 산가를 45mgKOH/g 이상으로 함으로써, 그 콘덴서 소자의 권취 이완, 권취 어긋남을 방지할 수 있다. 또한, 단말 박리의 평가로부터 명백한 바와 같이, 베이스 폴리머의 산가를 150mgKOH/g 이하로 함으로써, 부착성이 우수한 점착 테이프를 얻을 수 있다.As is clear from Table 1, the adhesive tape of the present invention is preferable as a tape for winding the capacitor element. More specifically, by setting the acid value of the base polymer in the pressure-sensitive adhesive layer to 45 mgKOH / g or more, it is possible to prevent the winding of the capacitor element from being unwound and the winding displacement. Further, as is evident from the evaluation of the peeling of the terminals, the adhesive tape having an excellent adhesive property can be obtained by setting the acid value of the base polymer to 150 mgKOH / g or less.
본 발명의 점착 테이프는, 전기 화학 디바이스의 고정, 콘덴서 소자의 권회 고정용의 테이프로서 바람직하게 사용될 수 있다.INDUSTRIAL APPLICABILITY The adhesive tape of the present invention can be preferably used as a tape for fixing an electrochemical device and for winding a capacitor element.
10: 기재
20: 점착제층
100: 점착 테이프10: substrate
20: pressure-sensitive adhesive layer
100: Adhesive tape
Claims (11)
그 점착제층이 베이스 폴리머를 포함하고, 그 베이스 폴리머의 산가가 45mgKOH/g 내지 150mgKOH/g인,
점착 테이프.And a pressure-sensitive adhesive layer disposed on at least one side of the base material,
Wherein the pressure-sensitive adhesive layer comprises a base polymer and the acid value of the base polymer is from 45 mgKOH / g to 150 mgKOH / g,
Adhesive tape.
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| JP2015001606A JP2016125026A (en) | 2015-01-07 | 2015-01-07 | Pressure-sensitive adhesive tape |
| JPJP-P-2015-001606 | 2015-01-07 |
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| KR (1) | KR101925178B1 (en) |
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| KR20190081304A (en) | 2017-12-29 | 2019-07-09 | (주)케이비어드히시브스 | Heat resistant rubber adhesive composition and adhesive tape containing the same |
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| JP6967339B2 (en) * | 2016-09-06 | 2021-11-17 | 日東電工株式会社 | Adhesive tape for battery exterior |
| TW202336198A (en) | 2021-12-06 | 2023-09-16 | 日商日絆股份有限公司 | Adhesive composition, adhesive tape and capacitor element |
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| Publication number | Publication date |
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| KR101925178B1 (en) | 2018-12-04 |
| CN105754505A (en) | 2016-07-13 |
| JP2016125026A (en) | 2016-07-11 |
| TW201632600A (en) | 2016-09-16 |
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