KR20160080410A - Thin film thickness measurement sensor module and thin film deposition apparatus including the same - Google Patents

Thin film thickness measurement sensor module and thin film deposition apparatus including the same Download PDF

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KR20160080410A
KR20160080410A KR1020140192163A KR20140192163A KR20160080410A KR 20160080410 A KR20160080410 A KR 20160080410A KR 1020140192163 A KR1020140192163 A KR 1020140192163A KR 20140192163 A KR20140192163 A KR 20140192163A KR 20160080410 A KR20160080410 A KR 20160080410A
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thin film
thickness measuring
measuring sensor
sensor
thickness
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Korean (ko)
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김진의
김동욱
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주식회사 레이언스
(주)바텍이우홀딩스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Vapour Deposition (AREA)
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Abstract

The purpose of the present invention is to provide a way to increase durability of a thin film thickness measuring sensor. The present invention provides a thin film deposition apparatus which comprises: a boat facing a substrate, and having a thin film deposition raw material laid therein; and a thin film thickness measuring sensor module positioned on one side of the boat. The thin film thickness measuring sensor module includes: a thickness measuring sensor; and a sensor cover protecting the thickness measuring sensor, and having an opening facing a sensing surface of the thickness measuring sensor on a side surface.

Description

박막 두께측정 센서모듈 및 이를 포함한 박막 증착 장비{Thin film thickness measurement sensor module and thin film deposition apparatus including the same}[0001] The present invention relates to a thin film thickness measurement sensor module and a thin film deposition apparatus including the thin film thickness measurement sensor module,

본 발명은 박막 증착에 필요한 실시간 두께 측정을 위한 센서 모듈에 관한 것으로서, 보다 상세하게는, 두꺼운 두께의 증착막을 형성함에 있어 증착 완료 시까지 안정적으로 박막 두께를 측정할 수 있는 박막 두께 측정 센서모듈 및 이를 포함한 박막 증착 장비에 관한 것이다.
The present invention relates to a sensor module for real-time thickness measurement required for thin film deposition, and more particularly, to a thin film thickness sensor module capable of measuring a thin film thickness stably until deposition is completed in forming a thick- And a thin film deposition apparatus including the same.

일반적으로, 박막 증착 공정에서는 실시간 두께 및 최종 두께 확인을 위해서 박막두께측정센서를 사용 한다. 실시간 두께 확인을 위한 센서 적용을 통해 공정 재현성과 박막에 대한 기본 품질을 결정할 수 있게 된다. Generally, in thin film deposition process, thin film thickness measurement sensor is used for real time thickness and final thickness. It is possible to determine the process reproducibility and the basic quality of the thin film by applying the sensor for real time thickness confirmation.

도 1은 종래의 박막 두께측정 센서가 구비된 박막 증착 장비를 개략적으로 도시한 도면이다.1 is a schematic view of a conventional thin film deposition apparatus equipped with a thin film thickness measurement sensor.

도 1을 참조하면, 진공증착법 즉 열 증발원(thermal evaporator)을 사용하여 박막을 증착하는 박막 증착 장비(10) 내에는, 하부에 위치하며 박막 증착용 원료가 놓여지는 보트(boat; 20)와, 보트(20) 상에 박막이 증착되는 기판(S)이 배치되고, 기판(S)은 지그(jig; 30) 내에 설치 된다.Referring to FIG. 1, a thin film deposition apparatus 10 for depositing a thin film using a vacuum evaporation method, that is, a thermal evaporator, includes a boat 20, A substrate S on which a thin film is deposited is arranged on a boat 20 and the substrate S is installed in a jig 30. [

한편, 기판(S)과 근접하고 실질적으로 기판(S)과 동일한 높이에 박막 두께측정 센서(50)가 위치한다.On the other hand, the thin film thickness measuring sensor 50 is located at the same height as the substrate S, substantially adjacent to the substrate S.

박막 증착이 진행되면, 기판(S)과 박막 두께측정 센서(50)에는 박막이 기판과 동일 수준으로 두께가 형성된다. 이에 따라, 박막 두께측정 센서(50)에 증착된 박막의 두께를 측정함으로써, 기판(S)에 증착된 박막의 두께를 확인할 수 있다. When the thin film deposition proceeds, a thin film is formed on the substrate S and the thin film thickness measuring sensor 50 at the same level as the substrate. Accordingly, the thickness of the thin film deposited on the substrate S can be confirmed by measuring the thickness of the thin film deposited on the thin film thickness measurement sensor 50. [

이와 같은 박막 두께 측정을 위해서는 센서 모듈(50) 내 막을 센싱할 수 있도록 하는 크리스탈(crystal)센서가 포함되어 있다. 크리스탈 센서의 역할은 실시간으로 증착 되는 막에 대한 센싱을 통한 두께를 확인할 수 있다. 크리스탈 센서의 종류에 따라 측정 가능한 두께의 범위는 상당히 제한적이다. 즉, 박막 수준의 두께인 수 um 정도는 측정이 가능하나 그 이상에서는 센서 수명이 다하여 측정할 수 없게 된다. In order to measure the thickness of the thin film, a crystal sensor for sensing the film in the sensor module 50 is included. The role of the crystal sensor can be confirmed by sensing the thickness of the deposited film in real time. Depending on the type of crystal sensor, the range of measurable thickness is quite limited. In other words, the thickness of the film at the thickness of several um can be measured, but beyond that, the sensor life can not be measured.

X선 검출기 등에 소자에 사용되는 광도전층과 같은 경우는 수백 um 이상 두께를 확보해야 한다. 이처럼 두꺼운 두께의 박막을 증착하는 경우에, 종래의 박막 두께 측정 센서(50)는 박막 증착 진행 도중에 수명이 종료되는 문제가 발생하며, 이에 따라 박막의 두께를 측정할 수 없게 된다. In the case of a photoconductive layer used in an element such as an X-ray detector, a thickness of several hundred μm or more should be secured. In the case of depositing a thin film having such a large thickness, the conventional thin film thickness measuring sensor 50 has a problem that the lifetime is terminated during the progress of thin film deposition, and thus the thickness of the thin film can not be measured.

이를 개선하기 위해, 다수의 크리스탈 센서를 적용하여 증착 공정 중에 센서가 교체되도록 구성하는 것을 고려해 볼 수 있는데, 이는 센서의 소모량이 상당하여 공정비용이 증가하는 문제가 발생하게 된다.
In order to solve this problem, it is possible to consider a configuration in which a plurality of crystal sensors are applied to replace the sensor during the deposition process. This increases the cost of the sensor due to a considerable consumption of the sensor.

본 발명은 박막 두께 측정 센서의 수명을 향상시킬 수 있는 방안을 제공하는 것에 과제가 있다.
The present invention has a problem to provide a method for improving the life of the thin film thickness measuring sensor.

전술한 바와 같은 과제를 달성하기 위해, 본 발명은 기판과 대향하며, 박막 증착 원료가 놓여진 보트와; 상기 보트의 일측에 위치하는 박막 두께 측정 센서 모듈을 포함하며, 상기 박막 두께 측정 센서 모듈은, 두께 측정 센서와; 상기 두께 측정 센서를 보호하고, 측면에 상기 두께 측정 센서의 센싱면에 대향하는 개구를 갖는 센서커버를 포함하는 박막 증착 장비를 제공한다.In order to achieve the above-mentioned object, the present invention provides a method of manufacturing a thin film deposition apparatus, comprising: a boat facing a substrate, on which a thin film deposition material is placed; And a thin film thickness measuring sensor module located at one side of the boat, wherein the thin film thickness measuring sensor module comprises: a thickness measuring sensor; And a sensor cover that protects the thickness measurement sensor and has an opening on a side surface thereof facing the sensing surface of the thickness measurement sensor.

여기서, 상기 개구는 원형상이나 슬릿 형상을 가질 수 있다. Here, the opening may have a circular shape or a slit shape.

상기 박막 두께 측정 센서 모듈은 상기 보트와 동일한 높이에 위치할 수 있다. The thin film thickness measurement sensor module may be located at the same height as the boat.

다른 측면에서, 본 발명은 박막 증착 장비용 박막 두께 측정 센서 모듈로서, 두께측정센서와; 상기 두께측정센서를 보호하고, 상기 두께측정센서의 센싱면과 이격되고 대향하는 측면에 형성된 개구를 갖는 센서커버를 포함하는 박막 두께측정 센서모듈을 제공한다.
In another aspect, the present invention is a thin film thickness measuring sensor module for a thin film deposition apparatus, comprising: a thickness measuring sensor; And a sensor cover which protects the thickness measurement sensor and has an opening formed on a side surface remote from the sensing surface of the thickness measurement sensor.

본 발명에 따르면, 두께측정센서와 보트의 거리와, 센서커버의 개구의 크기와, 센서커버의 개구와 두께측정센서 사이의 거리 등을 조절하여, 두께측정 센서의 박막 증착율을 기판의 박막 증착율보다 작게 설정하게 된다.According to the present invention, by adjusting the distance between the thickness measuring sensor and the boat, the size of the opening of the sensor cover, and the distance between the opening of the sensor cover and the thickness measuring sensor, the thin film deposition rate of the thickness measuring sensor is made smaller than the thin film deposition rate .

이에 따라, 기판에 수백um 이상의 두꺼운 박막을 증착하더라도, 두께측정 센서는 기판에 증착이 완료될 때까지 박막의 두께를 성공적으로 측정할 수 있게 되며, 두께측정 센서의 수명을 향상을 통해 공정 재현성 및 고품질의 증착막을 얻을 수 있다.
Accordingly, even if a thick film of several hundreds of um or more is deposited on the substrate, the thickness measurement sensor can successfully measure the thickness of the thin film until the deposition on the substrate is completed, and the lifetime of the thickness measurement sensor can be improved, A high-quality vapor deposition film can be obtained.

도 1은 종래의 박막 두께 측정 센서가 구비된 박막 증착 장비를 개략적으로 도시한 도면.
도 2는 본 발명의 실시 예에 따른 박막 두께 측정 센서 모듈이 구비된 박막 증착 장비를 개략적으로 도시한 도면.
도 3은 본 발명의 실시 예에 따른 박막 두께 측정 센서 모듈을 개략적으로 도시한 단면도.
도 4는 본 발명의 실시 예에 따른 박막 두께 측정 센서 모듈을 개략적으로 도시한 평면도.BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional thin film deposition apparatus equipped with a thin film thickness measurement sensor. FIG.
FIG. 2 is a schematic view of a thin film deposition apparatus equipped with a thin film thickness measuring sensor module according to an embodiment of the present invention. FIG.
3 is a cross-sectional view schematically showing a thin film thickness measuring sensor module according to an embodiment of the present invention.
4 is a plan view schematically illustrating a thin film thickness measurement sensor module according to an embodiment of the present invention.

이하, 도면을 참조하여 본 발명의 실시 예를 상세하게 설명한다.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

도 2는 본 발명의 실시 예에 따른 박막 두께 측정 센서 모듈이 구비된 박막 증착 장비를 개략적으로 도시한 도면이고, 도 3은 본 발명의 실시 예에 따른 박막 두께 측정 센서 모듈을 개략적으로 도시한 단면도이고, 도 4는 본 발명의 실시 예에 따른 박막 두께 측정 센서 모듈을 개략적으로 도시한 평면도이다.FIG. 2 is a schematic view of a thin film deposition apparatus equipped with a thin film thickness measuring sensor module according to an embodiment of the present invention. FIG. 3 is a cross- And FIG. 4 is a plan view schematically showing a thin film thickness measurement sensor module according to an embodiment of the present invention.

도 2 내지 4를 참조하면, 진공증착법 즉 열 증발원(thermal evaporator)을 사용하여 박막을 증착하는 박막 증착 장비(100)는 X선 검출기의 광도전층과 같이 두꺼운 박막을 증착하는데 사용될 수 있는데, 이에 한정되지는 않는다. Referring to FIGS. 2 to 4, a thin film deposition apparatus 100 for depositing a thin film using a vacuum evaporation method, that is, a thermal evaporator can be used for depositing a thick film such as a photoconductive layer of an X-ray detector. It does not.

박막 증착 장비(100) 내에는, 하부에 위치하며 박막 증착용 원료가 놓여지는 보트(boat; 120)와, 보트(120) 상에 박막이 증착되는 기판(S)이 배치되고,기판(S)은 지그(jig; 130)에 의해 지지된다. 박막 증착 시, 지그(130)는 회전하도록 구성될 수 있다. A boat 120 on which a thin film deposition material is placed and a substrate S on which a thin film is deposited are disposed in a lower portion of the thin film deposition apparatus 100, Is supported by a jig (130). During thin film deposition, the jig 130 may be configured to rotate.

박막 증착 장비(100) 내에는, 보트(120) 근방에 배치된 박막 두께 측정 센서 모듈(150)이 위치한다. 예를 들면, 보트(120)의 일측에 배치되며, 보트(120)와 실질적으로 동일한 높이에 위치할 수 있다. 일예로, 보트(120)와 박막 두께 측정 센서 모듈(150) 사이의 거리는 대략 100mm ~ 250mm로 설정될 수 있는데, 이에 한정되지는 않는다.In the thin film deposition apparatus 100, a thin film thickness measurement sensor module 150 disposed in the vicinity of the boat 120 is positioned. For example, disposed at one side of the boat 120 and at substantially the same height as the boat 120. For example, the distance between the boat 120 and the thin film thickness sensor module 150 may be set to approximately 100 mm to 250 mm, but is not limited thereto.

박막 두께 측정 센서 모듈(150)은 두께 측정 센서(151)와, 두께 측정 센서(151)를 감싸며 보호하는 센서 커버(153)를 포함할 수 있다. 두께 측정을 위해 센서 모듈(151)에 센싱을 위한 크리스탈 센서가 사용된다. 센서커버(153)의 재질은 Al, SUS 등으로 형성될 수 있는데, 이에 한정되지는 않는다.The thin film thickness measuring sensor module 150 may include a thickness measuring sensor 151 and a sensor cover 153 which surrounds and protects the thickness measuring sensor 151. A crystal sensor for sensing the sensor module 151 is used for thickness measurement. The material of the sensor cover 153 may be formed of Al, SUS, or the like, but is not limited thereto.

박막 두께 측정 센서 모듈(150)은 보트(120)와는 상대적으로 가깝고 기판(S)과는 상대적으로 먼 거리에 위치하도록 배치하여 두께측정센서(151)에 증착되는 박막은 기판(S)에 증착되는 박막보다 얇은 두께를 가질 수 있도록 제어 한다. 이를 통해, 두께측정센서(151)의 박막 증착율은 기판(S)의 박막 증착율 보다 작게 된다.The thin film thickness measuring sensor module 150 is disposed relatively far from the boat 120 and relatively far from the substrate S so that the thin film deposited on the thickness measuring sensor 151 is deposited on the substrate S So as to have a thickness smaller than that of the thin film. As a result, the thin film deposition rate of the thickness measurement sensor 151 becomes smaller than the thin film deposition rate of the substrate S.

한편, 센서커버(153)의 측면으로서 두께측정센서(151)의 센싱면(152)에 대향하는 센서커버(153)의 측면(154)에는 개구(155)가 구비된다. 이 개구(155)를 통해 보트(120)에서 증발된 증착 원료가 유입되어 두께 측정 센서(151)의 센싱 부에 증착을 통해 두께 측정을 할 수 있다. An opening 155 is provided in the side surface 154 of the sensor cover 153 opposite to the sensing surface 152 of the thickness measurement sensor 151 as a side surface of the sensor cover 153. The evaporation material evaporated in the boat 120 flows through the opening 155 and thickness measurement can be performed through deposition on the sensing portion of the thickness measurement sensor 151.

센서커버(153)의 개구(155)는 원형상이나 슬릿 형상 등 다양한 형상으로 형성될 수 있다. 본 실시예에서는 설명의 편의를 위해 개구(155)가 원형상으로 형성된 경우를 예로 들어 도 4에 도시하였다. The opening 155 of the sensor cover 153 may be formed in various shapes such as a circular shape or a slit shape. In this embodiment, for convenience of explanation, FIG. 4 shows an example in which the opening 155 is formed in a circular shape.

여기서, 개구(155)의 크기 즉 직경(a)은 예를 들면 대략 1.5mm ~ 10mm일 수 있는데, 이에 한정되지는 않는다. 이때, 개구(155)의 직경(a)를 조절함으로써 두께측정센서(151)에 증착 되는 박막의 증착율을 조절할 수 있다.Here, the size or diameter (a) of the opening 155 may be, for example, approximately 1.5 mm to 10 mm, but is not limited thereto. At this time, the deposition rate of the thin film deposited on the thickness measurement sensor 151 can be adjusted by adjusting the diameter a of the opening 155.

또한, 센서커버(153)의 개구(155)가 형성된 측면과 두께 측정 센서(151) 사이의 거리(b)를 조절함으로써, 두께 측정 센서(151)의 박막 증착율을 조절할 수 있다. The thin film deposition rate of the thickness measurement sensor 151 can be adjusted by adjusting the distance b between the side surface of the sensor cover 153 on which the opening 155 is formed and the thickness measurement sensor 151.

위와 같이, 두께 측정 센서(151)와 보트(120)의 거리와, 센서 커버(153)의 개구(155)의 크기와, 센서 커버(153)의 개구(155)와 두께 측정 센서(151) 사이의 거리는 두께 측정 센서(151)의 박막 증착율을 결정하는 주요 인자로서, 이들 인자에 따라 두께 측정 센서(151)의 박막 두께가 결정된다.The distance between the thickness measuring sensor 151 and the boat 120 and the size of the opening 155 of the sensor cover 153 and the distance between the opening 155 of the sensor cover 153 and the thickness measuring sensor 151 Is a main factor for determining the thin film deposition rate of the thickness measurement sensor 151, and the thickness of the thickness measurement sensor 151 is determined according to these factors.

따라서, 위와 같은 인자들을 조절하여, 두께측정센서(151)의 박막 증착율을 기판(S)의 박막 증착율보다 낮게 형성할 수 있다. 예를 들면, 두께 측정 센서(151)의 박막 증착률(DR1)과 기판(S)의 박막 증착률(DR2)의 비율은, 1:10 ~ 1: 30과 같이 제어 할 수 있다.Therefore, the thin film deposition rate of the thickness measurement sensor 151 can be made lower than the thin film deposition rate of the substrate S by adjusting the above factors. For example, the ratio of the thin film deposition rate DR1 of the thickness measurement sensor 151 to the thin film deposition rate DR2 of the substrate S can be controlled as 1:10 to 1:30.

이처럼, 두께 측정 센서(151)의 박막 증착률을 기판(S)에 비해 작게 설정함으로써, 기판(S)에 수백um 이상의 두꺼운 박막을 증착할 경우, 두께측정센서(151)는 기판(S)에 증착된 박막의 두께를 성공적으로 측정할 수 있게 된다. 따라서, 상기 방식을 적용을 통해 두께측정센서(151)의 수명을 향상시킬 수 있다.
When the thin film deposition rate of the thickness measurement sensor 151 is set smaller than that of the substrate S by depositing a thick film of several hundreds of um or more on the substrate S, The thickness of the deposited thin film can be successfully measured. Therefore, the lifetime of the thickness measurement sensor 151 can be improved by applying the above method.

전술한 본 발명의 실시예는 본 발명의 일예로서, 본 발명의 정신에 포함되는 범위 내에서 자유로운 변형이 가능하다. 따라서, 본 발명은, 첨부된 특허청구범위 및 이와 등가되는 범위 내에서의 본 발명의 변형을 포함한다.
The embodiment of the present invention described above is an example of the present invention, and variations are possible within the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and equivalents thereof.

100: 박막 증착 장비 120: 보트
130: 지그 150: 박막 두께 측정 센서 모듈
151: 두께 측정 센서 152: 센싱면
153: 센서커버 154: 센서커버의 측면
155: 개구
S: 기판100: thin film deposition equipment 120: boat
130: Jig 150: Thin film thickness measuring sensor module
151: Thickness measuring sensor 152: Sensing surface
153: Sensor cover 154: Side of sensor cover
155: opening
S: substrate

Claims (4)

기판과 대향하며, 박막 증착 원료가 놓여진 보트와;
상기 보트의 일측에 위치하는 박막 두께 측정 센서 모듈을 포함하고,
상기 박막 두께 측정 센서 모듈은,
두께 측정 센서와;
상기 두께 측정 센서를 보호하고, 측면에 상기 두께 측정 센서의 센싱면에 대향하는 개구를 갖는 센서커버를 포함하는 박막 증착 장비.
A boat facing the substrate and on which the thin film deposition material is placed;
And a thin film thickness measuring sensor module positioned at one side of the boat,
Wherein the thin film thickness measuring sensor module comprises:
A thickness measuring sensor;
And a sensor cover for protecting the thickness measurement sensor and having an opening on a side surface thereof facing the sensing surface of the thickness measurement sensor.
제 1 항에 있어서,
상기 개구는 원형상이나 슬릿 형상을 갖는 박막 증착 장비.
The method according to claim 1,
Wherein the opening has a circular shape or a slit shape.
제 1 항에 있어서,
상기 박막 두께 측정 센서 모듈은 상기 보트와 동일한 높이에 위치하는
박막 증착 장비.
The method according to claim 1,
The thin film thickness measuring sensor module is located at the same height as the boat
Thin Film Deposition Equipment.
박막 증착 장비용 박막 두께 측정 센서 모듈로서,
두께 측정 센서와;
상기 두께 측정 센서를 보호하고, 상기 두께 측정 센서의 센싱면과 이격되고 대향하는 측면에 형성된 개구를 갖는 센서커버
를 포함하는 박막 두께 측정 센서 모듈.A thin film thickness measuring sensor module for a thin film deposition apparatus,
A thickness measuring sensor;
And a sensor cover which protects the thickness measurement sensor and has an opening formed on a side surface remote from the sensing surface of the thickness measurement sensor,
Wherein the thin film thickness measuring sensor module comprises:
KR1020140192163A 2014-12-29 2014-12-29 Thin film thickness measurement sensor module and thin film deposition apparatus including the same KR20160080410A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016123159A1 (en) 2016-06-27 2017-12-28 Gwangju Institute Of Science And Technology Apparatus and method for detecting a driver condition based on biometric signals of the driver

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016123159A1 (en) 2016-06-27 2017-12-28 Gwangju Institute Of Science And Technology Apparatus and method for detecting a driver condition based on biometric signals of the driver

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