KR20160074504A - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

Info

Publication number
KR20160074504A
KR20160074504A KR1020167010544A KR20167010544A KR20160074504A KR 20160074504 A KR20160074504 A KR 20160074504A KR 1020167010544 A KR1020167010544 A KR 1020167010544A KR 20167010544 A KR20167010544 A KR 20167010544A KR 20160074504 A KR20160074504 A KR 20160074504A
Authority
KR
South Korea
Prior art keywords
optical semiconductor
sealing
semiconductor elements
semiconductor device
substrate
Prior art date
Application number
KR1020167010544A
Other languages
English (en)
Korean (ko)
Inventor
야스나리 오오야부
아키토 니노미야
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20160074504A publication Critical patent/KR20160074504A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020167010544A 2013-10-23 2014-08-18 반도체 장치 및 그 제조 방법 KR20160074504A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013219877A JP2015082580A (ja) 2013-10-23 2013-10-23 半導体装置およびその製造方法
JPJP-P-2013-219877 2013-10-23
PCT/JP2014/071564 WO2015059989A1 (ja) 2013-10-23 2014-08-18 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
KR20160074504A true KR20160074504A (ko) 2016-06-28

Family

ID=52992598

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167010544A KR20160074504A (ko) 2013-10-23 2014-08-18 반도체 장치 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP2015082580A (ja)
KR (1) KR20160074504A (ja)
CN (1) CN105556686A (ja)
TW (1) TW201517324A (ja)
WO (1) WO2015059989A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106469767B (zh) * 2015-08-18 2017-12-01 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备系统
CN106469780B (zh) * 2015-08-18 2018-02-13 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的工艺方法
CN106469768B (zh) * 2015-08-18 2018-02-02 江苏诚睿达光电有限公司 一种异形有机硅树脂光转换体贴合封装led的装备系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5097471B2 (ja) * 2007-08-03 2012-12-12 シャープ株式会社 発光装置の製造方法
US8431951B2 (en) * 2009-10-01 2013-04-30 Excelitas Canada, Inc. Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation
JP5882729B2 (ja) * 2011-12-28 2016-03-09 日東電工株式会社 シリコーン樹脂シート、硬化シート、発光ダイオード装置およびその製造方法

Also Published As

Publication number Publication date
JP2015082580A (ja) 2015-04-27
TW201517324A (zh) 2015-05-01
WO2015059989A1 (ja) 2015-04-30
CN105556686A (zh) 2016-05-04

Similar Documents

Publication Publication Date Title
US9401462B2 (en) Light emitting device exhibiting excellent heat resistance and good color reproducibility through fluorescent material arrangement
US9351399B2 (en) Light-emitting device, light-emitting device assembly, and electrode-bearing substrate in which a fragile region is formed in a substrate, and light emitting device cut from light-emitting device assembly
US9406847B2 (en) Optoelectronic semiconductor component, conversion-medium lamina and method for producing a conversion-medium lamina
TWI535056B (zh) 螢光反射片材、發光二極體裝置及其製造方法
US20140091337A1 (en) Light-emitting device, light-emitting device assembly, and electrode-bearing substrate
TW201401584A (zh) 反射層－螢光體層被覆ｌｅｄ、其製造方法、ｌｅｄ裝置及其製造方法
TW201401576A (zh) 密封層被覆半導體元件、其製造方法及半導體裝置
CN110943148B (zh) 发光装置的制造方法以及发光装置
EP3264462B1 (en) Led module
TW201401575A (zh) 密封層被覆半導體元件、其製造方法及半導體裝置
US20190157528A1 (en) Light emitting device
US12100790B2 (en) Method of manufacturing light emitting device
KR20160074504A (ko) 반도체 장치 및 그 제조 방법
WO2017221606A1 (ja) 蛍光体層付光半導体素子およびその製造方法
CN108878625B (zh) 发光装置及其制造方法
KR102512356B1 (ko) 발광장치 및 그 제조방법
EP2634805A1 (en) Light-emitting device assembly and lighting device
JP5902291B2 (ja) 封止シートおよびその製造方法

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination