KR20160070116A - Mounted component inspection device - Google Patents

Abstract

(Problems to be Solved) In an inspection apparatus for a mounting part for picking up a component mounted on a substrate in a plurality of directions, the inspection time is shortened.
The present invention relates to an inspection device for inspecting a mounting component, which comprises a camera (IC, OC1, OC2) for capturing an electronic component (12) in a plurality of directions, And a synchronous control device 30 for synchronously controlling each of the cameras IC, OC1 and OC2 and the combined illumination BL. The synchronous control device 30 includes a camera (IC, OC1 (OC2, OC2), and an image pickup signal for outputting an image pickup signal for performing image pickup by each of the cameras (IC, OC1, OC2) A lighting control circuit outputs a lighting signal when a predetermined imaging signal is inputted, and outputs a lighting signal to the camera (IC) and other cameras (OC1, OC2) during the longest exposure time from the imaging control circuit An image pickup signal is output.

Description

[0001] MOUNTED COMPONENT INSPECTION DEVICE [

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an inspection apparatus for a mounting part for inspecting a mounted state of a component mounted on a substrate.

2. Description of the Related Art Conventionally, there has been known an inspection apparatus for a mounting part for inspecting the appearance of a component mounted on a substrate and inspecting the mounted state of the component by processing the sensed image. Further, in recent years, in order to confirm the problem factor in detail in the case where the mounting condition of the component is poor, there is known an inspection device for a mounting part for picking up and inspecting the component in a plurality of directions with different imaging angles. An appearance inspection apparatus capable of picking up and inspecting a part to be inspected in a plurality of directions is disclosed in, for example, Patent Document 1. [

Japanese Patent Application Laid-Open No. 2006-184022

Incidentally, in such an inspection apparatus, an illumination device for projecting light for image pickup at the time of imaging a component is required. When imaging a component, a lighting signal of the lighting apparatus is output from the control-side apparatus in addition to the imaging signal of the component. However, in the conventional configuration, since each imaging device and illumination device is directly connected to a PC as an image processing device, an imaging signal and a lighting signal are sequentially output from the image processing device by serial communication, so that the imaging in each imaging device is sequentially . Therefore, a loss occurred at the inspection time.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to shorten the inspection time in an inspection apparatus for a component mounted on a substrate in a plurality of directions.

The technique disclosed in this specification captures a component mounted on a substrate in accordance with an image pickup signal outputted from an image processing apparatus, introduces an image of the picked-up component into the image processing apparatus, A plurality of imaging devices for imaging the components in a plurality of directions with different imaging angles; an illumination device for projecting light for imaging by the plurality of imaging devices onto the component; and a plurality of And a synchronization control device for controlling each of the imaging devices of the imaging device in synchronization with the illumination device, wherein the synchronization control device controls the illumination device to emit light to the illumination device in accordance with the longest exposure time among the respective exposure times set in the plurality of imaging devices And an image pickup control unit for outputting an image pickup signal for performing image pickup by the image pickup apparatus Wherein the lighting control circuit outputs the lighting signal when the predetermined imaging signal is input and outputs the lighting signal from the imaging control circuit to the imaging device and other imaging devices in the longest exposure time, And the signal is outputted synchronously.

In the inspection apparatus for the mounted component, when a predetermined image pickup signal is inputted, the image pickup signal is synchronously outputted to the image pickup apparatus and other image pickup apparatus having the longest exposure time from the image pickup control circuit. Here, the imaging signals referred to in the present specification are synchronously output, so that the imaging in the other imaging apparatus is ended within the lighting time of the illumination apparatus on the basis of the imaging apparatus with the longest exposure time, Quot; output signal "

Therefore, in the inspection apparatus for the mounted component, a lighting signal is outputted to the lighting apparatus in accordance with the longest exposure time, and when a predetermined imaging signal is inputted, the lighting signal to the lighting apparatus and the imaging signal to the imaging apparatus having the longest exposure time And is output synchronously. Accordingly, the illumination device is turned on in accordance with the longest exposure time. The imaging signal is also synchronously outputted to other imaging apparatuses so that exposure is completed within the lighting time of the illumination apparatus, whereby imaging in another imaging apparatus is performed within the lighting time of the illumination apparatus. That is, while the imaging in the imaging apparatus with the longest exposure time is being performed, the imaging in the other imaging apparatus is performed.

As described above, in the inspection device for the mounted component, lighting of the illumination device and imaging in each imaging device can be performed in accordance with the longest exposure time, and compared with the conventional configuration in which imaging is sequentially performed in each imaging device, It is possible to prevent or suppress the occurrence of erosion. As a result, the inspection time can be shortened as compared with the conventional configuration.

In the inspection apparatus for the mounted component, the synchronization control device may simultaneously output the imaging signal to the imaging device and the other imaging device having the longest exposure time from the imaging control circuit.

In a case where imaging in another imaging apparatus is not performed simultaneously with imaging in the imaging apparatus having the longest exposure time, exposure in the imaging apparatus having the longest exposure time in order to terminate imaging in another imaging apparatus within the lighting time of the illumination apparatus It is necessary to mount a new circuit or the like for measuring the elapsed time from the start. According to the above configuration, there is no need to mount such a new circuit or the like, so that the configuration of the synchronous control device can be simplified.

In the inspection apparatus for the mounted component, a signal may be input / output by serial communication between the image processing apparatus and the synchronization control apparatus.

According to this configuration, serial communication can be realized between the image processing apparatus and the synchronous control apparatus while simultaneously outputting the image pickup signals to the respective image pickup apparatuses from the synchronous control apparatus, so that the image processing apparatus and each image pickup apparatus are controlled by parallel communication The wiring can be saved and the cost can be reduced as compared with the case of FIG.

(Effects of the Invention)

According to the technique disclosed in this specification, inspection time can be shortened in an inspection apparatus for a mounted component that picks up a component mounted on a substrate in a plurality of directions.

1 is a schematic diagram showing a schematic configuration of an inspection apparatus according to an embodiment;
2 is a block diagram showing an internal configuration of the synchronous control device
3 is a flowchart showing the flow of the image pick-
4 is a flowchart showing the flow of image processing
Fig. 5 is a timing chart of each illumination and imaging in each camera

Embodiments will be described with reference to the drawings. In the present embodiment, an electronic component 12 (an example of a component) 12 mounted on a printed circuit board (an example of a board) 10 is picked up in a plurality of directions to check the mounting state of the electronic component 12 The inspection apparatus 1 is exemplified (see Fig. 1). The inspection of the mounted state of each electronic component 12 is performed before the reflow soldering process of the printed board 10 on which the respective electronic components 12 are mounted or after the reflow soldering process .

As shown in FIG. 1, the inspection apparatus 1 is electrically connected to a system board (an example of an image processing apparatus) 20 provided outside the apparatus 1. The system board 20 and the inspection apparatus 1 are connected by a LAN cable 22 to perform serial communication. The inspection apparatus 1 is entirely controlled by the system board 20.

The system board 20 includes a CPU and the like, and has a reception unit (not shown) for receiving an instruction from a worker. The system board 20 outputs an image pickup signal to the inspection apparatus 1 in accordance with an image pickup program input from an operator (or stored in advance). The system board 20 introduces an image of the electronic component 12 picked up by the inspection apparatus 1 and processes the image, and based on the inspection standard input from the operator (or stored in advance) And judges whether the component 12 is mounted or not.

(Configuration of inspection apparatus)

1, the inspection apparatus 1 includes a synchronous control device 30, an inspection camera (an example of an image pickup device) IC, a first dioptric camera (an example of an image pickup device) OC1, A first inspection illuminator IL1, a second inspection illuminator IL2, a combined illumination (an example of a lighting apparatus) BL, and a camera (an example of an imaging apparatus) OC2, And a stage (not shown) provided in the stage. In the inspection apparatus 1, the printed board 10 on which the electronic components 12 to be inspected are mounted is placed on the stage. The inspection apparatus 1 picks up an image on each of a plurality of areas previously defined on the printed board 10 and inspects the mounting state of each electronic component 12 of the picked-up area.

The synchronous control device 30 is connected to the system board 20 by the above-described LAN cable 22 and controls the respective cameras IC, OC1 and OC2 and the respective lights IL1, IL2 and BL in synchronization . The synchronous control device 30 outputs an image pickup signal having a predetermined pulse width to each of the cameras IC, OC1 and OC2 when a predetermined image pickup signal according to the image pickup program is outputted from the system board 20, IL1, IL2, BL) having a predetermined pulse width.

In the cameras (IC, OC1, and OC2), when an image pickup signal outputted from the synchronous control device 30 is input, the shutter is opened only for a time corresponding to the pulse width of the image pickup signal (exposure time). In each camera (IC, OC1, OC2), imaging of an area to be imaged is performed while the shutter is open. Further, the synchronous control device 30 outputs an image picked up by each camera (IC, OC1, OC2) to the system board 20. The internal configuration of the synchronous control device 30 will be described later in detail.

Each of the cameras IC, OC1, and OC2 and each of the lights IL1, IL2, and BL is provided in a hemispherical dome member (not shown) that opens on the stage side. This dome member is controlled so as to be movable in the plane direction along the plate surface of the printed board 10 to be mounted on the stage by the system board 20. [ In the inspection apparatus 1, the cameras IC, OC1 and OC2 and the respective lights IL1, IL2 and BL are integrated and moved as the dome member moves.

The inspection camera (IC) is provided in the dome member so as to be positioned above the stage, and picks up an area to be imaged on the printed board 10 immediately above. The first diagonal camera OC1 and the second diagonal camera OC2 are installed in the dome member so as to be positioned above the stage at an oblique angle and pick up an area at an obliquely upward position on the printed board 10 as an object to be imaged. The distances from the stage to the first diagonal cameras OC1 and the second diagonal cameras OC2 are equal to each other, and the imaging angles thereof are different. Further, the distance from the stage of the inspection camera (IC) is longer than the distance from the stage of the first diagonal camera OC1 and the second diagonal camera OC2.

In addition, in the system board 20, the mounted state of the electronic component 12 to be inspected is determined by using an image (hereinafter referred to as an inspection image) captured by the inspection camera (IC). On the other hand, an image (hereinafter referred to as a distorted image) captured by each of the observer cameras OC1 and OC2 is used to check the problem factor in detail when the mounting state of the electronic component 12 is poor.

Each of the lights IL1, IL2, and BL is an illuminating member that projects white light to the electronic component 12 in the area to be imaged on the printed board 10. [ Each of the lights IL1, IL2, and BL has the same brightness, an angle to illuminate the area to be imaged, and a distance from the stage to each other. Thus, a plurality of inspection images having different imaging conditions can be picked up with respect to the electronic component 12 on the area to be picked up.

In addition, each of the lights IL1, IL2, and BL forms an annular shape, and is provided on the inner side of the dome member at substantially equal intervals in the vertical direction so as to be concentric in plan view. Each of the illuminations IL1, IL2, and BL sequentially becomes the first inspection illuminant IL1, the second inspection illuminator IL2, and the combined illumination BL sequentially from the top.

The first inspection illumination IL1 and the second inspection illumination IL2 project light for imaging by the inspection camera IC onto an area to be imaged on the printed substrate 10, respectively. The first inspection illumination IL1 and the second inspection illumination IL2 are different in distance from the stage and the distance from the stage of the first inspection illumination IL1 is longer than the distance from the stage of the second inspection illumination IL2 .

The combined illumination BL projects light for imaging by each camera (IC, OC1, OC2) onto an area to be imaged on the printed board 10. The inspection camera IC described above is on the axis of each illumination IL1, IL2, BL forming the annular shape and is located above the first inspection illumination IL1. In each of the lights IL1, IL2, and BL, when a lighting signal outputted from the synchronous control device 30 is inputted, the lighting is performed only for a time (lighting time) equivalent to the length of the lighting signal.

(Electrical configuration of synchronous control device)

Next, the internal configuration of the synchronous control device 30 will be described. 2, the synchronous control device 30 includes an MPU 32, three illumination drive circuits 34A, 34B and 34C, an inspection camera drive circuit 36A, a strait camera drive circuit 36B . The MPU 32 includes a communication control circuit for communicating with the system board 20 through a LAN cable 22 in addition to the processor unit although not shown in the drawings and a lighting circuit for outputting a lighting signal to each of the lighting drive circuits 34A to 34C A control circuit 32A, and an image pickup control circuit 32B for outputting an image pickup signal to each of the camera drive circuits 36A to 36C.

Each of the lighting drive circuits 34A, 34B and 34C is electrically connected to each of the lights IL1, IL2 and BL by signal lines S1, S2 and S3 extended to the outside of the synchronous control device 30. [ Each of the lighting drive circuits 34A, 34B and 34C lights up the respective lights IL1, IL2 and BL in accordance with the lighting signal outputted from the MPU 32. [

The inspection camera drive circuit 36A is electrically connected to the inspection camera IC by a signal line S4 extended to the outside of the synchronous control device 30. [ The strait camera drive circuit 36B is electrically connected to the first and second strait cameras OC1 and OC2 by a signal line S5 extending out of the synchronous control device 30. [ Each of the camera drive circuits 36A and 36B drives the opening and closing of the shutter of each of the lights IL1, IL2 and BL in accordance with the image pickup signal outputted from the MPU 32. [

The image pickup control circuit 32A of the MPU 32 sets the exposure times of the cameras IC, OC1 and OC2 in accordance with the information given from the system board 20 in accordance with the image pickup program. This exposure time is different in the area to be imaged and in each of the cameras (IC, OC1, OC2). The image pickup control circuit 32A also outputs an image pickup signal having a pulse width of a length corresponding to the set exposure time to each of the cameras IC, OC1 and OC2 through the respective camera drive circuits 36A and 36B.

In the present embodiment, during the exposure time of each of the cameras (IC, OC1, OC2) at the point where the distance from the stage of the inspection camera (IC) is larger than the distance from the stage of each of the observer cameras OC1, OC2, ) Is set as the longest exposure time. In addition, the exposure time of the first and second diagonal cameras OC1 and OC2 is set by different exposure times.

The lighting control circuit 32B outputs a lighting signal to each of the lights IL1, IL2, and BL in accordance with the longest exposure time among the respective exposure times set in the cameras IC, OC1, and OC2. As described above, in the present embodiment, the light-up control circuit 32B has a light-up signal having a pulse width of a length corresponding to the exposure time of the inspection camera (IC) in that the exposure time of the inspection camera (IC) .

(Image pickup processing)

The inspection apparatus 1 of the present embodiment has the above-described structure. Next, the image pickup processing executed by the system board 20 and the inspection apparatus 1 will be described with reference to the flowchart shown in Fig. 3. The image pickup processing is processing for picking up an area to be picked up on the printed board 10 in accordance with the image pickup program. The image pickup process is performed before the solder reflow process of the printed circuit board 10 on which the electronic component 12 is mounted or after the solder reflow process and the printed circuit board 10 is mounted on the stage of the inspection apparatus 1 Program. The imaging program may be stored in advance in a part of the system board 20 or may be inputted by an operator.

In addition, the image pickup program is used to execute the imaging sequence of the area to be imaged on the printed board 10, which camera and illumination is used for the area to be imaged, and the image to be imaged , It includes information such as in which order the imaging is to be executed and whether or not the image should be picked up. In the inspection apparatus 1, when taking a photograph of a strabismic image, an image is taken by each of the observer cameras OC1 and OC2 together with the image of the inspection camera IC.

When the imaging process is started, the system board 20 first outputs a plurality of or a single imaging signal and a lighting signal to the MPU 32 of the inspection apparatus 1 for each area to be imaged in accordance with the imaging program. At this time, the system board 20 outputs the first imaging signal when imaging is performed only in the inspection camera IC using the first inspection illumination IL1, and the inspection camera 12 using the second inspection illumination IL2, (IC), the second image pickup signal is outputted, and when the imaging is performed to the observer cameras OC1 and OC2 together with the imaging by the inspection camera IC using the combined illumination BL (An example of a predetermined image pickup signal). When the inspection image is sensed multiple times for one area, the system board 20 sequentially outputs one of the respective imaging signals to the MPU 32 in accordance with the imaging program.

The system board 20 also has an upper surface of the stage so that the inspection camera (IC) is positioned immediately above the area to be imaged among the electronic components 12 on the printed board 10 mounted on the stage according to the imaging program A signal for moving the dome member described above is output to the inspection apparatus 1 in the planar direction along which the dome members are moved according to the signals so that the cameras IC, OC1 and OC2 are moved (S2).

Next, the MPU 32 determines whether the image pickup signal output from the system board 20 is the third image pickup signal (S4). When the MPU 32 determines that the image pickup signal is not the third image pickup signal (S4: NO), the MPU 32 proceeds to S6. If the MPU 32 determines that the imaging signal is the third imaging signal (S4: YES), the MPU 32 proceeds to S16.

In S6, the MPU 32 determines whether or not the image pickup signal outputted from the system board 20 is the second image pickup signal. When the MPU 32 determines that the image pickup signal is not the second image pickup signal (S6: NO), the MPU 32 proceeds to S8. When the MPU 32 determines that the image pickup signal is the second image pickup signal (S6: YES), the MPU 32 proceeds to S12.

In the case of an image pickup program for picking up an inspection image a plurality of times for one area, a plurality of image pickup signals are sequentially output to one area from the system board 20. When a plurality of imaging signals are output from the system board 20 to the area to be imaged, in steps S4 and S6, the MPU 32 determines whether or not the imaging signals outputted from the system board 20 It is determined with respect to the image pickup signal.

Therefore, for example, when the first imaging signal, the second imaging signal, and the third imaging signal are successively outputted from the system board 20 for one area to be imaged, the MPU 32 calculates, based on the first imaging signal Then, the imaging is performed based on the second imaging signal, and then the imaging is performed based on the third imaging signal.

In step S8, the MPU 32 sets the exposure time of the inspection camera IC according to the area to be imaged and sets the lighting time of the first inspection light IL1 in accordance with the exposure time of the inspection camera IC , And shifts to S10. In S10, the MPU 32 outputs an image pickup signal having a pulse width of a length corresponding to the set exposure time to the inspection camera drive circuit 36A, and simultaneously outputs a turn-on signal having a pulse width of a length corresponding to the set turn- And outputs it to the drive circuit 34A.

Thus, the illumination drive circuit 34A drives the first inspection illumination IL1 to light up in accordance with the inputted lighting signal, and in accordance with the imaging signal inputted at the same time, the inspection camera drive circuit 36A controls the inspection camera IC Thereby opening and closing the shutter. When the MPU 32 executes the process of S10, the process proceeds to S20.

In step S12, the MPU 32 sets the exposure time of the inspection camera (IC) according to the area to be imaged and sets the lighting time of the second inspection light IL2 in accordance with the exposure time of the inspection camera (IC) , And the process proceeds to S14. In S14, the MPU 32 outputs an image pickup signal having a pulse width of a length corresponding to the set exposure time to the inspection camera drive circuit 36A, and illuminates a lighting signal having a pulse width of a length corresponding to the set lighting time And outputs it to the drive circuit 34B.

Thereby, the illumination drive circuit 34B lights up the second inspection illumination IL2 in accordance with the inputted lighting signal, and in accordance with the imaging signal inputted at the same time, the inspection camera drive circuit 36A controls the inspection camera IC Thereby opening and closing the shutter. When the MPU 32 executes the process of S14, the process proceeds to S20.

In S16, the MPU 32 sets the exposure time of the inspection camera IC and each of the observer cameras OC1 and OC2 according to the area to be imaged. In this embodiment, the exposure time of the inspection camera (IC) is set as the longest exposure time among the exposure times of the cameras (IC, OC1, OC2). Further, in S16, the MPU 32 sets the lighting time of the dual use illumination BL in accordance with the exposure time of the set inspection camera (IC), and shifts to S18.

The MPU 32 outputs an imaging signal having a pulse width of a length corresponding to the exposure time of the set inspection camera IC to the inspection camera drive circuit 36A in S18, And outputs a lighting signal having a pulse width of a length corresponding to the set lighting time to the lighting drive circuit 34C .

The illumination drive circuit 34C lights up the combined illumination BL in accordance with the inputted lighting signal and the inspection camera drive circuit 36A detects the shutter of the inspection camera IC in accordance with the imaging signal inputted at the same time And the diaphragm camera drive 36B drives the shutters of the respective cameras OC1 and OC2 to open and close in accordance with the input imaging signal. When the MPU 32 executes the process of S18, the process proceeds to S20.

In S20, the MPU 32 determines whether or not the longest exposure time of the set exposure time has elapsed, that is, whether the exposure time of the inspection camera (IC) set after the imaging signal is outputted to the inspection camera drive circuit 36A . If the MPU 32 determines in S20 that the exposure time of the inspection camera IC has elapsed (S20: YES), the MPU 32 proceeds to S22. If the MPU 32 determines in S20 that the exposure time of the inspection camera IC has not elapsed (S20: NO), the MPU 32 repeatedly executes the process of S20 until the exposure time elapses.

In S22, the MPU 32 determines whether or not imaging of all inspection images has been completed for the area to be imaged. Here, when a plurality of imaging signals are outputted from the system board 20 to one area to be imaged, the MPU 32 determines whether imaging has been performed for all the imaging signals. When it is determined in S22 that imaging of all the inspection images is finished (S22: YES), the MPU 32 proceeds to S24. If it is determined in S22 that imaging of all the inspection images is not finished (S22: NO), the MPU 32 returns to S4.

In S24, the MPU 32 judges whether or not the imaging is completed for all the areas to be imaged on the printed board 10. If the MPU 32 determines in S24 that imaging has been completed for all the areas to be imaged (S24: YES), the MPU 32 ends the imaging process. If the MPU 32 determines in S24 that imaging has been completed for all the areas to be imaged (S24: NO), the MPU 32 returns to S2, and the inspection camera IC is positioned immediately above the area to be imaged next Move each camera (IC, OC1, OC2).

In addition, in the imaging processing, movement of the dome member may be performed while the imaging signals are outputted from the system board 20 to the MPU 32. [ In the imaging process, the MPU 32 sequentially outputs the sensed images to the system board 20. The system board 20 performs a process of moving the camera (IC, OC1, OC2) in S2 and / or after the end of the imaging process, when the MPU 32 receives the image picked up by the inspection apparatus 1 Image inspection processing is executed.

(Timing chart)

Here, each of the lights IL1, IL2, and BL when the first imaging signal, the second imaging signal, and the third imaging signal are sequentially output from the system board 20 to one area to be imaged, And a timing chart of each camera (IC, OC1, OC2) will be described with reference to Fig. In the timing chart shown in Fig. 5, the horizontal axis represents elapsed time.

5, the first inspection illumination IL1 is turned on by the first imaging signal outputted from the system board 20, and the shutter of the inspection camera IC is opened and the imaging of the inspection camera IC is executed do. Then, the lighting of the first inspection illumination IL1 is continued during the exposure time of the inspection camera (IC). That is, the shutter of the inspection camera IC is closed and the first inspection illumination IL1 is turned off.

Next, the second inspection illumination IL2 is turned on by the second imaging signal outputted from the system board 20, and at the same time, the shutter of the inspection camera IC is opened and the imaging by the inspection camera IC is performed. Then, the lighting of the second inspection illumination IL2 is continued during the exposure time of the inspection camera (IC). That is, the shutter of the inspection camera IC is closed and the second inspection illumination IL2 is turned off.

The combined illumination light BL is turned on by the third imaging signal outputted from the system board 20 and the shutter of the inspection camera IC and the shutter of the first diagonal camera OC1 and the second diagonal camera OC2 are turned on, And the imaging of the inspection camera IC and each of the observer cameras OC1 and OC2 is executed. Here, since the exposure time of the inspection camera IC is set to be longer than the exposure time of each of the oblique cameras OC1 and OC2, the shutter of the first diagonal camera OC1 and the shutter of the second diagonal camera OC2, (IC), and the shutter of the inspection camera (IC) is subsequently closed. Then, the lighting of the combined light BL continues during the exposure time of the inspection camera IC. That is, the shutter of the inspection camera IC is closed and the combined illumination BL is turned off.

(Image inspection processing)

Next, the image inspection process executed by the system board 20 will be described with reference to the flowchart shown in Fig. When the image processing is started, the system board 20 first executes the processing of the image on the inspected image based on the inspection standard (S32). Next, the system board 20 judges whether or not the electronic part 12 to be inspected in the inspection image introduced on the basis of the inspection standard input from the operator (or stored in advance) (S34).

If the system board 20 determines that the mounting state of the electronic component 12 to be inspected is good (S24: YES), if the electronic component 12 that has determined that the mounting state is good is picked up The slice image is deleted (S26), and the image checking process is terminated.

If the mounting state of the electronic component 12 to be inspected is not good (S34: NO), the system board 20 executes error processing as a mounting error of the electronic component 12 is detected (S26 ), The image inspection process is terminated. Here, the error process refers to stopping the operation of the inspection apparatus 1 or the like. When a strap-on image is picked up on the electronic component 12 on which the mounting error is detected, the strap screen is output from the inspection apparatus 1 to the system board 20 in order to elucidate the problem factors in detail.

(Effect of Embodiment)

As described above, in the inspection apparatus 1 of the mounting part of the present embodiment, the lighting signal is outputted to the combined illumination BL in accordance with the exposure time of the inspection camera (IC) having the longest exposure time, The lighting signal to the combined light BL and the imaging signal of the longest exposure time to the inspection camera IC are simultaneously outputted. Accordingly, the combined illumination BL is turned on in accordance with the longest exposure time. The imaging signals are also outputted to the respective oblique cameras OC1 and OC2 simultaneously so that the exposure ends in the lighting time of the combined illumination BL, Imaging is performed. That is, the imaging in the inspection camera (IC), which has the longest exposure time, is performed, the imaging is performed in each of the observer cameras OC1 and OC2.

As described above, in the inspecting apparatus for a mounting part of the present embodiment, it is possible to illuminate the combined illumination BL and capture images in the respective cameras (IC, OC1 and OC2) in accordance with the longest exposure time, It is possible to prevent or suppress the occurrence of a loss in the inspection time as compared with the conventional configuration in which the image pick-up operation is performed sequentially in the OC2. As a result, the inspection time can be shortened as compared with the conventional configuration.

In this embodiment, as described above, since the imaging signals are simultaneously output from the MPU 32 to the cameras (IC, OC1, OC2), a new circuit for measuring the elapsed time from the start of exposure in the inspection camera (IC) So that the configuration of the synchronous control device 30 can be simplified.

In this embodiment, a signal is input / output between the system board 20 and the synchronous control device 30 by serial communication. With such a configuration, serial communication can be realized between the system board 20 and the synchronous control device 30 while simultaneously outputting the image pickup signals to the respective cameras (IC, OC1, OC2) from the synchronous control device 30, It is possible to reduce the wiring and the cost as compared with the case where the system board 20 is controlled by the parallel communication between the cameras (IC, OC1, OC2).

Further, in the present embodiment, the inspection apparatus 1 is provided with the combined light BL for projecting the light also serving as the light for imaging by each of the cameras (IC, OC1, OC2) It is not necessary to control a plurality of illuminating devices as compared with the configuration in which the illumination devices for the respective cameras (IC, OC1, OC2) are individually controlled, and the inspection time can be shortened.

<Other Embodiments>

The present invention is not limited to the embodiments described with reference to the above description and drawings, but the following embodiments are also included in the technical scope of the present invention.

(1) In the above embodiment, the inspection camera in which the longest exposure time is set from the MPU of the synchronous control device and the configuration in which the imaging signal is simultaneously outputted to each of the oblique cameras is exemplified. However, And the image pickup signals are outputted synchronously with respect to each of the perspective cameras. That is, the imaging signal is outputted to each of the oblique cameras at the timing deviated from the inspection camera so that the imaging in each of the oblique cameras ends in the lighting time of the combined illumination based on the inspection camera in which the longest exposure time is set .

(2) In the above embodiment, a configuration in which the imaging signal and the lighting signal are simultaneously outputted to the inspection camera and the combined illumination are exemplified. However, depending on the responsiveness of the inspection camera and the responsiveness of the combined illumination, The lighting signal may be output to the inspection camera before the lighting signal is output to the combined illumination.

(3) In the above embodiment, the system board, which is an example of the image processing apparatus, has a chain configuration different from that of the inspection apparatus, but the image processing apparatus may be a part of the inspection apparatus.

(4) In the above-described embodiment, a configuration including one inspection camera and two cameras is exemplified. However, the number of the inspection cameras and the number of the cameras are not limited.

(5) In the above embodiment, the configuration including two inspection lights and one combined light is illustrated, but the number of inspection lights and the number of combined lights are not limited.

(6) In the above embodiment, the first imaging signal, the second imaging signal and the third imaging signal are exemplified as the imaging signals, but the types of imaging signals and the like are not limited.

The embodiments of the present invention have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The techniques described in the claims include various modifications and changes to the specific examples described above.

One… Inspection device
10 ... Printed board
12 ... Electronic parts
20 ... System board
22 ... LAN cable
30 ... Synchronous control device
32 ... MPU
34A, 34B, 34C ... Lighting drive circuit
36A ... Inspection camera drive circuit
36B ... Strap camera drive circuit
IC ... Inspection camera
OC1 ... First strap camera
OC2 ... Second strap camera
IL1 ... 1st inspection light
IL2 ... Second inspection light
BL ... Combination lighting
S1 to S6 ... Signal line

Claims (3)

An inspection apparatus for a mounting component that images a component mounted on a substrate in accordance with an image pickup signal outputted from an image processing apparatus and inspects the mounting state of the component by introducing an image of the picked-up component into the image processing apparatus ,
A plurality of imaging devices for imaging the components in a plurality of directions with different imaging angles;
An illumination device for projecting light for imaging by the plurality of imaging devices onto the component;
And a synchronous control device for controlling each of the plurality of image pickup devices and the illuminating device in synchronism with each other,
The synchronous control device comprising: a lighting control circuit for outputting a lighting signal to the lighting device in accordance with the longest exposure time among the respective exposure times set in the plurality of image pickup devices; and a lighting control circuit for outputting an imaging signal for performing imaging by the imaging device And an image pickup control circuit for outputting the light emission signal from the light emission control circuit when a predetermined image pickup signal is inputted and for outputting the image pickup control circuit to the image pickup apparatus and other image pickup apparatuses having the longest exposure time, An apparatus for inspecting a mounted component in which signals are output synchronously. The method according to claim 1,
Wherein the synchronization control device simultaneously outputs the imaging signal to the imaging device and the other imaging device having the longest exposure time from the imaging control circuit. 3. The method according to claim 1 or 2,
Wherein a signal is input / output by serial communication between the image processing apparatus and the synchronous control apparatus.

Images