CN113109350A - Detection method, system, device and computer readable storage medium - Google Patents
Detection method, system, device and computer readable storage medium Download PDFInfo
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- CN113109350A CN113109350A CN202110309782.7A CN202110309782A CN113109350A CN 113109350 A CN113109350 A CN 113109350A CN 202110309782 A CN202110309782 A CN 202110309782A CN 113109350 A CN113109350 A CN 113109350A
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract
The application provides a detection method, a system, equipment and a computer readable storage medium, wherein the method comprises the following steps: controlling a laser light source to emit laser and irradiating the surface of the piece to be detected to form a laser spot; controlling the piece to be detected to move relative to the laser, and detecting a first position of a laser spot on the piece to be detected in real time; when the first position is located in a to-be-detected area of the to-be-detected piece, controlling a shutter for shielding laser to be opened, and when the first position is located in a non-detection area of the to-be-detected piece, controlling the shutter to be closed; and receiving detection information of the area to be detected, and judging whether the area to be detected has defects according to the detection information. To sum up, this application controls the shutter through judging the position relation of first position and the region to be measured of the piece that awaits measuring, non-detection area and opens or close and make laser shine the surface of the piece that awaits measuring with the selectivity, when avoiding non-detection area to rotate to the within range of first position, forms the facula after non-detection area receives laser irradiation, influences the piece that awaits measuring and detects the accuracy.
Description
Technical Field
The present application relates to the field of electronic device detection, and in particular, to a detection method, system, device, and computer-readable storage medium.
Background
The device under test is one of the industrial terms in the microelectronic industry. High purity silicon (purity, 99.99.. 99, 9-11 after decimal point, 9) is typically made into cylindrical rods of 6 inches, 8 inches, or 12 inches in diameter.
The silicon rods are cut into extremely thin silicon wafers (circles) by laser in integrated circuit production enterprises, then circuits and electronic components are manufactured on the silicon wafers by optical and chemical etching methods, a large number of semiconductor chips (3000 plus 5000 chips can be arranged on each chip if a small-scale circuit or a triode) are manufactured on each silicon wafer, and the processed circular silicon wafers are to-be-detected pieces.
The piece to be tested is the most basic semiconductor material for manufacturing the IC, and the quality of the piece to be tested directly determines the quality of the finished IC product. Due to different process levels, the part to be tested may generate three defects, namely redundancy, crystal defect and mechanical damage in the production stage. Therefore, the efficient and accurate detection equipment can provide high-reliability material to be detected. Compared with the traditional manual detection, the machine vision detection has the advantages of high precision, high efficiency, continuity, non-contact pollution avoidance and the like.
In the related art, a detection device is generally used to detect the quality of a workpiece. Specifically, the detection device is a device for detecting surface defects of the piece to be detected, and the detection device mainly detects the appearance of the piece to be detected after cutting, such as: size, breakage, cracking, porosity, cracking, poor nickel coating, and the like.
At present, detection device mainly includes laser light source, detection device and bears the device, when examining to the piece that awaits measuring, the piece that awaits measuring is placed on bearing the device to follow and bear the device and rotate jointly, the laser light that laser light source sent shines on the piece that awaits measuring, and detect the piece that awaits measuring through detection device.
The specific detection process or detection principle of the detection is as follows: the surface of the piece to be measured is irradiated by laser rays, then image information of the piece to be measured is collected, and the image information is compared with defect characteristics, so that the defect condition of the surface of the piece to be measured is judged, the quality control of the piece to be measured is realized, and the piece to be measured with poor quality before the piece to be measured is packaged is avoided.
In the existing detection process, only some areas on the to-be-detected piece are required to be detected, namely, the to-be-detected piece is provided with an area to be detected and a non-detection area which is not required to be detected. However, when the laser light emitted from the laser light source irradiates the non-detection area, the detection device also detects the non-detection area, so that the detection efficiency is low.
Disclosure of Invention
In view of the foregoing, there is a need for a detection method, system, device and computer readable storage medium, which can improve the accuracy of detection.
In a first aspect, an embodiment of the present application provides a detection method, which is applied to a detection device, and the method includes:
controlling a laser light source to emit laser and irradiating the surface of the piece to be detected to form a laser spot;
controlling a piece to be detected to move relative to the laser, and detecting a first position of the laser spot on the piece to be detected in real time;
when the first position is located in a to-be-detected area of the to-be-detected piece, controlling a shutter for shielding laser to be opened, and when the first position is located in a non-detection area of the to-be-detected piece, controlling the shutter to be closed;
and receiving detection information of the area to be detected, and judging whether the area to be detected has defects according to the detection information.
In one embodiment, the controlling the movement of the object to be measured with respect to the laser and detecting the first position of the laser spot on the object to be measured in real time further includes:
and determining a to-be-detected area and a non-detection area of the surface of the to-be-detected piece.
In one embodiment, the determining the area to be detected and the non-detection area of the surface of the workpiece includes:
acquiring a surface image of a piece to be detected through an image acquisition component to determine a region to be detected and a non-detection region;
or, determining the region to be detected and the non-detection region according to the detection information of the piece to be detected to the laser;
or determining the area to be detected and the non-detection area according to preset parameters.
In one embodiment, the real-time detecting the first position of the laser spot on the workpiece includes:
determining a first position of a laser spot according to an emergent angle of a laser light source and a relative position of the laser light source and a bearing device for fixing a piece to be detected;
or, the first position of the laser spot on the piece to be detected is acquired through the image acquisition unit.
In one embodiment, the controlling the shutter for blocking the laser to open when the first position is located in the region to be detected of the object to be detected, and controlling the shutter to close when the first position is located in the non-detection region of the object to be detected includes:
determining a first position coding range of a region to be detected of the piece to be detected and a second position coding range of a non-detection region;
and when the position code corresponding to the first position is located in the first position code range, controlling the shutter to be opened, and when the position code corresponding to the first position is located in the second position code range, controlling the shutter to be closed.
In a second aspect, an embodiment of the present application provides a detection system, including:
the laser unit is used for controlling the laser light source to emit laser and irradiating the surface of the piece to be detected to form a laser spot;
the moving unit is used for controlling the piece to be detected to move relative to the laser and detecting the first position of the laser spot on the piece to be detected in real time;
the area detection unit detects the first position of the laser spot on the piece to be detected in real time;
the shutter control unit is used for controlling the shutter for shielding laser to be opened when the first position is located in the area to be detected of the piece to be detected, and controlling the shutter to be closed when the first position is located in the non-detection area of the piece to be detected;
and the light detection unit is used for receiving the detection information of the area to be detected and judging whether the area to be detected has defects according to the detection information.
In a third aspect, an embodiment of the present application provides a detection apparatus, including:
the bearing device is used for bearing the piece to be tested;
the laser light source comprises a laser emitting unit and a shutter, wherein the laser emitting unit emits laser to the surface of the piece to be detected and forms a laser spot, and the shutter is used for allowing or blocking the laser to be emitted to the surface of the piece to be detected;
the driving mechanism is used for driving the bearing device or the laser emitting unit to move;
the position detection unit is used for detecting the first position of the laser spot on the piece to be detected in real time;
the processor is used for controlling the shutter for shielding the laser to be opened when the first position is located in the region to be detected of the part to be detected, and controlling the shutter to be closed when the first position is located in the non-detection region of the part to be detected;
and the image detection unit is used for receiving the detection information of the area to be detected and judging whether the area to be detected has defects according to the detection information.
In an embodiment, the position detection unit is configured to determine a to-be-detected region and a non-detected region on the surface of the to-be-detected piece after detecting the first position of the laser spot on the to-be-detected piece in real time.
In one embodiment, the determining the region to be detected and the non-detection region on the surface of the object by the position detecting unit includes: acquiring a surface image of a piece to be detected through an image acquisition component to determine a region to be detected and a non-detection region;
or, determining the region to be detected and the non-detection region according to the detection information of the piece to be detected to the laser;
or determining the area to be detected and the non-detection area according to preset parameters.
In one embodiment, the detecting the first position of the laser spot on the workpiece in real time by the position detecting unit includes: determining a first position of a laser spot according to an emergent angle of a laser light source and a relative position of the laser light source and a bearing device for fixing a piece to be detected;
or, the first position of the laser spot on the piece to be detected is acquired through the image acquisition unit.
In one embodiment, the processor is configured to control the shutter for blocking the laser to open when the first position is located in a region to be detected of the device under test, and control the shutter to close when the first position is located in a non-detection region of the device under test, including:
determining a first position coding range of a region to be detected of the piece to be detected and a second position coding range of a non-detection region;
and when the position code corresponding to the first position is located in the first position code range, controlling the shutter to be opened, and when the position code corresponding to the first position is located in the second position code range, controlling the shutter to be closed.
In a fourth aspect, the present application provides a computer readable storage medium having stored thereon a program executable by a processor to perform the above method.
The invention has the beneficial effects that:
the application provides a detection method, a system, a device and a computer readable storage medium, wherein the detection method comprises the following steps: controlling a laser light source to emit laser and irradiating the surface of the piece to be detected to form a laser spot; controlling the piece to be detected to move relative to the laser, and detecting a first position of a laser spot on the piece to be detected in real time; when the first position is located in a to-be-detected area of the to-be-detected piece, controlling a shutter for shielding laser to be opened, and when the first position is located in a non-detection area of the to-be-detected piece, controlling the shutter to be closed; and receiving detection information of the area to be detected, and judging whether the area to be detected has defects according to the detection information, thereby effectively judging whether the surface of the piece to be detected has defects. In addition, the detection method detects the first position of the laser spot on the piece to be detected in real time; when the first position is located in a to-be-detected area of a to-be-detected piece, the shutter for shielding laser is controlled to be opened, when the first position is located in a non-detection area of the to-be-detected piece, the shutter is controlled to be closed, so that the laser irradiates the surface of the to-be-detected piece or the laser is shielded to irradiate the surface of the to-be-detected piece, namely, the shutter is controlled to be opened or closed to selectively irradiate the laser to the surface of the to-be-detected piece by judging the position relation between the first position of a laser spot on the to-be-detected piece and the to-be-detected area of the to-be-detected piece, and therefore the problem that the detection efficiency is low is caused because the laser irradiated light.
Drawings
Fig. 1 is a flowchart of a detection method provided in an embodiment of the present application;
fig. 2 is a circuit structure diagram of a detection apparatus provided in an embodiment of the present application;
fig. 3a to fig. 3b are schematic diagrams illustrating an exit angle of a laser light source on a to-be-tested object according to an embodiment of the present disclosure;
fig. 4 a-4 b are schematic diagrams illustrating a relative position between a first position of a laser spot and a non-detection region of a device under test according to an embodiment of the present disclosure.
Description of reference numerals:
100-a laser unit; 200-a mobile unit; 300-area detection unit; 400-shutter control unit; 500-a light detection unit;
10-a detection device; 11-a carrier; 12-a laser light source; 121-a laser emitting unit; 122-a shutter; 13-a position detection unit; 14-a drive mechanism; 15-a processor; 16-image detection unit.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The terms "connected" and "connected," when used in this application, include both direct and indirect connections (or communications), unless otherwise indicated.
The application provides a detection method and a detection system, which are applied to detection equipment, wherein the detection equipment is used for detecting whether the surface of a piece to be detected has defects or not. Generally, the detection device includes a carrying device, a detection device, a laser light source, and the like; the laser light source emits laser to the piece to be detected so that a light spot is generated on the surface of the piece to be detected, and the detection device detects the area where the light spot is located so as to judge the surface defect of the piece to be detected.
Generally, the device under test has a region under test where detection is required and a non-detection region where detection is not required. When the laser light emitted by the laser light source irradiates the non-detection area, the detection device still detects the non-detection area, and the detection of the non-detection area which does not need to be detected causes cost waste and affects the detection efficiency.
Therefore, the application provides a detection method, which is applied to detection equipment, and the detection equipment detects the defects on the surface of the piece to be detected so as to ensure the quality of the piece to be detected. In this embodiment, the device under test may be a wafer or a substrate made of other materials. The detection method provided by the application can timely stop laser irradiation when the to-be-detected part rotates to the non-detection area and is located in the laser spot range, so that the problem that the detection efficiency is low due to the fact that the laser irradiation light spot still detects the non-detection area through the detection equipment after passing through the non-detection area is solved.
As shown in fig. 1, the detection method includes the following steps: the detection equipment controls the laser light source to emit laser and irradiates the surface of the piece to be detected to form a laser spot; controlling the piece to be detected to move relative to the laser, and detecting a first position of a laser spot on the piece to be detected in real time; when the first position is located in a to-be-detected area of the to-be-detected piece, controlling a shutter for shielding laser to be opened, and when the first position is located in a non-detection area of the to-be-detected piece, controlling the shutter to be closed; and receiving detection information of the area to be detected, and judging whether the area to be detected has defects according to the detection information, thereby effectively judging whether the surface of the piece to be detected has defects.
In addition, the detection method detects the first position of the laser spot on the piece to be detected in real time; when the first position is located in a to-be-detected area of a to-be-detected piece, the shutter for shielding laser is controlled to be opened, when the first position is located in a non-detection area of the to-be-detected piece, the shutter is controlled to be closed, so that the laser irradiates the surface of the to-be-detected piece or the laser is shielded to irradiate the surface of the to-be-detected piece, namely, the shutter is controlled to be opened or closed by judging the position relation between the first position of a laser spot on the to-be-detected piece and the to-be-detected area of the to-be-detected piece and the position relation between the first position of the laser spot and the to-be-detected area and the position relation between the first position and the non-detection area, so.
In this embodiment, the determination of the position relationship between the non-detection region and the first position of the laser spot to select whether to open or close the shutter is based on the following: judging whether the first position of the laser spot covers the non-detection area; if yes, controlling a shutter for shielding the laser to close; if not, the shutter for blocking the laser is controlled to be opened. When the to-be-detected piece rotates and the first position of the laser spot is located outside the non-detection area, namely the laser cannot be projected onto the non-detection area, the shutter can be opened at the moment so that the laser irradiates the to-be-detected area on the surface of the to-be-detected piece; when the piece to be measured rotates to the first position of the laser spot and is located in the non-detection area, namely the laser light can irradiate to any position of the non-detection area, the shutter is closed, so that the laser is shielded from irradiating to the piece to be measured.
In addition, in this embodiment, the laser light source is in a normally open state, that is, the laser light source always emits laser light, so when the shutter is opened so as not to shield the laser light, the laser light is irradiated onto the surface of the region to be detected and/or the non-detection region of the workpiece, and when the shutter is closed, the shutter shields the laser light, thereby preventing the laser light from being irradiated onto the region to be detected and/or the non-detection region of the workpiece. That is to say, in this embodiment, the laser itself is in a state of always irradiating, and only when the to-be-detected piece rotates to the first position of the laser spot and is in the non-detection area, the laser is blocked by the shutter, and the surface of the to-be-detected piece is not irradiated by the laser, so that the detection efficiency is prevented from being affected after the laser is irradiated on the non-detection area; and the part to be measured is always in the rotating process, when the part to be measured rotates until the first position of the laser spot is positioned outside the non-detection area, the shutter is opened to enable the part to be measured not to shield the laser, and the laser can irradiate the area to be measured of the part to be measured.
It should be noted that the laser used for irradiating the laser onto the workpiece may specifically be ultraviolet, the intensity of the irradiated ultraviolet may also be changed according to actual needs, for example, light source parameters of the ultraviolet light source may be changed according to specifications of the workpiece, processing conditions, different intensities of the laser suitable for processing, and the like, and the changing method may be to provide a beam splitter to change the irradiation intensity of the ultraviolet light. The specific ultraviolet intensity is set according to actual needs, and this embodiment is not particularly limited thereto.
In addition, the detection method of this application, control to await measuring a removal for the laser to real-time detection laser facula is at the first position on the piece that awaits measuring, later still includes: and determining a to-be-detected area and a non-detection area of the surface of the to-be-detected piece.
For example, the area to be detected and the non-detection area on the surface of the object to be detected may be obtained by an image acquisition method, and for example, the non-detection area on the surface of the object to be detected may be subjected to area marking before detection, so that the area range of the area to be detected and the area range of the non-detection area may be obtained when the image acquisition component is used to acquire the image of the surface of the object to be detected.
Specifically, the mode of acquiring the area range of the area to be detected and the area range of the non-detection area when the image acquisition component acquires the image of the surface of the piece to be detected is as follows: acquiring a surface image of a piece to be detected by an image acquisition device and outputting the surface image, wherein the image acquisition device is a camera and the like; receiving marking information of a user on the surface image; and determining the area to be detected and the non-detection area according to the marking information.
For example, the region to be detected and the non-detection region on the surface of the workpiece can be obtained, and the region to be detected and the non-detection region can be determined according to the detection information of the workpiece to be detected on the laser. For example, before formal detection, laser irradiation is performed on the surface of the to-be-detected piece, and the to-be-detected area and the non-detected area are determined according to detection information of different areas of the surface of the to-be-detected piece after the laser irradiation is performed on the to-be-detected area and the non-detected area on the surface of the to-be-detected piece.
For example, the region to be detected and the non-detection region on the surface of the workpiece may be determined according to preset parameters. For example, before detection, the region to be detected and the non-detection region on the surface of the workpiece to be detected are determined according to preset parameters. For example, the non-detection area is annular, and the position area can be determined according to preset parameters such as the inner diameter and the outer diameter of the annular non-detection area; or, as shown in fig. 4, the non-detection area is circular, and the position relationship thereof may be determined according to preset parameters such as the circle center position and the radius of the non-detection area; or, if the non-detection area is in an arbitrary shape, the location area may be determined according to preset parameters of each location point in the arbitrary shape.
The inspection method of the present embodiment is mainly used for inspecting a workpiece, but the method of the present embodiment may be used for inspecting a surface of a plate-like member such as a semiconductor substrate made of a semiconductor material or a piezoelectric substrate made of a piezoelectric material. Illustratively, the semiconductor substrate may be made of a crystalline material having a crystalline structure.
Further, the real-time detection of the first position of the laser spot on the workpiece to be tested comprises: determining a first position of a laser spot according to the emergent angle of the laser light source and the relative position of the laser light source and a bearing device for fixing a piece to be detected; or, the first position of the laser spot on the piece to be detected is acquired through the image acquisition unit.
For example, as shown in fig. 3a, the emitting angle of the laser light source is 90 °, that is, the laser light is vertically irradiated onto the to-be-measured object; alternatively, as shown in fig. 3b, the emitting angle of the laser source is an arbitrary angle a, and the position of the laser source irradiated on the workpiece is related to the angle a and the distance H between the laser source and the workpiece. For example, assuming that a coordinate system is established with the center of the workpiece as an origin, when the initial emitting angle of the laser source is a, and the relative coordinate of the laser source on the coordinate system is (x, y), the relative coordinate of the first position of the laser spot on the coordinate system is (x1, y1), x1 is x + H tana, and y1 is y.
For example, as shown in fig. 4a and 4b, fig. 4a and 4b illustrate schematic views of a device under test provided with a circular non-detection region, where the circular region on the device under test is the non-detection region, and the region outside the circular region is the region under test. In one example, it is assumed that a coordinate system is established with the center of the workpiece as an origin, the emitting angle of the laser light source is a, and the coordinate of the first position of the laser spot on the coordinate system at this time is o (x1, y 1). The center of the non-detection area is located at a coordinate p (x2, y2) in the coordinate system, where the radius of the non-detection area is r. As shown in fig. 4b, when the first position o (x1, y1) of the laser spot is in the non-detection area with coordinates of (x2, y2) and radius of r, the laser is blocked by the shutter, and the surface of the device under test is not irradiated by the laser, so that the detection efficiency is prevented from being affected after the laser is irradiated on the non-detection area; with the rotation of the device under test, as shown in fig. 4a, when the first position o (x1, y1) of the laser spot is outside the non-detection area with the coordinate p (x2, y2) and the radius r, the shutter is opened to not block the laser, and the laser irradiates the region under test of the device under test. In addition, for examples in which the non-detection region has another shape, the above examples can be referred to.
For another example, the first position of the laser spot on the to-be-detected piece can be directly acquired through the image acquisition unit, so that the first position of the laser spot can be directly acquired. And the image acquisition component, such as a camera, acquires an image and acquires a first position of the laser spot on the to-be-detected piece. The specific structural model of the camera is selected according to actual needs, and this embodiment does not limit this.
In detail, in this embodiment, when the first position is located in the region to be detected of the device to be detected, the method for controlling the shutter to be opened to block the laser light, and when the first position is located in the non-detection region of the device to be detected, the method for controlling the shutter to be closed includes:
determining a first position coding range of a region to be detected of the piece to be detected and a second position coding range of a non-detection region; and when the position code corresponding to the first position is in the first position code range, controlling the shutter to be opened, and when the position code corresponding to the first position is in the second position code range, controlling the shutter to be closed.
As described above, after the region to be detected and the non-detection region on the surface of the object are subjected to position or region division, the region to be detected may be subjected to position coding by a coding element such as an encoder to obtain a first position coding range of the region to be detected, then the non-detection region may be subjected to position coding to obtain a second position coding range of the non-detection region, and then whether to control the shutter to close is selected by determining a relative relationship between the first position of the laser spot and the first position coding range or the second position coding range in a process of gradually changing the relative positions of the object and the laser light source. For example, when the first position of the laser spot is coincident with the first position code of the region to be detected, the shutter is opened to perform laser irradiation; when the first position of the laser spot coincides with the second position-coding portion of the non-detection area, it is determined that the laser is irradiated to at least part of the non-detection area, and the shutter is controlled to be closed.
Based on the detection method, the application provides a detection system for accurately detecting the to-be-detected piece.
As shown in fig. 2, the detection system includes: a laser unit 100, a moving unit 200, an area detection unit 300, a shutter control unit 400, and a light detection unit 500.
The laser unit 100 controls a laser light source to emit laser and irradiates the surface of a workpiece to be measured to form a laser spot; the moving unit 200 controls the workpiece to move relative to the laser; the area detection unit 300 detects a first position of a laser spot on a to-be-detected piece in real time; the shutter control unit 400 is used for controlling the shutter for shielding the laser to be opened when the first position is located in the region to be detected of the piece to be detected, and controlling the shutter to be closed when the first position is located in the non-detection region of the piece to be detected; the light detection unit 500 receives the detection information of the region to be detected, and judges whether the region to be detected has defects according to the detection information, so that whether the surface of the piece to be detected has defects or not is effectively judged.
The procedure for detection can be exemplarily explained as follows: the piece to be measured is mounted on the bearing device, then the bearing device can move along the vertical direction or the left and right direction or the combination of the vertical direction and the left and right direction, and the piece to be measured rotates by taking the center of the piece to be measured as an axis. Then, laser is irradiated on the piece to be detected, and whether certain defects exist in the piece to be detected is analyzed according to the collected detection information.
In addition, in the detection system of the present application, the area detection unit 300 detects the first position of the laser spot on the to-be-detected object in real time; when the first position is located in a to-be-detected area of a to-be-detected piece, the shutter control unit 400 controls the shutter for shielding laser to be opened, and when the first position is located in a non-detection area of the to-be-detected piece, the shutter is controlled to be closed, so that the laser irradiates the surface of the to-be-detected piece or the laser is shielded to irradiate the surface of the to-be-detected piece, namely, the shutter is controlled to be opened or closed by judging the position relation between the first position of a laser spot on the to-be-detected piece and the to-be-detected area of the to-be-detected piece and the position relation between the first position and the non-detection area to selectively irradiate the laser onto the surface of the to-be-detected piece, so that.
In this embodiment, the determination of the position relationship between the non-detection region and the first position of the laser spot to select whether to open or close the shutter is based on the following: the shutter control unit 400 determines whether the first position of the laser spot covers the non-detection area; if yes, controlling a shutter for shielding the laser to close; if not, the shutter for blocking the laser is controlled to be opened. When the to-be-detected part rotates to the position where the non-detection area is completely outside the first position range of the laser spot, namely the laser cannot be projected onto the non-detection area, the shutter can be opened to enable the laser to irradiate the to-be-detected area on the surface of the to-be-detected part; when the to-be-detected part rotates to the position where the non-detection area is located in the first position range of the laser spot, namely the laser light can irradiate any position of the non-detection area, the shutter is closed so as to shield the laser from irradiating the to-be-detected part.
In addition, as shown in fig. 2 to fig. 3b, the present application further provides a detection apparatus 10 for detecting whether there is a defect on the surface of the object. Specifically, the detection apparatus 10 includes a carrier 11, a laser light source 12, a position detection unit 13, a drive mechanism 14, a processor 15, and an image detection unit 16. The piece to be detected is fixed on the bearing device 11, the laser light source 12 emits laser to the piece to be detected and generates laser spots, and the image detection unit 16 analyzes detection information of the area to be detected to judge which defects exist in the piece to be detected. The position detection unit 13 is configured to detect a first position of a laser spot on the to-be-detected part in real time, and the driving mechanism 14 is configured to change a position between the to-be-detected part and the laser light source 12, so that the to-be-detected part can be entirely covered and irradiated by laser light emitted by the laser light source 12. The processor 15 can control whether the laser light source 12 emits light to the surface of the workpiece.
Specifically, the laser light source 12 may emit ultraviolet rays or the like, and the laser light source 12 may be, for example, an ultraviolet ray emitter or the like. The bearing device 11 includes, for example, a base for bearing the to-be-tested object and a plurality of limiting members for limiting the to-be-tested object, where a specific limiting member may be a clamping jaw or a buckle, and the like, for rotatably fixing the to-be-tested object on the base, and the limiting member may be made of metal or plastic material. The image detection unit 16 is configured to compare the received detection information with the defect feature image to determine whether and what kind of defects exist in the to-be-detected object. The driving mechanism 14 is used for changing the position relationship between the object to be measured and the laser light source 12, such as a slide rail and a driving motor. The processor 15 may be a processor commonly used in the related art.
The laser light source 12 includes a laser emitting unit 121 for emitting laser to the surface of the object and forming a laser spot, and a shutter 122 for controlling whether to block the laser from emitting to the surface of the object, the laser emitting unit 121 can emit laser under the control of the processor 15 and irradiate the laser spot on the object to be detected, the position of the laser on the object to be detected is determined by the laser spot, and in addition, the shutter 122 is disposed in the laser emitting unit 121 or at the light emitting position for allowing the laser to emit or block the laser under the control of the processor 15. As for the specific structure of the shutter 122 and the laser emitting unit 121, reference may be made to the structure known in the art, and this embodiment is not particularly limited thereto.
The driving mechanism 14 is used for driving the carrying device 11 or the laser emitting unit 121 to move under the control of the processor 15, so that the laser traverses at least part of the region to be detected and the non-detection region of the piece to be detected. For example, the driving mechanism 14 may include a slide rail and a driving motor, and the laser emitting unit 121 may be in transmission connection with the driving motor and move along the slide rail under the driving of the driving motor, so as to change the relative position between the laser emitting unit and the object to be measured; or the driving motor is in power connection with the bearing device 11 or the piece to be detected and is used for driving the piece to be detected or the bearing device 11 to rotate along the center of the piece to be detected or the bearing device 11; or the driving motor drives the laser emitting unit 121 to linearly move along the slide rail and simultaneously drives the to-be-detected piece or the bearing device 11 to rotate, so that the relative position between the to-be-detected piece and the laser is changed, the laser traverses the surface of the to-be-detected piece, the laser irradiates the surface of the to-be-detected piece, and the processor 15 can judge the defect condition of the surface of the to-be-detected piece according to the received detection information.
In addition, because the to-be-detected area exists on the to-be-detected piece, when the to-be-detected piece changes position relative to the laser, the non-detection area may be irradiated by the laser, so that the problem of low detection efficiency caused by the fact that the non-detection area is still detected by the detection equipment after the laser irradiated light spot passes through the non-detection area is solved. In this embodiment, the processor 15 is configured to control the shutter 122 for shielding the laser to open when the first position of the laser spot is located in the region to be detected of the to-be-detected member, and control the shutter 122 to close when the first position is located in the non-detection region of the to-be-detected member, that is, the processor 15 controls the shutter 122 for shielding the laser to open or close, so that the laser irradiates the surface of the to-be-detected member or the laser irradiates the surface of the to-be-detected member.
The position detection unit 13 detects the relationship between the non-detection area and the first position of the laser spot in real time, so that the processor 15 determines whether the shutter 122 for blocking the laser is opened or closed according to the position relationship, so that the laser is irradiated onto the surface of the workpiece or the laser is blocked from being irradiated onto the surface of the workpiece. Specifically, the processor 15 determines whether the laser light is irradiated to at least a part of the non-detection region; if yes, controlling a shutter 122 for blocking the laser to close; if not, the shutter 122 for blocking the laser beam is controlled to be opened.
In addition, the driving mechanism 14 controls the movement of the object to be measured relative to the laser, and the position detecting unit 13 detects the first position of the laser spot on the object to be measured in real time, and then further includes: and determining a to-be-detected area and a non-detection area of the surface of the to-be-detected piece.
For example, the position detection unit 13 may obtain the to-be-detected region and the non-detection region of the surface of the to-be-detected object by, for example, an image acquisition method, and for example, the surface of the to-be-detected object has the non-detection region, and the non-detection region may be subjected to region marking before detection, so as to obtain the region range of the to-be-detected region and the non-detection region when the image acquisition component is used to acquire the image of the surface of the to-be-detected object.
For example, the position detection unit 13 may obtain the to-be-detected region and the non-detection region on the surface of the to-be-detected piece, and determine the to-be-detected region and the non-detection region according to the detection information of the to-be-detected piece on the laser. For example, before formal detection, laser irradiation is performed on the surface of the to-be-detected piece, and the to-be-detected area and the non-detection area are determined according to different light spots formed after the laser irradiation is performed on the to-be-detected area and the non-detection area on the surface of the to-be-detected piece.
For example, the position detection unit 13 may obtain the region to be detected and the non-detection region of the surface of the workpiece according to preset parameters. For example, before the detection of the piece to be detected, the area to be detected and the non-detection area on the surface of the piece to be detected are determined according to preset parameters. For example, the non-detection area is annular, and the position area can be determined according to preset parameters such as the inner diameter and the outer diameter of the annular non-detection area; or, the non-detection area is circular, and the position relation can be determined according to preset parameters such as the circle center position, the radius and the like of the non-detection area; or, if the non-detection area is in an arbitrary shape, the location area may be determined according to preset parameters of each location point in the arbitrary shape.
Further, the real-time detection of the first position of the laser spot on the workpiece by the position detection unit 13 includes: determining a first position of a laser spot according to the emergent angle of the laser source and the relative position of the laser source and a bearing device 11 for fixing a piece to be detected; or, the first position of the laser spot on the piece to be detected is acquired through the image acquisition unit.
For example, as shown in fig. 3a, the emitting angle of the laser light source is 90 °, that is, the laser light is vertically irradiated onto the to-be-measured object; alternatively, as shown in fig. 3b, the emitting angle of the laser source is an arbitrary angle a, and the position of the laser source irradiated on the workpiece is related to the angle a and the distance H between the laser source and the workpiece. And then determining the relative position of the bearing device, for example, determining the initial position of the to-be-detected piece or the bearing device before rotation by establishing relative coordinates, and determining the relative position of the first position of the laser spot according to the relative relation between the first position of the laser spot and the relative coordinates.
For another example, the first position of the laser spot on the to-be-detected piece can be directly acquired through the image acquisition unit, so that the first position of the laser spot can be directly acquired. And the image acquisition component, such as a camera, acquires an image and acquires a first position of the laser spot on the to-be-detected piece. The specific structural model of the camera is selected according to actual needs, and this embodiment does not limit this.
In detail, in this embodiment, when the first position is located in the region to be detected of the device under test, the processor 15 controls the shutter 122 for blocking the laser to open, and when the first position is located in the non-detection region of the device under test, the method for the processor 15 to control the shutter 122 to close includes: determining a first position coding range of a region to be detected of the piece to be detected and a second position coding range of a non-detection region; when the position code corresponding to the first position is in the first position code range, the processor 15 controls the shutter 122 to open, and when the position code corresponding to the first position is in the second position code range, the processor 15 controls the shutter 122 to close. As described above, after the region to be detected and the non-detection region on the surface of the device under test are subjected to position or region division, the region to be detected may be subjected to position coding by a coding element such as an encoder to obtain a first position coding range of the region to be detected, then the non-detection region may be subjected to position coding to obtain a second position coding range of the non-detection region, and then whether the shutter 122 is controlled to close is selected by determining the relative relationship between the first position of the laser spot and the first position coding range or the second position coding range during the process of gradually changing the relative positions of the device under test and the laser light source. For example, when the first position of the laser spot coincides with the first position code of the region to be measured, the processor 15 opens the shutter 122 to perform laser irradiation; when the first position of the laser spot coincides with the second position-coded portion of the non-detection area, it is determined that the laser is irradiated to at least part of the non-detection area, and the processor 15 controls the shutter 122 to close.
The present application also provides a computer-readable storage medium on which a program is stored, the program being executable by a processor to implement the detection method described above.
It will be apparent to those skilled in the art that all or some of the steps of the methods, systems, functional modules/units in the devices disclosed above may be implemented as software (which may be implemented in program code executable by a computing device), firmware, hardware, and suitable combinations thereof. In a hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, one physical component may have multiple functions, or one function or step may be performed by several physical components in cooperation. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed over computer-readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media), executed by a computing device, and in some cases may perform the steps shown or described in a different order than here. The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art. Thus, the present invention is not limited to any specific combination of hardware and software.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (12)
1. A detection method is applied to detection equipment, and the method comprises the following steps:
controlling a laser light source to emit laser and irradiating the surface of the piece to be detected to form a laser spot;
controlling a piece to be detected to move relative to the laser, and detecting a first position of the laser spot on the piece to be detected in real time;
when the first position is located in a to-be-detected area of the to-be-detected piece, controlling a shutter for shielding laser to be opened, and when the first position is located in a non-detection area of the to-be-detected piece, controlling the shutter to be closed;
and receiving detection information of the area to be detected, and judging whether the area to be detected has defects according to the detection information.
2. The method of claim 1, wherein the controlling the movement of the object to be tested relative to the laser and the detecting the first position of the laser spot on the object to be tested in real time further comprises:
and determining a to-be-detected area and a non-detection area of the surface of the to-be-detected piece.
3. The inspection method of claim 2, wherein said determining the area to be inspected and the non-inspection area of the surface of the test object comprises:
acquiring a surface image of a piece to be detected through an image acquisition component to determine the area to be detected and the non-detection area;
or, determining the region to be detected and the non-detection region according to the detection information of the laser by the piece to be detected;
or determining the area to be detected and the non-detection area according to preset parameters.
4. The inspection method of claim 1, wherein said detecting in real time a first position of said laser spot on the dut comprises:
determining the first position of the laser spot according to the emergent angle of the laser light source and the relative position of the laser light source and a bearing device for fixing a piece to be detected;
or, the first position of the laser spot on the piece to be detected is acquired through an image acquisition unit.
5. The inspection method of claim 1, wherein said controlling a shutter for blocking the laser to open when the first position is located in an area to be inspected of the object to be inspected, and controlling the shutter to close when the first position is located in a non-inspection area of the object to be inspected, comprises:
determining a first position coding range of the region to be detected of the piece to be detected and a second position coding range of the non-detection region;
and when the position code corresponding to the first position is located in the first position code range, controlling the shutter to be opened, and when the position code corresponding to the first position is located in the second position code range, controlling the shutter to be closed.
6. A detection system, comprising:
the laser unit is used for controlling the laser light source to emit laser and irradiating the surface of the piece to be detected to form a laser spot;
the moving unit is used for controlling the piece to be detected to move relative to the laser;
the area detection unit detects the first position of the laser spot on the piece to be detected in real time;
the shutter control unit is used for controlling the shutter for shielding laser to be opened when the first position is located in the area to be detected of the piece to be detected, and controlling the shutter to be closed when the first position is located in the non-detection area of the piece to be detected;
and the light detection unit is used for receiving the detection information of the area to be detected and judging whether the area to be detected has defects according to the detection information.
7. A detection apparatus, comprising:
the bearing device is used for bearing the piece to be tested;
the laser light source comprises a laser emitting unit and a shutter, wherein the laser emitting unit emits laser to the surface of the piece to be detected and forms a laser spot, and the shutter is used for allowing or blocking the laser to be emitted to the surface of the piece to be detected;
the driving mechanism is used for driving the bearing device or the laser emitting unit to move;
the position detection unit is used for detecting the first position of the laser spot on the piece to be detected in real time;
the processor is used for controlling the shutter for shielding the laser to be opened when the first position is located in the region to be detected of the part to be detected, and controlling the shutter to be closed when the first position is located in the non-detection region of the part to be detected;
and the image detection unit is used for receiving the detection information of the area to be detected and judging whether the area to be detected has defects according to the detection information.
8. The inspection apparatus of claim 7, wherein the position detection unit is configured to determine the area to be inspected and the non-inspection area of the surface of the workpiece after detecting the first position of the laser spot on the workpiece in real time.
9. The detection apparatus of claim 8,
the position detection unit determines a region to be detected and a non-detection region on the surface of the piece to be detected, and comprises: acquiring a surface image of a piece to be detected through an image acquisition component to determine the area to be detected and the non-detection area;
or, determining the region to be detected and the non-detection region according to the detection information of the laser by the piece to be detected;
or determining the area to be detected and the non-detection area according to preset parameters.
10. The detection apparatus of claim 7,
the real-time detection of position detecting element the first position of laser facula on the piece that awaits measuring includes:
determining the first position of the laser spot according to the emergent angle of the laser light source and the relative position of the laser light source and a bearing device for fixing a piece to be detected;
or, the first position of the laser spot on the piece to be detected is acquired through an image acquisition unit.
11. The detection apparatus of claim 7,
the processor is used for controlling the shutter for shielding laser to open when the first position is located in the region to be detected of the piece to be detected, and controlling the shutter to close when the first position is located in the non-detection region of the piece to be detected, and the method comprises the following steps:
determining a first position coding range of the region to be detected of the piece to be detected and a second position coding range of the non-detection region;
and when the position code corresponding to the first position is located in the first position code range, controlling the shutter to be opened, and when the position code corresponding to the first position is located in the second position code range, controlling the shutter to be closed.
12. A computer-readable storage medium, characterized in that a program is stored on the medium, which program is executable by a processor to implement the method according to any one of claims 1 to 5.
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