KR20160064971A - Common mode filter - Google Patents

Common mode filter Download PDF

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Publication number
KR20160064971A
KR20160064971A KR1020150156709A KR20150156709A KR20160064971A KR 20160064971 A KR20160064971 A KR 20160064971A KR 1020150156709 A KR1020150156709 A KR 1020150156709A KR 20150156709 A KR20150156709 A KR 20150156709A KR 20160064971 A KR20160064971 A KR 20160064971A
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KR
South Korea
Prior art keywords
coil
common mode
mode filter
layer
cover
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Application number
KR1020150156709A
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Korean (ko)
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KR101740820B1 (en
Inventor
박승욱
심원철
Original Assignee
삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to US14/952,478 priority Critical patent/US9954510B2/en
Priority to CN201510855285.1A priority patent/CN105655090B/en
Publication of KR20160064971A publication Critical patent/KR20160064971A/en
Application granted granted Critical
Publication of KR101740820B1 publication Critical patent/KR101740820B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F2017/0093—Common mode choke coil

Abstract

The present invention relates to a common mode filter capable of increasing adhesion between coil layers, which comprises: a coil unit having a coil formed in one surface, and having a plurality of insulating layers including fillers stacked therein; a first cover unit arranged in a lower part of the coil unit; a second cover unit arranged in an upper part of the coil unit; and a surface modification layer for increasing adhesion between the insulating layers on at least one surface of the insulating layer.

Description

Common mode filter {COMMON MODE FILTER}

The present invention relates to a common mode filter.

As technology develops, electronic devices such as mobile phones, home appliances, PCs, PDAs, and LCDs are changing from analog to digital, and the speed is increasing due to an increase in the amount of data to be processed. As a result, the widespread use of USB 2.0, USB 3.0 and high-definition multimedia interface (HDMI) as high-speed signal transmission interfaces are currently being used in many digital devices such as personal computers and digital high-definition televisions have.

These high-speed interfaces employ a differential signaling system that transmits a differential signal (differential mode signal) using a pair of signal lines unlike a single-end transmission system that has been used for a long time. However, since the electronic devices which are digitized and accelerated are sensitive to external stimuli, signal distortions due to high frequency noise often occur.

Such abnormal voltage and noise are caused by switching voltage generated in the circuit, power supply noise included in the power supply voltage, unnecessary electromagnetic signal, or electromagnetic noise. To prevent such abnormal voltage and high frequency noise from flowing into the circuit A common mode filter (CMF) is used as a means.

Conventional common mode filters can be roughly divided into a laminate type and a thin film type.

In the case of the laminate-type common mode filter, the coil layer is formed on the ceramic sheet, and lamination, compression and firing are performed to secure adhesion between the coil layers. However, in the stacked common mode filter, since the process of forming a coil uses a conductive paste, the precision of the coil pattern is lowered and the resistance is high.

In the case of the thin film type common mode filter, the layer adhesion is low because each layer is formed by coating each layer after curing of the polymer resin. In order to increase the adhesion of the thin film, a method of strengthening the bonding by silane coating is used, but a method of forming a high adhesion force is required because the adhesion is lower than that of the lamination type.

In addition, in the case of forming a common mode filter by bonding to a ferrite substrate in a thin film type common mode filter, there is a problem of handling in the manufacturing process of the common mode filter as the thickness is thinned, There is a problem that the yield is reduced due to defects such as cracks.

Therefore, there is a need for a common mode filter capable of satisfying a low unit price and high electrical characteristics and a manufacturing method thereof.

Korean Patent Laid-Open Publication No. 2013-0047572

The present invention can provide a common mode filter capable of improving the bonding force between coil layers.

In addition, the present invention can provide a common mode filter that can satisfy low cost and high electrical characteristics and a method of manufacturing the same.

It is another object of the present invention to provide a common mode filter that can be protected from static electricity.

A common mode filter according to an embodiment of the present invention includes: a coil part having a coil on one surface thereof and including a plurality of insulating layers including a filler; A first cover portion disposed under the coil portion; And a second cover part disposed on the upper part of the coil part, wherein at least one surface of the insulating layer further includes a surface modification layer for improving adhesion between the insulating layers.

According to another aspect of the present invention, there is provided a common mode filter comprising: a coil part having a coil on one surface thereof and including a plurality of insulating layers including a filler; A first cover portion disposed under the coil portion; And a second cover portion disposed on the upper portion of the coil portion, wherein the first and second cover portions include a magnetic resin composite material including magnetic particle particles.

The common mode filter according to an embodiment of the present invention can improve the bonding force between the coil layers by forming a surface modification layer between the coil layers.

Further, the present invention can be easily handled even when the thickness of the common mode filter is reduced by using the ferrite resin layer instead of the conventional ferrite substrate as the lower magnetic layer, thereby causing cracks Defects can be prevented and the yield can be increased.

Protection of the common mode filter from static electricity, which is another object of the present invention, can be achieved by providing a common mode filter that further includes an ESD protection layer.

1 is a schematic cross-sectional view of a common mode filter according to a first embodiment of the present invention;
2 is a cross-sectional photograph of a common mode filter according to a first embodiment of the present invention.
3 is a schematic sectional view in which a surface modification layer is disposed between insulating layers.
Figures 4-8 are schematic cross-sectional views of a common mode filter according to various embodiments of the present invention.
9-13 are schematic cross-sectional views of a common mode filter according to another embodiment of the present invention.
14 to 24 are schematic sectional views of respective steps of a method of manufacturing a common mode filter of the present invention.
25 to 30 are schematic sectional views of respective steps of a method of manufacturing a common mode filter of the present invention.

The advantages and features of the present invention and the techniques for achieving them will be apparent from the following detailed description taken in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The present embodiments are provided so that the disclosure of the present invention is not only limited thereto, but also may enable others skilled in the art to fully understand the scope of the invention.

The terms used herein are intended to illustrate the embodiments and are not intended to limit the invention. In this specification, the singular forms include plural forms unless otherwise specified in the text. It is to be understood that the terms 'comprise', and / or 'comprising' as used herein may be used to refer to the presence or absence of one or more other components, steps, operations, and / Or additions.

1 is a schematic cross-sectional view of a common mode filter 101 according to a first embodiment of the present invention, and Fig. 2 is a cross-sectional view of a first embodiment of the present invention photographed with a V-SEM (Vertical-Scanning Electron Microscope) Sectional view of the common mode filter.

1 and 2, the common mode filter 101 according to the first embodiment of the present invention includes a first cover part 110, a second cover part 130 'and a coil part 120 .

The first cover portion 110 may be formed of a magnetic ceramic material, for example, a ferrite substrate. And may include a ferrite substrate having a permeability of 300 or more when the ferrite substrate is included.

A coil portion 120 is disposed above the first cover portion 110.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The coils 122-125 are arranged in a spiral shape and can be formed using a conductive material. For example, the coils 122-125 may be formed on the insulating layer 121 using a screen printing or lithography process.

One end of each of the first to fourth coils 122 to 125 is exposed to the side of the coil part 120 and electrically connected to the external electrode 140 to be described later.

The first and third coils 122 and 124 may be electrically connected to each other by conductive vias (not shown) of the insulating layer 121 and the second and fourth coils 123 and 125 may be electrically connected to the insulating layer 121. [ May be electrically connected to each other by conductive vias (not shown).

The conductive via may be formed by forming a via hole in the insulating layer 121 by laser punching or mechanical punching, and filling the via hole with a conductive material.

The insulating layer 121 may be formed by stacking a buildup film of ABF (Ajinomoto build-up films) or a polyimide, epoxy, BCB (Benzocyclobutene) or the like. Such build-up films include fillers to enhance the physical properties of the film or to enhance the magnetic properties.

As described above, in order to form the coil part 120, the coils 122-125 are formed on the plurality of insulating layers 121, and then lamination and compression are performed. The coils 122-125 are included in the insulating layer 121 The filler causes the bonding strength between the insulating layers 121 to deteriorate in the process of bonding the insulating layers 121.

3 is an enlarged cross-sectional view of a portion of the adjacent insulating layer 121. As shown in FIG.

Referring to FIGS. 1 to 3, a surface modification layer 150 is disposed between the insulating layers 121.

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

That is, the surface modifying layer 150 refers to a region where the content of the filler in the coil portion 120 is smaller than that of the other portion, or the filler is not contained.

The surface modification layer 150 is subjected to a chemical surface treatment (for example, a desmear process) before each of the insulating layers 121 is laminated to form a filler 121b exposed on the surface of the insulating layer 121 ).

When the filler 121b is removed as described above, the surface modification layer 150 has no filler or a filler content less than at least the insulating layer 121.

In addition, the portion where the filler is removed in the surface modification layer 150 has a fine shape like a groove. The portion where the filler is removed as described above can serve as the anchor 151.

Therefore, in the process of laminating and pressing the insulating layer 121, the material constituting the insulating layer 121 may be partially contained in the anchor 151, so that the adhesion between the insulating layers 121 may be further improved.

The thickness of the surface modification layer 150 may be about 1 탆 or more, more preferably about 1.5 탆 to about 3.0 탆, for the purpose of improving the adhesion. If the thickness of the surface modification layer 150 is more than 3.0 μm, the performance of the common mode filter may be decreased due to an increase or decrease in the content of the filler in the coil part 120, The effect of improving the adhesion between the surface modifying layer 150 is small.

A second cover part 130 'is disposed on the upper part of the coil part 120. The second cover portion 130 'may be formed of a magnetic material, for example, a magnetic resin composite material. The magnetic resin composite material means a composite material produced by dispersing magnetic material particles in a polymer resin, and a magnetic material such as ferrite or pure iron can be used as the magnetic material.

When the second cover part 130 'includes the magnetic resin composite material, the magnetic permeability of the second cover part can be adjusted according to the content of the magnetic material included in the magnetic resin composite.

Hereinafter, various embodiments of the common mode filter will be described with reference to FIGS. The description of the configuration and contents common to the embodiments will be omitted.

4 shows a schematic cross-sectional view of a common mode filter 102 according to a second embodiment of the present invention.

Referring to FIG. 4, the common mode filter 102 according to the second embodiment includes a first cover 110 ', a second cover 130', and a coil 120.

The first cover part 110 'may be formed to include a magnetic resin composite rather than a ferrite substrate as in the first embodiment. In the case of the ferrite substrate used as the first cover part 110 ', a crack is generated in the ferrite substrate during manufacturing or use because it is a ceramic sintered body. However, if the first cover part 110 'is formed using the magnetic resin composite material, the flexibility of the first cover part 110' can be reduced and the generation of cracks can be reduced.

Ref.
(Ferrite substrate 占 = 300, magnetic resin composite 占 = 12) Magnetic resin composite material
(μ = 12) Magnetic resin composite material
(μ = 20) Magnetic resin composite material
(μ = 30) Magnetic resin composite material
(mu = 40) CM Impedance
@ 100 MHz 86.6 Ω 80.5 Ω 86.1 Ω 89.5 Ω 91.3 Ω CM Attenuation -35.7 dB
@ 0.76 GHz -34.4 dB
@ 0.83 GHz -36.3 dB
@ 0.81 GHz -37.6 dB
@ 0.80 GHz -38.5 dB
@ 0.78 GHz

However, the magnetic resin composite has a problem that the permeability is lower than that of the ferrite substrate having a permeability of 300, and thus there is a loss in terms of impedance and attenuation.

However, as shown in Table 1, when the permeability of the magnetic resin composite material is secured to 20 or more, impedance and attenuation characteristics similar to those obtained by forming the first cover part 110 'with a ferrite substrate can be ensured.

The magnetic resin composite material is formed by dispersing magnetic material particles in a polymer resin, and it is possible to increase the permeability by increasing the proportion of the magnetic material particles. Or by changing the design of the conductor used for the coil, characteristics similar to those in the case of using the ferrite substrate as the first cover portion can be obtained.

The magnetic substance particles may be formed using a magnetic material such as ferrite or pure iron.

A coil part 120 is disposed on the upper part of the first cover part 110 '.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

5 is a schematic cross-sectional view of a common mode filter 103 according to a third embodiment of the present invention.

The common mode filter 103 according to the third embodiment may further include an electrostatic discharge (ESD) prevention unit 160 under the first cover unit 110.

The ESD prevention unit 160 may include a thermistor disposed under the first cover unit 110 formed of a ferrite substrate to allow the common mode filter 103 of the present embodiment to function as an ESD protection device .

The ESD prevention part 160 may be formed by forming two ESD electrodes (not shown) so as to be spaced apart from each other, and filling an ESD material in a space between the separated ESD electrodes. As the ESD material, a conductive metal such as Cu or Ag dispersed in an insulating inorganic material such as Al 2 O 3 , TiO 2 , or ZnO or an insulating organic material may be used. Normally, the ESD material operates as an insulator, A material which energizes through the conductive metals is used.

The common mode filter 103 of the present embodiment may further include an external electrode (not shown) electrically connected to the ESD electrode in the ESD prevention part 160.

A coil portion 120 is disposed above the first cover portion 110.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

6 is a schematic cross-sectional view of a common mode filter 104 according to a fourth embodiment of the present invention.

6 is an invention relating to a common mode filter 104 having an ESD prevention part 160 and a first cover part 110 'formed of a magnetic resin composite material.

The first cover part 110 'may be formed to include a magnetic resin composite rather than a ferrite substrate, unlike the third embodiment. In the case of the ferrite substrate used as the first cover part 110 ', a crack is generated in the ferrite substrate during manufacturing or use because it is a ceramic sintered body. However, if the first cover part 110 'is formed using the magnetic resin composite material, the flexibility of the first cover part 110' can be reduced and the generation of cracks can be reduced.

In addition, an ESD (Electrostatic Discharge) prevention unit 160 may be further provided under the first cover unit 110 '.

The ESD prevention unit 160 may include a thermistor disposed under the first cover unit 110 formed of a ferrite substrate to allow the common mode filter 103 of the present embodiment to function as an ESD protection device .

A coil part 120 is disposed on the upper part of the first cover part 110 '.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

7 is a schematic cross-sectional view of a common mode filter 105 according to a fifth embodiment of the present invention.

Referring to FIG. 7, the common mode filter 105 according to the fifth embodiment includes a first cover 110, a second cover 130 ', and a coil 120.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

The common mode filter 105 according to the fifth embodiment of the present invention is configured such that the coils 122-125 disposed in the coil part 120 are connected to the connection electrodes 141 through the connection vias 126, As shown in FIG. The external electrode 140 may be formed on the surface of the connection electrode 141.

Since the common mode filter 105 according to the fifth embodiment of the present invention is connected to the external electrode 140 disposed on the upper surface of the coil 122-125 through the connection via 126, No separate external electrode is formed on the side surface.

In addition, the common mode filter 105 according to the fifth embodiment of the present invention may further include a core 127 at the center of the coil section 120. The core 127 can improve the performance of the common mode filter 105. [

8 is a schematic cross-sectional view of a common mode filter 106 according to a sixth embodiment of the present invention.

Referring to FIG. 8, the common mode filter 106 according to the sixth embodiment includes a first cover 110 ', a second cover 130', and a coil 120.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

The first cover part 110 'may be formed to include a magnetic resin composite rather than a ferrite substrate, unlike the fifth embodiment. In the case of the ferrite substrate used as the first cover part 110 ', a crack is generated in the ferrite substrate during manufacturing or use because it is a ceramic sintered body. However, if the first cover part 110 'is formed using the magnetic resin composite material, the flexibility of the first cover part 110' can be reduced and the generation of cracks can be reduced.

The common mode filter 106 according to the sixth embodiment of the present invention is configured such that the coils 122-125 disposed in the coil part 120 are connected to the electrode pad 141 through the connection via 126, As shown in FIG. The external electrode 140 may be formed on the surface of the electrode pad 141.

Since the common mode filter 106 according to the sixth embodiment of the present invention is connected to the external electrode 140 disposed on the upper surface of the coil 122-125 via the connection via 126, No separate external electrode is formed on the side surface.

In addition, the common mode filter 107 according to the sixth embodiment of the present invention may further include a core 127 at the center of the coil section 120. The core 127 can improve the performance of the common mode filter 107. [

9 is a schematic cross-sectional view of a common mode filter 107 according to a seventh embodiment of the present invention.

9, the common mode filter 107 according to the seventh embodiment includes a first cover part 110 'and a coil part 120, and an ESD prevention layer 160 And a ground electrode 142, as shown in FIG.

The coil part 120 includes a plurality of insulating layers 121, coils 122-125 and a surface modification layer 150. [

The insulating layer 121 is composed of a resin 121a and a filler 121b. The filler 121b included in the insulating layer 121 reduces the bonding force between the respective insulating layers 121 in the process of bonding the insulating layers 121. The surface modification layer 150 is formed such that the content of the filler is insulated The insulating layer 121 is provided between the insulating layer 121 and the insulating layer 121 to improve the bonding force between the adjacent insulating layers 121. [

The common mode filter 107 according to the seventh embodiment of the present invention is configured such that the coils 122-125 disposed in the coil part 120 are connected to the electrode pad 141 through the connection via 126, As shown in FIG. The external electrode 140 may be formed on the surface of the electrode pad 141.

In addition, the common mode filter 107 according to the seventh embodiment of the present invention may further include a core 127 at the center of the coil section 120. The core 127 can improve the performance of the common mode filter 107. [

A ground electrode 142 and a connection electrode 141 are formed on the upper part of the coil part 120, that is, inside the second cover part 130 '. An ESD prevention layer 160 disposed between the connection electrode 141 and the ground electrode 142 is disposed. The ESD prevention layer disperses the conductive particles in the polymer resin to have insulation, but electricity can flow when a high voltage such as static electricity is applied, so that the ESD prevention layer releases a high voltage to the ground electrode 142 to protect the common mode filter.

The connection electrode 141 may be exposed to one side of the common mode filter 107 and electrically connected to the external electrode 140. That is, the connection electrode 141 may serve to electrically connect the coils 122-125 and the external electrodes 140 disposed inside the coil part 120. [

An external electrode (not shown) electrically connected to the ground electrode 142 may be disposed on the other side of the common mode filter 107.

10 to 13 are schematic cross-sectional views of a common mode filter according to another embodiment of the present invention.

10 to 13, a common mode filter according to another embodiment of the present invention will be described.

10 is a schematic cross-sectional view of a common mode filter 201 according to an eighth embodiment of the present invention.

Referring to FIG. 10, the common mode filter 201 according to the eighth embodiment of the present invention includes a first cover part 210 ', a second cover part 230', and a coil part 220.

The first cover part 210 'and the second cover part 210' may be formed of a magnetic resin composite material. When a ferrite substrate is used as the cover part, a crack is generated in the ferrite substrate during manufacture or use because it is a ceramic sintered body. However, when the first and second cover parts 210 'and 230' are formed using the magnetic resin composite material, flexibility is imparted to the first and second cover parts 210 'and 230' to reduce the occurrence of cracks .

A coil portion 20 is disposed on the upper portion of the first cover portion 210.

The coil portion 220 includes a plurality of insulating layers 221 and coils 222-225.

The coils 222-225 are arranged in a spiral shape and can be formed using a conductive material. For example, the coils 222-225 may be formed on the insulating layer 221 using a screen printing or lithography process.

One end of each of the first to fourth coils 222-225 is exposed to the side of the coil part 220 and is electrically connected to the external electrode 240 described later.

The first and third coils 222 and 224 may be electrically connected to each other by conductive vias (not shown) of the insulating layer 221 and the second and fourth coils 223 and 225 may be electrically connected to the insulating layer 221 May be electrically connected to each other by conductive vias (not shown).

The conductive via may be formed by forming a via hole in the insulating layer 221 by laser punching or mechanical punching, and filling the via hole with a conductive material.

The insulating layer 221 may be formed by stacking a build-up film of ABF (Ajinomoto build-up films) or polyimide, epoxy, BCB (Benzocyclobutene) or the like. Such build-up films include fillers to enhance the physical properties of the film or to enhance the magnetic properties.

11 is a schematic cross-sectional view of a common mode filter 202 according to a ninth embodiment of the present invention.

11, the common mode filter 202 according to the ninth embodiment of the present invention includes a first cover part 210 ', a second cover part 230' and a coil part 220.

The first cover part 210 'and the second cover part 210' may be formed of a magnetic resin composite material. When a ferrite substrate is used as the cover part, a crack is generated in the ferrite substrate during manufacture or use because it is a ceramic sintered body. However, when the first and second cover parts 210 'and 230' are formed using the magnetic resin composite material, flexibility is imparted to the first and second cover parts 210 'and 230' to reduce the occurrence of cracks .

The common mode filter 202 according to the ninth embodiment is different from the common mode filter 201 according to the eighth embodiment in that an ESD (Electrostatic Discharge) prevention part 260 is provided below the first cover part 210 .

The ESD prevention part 260 may be configured such that a thermistor is disposed below the first cover part 210 made of a ferrite substrate so that the common mode filter 203 of the present embodiment can perform up to the role of an ESD protection element .

The ESD prevention part 260 may be formed by forming two ESD electrodes (not shown) so as to be spaced apart from each other, and filling a space between the separated ESD electrodes with an ESD material. As the ESD material, a conductive metal such as Cu or Ag dispersed in an insulating inorganic material such as Al 2 O 3 , TiO 2 , or ZnO or an insulating organic material may be used. Normally, the ESD material operates as an insulator, A material which energizes through the conductive metals is used.

The common mode filter 203 of the present embodiment may further include an external electrode (not shown) electrically connected to the ESD electrode in the ESD prevention part 160.

12 is a schematic cross-sectional view of a common mode filter 203 according to a tenth embodiment of the present invention.

12, the common mode filter 203 according to the ninth embodiment of the present invention includes a first cover part 210 ', a second cover part 230', and a coil part 220.

The first cover part 210 'and the second cover part 210' may be formed of a magnetic resin composite material. When a ferrite substrate is used as the cover part, a crack is generated in the ferrite substrate during manufacture or use because it is a ceramic sintered body. However, when the first and second cover parts 210 'and 230' are formed using the magnetic resin composite material, flexibility is imparted to the first and second cover parts 210 'and 230' to reduce the occurrence of cracks .

The common mode filter 203 according to the tenth embodiment of the present invention is configured such that the coil 222-225 disposed inside the coil part 220 is connected to the connection electrode 241 through the connection via 226, As shown in FIG. The external electrode 240 may be formed on the surface of the connection electrode 241.

Since the common mode filter 203 according to the tenth embodiment of the present invention is connected to the external electrode 240 disposed on the upper surface of the coil 222-125 through the connection via 226, No separate external electrode is formed on the side surface.

In addition, the common mode filter 203 according to the tenth embodiment of the present invention may further include a core 227 at the center of the coil portion 220. The core 227 can improve the performance of the common mode filter 203. [

13 is a schematic cross-sectional view of a common mode filter 204 according to an eleventh embodiment of the present invention.

Referring to FIG. 13, the common mode filter 204 according to the eleventh embodiment of the present invention includes a first cover part 210 ', a second cover part 230', and a coil part 220.

The first cover part 210 'and the second cover part 210' may be formed of a magnetic resin composite material. When a ferrite substrate is used as the cover part, a crack is generated in the ferrite substrate during manufacture or use because it is a ceramic sintered body. However, when the first and second cover parts 210 'and 230' are formed using the magnetic resin composite material, flexibility is imparted to the first and second cover parts 210 'and 230' to reduce the occurrence of cracks .

The common mode filter 203 according to the eleventh embodiment further includes an ESD prevention layer 260 'and a ground electrode 242 on the coil part 220 in comparison with the common mode filter 203 according to the tenth embodiment can do.

A ground electrode 242 and a connection electrode 241 are formed on the upper part of the coil part 220, that is, inside the second cover part 230 '. An ESD prevention layer 260 disposed between the connection electrode 241 and the ground electrode 242 is disposed. Although the ESD prevention layer disperses the conductive particles in the polymer resin, the ESD prevention layer usually has an insulation property. However, when the high voltage such as static electricity is applied, electricity can flow, and the common electrode filter can be protected by releasing high voltage to the ground electrode 242.

The connection electrode 241 may be exposed to one side of the common mode filter 204 and electrically connected to the external electrode 240. That is, the connection electrode 241 may serve to electrically connect the coil 222-225 and the external electrode 240, which are disposed inside the coil portion 220.

An external electrode (not shown) electrically connected to the ground electrode 242 may be disposed on the other side of the common mode filter 204.

14 to 24 are schematic cross-sectional views of respective steps of a method of manufacturing a common mode filter of the present invention.

Referring to Figs. 14 to 24, a method of manufacturing the common mode filter of the present invention will be described.

First, the step of providing the detent core 10 (FIG. 14) should be performed.

The detent core 10 is located at a central portion until the core portion and the cover portion are formed.

Thereafter, an adhesive metal layer 11 is formed on both surfaces of the detent core 10, and a coil 125 is formed on one surface of the adhesive metal layer 11 (Fig. 15). The process of forming the insulating layer 121 on the coil 125 and forming the new coil 125 on the insulating layer 121 is repeated to form the coil part 120 (Fig. 15).

The adhesive metal layer 11 may be formed using a metal such as a coil, and may be formed of copper (Cu), for example.

The insulating layer 121 may be formed by stacking a buildup film of ABF (Ajinomoto build-up films) or a polyimide, epoxy, BCB (Benzocyclobutene) or the like. Such build-up films include fillers to enhance the physical properties of the film or to enhance the magnetic properties.

As described above, in order to form the coil part 120, the coils 122-125 are formed on the plurality of insulating layers 121, and then lamination and compression are performed. The coils 122-125 are included in the insulating layer 121 The filler causes the bonding strength between the insulating layers 121 to deteriorate in the process of bonding the insulating layers 121.

Accordingly, as shown in FIG. 16, the surface modification layer 150 may be formed between the insulating layers 121.

The method of forming the surface modification layer 150 will be described with reference to FIGS.

As shown in FIG. 17, the insulating layer 121 may be formed by dispersing the filler 121b in the polymer resin 121a.

18, the one surface of the insulating layer 121 is subjected to a chemical surface treatment (e.g., a desmear process) to remove the filler 121b exposed on the surface of the insulating layer 121 .

After the filler 121b exposed on the surface is removed, a new insulating layer 121 is laminated and pressed (FIG. 19) to form a surface modification layer 150 between the insulating layers 121.

When the filler 121b is removed as described above, the surface modification layer 150 has no filler or a filler content less than at least the insulating layer 121.

In addition, the portion where the filler is removed in the surface modification layer 150 has a fine shape like a groove. The portion where the filler is removed as described above can serve as the anchor 151.

Therefore, in the process of laminating and pressing the insulating layer 121, the material constituting the insulating layer 121 may be partially contained in the anchor 151, so that the adhesion between the insulating layers 121 may be further improved.

In addition, the filler is removed in the surface treatment process, and the average roughness Ra of the surface modification layer 150 is improved.

The thickness of the surface modification layer 150 may be about 1 탆 or more, more preferably about 1.5 탆 to about 3.0 탆, for the purpose of improving the adhesion. If the thickness of the surface modification layer 150 is more than 3.0 μm, the performance of the common mode filter may be decreased due to an increase or decrease in the content of the filler in the coil part 120, The effect of improving the adhesion between the surface modifying layer 150 is small.

After forming the coil part 120, the first cover part 110 'is formed on one side of the coil part 120 (FIG. 20).

The first cover 110 'may be formed of a magnetic resin composite material formed by dispersing magnetic particles in a polymer resin.

Thereafter, the adhesive metal layer 11 attached to both surfaces of the detent core 10 is separated as shown in Fig.

The adhesive metal layer 11 is exposed on one side of the separated coil part 120 and the first cover part 110 '.

The exposed adhesive metal layer 11 is removed by etching (Fig. 22).

The adhesive metal layer 11 is removed, and the second cover part 130 'is formed thereon (Fig. 23).

The second cover part 130 'may be formed of a magnetic resin composite material formed by dispersing magnetic particles in a polymer resin.

If necessary, the common mode filter can be completed by polishing the side surface of the coil part 120 to expose one end of the coil 122-125 and forming the external electrode 140 on the side surface (FIG. 24).

25 to 30 are schematic sectional views of respective steps of a method of manufacturing a common mode filter according to another embodiment. 25 to 30, a method of manufacturing a common mode filter according to another embodiment of the present invention will be described.

First, as shown in FIG. 14, a step of providing the detent core 10 should be performed.

Thereafter, an adhesive metal layer 11 is formed on both surfaces of the detent core 10 and a coil 125 is formed on one surface of the adhesive metal layer 11 (Fig. 25). The process of forming the insulating layer 121 on the coil 125 and forming the new coil 125 on the insulating layer 121 is repeated to form the coil part 120 (FIG. 25).

At this time, the connection via 126 and the core 127 may be formed together with the coil 125.

Although not shown, the step of forming the insulating layer 121 may include a step of forming a surface modification layer.

After the coil part 120 is formed as described above, the first cover part 110 'is formed on one side of the coil part 120 (FIG. 26).

The first cover 110 'may be formed of a magnetic resin composite material formed by dispersing magnetic particles in a polymer resin.

Thereafter, the adhesive metal layer 11 attached to both surfaces of the detent core 10 is separated as shown in Fig.

The adhesive metal layer 11 is exposed on one side of the separated coil part 120 and the first cover part 110 '.

The exposed adhesive metal layer 11 is removed through etching and electrically connected to the connection via 126 or the connection pad 141 is formed on the upper surface of the coil part 120 (FIG. 28).

Thereafter, the second cover part 130 'is formed on the upper surface of the coil part 120 (FIG. 29).

The second cover part 130 'may be formed of a magnetic resin composite material formed by dispersing magnetic particles in a polymer resin.

Finally, the external electrode 140 is formed on the surface of the connection terminal 141.

The common mode filter of the present embodiment can perform the ESD protection function and the common mode filter function together, thereby achieving miniaturization of the electronic product, and simplifying the process and reducing the manufacturing cost by using the two-side lamination method using the detent core There may also be.

The foregoing detailed description is illustrative of the present invention. It is also to be understood that the foregoing is illustrative and explanatory of preferred embodiments of the invention only, and that the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention.

The foregoing embodiments are intended to illustrate the best mode contemplated for carrying out the invention and are not intended to limit the scope of the present invention to other modes of operation known in the art for utilizing other inventions such as the present invention, Various changes are possible. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. It is also to be understood that the appended claims are intended to cover such other embodiments.

110: first cover part
120: coil part
130: second cover portion
140: external electrode
150: Surface modification layer

Claims (10)

A coil portion on one side of which a coil portion is formed, and a plurality of insulating layers including a filler laminated;
A first cover portion disposed under the coil portion; And
And a second cover portion disposed on the upper portion of the coil portion,
And a surface modification layer for improving adhesion between the insulating layers on at least one surface of the insulating layer. The method according to claim 1,
Wherein the surface modifying layer has a lower filler content than the insulating layer or does not contain a filler. The method according to claim 1,
Wherein a plurality of anchors are disposed on one surface of the surface modification layer to accommodate the resin of adjacent layers in the process of bonding the adjacent layers and improve adhesion. The method according to claim 1,
Wherein the thickness of the surface modification layer is from 1.5 [mu] m to 3.0 [mu] m. The method according to claim 1,
Wherein the first and second cover portions are magnetic resin composites including magnetic particle particles. 6. The method of claim 5,
Wherein the permeability of the magnetic resin composite is 20 or more. The method according to claim 1,
And an ESD prevention portion disposed under the second cover portion,
The ESD protection part includes first and second ESD electrodes formed to be spaced apart from each other, and an ESD prevention layer disposed between the first and second ESD electrodes. The method according to claim 1,
The second cover portion
A ground electrode disposed on an upper portion of the coil portion;
A plurality of connection electrodes disposed on the coil part and electrically connected to the coil; And
And an ESD prevention layer disposed between the connection electrode and the ground electrode. A coil portion on one side of which a coil portion is formed, and a plurality of insulating layers including a filler laminated;
A first cover portion disposed under the coil portion; And
And a second cover portion disposed on the upper portion of the coil portion,
Wherein the first and second cover portions comprise a magnetic resin composite material including magnetic particle particles. 10. The method of claim 9,
Wherein the permeability of the magnetic resin composite is 20 or more.
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