KR20160038839A - Wiring substrate and multi-piece wiring substrate - Google Patents

Wiring substrate and multi-piece wiring substrate Download PDF

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Publication number
KR20160038839A
KR20160038839A KR1020150137131A KR20150137131A KR20160038839A KR 20160038839 A KR20160038839 A KR 20160038839A KR 1020150137131 A KR1020150137131 A KR 1020150137131A KR 20150137131 A KR20150137131 A KR 20150137131A KR 20160038839 A KR20160038839 A KR 20160038839A
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KR
South Korea
Prior art keywords
wiring
main body
electrodes
wiring boards
electrode
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KR1020150137131A
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Korean (ko)
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KR101985056B1 (en
Inventor
다카시 구라우치
요시타카 요시다
가즈시게 아키타
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니뽄 도쿠슈 도교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Abstract

[PROBLEMS] To mount a variety of electronic components such as quartz crystal vibrators and the like on the surface of a substrate main body, to securely cover a metal plating film on the surface of a conductor exposed to the outside, And a plurality of interconnecting wiring boards for connecting a plurality of the wiring boards.
A substrate body (2a) made of ceramic (insulating material) and having a rectangular surface (3) and a back surface (4) in plan view and a plurality of A back electrode 10 and a frame-shaped conductor portion 7 on a rectangular frame as seen in a plan view and a plurality of backside electrodes 7, which are disposed on the side of the front surface 3 of the substrate body 2a, And a via conductors 9 for conducting between the back surface electrode 10 and the frame-shaped conductor portion 7. The plurality of back electrode 10 and the side surfaces 4a, A part 4z of the rear face 4 is exposed between the rear face electrodes 4a and 4b and the rear face 4 of the substrate main body 2a is exposed from a plurality of back face electrodes 10, (1a) in which at least one convex wiring (12) is formed between the sides (4a, 4b).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a wiring board,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which a plurality of electronic components such as a quartz crystal can be encapsulated and mounted on a surface thereof and a plurality of connection wiring boards having a plurality of wiring boards thereon.

For example, it is possible to use a substrate made of an insulating sheet, a pair of vibrating element mount electrodes formed on the surface of the substrate, four external connecting electrodes formed on the four corners of the back surface of the substrate, There has been proposed a package for a piezoelectric transducer having a metal ring on a rectangular frame fixed along its periphery (see, for example, Patent Document 1). The lower ends of the pair of vias that are individually connected to the vibrating piece mount electrodes and pass through the substrate are connected to a pair of outgoing electrodes extending from the pair of external connecting electrodes at the diagonal positions of the back surface to the back central side Respectively.

According to the package for a piezoelectric resonator, even if a thin substrate is used, since cracks are not easily generated and reliability can be ensured in a manufacturing process of a piezoelectric vibrator using the package, the package and the piezoelectric resonator Is obtained.

However, in the piezoelectric resonator package described in Patent Document 1, in the first embodiment shown in Figs. 1 (a) to 1 (c), a plurality of the above- The current flows through the external connection electrode 17c, the via 16, the metal ring 15, and the metal ring 15 in the case where the current for covering the metal plating film is applied to the surface of each conductor exposed to the outside, A first set which stops at the vias 16 to the external connection electrodes 17d to the external connection electrodes 17a to the lead electrodes 18 to the vias 14a to the vibrating plate mount electrodes 12a, The second set which stops at the connection electrode 17a → the lead electrode 18 → the via 14a → the vibrating plate mount electrode 12a and the external connection electrode 17b → the lead electrode 18 → the via 14b → the vibration And a third set which stops at the one-side mount electrode 12b. As a result, in the case of the package for a piezoelectric transducer, when a metal plating film is coated on the surface of each conductor exposed to the outside in each individual package, a plurality of sets of plating current paths are required. Further, in the form of a plurality of connections, it is impossible to cover the surface of each conductor exposed to the outside in each of a plurality of packages with a metal plating film. Therefore, it is remarkably difficult to provide a package for a piezoelectric transducer in which a metal plating film is reliably covered on the surface of each conductor exposed to the outside.

Japanese Laid-Open Patent Publication No. 2008-5088 (pages 1 to 11, Figs. 1 to 5)

It is an object of the present invention to solve the problems described in the background art and to provide a method of manufacturing a semiconductor device which can mount various electronic parts such as a quartz oscillator on a surface of a substrate body so as to be sealed, Another object of the present invention is to provide a wiring substrate which does not cause a problem in the back electrode at the time of mounting on the main board, and a plurality of connection wiring boards for connecting a plurality of wiring boards.

In order to solve the above-described problems, the present invention is characterized in that, in the form of a plurality of interconnecting wiring boards in which a plurality of the wiring boards are bundled, a metal plating film is surely coated on the surface of the conductor exposed to the outside in each of the wiring boards And a plurality of back electrodes formed on the back surface of the substrate body of the wiring substrate after the individualization is separated from the respective sides of the back surface.

That is, the wiring board according to the present invention (claim 1) of the present invention comprises: a substrate body made of an insulating material and having a rectangular surface and a rear surface in plan view; a plurality of back surface electrodes formed on a back surface of the substrate body; And a via conductor which penetrates through the substrate main body and conducts between the plurality of back electrode and the frame-shaped conductor portion, wherein the plurality of the plurality of Wherein a part of the back surface is exposed between the back electrode and the respective sides of the back surface of the substrate main body and the pair of back electrodes cross each other on the back surface of the substrate main body And at least one or more convex wirings are formed between the first and second electrodes.

According to this configuration, since the plurality of back electrodes formed on the back surface of the substrate main body are formed apart from the respective sides of the back surface, when the solder used for mounting the main wiring board on a main board such as a printed board is solidified It is possible to alleviate the stress accompanying the tensile force generated in the step. Therefore, problems such as peeling of the outer peripheral side of the back electrode can be prevented from occurring.

At least one or more convex wirings are formed from the back electrode to a pair of sides crossing (orthogonal) to each other on the back surface of the substrate main body. For this reason, in the state of a plurality of connection wiring boards, in which a plurality of the wiring boards are arranged side by side along the vertical and horizontal directions, connection wirings formed of mutually convex wirings between adjacent wiring boards are provided on the back surface of each board body At least one or more of them are formed on the respective sides of the frame. Therefore, when the plating current is supplied to the plurality of wiring substrates, the plating current can flow along the longitudinal direction, the lateral direction, and the oblique direction of the plurality of wiring substrates. Therefore, it is possible to provide a wiring board which reliably covers a metal plating film which is required to be provided on the surface of the conductor portion exposed to the outside such as the back electrode, the frame-shaped conductor portion, and the mounting electrode formed on the surface of the substrate body .

The insulating material forming the substrate body is ceramic or resin. The ceramics include, for example, high-temperature sintered ceramics such as alumina, aluminum nitride, and mullite, or low-temperature sintered ceramics such as glass-ceramics, and the resin includes, for example, an epoxy resin.

Further, the substrate main body is composed of a single-layer ceramic layer or a single-layer resin layer. It should be noted that the substrate main body is constituted by a laminate of a plurality of ceramic layers or a plurality of resin layers, and between the layers, for example, for connecting the via conductors on the upper layer side and the via conductors on the lower layer side Or a wiring layer for swirling may be formed. For example, in the case of a substrate body formed by laminating a ceramic layer on a flat plate and a ceramic layer on a rectangular frame in a plan view, the surface of the substrate body has a quadrangular shape and a rectangular frame shape.

The frame-shaped conductor portion on the rectangular frame disposed on the front surface side of the substrate main body may be formed along the periphery of the surface of the metal frame or the insulating layer on the upper layer side (for example, the ceramic layer) And is a frame-shaped metallization layer formed on the surface (surface) of a frame body on a rectangular frame made of an insulating material (for example, a ceramic layer).

A plurality of mounting electrodes for mounting a quartz vibrator, a semiconductor element, and the like are formed on the surface of the substrate main body surrounded by the metal frame or the frame body forming the frame-like conductor portion, and the plurality of mounting electrodes The plurality of rear conductors are also individually conducted by the via conductors.

In addition, the back electrode may be, for example, one pair (two) arranged along a pair of opposing sides on the back surface of the substrate body, or a pair of And a total of three back electrodes formed separately for each of the remaining two corner portions.

When the plurality of convex wirings laid on the back electrode on the rear surface of the substrate main body extend toward a pair of mutually adjacent pairs of the convex wirings adjacent to each other with at least a corner therebetween The bases are connected to the back electrode immediately without crossing each other.

The convex wirings may be formed in a shape that extends in a straight line and in an oblique direction as well as a shape that extends in a direction perpendicular to and straight to the side closest to the back surface of the substrate main body, And a shape in which the tip is extended at a right angle to the side.

Incidentally, the thickness of the back electrode and the convex wiring is in the range of about 10 to 50 mu m, and the width of the convex wiring is in the range of about 10 to 300 mu m.

In the present invention, it is preferable that the plurality of back-surface electrodes are formed at four corners of the back surface of the substrate main body, and each back-surface electrode has a pair of opposing sides And a wiring board (claim 2) in which at least one of the convex wirings is formed.

According to this configuration, at least one convex wiring is formed between the four back electrodes formed on the back surface of the substrate main body and a pair of respective sides crossing (orthogonal) to each other on the back surface. Therefore, in the state of a plurality of connection wiring boards to be described later, connection wirings formed of mutually convex wirings between adjacent wiring boards are provided on at least two sides Respectively. As a result, when the plating current is supplied to each of the plurality of wiring boards, the plating current stably flows along the longitudinal direction, the lateral direction, and the oblique direction of the plurality of wiring boards. It is possible to provide a wiring board on which a metal plating film is more reliably covered.

In addition, when the plating current is supplied to each of a plurality of wiring boards, the plating current flows in a plurality of directions (longitudinal direction, lateral direction and oblique direction in plan view) between the plurality of wiring boards, The thickness of the metal plating film coated on the surface of the back electrode or the like exposed to the outside can be made uniform. Further, since the plating current flows along a plurality of directions (energizing paths), for example, even when one path among these plural energizing paths is disconnected, the surface of the back electrode or the like exposed to the outside The metal plating film can be surely covered.

In the present invention, a plurality of mounting electrodes are formed on the surface of the substrate main body surrounded by the frame-shaped conductor portion in a plan view, and also between the plurality of mounting electrodes and the plurality of back surface electrodes, And a wiring board which is electrically conducted individually by via conductors passing through the via conductors.

Accordingly, in the state of a plurality of connection wiring boards to be described later, since a plating current flows through a plurality of mounting electrodes via a back electrode and a via conductor, a metal plating film is surely formed on the surface of each mounting electrode Respectively.

On the other hand, a plurality of interconnecting wiring boards according to the present invention (claim 3) according to the present invention comprises: a product area formed by arranging a plurality of the wiring boards adjacent to each other along the vertical and horizontal directions in plan view; And a plurality of plating electrodes formed on the periphery of the ear portion, the plating electrode being formed on the peripheral side of the product region, And a pair of wiring boards adjacent to each other with a boundary therebetween in the product area, the wiring board having a pair of wiring boards And is electrically connected via a connection wiring extending over the boundary.

According to this arrangement, when an electrode or the like is brought into contact with the electrode for plating on the opposite side of the opposite side of the ear portion, the plating current flows through the plating wiring and the connection wiring, The back electrode, the connection wiring, and the plating wiring on the opposite side, and then flows to the plating electrode on the other opposite side in the above-mentioned ear portion. Alternatively, the plating current may flow from the back electrode for each wiring board in the product area via the plating wiring and the connection wiring to another backside electrode, the connection wiring, and the adjacent wiring board through the via conductor and the frame- Back electrode, etc., and the plating wiring on the opposite side, and then flows to the electrode for plating on the other opposite side in the above-mentioned ear portion. At this time, the plating current surely flows between the backside electrodes of each of the plurality of wiring boards, which are vertically and horizontally adjacent to each other in the product area, in the longitudinal direction, the transverse direction and the oblique direction via the connection wiring. Therefore, in the individual wiring boards, a plurality of connecting wiring boards, for example, a metal plating film such as Ni and Au reliably covered on the surface of the back electrode or the frame-like conductor portion exposed to the outside .

The plating electrode formed on each side of the ear portions of the plurality of connection wiring boards is a semicylindrical conductor portion formed along the inner wall face of the recessed fan recessed groove in a semicircular shape when viewed from the top.

The plating wiring formed on the ear portions of the plurality of connection wiring boards may include a plurality of wiring electrodes formed on the plating electrode and a plurality of wiring boards located on the peripheral side of the product region adjacent to the sides of the ear portions on which the plating electrodes are located, Extending from the plating electrode to each of the front ends of the plurality of wirings or extending along the sides of the back surface of the plurality of wirings to connect the front ends of the plurality of convex wirings extending from the plating electrode A root line portion extending from the main line portion to the plating electrode and a plurality of branch line portions extending from the main line portion to each of the ends of the plurality of convex wirings are included have.

The present invention also includes a plurality of connecting wiring boards (claim 4) in which grid-shaped dividing grooves are formed in a plan view along the boundary dividing a plurality of wiring boards on the surface side of the product area do.

According to this, for example, when the substrate main body is made of ceramic, a plurality of the wiring boards can be easily and accurately obtained by applying a shearing force along the dividing grooves.

In addition, the boundary is an imaginary line (vertical plane) that divides the wiring boards adjacent to each other in a plan view, and the entire boundary shows a lattice frame shape in plan view.

In addition, the dividing groove includes a form showing a U-shaped cross section by laser machining or a form showing a V-shaped cross section by insertion of a blade.

Further, when the connection wirings connecting the backside electrodes of the two wiring boards adjacent to each other with the boundary therebetween are formed along the division grooves, the connection wirings become the convex wirings.

Incidentally, the dividing groove may be formed by inserting the blade at a predetermined depth from the surface side of the boundary, even if the board body and the ear portion of each wiring board are made of resin.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing one embodiment of a wiring board according to the present invention; Fig.
Fig. 2 is a vertical sectional view along the arrow line XX in Fig. 1; Fig.
3 is a bottom view of the wiring board.
Fig. 4 is a vertical sectional view similar to Fig. 2 showing another type of wiring board. Fig.
Fig. 5 is a vertical sectional view similar to Fig. 2 showing another type of wiring board. Fig.
6 is a bottom view of the above-mentioned wiring board having the back electrode of the application type.
7 is a plan view showing a plurality of interconnecting wiring boards according to one embodiment of the present invention.
8 is a bottom view showing the plurality of connection wiring boards.
9 is a vertical cross-sectional view schematically showing an energizing structure of the plurality of connection wiring boards.
10 is a partial bottom view showing the relationship between the back electrode and the convex wiring.
11 is a bottom view of the wiring board having another type of back surface electrode.
12 is a bottom view of the wiring board including another type of back electrode.
13 is a bottom view of the wiring board having a back electrode of an application type.
14 is a partial bottom view of a plurality of interconnecting wiring boards for bundling a plurality of the wiring boards.

Hereinafter, modes for carrying out the present invention will be described.

1 is a vertical cross-sectional view taken along the line X-X in Fig. 1, and Fig. 3 is a bottom view of the wiring board 1a. As shown in Fig.

As shown in Figs. 1 to 3, the wiring board 1a is made of ceramic (insulating material), and includes a front surface 3 and a rear surface 4 in a rectangular shape in plan view and four side surfaces 5, Four back electrodes 10 formed on the respective corners of the back surface 4 of the substrate body 2a and a plurality of back electrodes 10 formed on the surface of the substrate body 2 3), and a metal ring (frame-shaped conductor portion) 7 on a rectangular frame as viewed in a plan view and a metal ring (frame-shaped conductor portion) 7 disposed on the periphery of the metal ring 7 and the four back- And a plurality of via conductors 9 individually penetrating between the front surface 3 and the back surface 4 of the substrate main body 2.

The single-layer ceramic layer constituting the substrate main body 2a is made of, for example, a high-temperature sintered ceramic such as alumina or a low-temperature sintered ceramic such as glass-ceramics. (So-called chipping) and anti-cracking arc walls 5a are formed between the side surfaces 5 of the four sides of the substrate main body 2a.

The four backside electrodes 10 show a rectangular shape when viewed from the bottom. Between these four back electrode 10 and each of the long side (side) 4a and the short side (side) 4b of the back surface 4 of the substrate main body 2a, The portion 4z is exposed in a strip shape. Between the outer side of each back electrode 10 and the short side 4b and the short side 4b that intersect at right angles to each other when viewed from the bottom surface and also adjacent to each pair of long side 4a and short side 4b, (12) are formed at right angle and extend in a straight line. The convex wirings 12 are rectangular (rectangular) as viewed from the bottom, but the shape is not limited thereto.

3, a rear surface electrode 10 positioned on the upper left side of the rear surface 4 of the substrate main body 2 is provided with a slant surface for identifying the position and posture of the substrate main body 2a itself, (11) are formed. The thickness of the back electrode 10 and the convex wirings 12 is in the range of about 10 to 50 mu m and the width of the convex wirings 12 is in the range of about 10 to 300 mu m.

The metal ring 7 is made of, for example, Kovar (Fe-29% Ni-17% Co), 42alloy (Fe-42% Ni), or 194 alloy P). The metal ring 7 has a substantially vertical cross section of each part and is formed of Ag formed between the peripheral surface of the surface 3 of the substrate main body 2a and the entire surface of the bottom surface of the metal ring 7. [ (Not shown) such as lead, and is fixed to the peripheral portion of the surface 3 thereof. A rectangular shaped cavity 6 is formed in a plan view as surrounded by the inner surface of the metal ring 7 and the surface 3 of the substrate body 2a. A pair of mounting electrodes 8a and 8b are formed on the surface 3 of the substrate body 2a surrounded by the metal ring 7 in plan view and also on the bottom surface of the cavity 6. [ One end of the quartz resonator 13 or the like is joined to the upper surface of the mounting electrodes 8a and 8b and between the pair of back electrodes 10 located on the left side in Fig. And the conductors 9 are connected individually.

In order to seal the opening of the cavity 6 in which the quartz vibrator 13 or the like is mounted, a metal cover (not shown) in a rectangular shape as viewed in a plan view is formed on the upper surface of the metal ring 7 by resistance welding or soldering Or the like. A semiconductor element (not shown) or the like may be mounted in the cavity 6 instead of the crystal oscillator 13. In this case, the mounting electrodes 8n may be formed of three or more (for example, four) , And they may be made individually conductive via the backside electrode 10 and the via conductor 9 positioned almost immediately below each other.

The four back electrodes 10 extending the pair of mounting electrodes 8a and 8b and the plurality of via conductors 9 and the pair of convex wirings 12 are formed on the substrate main body 2a, When W, Mo, Cu, or the like is formed by printing and the substrate main body 2a is made of a low-temperature sintered ceramic such as glass-ceramics in the case where the substrate body 2a is made of a high-temperature sintered ceramic such as alumina, Is formed by printing.

The convex wirings 12 are formed in such a manner that a space between the sides 4a and 4b of the back electrode 10 and the substrate main body 2a (a part 4z of the back surface 4) And may be a shape extending along an oblique direction or an arbitrary shape such as a trapezoid in a bottom view.

Fig. 4 is a vertical sectional view similar to Fig. 2 showing a wiring board 1b different from the wiring board 1a.

4, the wiring board 1b has a substrate main body 2b instead of the substrate main body 2a and also has the surface of the substrate main body 2b instead of the metal ring 7 And a frame-shaped metallization layer (frame-shaped conductor portion) 14, which is a rectangular frame, viewed from a plane formed in the frame-shaped metal layer 3. The substrate main body 2b includes a ceramic layer c1 having a flat plate shape and a ceramic layer c2 having a square cross section in the shape of a square frame viewed in plan view along the periphery of the surface 3b, And the surface 3 has a quadrangular outer shape and a rectangular frame shape as seen in a plan view. The frame-shaped metallization layer 14 is also made of a conductor layer formed by printing the same W, Mo, Cu or the like.

On the rear surface 4 of the substrate main body 2b are formed the same four back surface electrodes 10 and the respective long side surfaces 4a and short side surfaces 4b of the back surface 4 from the outer side thereof, The same convex wirings 12 are formed. The same cavity 6 is located on the surface 3b of the lower ceramic layer c1 surrounded by the upper ceramic layer c2 and the surface 3b The same mounting electrodes 8a and 8b are formed.

4, via conductors 9 passing through the ceramic layers c1 and c2 are separately disposed and formed between the frame-shaped metallization layer 14 and the four backside conductors 10 And the via conductors 9 passing through the ceramic layer c1 on the lower layer side are separately disposed between the mounting electrodes 8a and 8b and the two back conductor 10 located on the left side in Fig. .

Fig. 5 is a vertical sectional view similar to Fig. 2 showing the wiring board 1c different from the wiring boards 1a and 1b.

5, the wiring board 1c includes a substrate main body 2a in which a flat ceramic layer c1 on the lower layer side and a flat ceramic layer c2 on the upper layer side are integrally laminated, instead of the substrate main body 2a, (2c). The metal ring 7 on the rectangular frame in the plan view is fixed to the same surface along the periphery of the surface 3 of the substrate main body 2c. 5, for example, is provided between the ceramic layers c1 and c2, and a mounting electrode (not shown) formed on the surface 3, which is a bottom surface of the cavity 6 surrounded by the metal ring 7, Contact wirings 15 connecting the plurality of via conductors 9 through the ceramic layer c2 received from the through holes 8a and 8b are formed. 5, the via conductors 9 other than the above penetrate through between the ceramic layers c1 and c2 or only through the ceramic layer c1 on the lower layer side. A power supply layer or a ground layer (not shown) may be formed between the ceramic layers c1 and c2.

6 is a bottom view of the wiring board 1a having the back electrode 10 of the application type.

6, four back-surface electrodes 10 are formed on the back surface 4 of the substrate main body 2a of the wiring board 1a in the same manner on the respective corners of the back surface 4, One electrically conductive wire 12 is formed between each of the back electrode 10 and the short side 4b of the back surface 4. [ In addition, two convex wirings 12 are formed between each back electrode 10 and the long side 4a of the back surface 4, respectively.

6, four back-surface electrodes 10 formed on each corner of the back surface 4 of the back surface 4 of the substrate main body 2a and four back- A total of twelve convex wirings 12 are formed in each of the three pairs of adjacent pairs of sides 4a and 4b intersecting at right angles to each other.

It is also possible to apply the back electrode 10 having the convex electrodes 12 of the above form to the wiring boards 1b and 1c by replacing the substrate main body 2a with the substrate bodies 2b and 2c Do.

A plurality of back electrode 10 formed on the rear surface 4 of each of the board bodies 2a to 2c is electrically connected to each of the long side 4a, The convex electrode 12 is formed across the portion 4z of the back surface 4 so as to be separated from the back surface 4b. If the outer peripheral side of the plurality of back electrode 10 formed on the back surface 4 of the substrate main body 2a to 2c is in contact with each of the long side 4a and the short side 4b of the back surface 4, And the outer peripheral side of the electrode 10 is exposed on the side surface 5. When the solder used in the mounting of the wiring board is mounted on a main board such as a printed board or the like, the back electrode 10 receives a tensile force, The back electrode 10 may peel off from the boundary line between the substrate 10 and the substrate main body 2a to 2c. Particularly when the side faces 5 of the substrate main bodies 2a to 2c have the groove face on the side of the surface 3 and the broken faces on the side of the back side 4, It is easy to peel off.

On the other hand, according to the wiring boards 1a to 1c, since the outer peripheral side of the back electrode 10 is not exposed on the side surface 5, when the solder used for the mounting is cooled and hardened, It is difficult to cause problems such as peeling off of the outer peripheral side of the back electrode 10, even if the electrode 10 receives a tensile force.

When the convex wiring 12 is largely exposed on the side surface 5, the outer peripheral side of the back electrode 10 is in contact with the long side 4a and the short side 4b of the back side 4 The back electrode 10 may be easily peeled off. Therefore, it is necessary to appropriately select and design the width, the thickness, and the area exposed to the side surface of the convex wirings 12.

Between the back electrode 10 and each pair of long side 4a and short side 4b crossing (orthogonal) to each other in the back surface 4 of the substrate main body 2a to 2c, One or two convex wirings 12 are formed in a state in which a plurality of the wiring boards 1a to 1c are arranged side by side along a longitudinal direction and a lateral direction so as to be adjacent to each other The connection wirings 32 made up of the convex wirings 12 mutually between the wiring substrates 1a to 1c which are arranged on the rear side 4 of each of the board bodies 2a to 2c, At least one or more of them are arranged in the short side 4b. Therefore, when the plating current is supplied, the plating current flows along the longitudinal direction, the transverse direction and the oblique direction of the plurality of wiring boards 1a to 1c. Therefore, the mounting electrodes 8a (8a) formed on the surfaces 3 and 3b of the plurality of back electrodes 10, the metal ring 7 or the frame-shaped metallization layer 14 and the substrate bodies 2a to 2c, And 8b, which are exposed to the outside. The wiring boards 1a to 1c are reliably covered with a metal plating film.

Fig. 7 is a plan view of a plurality of interconnecting wiring boards 20 in which a plurality of the interconnecting boards 1a are longitudinally and laterally connected. Fig. 8 is a bottom view of the plurality of interconnecting wiring boards 20. Fig. Sectional view showing an outline of the energizing structure of the plurality of connection wiring boards 20 in this embodiment.

As shown in Figs. 7 and 8, the plurality of interconnecting wiring boards 20 includes a product region 21, which is a rectangular shape as seen from a plane where a plurality of the wiring boards 1a are arranged adjacently along the longitudinal and lateral directions, And an ear portion 22 on the rectangular frame which surrounds the periphery of the product region 21 as viewed from the top and has a front surface 3 and a back surface 4 made of the same ceramic (insulating material). A virtual boundary 23 for partitioning between the plurality of wiring boards 1a located in the product area 21 and between the product area 21 and the ear 22 is formed in a plan view And is set in advance in a lattice pattern. A circular through hole 25 is formed in each of the positions at which the boundaries 23 intersect at right angles with respect to the plane. The through hole 25 forms the arc wall 5a when divided into the wiring board 1a later.

Two semicircular concave grooves 27 are formed in each circumferential side of the pair of opposing long sides of the ear portion 22 in plan view, A plating electrode 26 having a semicircular shape and showing a semicircular shape as a whole is formed.

8, a pair of the plating electrodes 26 located at each of the long sides of the ear portion 22 and the plating electrode 26 for each of the wiring boards 1a located on the peripheral side of the product region 21 Plating wirings 28 are formed between the back electrodes 10 so as to conduct them therebetween. The plating wiring 28 includes a trunk portion 30 extending elongated along the longitudinal direction at each long side of the ear portion 22 and a root portion 30 extending from the trunk portion 30 to each plating electrode 26 And a branch line portion 31 extending between the main line portion 30 and the back electrode 10 for each wiring board 1a.

8, a boundary 23 is formed between the back electrodes 10 and 10 of the pair of wiring boards 1a adjacent to each other along the vertical and lateral directions in the product area 21. In this case, (Crossing) the wiring lines 32 to electrically connect each other.

9, dividing grooves 24 having a predetermined depth from the surface 3 are formed on the surface 3 side of the boundary 23 in a lattice form as seen from a plan view. The division grooves 24 are formed on the front surface side of the single green sheet for connecting the wiring boards 1a and the ear portions 22 in the product region 21 And the blade has a V-shaped cross section in a vertical cross-section.

Also, the plating wiring 28 is made of the same W, Mo, or Cu.

The branch line portion 31 includes a portion that becomes the convex wiring 12 in the product region 21 when the plurality of wiring boards 1a are separately divided thereafter and the connection wiring 32 Is divided into the convex wirings 12 for each wiring board 1a when divided equally.

The metal ring 7 used for the wiring board 1a is fixed to the peripheral portion of the surface 3 via a brazing material (not shown) such as Ag lead. On the other hand, with the miniaturization of the wiring board 1a, pitches of adjacent metal rings 7 in the plurality of connection wiring boards 20 are narrowed. As a result, if a sufficient amount of the brazing material is used for the fixing, the brazing material may flow out to the brazing material of the neighboring wiring board 1a. For this reason, in the plurality of interconnecting wiring boards 20 in which the plurality of wiring boards 1a are arranged in the longitudinal and lateral directions, the dividing grooves 24 are formed along the surface 3 side of the boundary 23, It is possible to prevent a situation in which the lead material flows to the neighboring wiring board 1a. Since the dividing grooves 24 are formed on the surface 3 side, the connection wirings 32 for electrically connecting each other across (crossing) the side of the rear surface 4 of the boundary 23, (4).

The through hole 25 becomes the arc wall 5a located at each corner of the substrate main body 2a for each wiring substrate 1a when divided in the same manner as described above.

In addition, the vertical cross section of the dividing groove 24 may be U-shaped by irradiating the green sheet from the surface side of the green sheet while scanning the laser in a lattice form as seen from the plane.

9, when an electrode or the like is brought into contact with the electrode 26 for plating on one side of the long side of the ear portion 22 to energize the plating, The electric current is supplied to the backside electrode 10 on the peripheral side of the peripheral wiring board 1a in the product area 21 via the plating wiring 28 (29 to 31), the via conductor 9 The metal wiring 7 and the via conductors 9 and the back electrode 10 at the center side in the product area 21 and through the connection wiring 32 to the adjacent wiring board The via conductors 9, the metal ring 7, the via conductors 9 and the back electrode 10 on the side opposite to the above are flowed through the plating wiring 28 And flows from the ear portion 22 to the plating electrode 26 on the other long side. At this time, the plating current flows between the back electrodes 10 of the plurality of wiring boards 1a adjacent to each other along the vertical and horizontal directions in the product area 21 via the connection wirings 32, It flows surely along the horizontal and oblique directions.

The metal ring 7 and the electrodes 8a and 8b for mounting which are exposed to the outside when they are divided into the individual wiring boards 1a along the division grooves 24. Therefore, For example, a plurality of interconnecting wiring boards 20 capable of providing a plurality of wiring boards 1a on which necessary metallic plating films such as Ni and Au are securely coated.

The plurality of interconnecting wiring boards 20 may be formed in such a manner that a plurality of the wiring boards 1b or a plurality of the wiring boards 1c are vertically and horizontally arranged in the product area 21 thereof. In the case of the wiring board 1c, on the other hand, the dividing groove 24 is formed on the side of the front surface 3 of the boundary 23, but the wiring board 1a is formed by the thickness of the ceramic layers c1, It is necessary to form the dividing grooves 24 deeper than the arrangement formed. In this form, in order to form a connection wiring 32 on the rear surface 4 side for electrically connecting each other across (crossing) the boundary 23 in the plurality of connection wiring boards 20, It is easy to form the recess 24 deeply.

10 is a partial bottom view showing the relationship between the back electrode 10 and the convex wiring 12. FIG.

The back electrode 10 formed on each corner side of the back surface 4 of the board main bodies 2a to 2c of the wiring boards 1a to 1c has a substantially rectangular shape as viewed from the bottom surface, At least one (one pair) of the convex wirings 12 is formed toward the long side 4a and the short side 4b intersecting each other on the rear surface 4 from the middle of each of the two sides.

10, a pair of adjacent convex wirings 12 crossing (orthogonal) to each other with the corner interposed therebetween is formed on the back electrode 10 formed on the corner side of the rear surface 4, At least their bases do not intersect with each other but are connected to the outside of the back-side electrode 10. The back electrode 10 including the pair of convex wirings 12 of this type can be applied to all of the wiring boards 1a to 1c and can also be included in the plurality of connection wiring boards 20 .

11 is a bottom view of the wiring board 1a having another type of backside electrode 10a.

11, along the pair of long sides 4a of the back surface 4 of the back surface 4 of the board body 2a of the wiring board 1a, A pair of backside electrodes 10a are formed by separating the back side portions 4z of the strips from the pair of short sides 4a adjacent to each other and forming an elongated (trapezoidal) . The back electrode 10a has four convex wirings 12 in total, two on each corner side of the long side 4a of the back side 4 and four convex wirings 12 on the corner side of a pair of left and right short sides 4b One convex wiring 12 is extended to the long side 4a and the short side 4b. 11, a concave portion 11a for confirming the position and posture is formed on the inner side of the upper side back electrode 10a.

The backside electrode 10a including the plurality of convex wirings 12 may be applied to the wiring boards 1b and 1c or may be included in the plurality of connection wiring boards 20 as well.

The pair of backside electrodes 10a may be formed in the same manner in proximity to each pair of short sides 4b of the back surface 4. [

12 is a bottom view of the wiring board 1a including the back electrode 10b of still another form.

12, the same pair of backside electrodes 10 is formed on the left side of the rear face 4 of the back side 4 of the board body 2a of the wiring board 1a, On the right side of the back side 4 along the vicinity of the short side 4b on the right side of the figure and extending from the short side 4b and a pair of adjacent long side 4a to the back side of the back side 4z And one rear electrode 10b is formed in the shape of a rectangle or trapezoid when viewed from the bottom. That is, in the back surface 4, a total of three pairs of the back electrode 10 and the back electrode 10b are formed. The back electrode 10b includes four convex wirings 12 in total, one for each corner on the right side short side 4b and one for each corner side of a pair of long side 4a adjacent to the short side 4b Are extended toward the sides 4a and 4b.

The shape of the total of three pairs of the back electrode 10 and the back electrode 10b as described above may be applied to the wiring boards 1b and 1c, 20).

One back electrode 10a is formed along one side of the long side 4a of the back surface 4 and two back side electrodes 10b are formed on each corner side of the other long side 4a. (10) may be formed.

13 is a sectional view of the back surface 4 of the substrate main body 2a of the wiring board 1a in which the four back electrode 10 are separately arranged on the corner side of the back surface 4 3 is a bottom view showing an application form of the form shown in Fig.

As shown in Fig. 13, four back electrodes 10 are separately formed on the back surface 4 of the substrate main body 2a for each corner side of the back surface 4, and the back electrode 10 One convex wiring 12 is formed in the middle of the outer side of each side of the back surface 4 and the back side portion 4z between the long side 4a and the short side 4b. Of the pair of left and right pair of back electrodes 10 adjacent to each other along the pair of upper and lower long sides 4a of the back surface 4 in FIG. 13, the left upper back electrode 10 and the right lower right electrode Convex wirings 12a that show an L shape as viewed from the bottom face of the rear electrode 10 toward the middle of the long side 4a from the inner side on the side of the back electrode 10 adjacent to the left or right side And are formed in point symmetry.

The pair of convex wirings 12a may be applied to the wiring boards 1b and 1c or the backside 4 shown in Fig.

14 is a partial bottom view showing a part of the product region 21 in a plurality of connection wiring boards 20 in which a plurality of the wiring boards 1a are vertically and laterally adjacent to each other.

As shown in Fig. 14, in each of the rear surface 4 of the substrate main body 2a of the plurality of wiring boards 1a partitioned by the above-described boundary 23, The individual back electrode 10 positioned is located between the rear electrode 10 of the wiring board 1a adjacent to the boundary 23 with a gap therebetween in the middle of each pair of outer sides And are electrically connected by a connection wiring 32 to be connected. It should be noted that in each of the rear surfaces 4 of the pair of wiring boards 1a adjacent to each other with the boundary 23 interposed between the respective long sides 4a, A connection wiring 33 (hereinafter, referred to as " connection wiring ") 33, which intersects the boundary 23 at right angles with the boundary 23 and has a longitudinally long Z- Is formed. The connection wiring 33 is formed by dividing the plurality of interconnecting wiring boards 20 viewed along the boundary 23 into a plurality of wiring boards 1a, 12a.

By adding a plurality of the connection wirings 33 as described above to the back surface 4 of the substrate main body 2a in each wiring board 1a in the product area 21 of the connection wiring board 20, The plating current can be more reliably and uniformly conducted to the entire conductor portion such as the back electrode 10 of the plurality of wiring boards 1a.

A configuration in which a pair of convex wirings 12a are additionally formed to the pair of back electrodes 10 on the back surface 4 is applied to the wiring boards 1b and 1c, A plurality of connection wiring boards 20 may be formed by arranging a plurality of these in the product area 21.

The present invention is not limited to the above-described embodiments.

For example, the insulating material constituting the substrate main body may be made of epoxy resin or the like. The substrate main body made of the resin can be made, for example, of a so-called copper-clad resin substrate in which a copper foil is attached to both sides of a single resin plate, or a plurality of flat resin layers or a flat resin layer and a frame- May be laminated.

The substrate body may be formed by laminating a ceramic layer and a resin layer.

In addition, the front and back surfaces of the substrate body are not limited to the rectangular shape having a pair of long sides and short sides, and may have a tetragonal shape having substantially the same length.

The arc wall located at each corner of the substrate main body may be omitted, and the through holes in the plurality of connection wiring boards may be omitted.

The back electrode may be formed on the back surface of the substrate main body so as to be spaced apart from each other by five or more (e.g., six or eight).

At least one via conductors are formed separately between the plurality of back electrodes and the frame-shaped conductor portion on the front surface side of the substrate body, but when the total number of back electrodes formed on the back surface of the substrate body is three or more At least one or more of them may be separately formed between the two backside electrodes and the frame-like conductor portion.

The convex wiring is not limited to a rectangular shape as viewed from the bottom surface between the back electrode and each side of the substrate main body (a part of the back surface), but may be a parallelogram (oblique direction) , A curved shape that curves, a trapezoidal shape, or the like.

In addition, the plurality of connection wiring boards may have a rectangular shape in plan view, and the external and internal shapes of the ear portions may be square and substantially top-shaped.

In addition, the plating electrode and the plating wiring in the plurality of connection wiring boards may be arranged in every four sides of the ear portion.

According to the present invention, it is possible to encapsulate various electronic parts such as a quartz oscillator on the surface of the substrate body, to reliably coat the surface of the conductor exposed to the outside with a metal plating film, It is possible to reliably provide a wiring board which does not cause a problem in the back electrode and a plurality of connection wiring boards to which a plurality of wiring boards are connected.

1a to 1c: wiring board
2a to 2c:
3, 3b: surface
4:
4a: Long side (side)
4b: Short side (side)
4z: part of the back side
7: Metal ring (frame-shaped conductor)
9: via conductor
10, 10a, 10b: back electrode
12, 12a: convex wiring
14: frame-shaped metallization layer (frame-shaped conductor section)
20: a plurality of connection wiring boards
21: Product area
22: Your ear
26: Plating electrode
28: Plated wiring
32, 33: connection wiring

Claims (4)

A substrate main body made of an insulating material and having a rectangular-shaped surface and a back surface in plan view,
A plurality of backside electrodes formed on the back surface of the substrate body,
A frame-shaped conductor portion disposed on a front surface side of the substrate main body and having a rectangular frame in plan view,
And a via conductor which penetrates through the substrate main body and conducts between the plurality of back surface electrodes and the frame-shaped conductor portion,
A part of the back surface is exposed between the plurality of back surface electrodes and the respective sides of the back surface of the substrate main body,
Wherein at least one or more convex wirings are formed between the plurality of back electrodes and a pair of respective sides of the back face of the substrate main body that intersect with each other. The method according to claim 1,
Wherein the plurality of back electrodes are formed at four points on each corner side of the back surface of the substrate main body and each back electrode has at least a pair of Wherein at least one of the convex wirings is formed. A product region formed by arranging a plurality of wiring boards according to claim 1 or 2 along a vertical and horizontal direction in a plan view,
A ear portion which is made of the same insulating material as that of the substrate main body and has a front surface and a back surface and surrounds the periphery of the product area and shows a rectangular frame image in plan view,
A plurality of plating electrodes formed around the tabs,
And a plating wiring which conducts between the plating electrode and the convex wiring on each of the wiring boards located on the peripheral side of the product area,
Wherein a pair of wiring boards adjacent to each other with a boundary therebetween in the product area is formed by a pair of the convex wirings and electrically connected via a connection wiring extending over the border Connecting wiring board. The method of claim 3,
Wherein a plurality of grid-shaped dividing grooves are formed along the boundary dividing the plurality of wiring boards on the surface side of the product region.
KR1020150137131A 2014-09-30 2015-09-25 Wiring substrate and multi-piece wiring substrate KR101985056B1 (en)

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Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
CN108604888B (en) * 2016-05-31 2019-08-27 株式会社村田制作所 The assembly substrate of piezoelectric vibration device carrying and its manufacturing method, the manufacturing method of piezoelectric vibrator
WO2018216693A1 (en) * 2017-05-23 2018-11-29 京セラ株式会社 Multi-piece wiring substrate, electronic component housing package, and electronic device
JP6886043B2 (en) * 2017-11-29 2021-06-16 Ｎｇｋエレクトロデバイス株式会社 Sheet substrate and sheet substrate manufacturing method
WO2021106655A1 (en) * 2019-11-26 2021-06-03 京セラ株式会社 Package for housing electronic component, electronic device, and electronic module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236775A (en) * 2004-02-20 2005-09-02 Seiko Epson Corp Package for piezoelectric device and method for manufacturing piezoelectric device
JP2008005088A (en) 2006-06-21 2008-01-10 Epson Toyocom Corp Package for piezoelectric vibrator and piezoelectric vibrator, and piezoelectric oscillator

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3778773B2 (en) * 2000-05-09 2006-05-24 三洋電機株式会社 Plate-shaped body and method for manufacturing semiconductor device
JP2005340542A (en) * 2004-05-27 2005-12-08 Kyocera Corp Multiple patterning substrate
US8080869B2 (en) * 2005-11-25 2011-12-20 Panasonic Electric Works Co., Ltd. Wafer level package structure and production method therefor
JP4484934B2 (en) * 2008-02-26 2010-06-16 富士通メディアデバイス株式会社 Electronic component and manufacturing method thereof
JP5665145B2 (en) * 2010-10-08 2015-02-04 日本特殊陶業株式会社 Multi-piece wiring board and manufacturing method thereof
JP5753734B2 (en) * 2011-05-19 2015-07-22 日本特殊陶業株式会社 Wiring board, multi-cavity wiring board, and manufacturing method thereof
KR20140109849A (en) * 2011-12-27 2014-09-16 니혼도꾸슈도교 가부시키가이샤 Circuit board and multi-cavity circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236775A (en) * 2004-02-20 2005-09-02 Seiko Epson Corp Package for piezoelectric device and method for manufacturing piezoelectric device
JP2008005088A (en) 2006-06-21 2008-01-10 Epson Toyocom Corp Package for piezoelectric vibrator and piezoelectric vibrator, and piezoelectric oscillator

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