KR20160024647A - Grid device for preventing scattering of radiation, and method for manufacturing the same - Google Patents

Abstract

According to the present invention, a grid device for preventing scattering of radiation and a manufacturing method thereof are disclosed. According to the present invention, the grid device for preventing scattering of radiation comprises a substrate in which a plurality of microholes having predetermined patterns is formed. The substrate is a glass or ceramic substrate and a radiation shielding material is coated on surfaces of the micro holes. Therefore, the present invention has simple manufacturing processes to reduce manufacturing costs.

Description

Technical Field [0001] The present invention relates to a grid device for preventing scattering of radiation, and a manufacturing method thereof. [0002]

The present invention relates to a grid apparatus for a radiation imaging apparatus and a method of manufacturing the grid apparatus.

Imaging devices using radiation (e.g., X-rays) are widely used in the medical field.

X-ray imaging in the medical field is one of the basic elements of a wide range of medical activities. X-ray imaging involves radiographing X-rays on the body part to be examined, It is a radiation examination method. This is because when the x-ray penetrates the human body, the amount of absorption is different from tissue to tissue. The x-ray is partially absorbed while passing through the human body, and some parts are scattered and blurred.

An X-ray grid is used to prevent images from being blurred by scattered x-rays and is placed between the subject (human body) and the film.

However, there is a problem that the x-ray having the information of the object passing through the subject loses information due to self-scattering before reaching the detector. An x-ray grid is used as a structure to block scattered light and selectively transmit only unscattered x-rays.

An X-ray grid according to the prior art is made by cutting a lead sheet and an aluminum sheet with an epoxy or the like to a predetermined thickness and attaching the lead sheet and the aluminum sheet at a certain angle in a line.

The X-ray grid according to the prior art thus manufactured has an excessively long manufacturing process and has many limitations on the shape to be made. Also, since the current thinnest lead sheet is only about 20um, as the number of lines per inch increases, a product that can cope with is also limited.

1. Korean Patent Publication No. 10-2001-0044474 (June 05, 2001) 2. Korean Patent Publication No. 10-2012-0009811 (Feb. 02, 2012)

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a grid for preventing radiation scattering and a method of manufacturing the same.

According to another aspect of the present invention, there is provided a method of manufacturing a radiation scattering grid, including: forming a plurality of micro holes having a predetermined pattern on a substrate; And coating a surface of the barrier rib between the microholes with a radiation shielding material.

The radiation shielding material may be a multilayer film or an alloy including at least one of lead, gold, tungsten, copper, nickel, and silver.

The coating thickness of the radiation shielding material may be between 5 and 20 um.

The substrate may be a photosensitive glass substrate.

 The forming of the plurality of micro holes may include forming a grid pattern on the photosensitive glass to form the microholes, and exposing the region to laser according to the grid pattern; Heat-treating the glass exposed by the laser to crystallize the region; And removing the crystallized region.

 The step of coating the wall surface of the microholes with a radiation shielding material may be carried out by one or more of electroless plating, electroplating, and vapor-phase chemical vapor deposition.

A grid apparatus for preventing radiation scattering according to an embodiment of the present invention can be manufactured by the above method.

The grid device for radiation scattering prevention according to the embodiment of the present invention

And a substrate on which a plurality of micro holes having predetermined patterns are formed.

The substrate is a glass or ceramics substrate, the aspect ratio of the barrier between the plurality of microholes is 10 to 40, and the surface of the barrier is coated with a radiation shielding material.

According to the embodiment of the present invention, the manufacturing process of the grid for preventing radiation scattering is simple and the manufacturing cost can be reduced.

In addition, according to the embodiment of the present invention, the manufacturing process of the grid for preventing radiation scattering is simple and can be applied to various products, and there is no limit to the products that can cope with.

1 is a view schematically showing a radiation imaging apparatus according to an embodiment of the present invention.
FIG. 2 is a view showing the radiation scattering prevention grid shown in FIG. 1. FIG.
Figs. 3A and 3B are enlarged views showing an embodiment of a first portion and a second portion of the grid shown in Fig. 2, respectively. Fig.
Figs. 4 and 5 are enlarged views showing another embodiment of the first portion of the grid shown in Fig. 2. Fig.
6 is a flowchart schematically showing a method of manufacturing a grid according to an embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a grid apparatus according to an embodiment of the present invention.
8 to 11 are vertical sectional views sequentially showing an embodiment of a method of manufacturing a grid according to an embodiment of the present invention.

It is to be understood that the specific structural or functional descriptions of embodiments of the present invention disclosed herein are only for the purpose of illustrating embodiments of the inventive concept, But may be embodied in many different forms and is not limited to the embodiments set forth herein.

Embodiments in accordance with the concepts of the present invention are capable of various modifications and may take various forms, so that the embodiments are illustrated in the drawings and described in detail herein. It should be understood, however, that it is not intended to limit the embodiments according to the concepts of the present invention to the particular forms disclosed, but includes all modifications, equivalents, or alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are intended to distinguish one element from another, for example, without departing from the scope of the invention in accordance with the concepts of the present invention, the first element may be termed the second element, The second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, . On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between. Other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises ", or" having ", or the like, specify that there is a stated feature, number, step, operation, , Steps, operations, components, parts, or combinations thereof, as a matter of principle.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning of the context in the relevant art and, unless explicitly defined herein, are to be interpreted as ideal or overly formal Do not.

In the drawings, the thicknesses of layers and regions are exaggerated for clarity. When a layer is referred to as being "on" another layer or substrate, or when it is mentioned that a layer is bonded or bonded to another layer or substrate, it may be formed directly on another layer or substrate, May be intervening. Like numbers refer to like elements throughout the specification.

Terms such as top, bottom, top, bottom, front, rear, or top, bottom, etc. are used to distinguish relative positions in the components. For example, in the case of naming the upper part of the drawing as upper part and the lower part as lower part in the drawings for convenience, the upper part may be named lower part and the lower part may be named upper part without departing from the scope of right of the present invention .

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings.

1 is a view schematically showing a radiation imaging apparatus according to an embodiment of the present invention. The radiation imaging apparatus includes a radiation irradiator 1, a radiation scattering prevention grid 10 (hereinafter abbreviated as 'grid'), and a radiation detector 3.

The radiation irradiator 1 is a device for irradiating radiation (e.g., x-rays, alpha rays, beta rays, gamma rays, etc.) to an object (object, e.g. According to the embodiment, the radiation irradiator 1 may be an X-ray irradiator capable of irradiating an X-ray.

The grid 10 is a device that passes through a subject (for example, a human body) 2 to block scattering of radiation having information of a subject and selectively transmit only non-scattered radiation. The grid 10 includes a subject 2 and a radiation detector 3 . That is, the grid 10 is used to prevent the image from being blurred by the scattered radiation.

The radiation detector 3 is a device for detecting the radiation that is received through the subject 2 and the grid 10. [

FIG. 2 is a view showing the radiation scattering prevention grid shown in FIG. 1. FIG. Referring to FIG. 1, a radiation scattering prevention grid 10 according to an embodiment of the present invention includes a plurality of microholes 110 formed in a predetermined pattern on a substrate 100.

The substrate 100 may be a glass substrate or a ceramics substrate. When the substrate 100 is a glass substrate, the glass may be a photosensitive glass. In this embodiment, it is assumed that the substrate 100 is a glass substrate.

The shape of the pattern and the shape of the microholes 110 may vary. For example, the shape of the microhole may be circular or any polygonal shape (e.g., triangular, rectangular, pentagonal, hexagonal, octagonal, etc.).

Figs. 3A and 3B are enlarged views showing an embodiment of a first portion 11 and a second portion 12 of the grid 10 shown in Fig. 2, respectively. 3A and 3B show an embodiment of the microholes 110a having a honeycomb pattern (i.e., a hexagonal pattern), but the embodiment of the present invention is not limited thereto.

Figs. 4 and 5 are enlarged views showing another embodiment of the first portion 11 of the grid 10 shown in Fig.

Fig. 4 shows an embodiment of microholes 110b having a circular pattern, and Fig. 5 shows an embodiment of microholes 110c having a rectangular pattern.

The micro holes 110 may be formed as a through hole passing through the glass substrate by drilling holes of a specific shape using a predetermined manufacturing method (to be described later) on the glass substrate. A partition wall (a partition wall between holes and holes) 150 is formed between the micro holes 110 thus formed.

The aspect ratio of the barrier ribs 150 formed between the microholes 100 may be between 10 and 40, but is not limited thereto.

The aspect ratio of the barrier ribs 150 means the ratio of the width to the height of the barrier ribs. For example, if the width of the barrier rib 150 is 10 and the height of the barrier rib is 100, the aspect ratio of the barrier rib is 10, the width of the barrier rib is 10, and the height of the barrier rib is 400.

The surface of the wall of the microholes 110, that is, the surface of the partition 150, is coated with a radiation shielding material.

The radiation shielding material may be one of lead, gold, tungsten, copper, nickel, and silver, or may be a multilayer film or an alloy including two or more.

For example, the glass substrate 100 on which the microholes are formed may be nickel plated or gold plated to coat the wall surface of the microholes 110 with a radiation shielding material.

The coating thickness of the radiation shielding material may be between 5 and 20 um, but is not limited thereto. The glass may be photosensitive glass.

FIG. 6 is a flowchart schematically illustrating a method of manufacturing a grid according to an embodiment of the present invention, and FIG. 7 is a flowchart illustrating a method of manufacturing a grid apparatus according to an embodiment of the present invention.

8 to 11 are vertical sectional views sequentially showing an embodiment of a method of manufacturing a grid according to an embodiment of the present invention.

6 to 11, a plurality of microholes 110 having a predetermined pattern is formed on the glass 100 (S10).

For this purpose, a photosensitive glass substrate 100 may be provided. A photosensitive glass is generally in a transparent glassy state, but it may become opaque due to a crystalline state formed therein by an exposure and a heat treatment process. The photosensitive glass substrate 100 may include a photosensitive glass in a glass state or in a crystalline state.

The method of forming the plurality of microholes 110 in the photosensitive glass substrate 100 may be various.

In one embodiment, the step S10 of forming the plurality of micro holes 110 in the photosensitive glass substrate 100 may include S110 to S130 shown in FIG. 7, but the present invention is not limited thereto.

(Hereinafter, referred to as a 'microhole area') 120 on which the microholes 110 are to be formed may be displayed on the photosensitive glass substrate 100 in a glass state. That is, the micro hole region 120 can be distinguished by drawing a grid pattern on the glass substrate 100 or attaching a pattern sheet. Then, in the glass substrate 100, only the microhole region 120 is exposed with a laser (S110).

For example, after a predetermined grid pattern for displaying the microhole area 120 is drawn on the photosensitive glass substrate 100, the microhole area 120 is exposed with a laser according to the drawn grid pattern to form a grid pattern (S110).

In FIG. 8, reference numeral 120 denotes a microhole region 120.

Next, the pattern shape can be crystallized by heat-treating the glass substrate 100 on which the grid pattern is formed (S120). For example, the micro-hole region 120 can be crystallized by inserting the laser-exposed glass substrate 100 into a heat treatment apparatus and performing a heat treatment at a predetermined temperature for a predetermined period of time (S120).

The temperature during the heat treatment may be 500 ° C or more, for example, 550 ° C to 800 ° C (550 ° C to 800 ° C). When the heat treatment is performed at about 500 degrees centigrade, the microhole region 120 can be in a meta-stable crystalline state. When the heat treatment is performed at about 800 degrees centigrade, the microhole region 120 is stable ) Can be a single crystal state.

In FIG. 9, reference numeral 121 denotes a crystallized microhole region 120. The glass substrate 100 other than the crystallized microhole region 120 may remain in the amorphous state.

Next, the microhole region 120 crystallized in the glass substrate 100 may be removed to form the actual microholes 110 (S130). According to an embodiment, the crystallized microhole region 120 may be etched through an etching process (S130). For example, a hydrofluoric acid aqueous solution (for example, a 7% hydrofluoric acid aqueous solution) containing hydrogen fluoride (HF) may be used to remove the crystallized microhole region 120. The crystallized microhole region 121 is etched through the etching process to form microholes 110 passing through the glass substrate 100.

When a plurality of microholes 110 having a predetermined pattern are formed on the glass 100 as described above, a radiation shielding material is coated on the walls of the microholes (S20).

For example, a surface of a glass substrate on which a plurality of microholes 110 are formed is coated with a radiation shielding material (S20).

In one embodiment, the step S20 of coating the radiation shielding material may include, but is not limited to, S140 through S150 shown in FIG.

First, the metal thin film 120 may be formed on the surface of the glass substrate 100 on which the microholes 110 are formed (S140). The surface of the glass 100 is not readily plated. Therefore, the surface of the glass substrate 100 and the microholes 110 can be plated with a thin metal film before the plating process.

According to the embodiment, a titanium thin film or a copper thin film may be formed on the surface of the glass 100 on which the microholes are formed and on the wall surface of the microholes by a sputtering method (S140). However, a metal thin film may be formed by another method.

For example, the metal thin film 120 may be formed by physical vapor deposition (PVD) or chemical vapor deposition (CVD).

The physical vapor deposition method is a method of coating a gasified substance in a vacuum on a basic surface, and is divided into a vacuum deposition method and a sputtering method. Vacuum deposition is a method in which a metal is heated in a high vacuum and the evaporated metal particles are attached to a substrate to form a thin film. Sputtering refers to a process in which a thin film is formed on an object surface by using a phenomenon that an atom or molecule constituting the material protrudes and adheres to an object surface around the material when an ion impact is applied to the material.

The chemical vapor deposition method is a method in which a raw material gas is flowed on a substrate to be coated in the manufacturing process, external energy is applied to form a thin film by chemical coupling, decomposition of a raw material gas, or the like.

Next, the glass substrate 100 on which the metal thin film is formed is plated with metal (S150).

According to an embodiment, the shielding material coating process S20 may comprise one or more electroplating processes. For example, the glass on which the metal thin film is formed may be electroless-plated using nickel, gold or the like, and then electroplated using nickel, silver, gold, or the like.

As described above, the radiation shielding material may be a multilayer film or an alloy including at least one of lead, gold, tungsten, copper, nickel, and silver.

Fig. 11 shows the glass substrate after the radiation shielding material coating step S20 is completed. As shown in FIG. 11, the surface of the glass substrate 100 and the wall surface of the microholes 100 are coated with the radiation shielding material 130. The coating thickness of the radiation shielding material may be between 5 and 20 um, but is not limited thereto.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

The radiation irradiator 1, the radiation scattering prevention grid 10,
The radiation detector 3, the glass substrate 100,
The microholes 110, 110a, 110b, 110c,

Claims (8)

And a substrate on which a plurality of microholes having a predetermined pattern are formed,
The substrate is a glass or ceramics substrate,
An aspect ratio of the partition walls between the plurality of microholes is 10 to 40,
And a surface of the barrier rib is coated with a radiation shielding material. The method of claim 1, wherein the radiation shielding material
Wherein the multilayered film or alloy is a multilayered film or an alloy including at least one of lead, gold, tungsten, copper, nickel, and silver. The method according to claim 1,
Wherein the coating thickness of the radiation shielding material is between 5 and 20 um. The glass substrate according to claim 1, wherein the glass substrate
Wherein the substrate is a photosensitive glass substrate. Forming a plurality of micro holes having a predetermined pattern on a substrate; And
And coating a surface of the barrier rib between the microholes with a radiation shielding material. 6. The method of claim 5, wherein the substrate is a photosensitive glass substrate,
The step of forming the plurality of micro holes
Forming a grid pattern on the photosensitive glass to display a region for forming the microholes, and exposing the region to a laser according to the grid pattern;
Heat-treating the glass exposed by the laser to crystallize the region; And
And removing the crystallized region. ≪ Desc / Clms Page number 19 > 6. The method of claim 5, wherein coating the surface of the barrier ribs with a radiation shielding material
Wherein at least one of electroless plating, electroplating, and vapor-phase chemical vapor deposition is used. A grid apparatus for radiation scattering prevention produced by the manufacturing method according to any one of claims 5 to 7.

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