KR20160002251U - Flexible printed circuit - Google Patents

Flexible printed circuit Download PDF

Info

Publication number
KR20160002251U
KR20160002251U KR2020140009431U KR20140009431U KR20160002251U KR 20160002251 U KR20160002251 U KR 20160002251U KR 2020140009431 U KR2020140009431 U KR 2020140009431U KR 20140009431 U KR20140009431 U KR 20140009431U KR 20160002251 U KR20160002251 U KR 20160002251U
Authority
KR
South Korea
Prior art keywords
layer
circuit pattern
base layer
circuit board
reinforcing layer
Prior art date
Application number
KR2020140009431U
Other languages
Korean (ko)
Inventor
송인영
Original Assignee
한국단자공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국단자공업 주식회사 filed Critical 한국단자공업 주식회사
Priority to KR2020140009431U priority Critical patent/KR20160002251U/en
Publication of KR20160002251U publication Critical patent/KR20160002251U/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention relates to a flexible circuit board. The base layer 11 forms the skeleton of the flexible circuit board 10 of the present invention. A circuit pattern 20 is formed on at least one surface of the base layer 11 and a reinforcing layer 40 is formed on at least one surface of the base layer 11 of the same material as the circuit pattern 20 . A cover layer 60 is formed on the surfaces of the base layer 11, the circuit pattern 20, and the reinforcing layer 40. The reinforcing layer 40 is formed with an insulating region 50 of a predetermined width between itself and the circuit pattern 20. The through holes 52 are formed in the reinforcing layer 40 so that the adjacent holes are spaced apart from each other. According to the present invention, there is an advantage that expansion and contraction are minimized by thermal shock of the flexible circuit board 10.

Description

Flexible printed circuit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board, and more particularly, to a flexible circuit board having a mesh structure inside to reinforce rigidity.

A flexible circuit board is formed by forming a circuit pattern on a base layer having good insulation and heat resistance and a good bendability and covering the surface with a cover layer. The flexible circuit board is used for electrical connection between moving parts due to its flexible characteristics. Of course, since the flexible circuit board is relatively thin, it is often used where a lot of electrical connection is required through a narrow space.

An example of such a flexible circuit board is shown in Fig. Fig. 1 shows an example of a general flexible circuit board. According to this, the flexible circuit board 1 is made in the form of a sheet having a predetermined shape, and the circuit pattern 5 is formed on the base layer 3. A cover layer (7) is formed on the surface of the base layer (3) including the circuit pattern (5). The base layer 3 is made of a flexible material as an insulating material, and the circuit pattern 5 is made of a material having good conductivity such as copper or a copper alloy. The cover layer 7 forms the outer surface of the flexible circuit board 1 while the circuit pattern 5 is not exposed to the outside. The cover layer 7 is also made of a material having good insulating properties. The circuit pattern 5 is generally made by removing unnecessary portions with the copper foil on the base layer 3.

A portion of the circuit pattern 5 is exposed to the outside, and this portion is referred to as a land 9. The land 9 serves to electrically connect the flexible circuit board 1 and the outside. The land 9 can be made in various forms.

In the flexible circuit board according to the related art having such a configuration, there are the following problems.

In the case where the flexible circuit board 1 is used in an environment with a large temperature change, cracks are generated due to thermal shock and the circuit pattern 5 may be disconnected in severe cases. In this case, the flexible circuit board 1 can not function properly.

Particularly, a part of the flexible circuit board 1 is adhered to a housing of a component made of synthetic resin. However, a problem that a lot of damage is caused to the flexible circuit board 1 due to expansion and contraction according to the temperature change of the housing have.

SUMMARY OF THE INVENTION The object of the present invention is to solve the conventional problems as described above and to maximize the rigidity of the flexible circuit board.

Another object of the present invention is to enhance the grounding property of the flexible circuit board.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a base layer made of an insulating material and having flexible characteristics; a circuit pattern formed on a surface of the base layer to constitute a circuit; A reinforcing layer formed on the surface of the layer, and a cover layer covering the base layer, the circuit pattern and the reinforcing layer.

The circuit pattern and the reinforcing layer are made of the same material, and an insulating region is formed with a predetermined width between the circuit pattern and the reinforcing layer.

In the reinforcing layer, a plurality of through holes are formed by heat, and the adjacent through holes have a predetermined gap.

And a land connected to the circuit pattern and having a surface exposed to the outside of the cover layer.

The reinforcing layer is formed on at least one surface of the surface of the base layer on which the circuit pattern is formed and the surface of the opposite surface of the base layer on which the circuit pattern is formed.

In the flexible circuit board according to the present invention, the following effects can be obtained.

In the flexible circuit board of the present invention, a reinforcing layer is formed on the same layer as the circuit pattern formed on the base layer. Therefore, the strength of the base layer is reinforced by the reinforcing layer, and expansion and contraction of the base layer are minimized, thereby preventing cracks from being generated in the flexible circuit board due to thermal shock.

In the present invention, the reinforcing layer is made of the same material as the circuit pattern and utilized as a ground layer. Therefore, there is an effect that the grounding can be performed more reliably.

In addition, in the present invention, since the reinforcing layer is formed to have the same height as the circuit pattern, the damage caused by thermal shock can be minimized while the thickness and size of the flexible circuit board as a whole do not increase.

1 is a partial cross-sectional perspective view showing a configuration of a general flexible circuit board.
2 is a plan view showing a state in which a cover layer is removed in a preferred embodiment of the flexible circuit board according to the present invention.
FIG. 3 is a partial sectional view showing the construction of the embodiment of the present invention; FIG.
4 is a plan view showing a state in which a cover layer is removed in the embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. It should be noted that, in adding reference numerals to the constituent elements of the drawings, the same constituent elements are denoted by the same reference numerals whenever possible, even if they are shown in different drawings. In the following description of the embodiments of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may obscure the embodiments of the present invention.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) can be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; may be "connected," "coupled," or "connected. &Quot;

2 to 4, in the flexible circuit board 10 of the present invention, the base layer 11 forms a skeleton. The base layer 11 is generally made of polyimide having good insulation and heat resistance. The base layer 11 has a predetermined thickness and a predetermined width and has a planar shape as shown in FIG.

A circuit pattern (20) is formed on at least one surface of the base layer (11). The circuit pattern 20 is generally made of copper or a copper alloy. The circuit pattern 20 is made by removing unnecessary portions in a state where a copper foil layer is provided on the surface of the base layer 11, for example. Such a circuit pattern 20 serves to connect a circuit.

A land 30 may be formed at a specific position of the circuit pattern 20. The land 30 serves to electrically connect the circuit pattern 20 to the outside of the FPCB 10. The lands 30 are exposed to the outside of the cover layer 60 whose surface will be described below. The land 30 can be seen as a part of the circuit pattern 20.

A reinforcing layer 40 is formed adjacent to the circuit pattern 20 formed on one side surface of the base layer 11. The reinforcing layer 40 is made of the same material as the circuit pattern 20. The reinforcing layer 40 is left without being removed when the copper foil layer for forming the circuit pattern 20 is removed. The reinforcing layer 40 is formed at a position spaced from the circuit pattern 20 by a predetermined distance. That is, an insulating region 50 is formed between the circuit pattern 20 and the reinforcing layer 40. The insulation region 50 is for securing insulation between the circuit pattern 20 made of the same material and the reinforcing layer 40.

The reinforcing layer 40 is a portion which is left without removing the operating layer in the process of removing the copper foil layer for forming the circuit pattern 20. The reinforcing layer 40 may be used as a grounding layer for grounding. For this purpose, the entire reinforcing layers 40 are preferably electrically connected to each other.

A plurality of through holes 52 may be formed in the reinforcing layer 40. The through hole 52 is formed by removing the reinforcing layer 40. That is, the through hole 52 is formed through the reinforcing layer 40. In the illustrated embodiment, the through-holes 52 are made in a rectangular shape, but need not necessarily. The through hole 52 formed in the reinforcing layer 40 is filled with the material forming the cover layer 60, which will be described below.

A plurality of the through holes 52 are formed in rows in the horizontal and vertical directions. It is more preferable that the through holes 52 are formed in rows with a small area, rather than one with a large area. That is, it is effective for the function of the reinforcing layer 40 to form a plurality of rows so that the adjacent through holes 52 have a predetermined gap.

A cover layer 60 is formed to cover the surface of the circuit pattern 20, the reinforcing layer 40, and the base layer 11. The cover layer 60 is also made of a material having good insulation and heat resistance. The surface of the land 30 is exposed to the outside of the cover layer 60. The cover layer 60 is formed so as to cover both side surfaces of the base layer 11, as can be seen in Fig. For reference, the circuit pattern 20 may also be formed on the surface opposite to the surface of the base layer 11 on which the circuit pattern 20 is formed in this embodiment.

Hereinafter, a flexible circuit board according to the present invention having the above-described structure is produced and used.

The flexible circuit board 10 of the present invention is fabricated through the same process as a general flexible circuit board. That is, for example, in a state in which the copper foil layer is formed on the surface of the base layer 11, the copper foil layer is selectively removed to form the circuit pattern 20. In the present invention, not only the copper foil layer forming the circuit pattern 20 but also the reinforcing layer 40 is left in the process of forming the circuit pattern 20. That is, the copper foil layer is removed from the insulating region 50, and the copper foil layer in the through hole 52 is removed.

By doing so, the reinforcing layer 40 is formed. The reinforcing layer 40 reinforces the base layer 11 to prevent cracks. By forming the through holes 52, flexibility can be ensured. Of course, the thickness of the reinforcing layer 40 can be made thinner than the circuit pattern 20 without the through-holes 52 to ensure flexibility.

Next, a cover layer 60 is formed so as to cover the circuit pattern 20 and the base layer 11. The cover layer 60 covers both side surfaces of the base layer 11 to substantially form an outer surface of the flexible circuit board 10.

The flexible circuit board 10 is partially adhered to a housing made of synthetic resin and connected to the outside through the land 30 to form a circuit. The flexible circuit board 10 of the illustrated embodiment is electrically connected to each battery cell side in the battery module to obtain necessary information for the battery cell.

On the other hand, the environment in which the flexible circuit board 10 is used may vary, for example, the temperature change may be several tens of degrees or more. When the temperature change is large, the flexible circuit board 10 itself can expand and contract, and the housing in which the flexible circuit board 10 is adhered can also expand and contract. However, in the present invention, since the reinforcing layer 40 can withstand the contraction and expansion of the base layer 11 or the cover layer 60, the base layer 11 or the cover layer 60 can be formed by expansion and contraction It helps to prevent damage.

The description above is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in this specification are intended to illustrate rather than limit the technical idea of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas which are within the scope of the same should be interpreted as being included in the scope of the present invention.

In the illustrated embodiment, the reinforcing layer 40 is formed on the same surface as the surface on which the circuit pattern 20 is formed, but the reinforcing layer 40 is formed on the surface of the base layer 11 on the opposite side where the circuit pattern 20 is formed It is possible. Of course, the reinforcing layer 40 may be formed on both side surfaces of the base layer 11.

1: Flexible circuit board 3: Base layer
5: circuit pattern 7: cover layer
9: Land 10: Flexible circuit board
11: base layer 20: circuit pattern
30: land 40: reinforcing layer
50: insulating region 52: through hole
60: Cover layer

Claims (5)

A base layer made of an insulating material and having flexible characteristics,
A circuit pattern formed on a surface of the base layer and constituting a circuit,
A reinforcing layer formed on the surface of the base layer,
And a cover layer covering the base layer, the circuit pattern, and the reinforcing layer.
The flexible circuit board according to claim 1, wherein the circuit pattern and the reinforcing layer are made of the same material, and an insulating region is formed between the circuit pattern and the reinforcing layer by a predetermined width.
The flexible circuit board according to claim 2, wherein the reinforcing layer has a plurality of through holes formed in rows, the adjacent through holes having a predetermined gap.
The flexible circuit board according to any one of claims 1 to 3, further comprising a land connected to the circuit pattern and having a surface exposed to the outside of the cover layer. 5. The flexible circuit board according to claim 4, wherein the reinforcing layer is formed on at least one surface of a surface of the base layer on which the circuit pattern is formed and a surface of the base layer opposite to the base layer on which the circuit pattern is formed.
KR2020140009431U 2014-12-19 2014-12-19 Flexible printed circuit KR20160002251U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020140009431U KR20160002251U (en) 2014-12-19 2014-12-19 Flexible printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020140009431U KR20160002251U (en) 2014-12-19 2014-12-19 Flexible printed circuit

Publications (1)

Publication Number Publication Date
KR20160002251U true KR20160002251U (en) 2016-06-29

Family

ID=56344842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020140009431U KR20160002251U (en) 2014-12-19 2014-12-19 Flexible printed circuit

Country Status (1)

Country Link
KR (1) KR20160002251U (en)

Similar Documents

Publication Publication Date Title
JP4538069B2 (en) Printed wiring board
US20110149543A1 (en) Printed wiring board connection structure
US9750133B2 (en) Printed circuit board
US9786589B2 (en) Method for manufacturing package structure
US9549459B2 (en) Multilayer printed circuit board
JP6272173B2 (en) Wiring board
JP2009283902A5 (en)
CN104425286A (en) IC carrier plate, semiconductor device having the same and manufacturing method of the IC carrier plate
CN104080280A (en) Packaging substrate unit, preparation method of packaging substrate unit, and substrate assembly
JP2015133387A5 (en)
US20150201496A1 (en) Radio module and relevant manufacturing method
US20170118839A1 (en) Printed circuit board with edge soldering for high-density packages and assemblies
JP2014165210A5 (en)
US8592690B2 (en) Circuit board having circumferential shielding layer
US9437559B2 (en) High-frequency module
KR20160002251U (en) Flexible printed circuit
JP2015138925A (en) Multilayer wiring board
JP6920184B2 (en) Electronic devices and electronic modules
US20200258805A1 (en) Electronic component module provided with substrate on which electronic components are mounted and heat sink and manufacturing method of the same
KR20150079189A (en) Electronic components embedded substrate
US9888575B2 (en) Electronic device and method for manufacturing electronic device
KR101000573B1 (en) Printed circuit board for mounting semiconductor package
KR200484643Y1 (en) Linkage structure of multi pcb
EP3277065B1 (en) Imaging component, and imaging module provided with same
JP6355989B2 (en) Suspension board with circuit and manufacturing method thereof

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application