KR20160001894U - Apparatus for cutting corner of glass substrate - Google Patents

Apparatus for cutting corner of glass substrate Download PDF

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Publication number
KR20160001894U
KR20160001894U KR2020140008634U KR20140008634U KR20160001894U KR 20160001894 U KR20160001894 U KR 20160001894U KR 2020140008634 U KR2020140008634 U KR 2020140008634U KR 20140008634 U KR20140008634 U KR 20140008634U KR 20160001894 U KR20160001894 U KR 20160001894U
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KR
South Korea
Prior art keywords
glass substrate
heat
edge
processed
heating element
Prior art date
Application number
KR2020140008634U
Other languages
Korean (ko)
Inventor
손동진
김동환
김종민
Original Assignee
동우 화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동우 화인켐 주식회사 filed Critical 동우 화인켐 주식회사
Priority to KR2020140008634U priority Critical patent/KR20160001894U/en
Priority to PCT/KR2015/012459 priority patent/WO2016085194A1/en
Priority to TW104218768U priority patent/TWM527438U/en
Publication of KR20160001894U publication Critical patent/KR20160001894U/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A glass substrate edge processing apparatus is disclosed. According to an embodiment of the present invention, there is provided an apparatus for machining a corner of a glass substrate, the apparatus comprising: a heater for applying heat to an edge of the processed glass substrate; A power source capable of supplying power to the heating section; It is possible to reduce the thermal stress generated in the edge machining portion of the glass substrate, including the heat retaining portion supporting the heat retaining portion.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a glass substrate edge processing apparatus,

The present invention relates to a glass substrate edge processing apparatus.

Conventionally, a glass substrate used in a flat panel display is manufactured by cutting the glass into a desired shape and size, then grinding or polishing the edges of the cut glass substrate to remove sharp edges.

However, there are various disadvantages in the method of grinding or polishing the edge of the glass substrate. First, the particles generated during edge machining can be the main source of contamination on the surface of the glass substrate, so an additional process is needed to clean and dry the glass substrate after edge processing. Secondly, the particles sandwiched between the transfer device and the glass substrate during transportation of the glass substrate can damage the surface of the glass substrate, resulting in a high defect rate of the glass substrate.

In order to prevent the generation of glass dust, a method and an apparatus for processing the edges of a glass substrate by a heat treatment method as in Korean Patent Application No. 2012-002573 have been proposed. The glass substrate edge processing apparatus includes a heating element and a coil wound around the heating element. When a heating element that generates heat at a high temperature contacts the edge of the glass substrate, heat is transferred to the glass substrate. The portion of the glass substrate to which the heat is transferred is thermally expanded to cause a gap due to the difference in volume from the rest of the glass substrate to which the heat is not transferred. Thus, the portion including the edge of the glass substrate is separated from the rest of the glass substrate along the cut surface. The portion including the upper edge of the glass substrate and the portion including the lower edge are first processed, and the portion including the side surface of the glass substrate is secondarily processed, thereby processing the glass substrate.

On the other hand, the heating element is raised to about 1200 to 1600 degrees centigrade in the course of processing the edge of the glass substrate, and the portion of the glass substrate contacting the heating substrate is also raised to a temperature close to the above temperature. Here, the portion of the glass substrate processed by the heating element experiences a sudden temperature decrease again to room temperature (about 20 degrees Celsius). Such a sudden change in temperature occurs within a few seconds to several minutes, and causes a thermal stress on the glass substrate.

Korean Registered Patent No. 10-1345587 (Dec. 27, 2013)

The glass edge cornering apparatus according to the present invention is intended to reduce the thermal stress generated in the edge-processed portion of the glass substrate.

Thus, the rigidity of the glass substrate can be improved and the production of a reliable glass substrate can be achieved.

According to an embodiment of the present invention, there is provided an apparatus for processing an edge of a glass substrate, the apparatus comprising: a heat-releasing unit capable of applying heat to an edge of the processed glass substrate; A power source capable of supplying power to the heating section; There is provided a glass substrate cornering apparatus including a heating section support for supporting a heating section.

Here, the processing is performed continuously along the edge of the glass substrate, and the heat-radiating portion can apply heat to the processing portion where the edge of the glass substrate is processed.

Further, the heating section support body may be formed to surround the side of the glass substrate, and the heating section may be attached to and supported by the heating section support body.

Furthermore, the heat retaining portion can be attached to the inside of the glass substrate side of the heat retaining portion support.

Further, a plurality of the heat radiating portions may be provided, and they may be disposed apart from each other along the edge of the glass substrate.

The heating unit may be disposed along the edge of the glass substrate. The heating unit may maintain the temperature of the edge portion of the glass substrate. The glass substrate may include a heat generating body for moving the edge of the glass substrate. Heat can be applied to the machining portion subsequent to machining of the heating element.

Also, a plurality of the heat radiating portions may be provided so as to be disposed discontinuously along the edges of the glass substrate.

According to the embodiments of the present invention, it is possible to reduce the thermal stress generated in the edge machining portion of the glass substrate. As a result, the rigidity of the glass substrate can be improved, and a more reliable glass substrate can be produced.

Further, it is possible to reduce defects and breakage of the glass substrate, and increase the production yield and efficiency.

1 is a perspective view of a glass substrate edge processing apparatus according to the present invention,
2 is a plan view of a glass substrate edge processing apparatus according to the present invention,
3 is a flowchart of a glass substrate edge processing apparatus according to the present invention.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description of the present invention, a detailed description of known technologies related to the present invention will be omitted when it is determined that the gist of the present invention may be unnecessarily blurred. The following terms are defined in consideration of functions in the present invention, and may be different depending on the intention of the user, the intention or the custom of the operator. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the scope of claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary knowledge in the technical field to which the present invention belongs.

The glass sheet edge processing apparatus according to the embodiment of the present invention allows the edge of the glass substrate to be processed by the heating element 30. [ To this end, the glass substrate edge processing apparatus includes a heating element 30, and a coil is wound around the heating element 30. [ The heating element 30 is made of a material such as MoSi2, for example, and when a current flows therein, it can generate heat at a high temperature by a resistance heating method. An eddy current, which is an induction current, is generated in the heating element 30 to cause the heating element 30 to generate heat at a high temperature when a current flows through the coil wound around the heating element 30. The heating element 30 may have a cylindrical shape as a whole and the lower end of the heating element 30 to be brought into contact with the edge of the glass substrate 1 may have a conical shape with an inclined surface.

As shown in Fig. 1, first, the glass substrate 1 is seated on the inside of the stage 10, specifically, the heat-radiating portion 20 of the stage 10. As shown in Fig. Thereafter, when the inclined surface of the heat emitting body 30 emitting heat at a high temperature comes into point contact with the edge of the glass substrate 1, heat is applied to the portion of the glass substrate 1 which is in point contact with the heat emitting body 30, . Here, the term "point contact" includes not only a mathematical point, but also a case where the heating element 30 contacts the edge of the glass substrate 1 with a certain area so as to transmit heat to the edge of the glass substrate 1. The area of the glass substrate 1 to which the heat is transferred is thermally expanded to cause a gap due to the difference in volume from the rest of the glass substrate 1 to which heat is not transferred. As a result, the portion including the edge of the glass substrate 1 can be separated from the rest of the glass substrate 1. [ When the heating element 30 passes along the edge of the glass substrate 1, the corner portion in the form of a strip from the glass substrate 1 can be processed (heat transfer and peeling). On the other hand, the upper edge, the lower edge, and the side edge of the glass substrate 1 can be sequentially processed so that the edge processing of the glass substrate 1 can be completed.

Here, the glass edge cornering apparatus according to the present invention includes a heat radiating section 20 capable of applying heat to a processing region of the glass substrate 1 to be processed. The heat retaining portion 20 can apply heat to the edges of the glass substrate 1 to be processed according to the above-described method and a surrounding region including the edges. For this purpose, the heat-radiating portion 20 can be disposed along the edge of the glass substrate 1. The heating section 20 applies heat to the machining section following the machining of the heating element 30 so as to maintain the temperature of the machined part processed by the heating element 30, that is, the edge part of the glass substrate 1. [ The heat storage portion 20 may include a heat generation portion 22 for generating heat and a heat storage portion support 24 for supporting the heat storage generation portion 22. [ The heat-generating portion 22 is supported by the heat-radiating portion support 24 and can be positioned around the edge of the glass substrate 1 to be processed.

The heat-generating portion 22 can generate heat by supplying electric power, and any heat-generating component such as a heater can be employed. The heat generating portion 22 may be provided in order to sequentially apply heat to the edge portion of the glass substrate 1 and may be provided in the form of a continuous heat source or a discontinuous point heat source. Here, the "point heat source" includes a mathematical or physical point heat source and a heat source disposed apart from the point source. The heat-generating portion 22 may be connected to the power source portion 100 through a wiring or the like in the heat-radiating portion support 24. Although not shown in the drawing, the power supply unit 100 may include a separate control unit for controlling the power supply.

The heater support 24 may be formed to surround the side of the glass substrate 1 to be processed. The heater support 24 may be a united structure or a combination of intermittently spaced structures. For example, as shown in Figs. 1 and 2, when the glass substrate 1 to be processed is formed in a quadrangular shape, the heat-storage-portion supporter 24 is provided on the glass substrate 1, And may be formed in a square corner shape so as to cover the side portion of the substrate 1. However, the present invention is not limited to this, and in the case where the glass substrate 1 is formed in a polygonal shape rather than a quadrangular shape, the heat radiating support 24 may be formed in a shape corresponding thereto. Further, it is needless to say that it is not formed to correspond to the shape of the glass substrate 1, but may be formed in a shape of a polygon, a circle, or an ellipse capable of accommodating the glass substrate 1 therein.

On the other hand, the heat storage support 24 may support the heat generation portion 22 on the inner side, and the heat generation portion 22 may be attached to the heat storage support 24. [ Here, the "inside" of the heating section supporter 24 means the side where the heating section supporter 24 faces the glass substrate 1 while surrounding the glass substrate 1. Incidentally, the term "attachment" is used to mean not only a case where it is glued but also a concept that the heat-generating portion 22 is fixed so as not to be separated from the heat- Furthermore, the heat-generating portion 22 may protrude from the heat-radiating portion support 24 or may be embedded in the heat-radiating portion support 24. In addition, wiring that can be connected to the power source unit 100 can be located in the heater support 24.

Further, as described above, the heating element 30 is to process the edge of the glass substrate 1 while passing the edge of the glass substrate 1 by sweeping, that is, in point contact. Here, the heat-generating portion 22 can be turned on so that the heat-generating body 30 can heat the processed portion immediately after the edge of the glass substrate 1 is processed. That is to say, heat is applied to the portion of the glass substrate 1 where the heat generating element 30 has passed, so that the heat generating portion 22 can heat the portion processed by the heat generating body 30 around the glass substrate 1 The additional heat generating portion 22 can be turned on. For this purpose, the heat-generating portion 22 is formed to be continuously or discontinuously connected to the inner surface of the heat-radiating portion support 24 so as to be sequentially turned on. In the following description, mainly, the case where the heat-generating portion 22 is disposed inside the heat-radiating portion support 24 in the form of a discontinuous point heat source will be mainly described. However, the shape and arrangement of the heat generating portion 22 are not limited to this, and any shape may be used as long as heat can be sequentially applied to the edge of the glass substrate 1 inside the heat storing portion 20. [ For example, although not shown in the drawing, the heat-generating portion may be formed as a continuous heat source on the inner surface of the heat-radiating portion support 24, or may be sequentially turned on in the heat source .

1 and 2, the heat-generating portion 22 may be disposed on the inner surface of the heat-radiating portion support 24 in the form of a point heat source. Here, the "point heat source" has a generic meaning of not only a form of a mathematical or physical point heat source but also a form of a heat source disposed at a spaced apart position.

As shown in FIG. 2, a plurality of heat-generating units 22 are provided and spaced apart from each other inside the heat-radiating member support 24. When the heating element 30 starts to move in the direction D, the first heat generating portion 22-1 is turned on so that heat can be applied to the edge portion of the glass substrate 1 processed by the heating element 30 on. The heat H generated in the first heat generating portion 22-1 is immediately transferred to the edge portion of the glass substrate 1 processed by the heat generating body 30. [ The temperature of the first heat generating portion 22-1 may be about 400C or less. As a result, the edge portion processed in the glass substrate 1 is gradually lowered to about 400 deg. C in a state where the temperature is raised to about 1200 deg. C to 1600 deg. C by the heating element 30. Accordingly, the temperature does not rapidly drop to room temperature (about 20 degrees Celsius), and the temperature is maintained for a predetermined time after the temperature is lowered to about 400 degrees Celsius, thereby reducing the thermal stress that may be generated in the glass substrate 1. [

Here, the "predetermined time" can be determined within a range that minimizes the thermal stress generated in the glass substrate 1 in consideration of the temperatures of the heating element 30 and the first heat generating portion 22-1. The "predetermined time" may not only exceed the time at which the heating element 30 sweeps all the edges of the glass substrate 1 to be processed, but may also be shorter or shorter.

On the other hand, as the heating element 30 passes over the edge of the glass substrate 1 in point contact therewith, the heat generating portion 22 is also turned on sequentially.

2 or 3, when the heat generating body 30 is processed in the D direction, the first heat generating unit 22-1, the second heat generating unit 22-2, the third heat generating unit 22-2, (22-3), and heat is applied to the corner portion of the processed glass substrate (1). In addition, each of the heat-generating units 22 is turned on sequentially, and then turned off after the predetermined time elapses. As described above, the "predetermined time" may or may not be the time until the heating element 30 finishes machining one glass substrate 1. If the predetermined time exceeds the processing time of one glass substrate 1, even if the heating element 30 is separated from the glass substrate 1, one or more heat generating units 22 are turned on for a predetermined time, State can be maintained. Further, it is needless to say that the same predetermined time is set for each of the heat-generating units 22, and the heat-generating units 22 are sequentially turned off. In addition, it is needless to say that the predetermined time different from each other may be set for each heat-generating portion 22. For example, at the vertex of the glass substrate 1, the predetermined time may be set differently in consideration of heat exchange with the two adjacent heat-generating units 22.

The off heat of the heat generating portion 22 can be sequentially turned off in the on order and the on time of the heat generating portion 22 can be turned on and off, It may be turned off at a time after a predetermined time elapses to minimize the generation of thermal stress of the semiconductor wafer 1.

On the other hand, the temperature of the heat generating portion 22 can be gradually reduced until it is turned off, for example, to such an extent that thermal stress does not occur on the glass substrate 1. Further, the predetermined period of time is a period of time from the initial operating temperature (for example, 400 degrees Celsius) to the room temperature (about 25 degrees Celsius) at such a rate that no heat stress is generated on the glass substrate 1, ) Until it is reduced to a certain level.

The corner portion of the processed glass substrate 1 is heated at an initial operating temperature of the heat generating portion 22 (for example, at a temperature of 1200 to 1500 degrees Celsius, which is a temperature immediately after the heating of the heat generating body 30 is completed) The edge portion of the glass substrate 1 is gradually cooled to room temperature (for example, 25 degrees Celsius) while exchanging heat with the heat generating portion 22. As a result, it is possible to prevent thermal stress from being generated in the glass substrate 1 when the edge of the glass substrate 1 is processed.

3, when the edge of the glass substrate is machined (S1), the heat-generating portion 22 adjacent to the edge of the processed glass substrate is turned on (S2). As a result, The portion 22 is sequentially turned on. Thereafter, the heat generating portion 22 maintains the on state for the above-mentioned predetermined time, and supplies heat to the edge portion of the processed glass substrate 1. If the time required for the cornering of the glass substrate 1 by the heat generating element 30 to the end (Sn) is shorter than this predetermined time, the heat-generating portion 22 of the heat-radiating portion 20 is turned on ) State (Sn + 1) until the end of machining. Of course, while the heat generating portion 22 is maintained in the on state, the temperature of the heat generating portion 22 is gradually increased to room temperature, for example, to prevent thermal stress from being generated at the edge of the glass substrate 1 It is possible to reduce the speed. Of course, after a predetermined time has elapsed, the heat generation portion 22 of the heat storage portion 20 can be turned off. In order to minimize the occurrence of thermal stress on the glass substrate 1, the off-off of the heat generating portion 22 may be sequentially turned off in a turned- (off). On the other hand, a control unit included in the power supply unit 100 may control on and off of the heat generating unit 22, and a control unit (not shown) of the glass substrate edge processing apparatus may control the on and off .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined by the appended claims. I will understand. Therefore, the scope of the present invention should not be limited to the embodiments described, but should be determined by the scope of the appended claims and equivalents thereof.

1: glass substrate
10: stage
20:
22:
22-1: First Heated Heat Generating Unit
22-2: Second Heated Heat Generating Unit
22-3: Third Heated Heat Generating Part
22-n: the n th heat generating portion
24:
30: Heating element
100:

Claims (7)

An apparatus for processing a corner of a glass substrate,
A heating unit capable of applying heat to the edge of the processed glass substrate;
A power source capable of supplying power to the heat storage unit;
And a heater support for supporting the heater
Glass substrate edge processing apparatus.
The method according to claim 1,
Wherein the processing is continuously performed along an edge of the glass substrate and the heat radiating portion is capable of applying heat to the processed portion of the edge of the glass substrate.
The method according to claim 1,
Wherein the heating section support body is formed in a shape to surround a side portion of the glass substrate, and the heating section is attached to and supported by the heating section support body.
The method of claim 3,
Wherein the heat retaining portion is attached to the inside of the glass substrate side of the heat retaining portion support.
The method according to claim 1,
Wherein a plurality of the heat radiating portions are provided and are disposed apart from each other along the edge of the glass substrate.
The method according to claim 1,
Further comprising a heating element for moving along the edge of the glass substrate and for processing the edge of the glass substrate,
Wherein the heat radiating portion is disposed along an edge of the glass substrate,
Wherein the heat radiating portion applies heat to the machining portion subsequent to machining of the heating element so as to maintain the temperature of the corner portion of the glass substrate.
The method of claim 6,
Wherein the plurality of heating units are provided so as to be disposed discontinuously along corners of the glass substrate.
KR2020140008634U 2014-11-25 2014-11-25 Apparatus for cutting corner of glass substrate KR20160001894U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR2020140008634U KR20160001894U (en) 2014-11-25 2014-11-25 Apparatus for cutting corner of glass substrate
PCT/KR2015/012459 WO2016085194A1 (en) 2014-11-25 2015-11-19 Glass substrate corner processing device
TW104218768U TWM527438U (en) 2014-11-25 2015-11-23 Apparatus for cutting edges of glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020140008634U KR20160001894U (en) 2014-11-25 2014-11-25 Apparatus for cutting corner of glass substrate

Publications (1)

Publication Number Publication Date
KR20160001894U true KR20160001894U (en) 2016-06-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020140008634U KR20160001894U (en) 2014-11-25 2014-11-25 Apparatus for cutting corner of glass substrate

Country Status (3)

Country Link
KR (1) KR20160001894U (en)
TW (1) TWM527438U (en)
WO (1) WO2016085194A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719904B2 (en) * 2000-04-13 2005-11-24 シャープ株式会社 Method for chamfering glass substrate of liquid crystal display device and heater used in the method
CN101646524A (en) * 2007-02-23 2010-02-10 康宁股份有限公司 Thermal edge finishing
US20110107894A1 (en) * 2008-05-30 2011-05-12 Mitsuboshi Diamond Industrial Co., Ltd Brittle Material Substrate Chamfering Method
KR101405442B1 (en) * 2012-08-01 2014-06-13 주식회사 라미넥스 Method for cutting of corner of glass using
KR101462046B1 (en) * 2013-08-12 2014-11-18 주식회사 나노시스템 Apparatus for cutting edge of glass plate

Also Published As

Publication number Publication date
TWM527438U (en) 2016-08-21
WO2016085194A1 (en) 2016-06-02

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