JP2006012925A - Heating/cooling apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable to perform soaking heating of a workpiece while aiming at coexistence of heating and cooling of the workpiece. <P>SOLUTION: The heating/cooling apparatus includes a heating part having a through-hole, a cooling unit arranged at the opposite side of the workpiece facing surface of the heating part and having a pin for cooling unit rise and fall which touches the workpiece through the through-hole, and a rise and fall means for supporting the cooling unit to enable to rise and fall according to a pressure applied to the pin for the cooling unit rise and fall to make the cooling unit separate from the heating part at the heating part operation time. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heating / cooling apparatus including a heating unit and a cooling unit used in the field of manufacturing semiconductor devices.

  In the semiconductor manufacturing apparatus, there are a case where the workpiece is heated and a case where the workpiece is cooled to room temperature after the workpiece is heated. Further, it may be necessary to cool the heating element after heating the workpiece. Therefore, a heating device that heats a workpiece such as a semiconductor wafer includes both a heating unit and a cooling unit.

  In this case, when the cooling unit is disposed adjacent to the heating unit of the heating device, the workpiece can be efficiently cooled. However, since the heat of the heating unit escapes to the cooling unit when the workpiece is heated, the workpiece cannot be efficiently heated.

Several techniques have been proposed as means for solving the above problems (see, for example, Patent Document 1). In the heating device according to Patent Document 1, the cooling unit is disposed behind the heating unit, and the heating unit is provided with a gap portion, so that the cold air in the cooling unit can be easily transmitted to the workpiece, and both heating and cooling of the workpiece can be achieved. I am trying.
Patent No. 3065065

  However, according to the heating device according to Patent Document 1, it is possible to achieve both the heating and the cooling of the workpiece. However, since the gap portion is provided in the heating portion, it is difficult to perform soaking of the workpiece. Therefore, there has been a demand for a solution that can efficiently heat the workpiece and that can perform soaking.

  The present invention relates to the following items to be described.

(1) a heating unit having a through hole;
A cooling unit that is disposed on the opposite side of the heating unit facing the workpiece and has a cooling unit lifting and lowering pin that is in contact with the workpiece through the through hole;
Heating / cooling comprising: elevating means for supporting the cooling unit, enabling the elevating / lowering of the cooling unit according to pressure applied to the cooling unit elevating pins, and separating the cooling unit from the heating unit when the heating unit is operated apparatus.

(2) The heating / cooling device according to (1), wherein the elevating means is a compression coil spring.

  According to the present invention, when the workpiece is heated, the cooling unit is disposed at a position away from the heating unit. Therefore, since the heat of the heating part does not escape to the cooling part, the workpiece can be efficiently heated. In addition, since the gap is not provided in the heating part, the work can be soaked and heated.

  Hereinafter, the present invention will be described with reference to embodiments, but the present invention is not limited to the following embodiments. In order to facilitate understanding of the invention, the heating power source and the cooling water supply source are not shown.

  As shown in FIG. 1, the heating and cooling apparatus 1 according to the embodiment of the present invention is disposed on the heating unit 10 having through holes 14 and 16 and on the opposite side of the workpiece facing surface of the heating unit 10, and the through holes 14 and 16. The cooling part 20 having the cooling part raising and lowering pins 21a and 21b in contact with the workpiece through the support, the support guide part 35 for supporting the heating part 10 and guiding the raising and lowering of the cooling part 20, and the cooling part 20 are supported and cooled. The elevating means 40a, 40b for separating the cooling unit 20 from the heating unit 10 when the heating unit 10 is operated, and the supporting guide units 31, 35 are configured so that the cooling unit 20 can be moved up and down according to the force applied to the unit elevating pins 21a, 21b. And a base 50 for supporting the elevating means 40a and 40b.

  The heating unit 10 includes a heating element 12, a heat equalizing body 13 disposed so as to cover the entire circumference of the heating element 12, and a case 11 surrounding the heating element 12 and the heat equalizing body 13. As shown in the top view of the heating unit in FIG. 3, the heating unit 10 is provided with through holes 14 to 17 through which cooling unit raising and lowering pins can protrude at substantially equal intervals. Furthermore, the heating part 10 is supported by the support guide parts 31-38 arrange | positioned in the position shown by the dotted line in FIG. The other ends of the support guide parts 31 to 38 are fixed to the base 50 through the holes of the cooling part 20.

  The cooling unit 20 includes a hollow portion 22 that enables a cooling medium to flow. The cooling unit 20 is configured to exhibit a cooling effect when a cooling medium such as water is circulated and supplied to the hollow portion 22 from a cooling water supply source. Furthermore, the cooling unit 20 is supported by compression coil springs 40a and 40b as lifting means. Therefore, when a workpiece is not mounted on the cooling unit lifting pins 21 a and 21 b, the cooling unit 20 is pushed up by the restoring force of the compression coil springs 40 a and 40 b and is disposed at a position adjacent to the heating unit 10. Further, the cooling unit elevating pins 21 a and 21 b protrude from the work side surface of the heating unit 10 through the through holes 14 and 16. At least three cooling unit raising / lowering pins are necessary from the viewpoint of holding the workpiece W, but it is preferable that the number of cooling unit raising / lowering pins is small from the viewpoint of soaking the workpiece.

  The heating unit 10 and the cooling unit 20 are made of a material having high thermal conductivity. Specifically, the heating element 13 is made of silicon carbide or the like. The soaking body 12 is made of silicon nitride, aluminum nitride, silicon carbide, molybdenum steel, sialon, or the like. The case 11 is made of quartz, silicon nitride, aluminum nitride, silicon carbide, molybdenum steel, sialon, or the like. Furthermore, the cooling unit 20 is made of stainless steel, aluminum, molybdenum steel, or the like. The cooling unit elevating pins 21a and 21b are made of molybdenum steel, silicon nitride, aluminum nitride, silicon carbide, or the like.

  Since the structure as described above is provided, as shown in FIG. 2, when the work W is mounted on the cooling part lifting pins, the cooling part 10 descends along the support guide parts 31 and 35 due to its own weight. And away from the heating unit 10. On the other hand, when the workpiece W is removed from the cooling unit elevating pins 21a and 21b, the cooling unit 20 rises along the support guide units 31 and 35 and approaches the heating unit 10 by the restoring force of the compression coil springs 40a and 40b. Therefore, since the heat of the heating unit 10 does not escape to the cooling unit 20 when the workpiece W is heated, the workpiece W can be efficiently heated. In addition, since the gap is not provided in the heating unit 10, the work W can be heated uniformly. Since the heating / cooling device 1 has the above-described effects, the workpiece W, that is, a member to be heated, such as a wafer, a susceptor, a substrate, and a jig, can be suitably heated as an object to be heated. it can.

Modification of Embodiment In the above embodiment, the cooling unit is lifted and lowered by using the weight of the workpiece W. However, the cooling unit can also be increased or decreased by increasing or decreasing the pressure applied to the cooling unit lifting pins 21a and 21b. Can be moved up and down. With this configuration, the cooling unit 20 is disposed at a position away from the heating unit 10 when the workpiece W is heated, and the cooling unit 20 is disposed at a position adjacent to the heating unit 10 when the workpiece W is cooled. Therefore, the workpiece W can be efficiently heated or cooled. That is, heating and cooling on / off control can be performed relatively easily and without taking up a work space. As a result, the work efficiency is improved by the ease of temperature control.

  Further, although the compression coil springs 40a and 40b are used as the raising and lowering means, in addition to the compression coil springs 40a and 40b, elastic and restoring rubber, a resin material, and an air damper or an oil damper buffer mechanism may be used. Absent. The cooling medium supplied to the cooling unit 20 may be a gas in addition to a liquid.

  Furthermore, the heating / cooling device 1 according to the above embodiment may be turned upside down. When turning upside down, the workpiece W is preferably held using a vacuum suction means, an electrostatic chuck device, and an electromagnetic chuck. The heating and cooling on / off control is preferably performed by increasing or decreasing the pressure applied to the cooling unit lifting pins 21a and 21b.

FIG. 1 is a side sectional view of a heating / cooling device according to an embodiment of the present invention (when no workpiece is mounted). FIG. 2 is a side sectional view of the heating / cooling device according to the embodiment of the present invention (when a workpiece is mounted). FIG. 3 is a top view of the heating unit of the heating / cooling device according to the embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Heating / cooling apparatus 10: Heating part 11: Case 12: Heat generating body 13: Heat equalizing body 14-17: Through-hole 20: Cooling part 21: Cooling part raising / lowering pin 31-38: Support guide part 40: Elevating means 50 : Base
W: Work

Claims (2)

A heating part having a through hole;
A cooling unit disposed on the opposite side of the heating unit facing the workpiece, and having a cooling unit lifting pin that contacts the workpiece via the through hole;
Heating / cooling comprising: elevating means for supporting the cooling unit, enabling the elevating / lowering of the cooling unit according to the pressure applied to the cooling unit elevating pins, and separating the cooling unit from the heating unit when the heating unit is operated apparatus.   The heating / cooling device according to claim 1, wherein the elevating means is a compression coil spring.

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