JP2023000038A - Heat treatment device - Google Patents

Abstract

To provide a heat treatment device which is capable of lowering the cost of a support part and suppressing generation of particles in the support part.SOLUTION: A heat treatment device comprises: a chamber; a support part which is provided inside the chamber and capable of supporting a workpiece; and a heating part which is provided inside the chamber and capable of heating the workpiece. The support part includes: a cylindrical tip part of which one end is capable of coming into contact with the workpiece; a columnar part of which one end side is provided via a gap inside the tip part; and a holding part for holding the tip part.SELECTED DRAWING: Figure 2

Description

An embodiment of the present invention relates to a heat treatment apparatus.

2. Description of the Related Art There is a heat treatment apparatus that heats a work to form a film or the like on the surface of the work, or treats the surface of the work.
For example, a heat treatment apparatus has been proposed in which a solution containing an organic material and a solvent is applied onto a substrate and heated to form an organic film on the substrate. In such a heat treatment apparatus, for example, the pressure inside the chamber is reduced below the atmospheric pressure, and the substrate coated with the solution is heated to a temperature of about 100° C. to 600° C. in the atmosphere reduced below the atmospheric pressure. May be heated. In this case, a plurality of pin-shaped support portions are provided inside the chamber, and the substrate coated with the solution is placed on top of the plurality of support portions.

Since the substrate coated with the solution is heated to about 100° C. to 600° C., the plurality of supporting portions are made of heat-resistant material. In this case, if the plurality of supporting portions are made of metal such as stainless steel, scratches may occur on the back surface of the substrate with which the plurality of supporting portions come into contact.

On the other hand, if the plurality of support portions are made of ceramics or the like, it is possible to suppress the occurrence of scratches on the back surface of the substrate. However, forming the plurality of support portions from ceramics or the like poses a new problem of increased manufacturing costs.

Further, a support has been proposed that has a tip that contacts the back surface of the substrate and a tubular base into which the tip is inserted. (See, for example, Patent Document 1).
With such a support portion, only the tip portion can be formed of ceramics or the like. Therefore, it is possible to suppress the back surface of the substrate from being damaged, and to suppress the increase in the manufacturing cost.

However, if the tip is simply inserted into the base, the tip and the base may rub against each other, generating particles. For example, if the tip is made of ceramics and the base is made of stainless steel, which is cheaper than ceramics, rubbing occurs between the tip and the base due to the difference in coefficient of linear expansion. Therefore, particles may be emitted from between the tip and the base.

If the generated particles adhere to at least one of the solution and the formed organic film, the quality of the organic film may deteriorate.
Therefore, development of a heat treatment apparatus capable of reducing the cost of the supporting portion and suppressing the generation of particles in the supporting portion has been desired.

JP-A-2006-170534

The problem to be solved by the present invention is to provide a heat treatment apparatus capable of reducing the cost of the supporting portion and suppressing the generation of particles in the supporting portion.

A heat treatment apparatus according to an embodiment includes a chamber, a support section provided inside the chamber capable of supporting a work, and a heating section provided inside the chamber capable of heating the work. there is The support portion has a cylindrical shape, and has one end that can come into contact with the workpiece, a columnar portion that has one end provided inside the tip with a gap therebetween, and the tip. and a holding portion that holds the portion.

According to the embodiment of the present invention, there is provided a heat treatment apparatus capable of reducing the cost of the supporting portion and suppressing the generation of particles in the supporting portion.

1 is a schematic perspective view for illustrating a heat treatment apparatus according to an embodiment; FIG. FIG. 4 is a schematic diagram for illustrating a support part; FIG. 11 is a schematic diagram for illustrating a support portion according to another embodiment; FIG. 11 is a schematic diagram for illustrating a support portion according to another embodiment;

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same reference numerals are given to the same constituent elements, and detailed description thereof will be omitted as appropriate.
In the following, as an example, a heat treatment apparatus that heats a workpiece in an atmosphere that is reduced below atmospheric pressure to form an organic film on the surface of the workpiece will be described. However, the invention is not so limited. For example, the present invention can also be applied to a heat treatment apparatus that heats a work to form an inorganic film or the like on the surface of the work, or treats the surface of the work.

Moreover, the work before heating may have, for example, a substrate and a solution applied to the surface of the substrate, or may be only the substrate. In the following, as an example, a case where the work before heating has a substrate and a solution applied to the surface of the substrate will be described.

FIG. 1 is a schematic perspective view for illustrating a heat treatment apparatus 1 according to this embodiment.
Note that the X direction, Y direction, and Z direction in FIG. 1 represent three directions orthogonal to each other. The vertical direction in this specification can be the Z direction.

The workpiece 100 before heating has a substrate and a solution applied to the surface of the substrate.
The substrate is, for example, a glass substrate or a semiconductor wafer. However, the substrate is not limited to those illustrated.
A solution includes, for example, an organic material and a solvent. The organic material is not particularly limited as long as it can be dissolved by a solvent. The solution can be, for example, a varnish containing polyamic acid. However, the solution is not limited to the exemplified one.

As shown in FIG. 1, the heat treatment apparatus 1 is provided with, for example, a chamber 10, an exhaust section 20, a processing section 30, a cooling section 40, and a controller 50. As shown in FIG.
The chamber 10 has a box shape. The chamber 10 has an airtight structure capable of maintaining an atmosphere pressure-reduced below atmospheric pressure. The external shape of the chamber 10 is not particularly limited. The external shape of the chamber 10 can be, for example, a rectangular parallelepiped or a cylinder. The chamber 10 can be made of metal such as stainless steel, for example.

For example, one end of the chamber 10 is provided with a flange 11 . The flange 11 may be provided with a sealing material 12 such as an O-ring. The opening of the chamber 10 on the side where the flange 11 is provided can be opened and closed by an open/close door 13 . A driving device (not shown) presses the opening/closing door 13 against the flange 11 (sealing material 12), thereby closing the opening of the chamber 10 in an airtight manner. By separating the opening/closing door 13 from the flange 11 by a driving device (not shown), the workpiece 100 can be carried in or out through the opening of the chamber 10 .

A flange 14 may be provided at the other end of the chamber 10 . The flange 14 may be provided with a sealing material 12 such as an O-ring. The opening of the chamber 10 on the side where the flange 14 is provided can be opened and closed with a lid 15 . For example, the lid 15 can be detachably attached to the flange 14 using fastening members such as screws. When performing maintenance or the like, the lid 15 is removed to expose the opening of the chamber 10 on the side where the flange 14 is provided.

A cooling section 16 can be provided on the outer wall of the chamber 10 . A cooling water supply unit (not shown) is connected to the cooling unit 16 . The cooling unit 16 can be, for example, a water jacket. If the cooling part 16 is provided, it is possible to suppress the outer wall temperature of the chamber 10 from becoming higher than a predetermined temperature.

The exhaust part 20 exhausts the inside of the chamber 10 . The exhaust section 20 has a first exhaust section 21 and a second exhaust section 22 .
The first exhaust section 21 is connected to an exhaust port 17 provided on the bottom surface of the chamber 10 . The first exhaust section 21 has an exhaust pump 21a and a pressure control section 21b.
The exhaust pump 21a can be an exhaust pump that performs rough evacuation from atmospheric pressure to a predetermined pressure. Therefore, the exhaust pump 21a has a larger displacement than the later-described exhaust pump 22a. The exhaust pump 21a can be, for example, a dry vacuum pump.

The pressure control section 21b is provided between the exhaust port 17 and the exhaust pump 21a. The pressure control unit 21b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10 . The pressure control unit 21b can be, for example, an APC (Auto Pressure Controller).

The second exhaust section 22 is connected to an exhaust port 18 provided on the bottom surface of the chamber 10 . The second exhaust section 22 has an exhaust pump 22a and a pressure control section 22b.
After the rough evacuation by the exhaust pump 21a, the exhaust pump 22a evacuates to a predetermined lower pressure. The evacuation pump 22a has, for example, an evacuation capability capable of evacuating to a high-vacuum molecular flow region. For example, the exhaust pump 22a can be a turbo molecular pump (TMP) or the like.
The pressure control section 22b is provided between the exhaust port 18 and the exhaust pump 22a. The pressure controller 22b controls the internal pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) that detects the internal pressure of the chamber 10 . The pressure control unit 22b can be, for example, an APC.

The exhaust port 17 and the exhaust port 18 are arranged on the bottom surface of the chamber 10 . Therefore, a downflow airflow toward the bottom surface of the chamber 10 is formed inside the chamber 10 and inside the processing section 30 which will be described later. When the downflow airflow is formed, the sublimate containing the organic material generated when the workpiece 100 is heated is discharged to the outside of the chamber 10 along with the downflow airflow. Therefore, it is possible to suppress adhesion of foreign substances such as sublimation substances to the workpiece 100 .

In the above, the case where the exhaust port 17 and the exhaust port 18 are provided on the bottom surface of the chamber 10 is illustrated, but the exhaust port 17 and the exhaust port 18 can be provided on the ceiling surface or the side surface of the chamber 10, for example. . If the exhaust port 17 and the exhaust port 18 are provided on the bottom surface or the ceiling surface of the chamber 10 , an airflow can be formed inside the chamber 10 toward the bottom surface or the ceiling surface of the chamber 10 .

The processing section 30 has, for example, a frame 31 , a heating section 32 , a support section 33 , a soaking section 34 , a soaking plate support section 35 , and a cover 36 .
Inside the processing unit 30, a processing region 30a and a processing region 30b are provided. The processing areas 30a and 30b are spaces in which the workpiece 100 is processed. A workpiece 100 is supported inside the processing areas 30a, 30b. The processing area 30b is provided above the processing area 30a. In addition, although the case where two processing areas are provided is illustrated, it is not limited to this. It is also possible to provide only one processing area, or to provide three or more processing areas. In this embodiment, as an example, two processing regions are provided, but one processing region and three or more processing regions can be similarly considered.

The processing regions 30 a and 30 b are provided between the heating units 32 . The processing areas 30a and 30b are surrounded by a soaking section 34 (an upper soaking plate 34a, a lower soaking plate 34b, a side soaking plate 34c, and a side soaking plate 34d).

As will be described later, the upper heat soaking plate 34a and the lower heat soaking plate 34b have plate shapes and are supported by a plurality of heat soaking plate support portions 35. As shown in FIG. The processing region 30a and the internal space of the chamber 10 are connected through the gaps between the upper heat soaking plates 34a and the gaps between the lower heat soaking plates 34b. Therefore, when the pressure in the space between the inner wall of the chamber 10 and the processing section 30 is reduced, the pressure in the space inside the processing region 30a is also reduced. Note that the processing region 30b has the same structure as the processing region 30a, so the description thereof is omitted.

If the pressure in the space between the inner wall of the chamber 10 and the processing section 30 is reduced, the heat released from the processing regions 30a and 30b to the outside can be suppressed. That is, heating efficiency and heat storage efficiency can be improved. Therefore, the electric power applied to the heater 32a, which will be described later, can be reduced. If the electric power applied to the heater 32a can be reduced, the temperature of the heater 32a can be suppressed from exceeding a predetermined temperature, so the life of the heater 32a can be lengthened.

Further, if the heat storage efficiency is improved, the temperature of the processing regions 30a and 30b can be raised quickly. Therefore, it is possible to cope with processing that requires a rapid temperature rise. Moreover, since the temperature of the outer wall of the chamber 10 can be suppressed from rising, the cooling section 16 can be simplified.

The frame 31 has a frame structure using, for example, elongated plate materials or shaped steel. The external shape of the frame 31 can be made similar to the external shape of the chamber 10 . The external shape of the frame 31 can be, for example, a rectangular parallelepiped.

A plurality of heating units 32 are provided. The heating units 32 can be provided below the processing regions 30a and 30b and above the processing regions 30a and 30b. The heating section 32 provided below the processing regions 30a and 30b serves as a lower heating section. The heating section 32 provided above the processing regions 30a and 30b serves as an upper heating section. The lower heating section faces the upper heating section. When a plurality of processing areas are vertically stacked, the upper heating section provided in the lower processing area can also serve as the lower heating section provided in the upper processing area.

The heating unit 32 is provided inside the chamber 10 and heats the workpiece 100 .
For example, the back surface (lower surface) of the workpiece 100 supported by the processing area 30a is heated by the heating unit 32 provided below the processing area 30a. The surface (upper surface) of the workpiece 100 supported by the processing area 30a is heated by the heating unit 32 shared by the processing areas 30a and 30b.

The back surface of the workpiece 100 supported by the processing area 30b is heated by the heating unit 32 shared by the processing areas 30a and 30b. The surface of the workpiece 100 supported by the processing area 30b is heated by the heating unit 32 provided above the processing area 30b.
By doing so, the number of heating units 32 can be reduced, so that power consumption, manufacturing cost, and space can be reduced.

Each of the plurality of heating units 32 has at least one heater 32a and a pair of holders 32b. In addition, below, the case where several heater 32a is provided is demonstrated. The heater 32a has a bar shape and extends in the Y direction between the pair of holders 32b. A plurality of heaters 32a can be arranged side by side in the X direction. A plurality of heaters 32a can be provided at regular intervals. The heater 32a is, for example, a sheathed heater, a far infrared heater, a far infrared lamp, a ceramic heater, a cartridge heater, or the like. Also, various heaters can be covered with a quartz cover.

In this specification, the term "rod-shaped heater" includes various heaters covered with a quartz cover. In addition, there is no limitation on the external shape of the "rod-like", and for example, it may be cylindrical, prismatic, or the like.

Moreover, the heater 32a is not limited to the one described above as long as it can heat the workpiece 100 in an atmosphere that is reduced in pressure below the atmospheric pressure. That is, the heater 32a may be any device that utilizes heat energy by radiation.

The specifications, number, spacing, and the like of the plurality of heaters 32a in the upper heating section and the lower heating section can be appropriately changed according to the composition of the solution to be heated (solution heating temperature), the size of the workpiece 100, and the like. The specifications, number, intervals, etc. of the plurality of heaters 32a can be appropriately determined by performing simulations, experiments, and the like.

The workpiece 100 is heated from both sides in the processing regions 30a and 30b via the upper heat soaking plate 34a and the lower heat soaking plate 34b. Here, the vapor containing the sublimate generated when the solution is heated tends to adhere to objects having a temperature lower than the temperature of the workpiece 100 to be heated. However, since the upper heat soaking plate 34a and the lower heat soaking plate 34b are heated, the sublimate is suppressed from adhering to the upper heat soaking plate 34a and the lower heat soaking plate 34b. Also, the sublimate is discharged out of the chamber 10 along with the aforementioned downflow air current. Therefore, adhesion of the sublimate to the workpiece 100 can be suppressed.

A pair of holders 32b extend in the X direction (for example, the longitudinal direction of the processing regions 30a and 30b). The pair of holders 32b are opposed to each other in the Y direction. One holder 32b is fixed to the end face of the frame 31 on the open/close door 13 side. The other holder 32b is fixed to the end surface of the frame 31 on the side opposite to the opening/closing door 13 side. The pair of holders 32b are fixed to the frame 31 using, for example, fastening members such as screws. A pair of holders 32b hold non-heat generating portions near the ends of the heater 32a. The pair of holders 32b is formed of, for example, an elongated metal plate or shaped steel. The material of the pair of holders 32b can be, for example, stainless steel.

A plurality of supports 33 are provided inside the chamber 10 to support the workpiece 100 . For example, the plurality of supporting parts 33 support the workpiece 100 between the upper heating part and the lower heating part. A plurality of support portions 33 are provided below the processing region 30a and below the processing region 30b. The number, arrangement, intervals, etc., of the plurality of support portions 33 can be appropriately changed according to the size and rigidity (deflection) of the workpiece 100 .
Details of the support portion 33 will be described later.

The heat soaking section 34 has a plurality of upper heat soaking plates 34a, a plurality of lower heat soaking plates 34b, a plurality of side heat soaking plates 34c, and a plurality of side heat soaking plates 34d. The plurality of upper heat soaking plates 34a, the plurality of lower heat soaking plates 34b, the plurality of side heat soaking plates 34c, and the plurality of side heat soaking plates 34d are plate-shaped.

The plurality of upper heat soaking plates 34a are provided on the lower heating section side (workpiece 100 side) in the upper heating section. The plurality of upper heat soaking plates 34a are separated from the plurality of heaters 32a. The plurality of upper heat soaking plates 34a are arranged side by side in the X direction. A gap is provided between the plurality of upper heat equalizing plates 34a. If the gap is provided, it is possible to absorb the increase in the dimension of the upper heat equalizer plate 34a due to thermal expansion. Therefore, it is possible to prevent the upper heat equalizing plates 34a from interfering with each other and causing deformation. Moreover, as described above, the pressure of the atmosphere in the processing areas 30a and 30b can be reduced through this gap.

The plurality of lower heat equalizing plates 34b are provided on the upper heating section side (workpiece 100 side) in the lower heating section. The plurality of lower heat soaking plates 34b are separated from the plurality of heaters 32a. A plurality of lower heat equalizing plates 34b are arranged side by side in the X direction. A gap is provided between the plurality of lower heat equalizing plates 34b. If the gap is provided, it is possible to absorb the increased dimension of the lower heat equalizing plate 34b due to thermal expansion. Therefore, it is possible to prevent the lower heat equalizing plates 34b from interfering with each other and causing deformation. Moreover, as described above, the pressure of the atmosphere in the processing areas 30a and 30b can be reduced through this gap. A hole for preventing interference with the support portion 33 is provided in a part of the lower heat equalizing plate 34b.

The side soaking plates 34c are provided on both sides of the processing regions 30a and 30b in the X direction. The side heat equalizing plate 34 c can be provided inside the cover 36 . Also, at least one heater 32a may be provided between the side hot plate 34c and the cover 36. FIG.
The side soaking plates 34d are provided on both sides of the processing regions 30a and 30b in the Y direction.

As described above, the plurality of heaters 32a are bar-shaped and arranged side by side at predetermined intervals. When the heater 32a is rod-shaped, heat is radiated radially from the central axis of the heater 32a. In this case, the shorter the distance between the center axis of the heater 32a and the heated portion, the higher the temperature of the heated portion. Therefore, when the workpiece 100 is held so as to face the plurality of heaters 32a, the area of the workpiece 100 located directly above or below the heaters 32a is either directly above or below the space between the plurality of heaters 32a. The temperature becomes higher than the area of the workpiece 100 located directly below. That is, when the work 100 is directly heated using the plurality of rod-shaped heaters 32a, the in-plane distribution of the temperature of the heated work 100 varies.

If the temperature of the workpiece 100 has an in-plane distribution, the quality of the formed organic film may deteriorate. For example, bubbles may be generated or the composition of the organic film may change in the portion where the temperature is high.

If a plurality of upper heat soaking plates 34a and a plurality of lower heat soaking plates 34b are provided, the heat radiated from the plurality of heaters 32a is transferred to the plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b. Incident. The heat incident on the plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b is radiated toward the workpiece 100 while propagating in the plane direction inside them. Therefore, it is possible to suppress the in-plane distribution of the temperature of the workpiece 100, thereby improving the quality of the formed organic film.

The materials of the plurality of upper heat soaking plates 34a and the plurality of lower heat soaking plates 34b are preferably made of a material with high thermal conductivity. These materials can be, for example, aluminum, copper, stainless steel, and the like. Note that when a material that is easily oxidized such as aluminum or copper is used, a layer containing a material that is not easily oxidized can be provided on the surface.

A portion of the heat radiated from the plurality of upper heat equalizer plates 34a and the plurality of lower heat equalizer plates 34b is directed to the sides of the processing area. Therefore, the above-described side soaking plates 34c and 34d are provided on the sides of the processing area. Part of the heat incident on the side heat soaking plates 34c and 34d is radiated toward the workpiece 100 while propagating in the plane direction of the side heat soaking plates 34c and 34d. Therefore, the heating efficiency of the workpiece 100 can be improved.
The material of the side heat equalizer plates 34c, 34d can be the same as the material of the upper heat equalizer plate 34a and the lower heat equalizer plate 34b described above.

In the above description, a case where a plurality of upper heat soaking plates 34a and a plurality of lower heat soaking plates 34b are provided is illustrated, but at least one of the upper heat soaking plates 34a and the lower heat soaking plates 34b is a single heat soaking plate. A plate-like member can also be used.

A plurality of heat equalizer support portions 35 are arranged side by side in the X direction. The heat equalizer support portion 35 is provided directly below between the upper heat equalizer plates 34a in the X direction. The plurality of heat equalizer support portions 35 are fixed to the pair of holders 32b using fastening members such as screws. A pair of heat equalizer support portions 35 detachably support both ends of the upper heat equalizer plate 34a. The plurality of heat equalizer support portions 35 that support the plurality of lower heat equalizer plates 34b can also have the same configuration.

If the upper and lower heat equalizer plates 34a and 34b are supported by the pair of heat equalizer support portions 35, the dimensional difference due to thermal expansion can be absorbed. Therefore, deformation of the upper heat soaking plate 34a and the lower heat soaking plate 34b can be suppressed.

The cover 36 has a plate shape and covers the top surface, bottom surface and side surfaces of the frame 31 . That is, the inside of the frame 31 is covered with the cover 36 . However, the cover 36 on the opening/closing door 13 side can be provided on the opening/closing door 13, for example.
Although the cover 36 surrounds the processing areas 30 a and 30 b , gaps are provided at the boundary between the top and side surfaces of the frame 31 , the boundary between the side surfaces and the bottom surface of the frame 31 , and near the opening/closing door 13 .

Also, the covers 36 provided on the top and bottom surfaces of the frame 31 are divided into a plurality of pieces. A gap is provided between the divided covers 36 . That is, the internal space of the processing section 30 (processing regions 30a and 30b) communicates with the internal space of the chamber 10 through these gaps. Therefore, the pressure in the processing regions 30a, 30b can be made to be the same as the pressure in the space between the inner wall of the chamber 10 and the cover 36. FIG. The cover 36 is made of, for example, stainless steel.

The cooling unit 40 supplies cooling gas to the space provided with the plurality of heaters 32a. The cooling unit 40 may also supply the cooling gas to the processing regions 30a and 30b. The cooling unit 40 cools the soaking unit 34 surrounding the processing areas 30a and 30b with cooling gas. By cooling the soaking section 34, the workpiece 100 in a high temperature state is indirectly cooled. Further, by cooling the soaking portion 34 , it is possible to suppress the heat from the soaking portion 34 from being transmitted to the workpiece 100 . When the cooling gas is supplied to the processing areas 30a, 30b, the workpiece 100 in a high temperature state is directly cooled.

Note that the cooling unit 40 is not necessarily required and can be omitted. However, if the cooling unit 40 is provided, the cooling time of the workpiece 100 can be shortened. Further, when the work 100 is cooled, the heat from the soaking section 34 can suppress the in-plane distribution of the temperature of the work 100 .

The cooling section 40 has a nozzle 41 , a gas source 42 and a gas control section 43 .
The nozzle 41 is connected to a space provided with a plurality of heaters 32a. In addition, when supplying the cooling gas to the processing regions 30a and 30b, the nozzles 41 are connected to the processing regions 30a and 30b. The nozzles 41 are attached to, for example, holes provided in the side heat soaking plate 34c, the frame 31, and the cover 36, or the like. For example, the nozzles 41 can be provided on one side of the processing section 30 in the X direction, or can be provided on both sides of the processing section 30 . Note that the number and arrangement of the nozzles 41 can be changed as appropriate.

A gas source 42 supplies cooling gas to the nozzle 41 . The gas source 42 can be, for example, a high pressure gas cylinder, factory piping, or the like. Also, a plurality of gas sources 42 can be provided.

The cooling gas can be a gas that does not readily react with the heated workpiece 100 . The cooling gas is, for example, nitrogen gas, carbon dioxide (CO ₂ ), rare gas, or the like. The rare gas is, for example, argon gas or helium gas. The temperature of the cooling gas can be, for example, room temperature (eg, 25° C.) or lower.

A gas control unit 43 is provided between the nozzle 41 and the gas source 42 . The gas control unit 43 can, for example, supply the cooling gas, stop the supply, and control at least one of the flow velocity and flow rate of the cooling gas.

The controller 50 includes, for example, an arithmetic unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 50 is, for example, a computer. The controller 50 controls the operation of each element provided in the heat treatment apparatus 1 based on the control program stored in the storage unit.

Next, the plurality of support portions 33 will be further described.
When forming the organic film, the workpiece 100 having the substrate and the solution applied to the surface of the substrate is heated to, for example, about 100.degree. C. to 600.degree. Therefore, the support portion 33 is made of a heat-resistant material. For example, the support can be made of metal such as stainless steel. However, in this case, the back surface of the substrate with which the supporting portion is in contact may be damaged. Moreover, the support part can also be formed from ceramics or the like. If the supporting portion is made of ceramics or the like, it is possible to suppress the back surface of the substrate from being scratched. However, doing so increases manufacturing costs.

In this case, the tip portion of the support portion, which contacts the back surface of the substrate, can be made of ceramics or the like, and the base portion that holds the tip portion can be made of metal such as stainless steel. However, if the materials of the tip portion and the base portion are different, rubbing occurs between the tip portion and the base portion due to the difference in coefficient of linear expansion. Therefore, particles may be emitted from between the tip and the base. If the generated particles adhere to the workpiece 100, the quality of the workpiece 100 may deteriorate.

Therefore, the support portion 33 according to this embodiment has a configuration described below.
FIG. 2 is a schematic diagram for illustrating the support portion 33. As shown in FIG.
As shown in FIG. 2, the support portion 33 has, for example, a tip portion 33a, a base portion 33b, and a holding portion 33c.

The tip 33a has a tubular shape, and one end (the end on the back side of the workpiece 100) 33a1 is closed. The end portion 33 a 1 contacts the back surface of the work 100 . Therefore, the shape of the end portion 33a1 is preferably semispherical. If the shape of the end portion 33a1 is hemispherical, it is possible to suppress the back surface of the workpiece 100 from being damaged. Further, since the contact area between the back surface of the work 100 and the tip portion 33a can be reduced, the heat transferred from the work 100 to the support portion 33 can be reduced.

The other end 33a2 of the tip 33a is open. A flange 33a3 can be provided on the end portion 33a2. The flange 33a3 has an annular shape and protrudes outward from the side surface of the tip portion 33a.

The tip portion 33a is made of, for example, ceramics such as aluminum oxide or aluminum nitride, or glass. If the tip portion 33a is made of ceramics, glass, or the like, it is possible to prevent the rear surface of the workpiece 100 from being damaged.

The base portion 33b has, for example, a columnar portion 33b1 and a mounting portion 33b2.
One end side of the columnar portion 33b1 is provided inside the tip portion 33a with a gap therebetween. For example, a gap is provided between the columnar portion 33b1 and the inner wall of the tip portion 33a. The other end side of the columnar portion 33b1 is provided on the mounting portion 33b2. The columnar portion 33b1 and the mounting portion 33b2 may be integrally formed or joined by welding or the like. The attachment portion 33b2 is attached to, for example, a bracket 32b1, which will be described later.
The columnar portion 33b1 and the mounting portion 33b2 can be made of metal such as stainless steel, for example.

The bracket 32b1 is a member to which the support portion 33 is attached. The bracket 32b1 is, for example, a plate-like member and is fixed to the pair of holders 32b using fastening members such as screws. Bracket 32b1 is provided between lower heat equalizing plate 34b and heater 32a. By doing so, interference with the lower heat equalizing plate 34b and the heater 32a is prevented. However, the mounting position of the bracket 32b1 is not limited to this. For example, it may be provided above the lower heat equalizing plate 34b. In this case, the bracket 32b1 is fixed to the pair of holders 32b so as to straddle the lower heat equalizing plate 34b. Further, it is not necessary to provide holes for preventing interference with the support portion 33 in the lower heat equalizing plate 34b.
The bracket 32b1 can be made of metal such as stainless steel, for example.

The holding portion 33c holds the tip portion 33a. One end of the holding portion 33c is attached to the tip portion 33a (flange 33a3). The other end of the holding portion 33c is attached to the base portion 33b (mounting portion 33b2) or the bracket 32b1.

Here, if the holding portion 33c is made of ceramics or the like, the manufacturing cost increases. If the holding portion 33c is made of metal such as stainless steel, an increase in manufacturing cost can be suppressed. However, if the holding portion 33c is simply made of metal, rubbing occurs between the holding portion 33c and the tip portion 33a due to the difference in coefficient of linear expansion. Therefore, particles may be emitted from between the holding portion 33c and the tip portion 33a.

Therefore, the holding portion 33c is an elastic body containing metal. For example, as shown in FIG. 2, the holding portion 33c can be a coil spring containing metal. The holding portion 33c can be, for example, a coil spring made of stainless steel or Inconel. If the holding portion 33c is an elastic body, the deformation of the holding portion 33c can absorb the displacement between the holding portion 33c and the distal end portion 33a caused by the difference in coefficient of linear expansion. Therefore, particles can be suppressed from being emitted from between the holding portion 33c and the tip portion 33a.

Further, if the holding portion 33c is provided, it is possible to maintain the gap between the base portion 33b (the columnar portion 33b1) and the inner wall of the tip portion 33a. release can be suppressed.
Further, by providing a gap between the base portion 33b (the columnar portion 33b1) and the inner wall of the tip portion 33a, when the workpiece 100 is thermally deformed, the tip portion 33a of the support portion 33 is bent in accordance with the thermal deformation of the workpiece 100. can move. Further, since the tip portion 33a is supported by the holding portion 33c, the tip portion 33a of the support portion 33 can be easily moved according to the thermal deformation of the workpiece 100. FIG. If the front end portion 33a of the support portion 33 can move according to the thermal deformation of the work 100, it is possible to prevent the back surface of the work 100 from being damaged. Therefore, it is possible to suppress the generation of particles from the contact portion between the workpiece 100 and the tip portion 33a.
Moreover, if the holding portion 33c is made of metal, it is possible to suppress an increase in manufacturing cost.

FIG. 3 is a schematic diagram for illustrating the support portion 133 according to another embodiment.
As shown in FIG. 3, the support portion 133 has, for example, a tip portion 133a, a base portion 133b, and a holding portion 133c.

The tip portion 133a has a cylindrical shape, and one end portion (the end portion on the back side of the workpiece 100) 133a1 is closed. The end portion 133a1 can be, for example, similar to the end portion 33a1 described above.
The other end 133a2 of the tip 133a is open. The end portion 133a2 may be provided with a flange, or may not be provided with a flange.
The material of the tip portion 133a can be, for example, the same as the material of the tip portion 33a described above.

The base portion 133b has, for example, a columnar portion 133b1 and a mounting portion 133b2.
One end side of the columnar portion 133b1 is provided inside the tip portion 133a with a gap therebetween. For example, a gap is provided between the columnar portion 133b1 and the inner wall of the tip portion 133a. The other end side of the columnar portion 133b1 is provided on the mounting portion 133b2. A flange 133b3 can also be provided on the columnar portion 133b1. The flange 133b3 can be provided near the end 133a2 of the tip 133a. Note that the flange 133b3 can be omitted. However, if the flange 133b3 is provided, the length of the holding portion 133c in the axial direction of the columnar portion 133b1 can be shortened, so the posture of the tip portion 133a can be stabilized.

The columnar portion 133b1, the mounting portion 133b2, and the flange 133b3 may be integrally formed or joined by welding or the like. The attachment portion 133b2 is attached to, for example, a bracket 32b1 provided on the holder 32b.
The columnar portion 133b1, the mounting portion 133b2, and the flange 133b3 can be made of metal such as stainless steel, for example.

The holding portion 133c holds the tip portion 133a. One end of the holding portion 133c is attached to the end 133a2 of the tip portion 133a. The other end of the holding portion 133c is attached to the flange 133b3. If the flange 133b3 is not provided, the other end of the holding portion 133c can be attached to the mounting portion 133b2.

The holding portion 133c is an elastic body containing metal. For example, as shown in FIG. 3, the holding portion 133c can be a leaf spring containing metal. The holding portion 133c can be, for example, a leaf spring made of stainless steel or Inconel. If the holding portion 133c is an elastic body, the deformation of the holding portion 133c can absorb the displacement between the holding portion 133c and the distal end portion 133a caused by the difference in coefficient of linear expansion. Therefore, particles can be suppressed from being emitted from between the holding portion 133c and the tip portion 133a.

Further, if the holding portion 133c is provided, the gap between the base portion 133b (the columnar portion 133b1) and the inner wall of the tip portion 133a can be maintained, so that particles can be trapped between the base portion 133b and the tip portion 133a. release can be suppressed.
Further, if the holding portion 133c contains metal, an increase in manufacturing cost can be suppressed.

FIG. 4 is a schematic diagram for illustrating a support portion 233 according to another embodiment.
As shown in FIG. 4, the support portion 233 has, for example, a tip portion 33a, a base portion 33b, and a holding portion 233c.
The holding portion 233c holds the tip portion 33a.
The holding portion 233c has a first portion 233c1 and a second portion 233c2.
The first portion 233c1 is provided, for example, at the distal end portion 33a (flange 33a3). The first portion 233c1 can be, for example, an annular magnetic body.
The second portion 233c2 faces the first portion 233c1 with a gap therebetween. The second portion 233c2 can be provided on, for example, the base portion 33b (mounting portion 33b2) or the bracket 32b1. The second portion 233c2 can be, for example, an annular magnetic body.

In this case, the first portion 233c1 and the second portion 233c2 can be permanent magnets. The magnetic pole of the first portion 233c1 facing the second portion 233c2 is the same as the magnetic pole of the second portion 233c2 facing the first portion 233c1. For example, when the side of the first portion 233c1 facing the second portion 233c2 is the S pole, the side of the second portion 233c2 facing the first portion 233c1 is the S pole. For example, when the side of the first portion 233c1 facing the second portion 233c2 is the N pole, the side of the second portion 233c2 facing the first portion 233c1 is the N pole.

By doing so, a repulsive force (repulsive force) is generated between the first portion 233c1 and the second portion 233c2. Therefore, it is possible to absorb the deviation between the holding portion 233c and the tip portion 33a due to the difference in linear expansion coefficient. As a result, particles can be suppressed from being emitted from between the holding portion 233c and the tip portion 33a.

Further, if the holding portion 233c is provided, the gap between the base portion 33b (the columnar portion 33b1) and the inner wall of the tip portion 33a can be maintained, so that the particles can be prevented from entering between the base portion 33b and the tip portion 33a. release can be suppressed.
Further, if the first portion 233c1 and the second portion 233c2 are permanent magnets, an increase in manufacturing cost can be suppressed.

The embodiments have been illustrated above. However, the invention is not limited to these descriptions.
Appropriate design changes made by those skilled in the art with respect to the above embodiments are also included in the scope of the present invention as long as they have the features of the present invention.
For example, the shape, dimensions, arrangement, etc. of the heat treatment apparatus 1 are not limited to those illustrated and can be changed as appropriate.

Moreover, each element provided in each of the above-described embodiments can be combined as much as possible, and a combination thereof is also included in the scope of the present invention as long as it includes the features of the present invention.
Although the support portion 33 is held by the bracket 32b1 in the present embodiment, the present invention is not limited to this. For example, the width of the heat equalizer support portion 35 that supports the lower heat equalizer plate 34 b may be increased, and the support portion 33 may be provided on the upper surface of the heat equalizer support portion 35 . In other words, the heat equalizer support portion 35 that supports the lower heat equalizer plate 34b may have the function of the bracket 32b1. By doing so, there is no need to provide the bracket 32b1, which reduces the number of parts and facilitates maintenance. Alternatively, the lower heat equalizing plate 34b and the support portion 33 may be integrally formed.

1 Heat Treatment Apparatus 10 Chamber 20 Exhaust Part 30 Treatment Part 30a Treatment Area 30b Treatment Area 32 Heating Part 33 Supporting Part 33a Tip Part 33b Base Part 33c Holding Part 50 Controller 100 Workpiece 133 Supporting Part 133a Tip Part 133b Base Part 133c Holding Part 233 Supporting Part 233c Holding Part 233c1 First Part 233c2 Second Part

Claims (5)

a chamber;
a support provided inside the chamber and capable of supporting a workpiece;
a heating unit provided inside the chamber and capable of heating the workpiece;
with
The support part is
a tip portion having a cylindrical shape, one end portion of which is capable of contacting the work;
a columnar portion having one end side provided inside the tip portion with a gap therebetween;
a holding portion that holds the tip portion;
A heat treatment apparatus having 2. The heat treatment apparatus according to claim 1, further comprising an exhaust part capable of exhausting the interior of said chamber. The tip includes ceramics or glass,
3. The heat treatment apparatus according to claim 1, wherein the columnar portion contains metal. The heat treatment apparatus according to any one of claims 1 to 3, wherein the holding part is an elastic body containing metal. The holding part is
a first portion provided at the tip;
a second portion facing the first portion with a gap;
has
the first portion and the second portion are permanent magnets;
4. The magnetic pole of the first portion facing the second portion is the same as the magnetic pole of the second portion facing the first portion. 1. The heat treatment apparatus according to 1.

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