JP6826288B2 - Work dividing device and work dividing method - Google Patents

Description

The present invention relates to a work dividing device and a work dividing method, and more particularly to a work dividing device and a work dividing method for dividing a work such as a semiconductor wafer into individual chips along a scheduled division line.

Conventionally, in the manufacture of a semiconductor chip (hereinafter referred to as a chip), a semiconductor wafer (hereinafter referred to as a wafer) in which a planned division line is formed in advance by half-cutting with a dicing blade or forming a modified region by laser irradiation. ) Is known as a work dividing device that divides) into individual chips along a planned division line (see Patent Document 1 and the like).

13A and 13B are explanatory views of a wafer unit 2 to which a disk-shaped wafer 1 divided by a work dividing device is attached, FIG. 13A is a perspective view of the wafer unit 2, and FIG. 13B is a wafer unit. It is a vertical sectional view of 2.

The wafer 1 is attached to the central portion of a dicing tape (also referred to as an expansion tape or an adhesive sheet) 3 having a thickness of about 100 μm having an adhesive layer formed on one side, and the dicing tape 3 is a metal having a rigid outer peripheral portion. It is fixed to a ring-shaped frame 4 made of metal.

In the work dividing device, the frame 4 of the wafer unit 2 is abutted and fixed by the fixing portion (also referred to as a frame fixing mechanism) 7 indicated by the alternate long and short dash line. After that, the expanding ring (also referred to as a push-up ring) 8 indicated by the alternate long and short dash line is moved upward from below the wafer unit 2, and the dicing tape 3 is pressed by the expanding ring 8 to be radially expanded. The tension of the dicing tape 3 generated at this time is applied to the scheduled division line 5 of the wafer 1, so that the wafer 1 is divided into individual chips 6.

Here, in the specification of the present application, the region of the dicing tape 3 having a circular shape in a plan view to which the wafer 1 is attached is referred to as a central region 3A, and the outer edge portion (outer edge portion of the wafer 1) and the frame of the central region 3A. The plan-view donut-shaped region provided between the inner edge portion of 4 is referred to as an annular portion region 3B, and the plan-view donut-shaped region of the outermost peripheral portion fixed to the frame 4 is referred to as a fixed portion region 3C. The annular portion region 3B is a region that is pressed and expanded by the expanding ring 8.

In the work dividing device, the force required for dividing the wafer 1, that is, the tension that must be generated in the annular portion region 3B to divide the wafer 1, must be increased as the number of planned division lines 5 increases. It is known that it does not become. Regarding the number of planned division lines 5, for example, when the wafer 1 having a diameter of 300 mm has a chip size of 5 mm, about 120 planned division lines (60 lines each in the XY direction) are formed, and the chip size is 1 mm. Is formed with about 600 scheduled division lines 5. Therefore, the tension that must be generated in the annular portion region 3B must be increased as the chip size becomes smaller.

By the way, the inner diameter (diameter of the inner edge of the frame) of the frame 4 on which the wafer 1 having a diameter of 300 mm is mounted is defined as 350 mm by the SEMI standard (specification for a tape frame for a G74-0699 300 mm wafer). According to this standard, as shown in the vertical cross-sectional view of the wafer unit 2 of FIG. 14, an annular portion region 3B having a width dimension of 25 mm exists between the outer edge portion of the wafer 1 and the inner edge portion of the frame 4. .. Further, as shown in the vertical cross-sectional view of the main part of the work dividing device shown in FIGS. 15A and 15B, the fixing portion 7 for fixing the frame 4 does not come into contact with the annular portion region 3B expanded by the expanding ring 8. In the in-plane direction of the dicing tape 3 indicated by the arrow A, the dicing tape 3 is installed at a position separated outward from the annular portion region 3B.

Here, the forces that divide the wafer 1 generated by the ascending operation of the expanding ring 8 are (i) a force that expands the entire region of the annular portion region 3B, (ii) a force that divides the wafer 1 into chips 6, and (iii). It is decomposed into three forces that expand the dicing tape 3 between the adjacent chips 6.

As shown in the operation diagram of the work dividing device shown in FIGS. 16A to 16E, the expanding ring 8 abuts on the annular portion region 3B of the dicing tape 3, and the dicing tape 3 begins to expand by the ascending operation of the expanding ring 8. (FIG. 16 (A)), the expansion of the annular region 3B having the lowest spring constant begins (FIG. 16 (B)). As a result, tension is generated in the annular portion region 3B, and when this tension increases to some extent, the increased tension is transmitted to the wafer 1 and the wafer 1 is divided into chips 6 (FIG. 16C). When the wafer 1 is divided into individual chips 6, the expansion of the annular region 3B and the expansion of the dicing tape 3 between the chips 6 proceed at the same time (FIGS. 16D to 16E).

In the conventional work dividing device, in the wafer 1 having a diameter of 300 mm, when the chip size is 5 mm or more, the individual chips 6 can be divided without any problem due to the tension generated in the annular portion region 3B. However, with the miniaturization of the circuit pattern formed on the wafer 1, chips having a smaller chip size of 1 mm or less have appeared. In this case, when the number of planned division lines 5 for dividing the wafer 1 increases, the force required for dividing the wafer 1 increases, and a force greater than the tension due to the expansion of the annular portion region 3B is required. was there. Then, as shown in the vertical cross-sectional view of the wafer unit 2 of FIG. 17, even if the expansion operation by the expanding ring 8 is completed, a part of the planned division line 5 formed on the wafer 1 is not divided and remains undivided. There was a problem of doing.

Such an undivided problem of the scheduled division line 5 cannot be solved by increasing the expansion amount and expansion speed of the dicing tape 3. For example, when the expansion amount of the dicing tape 3 is increased, the annular portion region 3B starts plastic deformation. Since the spring constant of the annular portion region 3B during plastic deformation is smaller than the spring constant during elastic deformation, the tension for dividing the wafer 1 into individual chips 6 in the region exceeding the elastic deformation of the annular portion region 3B Does not occur. On the other hand, even when the expansion speed of the dicing tape 3 is increased, a part of the annular portion region 3B starts to be plastically deformed, so that the tension for dividing the wafer 1 into the individual chips 6 is not generated. This is because the frequency response of the dicing tape 3 is low, so that the force is not transmitted to the entire dicing tape 3 without a time lag.

Therefore, as an example of an apparatus for solving the above-mentioned problems, Patent Document 2 discloses a tape expansion apparatus (work division apparatus) provided with cold air supply means. According to Patent Document 2, the dicing tape is cooled by operating the cold air supply means to supply cold air into the processing space and cooling the processing space to, for example, below zero.

As in Patent Document 2, by cooling the dicing tape, the dicing tape can be expanded in a state where the spring constant of the dicing tape is increased. As a result, the tension generated in the annular portion region 3B shown in FIG. 14 can be increased as compared with the uncooled dicing tape, so that even if the chip size is small, it can be divided into individual chips. It becomes.

Japanese Unexamined Patent Publication No. 2016-149581 Japanese Unexamined Patent Publication No. 2016-12585

However, in the work dividing device of Patent Document 2, since the wafer unit is cooled below zero by the cold air from the cold air supply means, when the low temperature wafer unit divided into individual chips is immediately taken out from the work dividing device, Condensation may occur on the wafer unit due to the humidity of the outside air.

When dew condensation occurs on the wafer unit, the following problems occur. That is, stains called watermarks are generated on the chip, and these stains cause pattern defects, or the silicon surface that should be originally not exposed properly, resulting in incomplete film formation and abnormal film formation. Occurs.

Such a problem can be solved by dividing the wafer into individual chips, stopping the supply of cold air, and leaving the wafer unit in the work dividing device until the low temperature wafer unit 2 returns to room temperature. Can be done. That is, it can be solved by adding a room temperature step (heating step) for cooling the wafer unit to room temperature after the work splitting process by the work dividing device.

Here, the heat capacity of each member constituting the wafer unit 2 will be described. The heat capacity of the rigid metal frame 4 is larger than the heat capacity of the thin silicon wafer 1 and the resin dicing tape 3. .. Due to such a difference in heat capacity, even if the wafer 1 and the dicing tape 3 return to room temperature, it takes time for the frame 4 to return to room temperature. That is, since dew condensation formed on the frame 4 may adhere to the wafer 1, the time required for the room temperature step is not the time until the wafer 1 and the dicing tape 3 return to room temperature, but until the frame 4 returns to room temperature. It takes about 15 minutes, for example. When such a time-consuming room temperature setting step is added, there is a problem that the work processing capacity (throughput) per unit time of the work dividing device is significantly reduced.

As described above, in the conventional work dividing device, the problem of undivided lines to be divided, which occurs when the chip size is small, is solved, and the work processing capacity is reduced due to the addition of a time-consuming room temperature step. There is nothing that can solve the problem, and it has been desired to realize such a device.

The present invention has been made in view of such a problem, and the undivided problem of the scheduled division line that occurs when the chip size is a small chip and the work processing capacity generated by adding a time-consuming room temperature step. It is an object of the present invention to provide a work dividing device and a work dividing method capable of simultaneously solving the problem of deterioration of the work.

In order to achieve the object of the present invention, the work dividing device of the present invention divides a work attached to a dicing tape and mounted on a frame into individual chips along a planned division line. A cooling unit that has a surrounding cooling chamber and cools the inside of the cooling chamber, an expanding ring that is arranged inside the cooling chamber and expands the dicing tape by applying tension to the dicing tape cooled by the cooling unit, and a cooling chamber. The greenhouse is separated from the cooling chamber by a partition wall that can be opened and closed, and has a heating section that heats the inside of the greenhouse in a dry atmosphere, and is equipped with a dicing tape by expanding. After the work is expanded, the workpiece moved from the cooling chamber to the greenhouse is heated inside the greenhouse together with the dicing tape and frame.

According to the work dividing device of the present invention, the dicing tape is cooled inside the cooling chamber, and the dicing tape is expanded by expanding while the spring constant of the dicing tape is increased. As a result, according to the work dividing device of the present invention, even if the chip size is small, it can be divided into individual chips. Then, according to the work dividing device of the present invention, the work divided into individual chips by expanding is moved from the cooling chamber to the greenhouse, and then the work is moved inside the greenhouse together with the dicing tape and the frame in a dry atmosphere. Warm with to return to room temperature. As a result, according to the work dividing device of the present invention, the time required for the frame and the dicing tape to reach room temperature is significantly longer than that of the conventional work dividing device in which the low temperature frame and dicing tape are left at room temperature. It can be shortened.

Therefore, according to the work dividing device of the present invention, there is a problem of undivision of the scheduled division line that occurs when the chip size is small, and a problem of a decrease in work processing capacity caused by adding a time-consuming room temperature step. Can be resolved at the same time.

One aspect of the work dividing device of the present invention includes an expansion holding ring for holding the expanded state of the dicing tape expanded by the expanding ring, and the heating unit is in a state where the expanded state of the dicing tape is held by the expansion holding ring. Therefore, it is preferable to heat the work together with the dicing tape and the frame inside the greenhouse.

According to one aspect of the present invention, the dicing tape is heated inside the greenhouse while the dicing tape is held by the expansion holding ring, that is, the chips are prevented from being damaged due to contact between the chips. can do.

In one aspect of the work dividing device of the present invention, the cooling unit has a cold air supply means for supplying cold air at a temperature at which the dicing tape becomes brittle to the cooling chamber, and the heating unit heats the greenhouse at a temperature of room temperature or higher. It is preferable to have a heating means for heating.

According to one aspect of the present invention, since the dicing tape is made brittle by the cold air from the cold air supply means, a sufficient spring constant corresponding to the division of small chips can be given to the dicing tape, and the dicing tape is heated. The frame and dicing tape can be brought to room temperature in a short time by means.

In one aspect of the work dividing device of the present invention, it is preferable that the heating means includes a first heating means that mainly heats the frame and a second heating means that mainly heats the dicing tape.

According to one aspect of the present invention, the frame having a large heat capacity is heated by the first heating means, and the dicing tape having a small heat capacity is heated by the second heating means. On the other hand, when the frame and the dicing tape are heated at the same temperature by one heating means, the temperature rise rate of the frame (the temperature rise per unit time) is smaller than the temperature rise rate of the dicing tape. Therefore, when the frame is brought to room temperature, the dicing tape becomes hotter than normal temperature. In such a case, the dicing tape may soften, and when the dicing tape softens, the tension of the dicing tape decreases, which may affect the divided chips.

According to one aspect of the present invention, by mainly heating the frame by the first heating means and mainly heating the dicing tape by the second heating means, for example, the time until the dicing tape reaches room temperature and Since the time required for the frame to reach room temperature can be matched, the time required for the frame to reach room temperature can be shortened, and the dicing tape can be prevented from softening.

In one aspect of the work dividing device of the present invention, the heating unit has a first temperature measuring means for measuring the temperature of the frame and a second temperature measuring means for measuring the temperature of the dicing tape, and the first temperature measuring means is used. Based on the temperature of the frame measured and the temperature of the dying tape measured by the second temperature measuring means, the first heating means and the second heating means so that the temperature difference between the frame and the dying tape becomes small. It is preferable to provide a control unit that individually controls the temperature of the frame and the dicing tape.

According to one aspect of the present invention, the temperature difference between the frame and the dicing tape is based on the temperature of the frame measured by the first temperature measuring means and the temperature of the dicing tape measured by the second temperature measuring means. Since the temperature of the frame and the dicing tape is individually controlled by the first heating means and the second heating means so as to be smaller, the time required for the frame to reach room temperature can be shortened and the dicing tape can be softened. It can be reliably prevented.

The work dividing method of the present invention is a work dividing method for dividing a work attached to a dicing tape and mounted on a frame into individual chips along a planned division line in order to achieve the object of the present invention. A cooling process that cools the work placed inside the cooling chamber by cooling the inside of the dicing chamber, an expansion process that applies tension to the dicing tape cooled inside the cooling chamber to expand the dicing tape, and an expansion process. After the dicing tape is expanded by, the work is moved to the heating room connected to the cooling chamber, and the inside of the heating room is heated in a dry atmosphere, so that the work is divided into the dicing tape and the frame inside the heating room. It is provided with a heating process for heating together with.

According to the work dividing method of the present invention, the problem of undivided lines to be divided, which occurs when the chip size is a small chip, and the problem of a decrease in work processing capacity due to a time-consuming room temperature step are simultaneously solved. Can be done.

One aspect of the work dividing method of the present invention has an expanded state holding step between the expanding step and the heating step, and the expanded state holding step holds the expanded state of the dicing tape expanded by the expanding step. In the heating step, it is preferable to heat the work together with the dicing tape and the frame inside the heating chamber while the expanded state of the dicing tape is maintained by the expanded state holding step.

According to one aspect of the present invention, the dicing tape is heated inside the greenhouse while the dicing tape is held by the expansion holding ring, that is, the chips are prevented from being damaged due to contact between the chips. can do.

In one aspect of the work dividing method of the present invention, it is preferable that the cooling step supplies cold air at a temperature at which the dicing tape becomes brittle to the cooling chamber, and the heating step warms the greenhouse at a temperature equal to or higher than normal temperature. ..

According to one aspect of the present invention, since the dicing tape is made brittle by the cold air in the cooling step, a sufficient spring constant corresponding to the division of small chips can be given to the dicing tape, and the heating step can provide a sufficient spring constant. The frame and dicing tape can be cooled to room temperature in a short time.

In one aspect of the work dividing method of the present invention, it is preferable that the heating step includes a first heating step in which the frame is mainly heated and a second heating step in which the dicing tape is mainly heated.

According to one aspect of the present invention, by having a first heating step for mainly heating the frame and a second heating step for mainly heating the dicing tape, for example, the time until the dicing tape reaches room temperature. Since it is possible to match the time required for the frame to reach room temperature, it is possible to significantly reduce the time required for the frame to reach room temperature and prevent the dicing tape from softening.

In one aspect of the work dividing method of the present invention, the heating step includes a first temperature measuring step of measuring the temperature of the frame and a second temperature measuring step of measuring the temperature of the dicing tape, and the temperature is measured in the first temperature measuring step. Control to individually control the temperature of the frame and the dicing tape so that the temperature difference between the frame and the dicing tape becomes small based on the temperature of the heated frame and the temperature of the dicing tape measured in the second temperature measurement step. It is preferable to have a step.

According to one aspect of the present invention, the temperature difference between the frame and the dicing tape is small based on the temperature of the frame measured in the first temperature measuring step and the temperature of the dicing tape measured in the second temperature measuring step. Therefore, since the temperatures of the frame and the dicing tape are individually controlled, it is possible to reliably prevent the dicing tape from softening while significantly shortening the time required for the frame to reach room temperature.

According to the present invention, it is possible to simultaneously solve the problem of undivided lines to be divided, which occurs when the chip size is small, and the problem of a decrease in work processing capacity caused by adding a time-consuming room temperature step. it can.

Structural drawing of the work dividing device of the embodiment Enlarged perspective view of the main part of the work dividing device shown in FIG. Longitudinal cross-sectional view of the main part of the wafer unit showing the shape of the annular portion region during expansion Vertical sectional view showing the expanded state of the dicing tape by the extended holding ring. Enlarged sectional view of the main part of FIG. An enlarged perspective view of a main part showing the configuration of a heating part of the work dividing device shown in FIG. Block diagram showing the control system of the work dividing device Flow chart showing an example of wafer division method Operation explanatory diagram of work dividing device Operation explanatory diagram of work dividing device Explanatory drawing of the wafer unit carried from the cooling chamber to the greenhouse Explanatory drawing which showed other embodiment of a heating part Explanatory drawing of the wafer unit to which the wafer is attached Longitudinal section of wafer unit Side view of the main part of the work dividing device Operation diagram of work dividing device Longitudinal section of the wafer unit in which the wafer is divided

Hereinafter, preferred embodiments of the work dividing device and the work dividing method according to the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the following embodiments, and various modifications and substitutions can be added to the following embodiments within the scope of the present invention.

FIG. 1 is a vertical cross-sectional view of a main part of a cooling unit 12 and a heating unit 40 provided in the work dividing device 10 according to the embodiment, and FIG. 2 is an enlarged perspective view of a main part of the cooling unit 12. The size of the wafer unit to be divided by the work dividing device 10 is not limited, but in the embodiment, the wafer unit 2 on which the wafer 1 having a diameter of 300 mm shown in FIG. 14 is mounted is illustrated.

As shown in FIG. 2, the work dividing device 10 is a device that divides the wafer 1 on which the scheduled division line 5 is formed into individual chips 6 along the scheduled division line 5. A plurality of scheduled division lines 5 are formed in the X direction and the Y direction orthogonal to each other. In the embodiment, the number of planned division lines 5 parallel to the X direction and the number of planned division lines 5 parallel to the Y direction are 300, and the intervals are the same. Wafer 1, that is, a chip having a chip size of 1 mm. An example is a wafer 1 divided into 6.

As shown in FIGS. 1 and 2, the wafer 1 is attached to the central portion of the dicing tape 3 whose outer peripheral portion is fixed to the frame 4. The dicing tape 3 has a donut shape in a plan view between the central region 3A having a circular shape in a plan view to which the wafer 1 is attached and the outer edge portion (outer edge portion of the wafer 1) of the central portion region 3A and the inner edge portion of the frame 4. It has an annular portion region 3B of.

The thickness of the wafer 1 is, for example, about 50 μm. Further, as the dicing tape 3, for example, a PVC (polyvinyl chloride) -based tape is used. The wafer 1 may be attached to the dicing tape 3 via a film-like adhesive such as DAF (Die Attach Film). As the film-like adhesive, for example, a PO (polyolefin) -based adhesive can be used.

The cooling portion 12 of the work dividing device 10 is in contact with the fixing portion 7 (see FIGS. 15 and 16) for fixing the frame 4 and the annular portion region 3B of the dicing tape 3 from below to press the dicing tape 3. It has an expanding ring 14 that expands with the dicing ring 14, and an expanding holding ring (also referred to as a sub-ring) 18 that holds the expanded state of the dicing tape 3 expanded by the expanding ring 14.

Further, as shown in FIG. 1, the cooling unit 12 includes a cooling chamber 16 that surrounds the fixing unit 7, the expanding ring 14, and the expansion holding ring 18. Further, the work dividing device 10 includes a cold air supply means 24 provided with a nozzle 22 for supplying the cold air 20 below zero to the cooling chamber 16. The cooling unit 12 is composed of the cooling chamber 16 and the cold air supply means 24. Then, the cold air 20 is supplied to the internal space 34 of the cooling chamber 16, which is a space including the expanding ring 14 and the expansion holding ring 18. The temperature of the cold air 20 may be any temperature at which the spring constant of the dicing tape 3 can be increased, but is preferably a temperature at which the dicing tape 3 is made brittle, for example, −20 ° C. to −30 ° C.

The fixing portion 7 is arranged on the same side as the sticking surface of the wafer 1 on the dicing tape 3, and the frame 4 is detachably fixed to the lower surface 7A thereof. Further, the fixing portion 7 is installed at a position separated outward from the annular portion region 3B in the in-plane direction of the dicing tape 3 indicated by the arrow A so as not to come into contact with the annular portion region 3B expanded by the expanding ring 14. ing.

As shown in FIG. 2, the shape of the fixing portion 7 is a ring shape having an opening 7B having a diameter of 361 mm, which is larger than the inner diameter (350 mm) of the frame 4, but the shape is not particularly limited. As the fixing portion 7, for example, a rectangular plate-shaped material having an opening 7B can be exemplified, and a fixing portion composed of a plurality of fixing members arranged at predetermined intervals along the outer circumference of the frame 4 is exemplified. You can also do it. The inscribed circle of these fixing members is set equal to the diameter of the opening 7B.

The expanding ring 14 is arranged on the back surface side of the dicing tape 3 opposite to the attachment surface of the wafer 1, and is an expansion opening smaller than the inner diameter (350 mm) of the frame 4 and larger than the outer diameter (300 mm) of the wafer 1. It is formed in a ring shape having a portion (opening) 14A. The expanding ring 14 is movably arranged in a direction relatively close to the dicing tape 3. Specifically, the expanding ring 14 presses the back surface of the annular portion region 3B of the dicing tape 3 to expand the annular portion region 3B (position indicated by the alternate long and short dash line in FIG. 1) and downward from the expansion position. It is movably arranged in the vertical direction with and from the retracted position (position shown by the solid line in FIG. 1) retracted to.

Further, the work dividing device 10 is provided with an expanding ring moving mechanism 30 that moves the expanding ring 14 up and down between the expansion position and the retracted position. As an example of the expanding ring moving mechanism 30, a feed screw device is illustrated, but an actuator such as an air cylinder device can be used instead. When the expanding ring 14 located at the retracted position is moved toward the expanded position by the expanding ring moving mechanism 30, the expanding ring 14 is moved upward in the direction of arrow B toward the annular portion region 3B. As a result, the back surface of the annular portion region 3B is pressed by the expanding ring 14 and is expanded radially. The expanding ring 14 may be fixed and the wafer unit 2 may be moved downward in the direction of arrow C to press the annular portion region 3B against the expanding ring 14.

FIG. 3 is a vertical cross-sectional view of a main part of the wafer unit 2 showing the shape of the annular portion region 3B being expanded by the expanding ring 14. As will be described later, prior to the expansion of the annular portion region 3B by the expanding ring 14, the internal space 34 is cooled by, for example, cold air 20 at −20 to −30 ° C. supplied from the nozzle 22 to the internal space 34 of the cooling chamber 16. To. As a result, the dicing tape 3 is made brittle and the spring constant of the dicing tape 3 is larger than that at room temperature. In this state, the annular portion region 3B of the dicing tape 3 is expanded by the expanding ring 14, so that even if the chip size is small, it can be divided into individual chips.

The temperature of the annular portion region 3B cooled by the cold air 20 may be measured by a radiation thermometer (not shown). Further, the temperature change data of the annular portion region 3B based on the temperature of the cold air 20 and the supply time of the cold air 20 may be measured in advance, and the supply time of the cold air 20 may be controlled based on the temperature change data.

The nozzle 22 shown in FIG. 1 is arranged in the internal space 34 of the cooling chamber 16 toward the annular portion region 3B of the dicing tape 3. As a result, the annular portion region 3B is efficiently cooled by the cold air 20. Further, the cold air supply means 24 includes a heat exchanger that cools the sucked outside air to below zero, and the cold air 20 cooled by the heat exchanger is supplied to the nozzle 22 via the pipe 25. Although the cold air supply means 24 is arranged outside the cooling chamber 16 in FIG. 1, it may be arranged inside the cooling chamber 16. In this case, since the cold air supply means 24 cools the cooled indoor air in the internal space 34, the load on the heat exchanger can be reduced.

As shown in FIG. 1, the expansion holding ring 18 for holding the expanded state of the dicing tape 3 is arranged on the back surface side of the dicing tape 3 opposite to the sticking surface of the wafer 1. Further, the expansion holding ring 18 is attached to the main body ring 32 whose outer diameter is smaller than the inner diameter (350 mm) of the frame 4 and whose inner diameter is larger than the outer diameter of the expanding ring 14, and to the outer peripheral portion of the main body ring 32. It has a ring-shaped fitting portion 26 having an elastically deformable diameter (351.3 mm) larger than the inner diameter (350 mm) of the frame 4.

FIG. 4 is a vertical cross-sectional view in which the expanded state of the dicing tape 3 is held by the extended holding ring 18. FIG. 5 is an enlarged cross-sectional view of a main part of FIG.

As shown in FIGS. 4 and 5, the fitting portion 26 of the expansion holding ring 18 is fitted to the surface 4A of the frame 4 at the fitting position shown by the solid line via the annular portion region 3B of the dicing tape 3. As a result, the expanded state of the dicing tape 3 is held by the expansion holding ring 18.

Before the expansion holding, the expansion holding ring 18 is arranged at a standby position (the position shown by the solid line in FIG. 1) below the fitting position shown by the solid line in FIGS. 4 and 5, and from the standby position during the expansion holding. It is moved up to the fitting position by the extended holding ring moving mechanism 38. As an example of the extended holding ring moving mechanism 38, a feed screw device is illustrated, but an actuator such as an air cylinder device can be used instead.

When the extended holding ring 18 is raised by the extended holding ring moving mechanism 38, the fitting portion 26 comes into contact with the lower surface of the frame 4. After that, the fitting portion 26 is pushed by the inner peripheral surface of the frame 4 by the continuous ascending movement of the expansion holding ring 18, and ascends while being elastically deformed. Then, the ascending of the extended holding ring 18 is stopped at the position where the fitting portion 26 passes through the inner peripheral surface of the frame 4. As a result, the fitting portion 26 is fitted to the surface 4A of the frame 4 at the fitting position as shown in FIGS. 4 and 5. The expansion holding ring 18 may be fixed and the dicing tape 3 side may be moved in a direction closer to the expansion holding ring 18. That is, when the fitting portion 26 is fitted to the surface 4A of the frame 4, the expansion holding ring 18 may be moved in a direction relatively close to the dicing tape 3.

Next, the heating unit 40 shown in FIG. 1 will be described.

The heating unit 40 includes a greenhouse 42 that heats the wafer 1, the dicing tape 3, and the wafer unit 2 having the frame 4 cooled by the cooling unit 12 in a dry atmosphere. The greenhouse 42 has a dry atmosphere secured by the dry air 37 supplied from the dry air supply means 36.

The wafer unit 2 divided into individual chips in the cooling chamber 16 of the cooling unit 12 is of the heating unit 40 from the cooling chamber 16 with the expansion holding ring 18 mounted on the frame 4 by a transfer device (not shown). It is carried into the greenhouse 42. As a result, the wafer unit 2 is moved to the greenhouse 42 while the dicing tape 3 is held in the expanded state by the expansion holding ring 18.

The greenhouse 42 is connected to the cooling chamber 16 through a heat insulating wall 44 which is a partition wall. Further, the inside of the greenhouse 42 is communicated with the internal space 34 of the cooling chamber 16 via a carry-out opening 48 opened and closed by the door 46 of the heat insulating wall 44. Therefore, the wafer unit 2 divided into individual chips in the cooling chamber 16 is carried from the cooling chamber 16 into the greenhouse 42 through the carry-out opening 48 by a transfer device (not shown) after the door 46 is opened. The door. Then, in the wafer unit 2 carried into the greenhouse 42, the frame 4 is placed on the ring-shaped table 50 of the greenhouse 42 by the above-mentioned transport device.

The table 50 is preferably made of a material having high thermal conductivity such as silver or copper. As a result, even if the table 50 is interposed between the heating means described later and the frame 4, the heat from the heating means is not taken away by the table 50 and is efficiently transferred to the frame 4. The shape of the table 50 is not limited to the ring shape, and may be any shape as long as the frame 4 can be placed. As an example, the shape of the table 50 may be a rectangular flat plate.

Below the table 50 of the greenhouse 42, a halogen lamp group 52, which is a heating means for heating the wafer unit 2 at a temperature equal to or higher than room temperature, is arranged.

Here, FIG. 6 is an enlarged perspective view of a main part showing the configuration of the heating portion 40 of the work dividing device 10 shown in FIG.

As shown in FIG. 6, the halogen lamp group 52 includes four rod-shaped halogen lamps 54, 54 ... Which are the first heating means for mainly heating the frame 4 of the wafer unit 2, and a dicing tape 3 containing the wafer 1. It is provided with three rod-shaped halogen lamps 56, 56 ... Which are mainly second heating means for heating. It is undeniable that the heat generated by the halogen lamps 54 and 56 is transferred to both the frame 4 and the dicing tape 3, but the halogen lamp 54 is a dedicated heating means for mainly heating the frame 4, and is a halogen lamp. Reference numeral 56 denotes a dedicated heating means for mainly heating the dicing tape 3.

The four halogen lamps 54 are arranged in a rectangular shape along the ring-shaped frame 4 at a position directly below the frame 4. Further, the three halogen lamps 56 are arranged side by side at a position directly below the dicing tape 3. Reflectors 58 and 60 are arranged below the halogen lamps 54 and 56 in close proximity to the halogen lamps 54 and 56. As a result, the frame 4 of the wafer unit 2 is heated to a temperature exceeding room temperature by the direct heat from the halogen lamp 54 and the reflected heat reflected by the reflector 58. Similarly, the dicing tape 3 is heated to a temperature exceeding room temperature by the direct heat from the halogen lamp 56 and the reflected heat reflected by the reflector 60.

The halogen lamp 54 is formed in a rod shape, but the shape is not limited to the rod shape. For example, the first heating portion may be formed by one ring-shaped halogen lamp, and the halogen lamp may be arranged at a position directly below the frame 4. Further, the halogen lamp 56 may be similarly configured in a ring shape. In this case, one halogen lamp may form the second heating portion, but a plurality of ring-shaped halogen lamps having different diameters arranged concentrically may form the second heating portion. ..

FIG. 7 is a block diagram showing a control system of the work dividing device.

According to FIG. 7, the halogen lamp 54 is lit by the electric power applied from the halogen lamp power supply 62 for the frame 4 to dissipate heat. Similarly, the halogen lamp 56 is lit by the electric power applied from the halogen lamp power supply 64 for the dicing tape 3 to dissipate heat. The calorific value of these halogen lamps 54 and 56 is changed by changing the voltage applied from the halogen lamp power supplies 62 and 64. That is, by changing the voltage applied to the halogen lamps 54 and 56 from the halogen lamp power supplies 62 and 64, the temperature at which the frame 4 is heated by the halogen lamp 54 and the temperature at which the dicing tape 3 is heated by the halogen lamp 56 are set. Be changed. As a result, the dicing tape 3 and the frame 4 can be individually heated by the halogen lamps 54 and 56.

In the halogen lamp power supplies 62 and 64, the voltage applied to the halogen lamps 54 and 56 is controlled by the control unit 66 that collectively controls the work dividing device 10. The control unit 66 is based on the temperature measured by the radiation thermometer 68, which is the first temperature measuring means, and the radiation thermometer 70, which is the second temperature measuring means, installed in the heating chamber 42 (see FIG. 1). The halogen lamp power supplies 62 and 64 are controlled, and the voltage applied to the halogen lamps 54 and 56 is controlled. That is, the temperature at which the frame 4 is heated by the halogen lamp 54 is controlled based on the first temperature measurement step of measuring the temperature of the frame 4 measured by the radiation thermometer 68. Similarly, the temperature at which the dicing tape 3 is heated by the halogen lamp 56 is controlled based on the second temperature measurement step of measuring the temperature of the dicing tape 3 measured by the radiation thermometer 70.

The radiation thermometer 68 is arranged above the frame 4 of the wafer unit 2 placed on the table 50 so that the temperature of the frame 4 can be measured. Similarly, the radiation thermometer 70 is arranged above the dicing tape 3 of the wafer unit 2 placed on the table 50 so that the temperature of the dicing tape 3 can be measured.

The control unit 66 also controls the operations of the expanding ring moving mechanism 30 that drives the expanding ring 14, the expanding holding ring moving mechanism 38 that drives the expanding holding ring 18, and the cold air supply means 24.

Next, according to the flowchart of FIG. 8, FIGS. 9 (A) to 9 (D), FIGS. 10 (A) to 10 (D), and the operation explanatory diagram of the work dividing device 10 shown in FIG. 10, the work dividing device 10 of the embodiment The action will be described.

First, in the arrangement step of step S100 of FIG. 8, as shown in FIG. 9A, the expanding ring 14 is arranged in the retracted position by the expanding ring moving mechanism 30, and the extended holding ring 18 is placed in the standby position by the extended holding ring moving mechanism 38. To be placed in.

Next, in the fixing step of step S110 of FIG. 8, the frame 4 of the wafer unit 2 is fixed to the fixing portion 7 as shown in FIG. 9B.

Next, in the cold air cooling step of step S120 of FIG. 8, as shown in FIG. 9C, cold air 20 is supplied from the nozzle 22 to the internal space 34 (see FIG. 1) of the cooling chamber 16, and the annular portion of the dicing tape 3 is provided. Region 3B is cooled below zero (eg, -20 to -30 ° C). As a result, the annular portion region 3B of the dicing tape 3 is made brittle.

Next, in the expansion start step of step S130 of FIG. 8, as shown in FIG. 9D, the expanding ring moving mechanism 30 causes the expanding ring 14 to move from the retracted position of FIG. 9A toward the expansion position in the direction of arrow B. And start expanding the entire region of the brittle ring region 3B. In the expansion start step, the state in which the cold air 20 is injected from the nozzle 22 may be maintained, and in the cold air cooling step of step S120, when the annular portion region 3B is sufficiently cooled, the cold air from the nozzle 22 is sufficiently cooled. The injection of 20 may be stopped.

Next, in the dividing step of step S140 of FIG. 8, the wafer 1 is divided into individual chips 6 by continuing the ascending movement of the expanding ring 14 as shown in FIG. 10 (A). After that, as shown in FIG. 10B, when the expanding ring 14 reaches the expanded position, the ascending movement of the expanding ring 14 is stopped.

In the dividing step of step S140, the tension of the spring constant of the annular portion region 3B, which has a larger spring constant than at room temperature, is applied to the wafer 1. As a result, even if the chip size is small (1 mm), the tension sufficient to divide the individual chips 6 can be sufficiently applied to the wafer 1 from the annular portion region 3B. Therefore, according to the work dividing device 10, it is possible to solve the undivided problem of the scheduled division line that occurs when the chip size is a small chip (1 mm).

Next, in the extended state holding step of step S150 of FIG. 8, as shown in FIG. 10C, the extended holding ring 18 is raised from the standby position toward the fitting position by the extended holding ring moving mechanism 38 to be fitted. The portion 26 is fitted to the surface 4A of the frame 4 at the fitting position to hold the expanded state of the dicing tape 3.

Next, in the expanding ring withdrawal step of step S160 of FIG. 8, as shown in FIG. 10D, the expanding ring 14 is moved downward toward the evacuation position by the expanding ring moving mechanism 30 and placed at the evacuation position. At this time, the dicing tape 3 is released from the expansion by the expanding ring 14, but since the fitting portion 26 of the expansion holding ring 18 is fitted to the surface 4A of the frame 4, the expanded state is maintained without loosening. To. As a result, it is possible to prevent the chips 6 from coming into contact with each other due to the expanded dicing tape 3 being loosened, so that the quality of the chips 6 can be prevented from deteriorating.

Next, in the fixing release step of step S170 of FIG. 8, the fixing between the frame 4 and the fixing portion 7 of the wafer unit 2 is released.

Next, in the carry-out / carry-in step of step S180 of FIG. 8, the door 46 of the cooling chamber 16 is opened, and the wafer unit 2 is moved from the cooling chamber 16 through the carry-out opening 48 by a transfer device (not shown) to the greenhouse 42. Carry in to. Then, the frame 4 of the wafer unit 2 is placed on the table 50 of the greenhouse 42 by a transfer device (not shown) as shown in the structural drawing of the greenhouse 42 of FIG. After that, the door 46 is closed to seal the greenhouse 42.

Next, in the room temperature setting step of step S190 of FIG. 8, which is a heating step, the control unit 66 drives the halogen lamp power supplies 62 and 64 of FIG. 7 to light all the halogen lamps 54 and 56. That is, the frame 4 is heated by the halogen lamp 54 (first heating step), and the dicing tape 3 is heated by the halogen lamp 56 (second heating step). As a result, the frame 4 is heated by the heat from the halogen lamp 54, and the dicing tape 3 is heated by the heat from the halogen lamp 56.

In the room temperature step of step S190, the temperature of the frame 4 is constantly measured by the radiation thermometer 68 (first temperature measurement step), and similarly, the temperature of the dicing tape 3 is constantly measured by the radiation thermometer 70 (first temperature measurement step). 2 temperature measurement process). These temperature information is output from the radiation thermometers 68 and 70 to the control unit 66. The control unit 66 controls the voltage applied from the halogen lamp power supply 62 to the halogen lamp 54 based on the temperature of the frame 4 measured by the radiation thermometer 68, and measures the temperature by the radiation thermometer 70. Based on the temperature of the dicing tape 3, the frame 4 and the dicing tape 3 are heated toward room temperature while controlling the voltage applied from the halogen lamp power supply 64 to the halogen lamp 56.

Next, an example of the control method of the halogen lamp power supplies 62 and 64 by the control unit 66 will be described.

In the present embodiment, the frame 4 having a large heat capacity is individually heated by the halogen lamp 54, and the dicing tape 3 having a small heat capacity is individually heated by the halogen lamp 56. Further, the temperature of the frame 4 during heating is constantly measured by the radiation thermometer 68, the temperature of the dicing tape 3 during heating is constantly measured by the radiation thermometer 70, and based on these temperature information. The control unit 66 individually controls the halogen lamp power supplies 62 and 64. That is, the frame 4 and the dicing tape 3 having different heat capacities are heated at different heating temperatures.

On the other hand, when the frame 4 and the dicing tape 3 are heated at the same temperature by one heating means, the temperature rise rate of the frame 4 (the temperature rise per unit time) increases the temperature of the dicing tape 3. Since it is smaller than the rate, the dicing tape 3 becomes hotter than normal temperature when the frame 4 is brought to room temperature. In such a case, the dicing tape 3 may soften, and when the dicing tape 3 softens, the tension of the dicing tape decreases, so that the divided chips 6 may come into contact with each other and the quality of the chips 6 may deteriorate. .. Generally, in the case of a PVC dicing tape 3, the temperature tends to soften at 60 ° C. or higher. Therefore, the temperature of the dicing tape 3 when the frame 4 reaches room temperature can be suppressed to at least 60 ° C. Preferably, it is more preferably suppressed to 55 ° C. or lower.

Therefore, the control method of the halogen lamp power supplies 62 and 64 by the control unit 66 of the embodiment is based on the temperature information measured by the radiation thermometers 68 and 70.
(I) The halogen lamp 54, so that the time required for the frame 4 to reach room temperature and the time required for the dicing tape 3 to reach a temperature of not more than 60 ° C. A method of individually controlling the voltage applied to 56.

(Ii) There is a method of individually controlling the voltage applied to the halogen lamps 54 and 56 so that the time until the frame 4 reaches room temperature and the time until the dicing tape 3 reaches room temperature match.

In these control methods, the temperatures of the frame 4 and the dicing tape 3 are individually controlled (control step) so that the temperature difference between the frame 4 and the dicing tape 3 becomes small. A specific control method is a control method in which the above-mentioned "matching time" is first set, and the temperature of the frame 4 and the dicing tape 3 is raised to a target temperature within that time. In this case, in the storage unit built in the control unit 66, the temperature rise per unit time of the frame 4 according to the voltage applied to the halogen lamp 54 and the dicing tape 3 corresponding to the voltage applied to the halogen lamp 56 are stored. It is preferable to store information indicating the rising temperature per unit time. These pieces of information may be actually measured and acquired, or may be acquired by a temperature rise simulation. The control unit 66 individually controls the voltage applied to the halogen lamps 54 and 56 so that the temperature difference between the lame 4 and the dicing tape 3 becomes small based on this information and the “matching time”.

As a method of executing the above control method,
(Iii) A method in which the voltage applied to the halogen lamp 54 is kept constant and the frame 4 and the dicing tape 3 are heated to the above temperature while changing the voltage applied to the halogen lamp 56.

(Iv) A method in which the voltage applied to the halogen lamp 56 is kept constant and the frame 4 and the dicing tape 3 are heated to the above temperature while changing the voltage applied to the halogen lamp 54.

(V) There is a method of heating the frame 4 and the dicing tape 3 to the above temperature while changing the voltages applied to the halogen lamps 54 and 56, respectively. It is preferable that these control methods and methods are appropriately selected based on factors that determine the heat capacity such as the material and size of the frame 4 and the dicing tape 3.

By executing the control method of the halogen lamp power supplies 62 and 64 by the control unit 66, the time required for the frame 4 to reach room temperature, that is, the time required for the room temperature step of step S190 is shortened, and the dicing tape 3 is used. Softening can be reliably prevented.

As an experimental example, when the above-mentioned "matching time" was set to 1 minute and the control methods (i) and (ii) were executed by adopting the methods (iii) to (v), the heating started. After 1 minute, the frame 4 and the dicing tape 3 could be heated to the temperatures of (i) and (ii). Therefore, since the time required for the room temperature step of step S190 can be suppressed to 1 minute, it can be significantly shortened as compared with the 15 minutes required for the conventional room temperature step.

Next, in the extraction step of step S200 of FIG. 8, the upper lid 72 of the greenhouse 42 is opened, and the wafer unit 2 that has been cooled to room temperature is taken out from the greenhouse 42. With the above, the dividing process and the heating process for the wafer unit 2 are completed.

Since the wafer unit 2 carried out from the greenhouse 42 has already been brought to room temperature, no dew condensation occurs on the wafer unit 2. Therefore, the problem of pattern defects and the problem of film formation abnormality caused by the occurrence of dew condensation can be solved.

As described above, according to the work dividing device 10 of the embodiment, the division occurs when the chip size is small by going through the cold air supply step, the expansion start step, and the dividing step of steps S120, S130, and S140 of FIG. The problem of undivided scheduled lines can be solved. Then, by passing through the normal temperature step of step S190, it is possible to solve the problem of a decrease in the work processing capacity caused by the addition of the time-consuming normal temperature step.

In the work dividing device 10 of the above-described embodiment, the divided wafer unit 2 is placed on the table 50 of the greenhouse 42 and heated by the halogen lamps 54 and 56. Other inventions include the following. There is a work dividing device.

For example, in the work dividing device 100 of another invention shown in FIG. 12, a pair of upper and lower rod-shaped halogen lamps 74, 74 are installed in the carry-out opening 48 of the cooling chamber 16, and the work is being carried out from the carry-out opening 48. This is a device that heats the wafer unit 2 with halogen lamps 74 and 74 to bring the frame 4 and the dicing tape 3 to room temperature.

In the above-described embodiment and other inventions, halogen lamps 54, 56, and 74 have been exemplified as the heating means, but the present invention is not limited thereto. For example, as the heating means, a far-infrared lamp, an infrared lamp, a ceramic heater, a carbon heater, a warm air heater, or a contact type heater can be exemplified. According to these heating means, the low temperature frame 4 and the dicing tape 3 can be heated to room temperature.

1 ... Wafer, 2 ... Wafer unit, 3 ... Dicing tape, 3A ... Central region, 3B ... Annular region, 3C ... Fixed region, 4 ... Frame, 5 ... Scheduled division line, 6 ... Chip, 7 ... Fixed region , 8 ... Expanding ring, 10 ... Work dividing device, 14 ... Expanding ring, 16 ... Cooling chamber, 18 ... Expanded holding ring, 20 ... Cold air, 22 ... Nozzle, 24 ... Cold air supply means, 25 ... Piping, 26 ... Fitting Part, 30 ... Expanding ring moving mechanism, 32 ... Main body ring, 34 ... Internal space, 36 ... Dry air supply means, 37 ... Dry air, 38 ... Expanded holding ring moving mechanism, 40 ... Heating part, 42 ... Heating greenhouse, 44 ... Insulated wall, 46 ... door, 48 ... carry-out opening, 50 ... table, 52 ... halogen lamp group, 54 ... halogen lamp, 56 ... halogen lamp, 58 ... reflector, 60 ... reflector, 62 ... halogen lamp power supply, 64 ... Halogen lamp power supply, 66 ... Control unit, 68 ... Radiation thermometer, 70 ... Radiation thermometer, 72 ... Top lid, 74 ... Halogen lamp

Claims (6)

In a work dividing device that divides a work attached to a dicing tape and mounted on a frame into individual chips along a planned division line.
A cooling unit having a cooling chamber surrounding the work and cooling the inside of the cooling chamber,
An expanding ring that is arranged inside the cooling chamber and expands the dicing tape by applying tension to the dicing tape cooled by the cooling unit.
It has a greenhouse connected to the cooling chamber, and the greenhouse is partitioned from the cooling chamber by a partition wall that can be opened and closed, and includes a heating unit that heats the inside of the greenhouse in a dry atmosphere. ,
After said dicing tape is expanded, the dicing tape and warming city together with the frame the workpiece moved into the heating chamber from the cooling chamber within said heating chamber by said expanding ring,
The cooling unit has a cold air supply means for supplying cold air at a temperature at which the dicing tape becomes brittle to the cooling chamber.
The heating unit has a heating means for heating the greenhouse at a temperature equal to or higher than room temperature.
The heating means includes a first heating means that mainly heats the frame and a second heating means that mainly heats the dicing tape.
Work splitting device. An expansion holding ring for holding the expanded state of the dicing tape expanded by the expanding ring is provided.
The heating unit heats the work together with the dicing tape and the frame inside the greenhouse while the expanded state of the dicing tape is held by the expansion holding ring.
The work dividing device according to claim 1. The heating unit has a first temperature measuring means for measuring the temperature of the frame and a second temperature measuring means for measuring the temperature of the dicing tape.
The temperature difference between the frame and the dicing tape is reduced based on the temperature of the frame measured by the first temperature measuring means and the temperature of the dicing tape measured by the second temperature measuring means. A control unit for individually controlling the temperature of the frame and the dicing tape by the first heating means and the second heating means.
The work dividing device according to claim 1 or 2 . In the work division method in which the work attached to the dicing tape and mounted on the frame is divided into individual chips along the planned division line.
A cooling step of cooling the work arranged inside the cooling chamber by cooling the inside of the cooling chamber, and
An expansion step of applying tension to the dicing tape cooled inside the cooling chamber to expand the dicing tape, and
After the dicing tape is expanded by the expansion step, the work is moved to a greenhouse connected to the cooling chamber, and the inside of the greenhouse is heated in a dry atmosphere to heat the work. A heating step of heating together with the dicing tape and the frame inside the greenhouse is provided .
In the cooling step, cold air at a temperature at which the dicing tape becomes brittle is supplied to the cooling chamber.
In the heating step, the heating greenhouse is heated at a temperature equal to or higher than room temperature.
The heating step includes a first heating step that mainly heats the frame and a second heating step that mainly heats the dicing tape.
Work division method. An expanded state holding step is provided between the expanding step and the heating step.
The expanded state holding step holds the expanded state of the dicing tape expanded by the expanding step.
In the heating step, the work is heated together with the dicing tape and the frame inside the greenhouse while the dicing tape is held in the expanded state by the expansion state holding step.
The work dividing method according to claim 4 . The heating step includes a first temperature measuring step of measuring the temperature of the frame and a second temperature measuring step of measuring the temperature of the dicing tape.
The temperature difference between the frame and the dicing tape is reduced based on the temperature of the frame measured in the first temperature measuring step and the temperature of the dicing tape measured in the second temperature measuring step. It has a control step of individually controlling the temperature of the frame and the dicing tape.
The work dividing method according to claim 4 or 5 .

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