KR20150134460A - Heat radiant materials with clad material and lighting devide comprising the heat radiant materials - Google Patents
Heat radiant materials with clad material and lighting devide comprising the heat radiant materials Download PDFInfo
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- KR20150134460A KR20150134460A KR1020140060825A KR20140060825A KR20150134460A KR 20150134460 A KR20150134460 A KR 20150134460A KR 1020140060825 A KR1020140060825 A KR 1020140060825A KR 20140060825 A KR20140060825 A KR 20140060825A KR 20150134460 A KR20150134460 A KR 20150134460A
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- metal
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- shell
- heat
- materials
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- 239000000463 material Substances 0.000 title claims abstract description 50
- 239000002131 composite material Substances 0.000 claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
- 239000011162 core material Substances 0.000 claims description 73
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 25
- 229910000765 intermetallic Inorganic materials 0.000 claims description 20
- 238000001125 extrusion Methods 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 229910052755 nonmetal Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 10
- 238000010030 laminating Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910018565 CuAl Inorganic materials 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 230000002706 hydrostatic effect Effects 0.000 description 4
- 238000000886 hydrostatic extrusion Methods 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
Description
The present invention relates to a heat dissipation member made of a clad material and a lighting device including the heat dissipation material. More particularly, the present invention relates to a lighting device comprising a plurality of unit metal structures made of a core made of a metal and another metal clad on the outer periphery of the core, Which is excellent in thermal conductivity in a vertical direction and low in a thermal expansion coefficient in a horizontal direction, and more particularly to a heat radiation material which can be suitably used for heat radiation of a light emitting diode and a lighting device including the heat radiation material.
A light emitting diode is a light emitting device that emits light by recombination of injected electrons and holes by using a pn junction structure of a semiconductor. The light emitting diode is a light emitting device that is widely used today, that is, an incandescent lamp using a tungsten filament or a vacuum A small amount of mercury and argon gas is enclosed and a fluorescent material is coated on the inner wall of the glass tube. Ultraviolet rays generated by electrons emitted from the emitter collide with mercury are converted into visible light by the fluorescent material. Has a merit that the power consumption is very low and the lifetime is longer than that of a fluorescent lamp.
As a result, despite the relatively high price, the use range of various display elements as well as lighting has been gradually expanded.
In the case of LEDs, various problems such as reduction of light efficiency, shift of color coordinates, and change of heat resistance occur when the temperature of LED is increased.
11, a
However, in the case of a heat dissipation structure made of a metal material, it must be bonded to a material having a very low thermal expansion coefficient like an insulation layer as shown in FIG. 11. Since the metal material has a very large thermal expansion coefficient by its nature, There is a problem that the reliability is deteriorated by being separated from the device due to the thermal stress generated by the difference of the thermal expansion coefficient in the process of repeating the process.
In the case of materials that can sufficiently accommodate thermal stress such as a thermally conductive polymer sheet, it is required to have a high brightness such as for automobile and lighting equipment, and when there is a lot of heat, It is not suitable for a light emitting diode lighting device.
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art and it is an object of the present invention to provide a heat dissipation member having a low coefficient of thermal expansion in the direction of a contact surface in contact with a light emitting diode element and excellent in thermal conductivity in a direction perpendicular to a contact surface This is a problem to be solved.
Another object of the present invention is to provide a lighting device including the heat dissipation member.
According to a first aspect of the present invention for solving the above problems, there is provided a composite material comprising a core made of a metal and made of a metal, a plurality of composite materials comprising a metal and a shell formed on a peripheral surface of the core of the core, And a non-metallic layer formed on an interface between the core and the shell.
According to a second aspect of the present invention, there is provided a composite material comprising a core made of a metal and made of a metal and a metal, and a shell formed on a circumferential surface of the core of the core, And a non-metal layer is formed on the interface between the core and the shell, wherein the non-metal layer is formed in a regular or irregular manner and joined in a circumferential direction.
In the first aspect or the second aspect, the plurality of composites may be made of the same material.
In the first aspect or the second aspect, the plurality of composites may be made of materials different from each other.
In the first or second aspect, the nonmetal layer may be an intermetallic compound layer formed by the reaction of the core metal and the shell metal.
In the first or second aspect, the nonmetal layer may comprise a metal oxide, a metal nitride, a metal oxynitride, a metal carbide, a metal carbonitride, or a metal carbonitride.
In the first aspect or the second aspect, the core metal may be Al, Cu, Au, Ag, or an alloy thereof.
In the first or second aspect, the shell metal may be Cu, Ti, Al or an alloy thereof.
In the first aspect or the second aspect, the thermal conductivity of the heat dissipating member in the longitudinal direction of the core may be 250 W / mK or more.
In the first aspect, the joining between the plurality of composites may be performed by inserting the plurality of composites into a metal pipe.
In the second aspect, the joining between the plurality of composite materials and the plurality of core materials may be performed by inserting the plurality of composite materials and the plurality of core materials into a metal pipe.
In the first aspect or the second aspect, the nonmetal layer may be an intermetallic compound layer formed by reacting the core metal with the shell metal by heat-treating the heat dissipation member.
In the first or second aspect, the tubular metal may be made of the same or different metal as the core metal or the shell metal.
In the first aspect or the second aspect, a plurality of the extruded material obtained by the extrusion may be inserted into a tube made of metal and extruded repeatedly a plurality of times.
A third aspect of the present invention for solving the above-mentioned other problems is to provide a lighting device including the heat dissipating member described in the first aspect or the second aspect.
According to a third aspect of the present invention, the lighting device includes a light emitting diode, and the heat dissipation member may be disposed below the light emitting diode so that the longitudinal direction of the core portion is perpendicular to the longitudinal direction.
Since the heat dissipation member according to the present invention has a structure in which a plurality of composite materials including a core made of metal and made of a metal and a shell formed of a metal and formed on the peripheral surface of the core of the core are bonded in the circumferential direction, The thermal conductivity in the longitudinal direction of the column is excellent.
The heat dissipation member according to the present invention has a shape in which the interface between the core and the shell is arranged in a superposed manner in a direction perpendicular to the longitudinal direction of the core and a nonmetal layer having a thermal expansion coefficient lower than that of the metal is provided between the core and the shell And the thermal expansion of the core and the shell can be restrained, the thermal expansion coefficient can be kept low, and it can be suitably used as a heat radiating material for a light emitting diode.
1 is a perspective view of a heat dissipating member according to a first embodiment of the present invention.
2 is a plan view of the heat dissipating member according to the first embodiment of the present invention and a partially enlarged view thereof.
3 is a plan view and a partially enlarged view of the heat dissipating member according to the second embodiment of the present invention.
4 is a plan view of a heat dissipating member according to a third embodiment of the present invention and a partially enlarged view thereof.
5 is a process chart for manufacturing a heat dissipating member according to the first embodiment of the present invention.
6 is a cross-sectional photograph of a second composite material obtained by laminating a first composite material in a copper tube and extruded, and a third composite material obtained by laminating and extruding the second composite material.
7A and 7B are an optical microscope and a scanning electron microscope (SEM) image of a second composite material obtained by extruding a first composite material (Al / Cu clad material and Al / Ti clad material) in a copper tube, respectively.
8 is a scanning electron microscope (SEM) image of a cross section of a third composite material obtained by laminating and extruding a second composite material in a copper pipe.
9A is a scanning electron micrograph of the Al / Cu interface of the third composite after heat-treating the third composite made of Al / Cu at 400 DEG C for 1 hour, FIG. 9B is a photograph of the third composite made of Al / Lt; 0 > C for 1 hour, followed by scanning electron micrographs of the Al / Cu interface of the third composite.
10A is a graph showing a change in the thickness of the intermetallic compound layer with time when the third composite made of Al / Cu is heat-treated at 400 DEG C, FIG. 10B is a graph showing a change in the thickness of the third composite made of Al / FIG. 5 is a graph showing a change in the intermetallic compound layer thickness with time. FIG.
10 is a graph showing the results of measurement of the amount of intermetallic compound formed on the Al / Cu interface after heat treatment of the third composite material.
11 is a cross-sectional view of a conventional light emitting diode illumination device.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. Also, when a part is referred to as "including " an element, it does not exclude other elements unless specifically stated otherwise.
Fig. 1 is a perspective view of a heat dissipating member according to a first embodiment of the present invention, and Fig. 2 is a plan view and a partially enlarged view of the heat dissipating member according to the first embodiment of the present invention.
1 and 2, the
The shape of the
The
The
The
Most preferably, the
3 is a plan view and a partially enlarged view of the heat dissipating member according to the second embodiment of the present invention.
3, the
In the second embodiment of the present invention, the mixed cladding material of the
4 is a plan view of a heat dissipating member according to a third embodiment of the present invention and a partially enlarged view thereof.
4, the
In the third embodiment, the
Hereinafter, the process of manufacturing the
The heat dissipation member according to the present invention can be formed through multi-stage extrusion and heat treatment of the extruded material, but is not limited thereto.
5 is a process diagram for manufacturing a heat radiating member according to the present invention through a multi-stage extrusion process. As shown in FIG. 5, the present method is carried out through a total of three stages of extrusion and one stage of heat treatment.
The first stage extrusion process is a step of arranging the metal forming the core in a tube made of metal and then making it into a hexagonal pillar-shaped bar shape by using hydrostatic extrusion or groove-rolling. As shown in FIG. 5, the rod-like shape obtained through the extrusion or groove rolling is made of a first
In the second extrusion process, a plurality of the
In the third step, a plurality of the second
In the embodiment of the present invention, the heat radiating member is manufactured in three stages as described above. However, depending on the desired degree of structural refinement of the
The heat treatment is performed so that the metal forming the
Hereinafter, the present invention will be described in more detail with reference to specific examples of the present invention.
First, as the first step, an aluminum rod having a diameter of about 125 mm and a copper tube and a titanium tube having a diameter of about 132 mm and a thickness of about 4.5 mm capable of accommodating the aluminum rod were prepared.
In order to improve the bonding force of the clad material, the surface of the material constituting the core and the shell was subjected to sanding and ultrasonic cleaning. In this case, the sanding is performed to roughen the surface of the material to increase the bonding force of the interface, and the ultrasonic cleaning is to prevent the bonding force of the clad material from deteriorating due to impurities.
Then, extrusion was performed at a extrusion ratio of about 22 using a 2000 ton hydrostatic extruder. FIG. 6 is a photograph of a first composite material having a hexagonal columnar shape with a diameter of about 28 mm, in which copper and titanium are cladded on the outside of the aluminum core through hydrostatic extrusion. In the extruded first composite, the thickness of the copper and titanium was decreased to 896 탆, and the thickness reduction ratio of each was 80%.
Next, as a second step, 19 pieces of the first composite material are prepared in a copper tube having a diameter of about 132 mm and laminated on the copper tube, followed by secondary hydrostatic extrusion to obtain a second composite material having a hexagonal flat section. 6 is a cross-sectional photograph of a second composite material obtained by laminating a first composite material in a copper tube and then extruding the same. As can be seen from the photographs, the second composite material obtained through the two-step extrusion according to the embodiment of the present invention has a composite structure in which a copper tube has a honeycomb structure inside a copper tube and an aluminum core is disposed inside the copper tube .
Meanwhile, in the second step, in order to control the anisotropy of the thermal conductivity and the thermal expansion coefficient of the second composite material, it is possible to apply various kinds of materials of the first composite material or the material of the tube for laminating the first composite material. For example, after 10 and 9 Al / Cu clad materials and Al / Ti clad materials are stacked in a copper tube, hydrostatic extrusion can be performed. At this time, the arrangement of the Al / Cu clad material and the Al / Ti clad material may be varied according to the purpose, or randomly arranged. 7A and 7B are an optical microscope and a scanning electron microscope (SEM) image of a second composite material obtained by extruding a first composite material (Al / Cu clad material and Al / Ti clad material) in a copper tube, respectively. Similarly, in order to control the anisotropy of the thermal conductivity and the thermal expansion coefficient of the second composite material, the second composite material may be obtained by mixing and arranging the first composite material and the shellless core having the same shape as the first composite material.
Finally, in a third step, 19 second composite materials are prepared in a copper tube having a diameter of about 132 mm, laminated in the copper tube, and subjected to hydrostatic pressure extrusion to obtain a third composite material having a hexagonal flat section. 8 is a cross-sectional photograph of a third composite material obtained by laminating a second composite material in a copper tube and extruding the same. As shown in the photograph, the third composite material according to the embodiment of the present invention has a composite structure in which a copper tube has a honeycomb structure in the inside of a copper tube, and an aluminum core is disposed in the honeycomb structure. Through these three repetitive extrusion, the cell size was reduced to 420 탆.
Table 1 below shows the measured values of the thermal conductivity of the third composite material of Al / Cu repeatedly extruded three times.
As shown in Table 1, the composite obtained through three repeated extrusion showed a high thermal conductivity of about 270 W / mK in the vertical direction and a relatively low thermal conductivity of 204 W / mK in the horizontal direction.
Finally, a heat treatment is performed on the third composite material. The heat treatment temperature and time can be controlled to form an intermetallic compound at the interface of the Al / Cu or Al / Ti composite material composing the third composite material, and can be adjusted to a desired fraction of the intermetallic compound.
In the embodiment of the present invention, heat treatment was performed at 400 ° C. and 500 ° C. for 1 hour.
9A is a scanning electron micrograph of the Al / Cu interface of the third composite after heat-treating the third composite made of Al / Cu at 400 DEG C for 1 hour, FIG. 9B is a photograph of the third composite made of Al / Lt; 0 > C for 1 hour, followed by scanning electron micrographs of the Al / Cu interface of the third composite.
In FIGS. 9A and 9B, numeral portions are used to distinguish the generated intermetallic compound layers, and Table 2 below shows the results of analyzing the composition of each numeral portion.
compound
As can be seen from FIGS. 9A and 9B and Table 2, it can be seen that the types of intermetallic compounds produced vary depending on the heat treatment temperature. Such an intermetallic compound has a very low thermal expansion coefficient as compared with copper or aluminum, as is well known.
FIG. 10 shows the result of measurement of the amount of intermetallic compound formed on the Al / Cu interface through the above-described heat treatment, and it can be seen that the amount of the intermetallic compound formed gradually increases with time.
That is, by controlling the heat treatment temperature and the heat treatment time, the kind and amount of the intermetallic compound formed at the interface of the composite material can be controlled, thereby controlling the thermal conductivity and the anisotropy of the thermal expansion coefficient of the final composite material.
100, 200, 300: heat dissipating material
111, 211, 311: core
112, 212, 312: Shell
112a, 212a and 312a:
Claims (16)
And a non-metallic layer is formed on an interface between the core and the shell.
And a structure in which the core in which the shell is not formed is regularly or irregularly arranged and bonded in the circumferential direction,
And a nonmetal layer is formed at an interface between the core and the shell.
Wherein the plurality of composite materials are made of the same material.
Wherein the plurality of composite materials are made of materials different from each other.
Wherein the nonmetal layer is an intermetallic compound layer formed by a reaction between a core metal and a shell metal.
Wherein the nonmetal layer comprises a metal oxide, a metal nitride, a metal oxynitride, a metal carbide, a metal carbonitride, or a metal carbonitride.
Wherein the core metal is Al, Cu, Au, Ag, or an alloy thereof.
Wherein the shell metal is Cu, Ti, Al or an alloy thereof.
Wherein the thermal conductivity of the heat dissipating member in the longitudinal direction of the core is 250 W / mK or more.
Wherein the bonding of the plurality of composites is performed by inserting the plurality of composites into a tube made of metal and extruding the composite material.
Wherein the joining between the plurality of composite materials and the plurality of core materials is performed by putting the plurality of composite materials and the plurality of core materials into a tube made of metal and extruding the same.
Wherein the nonmetal layer is an intermetallic compound layer formed by reacting the core metal with shell metal by heat-treating the heat dissipation member.
Wherein the tubular metal is made of the same or different metal as the core metal or the shell metal.
Wherein a plurality of the extruded materials obtained by the extrusion are inserted into a tube made of metal and extruded repeatedly a plurality of times.
The illumination device includes a light emitting diode,
Wherein the heat dissipating member is disposed below the light emitting diode so that a longitudinal direction of the core portion is perpendicular to the longitudinal direction of the core portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140060825A KR20150134460A (en) | 2014-05-21 | 2014-05-21 | Heat radiant materials with clad material and lighting devide comprising the heat radiant materials |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140060825A KR20150134460A (en) | 2014-05-21 | 2014-05-21 | Heat radiant materials with clad material and lighting devide comprising the heat radiant materials |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019231069A1 (en) * | 2018-05-29 | 2019-12-05 | 케이씨케미칼 주식회사 | Method for processing heat-radiating member having cladding structure |
| KR20200088606A (en) * | 2019-01-15 | 2020-07-23 | 주식회사 더굿시스템 | Heat sink plate |
| KR20200121627A (en) * | 2019-04-16 | 2020-10-26 | 부경대학교 산학협력단 | Method for manufacturing aluminum-based clad heat sink and aluminum-based clad heat sink manufactured thereby |
| KR102296952B1 (en) * | 2020-03-27 | 2021-09-01 | 부경대학교 산학협력단 | Method for manufacturing extruded material of aluminum-carbon nanotube composite with improved corrosion resistance and extruded material of aluminum-carbon nanotube composite manufactured thereby |
-
2014
- 2014-05-21 KR KR1020140060825A patent/KR20150134460A/en active Search and Examination
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019231069A1 (en) * | 2018-05-29 | 2019-12-05 | 케이씨케미칼 주식회사 | Method for processing heat-radiating member having cladding structure |
| KR20200088606A (en) * | 2019-01-15 | 2020-07-23 | 주식회사 더굿시스템 | Heat sink plate |
| WO2020149587A1 (en) * | 2019-01-15 | 2020-07-23 | 주식회사 더굿시스템 | Radiation board |
| KR20200121627A (en) * | 2019-04-16 | 2020-10-26 | 부경대학교 산학협력단 | Method for manufacturing aluminum-based clad heat sink and aluminum-based clad heat sink manufactured thereby |
| KR102296952B1 (en) * | 2020-03-27 | 2021-09-01 | 부경대학교 산학협력단 | Method for manufacturing extruded material of aluminum-carbon nanotube composite with improved corrosion resistance and extruded material of aluminum-carbon nanotube composite manufactured thereby |
| WO2021194007A1 (en) * | 2020-03-27 | 2021-09-30 | 부경대학교 산학협력단 | Method for manufacturing extruded material of heterogeneous aluminum-carbon nanotube composite having improved corrosion resistance, and extruded material of heterogeneous aluminum-carbon nanotube composite manufactured thereby |
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| AMND | Amendment | ||
| E601 | Decision to refuse application | ||
| AMND | Amendment |