CN102095188A - LED (light emitting diode) lamp heat pipe radiator module with composite evaporation pan - Google Patents
LED (light emitting diode) lamp heat pipe radiator module with composite evaporation pan Download PDFInfo
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- CN102095188A CN102095188A CN2010105851702A CN201010585170A CN102095188A CN 102095188 A CN102095188 A CN 102095188A CN 2010105851702 A CN2010105851702 A CN 2010105851702A CN 201010585170 A CN201010585170 A CN 201010585170A CN 102095188 A CN102095188 A CN 102095188A
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- Prior art keywords
- heat
- composite evaporation
- hot channel
- led
- alloy
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an LED (light emitting diode) lamp heat pipe radiator module which is composed of a composite evaporation pan and a heat dissipation pipeline. The interior part of the composite evaporation pan is provided with inner cavity channels which are communicated in a criss-cross manner, and the inner cavity channels are communicated with the external heat dissipation pipeline; the heating surface of the composite evaporation pan is provided with a print circuit, and is glued with an electronic component of constant current supply and an LED chip; in the practical application, a heat pipe radiator of an LED lamp is assembled by n LED lamp heat pipe radiator modules provided by the invention; according to the invention, because the composite evaporation pan is provided with the inner cavity channels which are communicated in a criss-cross manner, the heat exchange area between a working medium and the evaporation pan is increased, and because the heat dissipation area is increased by the construction and design of grooves and screw threads and the like on the inner surface and outer surface of the heat dissipation pipeline, the heat dissipation efficiency is improved greatly; the heating surface of the composite evaporation pan directly receives the heat emitted by the electronic component of the constant current supply and the heat emitted by the LED chip and the substrate and the base plate used normally are not utilized; and the heat resistance between a heat source and the heat pipeline is eliminated, the heat dissipation efficiency of the LED lamp heat pipe heat dissipation module is improved, and the weight and cost of the power supply of the LED lamp and even the whole LED lamp are lowered.
Description
Technical field
The present invention relates to a kind of LED radiator, particularly a kind of LED light fixture heat-pipe radiator module.
Background technology
Because light emitting diode (LED) is compared with lighting sources such as conventional incandescent, fluorescent lamp, high-pressure sodium lamps, has energy-conservation, distinguishing features such as volume is little, colour rendering index height, is considered to the substitute of conventional light source, beginning is used widely in a lot of fields.The life-span of LED is defined as: luminous flux attenuation is to the used time of initial luminous flux 70%.And the speed of luminous flux attenuation is relevant with the temperature of LED knot, the temperature height of LED knot, and the speed of luminous flux attenuation is fast, and it is short that both LED has got the life-span; Conversely, the temperature of LED knot is low, and the life-span of LED is long.As seen improving the heat radiation of LED light fixture, is the important measures that improve the LED lamp life.The LED light fixture in the high-altitude, open-air, abominable relatively particular surroundings work such as be not easy to keep in repair, there is higher requirement in the life-span, convenient for maintaining etc.
The characteristics of heat-pipe radiator are that heat transfer rate is fast, can rapidly the heats that thermal source produced such as electronic devices and components be spread out of rapidly, have avoided heat to gather at thermal source places such as electronic devices and components and influence the reliability of whole electronic system.Because these characteristics of heat-pipe radiator just began to be used as the heat radiation of LED light fixture before several years, but were not also accepted extensively by market so far.Its reason, be complex structure on the surface, to be difficult for manufacturing, price height, cost performance low, profound reason is not resolve the heat radiation of be heated, dispel the heat two key links and the power supply of heat-pipe radiator in design, make the LED light fixture after using heat-pipe radiator, performance and cost increase synchronously, have limited further applying of LED light fixture.The LED light fixture heat-pipe radiator that heat-pipe radiator that present each LED light fixture producer uses and document are introduced has added heat-conducting substrate, pedestal between light source and heat pipe heating surface.These pedestals, substrate have increased the thermal resistance of light source (thermal source) between heat pipe, have reduced heat conduction efficiency between the two and have increased cost.The heat-pipe radiator of LED light fixture is aluminium alloy casting or aluminium alloy extruded moulding mostly in the market, and the heatsink weight of aluminium alloy casting is big, cost is high, self-cleaning property is poor, dust fall influence heat radiation; Use aluminium alloy punching press fin person, blindly pursue area of dissipation, ignored the inhomogeneities of fin temperature, reduced the heat exchange efficiency between radiating fin and the environment, can not give full play to the function of heat-pipe radiator.Power supply also is the main cause that influences the LED lamp life, and same influence needs heat radiation.Mostly LED light fixture producer power supply and heat-pipe radiator separately, power supply voluntarily natural heat dissipation life-span of both having reduced power supply also increased the power supply cost, thereby influenced the life-span and the cost of LED light fixture.
Summary of the invention
For addressing the above problem, the invention provides a kind of LED light fixture heat-pipe radiator module with composite evaporation ware, to reduce the temperature and the light decay speed of LED knot, the life-span of increase LED light fixture also reduces cost.
For achieving the above object, the invention provides a kind of LED light fixture heat-pipe radiator module with composite evaporation ware.It mainly is made of composite evaporation ware and hot channel.
The composite evaporation ware is a plank frame, the inner bore passages that has crisscross connection in the plate, and bore passages is connected with the hot channel of composite evaporation ware outside;
Composite evaporation ware even curface is a heating surface, and printed circuit is arranged on heating surface, and the electronic devices and components, the led chip that are fitted with constant-current supply.
In bore passages and hot channel, be vacuum state, and be marked with working medium.
Composite evaporation ware of the present invention is owing to there is the bore passages of crisscross connection, increased the heat exchange area between working medium and the evaporating dish, and, then improved radiating efficiency greatly because the design of structures such as the groove of hot channel surfaces externally and internally and screw thread has increased area of dissipation.The heating surface of composite evaporation ware is directly accepted the electronic devices and components of constant-current supply and the heat that led chip sends, and without substrate or pedestal commonly used.Eliminate the thermal resistance between thermal source and the heat pipe like this, improved the radiating efficiency of LED light fixture heat pipe heat radiation module, alleviated the weight and the cost of LED lamp power and even whole LED light fixture.
Description of drawings
Fig. 1 looks schematic diagram for the master of the 1st kind of embodiment of the present invention.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is the A portion enlarged drawing among Fig. 1.
Fig. 4 is the upward view of Fig. 1.
Fig. 5 is the A-A generalized section of Fig. 4.
Fig. 6 is the structural representation of another form of the A-A section of Fig. 4.
Fig. 7 looks schematic diagram for the master of second kind of embodiment of the present invention.
Fig. 8 is the left view of Fig. 7.
Fig. 9 looks schematic diagram for the master of the third embodiment of the present invention.
Figure 10 is the left view of Fig. 9.
Figure 11 looks schematic diagram for the master of the 4th kind of embodiment of the present invention.
Figure 12 is the left view of Figure 11.
Figure 13 looks schematic diagram for the master of the 5th kind of embodiment of the present invention.
Figure 14 is the left view of Figure 13.
Among the figure: 1 composite evaporation ware, 11 lower metals, 12 upper strata metals, 13 bore passages, the electronic devices and components of 14 printed circuits, 15 constant-current supplies, 16LED chip, 17 heating surfaces, 18 shapes, 2 hot channels, 3 tube connectors, 4 topping up pipes, 5 radiating fins.
The specific embodiment
Referring to Fig. 1-Figure 14, the present invention is a kind of LED light fixture heat-pipe radiator module with composite evaporation ware, and it is made of composite evaporation ware 1, hot channel 2, tube connector 3 and topping up pipe 4.Composite evaporation ware 1 is a plank frame, the inner bore passages 13 (referring to Fig. 4) that has crisscross connection in the plate, and bore passages 13 is connected by the hot channel 2 of tube connector 3 with composite evaporation ware 1 outside.The topping up pipe 4 that communicates with bore passages 13 is housed on composite evaporation ware 1, in bore passages 13 and the hot channel 2 for the state of vacuumizing and be marked with working medium.
The composite evaporation ware has two kinds of forms of the composition:
First kind: by two kinds of metals, promptly upper strata metal 11, lower metal 12 are made through operations such as pressurizeing, propel the price of.
The material of upper and lower layer metal 11,12 each by aluminium, aluminium alloy, perhaps copper, copper alloy, perhaps each metal and alloy thereof by other good heat conductivity constitute.
The bore passages 13 that propels the price of has constituted and has been clipped in the intrametallic inner chamber (seeing the structure of Fig. 5) that connects in length and breadth mutually of upper and lower layer.
Second kind: integral body is made (structure of seeing Fig. 6) by the metal of aluminium and alloy, copper and alloy thereof or other good heat conductivity and the section bar 18 of alloy thereof.
Referring to Fig. 4, composite evaporation ware 1 even curface is a heating surface 17, the electronic devices and components 15 and the led chip 16 that printed circuit 14 are arranged on heating surface 17 and be fitted with constant-current supply.Heating surface 17 is directly accepted the electronic devices and components 15 of constant-current supply and the heat that the LED16 chip sends, and without substrate or pedestal commonly used.
What Fig. 3 showed is the connected mode of bore passages 13, hot channel 2 and tube connector 3, can be that pressing connection, soldering, electric resistance welding, argon arc welding, stored energy welding or binding agent are bonding between them.
The material of hot channel 2, tube connector 3 can be aluminium, copper or steel (group's enlightening pipe), or the alloy of above-mentioned material, even be the other materials of good heat conductivity.
The structure of hot channel 2 can be designed to multiple pattern according to the area of heat radiation, the shape of LED light fixture etc., its structure can be coiled pipe (as shown in Figure 1 and Figure 2), horizontal single tube (as Fig. 7, shown in Figure 8), vertical tube (as Figure 11, shown in Figure 12), various ways can also be arranged, alternately arrange as two-tube and multitube, tipping tube or the like is not enumerated one by one at this.In actual applications, be not limited to several shapes shown in the figure of the present invention.Hot channel 2 can curve different shape according to shape, the size of LED light fixture.
For improving radiating efficiency, can suit radiating fin 5 on the hot channel 2.The surface of radiating fin 5 is plane or curved surface, and the cross section of curved surface can be circular arc, triangle, trapezoidal or rectangle.The above-mentioned shape that radiating fin 5 has has improved the heat exchange efficiency of radiating fin than the traditional heat-dissipating fin.The material of radiating fin 5 is: aluminium, copper or their alloy, the perhaps metal of other good heat conductivity.
The surface of fin 5, hot channel 2, tube connector 3 can apply one deck far ultrared paint or anodic oxygen changes into black, has improved the intensity of heat exchange between hot channel 2 and the environment, and radiating efficiency is further improved.
After composite evaporation ware 1, hot channel 2, tube connector 3, topping up pipe 4 were tightly connected each other, after topping up pipe 4 vacuumized, annotates working medium and sealing, the present invention completed.
During practical application, become the heat-pipe radiator of LED light fixture by n LED light fixture heat-pipe radiator module group of the present invention.After connecting power supply, constant-current power supply circuit components and parts 15 convert alternating current to direct current, for led chip 16 work.Working medium in the heat heating composite evaporation ware 1 that led chip 16 and constant-current supply components and parts 15 are produced in the bore passages 13, the working substance steam of carrying heat and having certain speed is seethed with excitement, is evaporated in the working medium heat absorption, working substance steam enters hot channel 2 through tube connector 3, working substance steam is carried out heat exchange by tube wall and environment in hot channel 2, the working substance steam that loses heat is condensed into worker quality liquid and relies on gravity to get back in the bore passages 13 of composite evaporation ware 1, continues to participate in the circulation of heat absorption evaporation heat release condensation.The moving in circles of evaporation, heat release condensation of so absorbing heat realized the high efficiency and heat radiation to the electronic devices and components of led chip 16 and constant-current supply.
Two kinds of versions of composite evaporation ware 1 of the present invention are all light than traditional aluminium alloy compression casting product weight, thermal resistance is little, cost is low.
LED lamp heat pipe radiator module with composite evaporation pan of the present invention, but have that processing volume production simple in structure, in light weight, easy, thermal resistance are low, a rapid heat dissipation, characteristics that cost is low, can effectively reduce the temperature of LED knot and prolong life-span of LED lamp.
Claims (10)
1. LED light fixture heat-pipe radiator module with composite evaporation ware, it mainly is made of composite evaporation ware and hot channel.
2. module according to claim 1 is characterized in that: described composite evaporation ware is a plank frame, the inner bore passages that has crisscross connection in the plate, and bore passages is connected with the hot channel of composite evaporation ware outside;
Composite evaporation ware even curface is a heating surface, and printed circuit is arranged on heating surface, and the electronic devices and components, the led chip that are fitted with constant-current supply;
In bore passages and hot channel, be vacuum state, and be marked with working medium.
3. bore passages according to claim 2 is characterized in that: bore passages is connected by the hot channel of tube connector with composite evaporation ware outside.
4. according to claim 2,3 described modules, it is characterized in that: the topping up pipe that communicates with bore passages is housed on the composite evaporation ware.
5. according to claim 1,2 described modules, it is characterized in that: the composite evaporation ware has two kinds of forms of the composition:
First kind: by two kinds of metals, promptly upper strata metal, lower metal are made through operations such as pressurizeing, propel the price of; The material of upper and lower layer metal each by aluminium, aluminium alloy, perhaps copper, copper alloy, perhaps each metal and alloy thereof by other good heat conductivity constitute; The bore passages that propels the price of has constituted and has been clipped in the intrametallic inner chamber that connects in length and breadth mutually of upper and lower layer;
Second kind: integral body is made by the metal of aluminium and alloy, copper and alloy thereof or other good heat conductivity and the section bar of alloy thereof.
6. according to claim 2,3 described modules, it is characterized in that: the connected mode of bore passages, hot channel and tube connector can be that pressing connection, soldering, electric resistance welding, argon arc welding, stored energy welding or binding agent are bonding between them.
7. according to claim 2,3 described modules, it is characterized in that: the material of hot channel, tube connector can be aluminium, copper or steel (group's enlightening pipe), or the alloy of above-mentioned material, even be the other materials of good heat conductivity.
8. according to claim 2,3 described modules, it is characterized in that: hot channel and tube connector are pipe or the special pipes that surfaces externally and internally has axial groove or screw thread, or common smooth pipe.
9. module according to claim 8 is characterized in that: suit radiating fin on the hot channel, the surface of radiating fin are plane or curved surface, and the cross section of curved surface can be circular arc, triangle, trapezoidal or rectangle; The material of radiating fin is: aluminium, copper or their alloy, the perhaps metal of other good heat conductivity;
The surface of radiating fin, hot channel, tube connector can apply one deck far ultrared paint or anodic oxygen changes into black.
10. according to claim 1,2 described modules, it is characterized in that: the structure of hot channel can be designed to multiple pattern according to the area of heat radiation, the shape of LED light fixture etc., its structure can be coiled pipe, horizontal single tube, vertical tube, two-tube and alternately arrangement of multitube, tipping tube or the like.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105851702A CN102095188A (en) | 2010-12-14 | 2010-12-14 | LED (light emitting diode) lamp heat pipe radiator module with composite evaporation pan |
| PCT/CN2011/070152 WO2012079291A1 (en) | 2010-12-14 | 2011-01-10 | Heat pipe radiator module of led lamp with compound evaporation pan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105851702A CN102095188A (en) | 2010-12-14 | 2010-12-14 | LED (light emitting diode) lamp heat pipe radiator module with composite evaporation pan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102095188A true CN102095188A (en) | 2011-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105851702A Pending CN102095188A (en) | 2010-12-14 | 2010-12-14 | LED (light emitting diode) lamp heat pipe radiator module with composite evaporation pan |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102095188A (en) |
| WO (1) | WO2012079291A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103488266A (en) * | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
| CN106705002A (en) * | 2016-06-01 | 2017-05-24 | 刘真 | Gravity heat pipe radiator used for ultra-large-power LED projection lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2893560Y (en) * | 2006-05-08 | 2007-04-25 | 齐媛 | Evaporator of heat tube radiator for thermoelectric refrigerator |
| CN200979315Y (en) * | 2006-12-11 | 2007-11-21 | 齐媛 | Fin-tube type heat pipe heat radiator for temperature difference electric refrigerator |
| CN101886801A (en) * | 2010-07-20 | 2010-11-17 | 上海交通大学 | Combined planar heat pipe radiator used for cooling light emitting diode (LED) |
| CN201964366U (en) * | 2010-12-14 | 2011-09-07 | 沈阳立晶光电有限公司 | LED lamp heat pipe radiator module with composite evaporation pan |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100565002C (en) * | 2006-11-29 | 2009-12-02 | 郑日春 | A kind of lamp |
| CN101576206B (en) * | 2009-05-05 | 2011-10-05 | 浙江名芯半导体科技有限公司 | High-power LED lamp based on heat pipe for thermal conductivity |
| CN101608788A (en) * | 2009-07-21 | 2009-12-23 | 史杰 | The LED lamp adopts the heat radiation device for loop heat pipe of enhanced evaporation section |
| CN101769462A (en) * | 2010-01-08 | 2010-07-07 | 莱芜市玉成光电科技有限公司 | LED lamp |
| CN201636608U (en) * | 2010-02-11 | 2010-11-17 | 郑日春 | High-power integrated LED lamp |
| CN101852416B (en) * | 2010-06-10 | 2013-09-25 | 上海合亚经贸有限公司 | Heat dissipation method and device of high-power LED (Light-Emitting Diode)lamp |
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2010
- 2010-12-14 CN CN2010105851702A patent/CN102095188A/en active Pending
-
2011
- 2011-01-10 WO PCT/CN2011/070152 patent/WO2012079291A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2893560Y (en) * | 2006-05-08 | 2007-04-25 | 齐媛 | Evaporator of heat tube radiator for thermoelectric refrigerator |
| CN200979315Y (en) * | 2006-12-11 | 2007-11-21 | 齐媛 | Fin-tube type heat pipe heat radiator for temperature difference electric refrigerator |
| CN101886801A (en) * | 2010-07-20 | 2010-11-17 | 上海交通大学 | Combined planar heat pipe radiator used for cooling light emitting diode (LED) |
| CN201964366U (en) * | 2010-12-14 | 2011-09-07 | 沈阳立晶光电有限公司 | LED lamp heat pipe radiator module with composite evaporation pan |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103488266A (en) * | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
| CN106705002A (en) * | 2016-06-01 | 2017-05-24 | 刘真 | Gravity heat pipe radiator used for ultra-large-power LED projection lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012079291A1 (en) | 2012-06-21 |
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Application publication date: 20110615 |