KR20150125589A - Method of removing the resin layer - Google Patents

Abstract

The present invention relates to a method for removing a resin layer which removes the resin layer disposed on a glass substrate, and to a method for removing a resin layer which has a process for removing the resin layer by contacting an alkaline aqueous solution which has alkali concentration of 15 mass% or more and contains a compound represented by equation (1) of 3 mass% or more with a resin layer.

Description

METHOD OF REMOVING THE RESIN LAYER [0002]

The present invention relates to a resin layer removal method for removing a resin layer from a composite formed by adhering a resin layer on a glass substrate.

2. Description of the Related Art In recent years, thinner and lighter electronic devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCD), and organic EL panels (OLED) As one of methods for reducing the thickness and weight of the electronic device, the thinning of the glass substrate used in electronic devices is progressing.

However, if the strength of the glass substrate is insufficient due to the thinning, the handling property of the glass substrate in the manufacturing process of the device is deteriorated.

In order to solve such a problem, recently, a laminated glass laminate in which a thin plate glass substrate and a composite as a reinforcing plate are laminated is manufactured, and electronic device parts such as a display device are formed on a thin plate glass substrate of the glass laminate, A method of separating a glass substrate and a composite has been proposed (see Patent Document 1).

The composite has a glass substrate to be a support substrate and a resin layer (for example, a silicone resin layer) formed on the support substrate. A thin plate glass substrate on which a component for an electronic device is formed is laminated and bonded to a resin layer of the composite in a peelable manner.

The composite obtained by peeling the thin plate glass substrate from the glass laminate can again be laminated and adhered to reuse the new thin plate glass substrate.

Here, the composite gradually deteriorates in accordance with the number of times of reuse due to heating or liquid processing, peeling / adhesion to a thin plate glass substrate, or the like accompanying the manufacture of electronic device parts. When the resin layer deteriorates, necessary adhesion with the thin plate glass substrate is not obtained, and the deteriorated resin adheres to the thin plate glass substrate.

When the resin layer of the composite deteriorates, it is necessary to separate the resin layer from the support substrate to form the resin layer again.

It is also conceivable that the resin layer is peeled from the support substrate and used as a separate glass plate product other than the composite regardless of the progress of deterioration of the resin layer.

As a method for peeling the resin layer from the support substrate, there is a method described in Patent Document 2.

In this method, first, the resin layer is subjected to a heat treatment step in which the resin layer is exposed to atmospheric air at 300 to 450 占 폚, an inert atmosphere at 350 to 600 占 폚, or water vapor at 150 to 350 占 폚. Subsequently, a cleaning step for removing the resin layer by polishing with a chemical liquid or an abrasive is performed on the resin layer after the heat treatment.

International Publication No. 2007/018028 International Publication No. 2011/111611

According to the resin layer removing method described in Patent Document 2, after the resin layer is decomposed by the heat treatment step, the resin layer is removed. Therefore, it is possible to use a method of washing with a brush while dissolving or swelling the resin layer using a chemical liquid, or a method of cleaning the resin layer with a brush while cutting the resin layer using a dispersion in which the polishing slurry is dispersed, The resin layer can be removed from the substrate.

On the other hand, in this method, a heat treatment process in an atmosphere of 300 to 450 ° C in an inert atmosphere of 350 to 600 ° C, or steam of 150 to 350 ° C is required.

As a result, the removal of the resin layer becomes more labor intensive, the equipment becomes large in scale for heat treatment, the productivity is poor, and the cost is increased.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art as described above, and it is an object of the present invention to provide a method for removing a resin layer from a glass substrate without performing heat treatment at a high temperature when removing a resin layer from a composite comprising a resin layer formed on a glass substrate The present invention provides a method of removing a resin layer which can simplify processing without requiring large-scale change of facilities, thereby improving productivity and reducing processing cost in reusing glass substrates.

Means for Solving the Problems The present inventors have conducted intensive studies to solve the above problems and have completed the present invention.

That is, a first aspect of the present invention is a method for removing a resin layer disposed on a glass substrate, the method comprising: a step of removing a resin layer having an alkali concentration of 15 mass% or more and a compound represented by the following formula (1) % Or more of the alkali aqueous solution and the resin layer to remove the resin layer.

In the first aspect, it is preferable that the resin layer is a silicone resin layer.

In the first aspect, it is preferable that L in the formula (1) is a trimethylene group, a propylene group or an ethylene group, and n is an integer of 1 to 3.

In the first aspect, it is preferable that the compound represented by the formula (1) is propylene glycol monoethyl ether or dipropylene glycol monomethyl ether.

In the first aspect, it is preferable that the alkali concentration is 18 mass% or more.

In the first aspect, it is preferable that the thickness of the resin layer is 0.1 to 100 mu m.

In the first aspect, it is preferable that the alkali aqueous solution contains at least one selected from the group consisting of sodium hydroxide, potassium hydroxide and lithium hydroxide.

In the first aspect, it is preferable that the temperature of the alkali aqueous solution is 5 to 50 캜.

In the first aspect, it is preferable that the contact time of the alkali aqueous solution and the resin layer is 0.1 to 24 hours.

In the first aspect, the glass substrate, the resin layer, the thin plate glass substrate, and the glass substrate obtained by separating the interface between the resin layer and the thin plate glass substrate from the laminate having the components for the electronic device in this order, And the resin layer in the composite having the resin layer.

A second aspect of the present invention is a method for manufacturing a glass substrate, wherein a glass substrate is manufactured by a method of removing the resin layer of the first embodiment.

According to the present invention, it is possible to remove a resin layer from a glass substrate without performing a heat treatment at a high temperature in a composite comprising a glass substrate as a support substrate and a resin layer formed thereon.

Therefore, according to the present invention, it is possible to simplify the processing without a large-scale change of the facility, and to improve the productivity and the processing cost in reusing the support substrate of the composite.

Hereinafter, a method for removing the resin layer (a method for manufacturing a glass substrate) of the present invention will be described in detail.

In the present invention, unlike Patent Document 2, a method of easily removing a resin layer without conducting a preheating treatment has been found by contacting an alkali aqueous solution containing a predetermined component with a resin layer.

Examples of the object to be cleaned include a composite comprising a glass substrate and a resin layer disposed on the glass substrate. As described above, in the composite, a thin plate glass substrate is peelably laminated on the resin layer to form a glass laminate. This glass laminate is used for the production of electronic devices (electronic devices) such as liquid crystal panels and organic EL panels, display devices such as solar cells, and the like. On the surface of the thin plate glass substrate, . After the components for the electronic device are formed, the composite body and the thin plate glass substrate and the electronic component are laminated from the laminate including the glass substrate, the resin layer, the thin plate glass substrate, and the electronic device component by peeling the interface between the resin layer and the thin plate glass substrate. And is separated into electronic devices including parts for devices. As described above, it is preferable that the resin layer in the separated composite is to be cleaned. Further, the thin plate glass substrate is intended to be a plate thinner than the glass substrate included in the composite.

Further, the thin plate glass substrate used in this glass laminate is a general one used in the production of an electronic device, as a glass substrate on which electronic device parts such as thin film transistors are formed.

Hereinafter, each member (glass substrate, resin layer) in the composite to be cleaned will be described in detail, and then the procedure of the present manufacturing method will be described in detail.

<Glass substrate>

The glass substrate is a member for supporting a resin layer to be described later. The composition of the glass substrate is not particularly limited. For example, glass having various compositions such as glass containing alkali metal oxide (soda lime glass or the like) and alkali-free glass can be used. Among them, alkali-free glass is preferred because heat shrinkage is small. It is preferable to clean the surface in advance in order to remove dirt, foreign matter, and the like before it is brought into close contact with the resin layer.

The thickness of the glass substrate is not particularly limited, but it is preferable that the thickness of the glass laminate is such that the glass laminate can be processed in a production line of an existing electronic device panel. For example, the thickness of the glass substrate currently used in the manufacture of LCDs is usually in the range of 0.4 to 1.2 mm, especially 0.7 mm.

Among them, the thickness of the glass substrate is preferably 0.08 mm or more for ease of handling and difficulty in breaking. The thickness of the glass substrate is preferably not more than 1.2 mm from the reason that it is desired that the rigidity of the glass substrate is not broken but appropriately bent when it is peeled off after the component for electronic device is formed.

The surface of the glass substrate may be a polished surface subjected to mechanical polishing or chemical polishing, or a non-etched surface (raw surface) without polishing. It is preferable that it is a non-etching surface (raw surface) in terms of productivity and cost.

The glass substrate has a first major surface and a second major surface, and its shape is not limited, but is preferably rectangular. Here, the rectangle is substantially a substantially rectangular shape, and includes a shape in which the corner of the peripheral portion is cut (corner cut). The size of the glass substrate is not limited, but may be, for example, 100 to 2000 mm x 100 to 2000 mm in the case of a rectangle, and 500 to 1000 mm x 500 to 1000 mm.

<Resin Layer>

The resin layer is a layer disposed (fixed) on the glass substrate. When the glass laminate is manufactured, a thin plate glass substrate is disposed on the surface of the glass laminate.

The resin layer is preferably bonded to the surface of the glass substrate with a strong bonding force such as an adhesive force or an adhesive force. For example, as will be described later, by crosslinking and curing the crosslinkable organopolysiloxane on the surface of the glass substrate, a silicone resin, which is a crosslinked product, is adhered to the surface of the glass substrate and a high bonding force can be obtained. It is also possible to increase the bonding force between the surface of the glass substrate and the resin layer by performing a treatment (for example, a treatment using a coupling agent) that generates a strong bonding force between the surface of the glass substrate and the resin layer.

The thickness of the resin layer is not particularly limited, but is preferably 0.1 to 100 占 퐉, more preferably 0.5 to 50 占 퐉, and further preferably 1 to 20 占 퐉. When the thickness of the resin layer is within this range, it is possible to suppress the occurrence of distortion defects in the thin plate glass substrate disposed on the resin layer, even when bubbles or foreign matter are interposed between the resin layer and the glass substrate. In addition, if the thickness of the resin layer is too thick, it takes time and material to form it, which is not economical and the heat resistance may be lowered.

The kind of the resin constituting the resin layer is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin and a silicone resin. Among them, a silicone resin is preferable from the viewpoints of heat resistance and releasability. That is, it is preferable that the resin layer is a silicone resin layer (a layer containing a silicone resin).

The silicone resin contained in the silicone resin layer is preferably a crosslinked product of a crosslinkable organopolysiloxane (curable silicone), and the silicone resin preferably forms a three-dimensional mesh structure.

The kind of the crosslinkable organopolysiloxane is not particularly limited and the structure is not particularly limited as long as it becomes a crosslinked product (cured product) constituting the silicone resin by crosslinking and curing through a predetermined crosslinking reaction. If the crosslinked organopolysiloxane has a predetermined crosslinking property do. The type of crosslinking is not particularly limited, and a well-known type may be adopted depending on the type of crosslinkable group contained in the crosslinkable organopolysiloxane. For example, a hydrosilylation reaction, a condensation reaction or a heat treatment, a high energy ray treatment, or a radical reaction with a radical polymerization initiator can be given.

More specifically, when the crosslinkable organopolysiloxane has a radical reactive group such as an alkenyl group or an alkynyl group, the crosslinked organopolysiloxane is crosslinked by a reaction between radical reactive groups through the radical reaction to form a cured product (crosslinked silicone resin).

When the crosslinkable organopolysiloxane has a silanol group, it is crosslinked by a condensation reaction between silanol groups to form a cured product.

In addition, when the crosslinkable organopolysiloxane is an organopolysiloxane having an alkenyl group (vinyl group or the like) bonded to a silicon atom (that is, an organoalkenyl polysiloxane) and a hydrogen atom (hydrosilyl group) bonded to a silicon atom When it contains a polysiloxane (i.e., an organohydrogenpolysiloxane), it is crosslinked by a hydrosilylation reaction in the presence of a hydrosilylation catalyst (for example, a platinum-based catalyst) to form a cured product.

Of these, organopolysiloxanes having an alkenyl group at both terminals and / or side chains (hereinafter appropriately referred to as organopolysiloxane A, also referred to as &quot; organopolysiloxane A &quot; ) And an organopolysiloxane having a hydrosilyl group at both ends and / or side chains (hereinafter appropriately referred to as organopolysiloxane B).

Examples of the alkenyl group include, but are not limited to, a vinyl group (an ethenyl group), an allyl group (a 2-propenyl group), a butenyl group, a pentenyl group and a hexynyl group. Among them, A vinyl group is preferable.

Examples of the group other than the alkenyl group contained in the organopolysiloxane A and the group other than the hydrosilyl group contained in the organopolysiloxane B include an alkyl group (particularly an alkyl group having 4 or less carbon atoms).

Although the position of the alkenyl group in the organopolysiloxane A is not particularly limited, when the organopolysiloxane A is linear, the alkenyl group may be present in any of the M units and D units shown below, and the M unit and D May be present on both sides of the unit. It is preferable that at least M units are present in view of the curing rate and it is preferable that they are present on both sides of two M units.

The M unit and D unit are examples of basic constituent units of an organopolysiloxane, and the M unit is a monofunctional siloxane unit in which three organic groups are bonded, and a D unit is a bifunctional siloxane unit in which two organic groups are bonded. In the siloxane unit, since the siloxane bond is a bond in which two silicon atoms are bonded through one oxygen atom, the oxygen atom per one silicon atom in the siloxane bond is regarded as _{1/2, and} is expressed as O _{1/2 in} the formula.

The number of alkenyl groups in the organopolysiloxane A is not particularly limited, but is preferably 1 to 3, and more preferably 2 in one molecule.

Although the position of the hydrosilyl group in the organopolysiloxane B is not particularly limited, when the organopolysiloxane A is linear, the hydrosilyl group may be present in either the M unit or the D unit, or the M unit and the D unit It may exist on both sides. It is preferable to exist at least in the D unit from the viewpoint of the curing rate.

The number of hydrosilyl groups in the organopolysiloxane B is not particularly limited, but is preferably at least 2 in one molecule, and more preferably 3.

Although the mixing ratio of the organopolysiloxane A and the organopolysiloxane B is not particularly limited, the molar ratio (hydrogen atom / alkenyl group) of the hydrogen atoms bonded to the silicon atom in the organopolysiloxane B and the total alkenyl groups in the organopolysiloxane A is 0.7 To 1.05. Among them, it is preferable to adjust the mixing ratio to be 0.8 to 1.0.

As the hydrosilylation catalyst, it is preferable to use a platinum group metal catalyst. Examples of the platinum group metal catalyst include platinum, palladium, and rhodium catalysts. Particularly, it is preferable to use the catalyst as a platinum catalyst in terms of economy and reactivity. As the platinum group metal catalyst, those known can be used. Specific examples thereof include platinum compounds such as platinum powder, platinum black, chloroplatinic acid, chloroplatinic acid and the like, chloroplatinic acid, platinum tetrachloride, alcohol compounds of chloroplatinic acid, aldehyde compounds or platinum olefin complexes, alkenylsiloxane complexes, And the like.

The hydrosilylation catalyst is used in an amount of preferably from 0.1 to 20 parts by mass, more preferably from 1 to 10 parts by mass per 100 parts by mass of the total mass of the organopolysiloxane A and the organopolysiloxane B.

The number average molecular weight of the crosslinkable organopolysiloxane is not particularly limited, but it is excellent in handling property as well as excellent in film forming property and is more resistant to decomposition of the silicone resin under high-temperature treatment conditions. In view of GPC (Gel Permeation Chromatography) Weight average molecular weight in terms of polystyrene is preferably 1,000 to 5,000,000, more preferably 2,000 to 3,000,000.

The viscosity of the crosslinkable organopolysiloxane is preferably 10 to 5000 mPa · s, more preferably 15 to 3000 mPa · s. The measurement temperature of the viscosity is 25 占 폚.

Examples of commercially available trade name or product number of the crosslinkable organopolysiloxane include KNS-320A, KS-847 (all manufactured by Shin-Etsu Silicone Co., Ltd.), TPR6700 (Momentive Performance Co., Ltd.) as a crosslinkable organopolysiloxane having no aromatic group , A combination of vinyl silicone 8500 (manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane 12031 (manufactured by Arakawa Chemical Industries, Ltd.), vinyl silicone 11364 (manufactured by Arakawa Chemical Industries, Ltd.) 11365 &quot; manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane &quot; 12031 &quot; (available from Arakawa Chemical Industries, Ltd.) Manufactured by Kao Chemical Industry Co., Ltd.).

The method of forming the resin layer is not particularly limited, and a known method is employed.

For example, in the case of forming a silicone resin layer, a layer containing a crosslinkable organopolysiloxane is formed on the surface of a glass substrate, and a crosslinkable organopolysiloxane is crosslinked on the glass substrate surface to form a silicone resin layer.

In order to form a layer containing a crosslinkable organopolysiloxane on a glass substrate, a resin composition obtained by dissolving a crosslinkable organopolysiloxane in a solvent is used, the composition is applied on a glass substrate to form a layer of a solution, Subsequently, the solvent is preferably removed to obtain a layer containing a crosslinkable organopolysiloxane. The thickness of the layer containing the crosslinkable organopolysiloxane can be controlled by adjusting the concentration of the crosslinkable organopolysiloxane in the composition.

The solvent is not particularly limited as long as it is a solvent capable of easily dissolving the crosslinkable organopolysiloxane in a working environment and capable of easily removing volatilization. Specific examples thereof include butyl acetate, heptane, 2-heptanone, 1-methoxy-2-propanol acetate, toluene, xylene, THF, chloroform and the like.

The method of applying the composition containing the crosslinkable organopolysiloxane on the surface of the glass substrate is not particularly limited and a known method can be used. Examples of the coating method include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method and a gravure coating method.

Thereafter, a drying treatment for removing the solvent may be carried out if necessary. The method of the drying treatment is not particularly limited, and examples thereof include a method of removing the solvent under a reduced pressure condition, a method of heating the crosslinkable organopolysiloxane to a temperature at which the curing of the crosslinkable organopolysiloxane does not proceed, and the like.

Subsequently, the crosslinkable organopolysiloxane on the glass substrate is crosslinked to form a silicone resin layer. As the curing (crosslinking) method, an optimum method is appropriately selected in accordance with the crosslinking type of the crosslinkable organopolysiloxane as described above, and examples thereof include a heat treatment and an exposure treatment. In particular, when the crosslinkable organopolysiloxane is crosslinked by a hydrosilylation reaction, a condensation reaction or a radical reaction, it is preferable to produce a silicone resin layer by thermal curing.

Hereinafter, the form of thermosetting will be described in detail.

The temperature condition for thermally curing the crosslinkable organopolysiloxane is preferably 150 to 300 占 폚, more preferably 180 to 250 占 폚 to improve the heat resistance of the silicone resin layer. The heating time is preferably 10 to 120 minutes, more preferably 30 to 60 minutes.

Further, the crosslinkable organopolysiloxane may be cured by pre-curing (pre-curing) followed by post-curing (final curing). Precure is applied to obtain a silicone resin layer having superior heat resistance. The precure is preferably carried out subsequent to the removal of the solvent. In this case, the step of removing the solvent from the layer to form the layer containing the crosslinkable organopolysiloxane and the step of performing the pre-cure are not particularly distinguished.

<Removal Process>

The method for removing a resin layer according to the present invention comprises the steps of contacting an alkali aqueous solution having an alkali concentration of 15 mass% or more and containing 3 mass% or more of a compound represented by the following formula (1) . By carrying out this step, the resin layer can be easily removed without heating.

Hereinafter, the alkali aqueous solution used in this step will be described in detail.

(Aqueous alkali solution)

The alkali concentration of the alkali aqueous solution is preferably not less than 15% by mass, more preferably not less than 18% by mass, more preferably not less than 20% by mass, and more preferably not less than 20% by mass in terms of excellent removability of the resin layer (hereinafter simply referred to as &quot; Or more. The upper limit is not particularly limited, but is preferably 40% by mass or less in that the effect is saturated.

When the alkali concentration is less than 15 mass%, the removability of the resin layer is deteriorated.

Further, the alkali concentration is intended to be a mass ratio (mass%) of the alkali component to the total weight of the alkali aqueous solution.

As the alkali component, a known alkali component can be used. Examples thereof include potassium carbonate, sodium carbonate, sodium bicarbonate, potassium bicarbonate, trisodium phosphate, tripotassium phosphate, dipotassium phosphate, sodium borate, potassium borate, sodium tetraborate (boric acid) , Potassium tetraborate, potassium hydroxide, sodium hydroxide, lithium hydroxide and the like. Of these, sodium hydroxide, potassium hydroxide and lithium hydroxide are preferable in that the effect of the present invention is more excellent.

The alkaline aqueous solution includes a compound (glycol ether) represented by the following formula (1).

RO- (LO) _n- H Equation (1)

In the formula (1), R represents an alkyl group. The number of carbon atoms in the alkyl group is not particularly limited, but is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3, from the viewpoint of more excellent effects of the present invention. The alkyl group may be linear, branched or cyclic.

L represents an alkylene group. The number of carbon atoms in the alkylene group is not particularly limited, but is preferably from 1 to 10, more preferably from 1 to 5, and still more preferably from 1 to 3, from the viewpoint of more excellent effects of the present invention. More specifically, an ethylene group (-CH ₂ -CH ₂ -), a trimethylene group (-CH ₂ -CH ₂ -CH ₂ -) and a propylene group (-CH (CH ₃ ) -CH ₂ -) are preferable.

n represents an integer of 1 or more. Among them, 1 to 10 is preferable, 1 to 5 is more preferable, and 1 to 3 is more preferable because the effect of the present invention is more excellent.

Examples of the compound represented by the formula (1) include propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, and the like.

The content of the compound represented by the formula (1) with respect to the total weight of the alkali aqueous solution is 3% by mass or more, more preferably 4% by mass or more, and more preferably 5% by mass or more. The upper limit is not particularly limited, but is preferably 20% by mass or less in that the effect is saturated.

If the content is less than 3% by mass, the removability of the resin layer becomes poor.

The alkali aqueous solution usually contains water as a solvent.

In addition, an organic solvent or other additives may be included in the aqueous alkali solution to the extent that the effect of the present invention is not impaired.

(Process procedure)

In this step, the alkali aqueous solution and the resin layer are brought into contact with each other to remove the resin layer.

The method of contacting the alkali aqueous solution and the resin layer is not particularly limited, and examples thereof include a method of immersing the composite containing the resin layer in an aqueous alkali solution, and a method of applying an aqueous alkali solution on the resin layer.

The contact time of the alkali aqueous solution and the resin layer is not particularly limited, but is preferably 0.1 hour or more, more preferably 0.5 hour or more, and even more preferably 0.6 hour or more, from the standpoint of the effect of the present invention. The upper limit is not particularly limited, but is preferably 30 hours or less, and more preferably 24 hours or less in terms of productivity.

The temperature of the aqueous alkali solution upon contact with the resin layer is not particularly limited, but is preferably 5 to 50 占 폚, more preferably 10 to 40 占 폚, from the viewpoints of the more excellent effects of the present invention and the stability of the aqueous solution.

Further, after the alkali aqueous solution and the resin layer are brought into contact with each other, the resin layer may be washed and removed with water if necessary.

The surface of the glass substrate from which the resin layer has been removed may be polished if necessary. As a polishing method, a known method can be used.

By performing the above process, the resin layer disposed on the glass substrate can be removed, and a glass substrate can be manufactured.

A resin layer may be formed on the obtained glass substrate again, or it may be used as a glass substrate.

<Examples>

Hereinafter, the present invention will be described in more detail by showing specific examples of the present invention.

&Lt; Preparation of composite &

(ASA-V01, manufactured by Arakawa Chemical Industry Co., Ltd.) and a methylhydrogenpolysiloxane having a hydrosilyl group in the molecule (manufactured by Arakawa Chemical Industries, Ltd., (240 mm in length, 240 mm in width, 0.5 mm in thickness, 0.5 mm in thickness), a platinum-based catalyst (ASA-X01 manufactured by Arakawa Chemical Industries, Ltd., ASA-C01) and IP solvent 2028 (manufactured by Idemitsu Kosan Co., Quot ;, a coefficient of linear expansion of 38 x 10 &lt; ^-7 &gt; / DEG C, trade name &quot; AN100 &quot; manufactured by Asahi Glass Co., Ltd.), and a layer containing uncured curable silicone was formed on the glass substrate. Here, the mixing ratio of the linear organoalkenyl polysiloxane and the methylhydrogenpolysiloxane was adjusted so that the molar ratio of the vinyl group and the hydrosilyl group was 1: 1. The platinum-based catalyst was adjusted to 4 parts by mass based on 100 parts by mass of the total of linear organoalkenyl polysiloxane and methylhydrogen polysiloxane. Further, the IP solvent 2028 was adjusted so that the solution solid concentration was 40% by weight.

Subsequently, this was heat-dried and cured in air at 250 ° C for 20 minutes to obtain a silicon resin layer having a thickness of 8 μm on the glass substrate.

&Lt; Example 1 >

(KOH concentration relative to the total weight of the alkaline aqueous solution) of 20% by mass and a propylene glycol monoethyl ether concentration (propylene glycol mono (Concentration of ethyl ether) was 5 mass%.

The glass substrate on which the silicone resin layer was disposed was immersed in the obtained alkali aqueous solution (25 DEG C) for 40 minutes. After the immersion, the glass substrate was taken out, and the silicon resin layer was removed.

&Lt; Example 2 >

The silicon resin layer was removed from the glass substrate according to the same procedure as in Example 1 except that the immersion time was changed from 40 minutes to 60 minutes.

&Lt; Example 3 >

The silicon resin layer was removed from the glass substrate according to the same procedure as in Example 1 except that the immersion time was changed from 40 minutes to 17 hours.

<Example 4>

(KOH concentration relative to the total weight of the alkali aqueous solution) of 20% by mass, and the concentration of dipropylene glycol monomethyl ether Propylene glycol monomethyl ether) was 5% by mass.

The glass substrate on which the silicone resin layer was disposed was immersed in the obtained alkali aqueous solution (25 DEG C) for 80 minutes. After the immersion, the glass substrate was taken out, and the silicon resin layer was removed.

&Lt; Example 5 >

The procedure of Example 4 was followed except that the immersion time was changed from 80 minutes to 4 hours, and the silicon resin layer was removed from the glass substrate.

&Lt; Comparative Example 1 &

According to the same procedure as in Example 1 except that propylene glycol monoethyl ether was not used in the aqueous alkali solution, the silicone resin layer could not be removed.

&Lt; Comparative Example 2 &

According to the same procedure as in Example 1 except that the KOH concentration was changed from 20 mass% to 10 mass%, the silicone resin layer could not be removed.

The present application is based on Japanese Patent Application No. 2014-093947 filed on April 30, 2014, the contents of which are incorporated herein by reference.

Claims (11)

A method of removing a resin layer for removing a resin layer disposed on a glass substrate,
And removing the resin layer by bringing the alkali layer into contact with an alkali aqueous solution having an alkali concentration of 15 mass% or more and containing 3 mass% or more of the compound represented by the formula (1).
RO- (LO) _n- H Equation (1)
[In the formula (1), R represents an alkyl group, L represents an alkylene group, and n represents an integer of 1 or more) The method for removing a resin layer according to claim 1, wherein the resin layer is a silicon resin layer. The method for removing a resin layer according to claim 1 or 2, wherein L in the formula (1) is a trimethylene group, a propylene group or an ethylene group, and n is an integer of 1 to 3. The method for removing a resin layer according to any one of claims 1 to 3, wherein the compound represented by the formula (1) is propylene glycol monoethyl ether or dipropylene glycol monomethyl ether. The method for removing a resin layer according to any one of claims 1 to 4, wherein the alkali concentration is 18 mass% or more. The method for removing a resin layer according to any one of claims 1 to 5, wherein the thickness of the resin layer is 0.1 to 100 mu m. The method for removing a resin layer according to any one of claims 1 to 6, wherein the alkali aqueous solution contains at least one selected from the group consisting of sodium hydroxide, potassium hydroxide and lithium hydroxide. The method for removing a resin layer according to any one of claims 1 to 7, wherein the temperature of the alkali aqueous solution is 5 to 50 占 폚. The method for removing a resin layer according to any one of claims 1 to 8, wherein the contact time of the alkali aqueous solution and the resin layer is 0.1 to 24 hours. The method for manufacturing a semiconductor device according to any one of claims 1 to 9, further comprising the step of, from a laminate having a glass substrate, a resin layer, a thin plate glass substrate, and an electronic device component in this order, And removing the resin layer in the composite having the glass substrate and the resin layer obtained by separating the resin layer from the glass substrate. A method for manufacturing a glass substrate, comprising the steps of: removing the resin layer according to any one of claims 1 to 10 to manufacture a glass substrate.