KR20150119470A - Method for producing color filter, color filter and solid-state imaging element - Google Patents

Abstract

Thereby providing a color filter having a good pattern shape. (a) a step of forming a colored layer by using a coloring and radiation-sensitive composition containing a dye, a polymerizable compound and a photopolymerization initiator soluble in an organic solvent, (b) a step of exposing the colored layer to a pattern shape through a mask And (c) developing the exposed colored layer using a developing solution containing an organic solvent, wherein the coloring and radiation-sensitive composition contains at least 65 mass% of a dye solubilized in the organic solvent, Gt;

Description

TECHNICAL FIELD [0001] The present invention relates to a color filter, a color filter, and a solid-state image pickup device,

The present invention relates to a method of manufacturing a color filter, a color filter and a solid-state image pickup device.

For example, a solid-state image pickup device is provided with a color filter in which a plurality of colored pixels of a plurality of colors such as a red pixel, a green pixel, and a blue pixel are two-dimensionally arranged on a support such as a semiconductor substrate. In this solid-state imaging device, an increase in the number of pixels has been remarkable in recent years, and when compared with a solid-state imaging device of the same inch size as the conventional one, the pixel size is remarkably reduced. In addition, as the pixel size is reduced, performance requirements for color separation become worse. In order to maintain device characteristics such as color shading characteristics and color mixing prevention, the performance required for the color filter is reduced by thinning, rectangularization, Performance such as eliminating overlapped overlapping areas is required.

A photolithography method in which an organic pigment of a red pigment, a green pigment, and a blue pigment is used as a coloring material and an aqueous alkali solution is used as a developing solution has been widely used as a manufacturing method of such a color filter. In the photolithography method, a colored and radiation-sensitive composition is coated on a support and dried to form a colored layer, and the colored layer is subjected to pattern exposure and development to form colored pixels of a first color (for example, green) , And similarly, a coloring pixel of the remaining color is similarly formed (see, for example, Patent Document 1).

Further, a technique of using a dye instead of a conventional technique of using a pigment has been proposed (see, for example, Patent Documents 2 and 3).

Japanese Patent Laid-Open No. 11-68076 Japanese Unexamined Patent Application Publication No. 6-75375 Japanese Patent Application Laid-Open No. 11-148950

According to the technique described in Patent Document 1, as the pixels of the solid-state imaging device are miniaturized, the pattern formation by the photolithography method becomes difficult to make both the spectral characteristics of the color filter and the pattern forming property compatible with the demands for miniaturization and thinning of the color filter. Specifically, in the color filter for a solid-state image sensor, the thinning of the coloring pattern may be carried out by forming a thin layer having a thickness of 0.8 m or less and a pixel pattern size of 1.4 m or less (for example, 0.5 to 1.4 m) There is a tendency to increase the size.

Particularly, as the thinning progresses, the relative amount of the coloring agent such as pigment increases in the film, while the amount of the component contributing to the photolithography other than the coloring agent is relatively decreased, and the pattern- There arises a problem that residues are generated due to defective development with respect to the requirement of pattern formation in which the pixel pattern size is less than 1.4 mu m. This is due to the fact that the pigment itself is not developable in the beginning in a color filter using a pigment dispersion (a color filter produced by photolithography using a coloring and radiation-emitting composition in which pigments are dispersed in various compositions). In addition, even when correction such as OPC (Optical Proximity Correction) is performed, there is an effect of improving the shape of the pattern observed from the upper surface, but there is a problem that the pattern shape when the cross section is observed is rounded and the rectangularity is insufficient do. It is known that the rounding of the pattern edge becomes remarkable due to the influence of light scattering upon exposure by the pigment.

Particularly, in recent years, from the requirement for further high definition of the color filter for a solid-state imaging element, for example, formation of a pattern of 1.1 mu m has become a problem, and in the conventional method of developing a coloring composition using an organic pigment with an alkali developer, Is close to the limit.

Further, in the color filter for a solid-state imaging device, further high definition is required. However, in the conventional pigment dispersion system, it is difficult to further improve the resolution, and since there is a problem that color unevenness occurs due to coarse particles of the pigment, it is not suitable for applications requiring a fine pattern like a solid-state image pickup device.

In the systems using the dyes soluble in organic solvents as colorants as in the techniques described in Patent Documents 2 and 3, it is difficult to achieve a thin film having a thickness of 0.8 탆 or less while satisfying desired spectroscopy.

As described above, the color filter formed by the conventional photolithography process has a problem that sufficient resolution is not obtained, that is, the pattern shape is not good, and as a result, the characteristics of the solid-state image pickup device are deteriorated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and an object thereof is to provide a method of manufacturing a color filter having a good pattern shape.

Under such circumstances, the inventors of the present invention have made intensive investigations, and as a result, have found that (i) a colored layer is formed by using a coloring and radiation-sensitive composition containing at least 65 mass% of a dye soluble in an organic solvent and exposed to light, (Ii) patterning by dry etching so as to form a colored pattern on the first colored layer by the coloring composition, and patterning by photolithography so as to form another colored pattern on the patterned first colored layer In the step of patterning by photolithography, a colored layer is formed by using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator, and exposed to light. Using a developing solution containing an organic solvent It has been found that a color filter having a good pattern shape can be obtained by the development, Reotda.

More specifically, the above problem is solved by the following solving means <1>, preferably by <2> - <14>.

(1) A process for producing a color filter comprising the steps of (a) forming a colored layer using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator,

(b) exposing the colored layer to a pattern shape through a mask, and

(c) developing the exposed colored layer using a developing solution containing an organic solvent,

Wherein the coloring and radiation-sensitive composition contains at least 65 mass% of a dye solubilized in the organic solvent among the total solids of the coloring and radiation-sensitive composition.

&Lt; 2 > The method for producing a color filter according to < 1 >, wherein the dye soluble in the organic solvent is a large amount of dye.

<3> The method of manufacturing a color filter according to <1> or <2>, wherein the developer containing the organic solvent contains 95% by mass or more of an organic solvent.

<4> The method of any one of <1> to <3>, wherein the SP value of the developer containing the organic solvent is 15.1 to 18.9 or 23.1 to 42.0.

&Lt; 5 > A method according to any one of < 1 > to < 4 >, wherein the SP value of the developer containing the organic solvent is 15.1 to 17.5 or 30.0 to 42.0.

&Lt; 6 > A method of manufacturing a color filter having a plurality of colored layers formed on a substrate,

A step of forming a first colored layer by a coloring composition,

A step of patterning by dry etching so as to form a colored pattern on the first colored layer,

And patterning by photolithography so that another colored pattern is formed on the patterned first colored layer,

In the step of patterning by photolithography,

(a) a step of forming a colored layer by using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator,

(b) exposing the colored layer to a pattern shape through a mask, and

(c) developing the exposed colored layer using a developing solution containing an organic solvent.

<7> The method for producing a color filter according to <6>, wherein the coloring and radiation-sensitive composition contains at least 65 mass% of a dye soluble in the organic solvent among all solids in the coloring and radiation-sensitive composition.

<8> The method for producing a color filter according to <6> or <7>, wherein the dye soluble in the organic solvent is a large amount of dye.

<9> The method for manufacturing a color filter according to any one of <6> to <8>, wherein the developer containing the organic solvent contains 95% by mass or more of an organic solvent.

<10> The method of any one of <6> to <9>, wherein the SP value of the developer containing the organic solvent is 15.1 to 18.9 or 23.1 to 42.0.

<11> The method of any one of <6> to <10>, wherein the SP value of the developer containing the organic solvent is 15.1 to 17.5 or 30.0 to 42.0.

<12> A method for manufacturing a color filter according to any one of <6> to <11>, wherein the first colored layer is a green transmissive layer.

<13> A color filter obtained by the method for producing a color filter according to any one of <1> to <12>.

&Lt; 14 > A solid-state imaging device comprising a color filter according to < 13 >.

(Effects of the Invention)

According to the present invention, a color filter having a good pattern shape can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing a configuration example of a color filter and a solid-state image pickup device. FIG.
2 is a schematic cross-sectional view of the first colored layer.
3 is a schematic cross-sectional view showing a state in which a photoresist layer is formed on the first colored layer.
4 is a schematic cross-sectional view showing a state in which a resist pattern is formed on the first colored layer.
5 is a schematic sectional view showing a state in which a first coloring pattern is formed by forming a removal portion group in the first coloring layer by etching.
6 is a schematic cross-sectional view showing a state where the resist pattern in Fig. 5 is removed.
7 is a schematic cross-sectional view showing a state in which a second coloring pattern and a second coloring and radiation-sensitive layer are formed.
8 is a schematic sectional view showing a state in which the second coloring radiation-curable layer in Fig. 7 and a part of the second coloring pixels constituting the second coloring pattern are removed.
9 is a schematic sectional view showing a state in which a third coloring pattern and a third coloring and radiation-sensitive layer are formed.
10 is a schematic sectional view showing a state in which the third coloring and radiation-sensitive layer in Fig. 9 is removed.

Hereinafter, the contents of the present invention will be described in detail. The description of the constituent elements described below may be made based on a representative embodiment of the present invention, but the present invention is not limited to such an embodiment.

In the present specification, &quot; &quot; is used to mean that the numerical values described before and after that are included as a lower limit value and an upper limit value.

In the present specification, the notation in which the substituent and the non-substituent are not described in the notation of the group (atomic group) includes those having a substituent and having a substituent. For example, the "alkyl group" includes an alkyl group (substituted alkyl group) having a substituent as well as an alkyl group (unsubstituted alkyl group) having no substituent.

As used herein, the term "(meth) acrylate" refers to acrylate and methacrylate, "(meth) acryl" refers to acryl and methacryl, "(meth) acryloyl" refers to acryloyl and methacryl Respectively.

In the present specification, &quot; coloring layer &quot; means a pixel used in a color filter.

The pigment in the present invention means, for example, an insoluble dye compound that is not soluble in a solvent. Here, the solvent includes the solvents exemplified in the column of the solvent to be described later. Therefore, a pigment compound which is not soluble in these solvents corresponds to the pigment in the present invention.

The &quot; dye soluble in organic solvent &quot; in the present invention means, for example, that the solubility of the dye in an organic solvent at 23 ° C is 1% by mass or more and preferably 1 to 50% by mass, More preferably 50% by mass, still more preferably 10% by mass to 50% by mass. The "organic solvent" refers to at least one of esters, ethers, ketones, and aromatic hydrocarbons, for example.

Hereinafter, the manufacturing method of the color filter of the present invention will be described in the order of the first embodiment and the second embodiment.

According to the method for manufacturing a color filter of the present invention, a color filter having a good pattern shape can be obtained. Further, according to the method for manufacturing a color filter of the present invention, even when the color filter is made thinner, the pattern shape of the color filter can be improved. In addition, according to the method for manufacturing a color filter of the present invention, it is possible to provide a color filter in which the non-uniformity of reflectance between pixels is small.

Further, according to the method for producing a color filter of the present invention, it is possible to obtain a color filter having good pattern shape, good developing property of the unexposed portion, and good decoloring resistance.

&Lt; First Embodiment >

A method of manufacturing a color filter according to the present invention includes:

(a) a step of forming a colored layer by using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator,

(b) exposing the colored layer to a pattern shape through a mask, and

(c) developing the exposed colored layer using a developing solution containing an organic solvent,

And 65% by mass or more of the total solids of the coloring and radiation-sensitive composition.

In the method of manufacturing a color filter of the present invention, it is preferable to perform patterning by photolithography.

The method of manufacturing a color filter may include a step of baking the colored layer (prebaking step) and a step of baking the developed colored layer (postbaking step), if necessary. Hereinafter, these processes may be collectively referred to as a pattern forming process.

Here, in order to make the color filter thinner, it is necessary to increase the concentration of the coloring agent (dye), but the amount of the component other than the coloring agent contributing to photolithography is relatively reduced. It has been difficult to improve the pattern shape due to the decrease in the film contributing to the photolithography property other than the coloring agent.

In the present invention, by using the above-described method of manufacturing a color filter, even when the color filter is made thinner, the pattern shape can be improved.

&Lt; Process of forming colored layer using coloring and radiation-sensitive composition &gt;

In the coloring layer forming step, a colored layer (preferably a coating film) is formed using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator. For example, it is preferable to dissolve each component of the radiation-sensitive resin composition in a solvent, filter it if necessary, and then apply a coloring and radiation-sensitive composition to the support to form a colored layer.

The filter is preferably made of polytetrafluoroethylene, polyethylene or nylon having a pore size of 0.1 탆 or less, more preferably 0.05 탆 or less, and more preferably 0.03 탆 or less.

Examples of the support that can be used in the present process include a solid-state imaging device (solid-state imaging device) provided with an imaging element (light-receiving element) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal-Oxide Semiconductor) A substrate for a device can be used.

The coloring pattern in the present invention may be formed on the imaging element formation surface side (surface) of the substrate for the solid-state imaging element, or on the imaging element formation surface side (back surface).

The light-shielding film may be formed on the back surface of the substrate for the solid-state imaging element or the color pattern of the solid-state imaging element.

In addition, an undercoat layer may be formed on the support for improving adhesion with the upper layer, preventing diffusion of the substance, and planarizing the surface of the substrate, if necessary. In particular, when a resist is used as the undercoat layer, mixing of the undercoat layer and the upper layer can be further suppressed.

As a method of applying the colored and radiation sensitive composition of the present invention onto a support, various coating methods such as slit coating, inkjet coating, spin coating, flex coating, roll coating and screen printing are preferably applied, Application is more preferable.

The film thickness (coating film thickness before heating) of the coloring and radiation-sensitive composition layer is not particularly limited, but is preferably 0.1 to 10 탆, more preferably 0.2 to 5 탆, for example.

The heating (prebaking) time is not particularly limited, but is preferably 30 to 300 seconds, more preferably 30 to 180 seconds, and still more preferably 30 to 130 seconds.

The heating can be performed by a means provided in a conventional exposure and developing machine, and can be performed using a hot plate, an oven, or the like.

The thickness of the coloring and radiation-sensitive composition layer after heating is preferably 0.1 to 1.5 탆, more preferably 0.1 to 0.8 탆.

<< Exposure Process >>

In the exposure step, the formed colored layer is exposed in a pattern through a mask. In the exposure step, it is preferable that the colored layer formed in the colored layer forming step is pattern-exposed through a mask having a predetermined mask pattern by using an exposure apparatus such as a stepper. Thereby, a colored cured film obtained by curing the coloring and radiation-sensitive composition is obtained.

As the radiation (light) usable for exposure, particularly ultraviolet rays such as g line and i line are preferably used (particularly preferably i line). The irradiation amount (exposure amount) is preferably 30 mJ / cm 2 to 3000 mJ / cm 2, more preferably 50 mJ / cm 2 to 2500 mJ / cm 2, and particularly preferably 100 mJ / cm 2 to 500 mJ /

<< Pattern formation process >>

In the pattern formation step, the exposed colored layer is developed using a developer containing an organic solvent. As a result, the coloring layer of the tailing portion is eluted into the developer and only the photo-cured portion remains.

The vapor pressure (the total vapor pressure in the case of a mixed solvent) of the developer containing an organic solvent is preferably 5 kPa or less, more preferably 3 kPa or less, and particularly preferably 2 kPa or less at 20 캜. By setting the vapor pressure of the organic solvent to 5 kPa or less, the evaporation of the developer on the substrate or in the developing cup is suppressed to improve the temperature uniformity within the wafer surface, and as a result, the dimensional uniformity within the wafer surface is improved.

As the organic solvent used in the developer, various organic solvents are widely used. For example, solvents such as an ester solvent, a ketone solvent, an alcohol solvent, an amide solvent, an ether solvent and a hydrocarbon solvent can be used.

In the present invention, the ester-based solvent is a solvent having an ester group in the molecule.

A ketone solvent is a solvent having a ketone group in a molecule. An alcohol-based solvent is a solvent having an alcoholic hydroxyl group in the molecule. An amide solvent is a solvent having an amide group in a molecule. An ether solvent is a solvent having an ether bond in a molecule. Among them, there is a solvent having a plurality of the above-mentioned functional groups in one molecule, but in this case, it corresponds to any solvent species including a functional group of the solvent. For example, diethylene glycol monomethyl ether corresponds to an alcohol solvent and an ether solvent in the above-mentioned classification.

The hydrocarbon solvent is a hydrocarbon solvent having no substituent.

Particularly, in the present invention, it is preferable that the developer is a developer containing at least one solvent selected from a ketone solvent, an ester solvent, an alcohol solvent and an ether solvent, and it is preferably a developer containing at least one solvent selected from ketone solvents, ester solvents, And more preferably a developer containing at least one kind of solvent to be selected.

The organic solvent to be used in the developer may be a mixture of a plurality of kinds, or may be mixed with a solvent or water other than the above. In order to achieve the effect of the present invention more effectively, the water content of the developer as a whole is preferably 30 mass% or less, more preferably less than 10 mass%, and more preferably substantially no moisture. By making the water content of the developer as 30% or less by mass as described above, the developing property of the unexposed portion can be improved and the development residue of the unexposed portion can be further suppressed, for example.

The concentration of the organic solvent (total amount when a plurality of kinds are mixed) in the developer is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 95% by mass or more, The organic solvent alone is used. In addition, the case of substantially containing only an organic solvent includes a case containing a small amount of a surfactant, an antioxidant, a basic compound, a stabilizer, a defoaming agent and the like.

Examples of the organic solvent used in the developing solution include ethyl acetate, butyl acetate, pentyl acetate, isopentyl acetate, diisopropyl ketone, methylhexyl ketone, methyl amyl ketone, methyl ethyl ketone,? -Butyrolactone, methanol, propylene glycol monomethyl ether acetate , 2-heptanone and anisole, and it is preferable to use at least one selected from the group consisting of ethyl acetate, butyl acetate, diisopropyl ketone, methylhexyl ketone, methyl amyl ketone, methyl ethyl ketone, More preferably at least one member selected from the group consisting of lactone and methanol, and more preferably at least one member selected from the group consisting of butyl acetate, diisopropyl ketone, methylhexyl ketone and methyl amyl ketone.

As the developer containing an organic solvent, for example, a developer described in paragraphs [0021] to [0043] of JP-A-2010- 217884 can also be used, and this content is incorporated herein by reference.

The organic solvent in the developer containing the organic solvent may be defined as the SP value (Solubility Parameter). As the SP value of the organic solvent, for example, the SP value (more specifically, the SP value described in Table 7) described in VII / 675 to 714 of "POLYMER HANDBOOK FOURTH EDITION Volume 2" can be used. The SP value is preferably 15.1 to 18.9 or 23.1 to 42.0, more preferably 15.1 to 18.0 or 26.0 to 42.0, further preferably 15.1 to 17.5 or 30.0 to 42.0, particularly preferably 15.7 to 17.5 or 30.0 to 42.0 .

By setting the SP value of the organic solvent to 18.9 or less and 23.1 or more, it is possible to prevent the compatibility of the organic solvent and the dye from becoming excessively good, and to prevent the dye from being separated from the cured portion. Further, by setting the SP value of the organic solvent to 15.1 or more and 42.0 or less, the affinity between the organic solvent and the dye can be improved and the developing property can be improved.

Further, when the SP value of the organic solvent is 15.7 or more, the developability of the unexposed portion can be improved.

Further, a nitrogen-containing compound may be contained in a developer containing an organic solvent. As the nitrogen-containing compound, for example, reference may be made to paragraphs [0042] to [0063] of JP-A-2013-011833, the content of which is incorporated herein by reference.

Examples of the developing method include a method (dipping method) in which the substrate is immersed in a bath filled with a developer for a predetermined time (dipping method), a method of puddling the surface of the substrate with the surface tension and then stopping the development for a predetermined time A method of spraying a developing solution (spraying method), a method of continuously discharging a developing solution while scanning a developing solution discharging nozzle at a constant speed on a substrate rotating at a constant speed (dynamic dispensing method), and the like, .

The developing time is not particularly limited as long as the coloring layer of the unexposed portion is sufficiently dissolved, and is usually 10 seconds to 300 seconds, preferably 20 seconds to 120 seconds.

The temperature of the developing solution is preferably 0 deg. C to 50 deg. C, more preferably 15 deg. C to 35 deg.

The method of manufacturing a color filter of the present invention may include a step of cleaning using a rinsing liquid containing an organic solvent after development using a developing solution containing an organic solvent.

The vapor pressure of the rinsing liquid (the total vapor pressure in the case of a mixed solvent) is preferably from 0.05 to 5, more preferably from 0.1 to 5, more preferably from 0.12 to 3, Most preferred. By adjusting the vapor pressure of the rinse liquid to 0.05-5 GPa or less, the temperature uniformity within the wafer surface is improved and the swelling due to infiltration of the rinsing liquid is suppressed, thereby improving the dimensional uniformity within the wafer surface.

As the rinse liquid, various organic solvents are used, but at least one organic solvent selected from a hydrocarbon solvent, a ketone solvent, an ester solvent, an alcohol solvent, an amide solvent and an ether solvent or a rinse liquid containing water Is preferably used.

As regards the rinsing treatment, for example, paragraphs [0045] to [0054] of Japanese Patent Application Laid-Open No. 2010-217884 can be taken into consideration, and the contents thereof are incorporated herein by reference.

&Lt; Color Sensitive Radiation Composition &gt;

Next, the composition used in the present invention will be described.

<<< Dyes soluble in organic solvents >>>

The coloring and radiation-sensitive composition used in the present invention contains a dye soluble in an organic solvent (hereinafter, simply referred to as a dye).

The dye is not particularly limited as long as it is a dye soluble in an organic solvent. For example, a known dye for a conventional color filter can be used. For example, JP-A-64-90403, JP-A-64-91102, JP-A-1-94301, JP-A-6-11614, U.S. Patent No. 4,808,501, U.S. Patent No. 5,667,920, U.S. Patent No. 5,059,500, JP-A-5-333207, JP-A-6-35183, and JP-A-6-51115 , JP-A-6-194828 and the like can be used, and these contents are incorporated herein by reference.

Examples thereof include a pyrazolone group, anilino group, triphenylmethane group, anthraquinone group, anthrapyridone group, benzilidene group, oxolin group, pyrazolotriazole group, pyridazo group, cyanine group, phenothiazine group, Dyes such as benzopyran, indigo, pyromethene, and methine can be used as the dyes.

The dyes to be used in the present invention are selected from dypyrromethene dye, azo dye, anthraquinone dye, triphenylmethane dye, xanthene dye, cyanine dye, squarylium dye, quinophthalone dye, phthalocyanine dye and subphthalocyanine dye It is preferable to have a partial structure (pigment structure) derived from the dye. The partial structure derived from the dye indicates a structure that can be connected to a dye multimer connecting portion (such as a polymer chain or a dendrimer core) from which a hydrogen atom has been removed from a specific dye capable of forming a dye structure (hereinafter also referred to as a dye compound).

It is preferable that each dye constituting the partial structure derived from the dye in the dye used in the present invention has a dye skeleton in which the maximum absorption wavelength is in the range of 400 to 780 nm. This dye functions as, for example, a coloring agent in the coloring and radiation-sensitive composition of the present invention.

As the structure of the dye, it is preferable to have a dye multimer structure. The dye multimer may contain two or more dye structures in the molecule, and a dye multimer containing a repeating unit having a dye structure is preferable. By using such a dye multimer, the discoloration resistance of the color filter can be further improved.

The dye multimer may contain other repeating units in addition to the repeating units having a pigment structure. Examples of other repeating units include repeating units having an ethylenically unsaturated bond, repeating units having an alkali-soluble group, and repeating units having a hydrophilic group. It is preferable to include a repeating unit having an ethylenically unsaturated bond from the viewpoints of reduction of apparatus contamination and suppression of occurrence of residue.

Specific preferred examples of the dye multimer structure are disclosed in, for example, JP-A-2010-250291, JP-A-2011-95732, JP-A-2012-13945, JP- Japanese Patent Application Laid-Open Publication Nos. 2001-46712, 2012-181502, 2012-208494, 2013-28764, and 2013-29760, respectively. ] To [0133], which are incorporated herein by reference.

<<< Desirable Structure of Dye >>>

The dye used in the coloring and radiation-sensitive composition of the present invention is preferably a dye multimer comprising at least one of the constitutional units represented by the following formulas (A), (B) and (C) D) is preferable.

The structural unit represented by the general formula (A)

In the general formula (A), X ¹ represents a linking group formed by polymerization, and L ¹ represents a single bond or a divalent linking group. Dye I represents the dye structure described later.

In the general formula (A), X ₁ represents a linking group formed by polymerization. That is, a part forming a repeating unit corresponding to a main chain formed by a polymerization reaction. In addition, a region represented by two * is a repeating unit. X ₁ is preferably a linking group represented by any one of the following formulas (XX-1) to (XX-24), more preferably a linking group represented by any one of formulas (XX-1) (Meth) acrylic linkage chain represented by (XX-10) to (XX-17), and a vinyl-based linkage chain represented by (XX-24). (XX-1) to (XX-24), it is connected to L ₁ at the site indicated by *. Me represents a methyl group. In the formulas (XX-18) and (XX-19), R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms or a phenyl group.

In the general formula (A), L ₁ represents a single bond or a divalent linking group. Examples of the divalent linking group when L ₁ represents a divalent linking group include a substituted or unsubstituted alkylene group having 1 to 30 carbon atoms (e.g., a methylene group, an ethylene group, a trimethylene group, a propylene group, a butylene group, etc.) Substituted or unsubstituted arylene group (e.g., phenylene group, naphthalene group, etc.), a substituted or unsubstituted heterocyclic linking group, -CH = CH-, -O-, -S-, -C -, -CO ₂ -, -NR-, -CONR-, -O ₂ C-, -SO-, -SO ₂ -, and a linking group formed by linking two or more of them. Here, each R independently represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group. In the general formula (A), Dye I represents the above-described dye structure.

The details of the general formula (A) can be taken into account in paragraphs [0138] to [0152] of JP-A-2013-29760, the contents of which are incorporated herein by reference.

The structural unit represented by the general formula (B)

In the general formula (B), X ² is synonymous with X ¹ in the general formula (A). L ² is synonymous with L ¹ in the general formula (A). Y ² represents a group capable of ionic bonding or coordination bonding with Dye ^II . Dye II represents the dye structure described later.

In the general formula (B), X ₂ and X ₂ are synonymous with in the formula (A), a preferred range is also the same. L ₂ is L ₁ and agreed in the formula (A), a preferred range is also the same. Y ₂ is a group capable of ionic or coordinate bonding with Dye _II , and may be either an anionic group or a cationic group. Examples of anionic groups _{COO-, PO 3 H-, SO 3} -, -SO 3 NH-, -SO 3 , and the like, but _{N-CO-, COO-, PO 3 H-, SO} 3 - is preferable.

Examples of the cationic group include substituted or unsubstituted onium cations (for example, ammonium, pyridinium, imidazolium, and phosphonium), and particularly preferable are ammonium cations.

Y ₂ may be bonded to the anion moiety (COO-, SO ₃ -, O-, etc.) or the cation moiety (such as the onium cation or metal cation) of Dye _II .

For details of the general formula (B), paragraphs [0156] to [0161] of Japanese Patent Laid-Open Publication No. 2013-29760 can be taken into consideration, and the contents thereof are incorporated herein by reference.

The structural unit represented by the general formula (C)

In the general formula (C), L ³ represents a single bond or a divalent linking group. DyeIII represents the dye structure described later. m represents 0 or 1;

Examples of the divalent linking group represented by L ₃ in the general formula (C) include a substituted or unsubstituted linear, branched or cyclic alkylene group having 1 to 30 carbon atoms (e.g., a methylene group, an ethylene group, a trimethylene group, A substituted or unsubstituted heterocyclic linking group, -CH = CH-, -O-, or a substituted or unsubstituted arylene group having 6 to 30 carbon atoms (e.g., a substituted or unsubstituted arylene group such as a phenylene group and a naphthalene group) -S-, -NR- (wherein each R independently represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group), -C (= O) -, -SO-, -SO ₂ - The connecting member to be formed is suitably. m represents 0 or 1, but is preferably 1.

Specific examples of suitable divalent linking groups represented by L ₃ in general formula (C) are described below, but L ₃ of the present invention is not limited thereto.

For the details of the general formula (C), paragraphs [0165] to [0167] of Japanese Patent Laid-Open Publication No. 2013-29760 may be taken into consideration, and the contents thereof are incorporated herein by reference.

The dye multimer represented by the general formula (D)

[In the general formula (D), L ⁴ represents an n-valent linking group. n represents an integer of 2 to 20; When n is 2 or more, the structure of Dye IV may be the same or different. Dye IV represents the dye structure described later]

In the general formula (D), n is preferably 3 to 15, particularly preferably 3 to 6.

In the general formula (D), when n is 2, the divalent linking group represented by L ₄ is a substituted or unsubstituted alkylene group having 1 to 30 carbon atoms (e.g., a methylene group, an ethylene group, a trimethylene group, , A substituted or unsubstituted heterocyclic linking group, -CH = CH-, -O-, -S (= O), or a substituted or unsubstituted arylene group having 6 to 30 carbon atoms (e.g., a phenylene group or a naphthalene group) -, -NR- (wherein each R independently represents a hydrogen atom, an alkyl group, an aryl group or a heterocyclic group), -C (= O) -, -SO-, -SO ₂ - A connector may suitably be mentioned.

The n-valent linking group wherein n is 3 or more is a substituted or unsubstituted arylene group (1,3,5-phenylene group, 1,2,4-phenylene group, 1,4,5,8-naphthalene group, etc.) A 1,3,5-triazine group, etc.), an alkylene linking group or the like as a central nucleus, and the bivalent linking group is substituted to form a linking group.

Specific examples of L ₄ in general formula (D) are shown below, but the present invention is not limited thereto.

For the details of the general formula (D), the paragraphs [0173] to [0178] of Japanese Patent Laid-Open Publication No. 2013-29760 can be taken into consideration and the contents thereof are incorporated herein by reference.

Among the polymeric oligomers having a structural unit represented by any one of the general formulas (A), (B) and (C) and the polymeric oligomers represented by the general formula (D) (C) and the dye oligomers represented by the formula (D) are linked by a covalent bond, the coloring and radiation-sensitive composition containing the dye multimer is excellent in heat resistance , It is preferable that the above-mentioned coloring and radiation-sensitive composition is effective for inhibiting the dye transfer to other adjacent coloring patterns when the coloring radiation-sensitive composition is applied to the formation of a plurality of coloring patterns. In particular, the compound represented by the general formula (A) is preferable because it is easy to control the molecular weight of the pigment multimer.

The dye used in the present invention may have a polymerizable group. As the polymerizable group, a known polymerizable group capable of crosslinking by radical, acid, or heat can be used, and examples thereof include a group containing an ethylenic unsaturated bond, a cyclic ether group (epoxy group, oxetane group), and a methylol group (Meth) acryloyl group is more preferable, and the (meth) acryloyl group derived from glycidyl (meth) acrylate and 3,4-epoxycyclohexylmethyl (meth) An acryloyl group is particularly preferred.

As a method for introducing the polymerizable group, there are (1) a method of modifying a dye multimer with a polymerizable group-containing compound and introducing the polymerizable group-containing compound, and (2) a method of introducing a dye monomer and a polymerizable group- These methods can be considered, for example, in paragraphs [0181] to [0188] of JP-A-2013-29760, the contents of which are incorporated herein by reference.

The amount of the polymerizable group in the dye is preferably 0.1 mmol to 2.0 mmol, more preferably 0.2 mmol to 1.5 mmol, and particularly preferably 0.3 mmol to 1.0 mmol, per g of the dye.

The dye used in the present invention may have other functional groups. With respect to other functional groups, those having an alkali-soluble group such as carboxylic acid group, sulfonic acid group, phosphoric acid group and phenolic hydroxyl group are preferable. As the alkali-soluble group, a carboxylic acid group is particularly preferable.

As to other functional groups that the multimer of the dye used in the present invention may have, for example, paragraphs [0195] to [0201] of JP-A-2013-29760 may be taken into consideration, Is used.

The weight average molecular weight of the dye used in the present invention is preferably 2000 or more, more preferably 3000 or more, still more preferably 4000 or more, and particularly preferably 5000 or more. In particular, since the dye has a weight average molecular weight of 5000 or more, the solubility of the coloring and radiation-sensitive composition of the present invention in a developer is improved, and thus the developability can be further improved. The upper limit of the weight average molecular weight of the dye is not particularly limited, but is preferably 20,000 or less, more preferably 15,000 or less, and even more preferably 10,000 or less.

In the present specification, the weight average molecular weight and the number average molecular weight are values measured in terms of styrene by the GPC method.

The ratio [Mw / (Mn)] of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of the pigment (A) is preferably 1.0 to 3.0, more preferably 1.6 to 2.5 , And particularly preferably from 1.6 to 2.0.

The Tg of the dye used in the present invention is preferably 50 DEG C or higher, more preferably 100 DEG C or higher. In addition, the 5% weight reduction temperature by thermogravimetric analysis (TGA measurement) is preferably 120 ° C or higher, more preferably 150 ° C or higher, and even more preferably 200 ° C or higher. When the coloring and radiation-sensitive composition of the present invention is applied to the production of a color filter or the like in this region, the concentration change due to the heating process can be reduced.

It is preferable that the dye used in the present invention has an extinction coefficient per unit weight (hereinafter referred to as epsilon '' = epsilon / average molecular weight, unit: L / g · cm) And more preferably 100 or more. Within this range, a color filter having good color reproducibility can be produced when a color filter is manufactured using the color sensitive radiation sensitive composition of the present invention.

The molar extinction coefficient of the (A) dye oligomer used in the coloring and radiation-sensitive composition of the present invention is preferably as high as possible from the viewpoint of tinting strength. The maximum absorption wavelength and extinction coefficient are measured by a spectrophotometer cary5 (manufactured by Varian, Inc.).

The content of the dye in the coloring and radiation sensitive composition of the present invention is preferably 65% by mass or more, more preferably 70% by mass or more, based on the total solid content of the coloring and radiation-sensitive composition. By making the content of the dye in the coloring and radiation-sensitive composition to be 65% by mass or more based on the total solid content of the coloring and radiation-sensitive composition, the color filter can be made thinner. The upper limit of the content of the dye in the coloring and radiation sensitive composition of the present invention is not particularly limited, but is preferably 95% by mass or less, and more preferably 90% by mass or less. As the dye, only one type may be used, or two or more types may be used in combination. A known pigment may be used together with the dye.

<<< Photocurable compound >>>

The colored radiation sensitive composition of the present invention contains a photo-curable compound. As the photo-curing compound, for example, a polymerizable compound containing an ethylenic unsaturated bond, cyclic ether (epoxy, oxetane), methylol and the like is preferable. Hereinafter, the polymerizable compound used as the photo-curable compound will be described.

The polymerizable compound is suitably selected from polymerizable compounds having at least one, and preferably two or more, terminal ethylenic unsaturated bonds from the viewpoint of sensitivity. Of these, polyfunctional polymerizable compounds having four or more functionalities are preferable, and polyfunctional polymerizable compounds having five or more functionalities are more preferable. In the present invention, these can be used without particular limitation. These may be, for example, monomers, prepolymers, that is, any of chemical forms such as dimers, trimer and oligomers or mixtures thereof, and oligomers thereof. The polymerizable compounds in the present invention may be used singly or in combination of two or more.

More specifically, examples of the monomer and its prepolymer include unsaturated carboxylic acids (e.g., acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters, amides, And preferably an ester of an unsaturated carboxylic acid and an aliphatic polyhydric alcohol compound and an amide of an unsaturated carboxylic acid and an aliphatic polyvalent amine compound and a multimer thereof.

Further, it is also possible to use an unsaturated carboxylic acid ester or amide having a nucleophilic substituent such as a hydroxyl group, an amino group or a mercapto group, an addition reaction product of a monofunctional or polyfunctional isocyanate or an epoxy or a monofunctional or polyfunctional carboxylic acid And a dehydration condensation reaction product of water.

Further, it is also possible to use an unsaturated carboxylic acid ester or amide having an electrophilic substituent such as an isocyanate group or an epoxy group, an addition reaction product of a monofunctional or polyfunctional alcohol, an amine or a thiol, or a leaving group such as a halogen group or a tosyloxy group , And a substitution reaction product of monofunctional or polyfunctional alcohols, amines and thiols are also suitable.

As another example, it is also possible to use a compound group substituted by unsaturated carboxylic acid, vinylbenzene derivative such as styrene, vinyl ether, allyl ether or the like instead of the above unsaturated carboxylic acid.

As specific compounds of these compounds, compounds described in paragraphs [0095] to [0108] of Japanese Patent Laid-Open No. 2009-288705 can be taken into consideration, and the contents thereof are herein incorporated by reference.

The polymerizable compound is also preferably a compound having an ethylenically unsaturated group having at least one addition-polymerizable ethylene group and a boiling point of at least 100 캜 under atmospheric pressure. For example, the paragraph [0227] of Japanese Patent Application Laid-Open No. 2013-29760 may be taken into consideration, and the contents thereof are incorporated herein by reference. As the compound having at least one addition-polymerizable ethylenically unsaturated group having a boiling point of 100 ° C or higher at normal pressure, the compounds described in paragraphs [0254] to [0257] of JP-A No. 2008-292970 may be taken into consideration. The contents are incorporated herein by reference.

Among them, polyfunctional (meth) acrylate is preferable as the polymerizable compound. For example, dipentaerythritol triacrylate (KAYARAD D-330, commercially available from Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.) and dipentaerythritol hexa (methacrylic acid) (commercially available products such as KAYARAD D-320 manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta (KAYARAD DPHA, available from Nippon Kayaku Co., Ltd., as a commercially available product) and a (meth) acryloyl group in which ethylene glycol and propylene glycol residues are present. These oligomer types can also be used.

Examples of the polymerizable compound are described in Japanese Patent Application Laid-Open Publication No. 2012-208494 (paragraphs [0466] to [0495] (corresponding to United States Patent Application Publication No. 2012/0235099 [0571] to [0606]) The contents of which are incorporated herein by reference.

The content of the photocurable compound in the color sensitive radiation sensitive composition of the present invention is preferably from 0.1 to 70 mass%, more preferably from 1.0 to 40 mass%, more preferably from 2.0 to 20 mass%, based on the total solid content in the coloring and radiation- % Is particularly preferable.

<<< photopolymerization initiator >>>

The coloring and radiation-sensitive composition used in the present invention further contains a photopolymerization initiator. The coloring and radiation-sensitive composition used in the present invention contains a photopolymerization initiator, whereby the sensitivity can be further improved.

The photopolymerization initiator is not particularly limited as far as it has the ability to initiate polymerization of the polymerizable compound, and can be appropriately selected from known photopolymerization initiators. For example, it is preferable to have photosensitivity to a visible ray from an ultraviolet ray region. It may be an activator that generates an active radical by generating some action with a photoexcited sensitizer, or may be an initiator such as initiating cationic polymerization depending on the type of monomer.

It is also preferable that the photopolymerization initiator contains at least one compound having a molecular extinction coefficient of at least about 50 within a range of about 300 nm to 800 nm (more preferably 330 nm to 500 nm).

Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, those having a triazine skeleton and those having an oxadiazole skeleton), acylphosphine compounds such as acylphosphine oxide, hexaarylbimidazole, oxime An organic peroxide, a thio compound, a ketone compound, an aromatic onium salt, a ketooxime ether, an aminoacetophenone compound, and a hydroxyacetophenone.

Also, from the viewpoint of exposure sensitivity, trihalomethyltriazine compounds, benzyldimethylketal compounds,? -Hydroxyketone compounds,? -Amino ketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, oxime compounds , Triallylimidazole dimer, onium compound, benzothiazole compound, benzophenone compound, acetophenone compound and its derivative, cyclopentadiene-benzene-iron complex and its salt, halomethyloxadiazole compound, 3-aryl substitution And a coumarin compound.

In particular, when the color sensitive radiation sensitive composition of the present invention is used in the production of a color filter of a solid-state image sensor, it is important to form a fine pattern in a sharp shape, so that it is cured and developed without residue on the unexposed portion. From this viewpoint, it is particularly preferable to use an oxime compound as the polymerization initiator.

Particularly, in the case of forming a fine pattern in a solid-state image pickup device, stepper exposure is used for curing exposure, but this exposure device may be damaged by halogen, and the addition amount of the polymerization initiator should also be suppressed to be low. Considering this point, it is particularly preferable to use an oxime compound as a photopolymerization initiator in order to form a fine pattern such as a solid-state image pickup device.

Specific examples of the oxime compound include compounds described in JP 2001-233842 A, compounds described in JP 2000-80068 A, and JP 2006-342166 A. Examples of the oxime compounds include compounds represented by the following formulas (OX-1) or (OX-1) after the Japanese Patent Application Laid-Open Publication No. 2012-208494 [0513] (corresponding US Patent Application Publication No. 2012/235099 [0632] -2), the contents of which are incorporated herein by reference.

Examples of the oxime compounds such as oxime derivatives which are suitably used as the photopolymerization initiator in the present invention include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan- 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino- (4-toluenesulfonyloxy) iminobutan-2-one and 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one.

As oxime ester compounds, see J. C. S. Perkin II (1979) pp. Pp. 1653-1660, J. C. S. Perkin II (1979) pp. 156-162, Journal of Photopolymer Science and Technology (1995) pp. 202 to 232 and Japanese Patent Application Laid-Open No. 2000-66385, compounds disclosed in the respective publications of JP-A-2000-80068, JP-A-2004-534797 and JP-A-2006-342166 . IRGACURE-OXE01 (manufactured by BASF, Ltd.) and IRGACURE-OXE02 (manufactured by BASF, Ltd.) are also suitably used as commercially available products.

The content of the photopolymerization initiator contained in the coloring and radiation-sensitive composition used in the present invention is preferably from 0.1 to 50 mass%, more preferably from 0.5 to 30 mass%, and most preferably from 1 to 5 mass%, based on the total solid content of the coloring and radiation- By mass to 10% by mass.

<<< polymerization inhibitor >>>

In the coloring and radiation-sensitive composition used in the present invention, it is preferable to add a polymerization inhibitor in order to prevent unnecessary polymerization of the photo-curing compound during or during the production of the above-mentioned coloring and radiation-sensitive composition.

Examples of the polymerization inhibitor usable in the present invention include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, 4,4'-thiobis Methyl-6-t-butylphenol), 2,2'-methylenebis (4-methyl-6-t-butylphenol) and N-nitrosophenylhydroxyamine cerium salt.

The addition amount of the polymerization inhibitor is preferably 0.01 to 5% by mass based on the total solid content of the coloring and radiation-sensitive composition used in the present invention.

<<< solvent >>>

The coloring and radiation-sensitive composition used in the present invention may contain a solvent (organic solvent). The solvent is not particularly limited so long as it satisfies the solubility of the dye described above.

Examples of the organic solvent include esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl lactate, methyl lactate, (For example, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethoxyacetate), 3 (methoxyethyl acetate, -Oxypropionic acid alkyl esters such as methyl 3-oxypropionate, ethyl 3-oxypropionate (for example, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, Ethoxypropionate, etc.)), 2-oxypropionic acid alkyl esters (e.g., methyl 2-oxypropionate, ethyl 2-oxypropionate, Methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate), 2-oxy-2 (2-methoxypropionate) Methyl propionate and ethyl 2-oxy-2-methylpropionate (for example, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate and the like), methyl pyruvate, ethyl pyruvate, Propyl acetate, ethyl acetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate and the like, and ethers such as diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol Monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol Propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monopropyl ether acetate, and the like, and ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, etc. And aromatic hydrocarbons, for example, toluene, xylene, and the like.

The content of the solvent in the coloring and radiation-sensitive composition is preferably such that the total solid content concentration of the coloring and radiation-sensitive composition is 5 to 80 mass%, more preferably 5 to 60 mass% By mass and 10 to 50% by mass, respectively.

<<< Other Ingredients >>>

The coloring and radiation-sensitive composition to be used in the present invention may contain components other than those described above. For example, paragraphs [0182] to [0184] of Japanese Patent Application Laid-Open No. 2006-243173 can be considered, and the contents thereof are incorporated herein by reference.

&Lt; Second Embodiment >

A method of manufacturing a color filter having a plurality of colored layers formed on a substrate,

A step of forming a first colored layer by a coloring composition,

Patterning the first colored layer by dry etching so as to form a plurality of patterns,

And patterning the other colored layer in the patterned first colored layer by photolithography,

Wherein the step of patterning the another colored layer by photolithography comprises:

(a) a step of forming the another colored layer using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator,

(b) exposing the other colored layer to a pattern shape through a mask, and

(c) developing the exposed colored layer using a developing solution containing an organic solvent.

According to the manufacturing method of the color filter according to the second embodiment, the pattern shape of the color filter can be made better when the color filter is made thinner than the manufacturing method of the color filter according to the first embodiment.

In the method of manufacturing a color filter of the present invention, the first colored layer is first patterned by dry etching to form a removed portion of a desired shape more reliably than when the first colored layer is patterned by photolithography . In addition, patterning of the first colored layer by dry etching and patterning of the other colored layer by photolithography can prevent the number of steps from being excessively increased as compared with the case where all the steps are dry-etched.

The coloring composition used in the step of forming the first colored layer in the method for producing a color filter of the present invention is not particularly limited as long as it contains a curable compound, a coloring agent (pigment or dye), a solvent, Compositions may also be used. For each component, for example, paragraphs [0072] to [0387] of Japanese Patent Laid-Open Publication No. 2013-54081 may be taken into consideration, the contents of which are incorporated herein by reference.

As the curing compound in the coloring composition used in the step of forming the first colored layer, a polymerizable compound (for example, a thermosetting compound) can be used.

The solvent in the coloring composition used in the step of forming the first colored layer is not particularly limited, and for example, the photo-curable compound or solvent described above can be used.

The content of the coloring agent in the coloring composition used in the step of forming the first colored layer is preferably 65% by mass or more, more preferably 70% by mass or more, based on the total solid content of the coloring composition. The upper limit of the content of the colorant in the coloring composition used in the step of forming the first colored layer is not particularly limited, but is preferably 95% by mass or less, and more preferably 90% by mass or less. As the colorant in the coloring composition used in the step of forming the first colored layer, a pigment may be used or a dye may be used, but it is preferable to use a pigment, and it is preferable to use a pigment as a pigment dispersion in which a pigment is dispersed in a solvent desirable. Further, only one kind of coloring agent may be used in the coloring composition used in the step of forming the first coloring layer, or two or more kinds of coloring agents may be used in combination.

The method of patterning by dry etching so as to form a plurality of patterns is not particularly limited as long as it is a method capable of patterning the first colored layer by forming the removed portion in the first colored layer, It is preferably arranged in an additional lattice shape (Bayer shape).

Dry etching is not particularly limited, but it is preferable to use, for example, an etching gas from the viewpoint of forming the cross section of the pattern closer to a rectangle or further reducing the damage to the support.

Another colored layer used in the step of patterning the other colored layer by photolithography is a colored layer having a color different from that of the first colored layer. The coloring and radiation-sensitive composition used in the step of patterning the other colored layer by photolithography is in agreement with the coloring and radiation-sensitive composition in the first embodiment described above, and the preferable range is the same.

Specific examples of the method for producing a color filter of the present invention will be described below.

In the method of manufacturing a color filter of the present invention, a first colored layer is formed using a coloring composition (hereinafter also referred to as a first coloring composition).

Here, the solid-state image pickup device will be described with reference to FIG. 1 as an example.

1, the solid-state imaging element 10 is composed of a light receiving element (photodiode) 42, a color filter 13, a flattening film 14, a microlens 15, and the like formed on a silicon substrate. In the present invention, the planarization film 14 is not necessarily formed. In FIG. 1, in order to clarify each part, the ratio of the thickness and the width of each other is ignored and partially exaggerated.

The support is not particularly limited as long as it is used for a color filter in addition to a silicon substrate. For example, soda glass, borosilicate glass, quartz glass, and a photoelectric conversion An element substrate, for example, an oxide film, silicon nitride, and the like. An intermediate layer or the like may be formed between the support and the color filter 13 as long as the present invention is not impaired.

On the silicon substrate, a P well 41 is provided, and a light receiving element (photodiode) 42 is provided on a part of the surface of the P well 41. The surface of the P-well 41 of the silicon substrate has an impurity diffusion layer 43 having a higher N-type impurity concentration than that of the light receiving element (photodiode) 42 in a region other than the above portion.

On the P well 41, the light receiving element (photodiode) 42 and the impurity diffused layer 43, SiO ₂ or SiO ₂ / SiN / SiO ₂ And an electrode 44 made of poly-Si, tungsten, tungsten silicide, Al, Cu, or the like is formed on the insulating film 47. [ A wiring layer 45 is formed above the electrode 44. A BPSG film 46 and a P-SiN film 48 are further provided above the wiring layer 45. [ A flattening film layer 49 is formed on the BPSG film 46 for the purpose of flattening the surface of the P-SiN film 48 or irregularities other than the pixel region.

A color filter 13 is formed on the planarizing film layer 49. In the following description, a colored film formed on a silicon substrate without dividing a region is referred to as a "colored (coloring and sensitizing radiation) layer", and a colored film formed by partitioning a region in a pattern form (for example, A film patterned in a stripe shape, etc.) is referred to as a &quot; coloring pattern &quot;. In addition, a coloring pattern (for example, a coloring pattern patterned in a square or a rectangle) constituting an element constituting the color filter 13 among the coloring patterns is referred to as a "colored (red, green, blue) pixel".

The color filter 13 is composed of a plurality of two-dimensionally arranged green pixels (first color pixels) 20G, a red pixel (second color pixel) 20R and a blue pixel (third color pixel) 20B have. Each coloring pixel 20R, 20G, and 20B is formed at a position above the light receiving element (photodiode) 42, respectively. The green pixel 20G is formed in a lattice shape and the blue pixel 20B and the red pixel 20R are formed between the respective green pixels 20G. In Fig. 1, the coloring pixels 20R, 20G, and 20B are arranged in a line and displayed in order to explain that the color filter 13 is composed of three color pixels.

The flattening film 14 is formed so as to cover the upper surface of the color filter 13, thereby flattening the color filter surface.

The microlens 15 is a converging lens disposed with its convex surface facing upward and is formed above the flattening film 14 (color filter when no flattening film is provided) and above the light receiving element (photodiode) 42 have. Each microlens 15 efficiently guides light from a subject to each light receiving element (photodiode) 42.

Next, a method of manufacturing the color filter of the present invention will be described.

In the method of manufacturing a color filter of the present invention, first coloring layer 11 is formed by first coloring composition as shown in a schematic sectional view of Fig. 2 (step (a)). The first coloring composition will be described later.

The first colored layer 11 is preferably a green transmissive layer. The color sensitivity can be further improved by forming the first colored layer 11 as a green transmissive layer.

The coloring agent in the first coloring composition was CI Pigment Green 7, 10, 36, 37, 58 and CI Pigment Yellow 1,2,3,4,5,6,10,11,12,13,14,15,16 36, 37, 37, 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, , 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118 , 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167 At least one selected from the group consisting of SEQ ID NOS: 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, .

The first colored layer 11 can be formed, for example, by coating a colored composition on a support by a coating method such as spin coating, slit coating, spray coating, and the like, followed by drying to form a colored layer.

The thickness of the first colored layer 11 after drying is preferably in the range of 0.3 to 1 mu m, more preferably in the range of 0.35 to 0.8 mu m, and further preferably in the range of 0.35 to 0.7 mu m.

When the first coloring composition contains a photo-curable compound, it is preferable to heat and cure the first colored layer 11 by a heating device such as a hot plate or an oven. The heating temperature is preferably 90 ° C to 250 ° C, more preferably 100 ° C to 230 ° C. The heating time varies depending on the heating means, but is usually about 3 to 30 minutes when heated on a hot plate, and usually about 30 to 90 minutes when heated in an oven.

Subsequently, the first colored layer 11 is patterned by dry etching so as to form a group of removed portions (step (B)). Thus, the first colored pattern is formed. According to this method, a first coloring layer is formed by the coloring and radiation-sensitive composition, and the removal portion of the desired shape can be formed more reliably than in the case of forming the removal portion by exposure and development of the first coloring layer .

Dry etching can be performed using an etching gas with the first colored layer 11 as a mask as a patterned photoresist layer. For example, as shown in the schematic cross-sectional view of FIG. 3, a photoresist layer 51 is first formed on the first colored layer 11.

More specifically, a positive or negative radiation-sensitive composition is coated on the first colored layer 11 and dried to form a photoresist layer. In forming the photoresist layer 51, it is preferable to further perform the prebaking treatment. Particularly, as the photoresist forming process, it is preferable that the post-exposure baking (PEB) and post-baking baking (post baking) are performed.

As the photoresist, for example, a positive radiation-sensitive composition is used. Examples of the positive radiation-sensitive composition include positive photoresists suitable for positive photoresists sensitive to radiation such as deep ultraviolet rays including ultraviolet rays (g line, h line, i line), excimer laser, electron beam, ion beam and X- Type resist composition may be used. Among radiation, g line, h line and i line are preferable, and among them, i line is preferable.

Specifically, a composition containing a quinone diazide compound and an alkali-soluble resin is preferably used as the positive-tone radiation-sensitive composition. As the quinone diazide compound, a naphthoquinone diazide compound can be mentioned.

The thickness of the photoresist layer 51 after drying is preferably 0.1 to 3 占 퐉, more preferably 0.2 to 2.5 占 퐉, and still more preferably 0.3 to 2 占 퐉. In addition, the application of the photoresist layer 51 is suitably performed using a coating method in the first colored layer 11.

4, a photoresist layer 51 is exposed and developed to form a resist pattern (patterned photoresist layer) 52 on which the resist removal unit group 51A is formed.

The formation of the resist pattern 52 is not particularly limited, and conventionally known photolithography techniques can be used. A resist pattern group 51A is formed in the photoresist layer 51 by exposure and development so that a resist pattern 52 as an etching mask to be used in the next etching is formed on the first colored layer 11. [

Exposure of the photoresist layer 51 can be performed by irradiating the positive or negative radiation-sensitive composition with a g-line, h-line, i-line, or the like, preferably i-line, through a predetermined mask pattern. After the exposure, the photoresist is removed in accordance with the region in which the colored pattern is to be formed by developing with a developing solution.

The developing solution may be any solution as long as it does not affect the first colored layer including the colorant and dissolves the unexposed portions of the positive type resist and the negative type resist. For example, a combination of various organic solvents or an alkaline aqueous solution Can be used.

As the alkaline aqueous solution, an alkaline aqueous solution prepared by dissolving an alkaline compound in an amount of 0.001 to 10 mass%, preferably 0.01 to 5 mass%, is suitable. The alkaline compound may be, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, Choline, pyrrole, piperidine, 1,8-diazabicyclo [5.4.0] -7-undecene and the like. When an alkaline aqueous solution is used as a developing solution, cleaning treatment is generally performed with water after development.

Next, as shown in the schematic sectional view of FIG. 5, the resist pattern 52 is used as an etching mask to pattern the first colored layer 11 by dry etching so as to form the removal group 120. As a result, the first colored pattern 12 is formed. Here, the removal unit 120 includes a first removal unit 121 and a second removal unit 122.

The removal section 120 is formed in a lattice shape in the first colored layer 11. Therefore, the first coloring pattern 12 in which the removal unit group 120 is formed in the first coloring layer 11 has a plurality of rectangular first coloring pixels in a lattice shape.

Specifically, in the dry etching, the first colored layer 11 is dry-etched using the resist pattern 52 as an etching mask. Representative examples of the dry etching are disclosed in Japanese Patent Laid-open Publication Nos. 59-126506, 59-46628, 58-9108, 58-2809, 57-148706 and 61-41102 , And the contents thereof are incorporated herein by reference.

Dry etching is preferably carried out in the following manner from the viewpoint of forming the pattern end face closer to a rectangle or further reducing the damage to the support.

(N ₂ ) and oxygen gas (N ₂ ) after the first-stage etching by using a mixed gas of a fluorine-based gas and an oxygen gas (O ₂ ) O ₂ ), preferably a second-stage etching process for performing etching up to a region (depth) where the substrate is exposed, and an over-etching process performed after the substrate is exposed. Hereinafter, the specific method of dry etching, the first-stage etching, the second-stage etching, and the over-etching will be described.

The dry etching is performed by obtaining the etching conditions in advance by the following method.

(1) The etching rate (nm / min) in the first-stage etching and the etching rate (nm / min) in the second-stage etching are respectively calculated.

(2) The time for etching the desired thickness in the first-stage etching and the time for etching the desired thickness in the second-stage etching are respectively calculated.

(3) The first-stage etching is performed according to the etching time calculated in (2) above.

(4) The second-stage etching is performed according to the etching time calculated in (2) above. Alternatively, the etching time may be determined by end point detection, and the second-stage etching may be performed according to the determined etching time.

(5) Overetching time is calculated for the total time of (3) and (4), and overetching is performed.

As the mixed gas to be used in the first step etching step, it is preferable to include a fluorine-based gas and an oxygen gas (O ₂ ) from the viewpoint of processing the organic material, which is an etching film, into a rectangular shape. In addition, the first-stage etching process may be performed by etching to a region where the support is not exposed, thereby avoiding damage to the support.

In the second etching step and the over etching step, etching is performed to a region where the support is not exposed by the mixed gas of the fluorine gas and the oxygen gas in the first etching step, and then nitrogen It is preferable to perform the etching treatment using a mixed gas of gas and oxygen gas.

It is important that the ratio of the amount of etching in the first step etching step to the amount of etching in the second step etching step is determined so as not to impair the rectangularity due to the etching treatment in the first step etching step. The latter ratio in the total etching amount (the sum of the etching amount in the first-stage etching step and the etching amount in the second-step etching step) is preferably greater than 0% and less than 50% 20% is more preferable. The etching amount refers to an amount calculated from the difference between the remaining film thickness of the etched film and the film thickness before etching.

Further, it is preferable that the etching includes an over-etching treatment. The overetching process is preferably performed by setting an overetching ratio. It is preferable that the overetching ratio is calculated from the first etching treatment time. Although the overetching ratio can be set arbitrarily, it is preferably 30% or less of the etching treatment time in the etching step, more preferably 5 to 25% in terms of the etching resistance of the photoresist and the maintenance of the rectangularity of the etching pattern .

Subsequently, as shown in the schematic sectional view of FIG. 6, the resist pattern (that is, the etching mask) 52 remaining after etching is removed. The resist pattern 52 is removed by applying a removing solution or a solvent on the resist pattern 52 to make the resist pattern 52 removable and a step of removing the resist pattern 52 by using washing water . For example, a step of applying a peeling liquid or a solvent on at least the resist pattern 52 and stagnating for a predetermined time to perform puddle development. The time for stucking the peeling liquid or the solvent is not particularly limited, but it is preferably several tens seconds to several minutes. Further, for example, the resist pattern 52 may be removed by spraying washing water onto the resist pattern 52 from a spraying or shower-type spraying nozzle.

As the washing water, pure water can be preferably used. As the injection nozzle, there can be mentioned a spray nozzle in which the entire support is contained in the spray range, and a spray nozzle in which the movable range of the movable spray nozzle includes the entire support.

Subsequently, as shown in the schematic cross-sectional view in Fig. 7, the second coloring and radiation-sensitive compositions are buried in the respective removal portions in the first removing group 121 and the second removing group 122, On the first coloring layer (that is, the first coloring pattern 12 formed by forming the removal unit group 120 in the first coloring layer 11) so as to form a pixel, the second coloring radiation- The radiation-sensitive layer 21 is laminated (step (c)). As a result, the second colored pattern 22 having a plurality of second colored pixels is formed in the removal unit group 120 of the first colored layer 11. Here, the second colored pixel is a rectangular pixel. The formation of the second coloring and radiation-sensitive layer 21 is carried out in the same manner as the step of forming the coloring layer using the coloring and radiation-sensitive composition in the first embodiment described above.

The thickness of the second coloring and radiation-sensitive layer 21 after post-baking is preferably in the range of 0.1 to 1 탆, more preferably in the range of 0.2 to 0.8 탆, and still more preferably in the range of 0.3 to 0.6 탆.

The second coloring and radiation-sensitive layer 21 is exposed by exposing and developing the position 21A corresponding to the first removing group 121 formed on the first coloring layer 11 of the second coloring and radiation-sensitive layer 21, And a plurality of second colored pixels 22R formed inside the respective removing portions of the second removing unit group 122 are removed (step (D)) (see the schematic sectional view of FIG. 8). This step is performed in the same manner as the exposure step and the pattern forming step in the first embodiment described above.

Next, as shown in the schematic cross-sectional view of FIG. 9, a third coloring and radiation-sensitive composition is buried in each removal part of the second removal unit group 122 to form a plurality of third coloring pixels, (The first coloring pattern 12 formed by forming the second coloring pattern 22 in the first removing group 121) by the third coloring and radiation-sensitive composition, the third coloring and radiation- (Step (e)). As a result, a third colored pattern 32 having a plurality of third colored pixels is formed in the second removing group 122 of the first colored layer 11. Here, the third colored pixel is a rectangular pixel. The formation of the third coloring radiation-sensitive layer 31 is carried out in the same manner as the step of forming the coloring layer using the coloring and radiation-sensitive composition in the first embodiment described above.

The thickness of the third coloring radiation-sensitive layer 31 after post-baking is preferably in the range of 0.1 to 1 탆, more preferably 0.2 to 0.8 탆, and still more preferably 0.3 to 0.6 탆.

Then, the third coloring radiation-sensitive layer 31 is exposed and developed at the position 31A corresponding to the second removal group 122 formed in the first coloring layer 11 of the third coloring radiation-sensitive layer 31, The color filter 100 having the first coloring pattern 12, the second coloring pattern 22 and the third coloring pattern 32 is manufactured as shown in the schematic sectional view of Fig. 10 bar)). This step is performed in the same manner as the exposure step and the pattern forming step in the first embodiment described above.

The color filter of the present invention is a color filter in which a green transmissive layer is formed with an arrangement of each color pattern at one pixel interval and a red transmissive layer and a blue transmissive layer are formed at intervals of one row between green transmissive layers, .

Further, the color filter of the present invention preferably has a thickness of 0.8 탆 or less, more preferably 0.6 탆 or less. The color filter of the present invention preferably has a pixel pattern size of 1.4 탆 or less, more preferably 0.5 to 1.4 탆, and still more preferably 0.5 to 1.1 탆. By setting the size of such a pixel pattern, the resolution can be further improved.

The above-mentioned second coloring and radiation-irradiating compositions and third coloring and radiation-irradiating compositions are synonymous with the coloring and radiation-sensitive compositions of the first embodiment except for the content of the dye in the coloring and radiation-sensitive composition, The same is true.

The content of the dye in the second coloring and radiation-sensitive composition and the third coloring and radiation-sensitive composition is usually 50 mass% or more, preferably 65 mass% or more, and 70 mass% or more, Or more. The upper limit of the content of the dye in the coloring and radiation sensitive composition of the present invention is not particularly limited, but is preferably 95% by mass or less, and more preferably 90% by mass or less.

One of the second colored pixel and the third colored pixel is a red transmissive portion and the other is a blue transmissive portion.

As the colorant contained in the coloring composition for forming the red transmission portion, a dye soluble in the organic solvent of the first embodiment can be used. As the colorant contained in the coloring composition for forming the red transmission portion, a pigment may be used together with a dye soluble in the organic solvent. Examples of the pigment include CI Pigment Orange 2, 5, 13, 16, 17: 1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62 , 64, 71, 73 and CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48: 48: 3, 48: 4, 49, 49: 1, 49: 2, 52: 1, 52: 2, 53: 1, 57: 1, 60: 1, 63: 81, 2, 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178, 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 272, and 279 can be used.

As the colorant contained in the coloring composition for forming the blue transmissive portion, a dye soluble in the organic solvent of the first embodiment can be used. As the colorant contained in the coloring composition for forming the blue transmitting portion, a pigment may be used together with a dye soluble in the organic solvent. 15: 3, 15: 4, 15: 2, 15: 3, 15: 6, 16, 22, 60, 64, 66, 79, and 80 may be used.

<Solid-state image sensor>

The solid-state image pickup device according to the present invention comprises the color filter obtained by the method for manufacturing a color filter of the present invention. The configuration of the solid-state imaging device of the present invention is not particularly limited as long as it has the configuration of the color filter for a solid-state imaging device according to the present invention and functions as a solid-state imaging device. .

A plurality of photodiodes constituting a light receiving area of a solid-state image sensor (a CCD image sensor, a CMOS image sensor, or the like) and a transfer electrode composed of polysilicon or the like on the support, and a photodiode light- And a silicon nitride or the like formed on the entire surface of the light-shielding film and the photodiode light-receiving portion so as to cover the light-shielding film. The color filter for a solid-state imaging device of the present invention .

Further, as the device protective layer, there may be provided a configuration having a condensing means (for example, a microlens or the like, hereinafter the same) below the color filter (near the support) or a configuration having a condensing means on the color filter .

<Image Display Device>

The color filter in the present invention can be used not only for the solid-state image pickup device but also for an image display device such as a liquid crystal display device and an organic EL display device, and is particularly suitable for use in a liquid crystal display device.

When used in a liquid crystal display device, contains a metal complex coloring matter excellent in spectral characteristics and heat resistance as a coloring agent, has poor orientation defect of liquid crystal molecules due to a decrease in specific resistance, and has good display characteristics and excellent display characteristics.

Therefore, the liquid crystal display device provided with the color filter of the present invention can display a high-quality image with good display characteristics and good display characteristics.

As for the definition of the display device and the details of each display device, for example, the paragraph [0364] of Japanese Patent Laid-Open Publication No. 2013-29760 may be taken into consideration, and the contents thereof are incorporated herein by reference.

Example

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless it departs from the spirit thereof. Unless otherwise stated, &quot;% &quot; and &quot; part &quot; are based on mass.

(Synthesis of dyes a, b and c)

(Synthesis Example 1)

Dye a (dye monomer M1) was obtained by the method described in paragraphs [0413] to [0423] of Japanese Patent Application Laid-Open Publication No. 2012-158739.

(Synthesis Example 2)

A mixed solution of 50 g of the dye a, 3.67 g of methacrylic acid, 1.05 g of dodecane thiol, 4.78 g of a polymerization initiator (V-601, manufactured by Wako Pure Chemical Industries, Ltd.) and 50 g of cyclohexanone was prepared. Separately, 50 g of dye a, 3.67 g of methacrylic acid, 1.05 g of dodecanethiol, and 50 g of cyclohexanone were added to the reaction vessel, followed by nitrogen flow and stirring at 80 ° C. The prepared mixed solution was added dropwise over 1 hour, stirred for 3 hours, and then the reaction was terminated. After cooling to room temperature, a solution obtained by mixing 6200 ml of acetonitrile with 1038 ml of the obtained reaction solution was added dropwise over 20 minutes and the mixture was stirred for 10 minutes. The obtained precipitate was filtered and then dried to obtain 70 g of a dye b having a large amount of dye. The weight average molecular weight (Mw) of the dye b determined by GPC measurement was 6,000, and the ratio of the weight average molecular weight / number average molecular weight (Mw / Mn) was 2.0. From the titration using a 0.1 N aqueous sodium hydroxide solution, the acid value was found to be 82 mg KOH / g.

(Synthesis Example 3)

15 g of the dye b, 2.08 g of glycidyl methacrylate, 0.38 g of tetrabutylammonium bromide and 0.017 g of p-methoxyphenol were added to 96.8 g of propylene glycol methyl ether acetate, followed by stirring at 100 DEG C for 8 hours. The resulting dye solution was added dropwise to a mixed solution of 180 g of acetonitrile and 900 g of ion-exchanged water, followed by filtration and drying to obtain 15 g of dye c, which is a large amount of dye. The weight average molecular weight (Mw) of the dye c determined from the GPC measurement was 9,000, and the ratio of the weight average molecular weight / number average molecular weight (Mw / Mn) was 2.2. From the titration using a 0.1N sodium hydroxide aqueous solution, the acid value was 28 mgKOH / g.

Hereinafter, the structure (dye monomer M1) of the dye a, the structure of the dye b (formula (101)), and the structure of the dye c (formula (102)) are shown.

(Synthesis of dye d · e)

A dye e having a large amount of a dye having a structure represented by the following formula (103) was synthesized using a dye monomer M2 which is a triphenylmethane dye as a dye. The detailed operation will be described below.

(Synthesis Example 4)

Dye d (dye monomer M2) was synthesized by the method described in Japanese Patent Application Laid-Open No. 2000-162429.

(15 g), 2-acrylamido-2-methylpropanesulfonic acid (6.5 g), hydroxyethyl methacrylate (23 g), methacrylic acid (5.5 g), 28 mass% ammonia water (2 g) and azobis Isobutyronitrile (5 g) was added to N-ethylpyrrolidone (70 g) and dissolved by stirring at room temperature for 30 minutes (dropwise polymerization solution).

Methacrylic acid (5.5 g) and 28 mass% ammonia water (2 g) were dissolved in N (15 g), 2-acrylamide-2-methylpropanesulfonic acid (6.5 g), hydroxyethyl methacrylate -Ethylpyrrolidone (70 g) and stirred at 95 ° C. The polymerization solution for dropwise addition was added dropwise thereto over 3 hours, and the mixture was stirred for 1 hour. Then, azoisobutyronitrile (2.5 g) was added, and the mixture was further reacted for 2 hours and stopped. After cooling to room temperature, the solvent was distilled off, and the resulting copolymer (dye e) had a weight average molecular weight (Mw) of 28000 and an acid value of 190 mgKOH / g by titration using a 0.1 N aqueous sodium hydroxide solution.

(Synthesis of Dye i)

A dye i having a structure represented by the formula (104) was synthesized as follows using a dye monomer M3 which is an anthraquinone dye as a dye.

To the reaction vessel were added the dye monomer M3 (8.21 g), methacrylic acid (1.08 g), dodecyl mercaptan (0.20 g) and propylene glycol 1-monomethyl ether 2-acetate (PGMEA) (23.3 g) 0.0 &gt; 80 C. &lt; / RTI &gt; To this solution were added the dye monomer M3 (8.21 g), methacrylic acid (1.08 g), dodecyl mercaptan (0.25 g), dimethyl 2,2'-azobis (isobutyrate) (The turbidity of this mixed solution was 8 ppm at room temperature) was added dropwise over 2 hours. Thereafter, after stirring for 3 hours, the temperature was raised to 90 占 폚, and the mixture was heated and stirred for 2 hours and then cooled to obtain a PGMEA solution of (MD-1). Subsequently, glycidyl methacrylate (1.42 g), tetrabutylammonium bromide (80 mg) and p-methoxyphenol (20 mg) were added, and the mixture was heated at 100 ° C. for 15 hours in an air atmosphere to obtain glycidyl methacrylate I confirmed that the deal was lost. After cooling, the solution was added dropwise to a mixed solvent of methanol / ion-exchanged water = 100 ml / 10 ml, and reprecipitated to obtain 17.6 g of the dye multimer 13. From the GPC measurement, the weight average molecular weight (Mw) was 9,000 and the weight average molecular weight / number average molecular weight (Mw / Mn) ratio was 1.9. From the titration using a 0.1N sodium hydroxide aqueous solution, the acid value was 42 mgKOH / g, and the amount of the polymerizable group contained in the dye multimer from NMR measurement was 22 mg / g based on 1 g of the colorant multimer 13 (1 g).

(Synthesis of dyes j to u)

The dye j to the dye u were synthesized in the same manner as in the synthesis of the dye i except that the kind of the dye monomer was changed as shown in Table 1 below.

The dye monomers M4 to M15 and the formulas (105) to (116) in the following Table 1 are as follows.

Herein, the dye monomer M4 and the colorant monomer M5 are phthalocyanine dyes, the dye monomer M9 is a subphthalocyanine dye, and the colorant monomer M6 is a cyanine dyestuff. , The dye monomer M10 is a quinophthalone dye, the dye monomer M11 is a xanthene dye, and the dye monomer M12 to a dye monomer M15 are azo dyes.

Table 1 shows the types (M1 to M15) of the dye monomers capable of forming the dye structure contained in the dye c to the dye u, which are a large amount of the dye, the structures of the dye oligomers (the formulas (101) to (117) The acid value and the weight average molecular weight (Mw) of the dye multimer are described.

[First Embodiment]

1) Preparation of undercoating liquid

· Propylene glycol monomethyl ether acetate ... Section 19.20

   (PGMEA)

· Ethyl lactate ... 36.67 parts

· Suzy … 30.51 part

  40% PGMEA solution of benzyl methacrylate / methacrylic acid / 2-hydroxyethyl methacrylate copolymer (molar ratio = 60: 22: 18)

· Dipentaerythritol hexaacrylate ... 12.20 part

   (Photopolymerizable compound)

· Polymerization inhibitor (p-methoxyphenol) ... 0.0061 part

· Fluorine surfactant ... 0.83 part

   (F-475, manufactured by DIC Corporation)

· Photopolymerization initiator ... 0.586 part

  (TAZ-107 (trihalomethyltriazine-based photopolymerization initiator), Midori Kagaku Co., Ltd.) were mixed and dissolved to prepare a resist solution.

2) Fabrication of a silicon wafer substrate (support) with an undercoat layer

An 8-inch silicon wafer was subjected to heat treatment in an oven at 200 占 폚 for 30 minutes. Then, the resist solution was coated on the silicon wafer so that the dry film thickness became 0.5 占 퐉 and further heated and dried in an oven at 220 占 폚 for one hour to form an undercoat layer, thereby obtaining a silicon wafer substrate with an undercoat layer.

3) Preparation of color sensitive radiation-sensitive composition

The following composition was mixed and dissolved to prepare a coloring and radiation-sensitive composition. Further, dipentaerythritol hexaacrylate, which had been subjected to column purification in advance, was used.

Preparation of color sensitive radiation-sensitive composition

The following compounds were mixed and dissolved to prepare a coloring and radiation-sensitive composition for use in the present invention.

[Composition of colored curable composition]

· Cyclohexanone ... 88

· Dyes soluble in organic solvents

     Dye (X) ... x part

     Dye (Y) ... y

· Polymerization inhibitor: p-methoxyphenol ... 0.01 part

· Photocurable compound: dipentaerythritol hexaacrylate ... 1.4 part

· Photopolymerization initiator: IRGACURE OXE 02 (manufactured by Ciba Specialty Chemicals Holding Inc.) ... 0.8 part

4) Application of color sensitive, radiation-curable composition, exposure, development, unexposed area development and evaluation of pattern rectangularity

The composition obtained in 3) was applied onto the undercoat layer of the silicon wafer substrate with undercoat layer obtained in 2) above to form a photo-curable coating film. Heat treatment (prebaking) was carried out for 120 seconds using a hot plate at 100 캜 so that the dried film thickness of the coating film was 0.4 탆.

Subsequently, using an i-line stepper exposure apparatus FPA-3000i5 + (manufactured by Canon Inc.), an exposure amount was set to 50 mJ / cm 2 at a wavelength of 365 nm through an island pattern mask of 0.9 탆 x 0.9 탆 in a range of 50 to 2500 mJ / . Thereafter, the silicon wafer substrate on which the coated film was irradiated was placed on a horizontal rotary table of a spin shower developing machine (DW-30 type; manufactured by Chemitronics Co., Ltd.) Lt; 0 &gt; C for 30 seconds to form a colored pattern on a silicon wafer substrate.

Unexposed portion development and pattern rectangularity were evaluated by observing the developed pattern at 25,000 times using SEM and evaluating according to the following evaluation criteria.

- Evaluation criteria for unexposed area -

A: The unexposed portion can be completely removed.

B: Almost no residue is visible in minerals.

C: There are some residues, but within acceptable limits.

D: I can not tolerate it because there are a lot of residue.

- Evaluation Criteria of Pattern Rectangles -

A: An island pattern of 0.9 mu m x 0.9 mu m can be formed in a rectangular shape.

B: The island pattern of 0.9 占 퐉 占 0.9 占 퐉 has a slightly rounded shape.

C: The island pattern of 0.9 占 퐉 占 0.9 占 퐉 has a round shape, but is within the allowable range.

D: The island pattern of 0.9 占 퐉 占 0.9 占 퐉 is round, which is not acceptable.

5) Evaluation of application, exposure, and decolorization resistance of the colored radiation sensitive composition

The coloring and radiation-sensitive composition obtained in 3) above was applied to the undercoat layer of the glass substrate with the undercoat layer obtained in 2) using a spin coater so as to have a film thickness of 0.4 탆 and prebaked at 100 캜 for 120 seconds.

Subsequently, the sample was irradiated with a coating film at an exposure amount of 2000 mJ / cm 2 at a wavelength of 365 nm using an exposure apparatus.

The coating films obtained in the respective Examples and Comparative Examples were evaluated for discoloration resistance in the following manner.

The spectra of the respective coated films after post-baking were measured (spectroscopic A). Subsequently, this coating film was immersed in cyclohexane for 1 minute, and the spectroscopy was again measured (spectral B). The dye remaining ratio (%; B / A x 100) was calculated from the obtained spectra A and B and evaluated. The closer this value is to 100%, the better the resistance. The results are shown in the following table.

In the following table, mixed solvent A represents heptane / diisopropyl ketone = 50% by weight / 50% by weight. The mixed solvent B represents? -Butyrolactone (? BL) / water = 75% by weight / 25% by weight. The mixed solvent C represents methanol / water = 75% by weight / 25% by weight. Further, the addition amounts of the pigment dispersions of Comparative Examples 1 and 2 were adjusted to 9.8 parts as pigment solid content. CV-2000 represents a water-based alkali developer (manufactured by FUJIFILM Electronic Materials Co., Ltd.).

As is evident from the above table, according to the present invention, a coloring and radiation-sensitive composition containing a dye, a polymerizable compound and a photopolymerization initiator soluble in an organic solvent and containing a dye in an amount of 65% by mass or more in the total solid content of the color- and radiation- (Color pattern) of a color filter obtained by forming a colored layer using a developing solution containing an organic solvent, exposing the colored layer to a pattern through a mask, and developing the exposed colored layer with a developing solution containing an organic solvent I knew. It was also found that the resulting color filter had good developing performance in the unexposed portion and good decolorization resistance.

[Second Embodiment]

<Dry Etching>

Preparation of Green Pigment Dispersion -

Pigment Yellow 36 (8.6 parts), Pigment Yellow 185 pigment (5.7 parts) as a phthalocyanine pigment, 1.4 parts of a derivative A as a pigment derivative (1.4 parts) and dispersant A , And propylene glycol monomethyl ether acetate (PGMEA, 80 parts) as a solvent were mixed and dispersed with a bead mill for 15 hours to prepare a Green pigment dispersion.

&Lt; Preparation of green pigment-containing composition (coating liquid) >

The green pigment dispersion was mixed and stirred under the following composition to prepare a coloring and radiation-sensitive composition.

<Composition>

Pigment dispersion: 85.0 parts of the above Green pigment dispersion

Curable compound: Additive A (compound shown below) 3.24 parts

Solvent: PGMEA 8.76 parts

Surfactant: a PGMEA 0.2% solution of F-781 (manufactured by DIC Corporation) (polymer type surfactant: mass-average molecular weight 30000, solid acid value 0 mgKOH / g) 3.0 parts

Preparation of coloring radiation-sensitive compositions other than Green

The following compounds were mixed and dissolved to prepare a coloring and radiation-sensitive composition for use in the present invention.

[Composition of coloring and radiation-sensitive composition]

· Cyclohexanone ... 88

· Dyes soluble in organic solvents

     Exemplary Compound (X) x part

     Exemplary Compound (Y) y

· Polymerization inhibitor: p-methoxyphenol ... 0.01 part

· Photocurable compound: dipentaerythritol hexaacrylate ... 1.4 part

· Photopolymerization initiator: IRGACURE OXE 02 (manufactured by Ciba Specialty Chemicals Holding Inc.) ... 0.8 part

(Comparative Example: Preparation of Red Pigment Dispersion R1)

A mixed solution composed of 8.3 parts of Pigment Red 254 and 3.7 parts of Pigment Yellow 139 as pigments, 4.8 parts of BYK-161 (BYK-Chemie GmbH) as a pigment dispersant and 83.2 parts of PGMEA were mixed and dispersed for 15 hours by a bead mill, To thereby prepare a dispersion R1.

(Comparative Example: Preparation of Blue Pigment Dispersion B1)

9.5 parts of Pigment Blue 15: 6 and 2.4 parts of Pigment Violet 23 as pigments, 5.6 parts of BYK-161 (BYK-Chemie GmbH) as a pigment dispersant and 82.5 parts of PGMEA were mixed and dispersed for 15 hours by a bead mill Blue pigment dispersion B1 was prepared.

<Step of Forming Green Pattern (Green Pixel) by Dry Etching>

(Formation of a green layer)

The colored composition for forming a green filter of Example or Comparative Example was coated on a glass wafer so as to be a coating film having a thickness of 0.40 mu m by a spin coater and then dried on a hot plate at 100 DEG C for 180 seconds and dried, (Post-baking) for 480 seconds by using a photolithography method to form a green layer. The thickness of the green layer was 0.36 mu m.

(Application of mask resist)

Then, a positive type photoresist &quot; FHi622BC &quot; (manufactured by FUJIFILM Electronic Materials Co., Ltd.) was coated on the green layer and prebaked to form a photoresist layer having a thickness of 0.8 mu m.

(Pattern exposure and development of mask resist)

Subsequently, the photoresist layer was pattern-exposed using an i-line stepper (Canon Inc.) at an exposure amount of 350 mJ / cm 2, and heat treatment was performed at a temperature at which the photoresist layer or the atmosphere temperature reached 90 캜 for 1 minute. Thereafter, the resist film was developed with a developing solution "FHD-5" (manufactured by FUJIFILM Electronic Materials Co., Ltd.) for one minute, and subjected to a post-baking treatment at 110 ° C for one minute to form a resist pattern. This resist pattern is a pattern formed by arranging a square-shaped resist film formed on one side of 0.90 mu m in a lattice pattern in consideration of the etching conversion difference (reduction of the pattern width by etching).

(Dry etching)

Subsequently, dry etching of the green layer was performed in the following order using the resist pattern as an etching mask.

RF power: 800 W, antenna bias: 400 W, wafer bias: 200 W, chamber internal pressure: 4.0 Pa, substrate temperature: 50 占 폚, gas type of the mixed gas: dry etching apparatus (U-621 manufactured by Hitachi High- And the first step etching for 80 seconds was performed with the flow rates of CF ₄ : 80 ml / min, O ₂ : 40 ml / min, and Ar: 800 ml / min.

The amount of wear of the green layer under this etching condition became 356 nm (the etching amount of 89%), and a state of a residual film of about 44 nm was found.

Subsequently, in the same etching chamber, RF power: 600 W, antenna bias: 100 W, wafer bias: 250 W, internal pressure of chamber: 2.0 Pa, substrate temperature: 50 캜, gas type and flow rate of mixed gas: N ₂ : (N ₂ / O ₂ / Ar = 10/1/10), O _{2 was} 50 ml / min, and Ar was 500 ml / min, and the overetching rate in the etching total was 20% , And an over-etching treatment was performed.

The etching rate of the green layer in the second-stage etching condition was 600 nm / min or more, and it took about 10 seconds to etch the remaining layer of the green layer. The etching time was calculated by adding 80 seconds as the first step etching time and 10 seconds as the second step etching time. As a result, the etching time was 80 + 10 = 90 seconds and the over etching time was 90 占 0.2 = 18 seconds, and the total etching time was set to 90 + 18 = 108 seconds.

After performing the dry etching under the above-mentioned conditions, the resist pattern was removed by performing a peeling process for 120 seconds using a photoresist peeling solution "MS230C" (manufactured by FUJIFILM Electronic Materials Co., Ltd.), followed by washing with pure water, spin drying . Thereafter, dehydration baking treatment was performed at 100 캜 for 2 minutes. From the above, a green pattern in which square green pixels of 0.9 占 퐉 on one side are arranged in a lattice form was obtained.

Green patterns formed by arranging square green pixels of 0.9 占 퐉 on one side formed in a lattice shape by using the color composition for green filter formation of each example in the above <green pattern (green pixel) forming process by dry etching> And a color sensitive radiation-sensitive composition for forming a red filter was formed so as to have a thickness of 0.36 mu m after drying and post-baking so that the coloring and radiation-sensitive composition for forming a red filter was embedded in each of the removing portions of the green pattern, To obtain a laminated color filter in which a red radiation-sensitive layer was formed on the green layer (corresponding to the state in Fig. 7).

The red radiation-sensitive layer of the laminated color filter thus obtained was subjected to pattern exposure using an i-line stepper (manufactured by Canon Inc.) at an exposure amount of 350 mJ / cm 2. Here, the exposure region is a region corresponding to the removal region located in the even-numbered columns in the lattice pattern of the green pattern (the first removing group group 121 formed in the first coloring layer 11 of the second coloring and radiation- ) (Corresponding to the position 21A (see Fig. 7)).

Subsequently, the laminated color filter after exposure was mounted on a horizontal rotary table of a spin shower developing machine (DW-30 type, manufactured by Chemitronics Co., Ltd.), and developed with a developing solution containing the solvent described in the following table at 23 DEG C Puddle development was performed for 60 seconds. Thereafter, the color filter was fixed to the horizontal rotary table by a vacuum chucking method, and the color filter was rotated at a rotation speed of 50 rpm by a rotary device, pure water was supplied from the nozzle above the rotation center in a shower shape, , Followed by spray drying.

As described above, the color filter precursor (corresponding to the state of FIG. 8) in which the red radiation-sensitive layer in the laminated color filter and the red pixel formed in the inside of the removing portion located in the odd-numbered column in the lattice pattern of the green pattern are removed .

Then, the coloring and radiation-sensitive composition for forming a blue filter was applied so that the coloring and radiation-sensitive composition for forming a blue filter was embedded in each of the removing portions of the green pattern of the color filter precursor and the thickness after drying and post-baking was 0.40 탆 (Corresponding to the state shown in Fig. 9) in which a blue radiation-sensitive layer was formed on the green layer by coating on the color filter precursor.

The blue radiation-sensitive layer of the laminated color filter thus obtained was pattern-exposed using an i-line stepper (Canon Inc.) at an exposure dose of 350 mJ / cm 2. Here, the exposure region is a region corresponding to the removal region located in the odd-numbered columns in the lattice pattern of the green pattern (the second removing group group 122 formed in the first coloring layer 11 of the third coloring radiation- ) (Corresponding to the position 31A (see Fig. 9)).

Subsequently, the laminated color filter after exposure was mounted on a horizontal rotary table of a spin shower developing machine (DW-30 type, manufactured by Chemitronics Co., Ltd.), and developed with a developing solution containing the solvent described in the following table at 23 DEG C Puddle development was performed for 60 seconds. Thereafter, the color filter was fixed to the horizontal rotary table by a vacuum chucking method, and the color filter was rotated at a rotation speed of 50 rpm by a rotary device, pure water was supplied from the nozzle above the rotation center in a shower shape, , Followed by spray drying.

From the above, a color filter (corresponding to the state of FIG. 10) in which the blue radiation-sensitive layer in the laminated color filter is removed is obtained.

The unexposed portion development and the pattern rectangularity were evaluated by observing the developed pattern at 25,000 times using SEM using the following evaluation criteria.

The evaluation of discoloration resistance of the coloring and radiation-sensitive composition was carried out in the same manner as in "5) Evaluation of coating, exposure and discoloration resistance of the above-mentioned" 5) coloring and radiation-sensitive composition ".

The results are shown in the following table.

- Evaluation criteria for unexposed area -

A: The unexposed portion can be completely removed.

B: Almost no residue is visible in minerals.

C: There are some residues, but within acceptable limits.

D: I can not tolerate it because there are a lot of residue.

- Evaluation Criteria of Pattern Rectangles -

A: An island pattern of 0.9 mu m x 0.9 mu m can be formed in a rectangular shape.

B: The island pattern of 0.9 mu m x 0.9 mu m has a slightly rounded shape, but is within the allowable range.

C: The island pattern of 0.9 占 퐉 占 0.9 占 퐉 is round, which is not acceptable.

In the following table, mixed solvent A represents heptane / diisopropyl ketone = 50% by weight / 50% by weight. The mixed solvent B represents? -Butyrolactone (? BL) / water = 75% by weight / 25% by weight. The mixed solvent C represents methanol / water = 75% by weight / 25% by weight. Further, the addition amounts of the pigment dispersions of Comparative Examples 1 and 2 were adjusted to 9.8 parts as pigment solid content. CV-2000 represents a water-based alkali developer (manufactured by FUJIFILM Electronic Materials Co., Ltd.).

As is clear from the above table, according to the present invention, by patterning by dry etching so as to form a colored pattern on the first colored layer by the coloring composition, and by forming the colored layer on the first colored layer by the photolithography A coloring layer is formed using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator in the step of patterning by photolithography, and the colored layer is patterned through a mask , And the developed coloring layer was developed using a developing solution containing an organic solvent. As a result, it was found that the color filter had a good pattern rectangularity (pattern shape). It was also found that the resulting color filter had good developing performance in the unexposed portion and good decolorization resistance.

10: solid state image pickup element 11: first coloring layer
12: first coloring pattern 13, 100: color filter
14: planarization film 15: microlens
20G: green pixel (first color pixel) 20R: red pixel (second color pixel)
20B: blue pixel (third color pixel) 21: second coloring radiation-sensitive layer
21A: a position corresponding to the first removal unit group 121
22: second colored pattern
22R: a plurality of second coloring pixels (not shown) formed inside each removal part of the second removal unit group 122,
31: Third colored radiation sensitive layer
31A: position corresponding to the second removal unit group 122
32: Third colored pattern 41: P well
42: light receiving element (photodiode) 43: impurity diffusion layer
44: electrode 45: wiring layer
46: BPSG film 47: insulating film
48: P-SiN film 49: planarization film layer
51: Photoresist layer 51A: Resist removal group
52: resist pattern (patterned photoresist layer)
120: removal group 121: first removal group
122: 2nd removal group

Claims (14)

(a) a step of forming a colored layer by using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator,
(b) exposing the colored layer to a pattern shape through a mask, and
(c) developing the exposed colored layer using a developing solution containing an organic solvent,
Wherein the coloring and radiation-sensitive composition contains at least 65 mass% of a dye solubilized in the organic solvent,
Wherein the dye soluble in the organic solvent is a large amount of dye. The method according to claim 1,
Wherein the coloring and radiation-sensitive composition comprises 70% by mass or more of a dye soluble in the organic solvent among all solids of the coloring and radiation-sensitive composition. 3. The method according to claim 1 or 2,
Wherein the developing solution containing the organic solvent contains 95% by mass or more of an organic solvent. 4. The method according to any one of claims 1 to 3,
Wherein the SP value of the developer containing the organic solvent is 15.1 to 18.9 or 23.1 to 42.0. 5. The method according to any one of claims 1 to 4,
Wherein the SP value of the developing solution containing the organic solvent is 15.1 to 17.5 or 30.0 to 42.0. A method of manufacturing a color filter having a plurality of colored layers formed on a substrate,
A step of forming a first colored layer by a coloring composition,
A step of patterning by dry etching so as to form a colored pattern on the first colored layer,
And patterning by photolithography so that another colored pattern is formed on the patterned first colored layer,
In the step of patterning by photolithography,
(a) a step of forming a colored layer by using a coloring and radiation-sensitive composition containing a dye soluble in an organic solvent, a polymerizable compound and a photopolymerization initiator,
(b) exposing the colored layer to a pattern shape through a mask, and
(c) developing the exposed colored layer using a developing solution containing an organic solvent,
Wherein the dye soluble in the organic solvent is a large amount of dye. The method according to claim 6,
Wherein said coloring and radiation-sensitive composition comprises at least 65 mass% of a dye soluble in said organic solvent among all solids of said coloring and radiation-sensitive composition. The method according to claim 6,
Wherein the coloring and radiation-sensitive composition comprises 70% by mass or more of a dye soluble in the organic solvent among all solids of the coloring and radiation-sensitive composition. 9. The method according to any one of claims 6 to 8,
Wherein the developing solution containing the organic solvent contains 95% by mass or more of an organic solvent. 10. The method according to any one of claims 6 to 9,
Wherein the SP value of the developer containing the organic solvent is 15.1 to 18.9 or 23.1 to 42.0. 11. The method according to any one of claims 6 to 10,
Wherein the SP value of the developing solution containing the organic solvent is 15.1 to 17.5 or 30.0 to 42.0. 12. The method according to any one of claims 6 to 11,
Wherein the first colored layer is a green transmissive layer. A color filter obtained by the method for producing a color filter according to any one of claims 1 to 12. A solid-state image pickup element having the color filter according to claim 13.

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